Automatic film expansion and taping assembly for semiconductor packaging

Abstract

The application relates to the technical field of semiconductor packaging, in particular to an automatic film-expanding patch assembly for semiconductor packaging, which comprises a wafer frame body, a film-expanding assembly, a basket assembly and a clamping feeding assembly; the film-expanding assembly comprises a lifting cylinder group, a loading plate and a pair of pressing lining plates; the pair of pressing lining plates are fixed symmetrically on the top of the loading plate, and a feeding cavity with fixed position is formed between the two; the clamping feeding assembly is used for horizontally drawing out the wafer frame body from the basket assembly and horizontally feeding into the feeding cavity; a pair of blocking pins for wafer frame body horizontal limiting and retractable limiting pins are arranged in the feeding cavity; a plurality of retractable abutting ends are arranged through the bottom of the feeding cavity, the top of the abutting end corresponds to the wafer frame body, and a base assembly is arranged at the bottom of the film-expanding assembly; the application can be compatible with the basket type automatic horizontal feeding, and can limit and fix the wafer frame in turn.

Description

Technical Field

[0001] This invention relates to the technical field of semiconductor packaging, and more particularly to an automated film expansion and bonding assembly for semiconductor packaging. Background Technology

[0002] The chip mounter is the core equipment in semiconductor back-end packaging. Its function is to cut and expand the wafer, and then pick up the individual chips on the blue film, align and mount them onto the lead frame and packaging substrate to complete chip fixation. The accuracy of the chip mounter depends on the quality of the film expansion.

[0003] An automatic wafer disk feeding and film expansion device is disclosed in the existing patent publication number CN113510610A, which includes a wafer disk basket lifting device, a basket lifting platform mechanism, a gripper motion mechanism, a wafer gripper mechanism, a wafer mold expansion worktable, and an XY axis linear module.

[0004] In the above technical solution, the wafer frame is removed from the basket by the horizontal movement of the gripper linear motion mechanism, and the lower limit block and upper limit block are sent in to limit the blue film tray. However, there is bound to be a gap between the upper and lower limits to facilitate wafer loading. Therefore, it can only passively prevent the wafer frame from falling out during film expansion, and cannot perform radial limiting and axial fixing of the wafer. During the film expansion operation, it is easy to move or shift position, which will affect the visual positioning of the subsequent pick-and-place machine and cause deviation. In addition, in some existing technologies, the film expansion mechanism requires the wafer frame itself to lift and adjust the angle for film expansion and then reset. After long-term operation, the positional error will continue to accumulate, and the loading position will easily deviate from the reference of the film expansion station, resulting in the deviation of the wafer base position accuracy.

[0005] Therefore, it is necessary to provide an automated film expansion and bonding assembly for semiconductor packaging to solve the problems mentioned in the background art. Summary of the Invention

[0006] The purpose of this invention is to provide an automated film expansion and bonding assembly for semiconductor packaging, which is compatible with basket-type automated horizontal feeding and sequentially limits and fixes the wafer frame around its entire circumference.

[0007] To solve the above-mentioned technical problems, the present invention provides the following technical solution: an automatic film expansion and bonding assembly for semiconductor packaging, comprising a wafer frame, a film expansion assembly, a basket assembly, and a clamping and feeding assembly; The film expansion assembly includes a lifting cylinder group, a material carrier plate, and a pair of pressure plates; A pair of pressure plates are symmetrically fixed to the top of the material carrier plate, forming a feeding cavity with a fixed position between them; The clamping and feeding assembly is used to horizontally pull the wafer frame body out of the basket assembly and horizontally feed it into the feeding cavity. The loading chamber is equipped with a pair of loading stop pins and a retractable limiting pin for horizontally limiting the wafer frame. The bottom of the loading chamber is provided with several retractable abutment ends, the top of which corresponds to the wafer frame.

[0008] As a preferred embodiment of the present invention, a base assembly is provided at the bottom of the film expansion assembly; A mating plate is provided on one side of the base assembly; The docking cross plate is adapted to the height of the carrier plate; One end of the docking plate extends to provide an overlapping portion, and one end of the material carrier plate overlaps and is fixed on the overlapping portion; The base assembly is provided with a pair of corner support frames on the side away from the docking cross plate, and the corner support frames support and fix the other end of the material plate.

[0009] As a preferred embodiment of the present invention, the docking cross plate is disposed between the basket assembly and the feeding chamber; The top two ends of the docking cross plate are provided with roller edge blocks for guiding the wafer frame body; The transmission height of the roller sidewall assembly is set flush with the feeding chamber.

