Method for manufacturing corrosion-resistant film and method for manufacturing electrostatic chuck device

Abstract

A method for manufacturing a corrosion-resistant coating film, including: a step of applying a slurry in which particles of a corrosion-resistant material are dispersed to a surface of a dielectric substrate to form a coating film of the corrosion-resistant material; and a step of irradiating a laser beam to the coating film to form a corrosion-resistant coating film in which the corrosion-resistant material is sintered, the corrosion-resistant material being at least one selected from the group of YOF, YF3, MgF2, and MgAl2O4, and the dielectric substrate being an alumina-silicon carbide composite sintered body.

Description

Technical Field

[0001] This invention relates to a method for manufacturing a corrosion-resistant coating and a method for manufacturing an electrostatic chuck device.

[0002] This application claims priority based on Japanese Patent Application No. 2023-203390, filed on November 30, 2023, the contents of which are incorporated herein by reference. Background Technology

[0003] Traditionally, semiconductor manufacturing production lines for ICs, LSIs, and VLSIs have included processes that use halogen gases such as fluorine-based gases and chlorine-based gases, or plasmas of these gases, as corrosive gases. In such processes, for example, after securing semiconductor wafers with an electrostatic chuck, the aforementioned halogen gases or plasmas are sometimes used to etch or clean the wafers (plasma cleaning).

[0004] An electrostatic chuck device includes: a substrate with a mounting surface whose main surface is a wafer mounting surface; and electrostatic adsorption electrodes that generate electrostatic force (Coulomb force) between the electrode and the wafer mounted on the mounting surface. The substrate is typically made of a sintered ceramic body (dielectric substrate). However, it is known that the aforementioned halogen gases or plasmas exhibit strong corrosiveness to the ceramic components constituting the electrostatic chuck device. Therefore, in processes using the aforementioned halogen gases or plasmas, the electrostatic chuck components are easily damaged by the halogen gases or plasmas.

[0005] Regarding the aforementioned technical issues, techniques for improving the corrosion resistance of electrostatic chuck components are known (for example, see Patent Document 1). Patent Document 1 describes an electrostatic chuck component manufactured using a dielectric substrate containing a material with high corrosion resistance. Yttrium aluminum garnet (Y3Al5O4) is disclosed as a material with high corrosion resistance. 12 YAG (hereinafter referred to as YAG) or a mixture of YAG with rare earth oxides other than yttrium oxide added.

[0006] Furthermore, Patent Document 2 discloses a yttrium-based fluoride spray coating, which is suitably a low-dust-generating, corrosion-resistant coating for parts and the like used in a corrosive plasma atmosphere.

[0007] Existing technical documents Patent documents Patent Document 1: Japanese Patent Application Publication No. 2012-094826 Patent Document 2: Japanese Patent Application Publication No. 2017-190475 Summary of the Invention The technical problem to be solved by the invention In recent years, semiconductor devices have become highly integrated, and semiconductor manufacturing processes have diversified. Consequently, after manufacturing electrostatic chuck devices, it is sometimes necessary to improve the corrosion resistance of the electrostatic chuck components. A technology is needed to improve corrosion resistance without damaging the electrostatic chuck device. Furthermore, as a key technology, a method for manufacturing a corrosion-resistant coating that can solve the aforementioned technical challenges is desired.

[0008] The present invention was made in view of this situation, and its object is to provide a method for manufacturing a corrosion-resistant coating that can improve the corrosion resistance of a dielectric substrate. Furthermore, its object is to provide a method for manufacturing an electrostatic chuck component whose corrosion resistance can be improved by using the above-described method to manufacture a corrosion-resistant coating.

[0009] means for solving technical problems To address the aforementioned technical challenges, the present invention includes the following embodiments.

[0010] [1] A method for manufacturing a corrosion-resistant coating, comprising: a step of coating a slurry containing particles of a corrosion-resistant material dispersed on the surface of a dielectric substrate to form a coating of the corrosion-resistant material; and a step of irradiating the coating with a laser beam to form a corrosion-resistant coating formed by sintering the corrosion-resistant material, wherein the corrosion-resistant material is at least one selected from the group consisting of YOF, YF3, MgF2 and MgAl2O4, and the dielectric substrate is an alumina-silicon carbide composite sintered body.

[0011] [2] The method for manufacturing a corrosion-resistant coating according to [1] wherein, in the step of forming the coating, the coating is formed on a portion of the surface.

[0012] [3] A method for manufacturing a corrosion-resistant coating, comprising: a step of forming a corrosion-resistant coating on the surface of a dielectric substrate using microparticles of a corrosion-resistant material and by aerosol deposition, wherein the corrosion-resistant material is at least one selected from the group consisting of YOF, YF3, MgF2 and MgAl2O4, and the dielectric substrate is an alumina-silicon carbide composite sintered body.

[0013] [4] The method for manufacturing the corrosion-resistant coating according to [3] wherein the corrosion-resistant coating is formed on a portion of the surface.

[0014] [5] A method for manufacturing a corrosion-resistant coating, comprising: a step of forming a corrosion-resistant coating on the surface of a dielectric substrate by high-frequency magnetron sputtering using a corrosion-resistant material as a target material, wherein the corrosion-resistant material is at least one selected from the group consisting of YOF, YF3, MgF2 and MgAl2O4, and the dielectric substrate is an alumina-silicon carbide composite sintered body.

[0015] [6] The method for manufacturing the corrosion-resistant coating according to [5] wherein the corrosion-resistant coating is formed on a portion of the surface.

[0016] [7] A method for manufacturing an electrostatic chuck device includes: a step of preparing an electrostatic chuck device body, the electrostatic chuck device body having an electrostatic chuck component made of an alumina-silicon carbide composite sintered body; and a step of forming a corrosion-resistant coating on the surface of the electrostatic chuck component by a method for manufacturing a corrosion-resistant coating as described in any one of [1] to [6].

