Inductive device and electronic device

Abstract

This application relates to an inductor and an electronic device. The inductor includes a magnetic body and a coil, the coil being disposed within the magnetic body, and at least one electrode being provided at one end of the coil. The electrode includes a first electrode portion and a second electrode portion. A portion of the first electrode portion is embedded within the magnetic body, and a portion of the first electrode portion is exposed outside the magnetic body. The second electrode portion is connected to the outer surface of the magnetic body and is connected to the portion of the first electrode portion exposed outside the magnetic body. The area S1 of the projection of the first electrode portion along a first direction and the area S2 of the projection of the second electrode portion along the first direction satisfy: 10% ≤ S1 / (S1+S2) ≤ 40%; wherein, the first direction is the thickness direction of the inductor. The inductor and electronic device of this application can effectively avoid the problem of electrode detachment and improve the service life and reliability of the inductor.

Description

Technical Field

[0001] This application relates to the field of inductor technology, and more particularly to an inductor device and an electronic device. Background Technology

[0002] Molded inductors, as electronic components with high integration, low electromagnetic interference, and excellent heat dissipation, have been widely used in new energy vehicles, consumer electronics, and industrial power supplies. Currently, the industry commonly uses electroplating to fabricate the electrodes of inductor devices. Specifically, a window is first created in the insulating layer covering the magnetic material, exposing a portion of the coil segment at its end and the surrounding magnetic material. Electroplating is then performed at the window location, forming a metal layer that covers the exposed portion of the coil segment and magnetic material, thus creating an electrode. This electrode enables the coil to connect to the external circuit. However, inductor devices using this technology suffer from poor electrode stability and a tendency for electrodes to detach, affecting the reliability of the inductor products. Summary of the Invention

[0003] The purpose of this application is to provide an inductor and electronic device that can effectively avoid the problem of electrode detachment and improve the service life and reliability of the inductor.

[0004] To achieve the above objectives, in a first aspect, this application provides an inductor device, comprising: Magnetic bodies; and A coil is disposed within a magnetic body, and at least one electrode is provided at the end of the coil. The electrode includes a first electrode portion and a second electrode portion. Part of the structure of the first electrode portion is embedded in the magnetic body, and part of the structure is exposed outside the magnetic body. The second electrode portion is connected to the outer surface of the magnetic body and is connected to the part of the first electrode portion that is exposed outside the magnetic body. Wherein, the area S1 of the projection of the first electrode portion along the first direction and the area S2 of the projection of the second electrode portion along the first direction satisfy: 10%≤S1 / (S1+S2)≤40%; wherein, the first direction is the thickness direction of the inductor.

[0005] Secondly, this application provides an inductor device, comprising: Magnetic bodies; and A coil is disposed within the magnetic body, and at least one electrode is provided at the end of the coil. The electrode includes a first electrode portion and a second electrode portion. A portion of the structure of the first electrode portion is embedded within the magnetic body, and a portion of the structure is exposed outside the magnetic body. The second electrode portion is connected to the outer surface of the magnetic body and is connected to the portion of the first electrode portion that is exposed outside the magnetic body. The margin between the outer edge of the second electrode portion and the outer surface edge of the magnet is L, which satisfies: 40 micrometers ≤ L ≤ 160 micrometers.

[0006] As an optional implementation, the outer surface of the magnetic body is a side surface along a first direction, and the outer surface of the magnetic body has two first sides along a second direction and two second sides along a third direction; The second electrode portion includes two portions, which are spaced apart along the second direction, and the two second electrode portions are respectively disposed adjacent to the first side; The second electrode portion has the margin amount near the outer edge of the first side in the second direction to the first side, and / or the second electrode portion has the margin amount near the outer edge of the second side in the third direction to the second side; The second direction and the third direction are perpendicular to the first direction.

[0007] As an optional implementation, the area S1 of the projection of the first electrode portion along the first direction and the area S2 of the projection of the second electrode portion along the first direction satisfy: 20%≤S1 / (S1+S2)≤40%.

[0008] As an optional implementation, the value of S1 / (S1+S2) is 20%, 25%, or 30%.

[0009] As an optional implementation, the surface of the first electrode portion exposed to the outside of the magnet includes a connecting end face and at least one first connecting side face, the connecting end face being located on the end side of the first electrode portion away from the magnet, and the first connecting side face being arranged circumferentially around the outer contour of the connecting end face. The second electrode completely covers each of the first connecting sides of the first electrode.

[0010] As an optional implementation, the minimum distance m1 between the outer contour edge of the projection of the first electrode portion along the first direction and the outer contour edge of the projection of the second electrode portion along the first direction satisfies: 5 micrometers ≤ m1 ≤ 30 micrometers.

[0011] As an optional implementation, the top surface of the second electrode portion facing away from the magnetic body is flush with the connecting end surface of the first electrode portion; and / or The surface of the first electrode portion embedded in the magnetic body includes a bottom end face, which is disposed opposite to the connecting end face, and an insulating film is sandwiched between the bottom end face and the magnetic body, and the second electrode portion is in contact with the magnetic body.

[0012] As an optional implementation, the projections of the first electrode portion and the second electrode portion along the first direction are combined to form a rectangle, and a set of adjacent sides of the rectangle are parallel to the second direction and the third direction, respectively. The extension dimension d1 of the first electrode portion along the second direction is 0.3 mm, and the extension dimension d2 of the first electrode portion along the third direction is 1 mm; The extension dimension h1 of the second electrode part along the second direction is 0.8 mm, and the extension dimension h2 of the second electrode part along the third direction is 2 mm; In this configuration, the second direction and the third direction are perpendicular to the first direction, and the size of the inductor along the second direction is larger than the size of the inductor along the third direction.

[0013] As an optional implementation, the extension dimension d2 of the first electrode portion along the third direction satisfies the following relationship with the extension dimension d0 of the inductor device along the third direction: 20%≤d2 / d0≤50%, where the third direction is perpendicular to the first direction.

[0014] As an optional implementation, the thickness W2 of the second electrode portion along the first direction satisfies: 8 micrometers ≤ W2 ≤ 15 micrometers.

[0015] As an optional implementation, the thickness W1 of the first electrode portion along the first direction satisfies: 24 micrometers ≤ W1 ≤ 302 micrometers.

[0016] As an optional implementation, the thickness W4 of the portion of the first electrode embedded in the magnetic body along the first direction satisfies: 5 micrometers ≤ W4 ≤ 20 micrometers.

[0017] As an optional implementation, the inductor also includes a connecting metal, which is disposed in a one-to-one correspondence with the electrodes, and the connecting metal includes a first metal layer and a second metal layer of different materials, which are sequentially stacked on the electrodes along the direction away from the magnetic body.

