Multi-protocol compatible high speed connector front end adaptive dynamic impedance matching system

Abstract

This invention relates to the field of electronic communication connector technology, specifically to a multi-protocol compatible high-speed connector front-end adaptive dynamic impedance matching system. The system includes a signal transmission channel, a tunable dynamic impedance matching module, a signal detection module, a protocol identification unit, and a central control unit. Based on feedback data from the signal detection module, the central control unit calculates the optimal impedance parameters using a simulated annealing algorithm and outputs control signals to the coarse and fine adjustment units. This allows the input impedance of the high-speed connector after connecting a load to be dynamically adjusted within the target range of the corresponding protocol. This addresses the technical problem that existing fixed-impedance connectors cannot simultaneously and perfectly match different protocol standards, and cannot cope with dynamic impedance drift in high-frequency environments.

Description

Technical Field

[0001] This invention relates to the field of electronic communication connector technology, and more specifically to a multi-protocol compatible high-speed connector front-end adaptive dynamic impedance matching system. Background Technology

[0002] With the explosive growth of big data, cloud computing, and artificial intelligence technologies, the demand for internal interconnect bandwidth in data centers is increasing exponentially. As two mainstream high-speed serial interface standards, SAS and PCIe are constantly evolving in terms of transmission rates. The SAS-4 standard has reached 24 Gbps, while PCIe 5.0 and 6.0 have achieved data transmission rates of 32 GT / s and 64 GT / s, respectively.

[0003] At extremely high frequencies, the characteristic impedance matching of signal transmission lines becomes a critical factor determining the integrity of the link signal. The reflection coefficient is defined by the following formula:

[0004]

[0005] in, For load impedance, This is the characteristic impedance of the transmission line.

[0006] However, the two protocols specify different characteristic impedances for physical layer transmission lines: the standard characteristic impedance for the SAS protocol is 100Ω, while the standard characteristic impedance for the PCIe protocol is 85Ω. Traditional compatible designs often employ a compromise, selecting an impedance value of around 92Ω in the connector and PCB design to attempt to accommodate both.

[0007] The prior art CN105278411A discloses a CAN bus adaptive matching module, which operates at a frequency only in the MHz range and uses simple resistor switching. This pure resistor matching cannot eliminate the influence of parasitic reactance at high frequencies and cannot handle the skin effect and dispersion problems in the GHz band.

[0008] Patent CN120090591A proposes an L-type reconfigurable network, but it is designed for ultrasonic drives (kHz to MHz level), and its inductor array uses relay switching, which cannot respond to the rapid fluctuations of GHz signals in the ns level time, and cannot withstand the stringent requirements of high-speed differential signals for group delay consistency.

[0009] In summary, there is currently a lack of an adaptive solution that can be integrated into the connector front end, cover a wide frequency band of 8-22 GHz, and simultaneously compensate for resistance mismatch and reactance parasitics. This invention addresses this need by proposing a high-speed electrical connector front end adaptive dynamic impedance matching unit based on a three-stage cascaded network and simulated annealing algorithm.

[0010] However, in real-world high-speed applications, this static intermediate value solution faces significant challenges: 1. High-frequency loss and reflection: As the signal frequency increases and the rise time becomes steeper, any small impedance discontinuity will lead to serious return loss. 92Ω has about 8% mismatch for 85Ω or 100Ω systems, which is not negligible at high frequencies.

[0011] 2. Dynamic impedance drift: In actual working conditions, the actual impedance of a connector is not constant. It will drift due to temperature changes, mechanical stress, and manufacturing tolerances of different signal ports.

[0012] 3. Multi-rate adaptability: During the training process, the same link will undergo a negotiation process from low speed to high speed. The sensitivity to impedance matching is different at different rates, and the static matching network cannot maintain optimal performance at all rates.

[0013] Therefore, there is an urgent need for a connector front-end impedance matching system that can meet the stringent requirements of next-generation high-speed signal transmission for low latency, high stability and low bit error rate, and solve the impedance difference and dynamic drift problem between multiple protocols in real time. Summary of the Invention

[0014] In order to overcome the shortcomings and deficiencies of the existing technology, the purpose of this invention is to provide a multi-protocol compatible high-speed connector front-end adaptive dynamic impedance matching system to solve the technical problems that existing fixed impedance connectors cannot perfectly match different protocol standards at the same time and cannot cope with dynamic impedance drift in high-frequency environments.