[0017] [8] A method for manufacturing an electrostatic chuck device, comprising: a step of forming a corrosion-resistant coating on a portion of the surface of an electrostatic chuck component made of an alumina-silicon carbide composite sintered body by means of the corrosion-resistant coating manufacturing method described in any one of [2], [4], and [6]; and a step of manufacturing an electrostatic chuck device, the electrostatic chuck device comprising an electrostatic chuck component having the corrosion-resistant coating.

[0018] [9] A method for manufacturing an electrostatic chuck device includes: a step of preparing an electrostatic chuck device body, the electrostatic chuck device body comprising an electrostatic chuck component made of an alumina-silicon carbide composite sintered body and a temperature regulating component; and a step of forming a corrosion-resistant coating on the surface of the electrostatic chuck component by the corrosion-resistant coating manufacturing method described in [5] or [6], wherein the temperature regulating component is formed of a conductive material, and in the step of forming the corrosion-resistant coating, the temperature regulating component is connected to a high-frequency power supply and a high-frequency magnetron sputtering method is performed.

[0019] Invention Effects According to the present invention, a method for manufacturing a corrosion-resistant coating that improves the corrosion resistance of a dielectric substrate can be provided. Furthermore, a method for manufacturing an electrostatic chuck component whose corrosion resistance is improved by manufacturing a corrosion-resistant coating using the above method can be provided. Attached Figure Description

[0020] Figure 1 This is a schematic diagram illustrating an example of a method for manufacturing a corrosion-resistant coating according to the first embodiment.

[0021] Figure 2 This is a schematic diagram illustrating an example of a method for manufacturing a corrosion-resistant coating according to the first embodiment.

[0022] Figure 3 This is a schematic diagram illustrating an example of a method for manufacturing a corrosion-resistant coating according to the second embodiment.

[0023] Figure 4This is a schematic diagram showing a preferred example of the main body of the electrostatic chuck device. Detailed Implementation

[0024] Manufacturing method of corrosion-resistant coating [First Implementation] The following is for reference. Figures 1-2 The method for manufacturing the corrosion-resistant coating according to the first embodiment of the present invention will be described. Furthermore, in all the following drawings, the dimensions, proportions, etc. of each component have been appropriately modified for easier observation.

[0025] Furthermore, the following descriptions of the first to third embodiments are provided for the purpose of better understanding the spirit of the invention, and are not intended to limit the invention unless otherwise specified. For example, unless otherwise specified, conditions such as materials, quantities, types, quantities, sizes, shapes, positions, and ratios can be changed, added, or omitted as needed.

[0026] (The process of forming a coating film) Figure 1 , Figure 2 This is an explanatory diagram illustrating the method for manufacturing the corrosion-resistant coating according to the first embodiment. In the method for manufacturing the corrosion-resistant coating of this embodiment, firstly, as... Figure 1 As shown, a slurry containing particles of a corrosion-resistant material is coated on the surface 100a of a dielectric substrate 100 to form a corrosion-resistant material coating film 200x (the process of forming the coating film).

[0027] In this embodiment, the dielectric substrate 100 is an alumina (Al2O3)-silicon carbide (SiC) composite sintered body. The dielectric substrate 100 is colored black by including black SiC.

[0028] The corrosion-resistant material is a material that is resistant to corrosive plasma, such as at least one selected from the group consisting of YOF (yttrium oxyfluoride), YF3, MgF2, and MgAl2O4. Furthermore, even commonly used corrosion-resistant materials such as diamond or fluorinated compounds can be used in the manufacturing method of this embodiment.

[0029] The YOF in this invention can be arbitrarily selected. Examples include compounds with a molar ratio of yttrium (Y), oxygen (O), and fluorine (F) of Y:O:F = 1:1:1, and compounds other than those with a ratio of 1:1:1. Examples of compounds other than those with a Y:O:F ratio of 1:1:1 include Y5O4F7 or Y7O6F9. The YOF can be a compound consisting of only one of these compounds, or a combination of two or more of them.

[0030] As long as a corrosion-resistant coating can be formed, the specific surface area of ​​the corrosion-resistant material is not particularly limited; for example, a surface area of ​​0.1 m² can be used. 2 / g~100m 2 / g of corrosion-resistant material. Depending on the requirements, the specific surface area of ​​the corrosion-resistant material particles can be, for example, 0.1m². 2 / g~1.0m 2 / g, 0.5m 2 / g~5.0m 2 / g, 1.0m 2 / g~10m 2 / g, 10m 2 / g~25m 2 / g、25m 2 / g~45m 2 / g、45m 2 / g~70m 2 / g、70m 2 / g~100m 2 / g etc.

[0031] The paste contains a corrosion-resistant material as inorganic particles and a dispersion medium for dispersing the corrosion-resistant material. The dispersion medium includes a solvent and may also include a binder. Furthermore, commercially available screen printing solvents can be used as the dispersion medium. The amount of corrosion-resistant material in the paste can be arbitrarily selected; for example, by mass ratio, examples include 30%–90%, 40%–80%, and 50%–70%, but it is not limited to these.

[0032] As a solvent, it can be selected arbitrarily according to needs, and high-boiling-point organic solvents such as hexanediol, propylene glycol, terpineol, or terpenes can be preferred.

[0033] As an adhesive, it can be selected arbitrarily according to needs, and preferably cellulose resins such as ethyl cellulose, acrylic resins such as polymethyl methacrylate, and vinyl resins such as polyvinyl butyral.

[0034] The dispersion medium may further include, as appropriate, commonly used additives such as leveling agents, chelating agents, surfactants, and thickeners.

[0035] Examples of leveling agents include water, ethylene glycol, polyethylene glycol, and glycerin.

[0036] Examples of chelating agents include acetylacetone, benzylacetone, and acetic acid.

[0037] By mixing these materials using a disperser selected as needed, such as a three-roll mill, a slurry containing corrosion-resistant materials can be obtained.

