Monolithic multi-optical scanner head

Abstract

An apparatus and system for optimizing the packaging of a scanner head is disclosed. The apparatus according to aspects of the disclosure includes a unitary multi-optical scanner interface housing configured to receive multiple sets of galvanometer mirrors scanners (galvos) and a beam entrance window. Each set of galvanometer mirrors receives a laser and redirects the laser using mirrors.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to U.S. Provisional Application No. 63 / 578,963, filed August 25, 2023, entitled “MONOLITHIC MULTI-OPTICS SCANNERHEAD,” which has been assigned to the assignee of this application, the entire contents of which are incorporated herein by reference as if fully set forth herein.

[0003] background Technical Field

[0004] This disclosure generally relates to additive manufacturing, and more specifically, to improving printing productivity by overlapping individual scanner heads. Background Technology

[0005] 3D printing (also known as additive manufacturing, AM) has recently offered new opportunities to more efficiently construct complex transportation structures such as cars, airplanes, ships, motorcycles, buses, and trains. AM technology is capable of manufacturing complex parts using a wide variety of materials. Applying AM processes to industries that produce these products has proven to produce structurally more efficient transportation structures. For example, cars produced using 3D-printed parts can be stronger, lighter, and thus more fuel-efficient. Furthermore, AM enables manufacturers to 3D print parts that are far more complex and equipped with more advanced functions and performance than parts manufactured via traditional machining and casting techniques. 3D objects can be formed using multiple layers of materials based on the object's digital model data. A 3D printer can form a structure defined by the digital model data by printing the structure one layer at a time.

[0006] In 3D printing, a scanner can control or steer a laser beam within a beam chamber. However, this design has several limitations. First, to maintain an inert environment within the build chamber and protect the laser from flying particles, there should be windows or glass (e.g., beam entrance windows) to enclose the area of ​​each pre-existing individual scanner housing containing its optics. However, windows or glass can vary in quality. For example, one side of a window or glass might be slightly thicker than the other. Furthermore, windows or glass may need to be replaced after a certain period due to deterioration and scratches. As another example, soot can accumulate on the top or bottom of the glass, and if not properly cleaned, the coating on the glass can be damaged. If these windows or glass need to be replaced, the entire system requires a complete optical calibration cycle because the new windows behave differently from the old ones. Summary of the Invention

[0007] The following section will describe more comprehensively several aspects of the apparatus and methods for packaging optimization systems, with reference to 3D printing technology.

[0008] An apparatus according to one aspect of this disclosure includes an integral multi-optical scanner head housing configured to receive multiple sets of galvos and a beam entrance window. Each set of galvos receives a laser and redirects the laser using a mirror.

[0009] This device may optionally include an integral multi-optical scanner head housing, which also includes a conformal channel having channels configured for thermal management of multiple sets of galvanometer reflector scanners.

[0010] This device may optionally include each set of galvanometer reflector scanners, as well as a set of integrally printed heat sink fins, heat sink structures, or heat exchangers for line thermal management of multiple sets of galvanometer reflector scanners.

[0011] This device may optionally include an integrated multi-optical scanner head housing, as well as a single air channel for thermal management of multiple sets of galvanometer reflector scanners.

[0012] This device may optionally include an integral multi-optical scanner head housing, and also include a single supply nozzle connected to each of the multiple sets of galvanometer reflector scanners to receive gas.

[0013] This device may optionally include an integrated multi-optical scanner head housing, as well as a single data inlet or power inlet connected to each of the multiple sets of galvanometer reflector scanners.

[0014] This device may optionally include an integral multi-optical scanner head housing, and also include at least two beam entrance windows for multiple lasers.

[0015] This device may optionally include an integrated multi-optical scanner head housing and is also configured to receive a camera for process monitoring.

[0016] This device may optionally include an integrated multi-optical scanner head housing, and is also configured to receive sensors.

[0017] Such a device may optionally include an integral multi-optical scanner head housing, a set of mounting holes configured to mount each set of galvanometer reflector scanners, cameras or sensors, and a corresponding single hole for receiving a laser beam.

[0018] Such a device may optionally include an integral multi-optical scanner head housing, and also include a hexagonal shape such that each side of the hexagonal shape includes a set of mounting holes configured to receive at least one set of galvanometer reflector scanners, cameras or sensors.

[0019] This device may optionally include an integral multi-optical scanner head housing, which is additively manufactured.

[0020] A system according to one aspect of this disclosure includes an integrated multi-optical scanner head housing configured to receive a single galvanometer reflector scanner (galvo) configured to receive a laser and redirect the laser using a reflector. The integrated multi-optical scanner head housing includes a conformal channel having channels configured for thermal management of the single galvanometer reflector scanner.

[0021] It should be understood that the packaging optimizations and other aspects of the sub-components will become apparent to those skilled in the art from the following detailed description, in which only a few embodiments are shown and described by way of illustration. For example, one benefit of the various embodiments is that the process of changing windows or glass may be more streamlined or easier when multiple scanners are combined as closely as possible into a single head. Thus, the benefit of packaging multiple scanners into a single package is that you only need to use one or two windows for the entire package of the combined scanners, rather than dealing with windows for each individual scanner head. As those skilled in the art will recognize, the exemplary embodiments described herein are capable of having other and different embodiments, and several details thereof are capable of being modified in various other ways, all without departing from the invention. Therefore, the drawings and detailed description should be considered illustrative in nature and not restrictive. Attached Figure Description

[0022] Various aspects of the apparatus and methods for packaging optimization will now be presented in detail, by way of example rather than limitation, with the accompanying drawings, wherein:

[0023] Figures 1A-1E Various side views of a 3-D printer system according to aspects of this disclosure are shown.

[0024] Figure 2 A schematic diagram of the configuration of a single multi-head individual scanner is shown.

[0025] Figure 3 A comparison is shown between a single scanner with multi-field overlap and a scanner integrated therein, according to aspects of this disclosure, with the former having multi-field overlap in its encapsulation optimization.

[0026] Figure 4Different views of a configuration including five sets of galvanometer reflector scanners according to aspects of this disclosure are shown.

[0027] Figure 5 A view showing the mounting holes and the configuration through which the laser beam passes, according to aspects of this disclosure, is provided.

[0028] Figure 6 A view showing the configuration of integrally printed heat sink fins and heat exchanger according to aspects of this disclosure is provided.

[0029] Figure 7 A view showing the configuration of the thermal cooling channels and inlet / outlet according to aspects of this disclosure is shown. Detailed Implementation

[0030] The detailed description given below, in conjunction with the accompanying drawings, is intended to provide an exemplary description of joinable additive manufacturing structures (or structures) and sub-components, and is not intended to represent the only embodiments that can be practiced with respect to this disclosure. The term “exemplary” as used throughout this disclosure means “serving as an example, instance, or illustration” and should not be necessarily construed as superior to or more advantageous than other embodiments set forth in this disclosure. The detailed description includes specific details and is intended to provide a thorough and complete disclosure that fully communicates the scope of this disclosure to those skilled in the art. However, this disclosure can be practiced without these specific details. In some cases, well-known structures and components may be shown in block diagram form or omitted entirely to avoid obscuring the various aspects presented throughout this disclosure.