[0010] As a preferred embodiment of the present invention, one end of the wafer frame is provided with a clamping end for clamping by the clamping and feeding assembly; The clamping end has corner openings on both adjacent sides that are adapted to the stop pin; The wafer frame body has a straight end that matches the limiting pin at one end away from the clamping end.

[0011] In a preferred embodiment of the present invention, the stop pin is connected through and fixedly attached to the material carrier plate; The limiting pins penetrate the material carrier plate and slide with it, and an integrated plate is fixedly connected to the bottom of a pair of limiting pins; The abutting end includes an abutting rod and an upper baffle; The abutment rod passes through the material carrier plate, and a floating ring is fixedly connected to the bottom end of the rod. The integrated plate is fixed on the floating ring. The lifting cylinder assembly passes through the floating ring and is fitted with it with a clearance.

[0012] As a preferred embodiment of the present invention, the lifting cylinder assembly includes a central top ring; The base assembly has a rotatable rotating base inside; The rotating base has a through groove in the center, and the through groove slides with the central top ring; An expansion ring extends outward from the bottom of the central top ring. A stepped ring groove adapted to the expansion ring is opened at the bottom of the rotating base. Several guide rods are fixedly connected to the bottom of the stepped ring groove. The guide rods pass through the expansion ring and slide with it.

[0013] As a preferred embodiment of the present invention, a lifting ring is fixedly connected to the outer side of the central top ring; The lifting ring has fixed ear plates extending from its four sides. The bottom of the fixed ear plates is bolted to a nut seat. The nut seat is threaded through and connected to a lead screw. The bottom of the lead screw is rotatably connected to the rotating base. The lifting ring is located at the bottom of the floating ring, and several elastic top members are provided between the two.

[0014] As a preferred embodiment of the present invention, the elastic top member includes a top rod, the bottom of the top rod is fixedly connected to a locking end piece, the top rod passes through the lifting ring and slides with it, and the top of the top rod is rotatably connected to a double-sided retaining wheel; The floating ring has several arc-shaped grooves through it, and the double-sided guide wheels are engaged in the arc-shaped grooves and move along them; A spring is sleeved on the outer side of the top rod, and its two ends are respectively connected to the bottom of the double-sided retaining wheel and the top of the lifting ring.

[0015] As a preferred embodiment of the present invention, the four corners of the rotating base are configured as arc-shaped end faces, and the center of the arc-shaped end face coincides with the center of the central top ring. A V-shaped protruding track is fixedly connected to the arc-shaped end face, and a V-groove wheel is rolled on the outer side of the V-shaped protruding track; The V-grooved wheel is rotatably connected to the base assembly.

[0016] As a preferred embodiment of the present invention, a support plate is fixedly connected to one side of the base assembly, a motor component is fixedly connected to the support plate, a lead screw is provided at the driving end of the motor component, a nut component is driven on the lead screw, a slider seat is fixedly connected to one end of the nut component, and a linear guide mechanism is provided at the bottom of the slider seat. One end of the slider seat extends into a lever block, and one end of the lever block has a through-hole groove. A fixed circle block is movably disposed in the through-hole groove, and the fixed circle block is fixed to one end of the rotating base.

[0017] Compared with the prior art, the beneficial effects achieved by the present invention are as follows: The present invention, by setting a feeding stop pin and a retractable limiting pin in the feeding cavity, and in conjunction with the abutment end extending from the bottom, forms a horizontal full-circumference limit and a vertical upward blocking of the wafer frame, avoiding gaps during film expansion, which would cause the wafer frame to move or shift, and improving the accuracy of subsequent chip mounting positions. By setting the positions of the carrier plate and a pair of pressure plates to be always fixed, a fixed-position loading cavity is formed, which stably connects and holds the horizontal material picking and feeding of the loading component. This ensures that the reference position of the wafer frame remains in place, and there is no positional accuracy deviation caused by lifting and resetting. This ensures the consistency of the basic positional accuracy and avoids the generation of cumulative errors. Attached Figure Description

[0018] The technical solution and other beneficial effects of this application will become apparent from the following detailed description of specific embodiments in conjunction with the accompanying drawings.