[0038] A coating film 200x is formed by applying the obtained slurry to the surface 100a of a dielectric substrate 100. Figure 1 In the middle, it is set as a part of the surface 100a of the dielectric substrate 100 (in Figure 2 The coating 200x is formed on a portion of the upper surface (or the entire surface of the dielectric substrate 100), but it can also be formed on the entire surface of the dielectric substrate 100. Depending on the need, it can be formed on the side or lower surface of the dielectric substrate 100. They can also be combined. Furthermore, the ratio of the area of ​​the portion relative to the area of ​​the entire surface of surface 100a can be arbitrarily selected, for example, it can be 1–95%, 5–70%, 10–50%, or 20–30%. The shape formed by the portion can be arbitrarily selected; in top view, it can be a shape surrounded by straight lines, a shape surrounded by curves, a shape surrounded by a combination of straight lines and curves, or an irregular shape. For example, it can be circular.

[0039] The method of applying the coating paste is not particularly limited, and any known coating method or printing method can be used. For example, a known printing method could be screen printing or spraying.

[0040] By drying the applied slurry, a coating 200x is obtained. The thickness of the coating 200x can be adjusted appropriately according to the desired corrosion resistance. For example, the thickness of the coating 200x can be appropriately determined by considering the desired corrosion resistance and the necessity of laser beam L transmission; for example, it can be 0.1μm to 200μm, 0.15μm to 150μm, 0.2μm to 95μm, 0.3μm to 90μm, 0.5μm to 80μm, 1μm to 50μm, or 5 to 20μm.

[0041] The drying method for the slurry is not particularly limited and can be chosen arbitrarily. For example, a method of placing it in an atmosphere at a solvent-removing temperature, such as room temperature to 200°C, can be cited. During drying, air supply or pressure reduction can be appropriately combined. The temperature can be, for example, 10–180°C, 30–150°C, 50–120°C, or 70–100°C.

[0042] Furthermore, to remove impurities such as adhesives contained in the coating film 200x, the applied slurry or coating film 200x can be degreased. For example, degreasing can be performed under an inert atmosphere such as nitrogen or argon at a temperature of 200°C to 600°C. Typically, if this degreasing treatment is performed, the solvent contained in the coating film 200x will also be removed. The degreasing temperature can be 200°C to 330°C, 330°C to 450°C, or 450°C to 600°C.

[0043] That is, in order to obtain a coating of 200x from the applied slurry, the slurry can be dried, degreased, or degreased after drying.

[0044] Next, as Figure 2 As shown, a laser beam L is irradiated onto a coating 200x to form a corrosion-resistant film 200, which is formed by sintering a corrosion-resistant material (the process of forming a corrosion-resistant film). Specifically, in the region where the corrosion-resistant film 200 is formed, the coating 200x is irradiated while being scanned by the laser beam L, causing the particles of the corrosion-resistant material constituting the coating 200x to sinter. Figure 2 In the figure, the light source of the laser beam L is indicated by the reference numeral LS. The device used to irradiate the laser beam L can be chosen arbitrarily.

[0045] In this embodiment, "irradiating the coating 200x with a laser beam L" includes not only directly irradiating the coating 200x with the laser beam L, but also irradiating a film formed on the surface of the coating 200x. Specifically, the laser beam L can be directly irradiated into the coating 200x, and / or, if a deposited film such as carbon is formed on the surface of the coating 200x, the deposited film can be irradiated. Thus, the coating 200x is heated directly by the laser beam L or indirectly via the deposited film, and sintered by the heat generated by the laser beam L.

[0046] When a laser beam L is directly irradiated onto the coating 200x, the dielectric substrate 100, which contains black SiC, absorbs the laser beam L and heats up. Therefore, the coating 200x on the dielectric substrate 100 is sintered through direct heating based on laser beam L irradiation and heating based on heat transfer from the dielectric substrate 100, becoming a corrosion-resistant coating 200. The particles composed of the corrosion-resistant material bond together to obtain a sintered film.

[0047] When the laser beam L is directly irradiated onto the coating 200x, the laser beam L needs to be irradiated onto the dielectric substrate 100. Therefore, the thickness of the coating 200x is preferably 95 μm or less.

[0048] Furthermore, in order for the dielectric substrate 100 to absorb the laser beam L, it is preferable to include at least 1 part by mass of silicon carbide relative to 100 parts by mass of alumina. From the viewpoint of obtaining the desired dielectric constant and volume resistivity, the dielectric substrate 100 preferably contains at least 1 part by mass and no more than 10 parts by mass of silicon carbide relative to 100 parts by mass of alumina. The amount of silicon carbide can be at least 2 parts by mass and no more than 9 parts by mass, at least 3 parts by mass and no more than 7 parts by mass, at least 4 parts by mass and no more than 6 parts by mass, etc.

[0049] When a deposited film is present on the surface of the coating 200x and is irradiated, the deposited film absorbs the laser beam L and generates heat when irradiated by the laser beam L.

[0050] Specifically, when a carbon or other deposited film is placed on the coating 200x and irradiated with a laser beam L, the laser beam L irradiates the deposited film, and the deposited film is heated. Thus, through heat transfer from the deposited film, the coating 200x is sintered to become a corrosion-resistant coating 200.

[0051] Alternatively, a portion of the laser beam L can be transmitted through the deposited film to irradiate the coating 200x. In this case, the coating 200x is sintered by direct heating based on the irradiation of the laser beam L and heating based on heat transfer from the deposited film heated by the laser beam L, thus becoming a corrosion-resistant coating 200.

[0052] Alternatively, a portion of the laser beam L reaching the coating 200x can be transmitted through the coating 200x and irradiate the dielectric substrate 100. In this case, the coating 200x is sintered by direct heating based on the irradiation of the laser beam L and by heating based on heat transfer from the deposited film heated by the laser beam L and the dielectric substrate 100, thus becoming a corrosion-resistant coating 200.

