Method and corresponding device for transferring dies of a wafer

Abstract

The invention relates to a method for transferring dies (120) of a wafer (100) onto a substrate (160), comprising: providing a wafer (100) having a plurality of dies (120), separating the wafer (100) into individual dies (120), taking (430) a die (120) from the wafer (100) with a taking device (170), and transferring (440) the separated die (120) onto the substrate (160) with a transferring device (180) by lateral grasping and subsequently placing the die (120) onto the substrate (160), wherein, for lateral grasping of a die (120') to be transferred, a temporary connection (186') is established between the transferring device (180) and one lateral surface (121) or two non-opposing lateral surfaces (121) of the die (120') to be transferred.

Description

Technical Field

[0001] This invention relates to the field of chips manufactured from wafers, particularly for microelectromechanical devices, and to a method for transferring chips from a wafer onto a substrate, as well as a corresponding transfer apparatus. Background Technology

[0002] Devices incorporating microelectromechanical systems (MEMS), such as micromirror arrays or micromirror actuators, are now used in a variety of devices, including smartphones, projectors, head-up displays, barcode readers, mask exposure machines in semiconductor manufacturing, and microscopes. Corresponding micromirror arrays are known, for example, from documents DE 10 2013208 446 A1, EP 0 877 272 A1, and WO 2010 / 049076 A2. DE 10 2006 032 195 A1 describes a method for fabricating MEMS structures. DE 10 2009 029 202 A1 discloses a micromechanical system and a method for fabricating such a system. According to DE 10 2015 206 996 A1, the so-called EPyC process (EPyC: epitaxial polysilicon cycle) is used to fabricate microelectromechanical structures with large vertical extension scales. This process uses epitaxial polysilicon as the functional and sacrificial material and constructs a layer structure consisting of epitaxial polysilicon layers (EpiPoly layers) by means of repeated cycles.

[0003] When fabricating individual microelectromechanical systems (MEMS) on a wafer basis, it is essential to ensure the continuous protection of the MEMS structures to avoid unintended damage to the MEMS chip. For this reason, the surfaces to be protected are typically protected by suitable protective structures, but these structures can significantly reduce the fill factor of the final product, i.e., the manufactured chip. US2008 / 0303129 A1 discloses a possibility for preventing damage to sensitive surfaces in MEMS manufacturing. This proposes the use of a chuck with structured contact surfaces. A cover wafer is described in detail, which is connected to an interposer wafer within the framework of the manufacturing process. The cover wafer is positioned on the chuck, and this structure is used to prevent mechanical damage. Summary of the Invention

[0004] According to the present invention, a method and a corresponding transfer apparatus are provided for transferring a semiconductor chip (also referred to as a chip within the framework of the present invention) from a semiconductor wafer onto a substrate.

[0005] Other features and details of the invention are derived from the dependent claims, the description, and the drawings. Hereinafter, the features and details described in connection with the method according to the invention also apply to the transfer apparatus according to the invention, and vice versa, so that disclosures relating to individual aspects of the invention are always mutually referenced or may be mutually referenced.

[0006] According to a first aspect of the invention, a method for transferring chips from a wafer onto a substrate is provided. For this purpose, a wafer having multiple chips is first provided, wherein these chips may, for example, be MEMS chips that have not yet been released.

[0007] The wafer is now separated into chips, and then the chips are removed from the wafer by a take-up device. A transfer device transfers the separated chips onto a substrate by laterally gripping and subsequently placing the chips, wherein, in order to laterally grip the chip to be transferred, a temporary connection is established between the transfer device and one or two, preferably exactly two, non-opposing lateral surfaces of the chip to be transferred. In this case, chip placement may include connecting the chip to the substrate and / or occurring before such a connection. The temporary connection is a mechanical connection. The temporary connection must be mechanically stable enough to enable the corresponding transfer. Because it is a temporary connection, this connection can be released again, for example, after placement.

[0008] Preferably, the chip includes a MEMS structure for a microelectromechanical system (MEMS), wherein the MEMS structure is released before wafer separation. Such a MEMS structure may be, for example, a MEMS structure for one or more MEMS elements, such as MEMS sensors and MEMS actuators, such as MEMS inertial sensors, MEMS pressure sensors, MEMS microphones, MEMS micromirrors, and / or MEMS resonators, or may include such a MEMS structure. The release of the MEMS structure may be performed, for example, by plasma-free and / or plasma-supported etching, such as by reactive ion etching (RIE). Preferably, such etching is performed using sulfur hexafluoride (SF6), xenon difluoride (XeF2), chlorine trifluoride (ClF3), and / or nitrogen trifluoride (NF3) as etching materials.