[0015] This invention is achieved through the following technical solution: In a first aspect, the present invention discloses a multi-protocol compatible high-speed connector front-end adaptive dynamic impedance matching system, comprising: The signal transmission channel is used to transmit differential signals and can carry multi-protocol data streams with different nominal characteristic impedance requirements; A tunable dynamic impedance matching module is connected in series to the front end of the signal transmission channel; the matching module includes a coarse adjustment unit formed by a combination of discrete capacitor arrays controlled by radio frequency switches, and a fine adjustment unit formed by a combination of continuously adjustable capacitors composed of varactor diodes. The signal detection module is used to detect the return loss or reflection coefficient in the signal link in real time. The protocol identification unit is used to monitor the characteristic signals of the load to identify the current transmission protocol type. The central control unit has a built-in analog annealing algorithm and is connected to the signal detection module, the tunable dynamic impedance matching module, and the protocol identification unit respectively. The control unit calculates the optimal impedance parameters using a simulated annealing algorithm based on feedback data from the signal detection module, and outputs control signals to the coarse adjustment unit and the fine adjustment unit, so that the input impedance of the high-speed connector after connecting the load is dynamically adjusted within the target range of the corresponding protocol.

[0016] In conjunction with the first aspect, the tunable dynamic impedance matching module is further described as a reconfigurable three-stage cascade. The topology is a type where the adjustable reactance element is composed of the coarse adjustment unit and the fine adjustment unit connected in parallel.

[0017] In conjunction with the first aspect, the radio frequency switch is further described as a MEMS radio frequency switch or an SOI radio frequency switch.

[0018] In conjunction with the first aspect, the continuously adjustable capacitor further includes two varactor diodes in reverse series configuration, with the cathodes of the two varactor diodes connected as a common bias point to receive an external DC bias voltage. The anodes of the two varactor diodes are connected to the radio frequency signal path and radio frequency ground, respectively, to cancel the odd-order nonlinear components in the capacitance-voltage characteristic curve.

[0019] In conjunction with the first aspect, the system further includes a directional coupler, an amplitude-phase detector, or a logarithmic detector; The signal detection module is coupled to the signal transmission channel via a directional coupler; The amplitude-phase detector or logarithmic detector is used to simultaneously acquire the amplitude or phase information of the reflection coefficient, and convert the high-frequency reflection signal into a voltage signal representing the reflection coefficient and send it to the central control unit to assist the simulated annealing algorithm in determining the search direction.

[0020] In conjunction with the first aspect, the protocol identification unit is further connected to the sideband signal pin of the physical layer interface.

[0021] Secondly, this invention discloses a dynamic impedance matching method, the system being based on the dynamic impedance matching method, which includes the following steps: S1. Monitor signal characteristics on the signal transmission channel to identify the current transmission protocol and the current signal transmission rate; S2. Based on the identification results, preset the tunable dynamic impedance matching module to the nominal characteristic impedance value corresponding to this protocol; S3. The reflection coefficient of the current signal link is measured in real time through the signal detection module; S4. If the measured reflection coefficient exceeds the preset threshold, start the simulated annealing algorithm to perform impedance tuning and find the global optimal solution; S5. Lock the matching module in the optimal state and continuously monitor impedance drift; when environmental changes or changes in transmission rate cause mismatch to exceed the threshold, return to step S3.

[0022] In conjunction with the second aspect, furthermore, in step S4, the specific process of impedance tuning using the simulated annealing algorithm is as follows: S4.1. Define the objective function as minimizing the reflection coefficient and set the initial annealing temperature; S4.2. Generate random perturbations based on the current impedance parameters to generate new switching state combinations and varactor diode bias voltages; S4.3. Calculate or measure the change in the reflection coefficient under the new condition; S4.4. According to the Metropolis criterion: if the performance improves, the new state is accepted unconditionally; if the performance deteriorates, the new state is accepted with a probability function, which includes the current annealing temperature variable. S4.5. Reduce the annealing temperature by a preset ratio, and repeat steps S4.2 to S4.4 until the convergence condition is met or the minimum temperature is reached.

[0023] In conjunction with the second aspect, further step S4 employs a hierarchical mechanism based on a random perturbation strategy: During the high-temperature phase of the algorithm, the RF switch state of the coarse adjustment unit is mainly disturbed to perform a global large-scale search. In the low-temperature phase of the algorithm, the voltage of the varactor diode in the fine-tuning unit is mainly perturbed to achieve local high-precision approximation.