[0053] Regarding the irradiation conditions of the laser beam L, there are no particular limitations as long as the coating 200x is sintered to form a corrosion-resistant film 200. For example, conditions where the coating 200x is irradiated with an output of 50W to 1000W can be cited. The output can be arbitrarily selected as needed, such as 70W to 800W, 100W to 600W, 200W to 500W, 300W to 400W, etc. Furthermore, the device used for irradiating the laser beam can be arbitrarily selected.

[0054] Furthermore, when irradiating with the laser beam L, irradiation can begin from the position where the laser beam L directly irradiates the coating 200x. Also, the laser beam L can be irradiated onto the surface 100a of the dielectric substrate 100 exposed near the coating 200x, by first heating the dielectric substrate 100 and then irradiating the coating 200x with the laser beam L while scanning.

[0055] The thickness of the manufactured corrosion-resistant coating 200 can be, for example, 0.02 μm to 200 μm. Depending on the requirements, it can be 0.04 μm to 150 μm, 0.07 μm to 110 μm, 0.08 μm to 90 μm, 0.10 μm to 70 μm, 1 μm to 60 μm, 5 μm to 40 μm, 10 μm to 20 μm, etc. The thickness of the corrosion-resistant coating 200 can be adjusted by controlling the thickness of the coating 200x.

[0056] According to the method for manufacturing a corrosion-resistant coating with the structure described above, a method for manufacturing a corrosion-resistant coating that can improve the corrosion resistance of a dielectric substrate can be provided.

[0057] For example, if a corrosion-resistant coating is formed by spraying a corrosion-resistant material, it is necessary to collide the corrosion-resistant material with the dielectric substrate 100 while the material is in a molten or semi-molten state. That is, the corrosion-resistant material colliding with the dielectric substrate 100 can be described as being at a high temperature with a molten state.

[0058] Furthermore, if after the corrosion-resistant material is disposed on the dielectric substrate 100, the entire dielectric substrate 100 is heated and sintered using a heating device, the entire dielectric substrate 100 is heated to above the sintering temperature of the corrosion-resistant material.

[0059] In contrast, in the corrosion-resistant coating manufacturing method of this embodiment, a corrosion-resistant material coating is formed by coating a slurry containing a corrosion-resistant material. Furthermore, the corrosion-resistant coating 200 can be manufactured without heating the dielectric substrate 100 as described above, except for local heating by the laser beam L. Therefore, according to the corrosion-resistant coating manufacturing method of this embodiment, compared with conventionally known methods, the corrosion resistance of the dielectric substrate can be improved without exposing the dielectric substrate 100 to a high-intensity heating environment.

[0060] [Second Implementation] Figure 3 This is an explanatory diagram illustrating the manufacturing method of the corrosion-resistant coating according to the second embodiment. In this embodiment, the same reference numerals are used to denote components common to the first embodiment, and detailed descriptions are omitted.

[0061] (The process of forming a corrosion-resistant coating) In the method for manufacturing the corrosion-resistant coating of this embodiment, such as Figure 3 As shown, a corrosion-resistant coating 200 is formed on the surface 100a of a dielectric substrate 100 using microparticles 210 of a corrosion-resistant material and by aerosol deposition (hereinafter referred to as AD method).

[0062] The aerosolization (AD) method involves mixing pre-prepared raw material particles with a gas to form an aerosol, which is then sprayed onto an object through a nozzle to form a coating. According to the AD method, corrosion-resistant materials can be formed at room temperature. Furthermore, the AD method can form a denser film compared to films formed by melt spraying. The shape or number of nozzle openings can be arbitrarily selected; for example, one or more circular or quadrilateral openings can be used.

[0063] AD method, for example, using Figure 3The aerosol deposition apparatus (hereinafter referred to as AD apparatus) 1000 shown is used for implementation. AD apparatus 1000 has a film-forming chamber 1100, a stage 1200 and a jetting section 1300.

[0064] The film-forming chamber 1100 includes a chamber 1110 for accommodating the object to be formed (dielectric substrate 100) and a pressure-reducing pump 1120 for reducing the pressure inside the chamber 1110. During the AD process, the pressure inside the chamber 1110 is reduced by the pressure-reducing pump 1120.

[0065] The stage 1200 is a stage for mounting the dielectric substrate 100, preferably an XYZθ stage. The XYZθ stage is capable of micro-adjustment in four axes. The stage 1200 can change the relative position and orientation (angle) of the nozzle 1320 relative to the jetting section 1300. For example, it can move horizontally left and right or forward and backward as needed, and can be set to any selectable angle, such as angles (collision angles) in the range of 0 to 90°, 5 to 75°, 10 to 60°, 15 to 45°, etc., or they can be combined. The moving speed of the stage can also be arbitrarily selected, for example, it can be 1 to 5000 mm / min, 5 to 1000 mm / min, 10 to 800 mm / min, 100 to 600 mm / min, or 200 to 400 mm / min, but is not limited to these examples.

[0066] The spraying unit 1300 includes a preparation unit 1310 for preparing an aerosol 220 containing microparticles 210 of a corrosion-resistant material, a nozzle 1320 for spraying the microparticles 210, and a pipe 1330 connecting the preparation unit 1310 and the nozzle 1320. The preparation unit 1310 is disposed outside the chamber 1110, and the nozzle 1320 is disposed inside the chamber 1110 opposite to the stage 1200. The distance between the nozzle 1320 and the surface 100a of the dielectric substrate 100 can be arbitrarily selected, for example, it can be 5mm to 50mm, 10mm to 45mm, 20mm to 40mm, etc. The type of gas mixed with the microparticles of the raw material can be arbitrarily selected, for example, helium, nitrogen, argon, etc. The microparticles 210 used as the corrosion-resistant material can use the microparticles or conditions described in the first embodiment, for example, YOF particles, YF3 particles, etc. The film-forming temperature can be arbitrarily selected, for example, 0–200℃, or 0–100℃, 0–60℃, 0–45℃, 5–40℃, or 10–35℃. The gas flow rate can be arbitrarily set, for example, 1–50L / min, 5–40L / min, or 10–30L / min, but is not limited to these examples.