[0009] Prior to separation, the wafer may have been connected or been connected to a carrier wafer, preferably made of or comprising glass. This forms a coupled wafer comprising the wafer and the carrier wafer, wherein a bonding connection is formed between them. Such a carrier wafer can then be separated together with the wafer. Alternatively, the separation is carried out such that it involves only the wafer and not the material of the carrier wafer. This achieves the goal that the carrier wafer can be reused.

[0010] In the case of using carrier wafers, it is advantageous to form a releasable bonding connection between the wafers. For example, such a releasable bonding connection can be achieved using an adhesive that can be cured and / or crosslinked and / or softened and / or de-crosslinked by electromagnetic radiation, such as IR light and / or UV light, preferably generated by one or more corresponding lasers. To enable this process, it is advantageous to use a material for at least a portion of the carrier wafer that is at least partially transparent to the wavelength used, so that the adhesive can be irradiated through these portions of the carrier wafer. Possible wavelength ranges include, for example, the UV range, the visible range, and the IR range. Especially when irradiated by UV or visible light, the partially transparent portions of the carrier wafer, and preferably the entire carrier wafer, can be made of or have glass, for example. Borosilicate glass or quartz glass can be considered as glass, for example. Other transparent materials are conceivable as alternatives to glass. For example, silicon can be used as an IR transparent material when using radiation in the IR range. In particular, it is conceivable that softening and / or decrosslinking can be performed solely by electromagnetic radiation to at least partially release the adhesive bond, and that curing and / or crosslinking can be performed by another method, such as introducing or removing ambient oxygen and / or increasing temperature (thermal curing), depending on the type of adhesive.

[0011] Preferably, the wafer's chips are at least partially electrically connected to one or more components before separation. These components may be, for example, MEMS components and / or electronic components such as ASICs (Application-Specific Integrated Circuits) and / or FPGAs (Field-Programmable Gate Arrays). That is, the components may be ASICs and / or FPGAs and / or MEMS components. Such a step is preferably performed after any possible release of the MEMS structures within the wafer.

[0012] Removal using a removal device is preferably performed by offsetting each chip perpendicular to the wafer surface, such that the chip can be grasped by a transfer device after offset. Such offset can be achieved, for example, by means of a punch in the removal device, wherein the punch is correspondingly perpendicular to the wafer surface and moves toward the chip to be removed, thereby pushing the chip to be removed out of the remainder of the wafer.

[0013] Preferably, for lateral chip gripping, a temporary connection is established between the transfer device and the chip to be transferred by the transfer device contacting one or more droplets, preferably composed of water, on one or all of the lateral surfaces of the chip used for the temporary connection, thus locally wetting them, and the droplets are subsequently frozen, for example, by a Peltier element. The temporary connection is preferably released after the chip is placed by heating the one or more frozen droplets, wherein the heating can also be performed by a Peltier element. Preferably, the same Peltier element is used to freeze and heat the one or more droplets contacting the chip.

[0014] According to a second aspect of the invention, a transfer device for transferring a chip, preferably as described in the above method, is provided. In this case, the transfer device is configured to laterally grip the chip to be transferred and place it on a substrate, in such a way that a temporary connection is established between the transfer device and one or two, preferably exactly two, non-opposing lateral surfaces of the chip to be transferred, for the purpose of laterally gripping the chip to be transferred.

[0015] Such a transfer device is preferably configured to establish a temporary connection for laterally gripping the chip by contacting one or more droplets, preferably made of water, on one or all of the lateral surfaces of the chip to be transferred for the temporary connection, and then freezing the droplets.

[0016] The transfer device may include a Peltier element configured to freeze one or more droplets in contact with the chip to be transferred. The Peltier element is also preferably used to heat the droplets to release the corresponding temporary connection. The transfer device may also include a measuring device configured to determine the contact state between the chip to be transferred and one of the droplets via resistance measurements, typically implemented as current and / or voltage measurements, and / or via capacitance measurements. Here, the conductivity and / or dielectric constant vary according to the droplet's state of aggregation (frozen, i.e., solid, or liquid).

[0017] It is particularly advantageous if the transfer apparatus includes tools configured to bring the chip to be transferred into contact with at least one droplet via two, preferably exactly two (L-shaped tools) lateral surfaces of the chip. The tools of the transfer apparatus may include capillaries for generating the droplets. These capillaries are preferably electrically insulated from each other within the transfer apparatus. This, for example, allows for the measurement of the current between the two capillaries and / or the droplets generated by the capillaries when a voltage is generated between the two capillaries.

