A high-precision wafer overlay wafer pre-alignment device and method for a solid-state transformer

Abstract

This invention belongs to the field of semiconductor technology, and specifically relates to a high-precision wafer pre-alignment device for solid-state transformer wafers, including a mounting bracket. This invention uses a tensioned cloth tube for wafer alignment and correction. Tiny burrs on the wafer edge can directly pass through the fiber gaps after contacting the cloth tube, avoiding both hard contact that could cause jamming and affect alignment accuracy, and preventing burr breakage or wafer edge damage. Simultaneously, the flexible contact of the cloth tube avoids stress concentration and edge chipping risks, making the overall alignment process smoother and positioning more reliable. Furthermore, as the tiny burrs pass through the cloth tube, the tube moves up and down, providing a continuous and gentle scraping and peeling action on the burrs, efficiently removing edge burrs to prevent them from interfering with alignment and correction. The entire process involves flexible contact, preventing rigid impacts, edge chipping, or scratches on the wafer, ensuring positioning accuracy and wafer integrity.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor technology, and in particular relates to a high-precision wafer pre-alignment device and method for solid-state transformer wafer overlay. Background Technology

[0002] As a core device in power semiconductors, the overlay process of solid-state transformer wafers directly determines the electrical performance and reliability of the devices. High-precision overlay requires precise positioning of the wafer's geometric center and orientation angle. During the loading, unloading, and transport of wafers, planar offsets and angular deviations are prone to occur. If pre-alignment correction is not performed, it will directly lead to misalignment between overlay patterns and out-of-tolerance critical dimensions, causing problems such as insufficient device withstand voltage and increased conduction losses, which will seriously reduce product yield and production stability. Therefore, completing high-precision pre-alignment of wafers before the overlay process is a necessary step to ensure the manufacturing accuracy and batch consistency of solid-state transformer wafers.

[0003] After wafers are cut, ground, and chamfered, small burrs may still remain on the edges. When using traditional mechanical clamps for clamping and alignment, the rigid contact between the jaws and the wafer edge will squeeze and scrape the burrs, forming particulate contamination and scratching the effective area of ​​the wafer. At the same time, the burrs will change the position of the clamping contact point, causing centering deviation and angle correction error, resulting in a decrease in pre-alignment accuracy. In addition, rigid clamping is prone to stress concentration at the wafer edge, causing microcracks or even edge chipping, increasing the risk of wafer breakage, and making it difficult to meet the high-precision and high-integrity overlay pre-alignment requirements of solid-state transformer wafers.

[0004] To address these issues, a high-precision wafer pre-alignment device and method for solid-state transformer wafer overlay is proposed. Summary of the Invention

[0005] The purpose of this invention is to address the above-mentioned problems by providing a high-precision wafer pre-alignment device and method for solid-state transformer wafer overlay.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a high-precision overlay wafer pre-alignment device for solid-state transformer wafers, comprising a mounting frame, a connecting frame fixedly connected to the upper side wall of the mounting frame, a controller fixedly connected to the upper side wall of the connecting frame, and a vision sensor fixedly connected to the inner wall of the connecting frame, wherein the vision sensor and the controller are electrically connected, and further comprising:

[0007] A negative pressure assembly, disposed on the side wall of the mounting bracket, is used to fix the wafer;

[0008] A drive component is disposed on the upper side wall of the mounting bracket and is used to drive the lifting component to move. The moving end of the lifting component is connected to an alignment component.