[0018] As an optional implementation, the first metal layer comprises nickel and the second metal layer comprises tin; The thickness W11 of the first metal layer satisfies: 2 micrometers ≤ W11 ≤ 7 micrometers; The thickness W12 of the second metal layer satisfies: 5 micrometers ≤ W12 ≤ 10 micrometers.

[0019] As an alternative implementation, the inductor also includes an insulating covering layer that wraps around the outer surface of the magnetic body, excluding the area covered by the electrodes.

[0020] Thirdly, this application discloses an electronic device including the aforementioned inductor.

[0021] Compared with the prior art, the beneficial effects of this application are: In this embodiment, by comprising a first electrode portion and a second electrode portion, with a portion of the first electrode portion embedded within the magnetic body and a portion exposed outside the magnetic body, and the second electrode portion connected to the outer surface of the magnetic body and connected to the exposed portion of the first electrode portion outside the magnetic body, the connection strength between the electrode and the magnetic body can be improved. This is because the connection between the second electrode portion and the exposed portion of the first electrode portion outside the magnetic body makes the second electrode portion and the first electrode portion a single unit, and the bonding force between the second electrode portion and the magnetic body is stronger than that between the first electrode portion and the magnetic body. Therefore, the connection between the second electrode portion and the magnetic body reinforces the connection between the first electrode portion and the magnetic body.

[0022] Furthermore, if the area S1 of the projection of the first electrode portion along the first direction and the area S2 of the projection of the second electrode portion along the first direction satisfy: 10% ≤ S1 / (S1+S2) ≤ 40%, the connection strength between the electrode and the magnetic body can be further improved. This is because, if the above condition is met, the area of ​​the second electrode portion, which has a stronger bond with the magnetic body, can account for a larger proportion, while the area of ​​the first electrode portion, which has a weaker bond with the magnetic body, can account for a smaller proportion. The second electrode portion can stably constrain the first electrode portion to the preset position of the magnetic body through its strong bond with the magnetic body, thus compensating for the deficiency of the direct bond between the first electrode portion and the magnetic body and achieving reliable fixation of the first electrode portion on the magnetic body. Furthermore, because the bond between the second electrode portion and the magnetic body is strong, when the inductor is subjected to external impact, the second electrode portion can transfer stress through its connection with the magnetic body, avoiding stress concentration at the contact surface between the first electrode portion and the electrode, thereby effectively preventing the entire electrode from separating from the magnetic body.

[0023] Furthermore, if the value of S1 / (S1+S2) is greater than 40%, in other words, the proportion of the first electrode portion is too large, resulting in a smaller effective bonding area between the second electrode portion and the magnetic body. The anchoring force of the first electrode portion relative to the magnetic body is insufficient, making it prone to separation from the magnetic body upon impact, thus causing the entire electrode to easily separate from the magnetic body. On the other hand, if the value of S1 / (S1+S2) is less than 10%, the size of the first electrode portion is too small, requiring higher process specifications and potentially increasing the open-circuit ratio of the final inductor device. This application, by controlling the value of S1 / (S1+S2) between 10% and 40%, ensures the bonding area between the second electrode portion and the magnetic body, effectively preventing the problem of electrode and magnetic body separation and detachment. This improves both the lifespan of the inductor device and the stability of the electrical connection. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the structure of the inductor provided in the embodiments of this application; Figure 2 This is a bottom view of the inductor device provided in the embodiments of this application; Figure 3 This is a partial cross-sectional view of the edge position of the electrode in the inductor provided in the embodiment of this application; Figure 4 This is a schematic diagram of another structure of the inductor device provided in the embodiments of this application; Figure 5 This is a schematic diagram of another structure of the inductor device provided in the embodiments of this application; Figure 6 yes Figure 5 Top view; Figure 7 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application; Figure 8 This is a schematic diagram of the fabrication process of the inductor device provided in the embodiments of this application.

[0026] Explanation of reference numerals in the attached figures: 100. Inductive devices; 10. Magnetic body; 10. First surface; 102. Second surface; 103. Third surface; 104. Fourth surface; 105. Fifth surface; 106. Sixth surface; 1020. First edge; 1021. Second edge; 1022. Recess; 20. Coil; 21. Coil segment; 30. Electrode; 31. First electrode portion; 311. Connecting end face; 312. First connecting side face; 313. Bottom end face; 314. Second connecting side face; 32. Second electrode portion; 321. Top end surface; 40. Base; 41. First structure; 42. Second structure; 50. Insulating coating layer; 51. Window; 60. PCB circuit board; 70. Insulating film; 80. Connecting metal; 81. First metal layer; 82. Second metal layer; F, first direction; S, second direction; T, third direction. Detailed Implementation

[0027] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application. When the following description refers to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements.

[0028] In this application, the terms "upper," "lower," "left," "right," "front," "rear," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0029] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0030] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0031] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, components, or parts (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, components, or parts. Unless otherwise stated, "a plurality of" means two or more.

[0032] Molded inductors, as electronic components with high integration, low electromagnetic interference, and excellent heat dissipation, have been widely used in new energy vehicles, consumer electronics, and industrial power supplies. In the manufacturing process of molded inductors, electrode fabrication is one of the core processes that determines the product's electrical performance, structural stability, and service life.

[0033] Currently, the industry commonly uses electroplating to prepare the electrodes of integrally molded inductors. In practice, a window is first made in the insulating layer covering the magnetic material, exposing part of the coil segment at the end of the coil and the magnetic material around the coil segment. Then, electroplating is performed at the window position, and the metal layer formed by electroplating covers the exposed part of the coil segment and the magnetic material to form an electrode. The electrode is used to achieve electrical connection between the coil and the external circuit.

[0034] The aforementioned technologies utilize electroplating to form the electrodes, a process with high maturity that can, to some extent, meet the conductivity requirements of integrally molded inductors, thus finding widespread application in the industry. However, these inductors suffer from poor electrode stability and a tendency for electrodes to detach. Specifically, when subjected to external impacts (such as vibrations during product transportation or mechanical stress during installation), or thermal expansion and contraction caused by cyclical temperature changes during long-term use, gaps can easily form between the electrodes and the magnetic material, leading to electrode detachment and affecting the reliability of the inductor.

[0035] In view of this, this application provides an inductor and an electronic device, which ensures that the area S1 of the projection of the first electrode portion along the first direction and the area S2 of the projection of the second electrode portion along the first direction satisfy: 10%≤S1 / (S1+S2)≤40%, thereby ensuring both sufficient electrical connection performance and connection strength.