[0019] In the attached diagram: Figure 1 This is a schematic diagram of the overall structure of the automatic film expansion and patching assembly of the present invention; Figure 2 This is a three-dimensional schematic diagram of the film expansion assembly of the present invention; Figure 3 This is a three-dimensional schematic diagram of the wafer framework of the present invention; Figure 4 This is a partial three-dimensional schematic diagram of the film expansion assembly of the present invention; Figure 5 This is a three-dimensional schematic diagram of the lifting cylinder assembly of the present invention; Figure 6 yes Figure 5 A magnified view of a portion of region A; Figure 7 yes Figure 5 A magnified view of a portion of region B; Figure 8 This is a three-dimensional schematic diagram of the bottom of the rotating base of the present invention; Figure 9 This is a three-dimensional schematic diagram of the elastic top member of the present invention; Figure 10 This is a schematic diagram of the basket assembly and the clamping and feeding assembly of the present invention; Figure 11 yes Figure 4 A magnified view of a portion of region C; Figure 12 yes Figure 1 A magnified view of a portion of region D; In the diagram: 1. Film expansion assembly; 101. Carrier plate; 102. Pressure plate; 103. Stop pin; 104. Limit pin; 105. Abutment end; 106. Integrated plate; 107. Abutment rod; 108. Floating ring; 2. Basket assembly; 201. Basket shell; 202. Lifting tray; 203. Linear guide mechanism; 3. Clamping and feeding assembly; 301. Linear motion module; 302. Extension arm; 303. Gripper; 304. Drive cylinder; 4. Wafer framework; 401. Clamping end; 402. Corner opening; 403. Straight end; 5. Lifting cylinder assembly; 501. Center top ring; 502. Expanding ring; 503. Lifting ring; 504. Fixed ear plate; 505. Lead screw; 6. Base assembly; 601. Connecting cross plate; 602. Roller side guard assembly; 603. Support plate; 604. Motor components; 605. Lead screw; 606. Slider seat; 607. Pulley block; 608. Fixed circle block; 609. Angle support frame; 7. Rotating base; 701. Guide rod; 702. V-shaped raised track; 703. V-groove wheel; 8. Top rod; 801. Locking end piece; 802. Double-sided retaining wheel; 803. Arc groove; 9. Spring components. Detailed Implementation

[0020] The following disclosure provides many different embodiments or examples for implementing different structures of this application. To simplify the disclosure, specific examples of components and arrangements are described below. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, various specific examples of processes and materials are provided in this application, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0021] Please see Figure 1-12 The present invention provides a technical solution: an automatic film expansion and bonding assembly for semiconductor packaging, comprising a wafer frame 4, a film expansion assembly 1, a basket assembly 2 and a clamping and feeding assembly 3; The film expansion assembly 1 includes a lifting cylinder group 5, a material carrier plate 101 and a pair of pressure plates 102; A pair of pressure plates 102 are symmetrically fixed to the top of the material carrier plate 101, forming a feeding cavity with a fixed position between them; The clamping and feeding assembly 3 is used to horizontally pull the wafer frame body 4 out of the basket assembly 2 and horizontally feed it into the feeding cavity; The loading chamber is equipped with a pair of loading stop pins 103 and a retractable limit pin 104 for horizontally limiting the wafer frame body 4. Several retractable abutment ends 105 are provided through the bottom of the loading chamber, and the top of the abutment ends 105 corresponds to the wafer frame body 4.

[0022] Specifically, the clamping and feeding assembly 3 clamps a single wafer frame 4 from the basket assembly 2 and moves it horizontally to the film expansion assembly 1, and then feeds the wafer frame 4 horizontally into the feeding cavity between the pressure plate 102 and the carrier plate 101; until the front edge of the wafer frame 4 contacts the feeding stop pin 103 fixed on the carrier plate 101, then the retractable limiting pin 104 extends from the rear edge of the wafer frame 4 and works together with the stop pin 103 to restrict all horizontal displacement of the wafer frame 4; When film expansion is required, a retractable abutment end 105 is set to extend upward from the bottom of the carrier plate 101, and its top contacts the lower surface of the wafer frame 4, and pushes the wafer frame 4 upward until the upper surface of the wafer frame 4 contacts the lower surface of a pair of pressure plates 102 to complete axial fixation. Then, the lifting cylinder group 5 can be raised relative to the wafer frame 4 that is limited and fixed to perform the film expansion process. In this embodiment, by setting a feeding stop pin 103 and a retractable limiting pin 104 in the feeding cavity, and cooperating with the abutment end 105 extending from the bottom, the wafer frame body 4 is fully limited in the horizontal direction and blocked upward in the vertical direction, so as to avoid gaps during film expansion, which would cause the wafer frame body 4 to move or shift, and improve the accuracy of subsequent chip mounting position. Furthermore, by setting the positions of the material carrier plate 101 and a pair of pressure plates 102 to be always fixed, a fixed-position feeding cavity is formed, which stably connects and holds the horizontal material picking and feeding of the material feeding assembly 3, thereby ensuring that the reference position of the wafer frame body 4 is always in place, and there is no positional accuracy deviation caused by lifting and resetting, which ensures the consistency of the basic positional accuracy and avoids the generation of cumulative errors. Preferably, the basket assembly 2 includes a basket housing 201, which is an aluminum alloy frame with multiple layers of sliding grooves in the vertical direction inside. Each layer is used to horizontally place a wafer frame 4, and the housing has an opening on one side for the clamping and feeding assembly 3 to horizontally pick up the material. It also includes a lifting plate 202, which is located at the bottom of the basket housing 201 and is driven by a linear drive mechanism to lift the basket housing 201 from below. A linear guide rail mechanism 203 is installed on one side of the lifting plate 202.