[0018] Advantages of the invention This invention demonstrates the possibility of creating a temporary mechanical connection between MEMS components and transfer devices without necessarily requiring a dedicated area on the wafer used for this purpose. Instead, the lateral surface of the chip is used by laterally gripping the chip, such as a MEMS chip. This saves costs by increasing the number of chips on the wafer, and further eliminates the need to separate the operating surfaces after the chips are placed on the substrate. Furthermore, chips with sensitive structures covering their entire surface area, i.e., up to the chip edges, can be transferred. This is advantageous, for example, for the highest possible optical fill factor.

[0019] The mechanical stability of the connection can be tuned by adjusting the size, number, density (number of droplets per unit area), especially the linear density (number of droplets per unit length), the composition of the applied droplets, and / or the temperature of the droplets. In principle, the mechanical connection can be maintained for any length of time. This invention enables the temporary connection to be released without residue after the chip is transferred to the substrate. The mechanical strength of the established connection can be easily checked via resistance and / or capacitance measurements. Attached Figure Description

[0020] Embodiments of the present invention will be further explained with reference to the accompanying drawings and the following description.

[0021] The attached diagram shows: Figures 1A to 1I : A schematic diagram of a cross-section of a wafer used to explain the method for transferring a chip according to the present invention; Figure 2 : A schematic top view of a chip connected to the transfer device according to the present invention; Figure 3 A top view of multiple chips on a substrate and a transfer device according to the present invention; and Figure 4 The following is a schematic flowchart illustrating an exemplary method according to the invention for transferring a chip from a wafer onto a substrate. Detailed Implementation

[0022] In the following description of embodiments of the present invention, the same or similar elements are identified by the same reference numerals, and in some cases, repeated descriptions of these elements are omitted. These figures are for illustrative purposes only to illustrate the subject matter of the invention.

[0023] Figures 1A to 1I A schematic diagram of a cross-section of a wafer is shown to illustrate the method for transferring a chip according to the present invention.

[0024] Here, in Figure 1AAs can be seen, wafer 100 contains MEMS chips 120, which can be structured, for example, using EPyC technology. Here, for example, in... Figure 1A As shown, these MEMS chips may be MEMS chips that have not yet been released, and their boundaries are at... Figure 1A The carrier wafer 102 is connected to the wafer 100 via a bonding connection 101. The carrier wafer is positioned opposite to the wafer surface 100a of the wafer 100, and has a recess 105 in the region of the metal contacts 108 of the wafer 100, such that the metal contacts 108 are connected to the external surrounding environment 112 of the wafer 100. The wafer 100 and the carrier wafer 102 together constitute a coupled wafer 110. The recess 105 is later used to attach electronic components such as ASICs. The carrier wafer 102 is preferably at least partially made of a material that is transparent to electromagnetic radiation within a specific wavelength range, such as glass and / or silicon. Furthermore, in this example, the bonding connection 101 is configured, for example by using a suitable adhesive, such that the bonding connection can be at least partially released, i.e., at least loosened, by irradiation with a laser having a wavelength within that wavelength range.

[0025] Before subsequent separation, the MEMS structure of MEMS chip 120 can be released. In such cases... Figure 1B In the illustrated embodiment, the particularly sensitive MEMS structure 122 of the MEMS chip 120 is released by means of such a release. This release can be performed, for example, by first removing the silicon structure exposed outwards, i.e., relative to the external surrounding environment 112, using sacrificial layer etching and / or reactive ion etching (RIE), for example, with SF6 and / or XeF2. Subsequently, any passivation layers that may be present, such as those composed of or comprising silicon dioxide, can be removed, for example, by HF vapor phase etching. For example, a passivation layer that may be present above the metal contacts 108 as a protective layer can be removed in this step. Preferably, the MEMS chip 120 is configured such that the sensitive MEMS structure 122 is positioned such that the MEMS structure is recessed relative to the original wafer surface 100a. To achieve this, the uppermost silicon layer of the wafer 100 can be removed in a region of the MEMS chip 120. Alternatively, it is conceivable to connect another wafer (not shown) with corresponding recesses to the wafer 100 for such protection.