[0067] As an AD method, known methods such as those described in Japanese Patent Publication No. 2020-525640 can be used.

[0068] In the AD process, a coating can be formed by spraying raw material onto the entire surface of the object, or it can be formed by spraying raw material onto a portion of the object's surface, creating a coating in a specific area. Figure 3 In this embodiment, a corrosion-resistant coating 200 is formed on a portion of the surface 100a of the dielectric substrate 100, but it can also be formed on the entire surface of the dielectric substrate 100.

[0069] The particle size range of the corrosion-resistant material microparticles 210 can be arbitrarily selected, for example, it can be set to 0.1μm~20μm, or 0.1μm~15μm, 0.1μm~10μm, 0.2μm~5μm, 0.2μm~2μm. It can also be 0.3μm~1.5μm, or 0.5μm~1.0μm.

[0070] The thickness of the manufactured corrosion-resistant coating 200 can be arbitrarily selected, for example, it can be 0.01μm to 90μm, or 0.1μm to 60μm, 1.0μm to 20μm, 2μm to 10μm, or 3μm to 7μm. The thickness of the corrosion-resistant coating 200 can be adjusted by controlling the amount or duration of the spraying of the raw material particles.

[0071] Regarding the obtained corrosion-resistant coating 200, if the adhesion to the dielectric substrate 100 is insufficient, the corrosion-resistant coating 200 can be further irradiated with the laser beam described in the first embodiment, and the corrosion-resistant coating 200 can be sintered.

[0072] The method for manufacturing a corrosion-resistant coating with the above-described structure also provides a method for manufacturing a corrosion-resistant coating that improves the corrosion resistance of the dielectric substrate 100. According to the AD method, film formation can be performed at room temperature; therefore, compared to conventional methods, the corrosion resistance of the dielectric substrate can be improved without exposing the dielectric substrate 100 to a heated environment. Furthermore, even a corrosion-resistant coating 200 with a thickness of only a few μm can form a corrosion-resistant coating with excellent corrosion resistance and excellent adhesion to the dielectric substrate 100.

[0073] [Third Implementation] In the method for manufacturing the corrosion-resistant coating according to this embodiment, a corrosion-resistant material is used as the target material, and a corrosion-resistant coating 200 is formed on the surface 100a of the dielectric substrate 100 by high-frequency magnetron sputtering (the step of forming the corrosion-resistant coating). For ease of understanding of the invention, the reference numerals in the following figures are the same as those in the first and second embodiments described above.

[0074] The target material can be a sintered body formed using a corrosion-resistant material, an unsintered powdered material formed using a corrosion-resistant material, a molded body formed by solidifying the powdered material, a melt-blown film formed using a corrosion-resistant material, or a combination thereof. To improve sputtering efficiency, the target material can be the sintered body, with corrosion-resistant powder or a molded body disposed on the dielectric substrate 100 side of the sintered body. Alternatively, the target material can be the molded body, with corrosion-resistant powder disposed on the dielectric substrate 100 side of the molded body.

[0075] The target material can use a metallic element from the compound that constitutes the corrosion-resistant material. The target material can be composed solely of the stated metallic element. Specifically, examples of such metallic elements include Y, Al, and Mg.

[0076] High-frequency magnetron sputtering is a method in which a magnet is placed on the back of a target, and the ionization of plasma gas is promoted by a magnetic field generated on the target surface, thereby improving sputtering efficiency. High-frequency magnetron sputtering can be implemented using a known high-frequency magnetron sputtering apparatus. For example, in this embodiment, a dielectric substrate 100 and a target (target material, cathode) with a magnet (permanent magnet, etc.) placed on its back can be arranged facing each other in a container, the container can be set to a vacuum, a gas of choice such as an inert gas can be introduced into the container as needed, and plasma can be generated by applying a voltage. Furthermore, the generated cations such as argon ions can collide with the surface of the target, and a corrosion-resistant coating can be formed on the surface of the dielectric substrate 100 by particles sputtered from the target. When the dielectric substrate 100 is combined with a temperature regulating component (temperature regulating base portion) made of a conductive material, a high-frequency power supply can be connected to the temperature regulating component to form a corrosion-resistant coating.

[0077] In the method for manufacturing the corrosion-resistant coating in this embodiment, the corrosion-resistant coating can be formed on the entire surface of the dielectric substrate 100, which is the object, or the corrosion-resistant coating can be formed on a portion of the surface of the object by masking the dielectric substrate 100.

[0078] The method for manufacturing a corrosion-resistant coating with the above-described structure can also provide a method for manufacturing a corrosion-resistant coating that can improve the corrosion resistance of the dielectric substrate 100.

[0079] Manufacturing Method of Electrostatic Chuck Device The manufacturing method of the electrostatic chuck device of this embodiment includes: a step of preparing an electrostatic chuck device body, the electrostatic chuck device body having an electrostatic chuck component made of an alumina-silicon carbide composite sintered body; and a step of forming a corrosion-resistant coating on the surface of the electrostatic chuck component by the above-described corrosion-resistant coating manufacturing method.

[0080] (The process of preparing the main body of the electrostatic chuck device) First, prepare as follows Figure 4 The main body of the electrostatic chuck device shown. Figure 4 This is a schematic diagram showing a preferred example of the main body of the electrostatic chuck device.