[0023] Preferably, the clamping and feeding assembly 3 includes a linear motion module 301, which includes a synchronous belt module driven by a servo motor, is horizontally fixed on the equipment frame, and its stroke covers the distance from the basket assembly 2 to the feeding chamber of the film expansion assembly 1; and an extension arm 302 is installed on the slider of the module, and a gripper 303 and a gripper drive cylinder 304 are provided at the end of the extension arm 302.

[0024] Based on the above embodiments, a base assembly 6 is provided at the bottom of the film expansion assembly 1; A mating plate 601 is provided on one side of the base assembly 6; The height of the connecting plate 601 is adapted to that of the carrier plate 101; One end of the connecting plate 601 is provided with an overlapping part, and one end of the material plate 101 is overlapped and fixed on the overlapping part. A pair of corner support frames 609 are provided on the side of the base assembly 6 away from the docking horizontal plate 601, and the corner support frames 609 support and fix the other end of the material carrier plate 101.

[0025] In this embodiment, the base assembly 6 provides multi-point support for the carrier plate 101 through the docking cross plate 601 on one side and the pair of corner support frames 609 on the other side. This further disperses the upward thrust transmitted by the lifting cylinder assembly 5 during film expansion and the reaction force against the wafer frame 4, reducing the bending deformation of the carrier plate 101 during long-term reciprocating lifting and lowering, and ensuring the support rigidity and flatness of the carrier plate 101. Furthermore, a pair of corner support frames 609 are provided to further resist the horizontal impact force on the material carrier plate 101 when the wafer frame body 4 is loaded, prevent the material carrier plate 101 from twisting and shifting, and ensure that the position reference of the stop pin 103 and the limit pin 104 remains unchanged. Preferably, the connecting plate 601 is made of aluminum alloy, is long and narrow, and its length matches that of the carrier plate 101. It is fixed to one side edge of the base assembly 6 by bolts. Preferably, the overlapping part is a stepped surface with reduced thickness, and a number of positioning pin holes and threaded holes are provided on the stepped surface. The material plate 101 is fixed by bolts, and the corner support frame 609 is similarly fixed by bolts.

[0026] Based on the above embodiments, the connecting plate 601 is disposed between the basket assembly 2 and the feeding chamber; The top two ends of the docking plate 601 are provided with roller edge groups 602 for guiding the wafer frame body 4; The transmission height of the roller guard assembly 602 is set flush with the feeding chamber.

[0027] In this embodiment, a docking cross plate 601 is set between the basket assembly 2 and the loading cavity. The transmission height of the roller baffle group 602 at the top of the cross plate is flush with the loading cavity. When the clamping loading assembly 3 pulls the wafer frame 4 out of the basket assembly 2, the bottom of the wafer frame 4 passes through the roller baffle group 602 and is then pushed into the loading cavity by the grippers. The rolling friction of the rollers replaces the sliding friction, which avoids scratching the bottom surface of the wafer frame 4 and reduces the feeding resistance. Furthermore, the roller guard assembly 602 is set on the left and right sides of the docking horizontal plate 601. The side guards of the rollers form a limiting guide for the two side edges of the wafer frame 4 to prevent it from swinging left and right during horizontal conveying and to ensure that the wafer frame 4 can be aligned with the inlet of the loading cavity for loading. Furthermore, a roller guard assembly 602 is provided at the top of the connecting cross plate 601 to achieve integrated support and conveying guidance, eliminating the need for a separate transition bridge plate, resulting in a compact structure and saving space. Preferably, each set of roller guards 602 includes an L-shaped bracket, which is fixed to the top end face of the connecting horizontal plate 601 by bolts; and the rollers are miniature rollers made of PEEK material with embedded rolling bearings.

[0028] Based on the above embodiments, one end of the wafer frame body 4 is provided with a clamping end 401 for clamping by the clamping and feeding assembly 3; The clamping end 401 has corner openings 402 on both adjacent sides that are adapted to the stop pin 103; The wafer frame 4 has a straight end 403 at the end away from the clamping end 401 that is adapted to the limiting pin 104.