[0026] The previously fixed MEMS structure 122 can be movable after release, and is therefore potentially sensitive to vibration, contact, and similar conditions. Figure 1BIn the exemplary release process shown, the MEMS chip 120 is exposed laterally around the trench. Thereafter, the MEMS chip 120 remains attached to the carrier wafer 102 only via the bonding connection 101 and thus retains its position in the remainder 100' of the wafer 100.

[0027] As in Figure 1C As shown, the coupled wafer 110 can now be placed on the chuck 150 such that the sensitive MEMS structure 122 to be protected faces downwards, i.e., towards the chuck 150. The metal contacts 108 in the recess 105 are correspondingly upwards, i.e., away from the chuck 150. The coupled wafer 110 can undergo wafer-level testing (WLT) via these metal contacts 108 through suitable contact probes 140a. Subsequently, as shown, an electronic component 130, such as an ASIC, can be introduced into the recess 105 via a pick-and-place device 135 and electrically and mechanically connected to the metal contacts 108 by soldering. The soldered electronic component 130 can also be measured electrically using measuring probes 140b. For this purpose, additional metal contacts 148 located on the electronic component 130 are typically used.

[0028] If, as described above, the carrier wafer 102 is at least partially composed of a material that is transparent in a certain wavelength range, such as glass and / or silicon, and a corresponding adhesive is used for bonding the interconnects 101, then as Figure 1D As shown, the temporary bonding connection 101 can now be at least partially released by full-area or only partial irradiation with a laser 109 having an appropriately selected wavelength. Therefore, the adhesion of the bonding connection 101 between the MEMS chip 120 and the carrier wafer 102 is at least reduced.

[0029] Subsequently, as Figure 1E As shown, each MEMS chip 120 can be removed from the coupled wafer 110, for example, by means of a removal device 170, and a punch 171 of the removal device 170 as shown. Here, the punch 171 is preferably cooled to a temperature below 0°C. Through the mechanical contact thus established between the removed MEMS chip 120 and the punch 171, a temperature similar to that of the punch 171 is generated on the MEMS chip 120 after a short time.

[0030] Figure 1FAn exemplary transfer device 180 with capillary tubes 184 and Peltier elements 183 is now shown for transferring a MEMS chip 120. The capillary tubes 184 of this transfer device are oriented such that they are perpendicular to the lateral surface 121 of the MEMS chip 120' to be transferred. To grasp the MEMS chip 120' to be transferred, a liquid, such as water, is introduced from a storage container 182, which is also part of the transfer device 180, into the capillary tubes 184 via a liquid inlet conduit 181. Droplets 186 are formed at the open end of the capillary tubes 184, which locally wet the corresponding lateral surface 121 of the MEMS chip 120'. Here, the liquid has a temperature slightly above its freezing point. When the liquid partially wets the lateral surface 121 of the MEMS chip 120', it freezes due to the correspondingly lower temperature of the MEMS chip 120' and forms a fixed but temporary mechanical connection 186' (also referred to as temporary connection 186' within the scope of this application) between the transfer device 180 and the MEMS chip 120'. Subsequently, a temperature below the freezing point of the liquid droplet 186 is similarly adjusted by means of the Peltier element 183 to stabilize the temporary connection 186' and keep the temperature of the MEMS chip 120' below the freezing point after the punch 171 peels it off.

[0031] Finally, as Figure 1G As shown, the punch 171 is removed and the MEMS chip 120', along with the electronic components 130 connected thereto, is held laterally by the transfer device 180 only by frozen droplets 186. To prevent condensation on the cooled MEMS chip 120' and / or the cooled portion of the transfer device 180, the humidity of the external ambient environment 112 can be controlled to be kept low and / or the parts involved can be purged with dry air or nitrogen.

[0032] exist Figure 1H In the assembly process, for example, the MEMS chip 120' is now transferred onto the substrate 160 and placed there as indicated by arrow 124. After placement on the substrate 160, the MEMS chip 120' receives the temperature of the substrate 160 via its connected electronics 130 shortly thereafter; this temperature is higher than the freezing point of the liquid in the droplet 186. Simultaneously, the Peltier element 183 is put into heating mode to heat the capillary 184. The frozen droplet 186 melts. Figure 1I As shown, at temperatures above freezing, the temporary connection 186' that has been permanently fixed between the MEMS chip 120' and the tool is released by the melting of the frozen droplet 186. The droplet 186 can now be controllably drawn into the capillary 184 and / or can be evaporated by heating the capillary 184. This is in Figure 1IThe reduced droplet 187 is symbolically represented in the image. The temperature of the substrate 160 can be adjusted accordingly to optimize the stripping process.