[0081] The main body 1 of the electrostatic chuck device includes: an electrostatic chuck component 2, which is circular in shape when viewed from above, with one main surface (upper surface) as the mounting surface; and a circular in shape when viewed from above, temperature regulating base 3, which is disposed below the electrostatic chuck component 2 and adjusts the electrostatic chuck component 2 to a desired temperature. Furthermore, the electrostatic chuck component 2 and the temperature regulating base 3 are bonded together via an adhesive layer 8 disposed between the electrostatic chuck component 2 and the temperature regulating base 3.

[0082] <Electrostatic Chuck Components> The electrostatic chuck component 2 includes: a mounting plate 11, the upper surface of which is a mounting surface 11a for mounting a plate-shaped sample W such as a semiconductor wafer; a support plate 12, integral with the mounting plate 11 and supporting the bottom side of the mounting plate 11; and an electrostatic adsorption electrode 13 disposed between the mounting plate 11 and the support plate 12. The electrostatic chuck component 2 may have an insulating material layer 14 that insulates the periphery of the electrostatic adsorption electrode 13.

[0083] In addition, Figure 4 In this embodiment, the electrostatic adsorption electrode 13 is disposed inside the substrate (between the mounting plate 11 and the support plate 12), but is not limited thereto. The electrostatic adsorption electrode 13 may be disposed on the side opposite to the mounting surface of the substrate, that is, at the lower part of the support plate 12.

[0084] (Placement plate, support plate) The mounting plate 11 and the support plate 12 are circular plate-shaped components with identical shapes for their overlapping surfaces. The mounting plate 11 and the support plate 12 possess excellent mechanical strength and durability against corrosive gases and their plasmas. The mounting plate 11 and the support plate 12 are constructed from the aforementioned Al2O3-SiC composite sintered body. In other words, the mounting plate 11 and the support plate 12 correspond to a dielectric substrate 100 from which a corrosion-resistant coating can be formed using the manufacturing methods of the corrosion-resistant coating in the first and second embodiments.

[0085] On the mounting surface 11a of the mounting plate 11, a plurality of protrusions 11b with diameters smaller than the thickness of the plate-shaped specimen are formed at predetermined intervals. These protrusions 11b support the plate-shaped specimen W.

[0086] (Electrode for electrostatic adsorption) Electrostatic adsorption electrode 13 is used to generate an electric charge to produce an electrostatic adsorption force to fix the plate-shaped sample W. Its shape and size can be adjusted appropriately according to its application.

[0087] The electrostatic adsorption electrode 13 is formed from a material arbitrarily selected from conductive ceramics or metals that is not prone to deterioration or damage under the operating conditions of the electrostatic chuck device manufactured in the manufacturing method of this embodiment.

[0088] (Insulating material layer) An insulating material layer 14 surrounds the electrostatic adsorption electrode 13 to protect it from corrosive gases and their plasma. Furthermore, the insulating material layer 14 is a layer that integrally bonds the boundary between the mounting plate 11 and the support plate 12, i.e., the outer peripheral area excluding the electrostatic adsorption electrode 13, and is made of an insulating material with the same composition or main components as the materials constituting the mounting plate 11 and the support plate 12.

[0089] (Temperature adjustment base) The temperature regulating base 3 is a component used to adjust the electrostatic chuck component 2 to the desired temperature, and is a thick, circular plate-shaped component. The main structure of the temperature regulating base 3 also functions as an internal electrode for plasma generation. The main structure of the temperature regulating base 3 is connected to an external high-frequency power supply via a matching device (not shown). For example, a liquid-cooled base with a refrigerant circulation path 3A formed internally is preferred as the temperature regulating base 3.

[0090] An insulating plate 7 can be bonded to the upper surface of the temperature regulating base 3 via an adhesive layer 6 as needed. The temperature regulating base 3 can be formed of any material, such as metal, conductive ceramic, or metal matrix composite (MMC).

[0091] The adhesive layer 6 is formed of an adhesive resin that has heat resistance and insulation properties. Examples of such adhesive materials include sheet-like or film-like polyimide resin, silicone resin, epoxy resin, etc.

[0092] The insulating board 7 is made of an insulating material that is not prone to deterioration or damage under the operating conditions of the electrostatic chuck device being manufactured. The insulating board 7 is, for example, made of a sheet, film or liner of a heat-resistant resin such as polyimide resin, epoxy resin, or acrylic resin.

[0093] (Focusing ring) The electrostatic chuck device body 1 may include a focusing ring 10. The focusing ring 10 is a ring-shaped component when viewed from above, placed on the periphery of the temperature regulating base 3. The focusing ring 10 may, for example, be made of a material having the same conductivity as the wafer placed on the mounting surface. By configuring such a focusing ring 10, the electrical environment for plasma at the periphery of the wafer can be made approximately consistent with that of the wafer, thereby minimizing differences or deviations in plasma processing between the center and periphery of the wafer.

[0094] (Other components) A power supply terminal 15 for applying a DC voltage to the electrostatic adsorption electrode 13 is connected to the electrostatic adsorption electrode 13. The power supply terminal 15 is inserted into the through hole 16 that penetrates the temperature regulating base 3, the adhesive layer 8, and the support plate 12 in the thickness direction. An insulator 15a with insulating properties may be provided on the outer periphery of the power supply terminal 15.

[0095] A heating element 5 can be provided on the lower surface of the electrostatic chuck component 2. Alternatively, the heating element 5 can be located inside the electrostatic chuck component 2. The heating element 5 can be made of any material or shape, as long as it is capable of heating the electrostatic chuck component 2. A power supply terminal 17 for supplying power to the heating element 5 is connected to it. A cylindrical insulator 18 made of insulating material can be provided between the power supply terminal 17 and the through hole 3b.

[0096] The heating element 5 is bonded and fixed to the bottom surface of the support plate 12 by an adhesive layer 4 made of sheet-like or film-like silicone or acrylic resin with uniform thickness, heat resistance, and insulation. The heating element 5 can have any shape that can be selected.