[0029] In this embodiment, corner openings 402 are provided on both sides of the wafer frame 4. The corner openings 402 are adapted to the positions of the stop pins 103. When the wafer frame 4 is delivered into place, the two corner openings 402 are respectively engaged with the two corresponding stop pins 103, which restricts the position of the wafer frame 4 in the forward direction and improves the positioning repeatability. Furthermore, a straight end 403, i.e. a straight edge, is provided, and a pair of limiting pins 104 are provided. After extending, they fit against the straight end 403 to stably limit the wafer frame body 4, preventing the wafer frame body 4 from shifting position under the top action of the abutment end 105 and deviating towards the basket assembly 2, thereby improving stability. Preferably, the clamping end 401 is located in the middle of one side of the wafer frame body 4, and is set as a protruding rectangular platform that matches the width of the gripper. The surface is also machined with anti-slip texture to further increase the clamping friction.

[0030] Based on the above embodiments, the stop pin 103 is inserted through and fixedly connected to the material carrier plate 101; The limiting pin 104 passes through the material carrier plate 101 and slides with it; the bottom of the pair of limiting pins 104 is fixedly connected to the integrated plate 106. The abutting end 105 includes an abutting rod 107 and an upper baffle; The abutment rod 107 passes through the material carrier plate 101, and a floating ring 108 is fixedly connected to the bottom end of the abutment rod 107. The integrated plate 106 is fixed on the floating ring 108. The lifting cylinder assembly 5 passes through the floating ring 108 and is fitted with it with a clearance. The height of the upper end face of the limit pin is higher than the height of the upper end face of the upper baffle.

[0031] In this embodiment, the limiting pin 104 is fixed to the floating ring 108 by the integrated plate 106, and the floating ring 108 is simultaneously fixed to the bottom end of the abutment rod 107. When the floating ring 108 is driven to rise, the abutment rod 107 pushes the wafer frame 4 upward to achieve vertical locking. The integrated plate 106 drives a pair of limiting pins 104 to extend upward to achieve horizontal limiting. The two actions are completed synchronously by the same power source, which reduces the number of cylinders and simplifies the control logic. Furthermore, the upper end face of the limiting pin 104 is set higher than the upper baffle. When the floating ring 108 rises, the limiting pin 104 first extends to the side of the straight end 403 of the wafer frame 4 to complete the horizontal locking. Then the upper baffle of the abutment rod 107 contacts the lower surface of the frame and lifts it up. This sequence ensures that the wafer frame 4 is completely fixed in the horizontal direction before vertical lifting, and will not be offset by horizontal positioning due to friction or small displacement during lifting. Moreover, it does not need to rely on electrical delay or sensor signals. The timing sequence of limiting and then locking can be naturally achieved by the height difference of mechanical dimensions alone, which improves reliability. Preferably, the stop pin 103 is a cylindrical steel pin with threads machined at the bottom, and a threaded through hole is opened at the corresponding position on the material plate 101. The stop pin 103 is screwed into the upper surface of the material plate 101, passes through the material plate 101, and is fixed at the lower end with a lock nut. Preferably, the abutment rod 107 is a cylindrical rod, and the number is preferably 4, which penetrates the corresponding through hole on the material carrier plate 101, and a wear-resistant copper sleeve is installed in the through hole; Preferably, an upper baffle is provided and fixed to the top of the abutment rod 107. The baffle has a diameter larger than that of the abutment rod 107, thereby increasing the contact area with the lower surface of the wafer frame 4 and preventing the abutment rod 107 from completely falling off. Preferably, one or more lifting cylinders are provided below the floating ring 108, and the piston rod of the cylinder is connected to the bottom surface of the floating ring 108 to drive its lifting and lowering.

[0032] Based on the above embodiments, the lifting cylinder assembly 5 includes a central top ring 501; The base assembly 6 has a rotatable rotating base 7 inside; A through groove is provided in the center of the rotating base 7, and the through groove is slidably engaged with the center top ring 501; The bottom of the central top ring 501 extends outward to provide an expansion ring 502. The bottom of the rotating base 7 is provided with a stepped ring groove that matches the expansion ring 502. Several guide rods 701 are fixedly connected to the bottom of the stepped ring groove. The guide rods 701 pass through the expansion ring 502 and slide with it.

