High performance epoxy electronic encapsulant, preparation method and application thereof
By modifying inorganic fillers and inorganic flame retardants with amino-polysilsesquioxane coating, the problems of insufficient bonding strength and dispersibility in existing epoxy electronic encapsulation materials are solved, and the hardness and flame retardant properties are improved.
CN122213601APending Publication Date: 2026-06-16SHANDONG MEIHENG NEW MATERIAL CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHANDONG MEIHENG NEW MATERIAL CO LTD
- Filing Date
- 2026-03-16
- Publication Date
- 2026-06-16
AI Technical Summary
Technical Problem
In existing epoxy electronic encapsulation materials, the fillers and additives have weak dispersibility and bonding strength with epoxy resin, resulting in limited improvement in strength, hardness, dielectric properties and flame retardant properties.
Method used
The inorganic filler and inorganic flame retardant were surface-coated and modified using amino-polysilsesquioxane. Through the cross-linking and curing reaction between amino and epoxy resin, the bonding strength and dispersibility with epoxy resin were improved.
Benefits of technology
It significantly improves the hardness, insulation properties, and flame retardant properties of epoxy electronic encapsulants, and the preparation method is simple with good encapsulation effect.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure SMS_1
Abstract
The application belongs to the technical field of polymer and electronic packaging materials, and particularly relates to a high-performance epoxy electronic encapsulating material and a preparation method and application thereof. The high-performance epoxy electronic encapsulating material comprises the following components in percentage by weight: 20-40% of an epoxy resin, 2-6% of a curing agent, 20-50% of inorganic filler coated and modified by amino polysilsesquioxane, 15-35% of inorganic flame retardant coated and modified by amino polysilsesquioxane, 1-3% of a pigment, and 2-10% of other additives. The high-performance epoxy electronic encapsulating material of the application uses inorganic filler and flame retardant coated and modified by amino polysilsesquioxane, which improves the dispersibility and binding force of the inorganic filler and flame retardant with the epoxy resin, and can significantly improve the hardness, insulation performance and flame retardant performance of the encapsulating material.
Need to check novelty before this filing date? Find Prior Art