[0036] The inductor device of the present application will be described below with reference to the accompanying drawings.

[0037] Example 1 Figure 1 This is a schematic diagram of the structure of the inductor 100 provided in the embodiments of this application. Figure 2 This is a bottom view of the inductor device 100 provided in an embodiment of this application. Figure 3 This is a partial cross-sectional view of the edge position of the electrode 30 in the inductor device 100 provided in this embodiment of the application. Figure 1 In the example, for ease of observation, the coil 20, electrode 30, and base 40 inside the inductor 100 are moved out to... Figure 1 An example is shown in the upper right corner of the drawing. Figure 2 In the example, the second electrode portion 32 of the electrode 30 in the inductor device 100 is removed and displayed. Figure 2 The right side of the image.

[0038] Please combine Figure 1 , Figure 2 and Figure 3 For reference, the inductor 100 provided in the embodiments of this application includes: a magnetic body 10 and a coil 20.

[0039] A coil 20 is disposed within a magnetic body 10, and at least one electrode 30 is provided at the end of the coil 20. The electrode 30 includes a first electrode portion 31 and a second electrode portion 32. Part of the structure of the first electrode portion 31 is embedded within the magnetic body 10, and part of the structure is exposed outside the magnetic body 10. The second electrode portion 32 is connected to the outer surface of the magnetic body 10 and is connected to the portion of the first electrode portion 31 that is exposed outside the magnetic body 10. The area S1 of the projection of the first electrode portion 31 along the first direction F and the area S2 of the projection of the second electrode portion 32 along the first direction F satisfy: 10% ≤ S1 / (S1+S2) ≤ 40%; where the first direction F is the thickness direction of the inductor 100.

[0040] In this embodiment, by including a first electrode portion 31 and a second electrode portion 32 in the electrode 30, with a portion of the first electrode portion 31 embedded within the magnetic body 10 and a portion exposed outside the magnetic body 10, and the second electrode portion 32 connected to the outer surface of the magnetic body 10 and connected to the portion of the first electrode portion 31 exposed outside the magnetic body 10, the connection strength between the electrode 30 and the magnetic body 10 can be improved. This is because the connection between the second electrode portion 32 and the portion of the first electrode portion 31 exposed outside the magnetic body 10 makes the second electrode portion 32 and the first electrode portion 31 connected as a whole, and the bonding force between the second electrode portion 32 and the magnetic body 10 is stronger than that between the first electrode portion 31 and the magnetic body 10. The connection between the second electrode portion 32 and the magnetic body 10 can reinforce the connection between the first electrode portion 31 and the magnetic body 10.

[0041] Furthermore, if the area S1 of the projection of the first electrode portion 31 along the first direction F and the area S2 of the projection of the second electrode portion 32 along the first direction F satisfy 10%≤S1 / (S1+S2)≤40%, the connection strength between the electrode 30 and the magnetic body 10 can be further improved. This is because if the above conditions are met, the area of ​​the second electrode portion 32, which has a stronger bonding force with the magnetic body 10, is larger, while the area of ​​the first electrode portion 31, which has a weaker bonding force with the magnetic body 10, is smaller. The second electrode portion 32 can stably constrain the first electrode portion 31 to the preset position of the magnetic body 10 through its strong bonding force with the magnetic body 10, thus compensating for the deficiency of the direct bonding force between the first electrode portion 31 and the magnetic body 10, and achieving reliable fixation of the first electrode portion 31 on the magnetic body 10. Furthermore, because the second electrode portion 32 has a strong bond with the magnetic body 10, when the inductor device 100 is subjected to an external force impact, the second electrode portion 32 can transfer stress through its connection with the magnetic body 10, thereby preventing stress concentration at the contact surface between the first electrode portion 31 and the electrode 30, and effectively preventing the electrode 30 from separating from the magnetic body 10 as a whole.

[0042] Furthermore, if the value of S1 / (S1+S2) is greater than 40%, in other words, the proportion of the first electrode portion 31 is too large, the effective bonding area between the second electrode portion 32 and the magnetic body 10 is small, and the anchoring force of the first electrode portion 31 relative to the magnetic body 10 is insufficient. Under impact, the first electrode portion 31 is prone to separating from the magnetic body 10, thus causing the entire electrode 30 to easily separate from the magnetic body 10. On the other hand, if the value of S1 / (S1+S2) is less than 10%, the size of the first electrode portion 31 is too small, which requires higher process specifications and is likely to increase the open circuit ratio of the final inductor device 100. This application controls the value of S1 / (S1+S2) between 10% and 40%, which not only ensures the bonding area between the second electrode portion 32 and the magnetic body 10, but also effectively avoids the problem of the electrode 30 separating from the magnetic body 10 and falling off. This not only improves the service life of the inductor device 100, but also improves the electrical connection stability.

[0043] In this embodiment, the magnetic body 10 is a basic component in the inductor device 100 used to carry the coil 20, and is usually made of magnetic material, such as magnetic powder, which can be formed by pressing.

[0044] The inductor 100 may further include a base 40, which includes a first structure 41 and a second structure 42 connected to each other. The first structure 41 may be, for example, a columnar member, and the second structure 42 may be, for example, a plate-like member. One end of the first structure 41 is connected to one surface of the second structure 42. The main body of the coil 20 may be wound around the first structure 41, and a portion of the coil 20 near its end extends to the back of the second structure 42, that is, the side facing away from the first structure 41. In this way, the base 40 can serve as a positioning component for the coil 20, facilitating the formation of a magnetic body 10 on the outside of the coil 20 by pressing. In addition, the relative position of the electrodes 30 in the magnetic body 10 can also be controlled by the dimensions of the base 40. For example, the coil 20 may have two electrodes 30, and the distance between the two electrodes 30 can be adjusted by the second structure 42. The electrode 30 is supported on the surface of the second structure 42 that is opposite to the first structure 41. The position of the electrode 30 in the magnetic body 10 along the first direction F can also be adjusted by changing the thickness of the second structure 42.

[0045] Additionally, coil 20 may include a metal core and an insulating film 70 wrapped around the metal core (e.g., ...). Figure 3 As shown, the insulating film 70 is used to achieve insulation between the metal core and the magnetic body 10, avoiding problems such as leakage. The insulating film 70 can be, for example, enameled wire. The thickness of the insulating film 70 is approximately 0.005mm-0.02mm.

[0046] In this embodiment of the application, the inductor 100 is a single-phase inductor, with each phase including two electrodes 30, as an example. In the example where the inductor 100 is a multi-phase inductor, the number of electrodes 30 can be multiple, as long as at least one set of corresponding first electrode portion 31 and second electrode portion 32 satisfies 10%≤S1 / (S1+S2)≤40%.