[0031] Additive manufacturing

[0032] Additive manufacturing (AM) involves accumulating layers of material on a build plate using a stored geometric model to produce three-dimensional (3-D) components with features defined by the model. AM technology is capable of printing complex parts using a wide variety of materials. 3-D objects can be manufactured based on computer-aided design (CAD) models. CAD models can be used to generate a set of instructions or commands compatible with a specific 3-D printer. The AM process can create solid 3D objects using CAD models and printing instructions. During the AM process, different materials or combinations of materials (such as engineering plastics, thermoplastic elastomers, metals, ceramics and / or alloys, or combinations thereof) can be used to create uniquely shaped 3D objects.

[0033] Components and terminology in AM

[0034] In this disclosure, the component is an example of an AM component. The component can be any 3D-printed component including features (such as interfaces) for mating with another component. The component can have internal or external features configured to accept a particular type of component. Alternatively or additionally, the component can be shaped to accept a particular type of component. Without departing from the scope of this disclosure, the component can utilize any internal design or shape and accept any kind of component.

[0035] Component interfaces can be configured to connect to another component. For example, but not limited to, interfaces between components can be tenon and groove structures. The interface can have high-precision features or complex geometry, allowing it to perform specific functions, including creating connections across structures such as pipes, structural panels, extrusions, sheet metal, and / or other structural members.

[0036] For clarity, parts may also include relatively simple connection features configured to connect with a finer network of connection features at the interface to form streamlined connections between structures. While these parts may contain more basic features, they can advantageously be 3D printed at higher printing rates. Alternatively, suitable non-3D printing manufacturing techniques can be used to construct the parts.

[0037] Many different AM technologies may be well-suited for constructing parts in transport structures or other mechanized components. Such 3D printing technologies can include, for example, directed energy deposition (DED), selective laser melting (SLM), selective laser sintering (SLS), direct metal laser sintering (DMLS), electron beam melting (EBM), powder bed fusion (PBF), and / or other AM processes involving the melting or fusion of metal powders.

[0038] Like many 3D printing technologies, these processes (such as PBF systems) create building blocks layer by layer. Each layer, or “slice,” is formed by depositing a layer of powder and exposing some portions of the powder to an energy beam. The energy beam is applied to the molten region of the powder layer, which coincides with the cross-section of the building block within the layer. The molten powder cools and melts to form a slice of the building block. This process can be repeated to form the next slice of the building block, and so on. Each layer is deposited on top of the previous one. The resulting structure is a building block assembled piece by piece, starting from the ground. SLS and various other PBF technologies may be well-suited for the construction of gearboxes and other transportation structural components. However, it should be understood that other AM technologies, such as fused deposition modeling (FDM), can also be used for such applications.

[0039] Tongue-and-groove (TNG) structures can be used to connect two or more components at an interface. For example, the tongue portion of a component can act as a single protrusion surrounding a peripheral area, extending all the way around that area. The tongue portion of a component can project outwards relative to the peripheral area of ​​the component, and in this sense, the lateral extension of the tongue portion can be considered as "extending" from the component.

[0040] The recessed portion of the interface is part of the second component and can be provided along the peripheral area of ​​the second component. The recessed portion may, but does not necessarily, include the material of the second component. The recessed portion may extend all the way around the peripheral area and may be a single channel in the second component. The recessed portion may also be inserted inward along the peripheral area relative to the second component and oriented laterally around the second component. The tenon and the recess can be arranged on the first and second components such that when the two components are placed in contact, the tenon can be aligned with the recess and can be fitted into the recess around the peripheral area at the interface between the two components.

[0041] AM can include the fabrication of one or more nodes. A node is a structural member that may include one or more interfaces for connecting to other nodes or spanning components such as pipes, extrusions, panels, etc. Using AM, nodes can be constructed to include additional features and functions, including interface functionality, depending on the objectives. As described herein, the terms node and structure are used interchangeably.

[0042] As mentioned above, nodes and other components can be connected together. For example, one or more nodes and / or other components can be connected together to form a larger component. Therefore, individual AM structures often need to be connected together, or individual AM structures often need to be connected to machined or COTS parts to provide combined structures, such as to realize the aforementioned modular networks or to form complex internal components in a vehicle. Examples include structure-to-structure connections, structure-to-panel connections, structure-to-pipe connections, and structure-extrusion connections, etc. For example, mechanical connectors (such as screws, clamps, etc.) can be used to connect AM joint components to body panels. Alternatively or additionally, adhesives can be used to form a strong bond. To connect these parts, tight tolerances are usually required, meaning that the parts must be positioned to fit precisely in a given orientation. For example, it may be necessary to position the two parts to be adhered to avoid direct contact with each other, thereby mitigating potential galvanic corrosion problems. Generally, the adhesive bond between the AM joint component and the panel should achieve an accurate fit. Therefore, for example, the AM joint component should not be misaligned or offset from the body panel, and the parts should maintain the correct orientation when establishing a permanent bond.

[0043] This disclosure aims to improve printing productivity by integrating multiple optical scanner heads into a single package. Specifically, package optimization allows for more flexible and compact placement of components to maximize overlapping laser fields. Furthermore, package optimization enables the inclusion of more scanner heads within a given build board size. In addition, to optimize size, this disclosure also improves thermal management, maintainability, and the opportunity to integrate photodiodes, power monitoring, and other components to increase additional process monitoring while minimizing the impact on beam quality.

[0044] Additive Manufacturing Environment

[0045] Figures 1A-1D Various side views of a 3-D printer system according to aspects of this disclosure are shown.

[0046] In this disclosure, the 3D printer system may be a powder-bed fusion (PBF) system 100. Figures 1A-1D The PBF system 100 is shown during different operational phases. Figures 1A-1D The specific embodiment shown is one of many suitable examples of PBF systems employing the principles of this disclosure. It should also be noted that... Figures 1A-1DElements in other figures of this disclosure are not necessarily drawn to scale and may be drawn larger or smaller for the purpose of better illustrating the concepts described herein. The PBF system 100 may include a depositor 101 capable of depositing each layer of metal powder, an energy beam source 103 capable of generating an energy beam, a scanner 105 capable of applying the energy beam to melt the powder material, a beam entrance window 129 protecting optical elements from the component chamber environment, and a build plate 107 capable of supporting one or more components, such as component 109. Although the terms “fuse” and / or “fusing” are used to describe the mechanical coupling of powder particles, other mechanical actions (e.g., sintering, melting, and / or other electrical, mechanical, electromechanical, electrochemical, and / or chemical coupling methods) are also considered to be within the scope of this disclosure.

