Antenna module and method of manufacturing the same

Abstract

The antenna substrate is provided with at least one radiating electrode, and a high-frequency circuit module is mounted on the antenna substrate. The high-frequency circuit module has a rectangular shape with two long sides and two short sides when viewed from above. The high-frequency circuit module has a first side corresponding to the two long sides, a second side corresponding to the two long sides, a third side corresponding to the two short sides, and a fourth side corresponding to the two short sides. The antenna substrate has a first substrate side, a second substrate side, a third substrate side, and a fourth substrate side. The first substrate side of the antenna substrate is located on the same plane as the first side of the high-frequency circuit module when viewed from above, or overlaps with the high-frequency circuit module and is located inward of the first side. At least one of the second substrate side, the third substrate side, and the fourth substrate side of the antenna substrate is located in a region that does not overlap with the high-frequency circuit module when viewed from above.

Description

Technical Field

[0001] This invention relates to antenna modules and their manufacturing methods. Background Technology

[0002] Patent Documents 1 and 2 describe antenna modules comprising an antenna substrate, multiple electronic components mounted on the antenna substrate, and a resin molding portion covering the electronic components (described as an electronic component module in Patent Document 1 and an electronic device package in Patent Document 2). Patent Document 3 describes an antenna module formed by stacking an antenna substrate on a drive circuit substrate (described as a receiver in Patent Document 3). Patent Document 4 describes an antenna module formed by stacking an antenna package and a semiconductor package (described as a wireless module in Patent Document 4).

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2020-174172

[0006] Patent Document 2: U.S. Patent Application Publication No. 2022 / 0037271

[0007] Patent Document 3: Japanese Patent Application Publication No. 2020-36311

[0008] Patent Document 4: U.S. Patent Application Publication No. 2019 / 0035749 Summary of the Invention

[0009] The problem the invention aims to solve

[0010] In the antenna modules of Patent Documents 1 and 2, the outer periphery of the antenna substrate is cut to determine the shape of the antenna module, which may result in a decrease in dimensional accuracy of the shape due to cutting offset. Furthermore, in Patent Documents 3 and 4, a drive circuit board or semiconductor package with an area (width) larger than the antenna substrate when viewed from above is mounted, making miniaturization difficult.

[0011] The purpose of this invention is to provide an antenna module and a method thereof that can achieve miniaturization and improve the dimensional accuracy of its shape.

[0012] Solution for solving the problem

[0013] An antenna module of one embodiment includes: an antenna substrate having at least one radiating electrode; and a high-frequency circuit module mounted on the antenna substrate. The high-frequency circuit module, when viewed from above, is rectangular with two long sides and two short sides, having a first side and a second side corresponding to the two long sides, and a third side and a fourth side corresponding to the two short sides. The antenna substrate has a first substrate side, a second substrate side opposite to the first substrate side, and a third substrate side and a fourth substrate side located between the first substrate side and the second substrate side. The first substrate side of the antenna substrate, when viewed from above, is on the same plane as the first side of the high-frequency circuit module, or overlaps with the high-frequency circuit module and is located inside the first side. At least one of the second substrate side, the third substrate side, and the fourth substrate side of the antenna substrate, when viewed from above, is located in a region that does not overlap with the high-frequency circuit module.

[0014] In one method of manufacturing an antenna module, the antenna module includes: an antenna substrate having at least one radiating electrode, a first substrate side, a second substrate side opposite to the first substrate side, a third substrate side and a fourth substrate side located between the first substrate side and the second substrate side; and a high-frequency circuit module mounted on the antenna substrate, which is rectangular in shape with two long sides and two short sides when viewed from above. The manufacturing method includes the following steps: cutting the antenna substrate along the first substrate side; and mounting the high-frequency circuit module on the antenna substrate such that the cut first substrate side, when viewed from above, is located in the same plane as the first substrate side corresponding to the long side of the high-frequency circuit module or overlaps with the high-frequency circuit module and is located inward of the first substrate side.

[0015] The effects of the invention

[0016] The antenna module and its manufacturing method according to the present invention can achieve miniaturization and improve the dimensional accuracy of the shape. Attached Figure Description

[0017] Figure 1 This is a perspective view of the antenna module according to the first embodiment.

[0018] Figure 2 This is a perspective view of the second main surface of the antenna module according to the first embodiment.

[0019] Figure 3 This is a top view showing the antenna module of the first embodiment.

[0020] Figure 4 yes Figure 3 Sectional view of IV-IV'.

[0021] Figure 5 This is an explanatory diagram illustrating the manufacturing method of the antenna module according to the first embodiment.

[0022] Figure 6 This is a top view showing the antenna module of the first variant.

[0023] Figure 7 This is a cross-sectional view showing the antenna module of the second variation.

[0024] Figure 8 This is a cross-sectional view showing the antenna module of the third variation.

[0025] Figure 9 This is a cross-sectional view showing the antenna module of the fourth variation.

[0026] Figure 10 This is a top view showing the antenna module of the second embodiment.

[0027] Figure 11 This is a top view showing the antenna module of the fifth variation.

[0028] Figure 12 This is a cross-sectional view showing the antenna module of the third embodiment.

[0029] Figure 13 This is a cross-sectional view showing the antenna module of the sixth variation.

[0030] Figure 14 This is a cross-sectional view showing the antenna module of the seventh variation.

[0031] Figure 15 This is a cross-sectional view showing the antenna module of the 8th variation.

[0032] Figure 16 This is a cross-sectional view showing the antenna module of the fourth embodiment.

[0033] Figure 17 This is a cross-sectional view showing the antenna module of the fifth embodiment.

[0034] Figure 18 This is a cross-sectional view showing the antenna module of the 9th variation.

[0035] Figure 19 This is a cross-sectional view showing the antenna module of the 10th variation.

[0036] Figure 20 This is a cross-sectional view showing the antenna module of the 11th variation.

[0037] Figure 21 This is a cross-sectional view showing the antenna module of the sixth embodiment.

[0038] Figure 22 This is a cross-sectional view showing the antenna module of the 12th variation.

[0039] Figure 23 This is a cross-sectional view showing the antenna module of the seventh embodiment.

[0040] Figure 24 This is a cross-sectional view of the antenna module of the seventh embodiment when cut along the Y direction.

[0041] Figure 25 This is a cross-sectional view of the antenna module of the 13th variation, cut along the Y direction.

[0042] Figure 26 This is a cross-sectional view of the antenna module of the 14th variation, cut along the Y direction.

[0043] Figure 27 This is a cross-sectional view of the antenna module of the 15th variation, cut along the Y direction. Detailed Implementation

[0044] Hereinafter, embodiments of the present disclosure will be described in detail based on the accompanying drawings. However, the present disclosure is not limited to these embodiments. Furthermore, the embodiments described in this disclosure are illustrative, and structural parts can be replaced or combined between different embodiments. In modified examples, second embodiments, and subsequent embodiments, descriptions of matters common to the first embodiment are omitted, and only the differences are described. In particular, the same effects obtained from the same structure are not mentioned repeatedly in each embodiment.

[0045] (First Embodiment)

[0046] Figure 1 This is a perspective view of the antenna module according to the first embodiment. Figure 2 This is a perspective view of the second main surface of the antenna module according to the first embodiment. Figure 3 This is a top view showing the antenna module of the first embodiment. Figure 4 yes Figure 3 Sectional view of IV-IV'.

[0047] like Figures 1 to 4 As shown, the antenna module 10 includes an antenna substrate 20, a high-frequency circuit module 30, and a connector 40. The antenna module 10 can be mounted, for example, in portable terminals such as mobile phones, smartphones, and tablets, or in electronic devices such as personal computers with communication capabilities. The antenna module 10 can be configured to support 4G (4th generation mobile communication) standards, 5G (5th generation mobile communication) standards, etc. However, it is not limited to this configuration and the antenna module 10 can also be configured to support other communication standards.

[0048] In the following description, the direction perpendicular to the first main surface 20a of the antenna substrate 20 is defined as the Z direction, the direction orthogonal to the Z direction is defined as the X direction, and the direction orthogonal to both the Z and X directions is defined as the Y direction. The X and Y directions are parallel to the first main surface 20a of the antenna substrate 20. Furthermore, in the following description, the configuration is shown from a top view when viewed from the direction perpendicular to the first main surface 20a of the antenna substrate 20 (Z direction).