[0047] Furthermore, the partial embedding of the first electrode portion 31 within the magnetic body 10 and the partial exposure of its structure to the outside of the magnetic body 10 means that the first electrode portion 31 is not completely embedded within the magnetic body 10, with a portion of its structure protruding outside. The second electrode portion 32 is connected to the outer surface of the magnetic body 10, meaning that the second electrode portion 32 is tightly connected to the outer surface of the magnetic body 10. For example, the second electrode portion 32 can be connected to the outer surface of the magnetic body 10 through electroplating to ensure good adhesion between the second electrode portion 32 and the magnetic body 10. The connection between the second electrode portion 32 and the exposed portion of the first electrode portion 31 to the outside of the magnetic body 10 can also be achieved, for example, by electroplating the second electrode portion 32 to the first electrode portion 31. This ensures good adhesion between the second electrode portion 32 and the first electrode portion 31, thereby reinforcing the connection between the first electrode portion 31 and the magnetic body 10 through a reliable connection between the second electrode portion 32 and the magnetic body 10.

[0048] In this embodiment of the application, the projection of the first electrode portion 31 and the second electrode portion 32 along the first direction F can be, for example, projecting the first electrode portion 31 and the second electrode portion 32 along the first direction F onto a plane perpendicular to the first direction F, and obtaining the area S1 of the projection of the first electrode portion 31 and the area S2 of the projection of the second electrode portion 32 from the projection on the plane.

[0049] In this embodiment of the application, the area S1 of the projection of the first electrode portion 31 along the first direction F and the area S2 of the projection of the second electrode portion 32 along the first direction F satisfy: 20% ≤ S1 / (S1+S2) ≤ 40%. Preferably, the value of S1 / (S1+S2) is 20%, 25%, or 30%.

[0050] In this embodiment of the application, for ease of explanation, a second direction S and a third direction T, both perpendicular to the first direction F, are defined. The dimension of the inductor 100 along the second direction S is greater than the dimension of the inductor 100 along the third direction T. For example, the second direction S may be the length direction of the inductor 100, and the third direction T may be the width direction of the inductor 100.

[0051] Figure 4 This is a schematic diagram of another structure of the inductor device provided in an embodiment of this application. Please refer to the embodiments in this application. Figure 2 , Figure 3 and Figure 4 The surface of the first electrode portion 31 exposed outside the magnetic body 10 includes connecting end faces 311 and at least one first connecting side face 312 that are connected to each other. The connecting end faces 311 are located on the end side of the first electrode portion 31 facing away from the magnetic body 10, and the first connecting side faces 312 are arranged continuously circumferentially around the outer contour of the connecting end faces 311. The second electrode portion 32 completely covers each of the first connecting side faces 312 of the first electrode portion 31 (e.g., Figure 4 As shown, this allows for a larger contact area between the second electrode portion 32 and the first electrode portion 31, resulting in a better anchoring effect of the second electrode portion 32 on the first electrode portion 31.

[0052] Please combine Figure 1 and Figure 3 The surface of the first electrode portion 31 embedded in the magnetic body 10 includes a bottom end surface 313, which is disposed opposite to the connecting end surface 311. An insulating film 70 is sandwiched between the bottom end surface 313 and the magnetic body 10, and the insulating film 70 serves as insulation between the first electrode portion 31 and the magnetic body 10. The second electrode portion 32 is in direct contact with the magnetic body 10 and does not have an insulating film, thus ensuring better bonding between the second electrode portion 32 and the magnetic body 10. In other words, along the first direction F, an insulating film 70 is provided between the first electrode portion 31 and the magnetic body 10, but no insulating film 70 is provided between the second electrode portion and the magnetic body 10.

[0053] In some embodiments, the first electrode portion 31 further includes a second connecting side surface 314 that is connected to the bottom end surface 313. The second connecting side surface 314 corresponds one-to-one with the first connecting side surface 312, and the corresponding first connecting side surface 312 and second connecting side surface 314 are connected to each other along the direction from the connecting end surface 311 to the bottom end surface 313 (i.e., the first direction F) to jointly define the side surface of the first electrode portion 31.

[0054] Furthermore, there are multiple second connecting sides 314, one of which is constructed as a cut surface that is directly in contact with the magnetic body 10. Among the multiple second connecting sides 314, the insulating film 70 mentioned above is sandwiched between the other second connecting sides 314 (excluding the cut surface) and the magnetic body 10.

[0055] In the embodiments of this application, such as Figure 2 As shown, one edge of the first electrode portion 31 may coincide with one edge of the second electrode portion 32. Alternatively, it may be as follows: Figure 4 As shown, the minimum distance m1 between the outer contour edge of the projection of the first electrode portion 31 along the first direction F and the outer contour edge of the projection of the second electrode portion 32 along the first direction F satisfies: 5 micrometers ≤ m1 ≤ 30 micrometers. Preferably, m1 is 10 micrometers, 15 micrometers, or 20 micrometers.

[0056] If the minimum spacing m1 is less than 5 micrometers, the edge of the first electrode portion 31 is too close to the edge of the second electrode portion 32. This can easily lead to a narrow width of the portion of the second electrode portion 32 filling the space between the edge of the first electrode portion 31 and the edge of the window 51. Not only is the connection strength between this portion and the magnetic body 10 insufficient, but this portion is also prone to damage. This would expose part of the structure of the first electrode portion 31 directly, making it susceptible to metal oxidation. Therefore, the minimum spacing m1 needs to be greater than or equal to 5 micrometers. In this case, the spacing between the edge of the first electrode portion 31 and the edge of the window 51 is more suitable, and the portion of the second electrode portion 32 filling the space between the edge of the first electrode portion 31 and the edge of the window 51 can meet the structural strength requirements while also avoiding the problem of metal exposure of the first electrode portion 31 due to damage to this portion.

[0057] In addition, m1 needs to be less than or equal to 30 micrometers to ensure that the requirement of 10%≤S1 / (S1+S2)≤40% is met. This is because the size of the second electrode part 32 is determined by the size of the pads on the PCB circuit board 60 connected to the client. Therefore, the size of the outer contour of the second electrode part 32 is generally relatively fixed. Thus, when the area of ​​the window 51 is fixed (that is, when the sum of the area S2 of the projection of the second electrode part 32 along the first direction F and the area S1 of the projection of the first electrode part 31 along the first direction F is fixed), when m1 is greater than 30 micrometers, it may cause the area S1 of the projection of the first electrode part 31 along the first direction F to be smaller, and thus fail to meet the requirement of 10%≤S1 / (S1+S2)≤40%.