[0047] The PBF system 100 may also include a build floor 111 positioned within a powder bed container. The walls 112 of the powder bed container typically define the boundaries of the container, and the build floor 111 is sandwiched between the walls 112 and abuts against a portion of the underlying build floor 111. The build floor 111 may be gradually lowered, allowing the depositor 101 to deposit the next layer. The entire assembly may reside within a chamber 113 that can enclose other components, thereby protecting the equipment, enabling atmospheric and temperature regulation, and mitigating the risk of contamination. The depositor 101 may include a hopper 115 containing powder 117 (such as metal powder) and a leveler 119 capable of leveling the top of each layer of deposited powder.

[0048] Specific reference Figure 1A The figure shows the PBF system 100 after the slice of component 109 has been melted, but before the next layer of powder has been deposited. In fact, Figure 1A The diagram shows the current state (e.g., formed by 200 individual slices) of the PBF system 100 after it has deposited and melted slices in multiple layers (e.g., 200 individual layers) to form the current state of the building block 109. The multiple individual layers that have been deposited have created a powder bed 121, which includes deposited but unmelted powder.

[0049] Figure 1B The diagram shows a PBF system 100 in a stage where the build floor 111 can reduce the powder layer thickness 123. The reduction of the build floor 111 causes the builders 109 and powder bed 121 to decrease in powder layer thickness 123, such that the tops of the builders 109 and powder bed 121 are lower than the tops of the powder bed container wall 112 by an amount equal to the powder layer thickness 123. Thus, for example, a space with a uniform thickness equal to the powder layer thickness 123 can be created above the tops of the builders 109 and powder bed 121.

[0050] Figure 1CA PBF system 100 in the following stage is shown, wherein a depositor 101 is positioned to deposit powder 117 in a space created above the top surface of a component 109 and a powder bed 121, the space being defined by a powder bed container wall 112. In this example, the depositor 101 moves gradually above the defined space while releasing powder 117 from a hopper 115. A leveler 119 can level the released powder to form a powder layer 125, leaving a top surface 126 configured to receive molten energy from an energy beam source 103. The thickness of the powder layer 125 is substantially equal to the powder layer thickness 123 (see [link to image]). Figure 1B Therefore, the powder in the PBF system can be supported by a powder material support structure, which may include, for example, a building plate 107, a building floor 111, a building element 109, a wall 112, etc. It should be noted that the thickness of the powder layer 125 shown (i.e., the powder layer thickness 123) is... Figure 1B Greater than the references mentioned above Figure 1A The actual thickness used in the 200 previously deposited individual layers discussed.

[0051] Figure 1D The PBF system 100 is shown in the following stage, wherein a powder layer 125 is deposited. Figure 1C Following this, energy beam source 103 generates energy beam 127, and scanner 105 applies the energy beam to melt the next slice in the building block 109. In various exemplary embodiments, energy beam source 103 may be an electron beam source, in which case energy beam 127 constitutes an electron beam. Scanner 105 may include deflection plates that can generate an electric or magnetic field that selectively deflects the electron beam such that the electron beam scans over a designated area to be melted. In various embodiments, energy beam source 103 may be a laser, in which case energy beam 127 is a laser beam. Scanner 105 may include an optical system that uses reflection and / or refraction to manipulate the laser beam to scan the selected area to be melted. Scanner 105 may include, for example, any of the various embodiments of the integral multi-optical scanner head housing described herein.

[0052] In various embodiments, scanner 105 may include one or more galvanometer reflector scanners that can rotate to translate the energy beam, thereby positioning the energy beam through beam incident window 129. In various embodiments, energy beam source 103 and / or scanner 105 may modulate the energy beam, for example, by turning the energy beam on and off during scanner scanning, such that the energy beam is applied only to appropriate areas of the powder layer via beam incident window 129. For example, in various embodiments, the energy beam may be modulated by a digital signal processor (DSP).

[0053] In various embodiments, the beam incident window 129 is a window (e.g., glass) between the scanner 105 and the chamber 113. In other words, the beam incident window 129 is the window through which the energy beam 127 passes through the chamber 113. The beam incident window 129 is configured to protect the optical elements from the environment of the chamber 113, including fumes, splashes, and vapors caused by laser-molten powder.

[0054] In various embodiments, when the beam entrance window 129 becomes dirty (e.g., from dust collected thereon), the dirt can affect the quality of the laser beam (e.g., energy beam 127). This reduction in beam quality can be attributed to the dirt absorbing laser beam energy and causing the beam entrance window 129 to heat up. This results in thermal deformation of the beam entrance window 129, which affects the laser beam as it travels through the deformed beam entrance window 129. Therefore, the beam entrance window is typically cleaned between builds and can become scratched or otherwise damaged, requiring periodic replacement. This periodic replacement of the beam entrance window can result in significant downtime for the PBF printer.

[0055] In particular, when the beam entrance window 129 is replaced, the scanner typically needs to be recalibrated because even a very small difference between one beam entrance window 129 and another can affect the entire system. The recalibration process can be time-consuming, and the PBF printer cannot print during recalibration. This downtime can be a significant cause of printer inefficiency. The advantage of this disclosure is that the beam entrance window 129 can be included with the scanner in a rigid and monolithic housing, and therefore the entire package can be calibrated offline, eliminating the need for recalibration after installation in the printer. Therefore, when the beam entrance window 129 on the printer is scratched, damaged, or otherwise needs to be replaced, the entire monolithic multi-optical scanner head housing, including the scanner head and beam entrance window, can be replaced, and a new monolithic multi-optical scanner head, including the calibrated scanner head and beam entrance window, can be easily installed. This way, the new monolithic multi-optical scanner head does not need to be recalibrated after installation in the printer, and printer downtime is reduced. The replaced monolithic multi-optical scanner head housing can be repaired, for example, by replacing the beam entrance window and recalibrating offline, and is ready to be replaced when needed without additional recalibration.

[0056] Figure 1E A functional block diagram of a 3-D printer system according to aspects of this disclosure is shown.

[0057] In this disclosure, control devices and / or components, including computer software, may be coupled to PBF system 100 to control one or more components within PBF system 100. Such devices may be computer 150, which may include one or more components that can assist in controlling PBF system 100. Computer 150 may communicate with PBF system 100 and / or other AM systems via one or more interfaces 151. Computer 150 and / or interface 151 are examples of devices that can be configured to implement the various methods described herein that can assist in controlling PBF system 100 and / or other AM systems.

[0058] In this disclosure, computer 150 may include at least one processor unit 152, memory 154, signal detector 156, digital signal processor (DSP) 158, and one or more user interfaces 160. Computer 150 may include additional components without departing from the scope of this disclosure.