[0049] The antenna substrate 20 is a multilayer substrate composed of multiple dielectric layers, and has a quadrilateral shape when viewed from above. The antenna substrate 20 is a flat plate having a first main surface 20a and a second main surface 20b on the side opposite to the first main surface 20a.

[0050] The material used as the dielectric layer of the antenna substrate 20 may be any one or more of the following: low-temperature co-fired ceramics (LTCC), glass epoxy resin, liquid crystal polymer (LCP), fluoropolymer, and polyimide resin. Among these materials, LTCC has the highest dielectric constant, and the dielectric constant decreases in the order of glass epoxy resin, liquid crystal polymer, and fluoropolymer. The antenna substrate 20 may be either a rigid substrate or a flexible substrate.

[0051] like Figure 4 As shown, the antenna substrate 20 includes a radiating electrode 21, a grounding electrode 22, and a wiring 23. The grounding electrode 22 and the wiring 23 are located in the inner layer of the antenna substrate 20. Figure 2 As shown, multiple radiating electrodes 21 are disposed on the second main surface 20b of the antenna substrate 20 and arranged in the Y direction. The multiple radiating electrodes 21 constitute an array antenna. In addition, the multiple radiating electrodes 21 are all quadrilateral in shape.

[0052] The electrodes (radiating electrode 21, ground electrode 22, and wiring 23) of the antenna substrate 20, located on the surface and inner layers, are respectively positioned inwards from the side surfaces (first side surface 20s1 and second side surface 20s2) of the antenna substrate 20. In other words, the end face 21e of the radiating electrode 21, the end face 22e of the ground electrode 22, and the end face 23e of the wiring 23 are covered by the dielectric layer of the antenna substrate 20. This at least suppresses oxidation of the ground electrode 22 and the wiring 23, and improves the interlayer adhesion strength of the antenna substrate 20.

[0053] The radiating electrode 21, the grounding electrode 22, and the wiring 23 are formed of a conductive metallic material. The radiating electrode 21, the grounding electrode 22, and the wiring 23 are formed, for example, of metallic materials such as aluminum (Al), copper (Cu), gold (Au), silver (Ag), or alloys containing at least one of these materials.

[0054] The radiating electrodes 21 are connected to the RFIC (Radio Frequency Integrated Circuit) 31 of the high-frequency circuit module 30 via wiring and pathways (not shown) provided in the inner layer of the antenna substrate 20. Thus, a high-frequency signal is supplied from the RFIC 31 to the power supply point of the radiating electrodes 21, and radio waves are radiated from the radiating electrodes 21.

[0055] like Figure 1 and Figure 3 As shown, the high-frequency circuit module 30 and the connector 40 are disposed on the first main surface 20a of the antenna substrate 20. The high-frequency circuit module 30 and the connector 40 are arranged adjacent to each other in the Y direction.

[0056] like Figure 4 As shown, the high-frequency circuit module 30 includes an RFIC 31 (high-frequency circuit), molding resin 32, and a circuit board 33. The high-frequency circuit module 30 is a SiP (System In Package) module. The circuit board 33 is a multilayer substrate composed of multiple dielectric layers. The dielectric layers of the circuit board 33 can be made of the same material as the antenna substrate 20 described above, or they can be made of a different material. The circuit board 33 is mounted on the first main surface 20a of the antenna substrate 20 via connection terminals 33a (bumps). In addition, the circuit board 33 has wiring 33b provided in the inner layer. Alternatively, wiring (not shown) may also be provided on the surface layer of the circuit board 33.

[0057] RFIC 31 is mounted on circuit board 33 via connection terminal 31a (bump). Molded resin 32 is disposed on circuit board 33 covering RFIC 31. Figures 1 to 4 The diagram schematically illustrates the structure of the high-frequency circuit module 30. However, as a high-frequency circuit, the high-frequency circuit module 30 may include, in addition to the RFIC 31, other ICs such as the power supply IC 35, and multiple chip components 36 (see reference) such as resistors, capacitors, and inductors required for the operation of the RFIC 31. Figure 8 In the high-frequency circuit module 30, the circuit board 33, the high-frequency circuit including the RFIC 31, and the molding resin 32 are encapsulated as a single unit and mounted on the antenna board 20.

[0058] Connector 40 is, for example, a multi-pole connector, for connecting to an external electronic device that houses the antenna module 10. Connector 40 is not limited to a multi-pole connector; it can also be other types such as a coaxial connector.

[0059] In this embodiment, the connector 40 is located on the same first main surface 20a as the high-frequency circuit module 30. That is, the high-frequency circuit module 30 and the connector 40 are located on the side opposite to the second main surface 20b where the radiation electrode 21 is located, thus ensuring the electrode size of the radiation electrode 21.

[0060] Next, the configuration relationship between the antenna substrate 20 and the high-frequency circuit module 30 will be explained. For example... Figure 3 As shown, the high-frequency circuit module 30 is rectangular in shape with two long sides and two short sides when viewed from above. The width of the high-frequency circuit module 30 in the X direction is smaller than its length in the Y direction. The high-frequency circuit module 30 has a first side 30s1 and a second side 30s2 corresponding to the two long sides, and a third side 30s3 and a fourth side 30s4 corresponding to the two short sides.

[0061] The first side 30s1 of the high-frequency circuit module 30 extends in the Y direction. The second side 30s2 extends in the Y direction and is located on the opposite side of the first side 30s1 in the X direction. The third side 30s3 and the fourth side 30s4 are disposed between the first side 30s1 and the second side 30s2. The third side 30s3 extends in the X direction. The fourth side 30s4 extends in the X direction and is located on the opposite side of the third side 30s3 in the Y direction.

[0062] Furthermore, the antenna substrate 20 is rectangular in shape with two long sides and two short sides when viewed from above. The width of the antenna substrate 20 in the X direction is smaller than its length in the Y direction. The antenna substrate 20 has a first substrate side surface 20s1 and a second substrate side surface 20s2 corresponding to the two long sides, and a third substrate side surface 20s3 and a fourth substrate side surface 20s4 corresponding to the two short sides.

[0063] The antenna substrate 20 has a first substrate side surface 20s1 extending in the Y direction. A second substrate side surface 20s2 extends in the Y direction and is located on the opposite side of the first substrate side surface 20s1 in the X direction. A third substrate side surface 20s3 and a fourth substrate side surface 20s4 are disposed between the first substrate side surface 20s1 and the second substrate side surface 20s2. The third substrate side surface 20s3 extends in the X direction. The fourth substrate side surface 20s4 extends in the X direction and is located on the opposite side of the third substrate side surface 20s3 in the Y direction.

[0064] The first substrate side 20s1 and the second substrate side 20s2 of the antenna substrate 20 are respectively arranged along the two long sides (first side 30s1 and second side 30s2) of the high-frequency circuit module 30. The third substrate side 20s3 and the fourth substrate side 20s4 of the antenna substrate 20 are respectively arranged along the two short sides (third side 30s3 and fourth side 30s4) of the high-frequency circuit module 30.

[0065] Furthermore, in the following description, unless it is necessary to distinguish between the first substrate side surface 20s1, the second substrate side surface 20s2, the third substrate side surface 20s3, and the fourth substrate side surface 20s4 of the antenna substrate 20, only the substrate side surface of the antenna substrate 20 will be referred to. Similarly, unless it is necessary to distinguish between the first side surface 30s1, the second side surface 30s2, the third side surface 30s3, and the fourth side surface 30s4 of the high-frequency circuit module 30, only the side surface of the high-frequency circuit module 30 will be referred to.

[0066] like Figure 3 and Figure 4 As shown, the first substrate side 20s1 of the antenna substrate 20 is on the same plane as the first substrate side 30s1 of the high-frequency circuit module 30 when viewed from above. The second substrate side 20s2 of the antenna substrate 20, which is opposite to the first substrate side 20s1, is located in a region that does not overlap with the high-frequency circuit module 30, and is located on the outer side of the second substrate side 30s2 of the high-frequency circuit module 30 in the X direction.

[0067] In addition, such as Figure 3 As shown, the third substrate side 20s3 and the fourth substrate side 20s4 of the antenna substrate 20 are located in a region that does not overlap with the high-frequency circuit module 30 when viewed from above, and are located outside the third substrate side 30s3 and the fourth substrate side 30s4 of the high-frequency circuit module 30 in the Y direction. In other words, the second substrate side 30s2, the third substrate side 30s3, and the fourth substrate side 30s4 of the high-frequency circuit module 30 are located in a region that overlaps with the antenna substrate 20 when viewed from above.