[0097] Furthermore, a temperature sensor 20 can be provided on the lower surface of the heating element 5. In the main body 1 of the electrostatic chuck device, a mounting hole 21 is formed, penetrating the temperature regulating base 3 in the thickness direction. The temperature sensor 20 is provided at the uppermost part of the mounting hole 21. The heating element 5 and the temperature sensor 20 do not need to be in direct contact.

[0098] Furthermore, the main body 1 of the electrostatic chuck device may have a gas hole 28 that extends through the temperature regulating base 3 to the mounting plate 11 in their thickness direction. A cylindrical insulator 29 may be provided on the inner periphery of the gas hole 28.

[0099] A gas supply device (cooling mechanism) is connected to the gas hole 28. Cooling gas (heat transfer gas) for cooling the plate-shaped sample W is supplied from the gas supply device through the gas hole 28. The cooling gas is supplied through the gas hole to the groove 19 formed between a plurality of protrusions 11b on the upper surface of the mounting plate 11, thereby cooling the plate-shaped sample W.

[0100] Furthermore, the main body 1 of the electrostatic chuck device has a pin insertion through-hole (not shown) that extends from the temperature regulating base 3 to the mounting plate 11 in their thickness direction. For example, the same structure as the gas hole 28 can be used as the pin insertion through-hole. A lifting pin for disengaging the plate-shaped sample is inserted into the pin insertion through-hole.

[0101] The main body 1 of the electrostatic chuck device has the structure described above.

[0102] (The process of forming a corrosion-resistant coating) Next, by the above-described method for manufacturing a corrosion-resistant coating, a corrosion-resistant coating is formed on the surface of the electrostatic chuck component 2, specifically on the surface of the mounting plate 11 and / or support plate 12 made of Al2O3-SiC composite sintered body (the process of forming a corrosion-resistant coating).

[0103] When a corrosion-resistant coating is formed by the method of the first embodiment, the dispersant used in the coating and the method of forming the coating are not particularly limited as long as they do not cause damage or deterioration to the components of the electrostatic chuck device body 1 and do not affect its use.

[0104] When a corrosion-resistant coating is formed by the method of the third embodiment, the temperature adjustment component 3 can be connected to a high-frequency power supply.

[0105] The corrosion-resistant coating is preferably applied to the parts of the electrostatic chuck device exposed to plasma. The location of the corrosion-resistant coating can be chosen arbitrarily. For example, the corrosion-resistant coating is preferably applied to the surface and sides of the electrostatic chuck device body 1, and / or preferably to the surface and sides of the electrostatic chuck component 2.

[0106] Furthermore, by using the methods described above (laser beam-based sintering, AD method, magnetron sputtering method), it is also possible to apply a corrosion-resistant coating to areas other than the dielectric substrate 100. For example, the corrosion-resistant coating can be applied to the side of the focusing ring 10 exposed to plasma or the temperature regulating base portion 3.

[0107] The methods for manufacturing the corrosion-resistant coating in the first, second, and third embodiments described above can all form a corrosion-resistant coating without exposing the dielectric substrate 100 to a high-intensity heating environment. Therefore, even when forming a corrosion-resistant coating on the electrostatic chuck device body 1, the corrosion-resistant coating can be formed without exposing the electrostatic chuck device body 1 to a heating environment, and the corrosion resistance of the electrostatic chuck device body 1 can be improved without damaging the wiring and other device structures of the electrostatic chuck device body 1.

[0108] Furthermore, in the methods for manufacturing the corrosion-resistant coating according to the first and second embodiments described above, the corrosion-resistant coating can also be formed at the desired location. Therefore, in the electrostatic chuck device, by selectively forming a corrosion-resistant coating on areas prone to wear during the plasma process, the corrosion resistance of these areas can be particularly improved. A process may be included in which the areas of the electrostatic chuck device prone to wear during the plasma process are identified in advance.

[0109] Furthermore, for electrostatic chuck devices that are worn out during plasma processing due to use, the worn areas can be easily repaired by re-forming a corrosion-resistant coating, allowing the device to be used for a long time. That is, a repair process for repairing the worn areas of the electrostatic chuck device can be further included.

[0110] The manufacturing method of the electrostatic chuck device with the structure described above can improve the corrosion resistance of the electrostatic chuck device.

[0111] In addition, in this embodiment, after preparing the electrostatic chuck device body 1, a corrosion-resistant coating is formed on the electrostatic chuck component of the electrostatic chuck device body 1, but it is not limited to this.

[0112] For example, after forming a corrosion-resistant coating on a portion of the surface of the electrostatic chuck component 2 made of Al2O3-SiC composite sintered body, the electrostatic chuck component 2 can be used to manufacture an electrostatic chuck device having the corrosion-resistant coating.

[0113] Even with this manufacturing method, in the electrostatic chuck device, a corrosion-resistant coating can be selectively formed on parts that are prone to wear during the plasma process, which can particularly improve the corrosion resistance of parts that are prone to wear during the plasma process.

[0114] The preferred embodiments of the present invention have been described above with reference to the accompanying drawings; however, the present invention is not limited to these examples. The shapes or combinations of the constituent components shown in the above examples are merely one example, and various modifications can be made according to design requirements, etc., without departing from the spirit of the present invention.

[0115] Example The present invention will be described below through examples, but the present invention is not limited to these examples.

[0116] In this embodiment, as a model experiment, the following test piece was used to confirm that a corrosion-resistant coating could be formed.

[0117] Test piece: Dielectric substrate (Al2O3:SiC=95:5 (mass ratio), circular, 20mm thick) [Example 1] Yttrium oxyfluoride (YOF) particles (specific surface area 4.7 m²) will be used as a corrosion-resistant material. 2 The mixture was added to a screen printing solvent at a rate of 70% by mass (g / g), and dispersed using a three-roll mill to obtain a slurry containing particles of a corrosion-resistant material.

[0118] The obtained paste was screen-printed onto the test piece to form a coating with a dry film thickness of 15 μm. The obtained coating was then irradiated with a 400W laser to sinter it, thereby obtaining the corrosion-resistant coating of Example 1.