[0059] Computer 150 may include at least one processor unit 152, which may assist in the control and / or operation of PBF system 100. Processor unit 152 may also be referred to as a central processing unit (CPU). Memory 154 (which may include read-only memory (ROM) and random access memory (RAM)) may provide instructions and / or data to the processor. A portion of memory 154 may also include non-volatile random access memory (NVRAM). Processor 152 typically performs logical and arithmetic operations based on program instructions stored in memory 154. Instructions in memory 154 may be executable (e.g., executed by processor unit 152) to implement the methods described herein.

[0060] Processor unit 152 may include or be a component of a processing system implemented with one or more processors. The one or more processors may be implemented with any combination of a general-purpose microprocessor, microcontroller, digital signal processor (DSP), floating-point gate array (FPGA), programmable logic device (PLD), controller, state machine, gated logic, discrete hardware components, special-purpose hardware finite state machine, or any other suitable entity capable of performing computation or other operations on information.

[0061] Processor unit 152 may also include a machine-readable medium for storing software. Software should be interpreted broadly as any type of instruction, whether referred to as software, firmware, middleware, microcode, hardware description language, or others. Instructions may include code (e.g., source code format, binary code format, executable code format, RS-274 instructions (G-code), numerical control (NC) programming languages, and / or any other suitable code format). When executed by one or more processors, the instructions cause the processing system to perform the various functions described herein.

[0062] Computer 150 may also include a signal detector 156, which can be used to detect and quantify signals of any level received by computer 150 for use by processing unit 152 and / or other components of computer 150. Signal detector 156 can detect signals such as the power of energy beam source 103, the position of scanner 105, the height of build-up floor 111, the amount of powder 117 remaining in depositor 101, the position of leveler 119, and other signals. In addition to or in place of processor unit 152, signal detector 156 can also control other components as described with respect to this disclosure. Computer 150 may also include a DSP 158 for processing signals received by computer 150. DSP 158 can be configured to generate instructions and / or instruction packets for transmission to PBF system 100.

[0063] In some aspects, computer 150 may also include user interface 160. User interface 160 may include a keyboard, pointing device, and / or display. User interface 160 may include any elements or components that convey information to and / or receive input from the user of computer 150.

[0064] Various components of computer 150 can be coupled together via bus system 151. Bus system 151 may include, for example, a data bus, as well as power buses, control signal buses, and status signal buses in addition to the data bus. Components of computer 150 may be coupled together or use some other mechanism to accept or provide input to each other.

[0065] although Figure 1E The diagram shows multiple separate components, but one or more of these components can be combined or implemented together. For example, processor unit 152 can be used not only to implement the functions described above with respect to processor unit 152, but also to implement the functions described above with respect to signal detector 156, DSP 158, and / or user interface 160. Furthermore, Figure 1E Each of the components shown can be implemented using multiple separate elements.

[0066] By way of example, one or more processors may be used to implement an element, any part of an element, or any combination of elements. Examples of processors include microprocessors, microcontrollers, graphics processing units (GPUs), central processing units (CPUs), application processors, digital signal processors (DSPs), reduced instruction set computing (RISC) processors, system-on-a-chip (SoCs), baseband processors, field-programmable gate arrays (FPGAs), programmable logic devices (PLDs), state machines, gated logic, discrete hardware circuitry, and other suitable hardware configured to perform the various functions described throughout this disclosure. One or more processors may execute software, as the term is stated above.

[0067] In one or more aspects, the described functions can be implemented using hardware, software, firmware, or any combination thereof. If implemented in software, these functions can be stored or transmitted as one or more instructions or code on a computer-readable medium. Computer-readable media includes both computer storage media and communication media, including any medium that facilitates the transfer of a computer program from one place to another. Storage media can be any available medium that is accessible to a computer. By way of example and not limitation, such computer-readable media can include RAM, ROM, EEPROM, optical disc (CD) ROM (CD-ROM) or other optical disc storage, disk storage or other magnetic storage devices, or any other medium that can be used to carry or store the required program code in the form of instructions or data structures and is accessible to a computer. Disks and optical discs as used herein include CDs, laser discs, optical discs, digital versatile optical discs (DVDs), floppy disks, and Blu-ray discs, where disks typically reproduce data magnetically, while optical discs reproduce data optically using lasers. Therefore, computer-readable media includes non-transitory computer-readable media (e.g., tangible media).

[0068] Overall, this disclosure describes a system that provides benefits including at least thermal management, maintainability, process monitoring, and system cost.

[0069] There are three main sources of heat generation that affect the overall beam quality. First, heat is generated due to the mechanical movement of the galvanometer mirror scanner and other moving objects used to move the lens to specific zoom and focus points. Second, the lens, mirror, and other optical objects are exposed to high laser power and prolonged exposure (e.g., thermal lensing effect). Third, heat is generated and reflected from the chamber via conduction, forced convection, and radiation, returning from the chamber to the integral multi-optical scanner head housing.

[0070] Mitigating this heat generation through a monolithic multi-optical scanner head housing (e.g., a 3D-printed monolithic housing) will become an increasingly popular system feature, as handling +1 kW of power becomes challenging for thermal management. This monolithic embodiment can also be additively manufactured with integrated channels and conformal cooling. The monolithic head can have integrated channels where a single supply nozzle connects to each of multiple sets of galvanometer reflector scanners to receive gas, air, and / or water and carry it to specific areas of the head to cool heat-affected portions. Gas can also be injected at a specific angle into optics (such as reflectors and lenses) using a single supply nozzle with a specific nozzle shape.

[0071] Furthermore, the coolant channels can address the heat generated from the galvanometer reflector scanner and the heat reflected back from the scanner. Actively managing the scanner's thermal aspects while using multimode laser power supports consistently high laser utilization. Alternative solutions may include more expensive substrates and / or coatings.

[0072] Secondly, the integrated multi-optical scanner head housing enables novel maintenance strategies to achieve greater machine availability and uptime, a primary goal of best-in-class factories. As described above, this disclosure describes a method for pre-calibrating each optical stage and maintaining hot-swappable backups that can be quickly replaced. Fine-tuning of individual printer mounts can be minimal and can be accomplished automatically with built-in, developed fiber alignment and multi-field calibration software. Assuming these replacements can be performed quickly, more frequent optical calibrations and better off-site cleaning can be performed in parallel without requiring several days of machine downtime planned each quarter.

[0073] In some examples, an integrated multi-optical scanner head housing can have a single data and a single power inlet, and the number of process channels is reduced by a factor of the number of optical tracks. Furthermore, the simplified printer structure offers direct benefits during initial manufacturing and carries over to the average time between unplanned service events.