[0068] As described above, the first substrate side 20s1 of the antenna substrate 20 and the first substrate side 30s1 of the high-frequency circuit module 30 are located on the same plane. Therefore, in a top view, the dimensional accuracy of one long side of the antenna module 10 is defined by the first substrate side 30s1 of the high-frequency circuit module 30. Furthermore, the dimensional accuracy of the other sides of the antenna module 10 is defined by the second substrate side 20s2, the third substrate side 20s3, and the fourth substrate side 20s4 of the antenna substrate 20. Thus, even if a positional shift occurs in the first substrate side 20s1 during the cutting process of the antenna substrate 20, it will not affect the overall shape of the antenna module 10, thereby improving the dimensional accuracy of at least one long side of the antenna module 10.

[0069] Therefore, in the antenna module 10, compared to the case where the first side 30s1 and the second side 30s2 of the high-frequency circuit module 30 are arranged in a position closer to the substrate side of the antenna substrate 20, the dimensional accuracy in the width direction (X direction) can be improved.

[0070] Furthermore, since the second substrate side surface 20s2, the third substrate side surface 20s3, and the fourth substrate side surface 20s4 of the antenna substrate 20 are located further outward than the high-frequency circuit module 30, space for the connector 40 can be secured on the first main surface 20a of the antenna substrate 20. As a result, the area of ​​the radiating electrode 21 can be increased compared to the case where the connector 40 is located on the second main surface 20b. Therefore, the antenna module 10 can improve the antenna frequency characteristics while miniaturizing the antenna substrate 20. In addition, the high-frequency circuit module 30 in the antenna module 10 has a smaller external shape (area) than the antenna substrate 20. Therefore, compared to the structure where the high-frequency circuit module 30 has a larger external shape (area) than the antenna substrate 20, i.e., the first side surface 30s1 and the second side surface 30s2 of the high-frequency circuit module 30 are located further outward than the substrate side surface of the antenna substrate 20, the antenna module 10 can be miniaturized.

[0071] As described above, the antenna module 10 can be miniaturized and its dimensional accuracy improved.

[0072] also, Figures 1 to 4 The structure of the antenna module 10 shown is merely an example and can be modified appropriately. For instance, the long side of the antenna substrate 20 may be approximately four to five times the length of the short side, but the ratio of the long side to the short side can be varied appropriately. The ratio of the long side to the short side of the high-frequency circuit module 30 can also be varied appropriately.

[0073] (Manufacturing method of antenna module)

[0074] Figure 5 This is an explanatory diagram illustrating the manufacturing method of the antenna module according to the first embodiment. (As shown) Figure 5 As shown, an antenna substrate 20 is prepared, and a cut is made along the first substrate side 20s1 of the substrate side of the antenna substrate 20 (step ST1). Specifically, one of the two long sides of the antenna substrate 20 is cut along the cutting line CL1 by mechanical processing such as laser processing or a cutting machine. Furthermore, in Figure 5 The diagram is omitted, but the radiation electrode 21, ground electrode 22, and wiring 23 are pre-formed on the surface and inner layers of the antenna substrate 20 (see reference). Figure 4 ).

[0075] Next, the high-frequency circuit module 30 is mounted on the antenna substrate 20 such that the first substrate side 20s1 after the antenna substrate 20 is cut, when viewed from above, is on the same plane as the first side 30s1 of the high-frequency circuit module 30 corresponding to its long side (step ST2). In addition, the unprocessed substrate sides of the antenna substrate 20 (the second substrate side 20s2, the third substrate side 20s3, and the fourth substrate side 20s4) do not overlap with the high-frequency circuit module 30, but are located on the outer side of the second side 30s2, the third side 30s3, and the fourth side 30s4 of the high-frequency circuit module 30.

[0076] Additionally, in step ST2, the connector 40 is mounted on the first main surface 20a of the antenna substrate 20. That is, the connector 40 is mounted on the same surface of the antenna substrate 20 as the high-frequency circuit module 30.

[0077] Next, the antenna substrate 20, on which the high-frequency circuit module 30 is mounted, is cut along the second substrate side 20s2, the third substrate side 20s3, and the fourth substrate side 20s4 (step ST3). Specifically, the antenna substrate 20 is cut along the cutting line CL2 by mechanical processing such as laser processing or a cutting machine.

[0078] Additionally, in step ST3, cutting is performed along three sides of the antenna substrate 20, but this is not a limitation. Depending on the required dimensional accuracy of the antenna module 10, cutting can be performed along at least one of the following substrate sides: the second substrate side 20s2, the third substrate side 20s3, and the fourth substrate side 20s4.

[0079] Through the above-described process, an antenna module 10 with its shape cut into the antenna substrate 20 can be manufactured (step ST4). According to the manufacturing method of the antenna module 10 of this embodiment, one long side (first substrate side surface 20s1) of the antenna substrate 20 is cut before the mounting process of the high-frequency circuit module 30. After the cutting process of the first substrate side surface 20s1, the high-frequency circuit module 30 is mounted. Thus, the shape corresponding to at least one long side of the antenna module 10 is defined by the first side surface 30s1 of the high-frequency circuit module 30. Therefore, even if a positional offset occurs during the cutting process of the first substrate side surface 20s1, the dimensional accuracy of the antenna module 10 can be improved.

[0080] also, Figure 5 The manufacturing method shown is merely schematic and can be modified appropriately. For example, in step ST2, the first substrate side 20s1 after the antenna substrate 20 is cut is not limited to the same side as the first side 30s1 of the high-frequency circuit module 30, but can also be located in a position inside the first side 30s1.

[0081] (Example 1)

[0082] Figure 6 This is a top view showing the antenna module of the first modified example. (Example) Figure 6 As shown, compared with the first embodiment described above, the structural difference of the antenna module 10A in the first modified example is that the first substrate side 20s1 of the antenna substrate 20 overlaps with the high-frequency circuit module 30 when viewed from above and is located on the inner side of the first side 30s1.

[0083] In other words, the high-frequency circuit module 30 is mounted on the antenna substrate 20 in such a way that the first side 30s1 of the high-frequency circuit module 30 does not overlap with the antenna substrate 20, but extends outward beyond the first side 20s1 of the substrate.

[0084] In this modified example, in the top view, the dimensional accuracy of one long side of the antenna module 10A is determined only by the first side surface 30s1 of the high-frequency circuit module 30. Therefore, even if the dimensional error of the cutting process of the first substrate side surface 20s1 of the antenna substrate 20 is large, the dimensional accuracy of the antenna module 10A equipped with the high-frequency circuit module 30 can be improved.

[0085] (Second variation)

[0086] Figure 7 This is a cross-sectional view showing the antenna module of the second variation. (e.g.) Figure 7 As shown, the antenna module 10B of the second variation differs from the first embodiment and the first variation described above in that the high-frequency circuit module 30A includes a shield 34 in a different structure.

[0087] The high-frequency circuit module 30A includes a circuit board 33, an RFIC 31 (high-frequency circuit) disposed on the circuit board 33, a molding resin 32 covering the RFIC 31, and a shielding member 34 covering the upper surface and sides of the molding resin 32. The shielding member 34 is formed of a conductive material, such as using metal materials such as aluminum (Al), copper (Cu), gold (Au), silver (Ag), or alloys containing these materials.

[0088] A shielding member 34 is disposed on the upper surface and side surfaces of the high-frequency circuit module 30. More specifically, the shielding member 34 is disposed covering the upper surface and side surfaces of the molding resin 32 and also covering the side surfaces of the circuit board 33. Furthermore, the shielding member 34 is not disposed on the antenna substrate 20. In this modified example, the side surfaces of the shielding member 34 constitute the side surfaces of the high-frequency circuit module 30A (first side surface 30s1, second side surface 30s2, third side surface 30s3, and fourth side surface 30s4). Additionally, the shielding member 34 is also disposed on... Figure 7 The third side 30s3 and the fourth side 30s4 are not shown in the figure.

[0089] Therefore, in the second modification, the shielding member 34 can suppress noise radiated from the RFIC 31, wiring 33b, etc. inside the high-frequency circuit module 30A. Alternatively, in the second modification, the shielding member 34 can suppress noise interference between the high-frequency circuit module 30A and the radiating electrode 21 of the antenna substrate 20.