[0058] In summary, when the minimum spacing m1 satisfies 5 micrometers ≤ m1 ≤ 30 micrometers, the portion of the second electrode portion 32 that fills the space between the edge of the first electrode portion 31 and the inner edge of the window 51 can meet the structural strength requirements and avoid the problem of metal exposure of the first electrode portion 31 due to damage to this portion. In addition, it can also ensure that the first electrode portion 31 has sufficient area to meet the requirement of 10% ≤ S1 / (S1+S2) ≤ 40%.

[0059] In this embodiment, the top surface 321 of the second electrode portion 32 facing away from the magnetic body 10 can be flush with the connecting end surface 311 of the first electrode portion 31. Here, "flush" means approximately flush, which facilitates better soldering of the electrode 30 to the pads of the PCB circuit board.

[0060] In some embodiments, please combine Figure 2 and Figure 4Referring to the diagram, the projections of the first electrode portion 31 and the second electrode portion 32 along the first direction F are combined to form a rectangle, and a set of adjacent sides of the rectangle are parallel to the second direction S and the third direction T, respectively. Figure 4 In the example, the second electrode portion 32 completely surrounds the first electrode portion.

[0061] The first electrode portion 31 has an extension dimension d1 of 0.3 mm along the second direction S and an extension dimension d2 of 1 mm along the third direction T. The second electrode portion 32 has an extension dimension h1 of 0.8 mm along the second direction S and an extension dimension h2 of 2 mm along the third direction T. Thus, S1 = 0.3, S2 = 1.3, and the value of S1 / (S1+S2) is 18.75%.

[0062] In this embodiment of the application, the extension dimension d2 of the first electrode portion 31 along the third direction T and the extension dimension d0 of the inductor 100 along the third direction T satisfy the following condition: 20%≤d2 / d0≤50%.

[0063] Please combine Figure 1 and Figure 4 Referring to the previous description, a portion of the coil segment at the end of the coil 20 extends to the side of the second structure 42 opposite to the first structure 41, forming a part of the first electrode portion 31. In practice, during manufacturing, the coil segment at the end of the coil 20 is left with a length allowance exceeding the target length. After the coil 20 is wound on the base 40, the coil segment at the end of the coil 20 is cut as needed, and the remaining portion serves as part of the first electrode portion 31. The length of the cut coil segment along the third direction T needs to be within a preset range; that is, the extension dimension d2 of the first electrode portion 31 along the third direction T needs to satisfy the following relationship with the extension dimension d0 of the inductor 100 along the third direction T: 20% ≤ d2 / d0 ≤ 50%, preferably 30% or 40%. If the value of d2 / d0 is greater than 50%, the area of ​​the first electrode portion 31 will be too large. After the second electrode portion 32 is soldered to the PCB circuit board 60, the electrode 30 is prone to separation from the magnetic body 10, causing the PCB circuit board 60 and the inductor 100 to detach, resulting in poor product reliability. If the value of d2 / d0 is less than 20%, the size of the first electrode portion 31 is too small, and the cutting position is relatively extreme. During the cutting process of the coil 20, the process requirements are high, the process window is compressed, and the cutting process is prone to deviation, which will lead to an increase in the open circuit ratio of the final inductor 100. When the value of d2 / d0 meets the condition of 20%≤d2 / d0≤50%, the connection strength between the PCB circuit board 60 and the inductor 100 can be guaranteed, improving product reliability, while reducing the open circuit ratio and improving electrical connection stability.

[0064] For example, d2 / d0 can be any value within the above range, such as 22%, 25%, 30%, 40%, 45%, etc.

[0065] Please refer to the embodiments in this application. Figure 3 The thickness W2 of the second electrode portion 32 along the first direction F satisfies: 8 micrometers ≤ W2 ≤ 15 micrometers. Preferably, it is 10 micrometers, 11 micrometers, or 12 micrometers. In this way, the second electrode portion 32 can form a continuous coverage of the first connecting side 312 at the junction of the first electrode portion 31 and the second electrode portion 32, resulting in better electrical stability of the electrode 30.

[0066] Specifically, if W2 is less than 8 micrometers, it cannot fully cover the first connecting side 312 of the first electrode portion 31, affecting the conductivity and structural strength of the first electrode portion 31. If W2 is greater than 15 micrometers, it will result in a longer production cycle, increased process costs, and excessive thickness will also lead to poor thickness uniformity of the second electrode portion 32, and may even cause the size of the second electrode portion 32 to exceed design requirements, affecting the assembly compatibility of the inductor device 100 with other electronic components on the PCB circuit board 60. By ensuring that W2 meets the following condition: 5 micrometers ≤ W2 ≤ 15 micrometers, it can fully cover the first connecting side 312 of the first electrode portion 31, improving the connection strength and ensuring electrical connection stability, while also achieving better thickness uniformity of the second electrode portion 32, reducing costs, and improving the assembly compatibility of the inductor device 100 with other electronic components.

[0067] For example, the thickness W2 can be any value in the range of 5 micrometers to 15 micrometers, such as 6 micrometers, 8 micrometers, 10 micrometers, 11 micrometers, 12 micrometers, 13 micrometers, etc.

[0068] In this embodiment, the thickness W1 of the first electrode portion 31 along the first direction F satisfies: 24 micrometers ≤ W1 ≤ 302 micrometers. This configuration ensures that while the exposed portion of the first electrode portion 31 has a suitable thickness, it also provides a larger embedded portion within the magnetic body 10, resulting in a stronger bond between the first electrode portion 31 and the magnetic body 10. Specifically, if the thickness of the first electrode portion 31 varies depending on the thickness of the magnetic body 10 along its own thickness direction, the thickness embedded within the magnetic body 10 will also vary. If W1 is greater than 302 micrometers, a larger portion of the first electrode portion 31 will be exposed within the magnetic body 10, making it prone to warping and detachment from the magnetic body 10. If W1 is less than 24 micrometers, a smaller portion of the first electrode portion 31 will be exposed within the magnetic body 10, failing to guarantee sufficient connection strength between the first electrode portion 31 and the magnetic body 10, making it prone to detachment. By ensuring that W1 satisfies the condition that 24 micrometers ≤ W1 ≤ 302 micrometers, the portion of the first electrode 31 exposed outside the magnetic body 10 is moderate, making it less prone to warping, and it also has sufficient connection strength with the magnetic body 10, resulting in a high degree of stability in the connection between the first electrode 31 and the magnetic body 10.