[0074] Third, this disclosure provides a method for integrating photodiodes, cameras, power monitoring, and other components to minimize the impact on beam quality. Many scanner manufacturers have separate modules for separating visible and thermal wavelengths, allowing users to add photodiodes and / or pyrometers. However, adding support for new features is a lengthy process, not one that can be quickly added and iterated upon. Adding sensors directly to a monolithic housing allows shared sensors for optical health, calibration, and process monitoring. Integrating multiple optics into a single monolithic housing allows for greater overlap of laser regions in multi-laser systems, which can improve system printing efficiency because more lasers can be focused on any given area of ​​the powder bed. See below for reference. Figure 2 and Figure 3 A more detailed description of the laser region overlap.

[0075] Finally, this disclosure improves the printer's integration through streamlined connections via utilities supplied to the printer (e.g., filtered compressed air coolant) and fiber optic cables from the laser module. Initially and over time, the integrated, printed housing should advantageously replace the inefficient, machined, separate housing.

[0076] Integrated multi-optical scanner head

[0077] Improving productivity while maintaining material quality is a key criterion for tilting the economic curve toward solutions that are more competitive than conventional manufacturing. However, this requires both software and hardware development. For example, software is needed to assign optical solutions to individual pixels based on factors such as maximizing laser uptime and managing the thermal effects on both components and optics used with multiple lasers to generate each layer of parts in a multi-layer process to minimize anisotropy. For hardware, maximum productivity is required, including but not limited to encapsulating multiple optical paths with the maximum number of optics, maximizing scanner overlap by reducing point-to-point connections for each individual optic, increasing laser power through proper thermal management, and managing beam size and shape to generate stable, repeatable, and producible molten pools while maintaining beam quality.

[0078] Packaging optimization allows for more flexible and compact placement of components to maximize the overlapping laser field. It also enables the packaging of more optical components (or scanner heads) to address the challenges of building boards of a given size.

[0079] Figure 2 A schematic diagram of the configuration of individual multi-head scanner heads packaged as a cluster is shown. Figure 2 Example 200a shows that the first scanner head 201a, the second scanner head 203a, the third scanner head 205a, the fourth scanner head 207a, the fifth scanner head 209a, the sixth scanner head 211a, the seventh scanner head 213a and the eighth scanner head 215a are tightly packed into a cluster to improve printing productivity with maximized individual scanner overlap.

[0080] In the context of PBF laser beam assemblies, a scanner head is an optical component that guides, focuses, and controls a laser beam to accurately melt powder material during additive manufacturing. Specifically, a scanner head is an optical component that guides a laser beam through a beam entrance window onto a powder bed to selectively melt and fuse material layer by layer, thereby creating 3D objects. Key functions of the scanner head include at least beam steering and focusing. The scanner head may contain a set of galvanometer-mirror scanners that can quickly and precisely adjust the angle of the laser beam. This steering capability allows the laser to be guided to specific locations on the powder bed where the material needs to be melted. Furthermore, the scanner head includes optical lenses that focus the laser beam onto a small, precise spot size on the powder bed. The quality of the focus contributes to achieving the energy density necessary for accurately melting powder material.

[0081] like Figure 2 As shown in Examples 200a and 200b, Figure 2The diagram shows a configuration with a working distance (WD) of 511 mm, as an example of a 2x4 array of scanner heads 201a, 203a, 205a, 207a, 209a, 211a, 213a, and 215a nested tightly together in a cluster. In systems such as example 200b, when scanner heads 201a, 203a, 205a, 207a, 209a, 211a, 213a, and 215a are clustered together due to space constraints, the working distance is a parameter that ensures each head functions optimally without interference and maintains proper focus on the target surface or object. The working distance refers to the distance between a scanner head (e.g., specifically the lens or front of an optical component) and the object or surface on which it is focused. Generally, a shorter working distance decreases the depth of field, while a shorter working distance increases the depth of field. Therefore, the working distance helps ensure that each scanner head in the cluster is accurately focused on the target surface. For example, if the working distance is too short or too long, the image or data captured by the scanner head will be blurry or out of focus.

[0082] For example, for a configuration of a 2x4 array of individual scanner heads, the optimized package can increase the number of scanner heads per identical footprint to 2x5 or 2x6, which improves machine throughput (e.g., an example of 10 or 12 scanner heads in a 420 x 720 mm platform compared to 8 scanner heads in a current 420 x 720 mm platform).

[0083] As mentioned above, the advantage of a separate scanner head cluster with a 2x4 array is that only a single glass is needed for the entire package (e.g., instead of eight separate glasses for each scanner head). This allows for a much more streamlined calibration cycle, as only a single beam incident window (e.g., glass) needs to be maintained, instead of eight separate beam incident windows. As explained above, the beam incident window is the window between the scanner and the build chamber and protects the optics from the harsh environment within the build chamber, including metal vapors and powder particles.

[0084] Figure 2Example 200b shows the corresponding laser area on the powder bed that each scanner head can reach. For example, the laser area 203b from the second scanner head 203a (as depicted by the dashed line) shows overlapping areas that can be reached by lasers from other scanner heads. Specifically, the laser area 203b from the second scanner head 203a can overlap with the following areas: the laser area 201b from the first scanner head 201a (as depicted by the dashed line), the laser area 205b from the third scanner head 205a (as depicted by the solid line), the laser area 207b from the fourth scanner head 207a (as depicted by the dotted line), the laser area 209b from the fifth scanner head 209a (as depicted by the dashed line), the laser area 211b from the sixth scanner head 211a (as depicted by the dashed line), and the laser area 213b from the seventh scanner head 213a (as depicted by the solid line), but does not include the laser area 215b from the eighth scanner head 215a (as depicted by the dotted line). Therefore, it should be noted that there is overlap in the two X-axis directions. This overlap in the two X-axis directions makes calibration less challenging because it reduces the amount of overlap that needs to be addressed.

[0085] It should be noted that although the configuration shown is for illustrative purposes only, this disclosure is applicable to any other configuration, such as 2x1, 2x2 or 2x8 configurations.

[0086] Figure 3 A schematic comparison is shown between a package optimization in which individual scanners 301, 303 have multi-field overlap 305 and a package optimization in which an integrated scanner head 307 (e.g., an integral multi-optical scanner head housing) has multi-field overlap 309. (See diagram for reference.) Figure 3 As shown, compared to the individual scanner head multi-field overlap 305 shown in Example 300a, the point-to-point coverage of the integrated scanner head multi-field overlap 309 shown in Example 300b can be increased proportionally by a linear factor.

[0087] In some examples, the packaging flexibility of individual scanners may also help address the challenge of merging scaling capabilities to maximize beam size.

[0088] After packaging optimization, the main factors for both thermal management and productivity are maximizing the overlap between lasers. This can be achieved in two ways.