[0090] (3rd variation)

[0091] Figure 8 This is a cross-sectional view showing the antenna module of the third variation. (e.g.) Figure 8 As shown, the antenna module 10C of the third variation differs from the first embodiment and other variations in that the high-frequency circuit module 30B has a structure that includes a power supply IC 35 and a chip component 36 in addition to the RFIC 31.

[0092] Power supply IC 35, for example, includes a power amplifier and supplies power voltage to RFIC 31. Chip component 36 includes, for example, resistors, capacitors, inductors, etc. Figure 8 The diagram shows a power supply IC 35 and a chip component 36, but multiple other ICs and multiple chip components can also be used. Alternatively, the high-frequency circuit module 30B is not limited to a structure having both a power supply IC 35 and a chip component 36, as long as it includes at least one of other ICs and chip components 36 that are different from RFIC 31, in addition to RFIC 31.

[0093] The power IC 35 and the chip component 36 are mounted on the circuit board 33 shared with the RFIC 31 via connection terminals 35a and 36a, respectively. The molding resin 32 and the shielding member 34 are provided to cover the RFIC 31, the power IC 35 and the chip component 36.

[0094] In this modified example, multiple components, including RFIC 31, power IC 35, and chip component 36, are packaged as a single unit and mounted on antenna substrate 20. Therefore, compared to a structure where RFIC 31, power IC 35, and chip component 36 are individually mounted on antenna substrate 20, miniaturization of antenna module 10C can be achieved.

[0095] (4th variation)

[0096] Figure 9 This is a cross-sectional view showing the antenna module of the fourth variation. (e.g.) Figure 9 As shown, the antenna module 10D of the fourth variation differs from the first embodiment and other variations in that the high-frequency circuit module 30C does not have a circuit board 33.

[0097] The high-frequency circuit module 30C includes: a high-frequency circuit comprising an RFIC 31, a power IC 35, and a chip component 36; a molding resin 32; and a shielding component 34. The molding resin 32 covers the high-frequency circuit (RFIC 31, power IC 35, and chip component 36). The shielding component 34 covers the upper surface and sides of the molding resin 32.

[0098] The high-frequency circuit module 30C is a so-called intermediary-free module. In the high-frequency circuit module 30C, the high-frequency circuit (RFIC 31, power IC 35, and chip component 36), molding resin 32, and shielding 34 are integrally packaged and mounted on the antenna substrate 20. That is, the RFIC 31, power IC 35, and chip component 36 are directly mounted on the first main surface 20a of the antenna substrate 20 via connection terminals 31a, 35a, and 36a, respectively. Figure 9 The diagram is omitted, but the first main surface 20a of the antenna substrate 20 is provided with connection electrodes corresponding to the positions (configuration pitch) of the connection terminals 31a, 35a, and 36a.

[0099] In the fourth variation, compared with the first embodiment and other variations described above, the high-frequency circuit module 30C does not have a circuit board 33, thus enabling miniaturization and thinning of the high-frequency circuit module 30C.

[0100] In the first to fourth modifications described above, various modifications of the high-frequency circuit modules 30, 30A, 30B, and 30C were explained. These structures can be appropriately combined. For example, in the high-frequency circuit modules 30B and 30C (refer to...) Figure 8 , Figure 9 In addition, the structure may also be without the shielding element 34. Furthermore, in the embodiments and variations described below, any one of the high-frequency circuit modules 30, 30A, 30B, and 30C is shown, but it is not limited to this, and other high-frequency circuit modules 30, 30A, 30B, and 30C can be applied.

[0101] (Second Implementation)

[0102] Figure 10 This is a top view showing the antenna module of the second embodiment. (Example) Figure 10 As shown, the antenna module 10E of the second embodiment differs from the first embodiment and its various modifications in that it has an antenna element 41 in addition to the radiating electrode 21.

[0103] Antenna element 41 is related to radiating electrode 21 (see reference). Figure 2Different radiating electrodes are disposed on the first main surface 20a of the antenna substrate 20, opposite to the radiating electrode 21. The antenna element 41 has a directional radiating pattern in a direction parallel to the first main surface 20a of the antenna substrate 20. The antenna element 41 is, for example, a dipole antenna. However, it is not limited to this, and the antenna element 41 can also be of other constructions as long as it is directional in the horizontal direction.

[0104] Compared to the first embodiment and its variations described above, the antenna substrate 20 has a larger width in the X direction. A plurality of antenna elements 41 are disposed in a region of the antenna substrate 20 that does not overlap with the high-frequency circuit module 30 and the connector 40. The plurality of antenna elements 41 are arranged at the first main surface 20a of the antenna substrate 20 in regions along the second substrate side surface 20s2, the third substrate side surface 20s3, and the fourth substrate side surface 20s4, respectively.

[0105] The antenna module 10E of this embodiment has a radiating electrode 21 and an antenna element 41, thus forming a horizontally radiating pattern. Therefore, compared with the first embodiment and its variations described above, this embodiment can increase the coverage area of ​​the radiating pattern of the radiating electrode 21 and the antenna element 41.

[0106] Furthermore, the number and configuration pattern of the multiple antenna elements 41 are merely an example and can be appropriately changed according to the radiation pattern required by the antenna module 10E.

[0107] (5th variation)

[0108] Figure 11 This is a top view showing the antenna module of the fifth variation. (Example) Figure 11 As shown, the antenna module 10F of the fifth variation differs from the second embodiment described above in that the plurality of antenna elements 41 are disposed in the region along the side surface 20s2 of the second substrate at the first main surface 20a of the antenna substrate 20, and are not disposed in the regions along the side surface 20s3 and the side surface 20s4 of the third substrate, respectively.

[0109] In the fifth variation, compared to the second embodiment described above, the width of the antenna substrate 20 in the X direction is smaller. Furthermore, the first substrate side surface 20s1 of the antenna substrate 20 is disposed overlapping the high-frequency circuit module 30A when viewed from above, and is located on the inner side of the first substrate side surface 30s1 of the high-frequency circuit module 30A. In other words, the first substrate side surface 30s1 of the high-frequency circuit module 30A does not overlap with the antenna substrate 20 when viewed from above, but is located on the outer side of the first substrate side surface 20s1 of the antenna substrate 20. A plurality of antenna elements 41 are disposed in the region between the second substrate side surface 30s2 of the high-frequency circuit module 30A and the second substrate side surface 20s2 of the antenna substrate 20.

[0110] Therefore, in this modified example, it is possible to achieve miniaturization of the antenna module 10F while ensuring an area for multiple antenna elements 41 to be configured on the first main surface 20a of the antenna substrate 20.

[0111] (Third implementation)

[0112] Figure 12 This is a cross-sectional view showing the antenna module according to the third embodiment. (e.g.) Figure 12 As shown, the antenna module 10G of the third embodiment differs from the embodiments and variations described above in that the electrodes (radiating electrode 21, grounding electrode 22, and wiring 23) provided on the surface and inner layers of the antenna substrate 20 are exposed from the side of the antenna substrate 20.

[0113] More specifically, the end face 21e of the radiating electrode 21, the end face 22e of the grounding electrode 22, and the end face 23e of the wiring 23 are located on the same side as the first substrate side 20s1 and the second substrate side 20s2 of the antenna substrate 20.

[0114] In this modified example, the area of ​​the radiating electrode 21 and the ground electrode 22 can be ensured while miniaturizing the antenna substrate 20. Therefore, the antenna module 10G of the third embodiment can achieve improvements in antenna gain, frequency characteristics, and frequency band.

[0115] (Sixth variation)

[0116] Figure 13 This is a cross-sectional view showing the antenna module of the sixth variation. (e.g.) Figure 13 As shown, the antenna module 10H of the sixth variation differs from the third embodiment described above in that the ground electrode 22 located in the inner layer of the antenna substrate 20 is exposed from the side of the antenna substrate 20, and the radiating electrode 21 and wiring 23 are located in a position further inward than the side of the antenna substrate 20.

[0117] More specifically, the end face 22e of the ground electrode 22 is on the same plane as the first substrate side surface 20s1 and the second substrate side surface 20s2 of the antenna substrate 20. In addition, the end face 21e of the radiating electrode 21 and the end face 23e of the wiring 23 are located inside the first substrate side surface 20s1 and the second substrate side surface 20s2 of the antenna substrate 20.