[0009] Preferably, the negative pressure assembly includes a negative pressure cylinder fixedly inserted into the side wall of the mounting frame. The upper end of the negative pressure cylinder is open and rotatably connected to a rotating cylinder via a sealed bearing. A negative pressure pump is fixedly connected to the lower side wall of the mounting frame. The suction end of the negative pressure pump communicates with the negative pressure cylinder. A negative pressure plate is fixedly sleeved on the outer wall of the rotating cylinder. The negative pressure plate is hollow and a pressure sensor is fixedly connected to its inner wall. Multiple adsorption cylinders are fixedly inserted into the upper side wall of the negative pressure plate. A perforated plate is fixedly connected to the inner wall of the adsorption cylinder. A pressure sensor is connected to the upper side wall of the perforated plate. The detection end of the pressure sensor is connected to a lifting tube via a spring. The lower end of the lifting tube is closed, and multiple negative pressure holes are opened on the side wall of the lifting tube. The lifting tube is movably inserted into the upper side wall of the adsorption cylinder. A silicone ring is connected to the upper end of the lifting tube. A piston ring is fixedly sleeved on the tube wall of the lifting tube located inside the negative pressure cylinder.

[0010] Preferably, the drive assembly includes a fixed ring fixedly connected to the upper side wall of the mounting bracket, a rotating ring rotatably connected to the outer wall of the fixed ring via a bearing, the height of the rotating ring being higher than that of the fixed ring, a drive plate fixedly connected to the upper side wall of the rotating ring, a drive motor connected to the upper side wall of the drive plate, the output end of the drive motor passing through the drive plate and being driven by the fixed ring via a gear ring transmission mechanism.

[0011] Preferably, the lifting assembly includes a guide cylinder fixedly connected to the right side wall of the drive plate. The upper and lower ends of the guide cylinder are closed structures. A square rod is movably inserted into the guide cylinder. A connecting ring is fixedly sleeved on the rod wall of the square rod inside the guide cylinder. A spring is fixedly connected between the connecting ring and the guide cylinder. The lower end of the square rod extends out of the guide cylinder and is fixedly connected to a ball bearing. A curved track matching the ball bearing is fixedly connected to the upper side wall of the mounting frame through a bracket. The upper end of the square rod extends out of the guide cylinder and is connected to the alignment assembly.

[0012] Preferably, the alignment assembly includes a mounting ring fixedly connected to the upper end of the square rod, an alignment electric push rod fixedly connected inside the mounting ring, a dust collection box fixedly connected to the movable end of the alignment electric push rod, a metal bend tube fixedly connected to the side wall of the dust collection box away from the alignment electric push rod, a fixing plate fixedly sleeved at the lower end of the metal bend tube, a miniature electric push rod fixedly connected to the lower side wall of the fixing plate, a lifting plate fixedly connected to the movable end of the miniature electric push rod, and a common fabric tube made of polyester fiber cloth sleeved between the lifting plate and the fixing plate.

[0013] Preferably, a vacuum pump is connected to the upper side wall of the vacuum box, the air inlet of the vacuum pump is connected to the vacuum box, and a filter element is provided on the inner wall of the vacuum box at the air inlet of the vacuum pump.

[0014] Preferably, a small electric push rod is connected to the upper side wall of the drive plate, a push plate is fixedly connected to the moving end of the small electric push rod, a monitoring probe is fixedly connected to the upper side wall of the push plate, and a push block is fixedly connected to the outer wall of the negative pressure plate.

[0015] An alignment method for a high-precision overlay wafer pre-alignment device for solid-state transformer wafers includes the following steps:

[0016] S1. An external robotic arm places the wafer above the negative pressure assembly;

[0017] S2. The controller controls the alignment component to work, so that the alignment component is adjusted to the appropriate specifications;

[0018] S3. The controller controls the drive component to move the lifting component and the alignment component. The alignment component is used to correct the wafer, and the lifting component will move the alignment component to remove the tiny burrs on the wafer surface.

[0019] S4. After the wafer correction is completed, the controller controls the small electric push rod to move the push plate to the set position. Then, it controls the negative pressure component to adsorb and fix the wafer. The drive component drives the small electric push rod and the push plate to rotate. The push plate squeezes the push block, which drives the negative pressure component and the wafer to rotate. The visual sensor is used to observe and make the positioning notch on the wafer surface face the set position.

[0020] S5. The controller controls the negative pressure component to release the adsorption and uses an external robotic arm to remove the aligned wafer.