[0069] For example, the thickness W1 can be any value within the range mentioned above, such as 30 micrometers, 50 micrometers, 100 micrometers, 150 micrometers, 200 micrometers, 250 micrometers, 300 micrometers, etc.

[0070] Furthermore, the thickness W4 of the portion of the first electrode portion 31 embedded within the magnetic body 10 along the first direction F satisfies: 5 micrometers ≤ W4 ≤ 20 micrometers. This ensures sufficient connection strength between the first electrode portion 31 and the magnetic body 10. For example, the thickness W4 can be any value within the aforementioned range, such as 6 micrometers, 8 micrometers, 10 micrometers, 12 micrometers, 14 micrometers, 15 micrometers, 18 micrometers, etc.

[0071] To verify the connection reliability of the electrodes 30 of the inductor device 100 of this application, the inventors of this application also conducted drop tests and lateral thrust tests on inductors in related technologies and the inductor device 100 of this application. The test results are recorded in Table 1 below: Table 1: Performance comparison of inductor devices in related technologies and inductor device 100 of this application:

[0072] As shown in Table 1, in the drop test of the related inductors at a height of 1.5m, 8 out of 30 inductors failed. In the drop test of the inductors 100 of this application at a height of 1.5m, 0 out of 30 inductors 100 failed.

[0073] Furthermore, after soldering the inductor to the PCB circuit board 60 and applying a pushing force to the inductor until it just detaches from the PCB circuit board 60, the maximum pushing force that the inductor can withstand when detaching is recorded in Table 1. Table 1 shows that the maximum pushing force that inductors in related technologies can withstand is ≤10N, while the maximum pushing force that the inductor 100 of this application can withstand is ≥15N, representing a 50% performance improvement compared to inductors in related technologies. Therefore, the inductor 100 of this embodiment can effectively avoid the problem of electrode 30 detachment, improve the service life and reliability of the inductor 100, and enhance the stability of the electrical connection.

[0074] Furthermore, this application avoids poor product performance, waste of electroplating materials, and increased time costs caused by limiting the thickness of the second electrode portion 32 to a reasonable range. For example, see Table 2 below, which shows the results of drop tests with different thicknesses of the second electrode portion 32.

[0075] Table 2: Drop results of the inductor device of this application under different thicknesses of the second electrode portion 32.

[0076] In Table 2, a drop test result of "ok" indicates that the tested inductor was undamaged, while "NG" indicates that the tested inductor was damaged. Furthermore, N / NxNG means that out of Nx tested inductors, N inductors were damaged. For example, 4 / 30NG means that out of 30 tested inductors, 4 were damaged, and 11 / 30NG means that out of 30 tested inductors, 11 were damaged.

[0077] As can be seen from Table 2 above, when the thickness of the second electrode part 32 is less than 5μm, for example, 3μm, there is not much problem with drops from heights of 1m and 1.2m. However, when dropped from heights of 1.5m and 1.8m, different degrees of damage occur. For example, when dropped from a height of 1.5m, 3 out of 30 tested inductors are damaged (NG), while when dropped from a height of 1.8m, the number of damaged (NG) inductors reaches 9 out of 30 tested inductors.

[0078] When the thickness of the second electrode 32 is in the range of 5 micrometers to 15 micrometers, the test results show that no damage to the inductor was observed at different test heights of 1m, 1.2m, 1.5m, and 1.8m.

[0079] When the thickness of the second electrode portion 32 exceeds 15 μm, such as 17 μm and 20 μm as shown in Table 2, it can be seen that the test results show damage to the inductor. In particular, the greater the increase in the thickness of the second electrode portion 32, the more severe the damage.

[0080] Therefore, in this application, the thickness of the second electrode portion 32 cannot be too thin or too thick, and is optimally within the range of 5 micrometers to 15 micrometers. If the thickness of the second electrode portion 32 is too thin, less than 5 micrometers, it cannot completely cover the magnetic surface of the inductor, which will lead to discontinuities in the connection of the second electrode portion 32 and affect the product's drop resistance. On the other hand, if the thickness of the second electrode portion 32 is too thick, for example, exceeding 15 micrometers, it may cause increased internal stress, decreased toughness, and poor adhesion of the plating layer of the second electrode portion 32. During drop impact, it is prone to cracking, peeling, or even detachment, resulting in poor electrode conductivity of the inductor, which will also affect the product's drop resistance.

[0081] In this embodiment, the inductor 100 further includes a connecting metal 80, which is disposed one-to-one with the electrodes 30. The connecting metal 80 includes a first metal layer 81 and a second metal layer 82 made of different materials. The first metal layer 81 and the second metal layer 82 are sequentially stacked on the electrodes 30 along the direction away from the magnetic body 10, that is, stacked on the first electrode portion 31 and the second electrode portion 32. The first metal layer 81 focuses on the protective performance of anti-oxidation and anti-corrosion, while the second metal layer 82 focuses on the welding strength with the pads of the PCB circuit board 60, thereby improving the connection reliability, environmental tolerance, and welding reliability of the electrodes 30. Compared with a connecting metal 80 made of a single material, the composite structure of the connecting metal 80 can avoid oxidation and aging of the electrodes caused by external environmental corrosion while ensuring a stable connection with the first electrode portion 31 and the second electrode portion 32, thereby extending the electrical life of the device and improving the connection strength with the PCB circuit board 60. Specifically, the first metal layer 81 includes nickel, and the second metal layer 82 includes tin. The second metal layer 82 serves as a soldering layer and is soldered to the pads on the PCB circuit board 60.

[0082] Furthermore, the thickness W11 of the first metal layer satisfies: 2 micrometers ≤ W11 ≤ 7 micrometers, preferably 4 micrometers, 5 micrometers, or 6 micrometers. The thickness W12 of the second metal layer satisfies: 5 micrometers ≤ W12 ≤ 10 micrometers, preferably 6 micrometers, 7 micrometers, or 8 micrometers.

[0083] When the first metal layer 81 includes nickel, it can protect the electrode 30, provide structural support, and optimize performance. The first metal layer 81 serves as a protective layer, providing protection, structural support, and performance optimization. If the thickness of the first metal layer 81 is less than 2 micrometers, it cannot provide adequate protection for the electrode 30. Furthermore, since the material of the first metal layer 81 differs from that of the electrode 30, their coefficients of thermal expansion also differ. If the thickness of the first metal layer 81 is greater than 7 micrometers, the volume effect caused by the thickness can easily lead to gaps between the electrode 30 and the first metal layer 81, increasing the risk of open circuits in the electrode 30. If the thickness W11 of the first metal layer 81 satisfies the condition: 2 micrometers ≤ W11 ≤ 7 micrometers, it can provide good protection for the electrode 30 and also ensure good bonding between the first metal layer 81 and the electrode 30, increasing the stability of the electrical connection.