[0118] In this modified example, compared to the third embodiment described above, the area of ​​the ground electrode 22 can be ensured to be larger relative to the radiating electrode 21. An edge electric field is generated from the end face 21e of the radiating electrode 21 toward the end face 22e of the ground electrode 22, and radio waves are radiated in the normal direction of the radiating electrode 21 through this edge electric field. Therefore, the antenna module 10H of the sixth modified example can achieve improved antenna gain.

[0119] (Seventh variation)

[0120] Figure 14 This is a cross-sectional view showing the antenna module of the seventh variation. (e.g.) Figure 14 As shown, the antenna module 10I of the seventh modification differs from the third and sixth modifications described above in that the radiating electrode 21 and wiring 23 are exposed from the side of the antenna substrate 20, and the ground electrode 22 located in the inner layer of the antenna substrate 20 is located further inward than the side of the antenna substrate 20.

[0121] More specifically, the end face 21e of the radiating electrode 21 and the end face 23e of the wiring 23 are located on the same plane as the first substrate side surface 20s1 and the second substrate side surface 20s2 of the antenna substrate 20. In addition, the end face 22e of the ground electrode 22 is located inside the first substrate side surface 20s1 and the second substrate side surface 20s2 of the antenna substrate 20.

[0122] In this modification, compared to the third and sixth embodiments described above, the area of ​​the radiating electrode 21 can be ensured to be larger relative to the ground electrode 22. Therefore, in the antenna module 10I of the seventh modification, the antenna frequency characteristics can be improved while miniaturizing the antenna substrate 20. In particular, by increasing the area of ​​the radiating electrode 21, the low-frequency side can be improved.

[0123] (8th variation)

[0124] Figure 15 This is a cross-sectional view showing the antenna module of the eighth variation. (e.g.) Figure 14 As shown, the antenna module 10J in the eighth modification differs from the third, sixth, and seventh embodiments described above in that the wiring 23 in the inner layer of the antenna substrate 20 is connected to the ground electrode 22 via the passage 24. Furthermore, in the eighth modification, the ground electrode 22 and wiring 23 in the inner layer of the antenna substrate 20 are exposed from the substrate side of the antenna substrate 20, and the radiating electrode 21 is located further inward than the substrate side of the antenna substrate 20.

[0125] More specifically, the end face 22e of the ground electrode 22 and the end face 23e of the wiring 23 are located on the same plane as the first substrate side surface 20s1 and the second substrate side surface 20s2 of the antenna substrate 20. In addition, the end face 21e of the radiating electrode 21 is located inside the first substrate side surface 20s1 and the second substrate side surface 20s2 of the antenna substrate 20.

[0126] In this modified example, compared to the third, sixth, and seventh embodiments described above, the wiring 23 is connected to the ground electrode 22. Furthermore, in the Z direction, the wiring 23 is located in the layer between the radiating electrode 21 and the ground electrode 22. Therefore, compared to the distance between the radiating electrode 21 and the ground potential (ground electrode 22) in structures where the wiring 23 and the ground electrode 22 are not connected, the distance between the radiating electrode 21 and the ground potential (wiring 23) is shorter. Consequently, an electric field is preferentially generated between the radiating electrode 21 and the wiring 23, reducing the generation of edge electric fields that bypass the substrate side of the antenna substrate 20 from the end face 21e of the radiating electrode 21 toward the end face 22e of the ground electrode 22. Therefore, in the antenna module 10J of the eighth modified example, it is possible to achieve miniaturization of the antenna substrate 20 while simultaneously improving the antenna frequency band.

[0127] (Fourth implementation)

[0128] Figure 16 This is a cross-sectional view showing the antenna module of the fourth embodiment. (e.g.) Figure 16 As shown, the antenna module 10K of the fourth embodiment differs from the above embodiments and modifications in that the first substrate side 20s1 and the second substrate side 20s2 of the antenna substrate 20 are located on the same side as the first side 30s1 and the second side 30s2 of the high-frequency circuit module 30A when viewed from above.

[0129] In addition, Figure 16 Not shown in the figure, but the third substrate side 20s3 and the fourth substrate side 20s4 of the antenna substrate 20 are located at a position higher than the third substrate side 30s3 and the fourth substrate side 30s4 of the high-frequency circuit module 30A when viewed from above (see reference). Figure 3 (The outermost position)

[0130] In this embodiment, the dimensional accuracy of the two long sides of the antenna module 10K in its top view is defined by the first side 30s1 and the second side 30s2 of the high-frequency circuit module 30A. Therefore, even if the first substrate side 20s1 and the second substrate side 20s2 shift during the cutting process of the antenna substrate 20, this shift will not be reflected in the shape of the two long sides of the antenna module 10K. Thus, the antenna module 10K can be miniaturized in the X direction, and its dimensional accuracy can be improved.

[0131] In addition, in the fourth embodiment, the first substrate side 20s1 and the second substrate side 20s2 of the antenna substrate 20 may be located inside the first substrate side 30s1 and the second substrate side 30s2 of the high-frequency circuit module 30A when viewed from above.

[0132] (Fifth implementation)

[0133] Figure 17 This is a cross-sectional view showing the antenna module of the fifth embodiment. (e.g.) Figure 17 As shown, the antenna module 10L of the fifth embodiment has a different structure from the embodiments and variations described above, having a resin layer 50 disposed between the antenna substrate 20 and the high-frequency circuit module 30A.

[0134] More specifically, the resin layer 50 is disposed between the first main surface 20a of the antenna substrate 20 and the lower surface (the surface opposite to the first main surface 20a) of the circuit substrate 33. The resin layer 50 can improve the connection strength between the antenna substrate 20 and the high-frequency circuit module 30A.

[0135] The antenna substrate 20 and the high-frequency circuit module 30A in this embodiment have the same structure as in the fourth embodiment described above. Specifically, the first substrate side surface 20s1 and the second substrate side surface 20s2 of the antenna substrate 20 are located on the same plane as the first substrate side surface 30s1 and the second substrate side surface 30s2 of the high-frequency circuit module 30A when viewed from above. Therefore, the resin layer 50 does not form a so-called fillet. That is, the end face of the resin layer 50 is located on the same plane as the first substrate side surface 20s1 and the second substrate side surface 20s2, and is formed in a manner that does not extend from the first substrate side surface 20s1 and the second substrate side surface 20s2 of the antenna substrate 20. Thus, even with the resin layer 50 provided, the connection strength can be improved without increasing the overall shape of the antenna module 10L.

[0136] Furthermore, the resin layer 50 of this embodiment can be applied to the first to third embodiments and various modifications described above.

[0137] (9th variation)

[0138] Figure 18 This is a cross-sectional view showing the antenna module of the 9th variation. (Example) Figure 18 As shown, the antenna module 10M of the 9th variation differs from the 5th embodiment described above in that the resin layer 50A covers the space between the antenna substrate 20 and the high-frequency circuit module 30A, and is disposed on the side of the antenna substrate 20.

[0139] More specifically, the resin layer 50A fills the space between the first main surface 20a of the antenna substrate 20 and the lower surface (the surface opposite to the first main surface 20a) of the circuit substrate 33, and is disposed to cover the first substrate side surface 20s1 and the second substrate side surface 20s2 of the antenna substrate 20. The resin layer 50A may also cover... Figure 18 The antenna substrate 20, not shown in the figure, has a third substrate side surface 20s3 and a fourth substrate side surface 20s4.

[0140] The resin layer 50A enhances the connection strength between the antenna substrate 20 and the high-frequency circuit module 30A. Furthermore, the end faces 21e of the radiating electrode 21, 22e of the ground electrode 22, and 23e of the wiring 23 exposed from the side of the antenna substrate 20 are covered by the resin layer 50A. In this modified example, the resin layer 50A suppresses oxidation of the radiating electrode 21, ground electrode 22, and wiring 23 exposed from the side of the antenna substrate 20.

[0141] Furthermore, the resin layer 50A of this modified example can be applied to the first to third embodiments and each modified example described above.

[0142] (Example 10)

[0143] Figure 19 This is a cross-sectional view showing the antenna module of the 10th variation. (Example) Figure 19 As shown, the antenna module 10N of the 10th variation has an insulating layer 51 compared with the above embodiments and variations. The insulating layer 51 is provided on the side of the antenna substrate 20 and has a different structure formed of a different material than the antenna substrate 20.