[0021] Compared with existing technologies, the advantages of a high-precision wafer pre-alignment device and method for solid-state transformer wafers are as follows:

[0022] 1. By using the set drive components and alignment components, the wafer is aligned and corrected by a tensioned cloth tube. The tiny burrs on the edge of the wafer can pass directly through the fiber gap after contacting the cloth tube. This avoids the impact on alignment accuracy caused by hard contact and avoids the breakage and fall off of burrs or damage to the edge of the wafer. At the same time, the flexible contact of the cloth tube can also avoid stress concentration and edge breakage risks, making the overall correction process more stable and the positioning more reliable.

[0023] 2. With the lifting component, when tiny burrs pass through the cloth cylinder, the cloth cylinder moves up and down adaptively under the action of the lifting component, which can form a continuous and gentle scraping and peeling action on the burrs, effectively removing edge burrs to avoid them interfering with the alignment. At the same time, the entire process is a flexible contact, which will not cause rigid impact, chipping or scratches to the wafer, ensuring positioning accuracy and wafer integrity.

[0024] 3. With the set dust pump and alignment components, the tiny burrs that are cleaned can be adsorbed and collected in time, which can effectively prevent burr debris from falling and adhering to the wafer surface or the inside of the equipment, prevent secondary pollution and particle defects, and improve chip yield.

[0025] 4. By using the set negative pressure component, the flatness of the wafer is detected simultaneously during the wafer fixing process. Abnormal states such as wafer warping and tilting can be identified in real time, reminding operators to remove severely warped wafers in time, effectively preventing wafers from being damaged due to uneven stress in subsequent processes, and ensuring processing yield. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of a high-precision wafer pre-alignment device and method for solid-state transformer wafers provided by the present invention;

[0027] Figure 2 This is a schematic diagram showing the positional relationship of the negative pressure pump in the high-precision overlay wafer pre-alignment device and method for solid-state transformer wafers provided by the present invention.

[0028] Figure 3 This is a schematic diagram of the negative pressure component in the high-precision overlay wafer pre-alignment device and method for solid-state transformer wafers provided by the present invention;

[0029] Figure 4 This is a schematic diagram of the internal structure of the adsorption cylinder in the high-precision overlay wafer pre-alignment device and method for solid-state transformer wafers provided by the present invention.

[0030] Figure 5 This is a schematic diagram of the surface structure of the drive board in the high-precision overlay wafer pre-alignment device and method for solid-state transformer wafers provided by the present invention.

[0031] Figure 6 This is a schematic diagram showing the positional relationship of the miniature electric push rod in the high-precision overlay wafer pre-alignment device and method for solid-state transformer wafers provided by the present invention.

[0032] Figure 7 This is a schematic diagram of the internal structure of the guide cylinder in a high-precision wafer pre-alignment device and method for solid-state transformer wafers provided by the present invention.

[0033] In the diagram: 1. Mounting bracket, 2. Connecting bracket, 3. Controller, 4. Vision sensor, 5. Negative pressure assembly, 501. Negative pressure cylinder, 502. Rotating cylinder, 6. Negative pressure plate, 7. Air pressure sensor, 8. Adsorption cylinder, 9. Perforated plate, 10. Pressure sensor, 11. Lifting pipe, 12. Negative pressure hole, 13. Silicone ring, 14. Piston ring, 15. Drive assembly, 151. Fixing ring, 152. Rotating ring, 16. Drive plate, 17. Drive motor, 18. Lifting assembly, 181. Guide cylinder, 182. Square rod, 19. Connecting ring, 20. Ball bearing, 21. Curved track, 22. Alignment assembly, 221. Mounting ring, 222. Alignment electric push rod, 23. Dust collection box, 24. Metal bend, 25. Fixing plate, 26. Mini electric push rod, 27. Lifting plate, 28. Fabric cylinder, 29. Dust pump, 30. Small electric push rod, 31. Push plate, 32. Monitoring probe, 33. Negative pressure pump, 34. Push block. Detailed Implementation