[0024] In conjunction with the second aspect, the method further includes a rapid response mechanism for dynamic changes in the signal: When a signal data rate jump is detected or the link is retrained, the control unit directly calls the impedance parameters optimized for that rate or protocol that are pre-stored in the lookup table as the initial solution for a new round of simulated annealing optimization.

[0025] The beneficial effects of this invention are: 1. Protocol Adaptability: Seamlessly supports 85 without manual intervention or hardware replacement on the same interface. PCIe devices and 100 SAS equipment greatly improves the versatility of high-speed connectors; 2. High linearity and low noise: By combining capacitors and reverse series varactors, the harmonic distortion under large signals is minimized while ensuring a wide tuning range, thus meeting the stringent signal-to-noise ratio requirements of high-speed serial signals. 3. Global optimal convergence: Simulated annealing effectively overcomes the shortcomings of traditional gradient algorithms that are prone to getting trapped in local optima, ensuring that the best matching point can still be found in complex parasitic parameter environments, maximizing link margin. Attached Figure Description

[0026] The present invention will be further described with reference to the accompanying drawings, but the embodiments in the drawings do not constitute any limitation on the present invention. For those skilled in the art, other drawings can be obtained based on the following drawings without creative effort.

[0027] Figure 1 This is a block diagram of the architecture of a high-speed connector front-end adaptive dynamic impedance matching system in one embodiment of the present invention.

[0028] Figure 2 This is a three-stage cascade of a tunable dynamic impedance matching module in one embodiment of the present invention. Schematic diagram of a type circuit topology.

[0029] Figure 3 This is a schematic diagram of the coarse adjustment unit in one embodiment of the present invention.

[0030] Figure 4 This is a schematic diagram of the fine-tuning unit in one embodiment of the present invention.

[0031] Figure 5 This is a partial control flowchart of dynamic impedance matching based on simulated annealing algorithm in one embodiment of the present invention.

[0032] Figure 6 This is a partial control flowchart of dynamic impedance matching based on simulated annealing algorithm in one embodiment of the present invention.

[0033] Figure 7 In SAS mode Simulation curves of optimized return loss after extreme mismatch.

[0034] Figure 8 In PCIe mode Simulation curves of optimized return loss after extreme mismatch. Detailed Implementation

[0035] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0036] like Figures 1 to 4As shown, this embodiment provides a multi-protocol compatible high-speed connector front-end adaptive dynamic impedance matching system. For example... Figure 1 As shown, this system is embedded between the host and the backplane or cable connector. Its core hardware architecture includes: signal transmission channel (RF main link), protocol identification unit, tunable dynamic impedance matching module, signal detection unit, and central control unit.

[0037] The following embodiment will describe in detail the functions and working principles of each module or unit.

[0038] 1. Signal transmission channel and protocol identification mechanism In this embodiment, the signal transmission channel includes a pair of wires for transmitting differential signals. A tunable element is connected to this link, and the channel can carry high-speed data streams of multiple protocols with different nominal characteristic impedance requirements. To achieve seamless compatibility among multiple protocols, the system is configured with a protocol identification unit connected to the sideband signal pin of the physical layer interface. This unit monitors the characteristic signals of the access device to identify the current transmission protocol type. Specifically: when identified as a first-type protocol (such as PCIe), i.e., when the receiver detection pulse sequence or PCIe reset signal specific to the PCIe protocol is detected, the controller sets the target differential impedance of the system to a first preset value (such as 85Ω); when identified as a second-type protocol (such as SAS), i.e., when the out-of-band signal sequence specific to the SAS protocol is detected, the controller sets the target differential impedance of the system to a second preset value (such as 100Ω). This mechanism ensures that the matching network has an accurate initial convergence starting point, significantly shortening the subsequent fine-tuning time.

[0039] 2. Hybrid Tunable Dynamic Impedance Matching Module In this embodiment, the tunable dynamic impedance matching module is connected in series to the front end of the signal transmission channel, specifically positioned between the transceiver and the physical connector. Figure 2 As shown, the matching module adopts a reconfigurable three-level cascaded topology, with its series arm including a fixed inductor and its parallel arm including an adjustable reactance element composed of a coarse adjustment unit and a fine adjustment unit connected in parallel.

[0040] The coarse adjustment unit employs a hybrid architecture, including a discrete capacitor array controlled by an RF switch as the coarse adjustment unit. For example... Figure 3 As shown, the coarse adjustment unit includes a binary-weighted capacitor array and a MEMS RF switch or an SOI RF switch to provide a wide range of discrete impedance coverage. The array consists of four binary-weighted unit capacitors connected in parallel, with each unit capacitor connected in series with an RF switch. The total capacitance value connected to the circuit is directly controlled by a digital control word.