[0033] Figure 2 A schematic top view of a MEMS chip 120' connected to a transfer device 180 according to the invention is now shown, the MEMS chip having Figure 1F The sensitive MEMS structure 122. For better orientation, in Figure 1F and Figure 2 The same axes 190 and 192 are marked on the wafer surface 100a, wherein axis 190 is perpendicular to the wafer surface 100a and axis 192 is parallel to the wafer surface 100a and points in the same direction.

[0034] An exemplary transfer device 180 includes an L-shaped tool 280 with a capillary tube 184 and a Peltier element 183 for heating and cooling. A droplet 186 is formed between the open end of the capillary tube 184 and two lateral surfaces of the MEMS chip 120'. To establish a temporary connection 186' with the MEMS chip 120', the capillary tube 184 is oriented laterally and perpendicularly to the two lateral surfaces 121 of the MEMS chip 120'. The MEMS chip 120' is previously configured according to... Figure 1E and Figure 1F The punch 171 of the extraction device 170 is lifted out of the wafer 100. Here, the punch 171 is cooled to a temperature below 0°C. Similarly, the MEMS chip 120' is cooled to a temperature below 0°C through contact with the punch 171. A defined amount of liquid is drawn from the capillary tube 184 to form a droplet 186 on the open end of the capillary tube 184. The temperature of the droplet 186 is cooled to slightly above freezing point by the Peltier element 183. The lateral spacing of the L-shaped tool 280 relative to the MEMS chip 120' is previously adjusted such that the droplet 186 squeezed out from the capillary tube 184 can locally wet the lateral surface 121 of the MEMS chip 120'. Because the MEMS chip 120' has a temperature below 0°C, the droplet 186 freezes shortly after the point of local wetting, forming a fixed, localized, mechanical temporary connection 186' between the MEMS chip 120' and the tool 280, and therefore with the transfer device 180. To stabilize the temporary connection 186', the capillary 184 and the thus frozen droplet 186 are preferably kept at a temperature below the freezing point of the liquid. The punch 171 can now be removed and the MEMS chip 120' is applied to the substrate 160 by the transfer device 180.

[0035] During the peeling process, lateral forces, such as capillary forces generated by the droplets 186 varying due to the peeling process, act on the MEMS chip 120' and alter its position on the substrate 160. To prevent displacement of the MEMS chip 120', the position of the tool 280 can be controlled. To detect the relative spacing change between the tool 280 and the MEMS chip 120', electronic characteristic variables can be used, which are also used to detect the correct formation of the temporary connections 186'. For this purpose, for example in Figure 2 As shown, a voltage source 220 may be present, which applies a voltage to the two capillaries in capillaries 184 via an electrical connection 230. The current 240 flowing through the capillaries 184, through the two corresponding droplets 186, and through the MEMS chip 120' can now be measured by a corresponding measuring device 210, wherein... Figure 2 The current path is marked with a dashed line outside the electrical connection 230. By analyzing and evaluating the measurements from the measuring device 210, the resistance of the droplet 186 can be inferred, and thus the state of the droplet and the stability of the temporary connection 186' can be determined. Alternatively, this can also be done via capacitance measurement.

[0036] Figure 3 A schematic top view of the MEMS array 300 is now shown. The MEMS array 300 includes a plurality of MEMS chips 120 having sensitive MEMS structures 122, which are arranged on a substrate (not shown). Also shown is a MEMS chip 120' still on the substrate, awaiting transfer, which is related to... Figure 2 The L-shaped tool 280 of the transfer device 180 according to the invention is connected. It can be clearly seen that, due to the shape of the tool 280, the individual MEMS chips 120 can be placed close to each other on the substrate. Since the temporary connection 186' uses the lateral surface 121 via the droplet 186, there is no need to reserve a large, unused area for gripping from above, thus minimizing the spacing between the MEMS chips 120, 120'. A free area 310 for possible additional MEMS chips 120 is provided. Figure 3 The center is marked as a dashed square.

[0037] Figure 4An exemplary method according to the invention for transferring chips from a wafer onto a substrate is illustrated schematically as a flowchart. To do this, a wafer having multiple chips is provided, preferably connectable to a carrier substrate. If the chips include MEMS structures, i.e., the chips are MEMS chips, then the MEMS structures can now be released 410. After separating the wafer 420 into individual chips, the chips are removed from the wafer in step 430 by a removal device. Subsequently, the separated chips are transferred 440 onto the substrate by means of a transfer device. This is done by lateral gripping, for example by means of an L-shaped tool of the transfer device, followed by placing the chips onto the substrate. To laterally grip the chips to be transferred, a temporary connection is established between the transfer device and one or two non-opposing lateral surfaces of the chips to be transferred. The temporary connection between the transfer device and the chips to be transferred can be created by the transfer device locally wetting at least one lateral surface of each chip to be transferred with a droplet and then freezing the droplet. After placing the chip to be transferred, the temporary connection is released in step 450 by heating the frozen droplet.