[0034] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0035] like Figures 1-7 As shown, a high-precision wafer pre-alignment device for solid-state transformer wafer overlay includes a mounting frame 1, a connecting frame 2 fixedly connected to the upper side wall of the mounting frame 1, a controller 3 fixedly connected to the upper side wall of the connecting frame 2, and a vision sensor 4 fixedly connected to the inner wall of the connecting frame 2. The vision sensor 4 and the controller 3 are electrically connected. The device also includes:

[0036] A negative pressure assembly 5 is disposed on the side wall of the mounting frame 1. The negative pressure assembly 5 includes a negative pressure cylinder 501 fixedly inserted into the side wall of the mounting frame 1. The upper end of the negative pressure cylinder 501 is an open structure and is rotatably connected to a rotating cylinder 502 via a sealed bearing. A negative pressure pump 33 is fixedly connected to the lower side wall of the mounting frame 1. The suction end of the negative pressure pump 33 is connected to the negative pressure cylinder 501. A negative pressure plate 6 is fixedly sleeved on the outer wall of the rotating cylinder 502. The negative pressure plate 6 is a hollow structure, and a pressure sensor 7 is fixedly connected to its inner wall. Multiple pressure sensors are fixedly inserted into the upper side wall of the negative pressure plate 6. An adsorption cylinder 8 has a perforated plate 9 fixedly connected to its inner wall. A pressure sensor 10 is connected to the upper side wall of the perforated plate 9. The detection end of the pressure sensor 10 is connected to a lifting tube 11 via a spring. The lower end of the lifting tube 11 is closed, and multiple negative pressure holes 12 are opened on the side wall of the lifting tube 11. The lifting tube 11 is movably inserted into the upper side wall of the adsorption cylinder 8. A silicone ring 13 is connected to the upper end of the lifting tube 11. A piston ring 14 is fixedly sleeved on the tube wall of the lifting tube 11 located inside the negative pressure cylinder 501 for fixing the wafer.

[0037] The drive assembly 15 is disposed on the upper side wall of the mounting frame 1. The drive assembly 15 includes a fixed ring 151 fixedly connected to the upper side wall of the mounting frame 1. A rotating ring 152 is rotatably connected to the outer wall of the fixed ring 151 via a bearing. The height of the rotating ring 152 is higher than that of the fixed ring 151. A drive plate 16 is fixedly connected to the upper side wall of the rotating ring 152. A drive motor 17 is connected to the upper side wall of the drive plate 16. The output end of the drive motor 17 passes through the drive plate 16 and is connected to the fixed ring 151 via a gear ring transmission mechanism. A small electric push rod 30 is connected to the upper side wall of the drive plate 16. A push plate 31 is fixedly connected to the moving end of the small electric push rod 30. A monitoring probe 32 is fixedly connected to the upper side wall of the push plate 31. A push block 34 is fixedly connected to the outer wall of the negative pressure plate 6 for driving the lifting assembly 18 to move. An alignment assembly 22 is connected to the moving end of the lifting assembly 18.

[0038] The lifting assembly 18 includes a guide cylinder 181 fixedly connected to the right side wall of the drive plate 16. Both the upper and lower ends of the guide cylinder 181 are closed structures. A square rod 182 is movably inserted into the guide cylinder 181. A connecting ring 19 is fixedly sleeved on the rod wall of the square rod 182 inside the guide cylinder 181. A spring is fixedly connected between the connecting ring 19 and the guide cylinder 181. The lower end of the square rod 182 extends out of the guide cylinder 181 and is fixedly connected to a ball bearing 20. A curved track 21 that matches the ball bearing 20 is fixedly connected to the upper side wall of the mounting bracket 1 through a bracket. The upper end of the square rod 182 extends out of the guide cylinder 181 and is connected to the alignment assembly 22.