[0041] The fine-tuning unit includes a continuously adjustable capacitor composed of varactor diodes. For example... Figure 4 As shown, to eliminate quantization errors and address nonlinear distortion under large signals, the fine-tuning unit includes a pair of varactor diodes in an inverted series configuration to provide fine, continuous impedance adjustment with high linearity. Specifically, the cathodes of the two varactor diodes are connected as a common bias point to receive an external DC bias voltage (applied through a high-impedance element), while their anodes are connected to the RF signal path and RF ground, respectively. This topology utilizes a push-pull effect: when the RF voltage fluctuates, causing the capacitance of one diode to increase, the capacitance of the other diode decreases, thereby canceling out the odd-order nonlinear components in the capacitance-voltage characteristic curve and significantly reducing third-order intermodulation distortion.

[0042] The core of this system lies in the three-level cascading. Accurate modeling of multi-level networks. To achieve accurate algorithm control, this embodiment utilizes the ABCD matrix from microwave network theory for derivation. The ABCD matrix has the property of cascaded multiplication, making it very suitable for the analysis of such multi-level networks.

[0043] Define the input port voltage and current as The output port is The transmission relationship is then defined as:

[0044] For the basic elements in the network of this invention: Parallel capacitors Admittance Transmission Matrix for:

[0045] Series inductor ,impedance Transmission Matrix for:

[0046] Although this embodiment is a three-level cascade, it can be regarded as the basic one. Combination of type units. Consider a standard single-level... Type network, with a capacitor connected in parallel at the input. Series inductor A capacitor connected in parallel with the output terminal Composition. Its total transmission matrix. The product of the three element matrices in sequence:

[0047]

[0048] The step-by-step calculation is as follows: First, calculate the first two terms:

[0049] Multiply by the third term:

[0050] Expanding matrix multiplication yields a single-level matrix. The ABCD parameter expression for the type network:

[0051] Sorting the matrix elements yields:

[0052] As can be seen from the above formula, Item contains Factor, which indicates Compared to a simple L-shaped network, the L-shaped network has a higher order of adjustment capability in frequency response, thus enabling wider bandwidth matching.

[0053] For this embodiment Figure 1 The three-level cascaded network shown has a total transmission matrix. The chain multiplication of the capacitance matrix and the series inductance matrix at each node is as follows:

[0054]

[0055] When the actual load impedance of the connector is At that time, the input impedance seen from the input terminal It can be accurately calculated using the following formula:

[0056] The FPGA controller of this invention changes the values ​​of the four capacitor arrays in the above matrix. Parameters, thus making Approximating the characteristic impedance of the system To achieve the reflection coefficient Minimize:

[0057] 3. Signal detection and central control optimization The signal detection module is coupled to the signal transmission channel via a highly directional coupler to extract the reflected signal in real time and detect the return loss or reflection coefficient in the signal link. Furthermore, the signal detection module also includes an amplitude-phase detector or a logarithmic detector to convert the extracted signal into a voltage signal representing the reflection coefficient, while simultaneously acquiring the amplitude or phase information of the reflection coefficient to assist the simulated annealing algorithm in determining the search direction for impedance optimization.

[0058] Central control unit: Connected to both the signal detection module and the matching module. The central control unit (e.g., an FPGA controller) incorporates a broadband matching algorithm engine based on simulated annealing, used to search for the globally optimal impedance point in a multi-dimensional parameter space. The enhanced configuration allows the system to escape local minima. The control unit receives the reflection coefficient from the signal detection module as an energy function and calculates the optimal impedance parameters using an analog annealing algorithm. Subsequently, the controller outputs two control signals: one is a 4-bit digital signal that coarsely adjusts the switching state of the capacitor array; the other is an analog voltage signal converted from digital to analog (DAC) that finely adjusts the bias voltage of the reverse-series varactor diode. Ultimately, this dynamically adjusts the input impedance of the high-speed electrical connector to approach the target range of 85 to 100 Ω, minimizing the reflection coefficient. ).

[0059] 4. Workflow of the Dynamic Impedance Matching Method Based on Simulated Annealing Algorithm This embodiment also provides a dynamic impedance matching method based on the above system, used to optimize the performance of high-speed electrical connectors compatible with multiple protocols. For example... Figure 5 and Figure 6 As shown, the dynamic matching method and algorithm logic specifically include the following steps: S1. Protocol and Rate Identification: Monitors signal characteristics on high-speed signal transmission channels to identify whether the current transmission protocol is SAS or PCIe, and the current signal transmission rate. After system power-on, it detects the current protocol through sideband signals or link training.