[0089] The first approach is to increase the working distance, but at the cost of reduced resolution. Theoretically, 100% overlap can be achieved when the working distance approaches infinity. However, laser powder bed fusion (PBF-L) technology is limited by the shape factors within the cavity, which, due to issues such as gas flow, typically prevent the Z-height from increasing beyond a certain level. Furthermore, increasing the working distance will affect the resolution of the light spot projected onto the build plate.

[0090] The second method is to tightly seal the scanner head together, as shown above. Figure 2 As shown. Ideally, 100% overlap would be achieved if the optics were moved point-to-point to a distance of zero between them. The implications of achieving higher field overlap are complex. Understandably, the ideal configuration with 100% overlap simplifies the laser distribution strategy by randomly selecting optics based on each location reference in the printer build board. However, it is clear that more overlap will allow for the identification of more potential scan field segmentation solutions that better meet overall process objectives and adhere to constraints such as minimizing laser-smoke interactions.

[0091] Unless physical constraints can be eliminated and all galvanometer reflector scanner assemblies are tightly packaged together, these embodiments may not be physically feasible compared to [previous implementations]. Figure 3 Further effects are presented in the configuration shown in Example 300a. A galvanometer reflector scanner is a device used to deflect a laser beam passing through a beam incident window using a reflector to scan the laser beam on a powder bed. In some embodiments, the beam incident window may be a single window for all galvanometer reflector scanners. In some embodiments, each galvanometer reflector scanner may have its own respective beam incident window.

[0092] Specifically, in PBF AM, the galvanometer mirror scanner plays a crucial role in the scanner head, which guides or redirects the laser beam to selectively melt and fused powder particles, thereby building components layer by layer. The galvanometer mirror scanner can serve various functions within the scanner head, such as beam steering, high-speed scanning, precision and accuracy, dynamic focus adjustment, or complex path generation.

[0093] First, galvanometer reflector scanners can be used to direct laser beams across a powder bed with high precision and speed via a beam entrance window. For example, a galvanometer reflector scanner head typically consists of two galvanometer reflector scanners, each controlling a reflector. One scanner controls X-axis movement, and the other controls Y-axis movement. By adjusting the angle of the reflectors, the laser beam can be guided to any point on the powder bed via the beam entrance window, allowing for precise control over the location where the laser melts the powder.

[0094] Secondly, the galvanometer reflector scanner can move the reflector very quickly, allowing the laser beam to scan the powder bed rapidly. This high-speed operation is desirable for efficient layer-by-layer construction. The faster scanning speed also translates to shorter build-up time, thereby improving the overall productivity of the PBF process.

[0095] Third, the feedback control system in the galvanometer mirror scanner ensures highly accurate mirror positioning, allowing for precise control of the laser beam's position. This precision is crucial for achieving high-resolution features and maintaining the dimensional accuracy of the final component.

[0096] Fourth, some advanced scanner heads can be combined with a third galvanometer reflector scanner to dynamically adjust the laser beam focus. This ensures that the laser maintains the correct focus on the powder bed even if the reflector moves. Maintaining a consistent focus is desirable for uniform energy distribution and consistent powder melting.

[0097] The galvanometer reflector scanner also enables the laser to follow complex paths and geometries, which is desirable for creating intricate and delicate parts. The ability to rapidly change the laser path allows for the creation of complex internal structures and fine details that are difficult or impossible in traditional manufacturing methods.

[0098] Figure 4 Different views of a configuration including five sets of galvanometer reflector scanners according to aspects of this disclosure are shown.

[0099] As in Figure 4 As shown in the examples 400a and 400b, two views of an integral multi-optical scanner head housing 401a, 401b placed adjacent to each other when installed in a printer are presented, with 400a being a top perspective view and 400b being a bottom perspective view. Each individual housing can accommodate up to six scanner heads or optics (e.g., five sets of galvanometer reflector scanners 409a, 409b, 409c, 409d, 409e and camera 405a). The beam entrance window 402 can be made of transparent glass covering the bottom opening of each integral multi-optical scanner head housing 401a, 401b. For illustrative purposes, Figure 4The beam incident window 402 is displayed as completely invisible, allowing for a clearer view of the contents within each housing 401a, 401b (e.g., the galvanometer reflector scanner and camera). The beam incident window 402 is typically a transparent component, allowing the laser beam from the scanner head to enter the optical path without noticeable distortion or loss. In some examples, the window is made of optical-grade materials, such as glass or a specific type of crystal that is transparent to the wavelength of the laser used. The beam incident window 402 is crucial for maintaining the integrity of the laser beam as it enters the galvanometer reflector scanner system for precise scanning or positioning.

[0100] In some examples, the monolithic multi-optical scanner head housing can be additively manufactured, allowing complex features such as integrated channels, tubes, and cooling fins to be directly additively manufactured into the monolithic multi-optical scanner head housing. Additive manufacturing allows for the creation of complex nonlinear geometries that are difficult or impossible to produce using conventional subtractive manufacturing methods. In this way, regardless of their complexity, integrated channels, tubes, and cooling fins can be integrated into the housing in an optimal configuration. Furthermore, additive manufacturing enables the direct fabrication of internal channels and cooling tubes within the housing itself, without the need for additional parts or assembly steps. These internal features can be designed to conform to the contours of the scanner head, ensuring efficient heat dissipation for specific hot spots.

[0101] As a non-limiting example, each of the integrated multi-optical scanner head housings 401a and 401b has a hexagonal group with five galvanometer mirror scanner groups 409a, 409b, 409c, 409d, and 409e, for a total of ten galvanometer mirror scanners in the system. Furthermore, each laser beam will have a set of galvanometer mirror scanners, and each laser beam will have a corresponding beam entrance window. In some examples, the two housings can accommodate a total of 10 scanner heads and two lasers.

[0102] and Figure 2 Compared to a 2x4 array of scanner heads, the advantage of a hexagonal structure is that each scanner head has its own spaced-apart elements. For example, in a hexagonal arrangement, each optical element typically has fewer direct neighbors compared to a 2x4 array. Furthermore, the hexagonal geometry provides greater spacing and therefore easier access to each optical element, especially from the edges. This allows for better maneuverability and more direct access to individual scanner heads.

[0103] In contrast to a 2x4 array of scanner heads, the scanner heads are tightly enclosed in a rectangular grid, meaning each scanner head is surrounded by neighbors on multiple sides. This makes accessing individual scanner heads challenging, especially if they are tightly enclosed. The limited space between the scanner heads also restricts the ability to manipulate tools, increasing the difficulty of removing or replacing them without disturbing adjacent scanner heads. Therefore, if any problem occurs with a single or two scanner heads in the integral multi-optical scanner head housings 401a, 401b, then... Figure 2 Compared to the configuration shown in the diagram where individual multi-head scanner heads are packaged into a cluster, it is easier to remove and / or replace a single component.