[0033] Specifically, when the floating ring 108 rises and limits and fixes the wafer frame 4, the wafer frame 4 remains stationary. Then, the central top ring 501 rises, and the outer wall of the central top ring 501 slides upward along the circular groove of the rotating base 7. The expansion ring 502 at its bottom slides upward along the guide rod 701 for guidance. The top of the central top ring 501 passes through the through hole reserved in the center of the carrier plate 101, contacts and lifts the blue film, and performs the film expansion process. After the film expansion is completed, the central top ring 501 stays at the highest position, the drive motor of the rotating base 7 starts, and drives the rotating base 7 to rotate back and forth slightly inside the base assembly 6. The rotating base 7 drives the central top ring 501 to rotate synchronously through the round groove, the guide rod 701 and the expanding ring 502. In this embodiment, the central top ring 501 is set to rise independently while the wafer frame 4 remains stationary, thus avoiding the positional changes caused by the lifting and lowering of the entire carrier plate 101 for film expansion in the prior art, and avoiding the offset of the positioning reference of the wafer frame 4 caused by cumulative errors. Furthermore, after the film expansion is completed, the rotating base 7 drives the central top ring 501 to rotate back and forth in a small amplitude. This rotational force acts on the central top ring 501 and the blue film it contacts, thereby further releasing the adhesion or local stress concentration between the blue film and the central top ring 501, which facilitates subsequent chip picking and avoids blue film shrinkage. Preferably, a graphite bushing is installed inside the circular groove to reduce the friction of the central top ring 501; Preferably, a number of guide rods 701 are provided, evenly distributed along the circumference, and fixed to the bottom surface of the stepped ring groove by screwing, extending vertically downward; and the same number of guide through holes are opened at corresponding positions on the expansion ring 502, and copper sleeves are installed in the holes to improve wear resistance.

[0034] Based on the above embodiments, a lifting ring 503 is fixedly connected to the outer side of the central top ring 501; The lifting ring 503 has four sides with fixed ear plates 504. The bottom of the fixed ear plate 504 is bolted to a nut seat. The nut seat is threaded through and connected to a lead screw 505. The bottom of the lead screw 505 is rotatably connected to the rotating base 7. The lifting ring 503 is located at the bottom of the floating ring 108, and several elastic top parts are provided between the two.

[0035] Specifically, the rotation of the lead screw 505 drives the threaded nut seat and the fixed ear plate 504 to move upward. The fixed ear plate 504 drives the lifting ring 503 and the center top ring 501 to rise as a whole. When the lifting ring 503 rises, its upper surface pushes the floating ring 108 located above it to rise synchronously through several elastic top members. The floating ring 108 drives the integrated plate 106 and the abutment rod 107 to rise. The limit pin 104 first extends from the upper surface of the carrier plate 101 and is aligned with the straight end 403 of the wafer frame body 4. Upon contact, the upper baffle at the top of the abutment rod 107 contacts the lower surface of the wafer frame 4, lifting the wafer frame 4 upward until it is fixed. At this time, the floating ring 108 cannot continue to rise due to the reaction force of the pressure plate 102. The lead screw 505 continues to rotate, the lifting ring 503 continues to rise, the elastic top is compressed, and the gap between the lifting ring 503 and the floating ring 108 decreases until the top of the center top ring 501 passes through the center of the carrier plate 101, contacts and lifts the blue film upward to achieve film expansion. In this embodiment, the lifting ring 503 is driven by the lead screw 505. By utilizing the compression characteristics of the elastic top member, the floating ring 108 is first pushed to fix the wafer frame 4, and then the central top ring 501 continues to rise to expand the film. There is no need to set up an independent cylinder to drive the floating ring 108, which improves the structural compactness, reduces the cost, and simplifies the control logic. Preferably, the lifting ring 503 is configured as an annular plate, which is fitted around the outside of the central top ring 501 and fixedly connected by welding; Preferably, a number of lead screws 505 are equipped with synchronous pulleys at their bottom ends and connected by a ring-shaped synchronous belt. A tensioning pulley can also be provided. All lead screws 505 are driven by the same servo motor through the synchronous belt to ensure synchronous rotation and a compact structure.

[0036] Based on the above embodiments, the elastic top member includes a top rod 8, a locking end piece 801 is fixedly connected to the bottom of the top rod 8, the top rod 8 passes through the lifting ring 503 and slides with it, and a double-sided retaining wheel 802 is rotatably connected to the top of the top rod 8. Several arc-shaped grooves 803 are provided through the floating ring 108, and the double-sided guide wheels 802 are engaged in the arc-shaped grooves 803 and move along them; A spring 9 is sleeved on the outside of the top rod 8, and its two ends are respectively connected to the bottom of the double-sided retaining wheel 802 and the top of the lifting ring 503.