[0084] When the second metal layer 82 includes tin, it serves as a solder layer, providing soldering functionality for the inductor 100. If the thickness of the second metal layer 82 is less than 5 micrometers, the soldering reliability between the second electrode portion 32 and the PCB circuit board 60 will be poor, resulting in defects such as cold solder joints and false solder joints. If the thickness of the second metal layer 82 is greater than 10 micrometers, solder balls and solder bridges are easily formed during the soldering process, especially when the spacing between the electrodes 30 of the inductor 100 is small, which increases the risk of short circuits. By ensuring that the thickness W12 of the second metal layer 82 satisfies the condition: 5 micrometers ≤ W12 ≤ 10 micrometers, reliable soldering between the inductor 100 and the PCB circuit board 60 can be achieved, while avoiding solder balls and solder bridges, thus reducing the risk of short circuits.

[0085] In this embodiment, the inductor 100 further includes an insulating covering layer 50, which covers the portion of the outer surface of the magnetic body 10 other than the area covered by the electrode 30.

[0086] In this embodiment, the insulating coating layer 50 covers the outer surface of the magnetic body 10, which can insulate the inductor 100 from the outside world.

[0087] Example 2 Please see Figure 5 and Figure 6 , Figure 5 This is a schematic diagram of the structure of the inductor disclosed in Embodiment 2 of this application. Figure 6 yes Figure 5 A top view. Embodiment 2 of this application also discloses an inductor 100, which comprises a magnetic body 10 and a coil 20.

[0088] The coil 20 is disposed inside the magnetic body 10, and at least one electrode 30 is provided at the end of the coil 20. The electrode 30 includes a first electrode portion 31 and a second electrode portion 32. Part of the structure of the first electrode portion 31 is embedded inside the magnetic body 10, and part of the structure is exposed outside the magnetic body 10. The second electrode portion 32 is connected to the outer surface of the magnetic body 10 and is connected to the part of the first electrode portion 31 that is exposed outside the magnetic body 10.

[0089] The second electrode portion 32 is located on the outer surface of the magnetic body 10, and the margin between the outer edge of the second electrode portion 32 and the outer surface edge of the magnetic body 10 is L, which satisfies: 40 micrometers ≤ L ≤ 160 micrometers.

[0090] In this embodiment, by including a first electrode portion 31 and a second electrode portion 32 in the electrode 30, with a portion of the first electrode portion 31 embedded within the magnetic body 10 and a portion exposed outside the magnetic body 10, and the second electrode portion 32 connected to the outer surface of the magnetic body 10 and connected to the portion of the first electrode portion 31 exposed outside the magnetic body 10, the connection strength between the electrode 30 and the magnetic body 10 can be improved. This is because the connection between the second electrode portion 32 and the portion of the first electrode portion 31 exposed outside the magnetic body 10 makes the second electrode portion 32 and the first electrode portion 31 connected as a whole, and the bonding force between the second electrode portion 32 and the magnetic body 10 is stronger than that between the first electrode portion 31 and the magnetic body 10. The connection between the second electrode portion 32 and the magnetic body 10 can reinforce the connection between the first electrode portion 31 and the magnetic body 10.

[0091] Based on this, considering that the second electrode portion 32 is located on the outer surface of the magnetic body 10, and that the second electrode portion 32 is typically formed on the outer surface of the magnetic body 10 by electroplating, the plating solution usually has a certain creep distance during electroplating. If the second electrode portion 32 is too close to the edge of the outer surface of the magnetic body 10, or even covers the edge of the outer surface of the magnetic body 10, the plating solution may creep to the edge of the outer surface of the magnetic body 10 or even beyond due to insufficient creep distance during electroplating, resulting in insufficient plating solution for forming the second electrode portion 32. When the second electrode portion 32 is electrically connected to an external PCB, poor solder joints are likely to occur. However, if the second electrode portion 32 is too far from the edge of the outer surface of the magnetic body 10, the overall size of the second electrode portion 32 will be compressed while the overall size of the inductor remains unchanged. After connection to the external PCB, problems such as cold solder joints, desoldering, and low adhesion leading to failure in drop tests may occur.

[0092] Based on this, this application also considers the margin L at the edge of the second electrode portion 32 and the outer surface 102 of the magnetic body 10, and limits the margin L to satisfy: 40 micrometers ≤ L ≤ 160 micrometers. The inventors have learned through research that, under normal circumstances, the creep distance of the plating solution is approximately 20 micrometers to 40 micrometers. Therefore, the margin L of this application needs to allow for the creep distance of the plating solution. Thus, on the one hand, the margin L is not too small to meet the creep distance of the plating solution, and on the other hand, the margin L is not too large, so that the second electrode portion 32 has sufficient size to meet the soldering requirements with the external PCB while keeping the overall product size unchanged, and also meets the adhesion requirements of the second electrode portion 32 on the outer surface 102 of the magnetic body 10.

[0093] For example, the margin L can be 40 micrometers, 80 micrometers, 120 micrometers, 160 micrometers, etc.

[0094] In some embodiments, the magnetic body 10 is typically a cuboid, including a first surface 101 and a second surface 102 opposite each other along a first direction F, a third surface 103 and a fourth surface 104 along a second direction S, and a fifth surface 105 and a sixth surface 106 along a third direction T.

[0095] Wherein, the first direction F can be the height direction of the magnetic body 10, the first surface 101 can be the upper surface along the height direction, and the second surface 102 can be the lower surface along the height direction, and the second surface 102 is also the outer surface 102 of the magnetic body 10 mentioned above. In other words, the second electrode portion 32 is disposed on the lower surface of the magnetic body 10.

[0096] The second direction S can be the length direction of the magnetic body 10, and correspondingly, the third direction T can be the width direction of the magnetic body 10.

[0097] In some embodiments, the outer surface 102 of the magnetic body 10 (i.e., the second surface 102 described above) has two opposing first edges 1020 along the second direction S and two opposing edges 1021 along the third direction T. Two second electrode portions 32 are provided, spaced apart along the second direction S. One second electrode portion 32 is disposed near one of the first edges 1020, and the other second electrode portion 32 is disposed near the other first edge 1020.