[0144] An insulating layer 51 is disposed covering the first substrate side surface 20s1 and the second substrate side surface 20s2 of the antenna substrate 20. Alternatively, the insulating layer 51 may also cover... Figure 19 The antenna substrate 20, not shown in the figure, has a third substrate side surface 20s3 and a fourth substrate side surface 20s4.

[0145] The end faces 21e of the radiating electrode 21, 22e of the ground electrode 22, and 23e of the wiring 23 exposed from the side of the antenna substrate 20 are covered by the insulating layer 51. Therefore, in this modified example, the oxidation of the radiating electrode 21, the ground electrode 22, and the wiring 23 exposed from the side of the antenna substrate 20 can be suppressed by the insulating layer 51.

[0146] Furthermore, the insulating layer 51 of this modification can be applied to the first to third embodiments and each modification described above. Additionally, the insulating layer 51 of this modification can be combined with the resin layers 50 and 50A of the fifth and ninth embodiments.

[0147] (Example 11)

[0148] Figure 20 This is a cross-sectional view showing the antenna module of the 11th variation. (Example) Figure 20 As shown, the antenna module 10O of the 11th variation has a different structure than the embodiments and variations described above, having a plating layer 52 that covers the electrodes (radiating electrode 21, ground electrode 22, and wiring 23) exposed from the side of the antenna substrate 20.

[0149] The plating layer 52 is provided to cover the end face 21e of the radiating electrode 21, the end face 22e of the ground electrode 22, and the end face 23e of the wiring 23 exposed from the side of the antenna substrate 20. In this modified example, the plating layer 52 can suppress the oxidation of the radiating electrode 21, the ground electrode 22, and the wiring 23 exposed from the side of the antenna substrate 20.

[0150] Furthermore, the coating 52 of this modified example can be used in conjunction with the third embodiment described above (see also...). Figure 12 ), Examples 6 to 8 (refer to) Figure 15 The coating 52 is formed on the end face of the electrode (radiating electrode 21, ground electrode 22, and wiring 23) exposed from the side of the antenna substrate 20. Furthermore, the coating 52 of this modified example can be combined with one or more of the resin layers 50, 50A and insulating layer 51 shown in the 5th, 9th, and 10th embodiments.

[0151] (Sixth implementation)

[0152] Figure 21 This is a cross-sectional view showing the antenna module of the sixth embodiment. (e.g.) Figure 21 As shown, the antenna module 10P of the sixth embodiment differs from the above embodiments and variations in that the first substrate side 20s1 and the second substrate side 20s2 of the antenna substrate 20 have a conical inclined structure.

[0153] In the sixth embodiment, the first substrate side surface 20s1 and the second substrate side surface 20s2 of the antenna substrate 20 are inclined in a positive cone shape. That is, the width of the first main surface 20a of the antenna substrate 20 in the X direction is smaller than the width of the second main surface 20b in the X direction.

[0154] The radiating electrode 21, ground electrode 22, and wiring 23 provided on the antenna substrate 20 are exposed from the side of the antenna substrate 20. Therefore, in this embodiment, the area of ​​the radiating electrode 21 can be maximized while achieving miniaturization of the antenna substrate 20. As a result, the antenna module 10P can achieve improvement in the low-frequency side of the antenna characteristics.

[0155] Furthermore, the structure of the antenna substrate 20 in this embodiment can be combined with the first to fifth embodiments and various modifications described above.

[0156] (12th variation)

[0157] Figure 22 This is a cross-sectional view showing the antenna module of the 12th variation. (Example) Figure 22As shown, the antenna module 10Q of the 12th variation differs from the 6th embodiment described above in that the first substrate side surface 20s1 and the second substrate side surface 20s2 of the antenna substrate 20 have an inverted conical inclined structure. That is, the width of the first main surface 20a of the antenna substrate 20 in the X direction is larger than the width of the second main surface 20b in the X direction.

[0158] In this modified example, the radiating electrode 21, the ground electrode 22, and the wiring 23 provided on the antenna substrate 20 are exposed from the side of the antenna substrate 20. Therefore, in this modified example, it is possible to achieve miniaturization of the antenna substrate 20 while ensuring that the area of ​​the ground electrode 22 is larger than that of the radiating electrode 21. Thus, the antenna module 10Q can achieve high gain in its antenna characteristics.

[0159] Furthermore, the structure of the antenna substrate 20 in this modified example can be combined with the first to fifth embodiments and various modified examples described above.

[0160] (Seventh implementation)

[0161] Figure 23 This is a cross-sectional view showing the antenna module of the seventh embodiment. Figure 24 This is a cross-sectional view of the antenna module of the seventh embodiment when cut along the Y direction. For example... Figure 23 and Figure 24 As shown, the antenna module 10R of the seventh embodiment differs from the above embodiments and variations in that the antenna substrate 20A has a structure with a first antenna substrate 25 and a second antenna substrate 26.

[0162] In this embodiment, the antenna module 10R is stacked in the Z direction in the order of the second antenna substrate 26, the first antenna substrate 25, and the high-frequency circuit module 30D. In other words, the first antenna substrate 25 is disposed between the second antenna substrate 26 and the high-frequency circuit module 30D in the Z direction. The first antenna substrate 25 is a so-called interposer substrate.

[0163] The high-frequency circuit module 30D includes a circuit board 33, an RFIC 31 (high-frequency circuit) disposed on the circuit board 33, a chip component 36, a molding resin 32 covering the RFIC 31 and the chip component 36, and a shielding member 34 covering the upper surface and sides of the molding resin 32. The chip component 36 contains components such as resistors, capacitors, and inductors required for the operation of the RFIC 31. In the high-frequency circuit module 30D, the circuit board 33, the high-frequency circuit containing the RFIC 31, the chip component 36, the molding resin 32, and the shielding member 34 are integrally packaged and mounted on the first antenna substrate 25 of the antenna substrate 20A.

[0164] The circuit board 33 of the high-frequency circuit module 30D is mounted on one main surface of the first antenna board 25 via a connection terminal 33a (bump). Additionally, the second antenna board 26 is connected to the other main surface of the first antenna board 25 via a connection terminal 26a (bump). The high-frequency circuit module 30D is electrically connected to the radiating electrode 21A provided on the second antenna board 26 via wiring and pathways (not shown) provided on the first antenna board 25.

[0165] A ground electrode 27 and a wiring 28 are provided on the first antenna substrate 25. The ground electrode 27 and the wiring 28 are located in the inner layer of the first antenna substrate 25. In addition, the thickness of the first antenna substrate 25 is made thinner than that of the second antenna substrate 26.

[0166] The material used for the dielectric layer of the first antenna substrate 25 may be any one or more of the following: low-temperature co-fired ceramic (LTCC), glass epoxy resin, liquid crystal polymer (LCP), fluoropolymer, polyimide resin, etc. For example, the first antenna substrate 25 may use a liquid crystal polymer. The ground electrode 27 and the wiring 28 are the same as the ground electrode 22 and wiring 23 of the antenna substrate 20 described above, and are formed of a conductive metallic material.

[0167] A radiating electrode 21A is provided on the second antenna substrate 26. The radiating electrode 21A is located on the lower surface of the second antenna substrate 26 (the side opposite to the first antenna substrate 25). The dielectric layer of the second antenna substrate 26 can be made of the same material as the antenna substrate 20 described above. Furthermore, the radiating electrode 21A can be made of the same material as the radiating electrode 21 of the antenna substrate 20 described above.

[0168] like Figure 24 As shown, the antenna module 10R has multiple second antenna substrates 26-1, 26-2, 26-3, 26-4, and 26-5. These multiple second antenna substrates 26-1, 26-2, 26-3, 26-4, and 26-5 are arranged along the Y-direction on another main surface of the first antenna substrate 25. Furthermore, each of the multiple second antenna substrates 26-1, 26-2, 26-3, 26-4, and 26-5 is provided with a radiating electrode 21A.

[0169] Furthermore, in the following description, unless it is necessary to distinguish between multiple second antenna substrates 26-1, 26-2, 26-3, 26-4, and 26-5, they will only be referred to as second antenna substrate 26.