[0037] Specifically, when the lifting ring 503 rises, the spring 9 pushes the double-sided retaining wheel 802 at the top of the push rod 8. The double-sided retaining wheel 802 transmits the thrust to the floating ring 108, which rises first, thereby achieving the limiting and fixing of the wafer frame 4. The lifting ring 503 continues to rise, the spring 9 is compressed, and the lifting ring 503 slides upward relative to the push rod 8, driving the central top ring 501 to continue to rise, thereby expanding the mold. Then, the rotating base 7 rotates back and forth in a small amplitude. The rotating base 7 drives the lifting ring 503 to rotate synchronously through the lead screw 505 and the fixed ear plate 504. The lifting ring 503 drives the push rod 8 and the double-sided retaining wheel 802 to make a circular motion. The double-sided retaining wheel 802 rolls along the arc of the arc groove 803 in the floating ring 108. The floating ring 108 remains stationary and does not follow the rotation. Therefore, the limiting pin 104 and the abutment rod 107 do not rotate, and the wafer frame 4 can remain stationary. In this embodiment, the arc groove 803 is arc-shaped, and its center coincides with the rotation center of the rotating base 7. The double-sided guide wheel 802 rolls in the groove, converting the rotational motion of the lifting ring 503 into the movement of the double-sided guide wheel 802 along the arc groove 803, without transmitting torque to the floating ring 108, thus avoiding interference. Preferably, the top end of the push rod 8 is rotatably connected to a double-sided retaining wheel 802 via a bearing. The double-sided retaining wheel 802 is provided with double-sided retaining edges and a groove is formed in the middle for engaging the edge of the arc-shaped groove 803. Preferably, polytetrafluoroethylene (PTFE) strips are inlaid on both sides of the arc groove 803 of the floating ring 108 to reduce the coefficient of friction and extend the service life.

[0038] Based on the above embodiments, the four corners of the rotating base 7 are set as arc-shaped end faces, and the center of the arc-shaped end face coincides with the center of the central top ring 501. A V-shaped protruding track 702 is fixedly connected to the arc-shaped end face, and a V-groove wheel 703 is rolled on the outer side of the V-shaped protruding track 702; V-grooving wheel 703 is rotatably connected to base assembly 6.

[0039] In this embodiment, the V-shaped raised track 702 and the V-grooved wheel 703 are configured to form a line contact rolling pair, which can withstand radial load and axial load, and achieve high-precision and low-friction rotational motion. Furthermore, a set of V-shaped protruding rails 702 and V-grooved wheels 703 are set at each of the four corners to jointly support the rotating base 7, so that the force is evenly distributed when it rotates, improving stability and making the structure compact. Preferably, the V-groove wheel 703 is made of silicon nitride ceramic roller, thereby reducing the generation of metal particles. Combined with the V-shaped raised track 702 made of bearing steel, it reduces the coefficient of friction and does not generate magnetic adsorption of particles.

[0040] Based on the above embodiments, a support plate 603 is fixedly connected to one side of the base assembly 6, a motor component 604 is fixedly connected to the support plate 603, a lead screw 605 is provided at the driving end of the motor component 604, a nut component is driven on the lead screw 605, a slider seat 606 is fixedly connected to one end of the nut component, and a guide rail slider mechanism is provided at the bottom of the slider seat 606. One end of the slider base 606 extends a lever 607, and one end of the lever 607 has a through-hole groove. A fixed circle block 608 is movably disposed in the through-hole groove and is fixed to one end of the rotating base 7.

[0041] Specifically, the motor 604 drives the lead screw 605 to rotate, which in turn drives the nut and the slider seat 606 to move horizontally back and forth under the guidance of the guide rail slider mechanism. Through the long hole groove on the lever 607, the movement of the fixed circle block 608 is restricted and driven, so that the rotating base 7 rotates back and forth slightly, and the fixed circle block 608 adapts to the movement within the long hole groove. In this embodiment, the motor 604, in conjunction with the lead screw 605, drives the slider seat 606 to perform linear reciprocating motion. The linear motion is converted into the reciprocating rotation of the rotating base 7 through the elongated slot of the lever 607, giving it self-locking properties. This allows the rotating base 7 to be stably maintained in its position after rotation without the need for additional braking. The control is simple and highly accurate. Preferably, the fixed round block 608 is provided with a cylindrical metal block, one end of which is fixed to the side of the rotating base 7 near the dial block 607 by a thread, and is inserted into the elongated slot of the dial block 607, and can slide in the slot. Furthermore, a wear-resistant sleeve can be added to the head of the fixed round block 608 to further reduce friction.

[0042] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection, the internal communication between two components, or the interaction between two components. Those skilled in the art can understand the meaning of the above terms in this application according to the specific circumstances.