[0060] S2. Initial State Setting: Based on the identification results, the tunable dynamic impedance matching module is preset to the nominal characteristic impedance value of the protocol. For PCIe devices, the controller looks up the preset table and sets the coarse adjustment switch array to a state close to 85Ω; for SAS devices, it is set to a state close to 100Ω. This mechanism provides the algorithm with an accurate initial convergence starting point.

[0061] S3. Real-time detection: The reflection coefficient of the current signal link is measured in real time through the signal detection module.

[0062] S4. Simulated Annealing Optimization: If the measured reflection coefficient exceeds a preset threshold, the simulated annealing algorithm is activated to perform impedance tuning and find the global optimal solution. The simulated annealing algorithm built into the control unit simulates the thermodynamic process of metal annealing, introducing the temperature (T) parameter. The specific impedance tuning process is as follows: S4.1: Define the objective function as minimizing the reflection coefficient and set a relatively high initial annealing temperature.

[0063] S4.2: Based on the current impedance parameters, random perturbations are generated to produce new switching state combinations and varactor diode bias voltages. To improve optimization efficiency, the random perturbation strategy adopts a hierarchical mechanism: in the high-temperature phase of the algorithm, the RF switching state of the coarse-tuning unit is mainly perturbed to perform a wide-range search; in the low-temperature phase of the algorithm, the varactor diode voltage of the fine-tuning unit is mainly perturbed to perform a local high-precision approximation.

[0064] S4.3: Calculate or measure the change in reflection coefficient under the new state. Read the reflection coefficient fed back by the detection unit as the energy function of the system.

[0065] S4.4: According to the Metropolis criterion: if the reflection coefficient of the new state decreases (performance improves), the new state is accepted unconditionally; if the reflection coefficient of the new state increases (performance deteriorates), the new state is accepted with a probability function, which includes the current annealing temperature variable. In the early stages of optimization (high-temperature stage), the system has a higher probability of accepting the inferior solution, which allows the algorithm to tolerate temporary performance degradation and thus escape the local minimum trap.

[0066] S4.5: Reduce the annealing temperature by a preset ratio (e.g., 0.9~0.99), and repeat steps S4.2 to S4.4 until the convergence condition is met or the minimum temperature is reached. As the temperature decreases, the probability of the system accepting the differential solution gradually approaches zero, and eventually converges to the globally optimal impedance matching point (minimum reflection coefficient).

[0067] S5. State Locking and Monitoring: The matching module is locked in the optimal state, and impedance drift is continuously monitored. When the algorithm converges, the system enters a low-power monitoring mode. When environmental changes or transmission rate changes cause mismatch (such as when VSWR deteriorates beyond a set threshold), a small-scale local search is retried, and the process returns to step S3.

[0068] 5. Fast response mechanism for signal transitions Furthermore, to address the complex state transitions in real-world links, the method includes a rapid response mechanism for dynamic signal changes. When a jump in signal data rate or link renegotiation training is detected, the control unit does not need to start global optimization from scratch. Instead, it directly calls the impedance parameters optimized for that rate or protocol and stored in a lookup table as the initial solution for a new round of simulated annealing optimization.

[0069] Through the above embodiments, the present invention can significantly reduce signal reflection in high-speed interconnect systems, enabling a single connector hardware to perfectly adapt to protocols with two different impedance standards, SAS and PCIe, and achieving low-latency, high-reliability data transmission. Figure 7 and Figure 8 The simulation curves fully verify the excellent optimization effect of the present invention on extreme mismatch return loss in SAS mode and PCIe mode.

[0070] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit the scope of protection of the present invention. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the essence and scope of the technical solutions of the present invention.

Claims

1. A high-speed connector front-end adaptive dynamic impedance matching system compatible with multiple protocols, characterized in that, include: The signal transmission channel is used to transmit differential signals and can carry multi-protocol data streams with different nominal characteristic impedance requirements; A tunable dynamic impedance matching module is connected in series to the front end of the signal transmission channel; the tunable dynamic impedance matching module includes a coarse adjustment unit formed by a combination of discrete capacitor arrays controlled by radio frequency switches, and a fine adjustment unit formed by a combination of continuously adjustable capacitors composed of varactor diodes. The signal detection module is used to detect the return loss or reflection coefficient in the signal link in real time. The protocol identification unit is used to monitor the characteristic signals of the load to identify the current transmission protocol type. The central control unit has a built-in analog annealing algorithm and is connected to the signal detection module, the tunable dynamic impedance matching module, and the protocol identification unit respectively. The central control unit calculates the optimal impedance parameters using a simulated annealing algorithm based on feedback data from the signal detection module, and outputs control signals to the coarse adjustment unit and the fine adjustment unit, so that the input impedance of the high-speed connector after connecting the load is dynamically adjusted within the target range of the corresponding protocol.