[0170] In the antenna module 10R of this embodiment, the first substrate side 25s1, the second substrate side 25s2, the third substrate side 25s3 and the fourth substrate side 25s4 of the first antenna substrate 25 correspond to the first substrate side 20s1, the second substrate side 20s2, the third substrate side 20s3 and the fourth substrate side 20s4 of the antenna substrate 20.

[0171] When viewed from above, the first substrate side surface 25s1 of the first antenna substrate 25 is located on the same plane as the first side surface 30s1 of the high-frequency circuit module 30D, or overlaps with the high-frequency circuit module 30D and is located inward of the first side surface 30s1. Furthermore, at least the second substrate side surface 25s2 and the third substrate side surface 25s3 of the first antenna substrate 25 are located in a region that does not overlap with the high-frequency circuit module 30D when viewed from above. The second substrate side surface 25s2 is located outward of the second side surface 30s2 of the high-frequency circuit module 30D in the X direction. The third substrate side surface 25s3 is located outward of the third side surface 30s3 of the high-frequency circuit module 30D in the Y direction.

[0172] Therefore, in the antenna module 10R of this embodiment, the dimensional accuracy can also be improved in the same way as in the embodiments described above.

[0173] Furthermore, the antenna module 10R of this embodiment has a first antenna substrate 25 that relays the second antenna substrate 26, which is provided with radiating electrodes 21, and the high-frequency circuit module 30D. This increases the degree of freedom in the material and size of the second antenna substrate 26, the size of the radiating electrodes 21, etc. Therefore, it is possible to achieve high performance and wide bandwidth for the antenna module 10R.

[0174] For example, the material of the second antenna substrate 26 can be different from that of the first antenna substrate 25, and multiple second antenna substrates 26 can be easily mounted on a single first antenna substrate 25. Even when the number and arrangement pitch of the second antenna substrates 26 (radiating electrodes 21) differ, the high-frequency circuit module 30D can be reliably connected to multiple second antenna substrates 26 via the first antenna substrate 25. Furthermore, even when the number and arrangement pitch of the connection terminals 33a (bumps) of the high-frequency circuit module 30D differ from those of the connection terminals 26a (bumps) of the second antenna substrate 26, the high-frequency circuit module 30D can still be reliably connected to the second antenna substrate 26 via the first antenna substrate 25.

[0175] The first antenna substrate 25 is, for example, a thin, flexible substrate formed of a liquid crystal polymer. Therefore, even when stress is applied to the antenna module 10R, stress concentration at the first antenna substrate 25 can be suppressed, thus preventing damage such as breakage of the first antenna substrate 25.

[0176] Furthermore, the structure of the antenna module 10R in this embodiment is merely an example and can be appropriately modified. For example, the structure of the high-frequency circuit module 30D is not limited to... Figure 23 and Figure 24 The example shown could also be any of the aforementioned high-frequency circuit modules 30, 30A, 30B, and 30C. Additionally, Figure 23 and Figure 24 The structures of the first antenna substrate 25 and the second antenna substrate 26 shown are merely examples and can be modified appropriately.

[0177] (Example 13)

[0178] Figure 25 This is a cross-sectional view of the antenna module of the 13th variation, cut along the Y direction. For example... Figure 25 As shown, the antenna module 10S of the 13th variation differs from the 7th embodiment described above in that the arrangement of the plurality of wirings 28 on the first antenna substrate 25 along the Y direction is different. Specifically, the plurality of wirings 28 are respectively provided corresponding to the plurality of second antenna substrates 26-1, 26-2, 26-3, 26-4, and 26-5 arranged along the Y direction. The patterns and quantities of wiring and electrodes on the first antenna substrate 25 can be appropriately changed.

[0179] (Example 14)

[0180] Figure 26 This is a cross-sectional view of the antenna module of the 14th variation, cut along the Y direction. For example... Figure 26 As shown, the antenna module 10T of the 14th variation differs from the 7th embodiment described above in that the three second antenna substrates 26-1, 26-2, and 26-3 are arranged along the Y direction. Two radiation electrodes 21A are provided on the second antenna substrates 26-1 and 26-2, respectively, arranged along the Y direction. One radiation electrode 21A is provided on the second antenna substrate 26-3.

[0181] (Example 15)

[0182] Figure 27 This is a cross-sectional view of the antenna module of the 15th variation, cut along the Y direction. For example... Figure 27 As shown, the antenna module 10U of the 15th modification differs from the 7th embodiment described above in that it has a structure with a second antenna substrate 26. That is, in the 15th modification, a second antenna substrate 26 is connected to another main surface of a first antenna substrate 25. In addition, in the second antenna substrate 26, a plurality of radiating electrodes 21A are arranged along the Y direction.

[0183] As shown in the 14th and 15th modifications, the number of second antenna substrates 26 connected to the first antenna substrate 25 and the number of radiating electrodes 21A provided on the second antenna substrate 26 can be appropriately varied according to the characteristics required by the antenna module. The number of second antenna substrates 26 connected to one first antenna substrate 25 can be, for example, two, four, or six or more. Furthermore, the total number of radiating electrodes 21A can be four or less, or six or more.

[0184] Furthermore, the above-described embodiments are provided for ease of understanding of the invention and are not intended to limit the scope of the invention. The invention can be modified / improved without departing from its spirit, and the invention also includes its equivalents.

[0185] In addition, this disclosure can also adopt the following structure.

[0186] (1) An antenna module, comprising: an antenna substrate having at least one radiating electrode; and a high-frequency circuit module mounted on the antenna substrate, wherein the high-frequency circuit module is rectangular in shape with two long sides and two short sides when viewed from above, having a first side and a second side corresponding to the two long sides, and a third side and a fourth side corresponding to the two short sides, the antenna substrate having a first substrate side, a second substrate side opposite to the first substrate side, and a third substrate side and a fourth substrate side located between the first substrate side and the second substrate side, wherein the first substrate side of the antenna substrate is on the same plane as the first side of the high-frequency circuit module when viewed from above, or overlaps with the high-frequency circuit module and is located inward of the first side, and at least one of the second substrate side, the third substrate side and the fourth substrate side of the antenna substrate is located in a region that does not overlap with the high-frequency circuit module when viewed from above.

[0187] (2) The antenna module according to (1), wherein the high-frequency circuit module comprises: a circuit board; a high-frequency circuit including an RFIC disposed on the circuit board; a molding resin covering the high-frequency circuit; and a shield covering the upper surface and side surface of the molding resin.

[0188] (3) The antenna module according to (1), wherein the high-frequency circuit module comprises: a high-frequency circuit including an RFIC; a molding resin covering the high-frequency circuit; and a shield covering the upper surface and side surface of the molding resin.

[0189] (4) The antenna module according to (2) or (3), wherein the high-frequency circuit further comprises at least one of other ICs and chip components different from the RFIC.

[0190] (5) An antenna module according to any one of (1) to (4), wherein the antenna substrate has an antenna element different from the radiating electrode, and the antenna element has a directional radiating pattern in a direction parallel to the surface of the antenna substrate.

[0191] (6) An antenna module according to any one of (1) to (5), wherein the antenna substrate has an electrode in at least one of the surface layer and the inner layer, and the electrode disposed in at least one of the surface layer and the inner layer is exposed from the substrate side of the antenna substrate.

[0192] (7) An antenna module according to any one of (1) to (6), wherein the antenna substrate has a ground electrode disposed in an inner layer, the ground electrode being exposed from the substrate side of the antenna substrate.

[0193] (8) The antenna module according to any one of (1) to (7), wherein the end face of the radiating electrode disposed on the antenna substrate is located on the same side of the antenna substrate.

[0194] (9) The antenna module according to (7), wherein the antenna substrate has wiring disposed in the inner layer and connected to the ground electrode, the wiring being exposed from the side of the antenna substrate.

[0195] (10) An antenna module according to any one of (1) to (5), wherein the antenna substrate has electrodes in a surface layer and an inner layer, and the electrodes in the surface layer and the inner layer are respectively located inward of the substrate side of the antenna substrate.

[0196] (11) The antenna module according to any one of (1) to (10), wherein the first substrate side and the second substrate side of the antenna substrate are located on the same plane as the first side and the second side of the high frequency circuit module when viewed from above, or are located in a position that is more inward than the first side and the second side.

[0197] (12) The antenna module according to any one of (1) to (11), wherein the antenna module has a resin layer disposed between the antenna substrate and the high-frequency circuit module.