[0039] The alignment assembly 22 includes a mounting ring 221 fixedly connected to the upper end of the square rod 182. An alignment electric push rod 222 is fixedly connected inside the mounting ring 221. A dust collection box 23 is fixedly connected to the moving end of the alignment electric push rod 222. A dust pump 29 is connected to the upper side wall of the dust collection box 23. The air inlet of the dust pump 29 is connected to the dust collection box 23. A filter element is provided on the inner wall of the dust collection box 23 at the air inlet of the dust pump 29. A metal bend 24 is fixedly connected to the side wall of the dust collection box 23 away from the alignment electric push rod 222. A fixing plate 25 is fixedly sleeved on the lower end of the metal bend 24. A miniature electric push rod 26 is fixedly connected to the lower side wall of the fixing plate 25. A lifting plate 27 is fixedly connected to the moving end of the miniature electric push rod 26. A fabric tube 28 made of polyester fiber cloth is sleeved between the lifting plate 27 and the fixing plate 25.

[0040] The operating principle of this invention is explained as follows: An external robotic arm places the wafer above the negative pressure assembly 5. Then, the controller 3 controls the alignment electric push rod 222 to move the vacuum box 23, metal bend 24, and cloth cylinder 28 towards a set position closer to the wafer. The cloth cylinder 28 maintains appropriate tension under the push of the miniature electric push rod 26, lifting plate 27, and fixing plate 25. Next, the controller 3 controls the drive motor 17 to operate. The drive motor 17 is driven by a gear ring transmission mechanism (the gear ring transmission mechanism includes components connected to the drive motor 17...). The drive teeth at the output end and the gear ring sleeved on the outer wall of the fixed ring 151, when the drive motor 17 drives the drive teeth to rotate, through the mutual meshing of the drive teeth and the gear ring, can drive the drive plate 16 and the rotating ring 152 to rotate. The drive plate 16 drives the alignment component 22 to rotate along the wafer through the lifting component 18. When the wafer is in an skewed state on the surface of the negative pressure component 5, after the cloth cylinder 28 contacts the wafer, it will push the wafer towards the center. After the cloth cylinder 28 rotates one revolution, it will put the wafer in the appropriate position, thereby completing the wafer correction.

[0041] When there are tiny burrs on the wafer surface, and the feed cylinder 28 comes into contact with these burrs, the burrs will pass through the fiber gaps in the feed cylinder 28. This prevents hard contact from causing jamming and affecting alignment accuracy, and also prevents burrs from breaking off or damaging the wafer edge. Furthermore, when the drive board 16 drives the lifting assembly 18 to rotate, the lower end of the square rod 182 inside the lifting assembly 18 contacts the lower curved track 21 through the ball bearings 20. Therefore, when the lifting assembly 18 rotates, the square rod 182 will drive the feed cylinder 28 through the cooperation of the ball bearings 20 and the curved track 21. 8. Moving up and down, as tiny burrs insert into the fiber gaps of the cloth cylinder 28, the fibers exert a shearing force on the tiny burrs when the cloth cylinder 28 moves up and down, causing the burrs to detach from the wafer. The controller 3 controls the dust pump 29 to work, and the dust pump 29 extracts the gas inside the dust collection box 23. The external gas carries the cleaned-off tiny burrs into the dust collection box 23 through the cloth cylinder 28 and the metal bend 24, which can effectively prevent burr debris from scattering and adhering to the wafer surface or the inside of the equipment, prevent secondary contamination and particle defects, and improve chip yield.

[0042] After wafer alignment is complete, controller 3 controls the small electric push rod 30 to move the push plate 31 to the set position. Simultaneously, controller 3 controls the negative pressure assembly 5 to adsorb and fix the wafer. Controller 3 also controls the negative pressure pump 33 to extract gas from the negative pressure disk 6, creating a negative pressure state inside the adsorption cylinder 8 and the lifting tube 11. The lifting tube 11 then adsorbs and fixes the wafer above it via the upper silicone ring 13. Under the negative pressure, the lifting tube 11 moves downwards against the spring force below. When controller 3 detects through the air pressure sensor 7 that the air pressure inside the negative pressure disk 6 has reached the set threshold (-80 kPa),... The controller 3 will control the negative pressure pump 33 to stop working (the pressure inside the negative pressure plate 6 can be restored to normal by opening the pressure relief valve on the back of the negative pressure cylinder 501, which is not shown in the figure). Since the lifting tube 11 will move downward under negative pressure, when there is warping on the wafer surface, the lifting tube 11 that is in contact with the warped part will move downward a shorter distance, thereby reducing the pressure applied by the lifting tube 11 to the pressure sensor 10 below through the spring. The controller 3 can determine the flatness of the wafer by analyzing the pressure change through the pressure sensor 10, and inform the operator of the wafer flatness through its own wireless communication module.