[0043] The above provides a detailed description of the automatic film expansion and bonding assembly for semiconductor packaging provided in the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the technical solutions and core ideas of this application. Those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. An automated film expansion and mounting assembly for semiconductor packaging, characterized in that, It includes a wafer frame, a film expansion assembly, a basket assembly, and a clamping and feeding assembly; The film expansion assembly includes a lifting cylinder group, a material carrier plate, and a pair of pressure plates; A pair of pressure plates are symmetrically fixed to the top of the material carrier plate, forming a feeding cavity with a fixed position between them; The clamping and feeding assembly is used to horizontally pull the wafer frame body out of the basket assembly and horizontally feed it into the feeding cavity. The loading chamber is equipped with a pair of loading stop pins and a retractable limiting pin for horizontally limiting the wafer frame. The bottom of the loading chamber is provided with several retractable abutment ends, the top of which corresponds to the wafer frame body; The stop pin passes through and is fixedly connected to the material carrier plate; The limiting pins penetrate the material carrier plate and slide with it, and an integrated plate is fixedly connected to the bottom of a pair of limiting pins; The abutting end includes an abutting rod and an upper baffle; The abutment rod passes through the material carrier plate, and a floating ring is fixedly connected to the bottom end of the rod. The integrated plate is fixed on the floating ring. The lifting cylinder assembly passes through the floating ring and is fitted with it with a clearance; The height of the upper end face of the limiting pin is higher than the height of the upper end face of the upper baffle.

2. The automated film expansion and bonding assembly for semiconductor packaging according to claim 1, characterized in that, A base assembly is provided at the bottom of the film expansion assembly; A mating plate is provided on one side of the base assembly; The docking cross plate is adapted to the height of the carrier plate; One end of the docking plate extends to provide an overlapping portion, and one end of the material carrier plate overlaps and is fixed on the overlapping portion; The base assembly is provided with a pair of corner support frames on the side away from the docking cross plate, and the corner support frames support and fix the other end of the material plate.

3. The automated film expansion and bonding assembly for semiconductor packaging according to claim 2, characterized in that, The docking plate is disposed between the basket assembly and the feeding chamber; The top two ends of the docking cross plate are provided with roller edge blocks for guiding the wafer frame body; The transmission height of the roller sidewall assembly is set flush with the feeding chamber.

4. The automated film expansion and bonding assembly for semiconductor packaging according to claim 1, characterized in that, One end of the wafer frame is provided with a clamping end for clamping and feeding components; The clamping end has corner openings on both adjacent sides that are adapted to the stop pin; The wafer frame body has a straight end that matches the limiting pin at one end away from the clamping end.

5. The automated film expansion and bonding assembly for semiconductor packaging according to claim 2, characterized in that, The lifting cylinder assembly includes a central top ring; The base assembly has a rotatable rotating base inside; The rotating base has a through groove in the center, and the through groove slides with the central top ring; An expansion ring extends outward from the bottom of the central top ring. A stepped ring groove adapted to the expansion ring is opened at the bottom of the rotating base. Several guide rods are fixedly connected to the bottom of the stepped ring groove. The guide rods pass through the expansion ring and slide with it.

6. The automated film expansion and bonding assembly for semiconductor packaging according to claim 5, characterized in that, A lifting ring is fixedly connected to the outer side of the central top ring; The lifting ring has fixed ear plates extending from its four sides. The bottom of the fixed ear plates is bolted to a nut seat. The nut seat is threaded through and connected to a lead screw. The bottom of the lead screw is rotatably connected to the rotating base. The lifting ring is located at the bottom of the floating ring, and several elastic top members are provided between the two.

7. The automated film expansion and bonding assembly for semiconductor packaging according to claim 6, characterized in that, The elastic top member includes a top rod, the bottom of which is fixedly connected to a locking end piece, the top rod passes through the lifting ring and slides with it, and the top of the top rod is rotatably connected to a double-sided retaining wheel; The floating ring has several arc-shaped grooves through it, and the double-sided guide wheels are engaged in the arc-shaped grooves and move along them; A spring is sleeved on the outer side of the top rod, and its two ends are respectively connected to the bottom of the double-sided retaining wheel and the top of the lifting ring.

8. The automated film expansion and bonding assembly for semiconductor packaging according to claim 5, characterized in that, The four corners of the rotating base are set as arc-shaped end faces, and the center of the arc-shaped end face coincides with the center of the central top ring. A V-shaped protruding track is fixedly connected to the arc-shaped end face, and a V-groove wheel is rolled on the outer side of the V-shaped protruding track; The V-grooved wheel is rotatably connected to the base assembly.

9. The automated film expansion and bonding assembly for semiconductor packaging according to claim 7, characterized in that, A support plate is fixedly connected to one side of the base assembly, a motor component is fixedly connected to the support plate, a lead screw is provided at the driving end of the motor component, a nut component is driven on the lead screw, a slider seat is fixedly connected to one end of the nut component, and a linear guide mechanism is provided at the bottom of the slider seat. One end of the slider seat extends into a lever block, and one end of the lever block has a through-hole groove. A fixed circle block is movably disposed in the through-hole groove, and the fixed circle block is fixed to one end of the rotating base.

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