[0198] (13) The antenna module according to (12), wherein the resin layer is disposed between the antenna substrate and the high-frequency circuit module and on the substrate side of the antenna substrate.

[0199] (14) The antenna module according to any one of (1) to (12), wherein the antenna module has an insulating layer disposed on the substrate side of the antenna substrate and formed of a material different from the antenna substrate.

[0200] (15) The antenna module according to (6), wherein the antenna module has a coating that covers the electrodes exposed from the substrate side of the antenna substrate.

[0201] (16) The antenna module according to any one of (1) to (15), wherein the first substrate side and the second substrate side of the antenna substrate are tapered.

[0202] (17) A method for manufacturing an antenna module, wherein the antenna module comprises: an antenna substrate having at least one radiating electrode, having a first substrate side, a second substrate side opposite to the first substrate side, a third substrate side and a fourth substrate side located between the first substrate side and the second substrate side; and a high-frequency circuit module mounted on the antenna substrate, which is rectangular in shape with two long sides and two short sides when viewed from above, the manufacturing method comprising the following steps: cutting the antenna substrate along the first substrate side; and mounting the high-frequency circuit module on the antenna substrate such that the cut first substrate side is located in the same plane as the first side of the high-frequency circuit module corresponding to the long side when viewed from above, or overlaps with the high-frequency circuit module and is located in a position closer to the inside of the first side.

[0203] (18) The method of manufacturing an antenna module according to (17) includes the following steps: cutting along at least one of the second substrate side, the third substrate side and the fourth substrate side of the antenna substrate on which the high-frequency circuit module is mounted.

[0204] (19) The antenna module according to (1), wherein the antenna substrate comprises: a first antenna substrate on which the high-frequency circuit module is mounted; and a second antenna substrate having the radiating electrode, the first antenna substrate having a first substrate side side, a second substrate side side, a third substrate side side and a fourth substrate side side.

[0205] (20) The antenna module according to (19), wherein a plurality of the second antenna substrates are connected to the first antenna substrate, and at least one of the radiation electrodes is disposed on each of the plurality of the second antenna substrates.

[0206] Explanation of reference numerals in the attached figures

[0207] 10, 10A, 10B, 10C, 10D, 10E, 10F, 10G, 10H, 10I, 10J, 10K, 10L, 10M, 10N, 10O, 10P, 10Q, 10R, 10S, 10T, 10U, Antenna Module; 20, 20A, Antenna Substrate; 20a, First Main Surface; 20b, Second Main Surface; 20s1, 25s1, Side Surface of First Substrate; 20s2, 25s2, Side Surface of Second Substrate; 20s3, 25s3, Side Surface of Third Substrate; 20s4, 25s4, Side Surface of Fourth Substrate; 21, 21A, Radiation Electrode; 21e 22e, 23e, end face; 22, grounding electrode; 23, wiring; 24, path; 25, first antenna substrate; 26, second antenna substrate; 30, 30A, 30B, 30C, 30D, high-frequency circuit module; 30s1, first side; 30s2, second side; 30s3, third side; 30s4, fourth side; 31, RFIC; 32, molding resin; 33, circuit board; 34, shielding; 35, power IC; 36, chip component; 40, connector; 41, antenna element; 50, 50A, resin layer; 51, insulating layer; 52, plating.

Claims

1. An antenna module, wherein, This antenna module includes: Antenna substrate having at least one radiating electrode; and The high-frequency circuit module is mounted on the antenna substrate. The high-frequency circuit module, when viewed from above, is rectangular with two long sides and two short sides, and has a first side and a second side corresponding to the two long sides, and a third side and a fourth side corresponding to the two short sides. The antenna substrate has a first substrate side surface, a second substrate side surface opposite to the first substrate side surface, a third substrate side surface and a fourth substrate side surface located between the first substrate side surface and the second substrate side surface. The first substrate side of the antenna substrate, when viewed from above, is located on the same plane as the first side of the high-frequency circuit module, or overlaps with the high-frequency circuit module and is located on a position further inward than the first side. At least one of the second substrate side, the third substrate side, and the fourth substrate side of the antenna substrate is located in an area that does not overlap with the high-frequency circuit module when viewed from above.

2. The antenna module according to claim 1, wherein, The high-frequency circuit module includes: Circuit board; A high-frequency circuit, including an RFIC, is disposed on the circuit board; Molded resin covering the high-frequency circuit; and A shielding element that covers the upper surface and sides of the molded resin.

3. The antenna module according to claim 1, wherein, The high-frequency circuit module includes: High-frequency circuits, which include RFICs; Molded resin covering the high-frequency circuit; and A shielding element that covers the upper surface and sides of the molded resin.

4. The antenna module according to claim 2 or 3, wherein, The high-frequency circuit also includes at least one of other ICs and chip components that are different from the RFIC.

5. The antenna module according to any one of claims 1 to 4, wherein, The antenna substrate has antenna elements that are different from the radiating electrodes. The antenna element has a directional radiation pattern in a direction parallel to the surface of the antenna substrate.

6. The antenna module according to any one of claims 1 to 5, wherein, The antenna substrate has electrodes in at least one of its surface and inner layers. The electrodes, located in at least one of the surface layer and the inner layer, are exposed from the side of the antenna substrate.

7. The antenna module according to any one of claims 1 to 6, wherein, The antenna substrate has a ground electrode located on the inner layer. The grounding electrode is exposed from the side of the antenna substrate.

8. The antenna module according to any one of claims 1 to 7, wherein, The end face of the radiating electrode on the antenna substrate is located on the same side of the antenna substrate.

9. The antenna module according to claim 7, wherein, The antenna substrate has wiring disposed in the inner layer and connected to the ground electrode. The wiring is exposed from the side of the antenna substrate.

10. The antenna module according to any one of claims 1 to 5, wherein, The antenna substrate has electrodes on its surface and inner layers. The electrodes on the surface layer and the inner layer are respectively located on the inner side of the substrate of the antenna substrate.

11. The antenna module according to any one of claims 1 to 10, wherein, The first substrate side and the second substrate side of the antenna substrate, when viewed from above, are located on the same plane as the first side and the second side of the high-frequency circuit module, or are located inwards from the first side and the second side.

12. The antenna module according to any one of claims 1 to 11, wherein, The antenna module has a resin layer disposed between the antenna substrate and the high-frequency circuit module.

13. The antenna module according to claim 12, wherein, The resin layer is disposed between the antenna substrate and the high-frequency circuit module and on the side of the antenna substrate.

14. The antenna module according to any one of claims 1 to 12, wherein, The antenna module has an insulating layer disposed on the side of the antenna substrate and formed of a material different from that of the antenna substrate.

15. The antenna module according to claim 6, wherein, The antenna module has a coating that covers the electrodes exposed from the side of the antenna substrate.

16. The antenna module according to any one of claims 1 to 15, wherein, The first substrate side and the second substrate side of the antenna substrate are tapered and inclined.

17. A method for manufacturing an antenna module, wherein, The antenna module includes: an antenna substrate having at least one radiating electrode, a first substrate side, a second substrate side opposite to the first substrate side, a third substrate side and a fourth substrate side located between the first substrate side and the second substrate side; and a high-frequency circuit module mounted on the antenna substrate, which, when viewed from above, is rectangular with two long sides and two short sides. The manufacturing method includes the following steps: The antenna substrate is cut along the side of the first substrate; and The high-frequency circuit module is mounted on the antenna substrate in such a way that, when viewed from above, the side of the first substrate after the antenna substrate is cut is located in the same plane as the first side of the high-frequency circuit module corresponding to the long side, or overlaps with the high-frequency circuit module and is located in a position that is more inward than the first side.

18. The method for manufacturing an antenna module according to claim 17, wherein, The manufacturing method includes the following steps: cutting along at least one of the second substrate side, the third substrate side, and the fourth substrate side of the antenna substrate on which the high-frequency circuit module is mounted.

19. The antenna module according to claim 1, wherein, The antenna substrate comprises: A first antenna substrate, on which the high-frequency circuit module is mounted; and The second antenna substrate is provided with the aforementioned radiating electrodes. The first antenna substrate has a first substrate side surface, a second substrate side surface, a third substrate side surface, and a fourth substrate side surface.

20. The antenna module according to claim 19, wherein, Multiple second antenna substrates are connected to the first antenna substrate. At least one of the radiation electrodes is disposed on each of the plurality of the second antenna substrates.

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