[0043] Once the negative pressure component 5 has adsorbed and fixed the wafer, the controller 3 will control the drive component 15 to drive the drive plate 16, the small electric push rod 30 and the push plate 31 to rotate (the monitoring probe 32 can prevent the push plate 31 and the push block 34 from colliding). During the rotation, the push plate 31 will squeeze the push block 34, and the push block 34 will drive the negative pressure plate 6, the wafer and the rotating cylinder 502 to rotate together. After the controller 3 detects that the positioning notch on the wafer surface is facing the set position through the vision sensor 4, it will control the drive component 15 to stop working. Then the controller 3 will take out the aligned wafer through an external robotic arm.

[0044] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A high-precision wafer pre-alignment device for solid-state transformer wafer overlay, comprising a mounting frame (1), a connecting frame (2) fixedly connected to the upper side wall of the mounting frame (1), a controller (3) fixedly connected to the upper side wall of the connecting frame (2), and a vision sensor (4) fixedly connected to the inner wall of the connecting frame (2), wherein the vision sensor (4) and the controller (3) are electrically connected, characterized in that, Also includes: A negative pressure assembly (5) is disposed on the side wall of the mounting bracket (1) for fixing the wafer; A drive assembly (15) is disposed on the upper side wall of the mounting bracket (1) for driving the lifting assembly (18) to move. The moving end of the lifting assembly (18) is connected to an alignment assembly (22).

2. The high-precision overlay wafer pre-alignment device for solid-state transformer wafers according to claim 1, characterized in that, The negative pressure assembly (5) includes a negative pressure cylinder (501) fixedly inserted into the side wall of the mounting frame (1). The upper end of the negative pressure cylinder (501) is an open structure, and a rotating cylinder (502) is rotatably connected to it through a sealed bearing. A negative pressure pump (33) is fixedly connected to the lower side wall of the mounting frame (1). The suction end of the negative pressure pump (33) is connected to the negative pressure cylinder (501). A negative pressure plate (6) is fixedly sleeved on the outer wall of the rotating cylinder (502). The negative pressure plate (6) is a hollow structure, and a pressure sensor (7) is fixedly connected to its inner wall. Multiple adsorption cylinders (8) are fixedly inserted into the upper side wall of the negative pressure plate (6). The inner wall of the adsorption cylinder (8) is fixedly connected to a perforated plate (9). A pressure sensor (10) is connected to the upper side wall of the perforated plate (9). The detection end of the pressure sensor (10) is connected to a lifting tube (11) via a spring. The lower end of the lifting tube (11) is closed, and multiple negative pressure holes (12) are opened on the side wall of the lifting tube (11). The lifting tube (11) is movably inserted into the upper side wall of the adsorption cylinder (8). A silicone ring (13) is connected to the upper end of the lifting tube (11). A piston ring (14) is fixedly sleeved on the tube wall of the lifting tube (11) inside the negative pressure cylinder (501).

3. The high-precision overlay wafer pre-alignment device for solid-state transformer wafers according to claim 2, characterized in that, The drive assembly (15) includes a fixed ring (151) fixedly connected to the upper side wall of the mounting bracket (1). The outer wall of the fixed ring (151) is rotatably connected to a rotating ring (152) via a bearing. The height of the rotating ring (152) is higher than that of the fixed ring (151). The upper side wall of the rotating ring (152) is fixedly connected to a drive plate (16). The upper side wall of the drive plate (16) is connected to a drive motor (17). The output end of the drive motor (17) passes through the drive plate (16) and is connected to the fixed ring (151) via a gear ring transmission mechanism.