[0038] The invention is not limited to the embodiments described herein and the aspects highlighted therein. Rather, various modifications that are within the scope of the claims are possible and are of skill to those skilled in the art.

Claims

1. A method for transferring a chip (120) from a wafer (100) onto a substrate (160), comprising the following steps: a. Provide (400) wafers (100) having multiple chips (120); b. Separate (420) the wafer (100) into the chip (120); c. The chip (120) is removed (430) from the wafer (100) by means of the removal device (170); and d. Using a transfer device (180), the separated chip (120) is transferred (440) onto the substrate (160) by laterally gripping and subsequently placing the chip (120) onto the substrate (160), wherein, In order to laterally grasp the chip to be transferred (120'), a temporary connection (186') is established between the transfer device (180) and one lateral surface (121) or two non-opposing lateral surfaces (121) of the chip to be transferred (120').

2. The method according to any one of the preceding claims, wherein, The chip (120) includes a MEMS structure (122) for a microelectromechanical system, wherein the MEMS structure (122) is released (410) before being separated (420) from the wafer (100).

3. The method according to claim 2, wherein, The MEMS structure (122) includes or is used for one or more MEMS elements, such as MEMS sensors and MEMS actuators, such as MEMS inertial sensors, MEMS pressure sensors, MEMS microphones, MEMS micromirrors and / or MEMS resonators.

4. The method according to any one of the preceding claims, wherein, The wafer (100) is connected to a carrier wafer (102) preferably made of or including glass before the separation (420).

5. The method according to any one of the preceding claims, wherein, The chip (120) of the wafer (100) is at least partially electrically connected to one or more elements (135) prior to the separation (420).

6. The method according to any one of the preceding claims, wherein, The removal (430) performed using the removal device (170) is carried out by offsetting each chip (120) perpendicular to the wafer surface (100a) of the wafer (100), so that the chip (120) can be picked up by the transfer device (180) after the offset.

7. The method according to any one of the preceding claims, wherein, In order to laterally grasp the chip (120), a temporary connection (186') is established between the transfer device (180) and the chip to be transferred (120') in such a way that the transfer device (180) contacts the chip to be transferred (120') on one or all of the lateral surfaces (121) of the chip to be transferred (120') used for the temporary connection (186') with one or more droplets (186) preferably made of water, and then freezes the droplets.

8. The method according to claim 7, wherein, After the chip to be transferred (120') is placed, the temporary connection (186') is released (450) by heating one or more of the frozen droplets (186).

9. A transfer device (180) for transferring a chip (120), preferably used in the method according to any one of claims 1 to 8, wherein, The transfer device (180) is configured to laterally grasp the chip to be transferred (120') and place it on the substrate (160) in such a way that the transfer device (180) establishes a temporary connection (186') between one lateral surface (121) or two non-opposing lateral surfaces (121) of the transfer device (180) and the chip to be transferred (120') for laterally grasping the chip to be transferred (120').

10. The transfer device (180) according to claim 9, wherein the transfer device (180) is configured to establish the temporary connection (186') for laterally gripping the chip (120) by the transfer device (180) contacting the chip to be transferred (120') with one or more droplets (186) preferably made of water on one or all of the lateral surfaces (121) of the chip to be transferred (120') for the temporary connection (186'), and subsequently freezing the droplets.

11. The transfer device (180) according to claim 10, wherein, The transfer device (180) has a Peltier element (183) configured to freeze one or more droplets (186) that are in contact with the chip (120') to be transferred.

12. The transfer device (180) according to any one of claims 10 or 11, wherein, The transfer device (180) has a measuring device (210) configured to determine the contact state between the chip to be transferred (120') and one of the droplets (186) via resistance measurement and / or capacitance measurement.

13. The transfer device (180) according to any one of claims 10 to 12, wherein, The transfer device (180) has a tool (280) configured to contact the chip to be transferred (120') with at least one of the droplets (186) via the two lateral surfaces (121) of the chip to be transferred (120').

14. The transfer device (180) according to claim 13, wherein, The tool (280) includes a capillary tube (184) for generating the droplets (186).

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