2. The high-speed connector front-end adaptive dynamic impedance matching system according to claim 1, characterized in that, The tunable dynamic impedance matching module is a reconfigurable three-stage cascade. The topology is a type where the adjustable reactance element is composed of the coarse adjustment unit and the fine adjustment unit connected in parallel.

3. The high-speed connector front-end adaptive dynamic impedance matching system according to claim 1, characterized in that, The radio frequency switch is a MEMS radio frequency switch or an SOI radio frequency switch.

4. The high-speed connector front-end adaptive dynamic impedance matching system according to claim 1, characterized in that, The continuously adjustable capacitor includes two varactor diodes in reverse series configuration, with the cathodes of the two varactor diodes connected as a common bias point to receive an external DC bias voltage. The anodes of the two varactor diodes are connected to the radio frequency signal path and radio frequency ground, respectively, to cancel the odd-order nonlinear components in the capacitance-voltage characteristic curve.

5. The high-speed connector front-end adaptive dynamic impedance matching system according to claim 1, characterized in that, The system also includes a directional coupler, an amplitude-phase detector, or a logarithmic detector; The signal detection module is coupled to the signal transmission channel via a directional coupler; The amplitude-phase detector or logarithmic detector is used to simultaneously acquire the amplitude or phase information of the reflection coefficient, and convert the high-frequency reflection signal into a voltage signal representing the reflection coefficient and send it to the central control unit to assist the simulated annealing algorithm in determining the search direction.

6. The high-speed connector front-end adaptive dynamic impedance matching system according to claim 1, characterized in that, The protocol identification unit is connected to the sideband signal pin of the physical layer interface.

7. The high-speed connector front-end adaptive dynamic impedance matching system according to any one of claims 1-6, characterized in that, The system operates based on a dynamic impedance matching method, which includes the following steps: S1. Monitor signal characteristics on the signal transmission channel to identify the current transmission protocol and the current signal transmission rate; S2. Based on the identification results, preset the tunable dynamic impedance matching module to the nominal characteristic impedance value corresponding to this protocol; S3. The reflection coefficient of the current signal link is measured in real time through the signal detection module; S4. If the measured reflection coefficient exceeds the preset threshold, start the simulated annealing algorithm to perform impedance tuning and find the global optimal solution; S5. Lock the matching module in the optimal state and continuously monitor impedance drift; when environmental changes or changes in transmission rate cause mismatch to exceed the threshold, return to step S3.

8. The high-speed connector front-end adaptive dynamic impedance matching system according to claim 7, characterized in that, In step S4, the specific process of impedance tuning using the simulated annealing algorithm is as follows: S4.

1. Define the objective function as minimizing the reflection coefficient and set the initial annealing temperature; S4.

2. Generate random perturbations based on the current impedance parameters to generate new switching state combinations and varactor diode bias voltages; S4.

3. Calculate or measure the change in the reflection coefficient under the new condition; S4.

4. According to the Metropolis criterion: if performance improves, the new state is unconditionally accepted; If performance deteriorates, a new state is accepted using a probability function, which includes the current annealing temperature variable. S4.

5. Reduce the annealing temperature by a preset ratio, and repeat steps S4.2 to S4.4 until the convergence condition is met or the minimum temperature is reached.

9. The high-speed connector front-end adaptive dynamic impedance matching system according to claim 7, characterized in that, Step S4 employs a hierarchical mechanism based on a random perturbation strategy: During the high-temperature phase of the algorithm, the RF switch state of the coarse adjustment unit is mainly disturbed to perform a global large-scale search. In the low-temperature phase of the algorithm, the voltage of the varactor diode in the fine-tuning unit is mainly perturbed to achieve local high-precision approximation.

10. The high-speed connector front-end adaptive dynamic impedance matching system according to claim 7, characterized in that, The method further includes a rapid response mechanism for dynamic changes in the signal: When a signal data rate jump is detected or the link is retrained, the control unit directly calls the impedance parameters optimized for that rate or protocol that are pre-stored in the lookup table as the initial solution for a new round of simulated annealing optimization.

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