4. The high-precision overlay wafer pre-alignment device for solid-state transformer wafers according to claim 3, characterized in that, The lifting assembly (18) includes a guide cylinder (181) fixedly connected to the right side wall of the drive plate (16). The upper and lower ends of the guide cylinder (181) are closed structures. A square rod (182) is movably inserted into the guide cylinder (181). A connecting ring (19) is fixedly sleeved on the rod wall of the square rod (182) inside the guide cylinder (181). A spring is fixedly connected between the connecting ring (19) and the guide cylinder (181). The lower end of the square rod (182) extends out of the guide cylinder (181) and is fixedly connected to a ball bearing (20). The upper side wall of the mounting bracket (1) is fixedly connected to a curved track (21) that matches the ball bearing (20) through a bracket. The upper end of the square rod (182) extends out of the guide cylinder (181) and is connected to the alignment assembly (22).

5. The high-precision overlay wafer pre-alignment device for solid-state transformer wafers according to claim 4, characterized in that, The alignment assembly (22) includes a mounting ring (221) fixedly connected to the upper end of the square rod (182). An alignment electric push rod (222) is fixedly connected inside the mounting ring (221). A dust collection box (23) is fixedly connected to the moving end of the alignment electric push rod (222). A metal bend (24) is fixedly connected to the side wall of the dust collection box (23) away from the alignment electric push rod (222). A fixing plate (25) is fixedly sleeved on the lower end of the metal bend (24). A miniature electric push rod (26) is fixedly connected to the lower side wall of the fixing plate (25). A lifting plate (27) is fixedly connected to the moving end of the miniature electric push rod (26). A fabric tube (28) is sleeved between the lifting plate (27) and the fixing plate (25). The fabric tube (28) is made of polyester fiber cloth.

6. The high-precision overlay wafer pre-alignment device for solid-state transformer wafers according to claim 5, characterized in that, The upper side wall of the dust collection box (23) is connected to a dust pump (29), the air inlet of the dust pump (29) is connected to the dust collection box (23), and the inner wall of the dust collection box (23) is provided with a filter element located at the air inlet of the dust pump (29).

7. The high-precision overlay wafer pre-alignment device for solid-state transformer wafers according to claim 6, characterized in that, The upper side wall of the drive plate (16) is connected to a small electric push rod (30), the moving end of the small electric push rod (30) is fixedly connected to a push plate (31), the upper side wall of the push plate (31) is fixedly connected to a monitoring probe (32), and the outer wall of the negative pressure plate (6) is fixedly connected to a push block (34).

8. An alignment method applied to the high-precision overlay wafer pre-alignment device for solid-state transformer wafers as described in claim 7, characterized in that, Includes the following steps: S1. An external robotic arm places the wafer above the negative pressure assembly (5); S2, The controller (3) controls the alignment component (22) to work, so that the alignment component (22) is adjusted to the appropriate specifications; S3, the controller (3) controls the drive component (15) to move the lifting component (18) and the alignment component (22), and uses the alignment component (22) to correct the wafer. The lifting component (18) will move the alignment component (22) to clean the tiny burrs on the wafer surface. S4. After the wafer correction is completed, the controller (3) controls the small electric push rod (30) to drive the push plate (31) to move to the set position. Then, the negative pressure component (5) is controlled to adsorb and fix the wafer. The small electric push rod (30) and the push plate (31) are rotated by the drive component (15). The push plate (31) is used to squeeze the push block (34), which drives the negative pressure component (5) and the wafer to rotate. The visual sensor (4) is used to observe and make the positioning notch on the wafer surface face the set position. S5. The controller (3) controls the negative pressure component (5) to release the adsorption work and takes out the aligned wafer through an external robotic arm.

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