[0119] [Example 2] Yttrium fluoride particles (YF3, specific surface area 8.2 m²) were used as a corrosion-resistant material. 2 / g) and the content of corrosion-resistant material in the slurry was set to 60% by mass. Otherwise, the corrosion-resistant coating of Example 2 was obtained in the same manner as in Example 1.

[0120] [Example 3] Spinel particles (MgAl2O4, specific surface area 2.9 m²) were used as a corrosion-resistant material. 2 / g) and the content of corrosion-resistant material in the slurry was set to 54% by mass. Otherwise, the corrosion-resistant coating of Example 3 was obtained in the same manner as in Example 1.

[0121] [Example 4] Yttrium oxyfluoride (YOF) particles (specific surface area 1.9 m²) were used as a corrosion-resistant material. 2 / g), and the corrosion-resistant coating of Example 4 was formed on the test piece by aerosol deposition. Using aerosol deposition, the corrosion-resistant coating can be fully adhered to the dielectric substrate serving as the test piece.

[0122] (Conditions for aerosol deposition) Gas (He) flow rate: 10 L / min Collision angle: 60° Substrate moving speed: 200mm / min (The resulting corrosion-resistant coating) Thickness of corrosion-resistant coating: 1μm As shown in Examples 1-4, it was confirmed that a corrosion-resistant coating could be formed on a dielectric substrate made of Al2O3 and SiC by screen printing and laser irradiation or aerosol deposition.

[0123] The above research confirms that the present invention is useful.

[0124] Explanation of reference numerals in the attached figures 1-Main body of electrostatic chuck device 2-Electrostatic Chuck Components 3- Temperature regulating base part 3A-Flow path 3b-Through Hole 4-Adhesive layer 5-Heating element 6-Adhesive layer 7-Insulation Board 8-Adhesive layer 10-Focusing Ring 11-Placement plate 11a-Placement Surface 11b-Protrusion 12-Support Plate 13-Electrode for electrostatic adsorption 14-Insulation material layer 15-Power supply terminal 15a-Insulator 16-Through Hole 17-Power supply terminal 18-Insulator 19-slot 20-Temperature Sensor 21-Setting Hole 28-Gas Pore 29-Insulator 2O4-MgAl 100-Dielectric substrate 100a-Surface 200-Corrosion-resistant coating 200x-coating 210-particles 220-aerosol 1000-Aerosol Deposition Device 1100-film-forming chamber 1110-chamber 1120-Pressure Reducing Pump 1200-platform 1300-Jet Section 1310 - Preparation Department 1320-nozzle 1330-Piping L-laser beam LS-laser beam source W - Plate-shaped specimen.

Claims

1. A method for manufacturing a corrosion-resistant coating, comprising: The process of coating a slurry containing particles of a corrosion-resistant material dispersed on the surface of a dielectric substrate to form a coating film of the corrosion-resistant material; and The process of irradiating the coating with a laser beam to form a corrosion-resistant film sintered from the corrosion-resistant material. The corrosion-resistant material is selected from at least one of the following groups: YOF, YF3, MgF2, and MgAl2O4. The dielectric substrate is an alumina-silicon carbide composite sintered body.

2. The method for manufacturing the corrosion-resistant coating according to claim 1, wherein, In the process of forming the coating film, the coating film is formed on a portion of the surface.

3. A method for manufacturing a corrosion-resistant coating, comprising: The process of forming a corrosion-resistant coating on the surface of a dielectric substrate using microparticles of corrosion-resistant materials and aerosol deposition. The corrosion-resistant material is selected from at least one of the following groups: YOF, YF3, MgF2, and MgAl2O4. The dielectric substrate is an alumina-silicon carbide composite sintered body.

4. The method for manufacturing the corrosion-resistant coating according to claim 3, wherein, The corrosion-resistant coating is formed on a portion of the surface.

5. A method for manufacturing a corrosion-resistant coating, comprising: The process of forming a corrosion-resistant coating on the surface of a dielectric substrate using a corrosion-resistant material as the target material and a high-frequency magnetron sputtering method. The corrosion-resistant material is selected from at least one of the following groups: YOF, YF3, MgF2, and MgAl2O4. The dielectric substrate is an alumina-silicon carbide composite sintered body.

6. The method for manufacturing the corrosion-resistant coating according to claim 5, wherein, The corrosion-resistant coating is formed on a portion of the surface.

7. A method for manufacturing an electrostatic chuck device, comprising: The process of preparing the main body of the electrostatic chuck device, wherein the main body of the electrostatic chuck device has an electrostatic chuck component made of an alumina-silicon carbide composite sintered body. and The process of forming a corrosion-resistant coating on the surface of the electrostatic chuck component by the method of manufacturing the corrosion-resistant coating according to any one of claims 1 to 6.

8. A method for manufacturing an electrostatic chuck device, comprising: The method for manufacturing a corrosion-resistant coating according to any one of claims 2, 4, and 6 involves forming a corrosion-resistant coating on a portion of the surface of an electrostatic chuck component made of an alumina-silicon carbide composite sintered body. and The process of manufacturing an electrostatic chuck device, wherein the electrostatic chuck device comprises an electrostatic chuck component having the corrosion-resistant coating.

9. A method for manufacturing an electrostatic chuck device, comprising: The process of preparing the main body of the electrostatic chuck device, wherein the main body of the electrostatic chuck device includes an electrostatic chuck component made of an alumina-silicon carbide composite sintered body and a temperature regulating component. and The process of forming a corrosion-resistant coating on the surface of the electrostatic chuck component using the corrosion-resistant coating manufacturing method according to claim 5 or 6. The temperature regulating component is made of a conductive material. In the process of forming the corrosion-resistant coating, the temperature control component is connected to a high-frequency power supply, and a high-frequency magnetron sputtering method is performed.

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