[0104] As shown in Example 400a, the integrated multi-optical scanner head housings 401a, 401b may have multiple sets of mounting holes 403 for the galvanometer reflector scanners 409a-e and the cameras 405a-b, as well as laser beam through holes 411. Further details regarding the mounting holes and laser beam through holes can be found in... Figure 5 The explanation is as follows.

[0105] Furthermore, the integrated multi-optical scanner head housing can include integrated cooling channels 407, such as... Figure 7 The display can be more detailed, or additional features for process monitoring can be added, such as cameras or sensors directly within the unit.

[0106] Among other advantages, one of the benefits of having an integrated multi-optical scanner head housing is the ability to integrate photodiodes, cameras, power monitoring devices, or any other components in a manner that minimizes the impact on beam quality. Directly sensorizing components within the integrated housing allows for shared sensors to be used for optical health, calibration, and process monitoring.

[0107] As a non-limiting example, as shown in example 400b, cameras 405a, 405b can be positioned closer to the center of the combined integrated multi-optical scanner head housings 401a, 401b for process monitoring.

[0108] Figure 5 Two views 500a, 500b of an integral multi-optical scanner head housing 501 without a galvanometer reflector scanner or other internal components according to aspects of this disclosure are shown to more clearly show the mounting holes and the passage of the laser beam. A beam entrance window 502 is also shown for illustrative purposes, showing the positioning of the beam entrance window; however, it should be noted that the beam entrance window is typically not installed before the internal components of the housing 501 are installed.

[0109] As shown in Examples 500a and 500b, the integral multi-optical scanner head housing 501 is shown as a scanner without any galvanometer reflector.

[0110] For example, as shown in Example 500b, there are mounting holes for the galvanometer reflector scanner 503 and a laser beam passing through 505.

[0111] Figure 6 A view of a configuration according to aspects of this disclosure is shown, which displays integrally printed heat sink fins and a heat exchanger.

[0112] Figure 6 Example 600 shows an example integral multi-optical scanner head housing 601, which has a beam entrance window 602 and a set of integrally printed heat sink fins / heat exchangers as a heat sink structure. For example, the galvanometer, mirror scanner, mirrors, and other electronic components within the scanner head generate significant heat during operation. Excessive heat can cause thermal expansion and deformation of the scanner head components, which can also lead to laser beam misalignment, reducing the precision and accuracy of the scanning process. Furthermore, prolonged exposure to high temperatures can degrade electronic components, shortening their lifespan and reliability. Therefore, effective thermal management is crucial for ensuring the reliability, accuracy, and lifespan of the scanner head.

[0113] A radiator structure can refer to a system or component designed to dissipate heat from a source. The primary function of a radiator structure is for thermal management. As an example, thermal management can include transferring heat from a hot object or fluid to a cooler environment to help regulate temperature and prevent overheating. In some examples, a radiator structure may include fins with thin, flat surfaces extending from the body and / or pipes or channels through which coolant fluid flows. The fluid absorbs heat from the heat source and transfers it to the radiator. In some examples, the radiator may be made of metals (e.g., aluminum, copper, or steel) that have high thermal conductivity to allow for efficient heat transfer. In some examples, a liquid coolant may circulate throughout the radiator structure to absorb heat from the system and release it into integrally printed heat dissipation fins. In some examples, air is the primary medium for cooling, with air flowing over the radiator surface to remove heat.

[0114] The integrally printed heat sink fins and heat exchanger with tubes 605a, 605b, 605c, 605d and integrally printed heat sink fins 603a, 603b, 603c, 603d can be part of a heat sink structure and are examples of components that can be used in the thermal management of scanner heads, particularly in high-power applications such as those seen in PBF AM. In various embodiments, the cooling fins can be used without tubes. In various embodiments, the tubes can be used without cooling fins.

[0115] Specifically, the integrally printed heat sink fins 603a, 603b, 603c, and 603d can typically be thin, flat surfaces extending from the tube attached to the integral multi-optical scanner head housing 601. The integrally printed heat sink fins 603a, 603b, 603c, and 603d operate by increasing the surface area available for heat dissipation. Therefore, the increased surface area provided by the integrally printed heat sink fins 603a, 603b, 603c, and 603d allows for more efficient heat transfer, which helps maintain a lower operating temperature.

[0116] Unlike traditional fins that are attached to a surface after the part is manufactured, one-piece printed fins are created directly as part of the part itself during the manufacturing process. In some examples, these one-piece printed heat sink fins are printed using 3D printing techniques such as additive manufacturing, which allows for the creation of complex geometries that might be difficult or impossible to achieve using conventional manufacturing methods. The primary function of one-piece printed heat sink fins is to improve the thermal management of a device, helping to prevent overheating and ensure stable operation by increasing the surface area of ​​the part to dissipate heat into the surrounding environment.

[0117] Furthermore, as shown in Example 600, the integral multi-optical scanner head housing 601 includes a heat exchanger with tubes and integrally printed heat dissipation fins 603a, 603b, 603c, 603d. The tubes 605a, 605b, 605c, 605d can carry coolant fluid, while the integrally printed heat dissipation fins 603a, 603b, 603c, 603d are attached to the tubes to enhance heat transfer from the scanner head components to the coolant fluid. In this way, heat can be removed from the system. Furthermore, as explained above, the integrally printed heat dissipation fins 603a, 603b, 603c, 603d attached to the tubes increase the surface area for heat exchange, improving the efficiency of the cooling process. In some examples, the hot coolant circulates through the heat exchanger and is then cooled by an external cooling system or by a radiator.

[0118] The benefits of using one-piece printed heat sinks (or cooling fins) and heat exchangers include at least temperature control, precision and accuracy, component lifespan, and system efficiency. An effective cooling mechanism helps maintain a stable operating temperature for the scanner head components. This prevents overheating and ensures consistent performance. By minimizing thermal deformation, one-piece printed heat sinks and heat exchangers help maintain laser beam alignment and accuracy, which is crucial for achieving high-resolution features and dimensional accuracy in the final part. Furthermore, proper thermal management reduces thermal stress on electronic components, extending their lifespan and reliability. This results in lower maintenance costs and fewer system failures. In addition, efficient heat dissipation allows the scanner head to operate at higher power levels without overheating.

[0119] It should be noted that the integrally printed heat sink fins and / or tubes described herein are for illustrative purposes only and any other type of component with the same function may be used in this disclosure.

[0120] Figure 7 A view of a configuration according to an aspect of this disclosure is shown, which illustrates thermal management channels, such as tubes and inlets / outlets, corresponding to a set of galvanometer reflector scanners.

[0121] As shown in Example 700, the integrated multi-optical scanner head housing may have conformal channels 703 (cooling or heating) surrounding the galvanometer reflector scanner group 701. The conformal channels 703 may have corresponding liquid inlets / outlets 705. These conformal channels 703 may have integrated conduits to carry gases, air, and / or water to certain areas to cool heat generated by the object. For example, heat and conformal cooling liquid channels can address heat generated from the galvanometer reflector scanner and heat bounced back from the scanner. In some examples, the conformal channels 703 may also extend to other groups of galvanometer reflector scanners, such that a single channel can be configured for thermal management across multiple groups of galvanometer reflector scanners.

[0122] As an example, in operation, the scanner head will include a high-power galvanometer reflector scanner 701 (e.g., from...). Figure 4 (e.g., 409a, 409b, 409c, 409d, 409e), mirrors or other electronic components (e.g., from...) Figure 4 (Camera 405a). In some examples, one-piece printed heat sink fins (from... Figure 6 The integrally printed heat sink fins (603a, 603b, 603c, 603d) can be directly attached to the galvanometer reflector scanner and / or other heat-generating components, such as the conformal channel 703 (from...). Figure 6(Pipes 605a, 605b, 605c, 605d). One-piece printed heat sink fins conduct heat away from these components and dissipate it to the surrounding area. Conformal channel 703 carries coolant fluid that absorbs heat from the scanner head. One-piece printed heat sink fins on the heat exchanger also enhance heat transfer from the conformal channel 703 to the coolant fluid. In some respects, the heated coolant circulates through the heat exchanger and is then cooled by an external cooling system.

[0123] It should be noted that this disclosure describes liquid cooling channels and fins for illustrative purposes only, and this disclosure may also be applied to heating channels.

[0124] Advantages provided by this disclosure

[0125] In this disclosure, a system and apparatus for an integrated multi-optical scanner head housing are provided. For example, the integrated multi-optical scanner head housing can be additively manufactured with integrated conformal channels (e.g., 703) and conformal cooling (e.g., fins 603a, 603b, 603c, 603d). Furthermore, the integrated head can have integrated channels to carry gas and / or water to reduce heat generation. As another example, the integrated housing enables a novel maintenance strategy because the integrated head can have a single data and a single power inlet. This allows the integrated head to be pre-calibrated and easily hot-swapped in a printer. Additionally, the integrated multi-optical scanner head housing can integrate photodiodes, cameras, power monitoring, and other components for process monitoring in a manner that minimizes the impact on beam quality.

[0126] The foregoing description is provided to enable those skilled in the art to practice the various aspects described herein. Various modifications to the exemplary embodiments presented throughout this disclosure will be apparent to those skilled in the art, and the concepts disclosed herein can be applied to other technologies for printed structures and interconnections. Therefore, the claims are not intended to be limited to the exemplary embodiments presented throughout this disclosure, but should be given the full scope consistent with the language of the claims. All structural and functional equivalents of elements of the exemplary embodiments described throughout this disclosure that are known or hereafter known to those skilled in the art are intended to be covered by the claims. Furthermore, the disclosure herein is not intended to be exclusive to the public, regardless of whether such disclosure is expressly stated in the claims. No element of a claim should be construed in accordance with 35 USC §112(f) or similar law in the applicable jurisdiction, unless the element is expressly stated using the phrase “means for…” or, in the case of a method claim, the element is stated using the phrase “steps for…”.

Claims

1. An apparatus comprising: An integrated multi-optical scanner head housing is configured to receive multiple sets of galvanometer reflector scanners (galvo) and beam entrance windows, wherein each set of galvanometer reflector scanners receives a laser and redirects the laser using a reflector.

2. The apparatus of claim 1, wherein the integral multi-optical scanner head housing further includes a conformal channel having a channel configured for thermal management of the multiple sets of galvanometer reflector scanners.

3. The apparatus of claim 1, wherein each set of galvanometer reflector scanners further comprises a set of integrally printed heat sink fins, heat sink structure or heat exchanger for thermal management of the plurality of galvanometer reflector scanners.

4. The apparatus of claim 1, wherein the integral multi-optical scanner head housing further includes a single air channel for thermal management of the multiple sets of galvanometer reflector scanners.

5. The apparatus of claim 1, wherein the integral multi-optical scanner head housing further includes a single supply nozzle connected to each of the plurality of galvanometer reflector scanners to receive gas.

6. The apparatus of claim 1, wherein the integral multi-optical scanner head housing further includes a single data inlet or power inlet connected to each of the plurality of galvanometer reflector scanners.

7. The apparatus of claim 1, wherein the integral multi-optical scanner head housing further includes at least two beam entrance windows for the plurality of lasers.

8. The apparatus of claim 6, wherein the integral multi-optical scanner head housing further includes a corresponding beam entrance window for each laser.

9. The apparatus of claim 1, wherein the integral multi-optical scanner head housing is further configured to receive a camera for process monitoring.

10. The apparatus of claim 1, wherein the integral multi-optical scanner head housing is further configured to receive a sensor.

11. The apparatus of claim 1, wherein the integral multi-optical scanner head housing further includes a set of mounting holes configured to mount each set of galvanometer reflector scanners, cameras, or sensors and a corresponding single hole for receiving laser beams.

12. The apparatus of claim 1, wherein the integral multi-optical scanner head housing further comprises a hexagonal shape such that each side of the hexagonal shape includes a set of mounting holes configured to receive at least one set of galvanometer reflector scanners, cameras, or sensors.

13. The device of claim 1, wherein the integral multi-optical scanner head housing is additively manufactured.

14. A system for: An integral multi-optical scanner head housing configured to receive a single galvo galvanometer configured to receive a laser and redirect the laser using a reflector, wherein the integral multi-optical scanner head housing includes a conformal channel having a channel configured for thermal management of the single galvo galvanometer.

15. The system of claim 14, wherein the integral multi-optical scanner head housing further includes a conformal channel having a channel configured for thermal management of the single set of galvanometers.

16. The system of claim 14, wherein each set of galvanometers further comprises a set of integrally printed heat sink fins, a heat sink structure or a heat exchanger for thermal management.

17. The system of claim 14, wherein the integral multi-optical scanner head housing further includes a single air channel for thermal management of the single galvanometer group.

18. The system of claim 14, wherein the integral multi-optical scanner head housing further includes a single supply nozzle connected to each of the single set of galvanometers to receive gas.

19. The system of claim 14, wherein the integrated multi-optical scanner head housing further includes a single data inlet or power inlet connected to the single galvanometer group.

20. The system of claim 18, wherein the integral multi-optical scanner head housing further includes a corresponding beam incident window for each laser.

21. The system of claim 14, wherein the integral multi-optical scanner head housing is further configured to receive a camera for process monitoring.

22. The system of claim 14, wherein the integral multi-optical scanner head housing is further configured to receive a sensor.

23. The system of claim 14, wherein the integral multi-optical scanner head housing further includes a set of mounting holes configured to mount each set of galvanometers, cameras, or sensors and a corresponding single hole for receiving a laser beam.

24. The system of claim 14, wherein the integral multi-optical scanner head housing is additively manufactured.

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