[0098] Therefore, the second electrode portion has the margin L near the outer edge of the first side 1020 in the second direction S, or the second electrode portion has the margin L near the outer edge of 1021 in the third direction T, or the second electrode portion has the margin L in both the second direction S and the third direction T. Since the outer edge of the second electrode portion is close to the edge of the outer surface 102 of the magnetic body 10, by making the second electrode portion 32 have the margin L in the second direction S and the third direction T, the plating solution can be prevented from creeping to other surfaces of the magnetic body 10, such as the third surface 103, the fourth surface 104, the fifth surface 105, and the sixth surface 106.

[0099] It should be noted that the margin L of the second electrode portion 32 in the second direction S can be equal to or unequal to the margin L of the second electrode portion 32 in the third direction T. The specific margin can be set according to the actual situation, and this embodiment does not make a specific limitation on this.

[0100] To verify the design considerations of the second electrode portion 32 of the inductor device 100 of this application for the margin amount L, the inventors of this application conducted drop tests according to different margin amounts L values, and the test results are recorded in Table 3 below.

[0101] Table 3: Drop test results of the inductor 100 under different margin amounts in this application

[0102] In Table 3 above, "ok" indicates that the tested inductor was undamaged, while "NG" indicates that the tested inductor was damaged. Furthermore, N / NxNG means that out of Nx tested inductors, N inductors were damaged. For example, 2 / 30NG means that out of 30 tested inductors, 2 were damaged, and 9 / 30NG means that out of 30 tested inductors, 9 were damaged, and so on.

[0103] As shown in Table 3 above, when the margin L is within the range of 40 to 160 micrometers, no inductor 100 was damaged in drop tests from different heights. However, when the margin L is higher than 160 micrometers, such as reaching 200 micrometers, 240 micrometers, or even higher, it can be seen that inductor 100 was damaged in the test results. In particular, the larger the margin L, the more severe the damage. For example, with a margin of 240 micrometers, in a 1.8m drop test, as many as 16 out of 30 inductors were damaged (NG), more than half. In contrast, with a margin of 200 micrometers, only 7 out of 30 inductors were damaged in a 1.8m drop test, a significant difference.

[0104] This is because, given a fixed product size, the larger the margin L, the smaller the space left for the plating solution in the second electrode portion 32, resulting in a smaller size of the second electrode portion 32 after plating. This may lead to poor soldering or desoldering, resulting in insufficient adhesion on the outer surface 102 of the magnetic body 10, which in turn makes the second electrode portion 32 prone to falling off.

[0105] Considering that the inductor 100 of this application is a small-sized device, for example, its size is approximately 2.5*2.0*0.8mm, its size in the second direction S is very limited. When two second electrode portions 32 are provided on the outer surface 102, it is easy for the two second electrode portions 32 to short-circuit due to the small distance between them. Based on this, in some embodiments, a recessed portion 1022 can be provided on the outer surface 102 in the direction from the outer surface 102 to the first surface 101, so that the recessed portion 1022 can form an electrode bridge to block the connection between the two second electrode portions 32.

[0106] It is understood that other solutions not mentioned in the embodiments of this application, such as the relevant parameter design and structural design of the first electrode part 31 and the second electrode part 32, as well as other structures of the inductor device 100, can all refer to the description of the aforementioned Embodiment 1, and will not be repeated here.

[0107] Example 3 This application also discloses an inductor device in Embodiment 3. The inductor device includes not only all the technical solutions mentioned in Embodiment 1, but also all the technical solutions mentioned in Embodiment 2. For details, please refer to the description and explanation of Embodiment 1 and Embodiment 2. They will not be repeated here.

[0108] Please see Figure 7 This application also discloses an electronic device 200, including the aforementioned inductor 100. It is understood that this electronic device may include, but is not limited to, smartwatches, mobile phones, smart glasses, in-vehicle devices, etc.

[0109] It is understood that electronic devices having the inductor 100 described above can bring the same or similar beneficial effects as the inductor 100, as can be seen from the description of the foregoing embodiments, which will not be repeated here.

[0110] It is understood that the electronic device may include, but is not limited to, smart wearable devices (such as smartwatches, smart glasses, etc.), mobile phones, tablets, etc. The placement of the inductor in the electronic device can be determined according to the actual structure of the electronic device, and this embodiment does not impose specific limitations on it.

[0111] For example, such as Figure 7 As shown, Figure 7Taking a smartwatch as an example, among which... Figure 7 The dashed box in the figure is only to indicate that the inductor can be used in the phone watch, and does not limit the position of the inductor in the phone watch as shown in the figure, nor does it limit the size of the inductor in the phone watch as shown in the figure.

[0112] Figure 8 is a schematic diagram of the fabrication process of the inductor device provided in the embodiments of this application.

[0113] Please see Figure 8 This application also discloses a method for manufacturing an inductor device, which is used to manufacture the aforementioned inductor device 100.

[0114] The method for manufacturing this inductor includes: Step 1, winding: Please refer to Figure 8 (a) The coil 20 is wound on the base 40, and the coil segment 21 of the coil 20 located at the back of the base 40 is cut to 1 mm.

[0115] Step 2, Compression Molding: Please refer to... Figure 8 (b) Place the structure after winding in step 1 into a mold, add magnetic powder to the mold and press it to form a magnetic body 10, and expose part of the coil segment 21 to the magnetic body 10.

[0116] Step 3, Surface Spraying: Please refer to... Figure 8 (c) An insulating material (such as polyimide or epoxy resin) is sprayed onto the outer side of the magnetic body 10 and the coil section 21 using a spraying process. After coating, the material is placed in a curing oven for curing to form an insulating coating layer 50.

[0117] Step 4, Open the window: Please refer to Figure 8 (d) Using CCD identification and positioning, the product coated with insulating layer 50 is identified and positioned. Part of the insulating layer 50 is removed by laser to form window 51, thereby exposing part of the magnetic body 10 and coil segment 21.

[0118] Step 5, Electroplating: Please refer to... Figure 8(e) The structure formed in step 4 is placed in an electroplating tank, with coil segment 21 as the cathode and pure copper plate as the anode. Electroplating is performed using copper sulfate electroplating solution (copper sulfate concentration of 150g / L-200g / L, sulfuric acid concentration of 50g / L-80g / L) to form an electroplated metal layer, thereby forming the first electrode part 31 and the second electrode part 32. The electroplating current density is controlled at 1 ampere / dm²-3 ampere / dm², and the electroplating time is 10 minutes-30 minutes. The electroplating process parameters are precisely controlled according to the area ratio requirements of the first electrode part 31 and the second electrode part 32 and the thickness requirements of the second electrode part 32 (8 micrometers-15 micrometers). Then, the first metal layer 81 and the second metal layer 82 are formed sequentially by electroplating on the first electrode part 31 and the second electrode part 32 to form the connecting metal 80.

[0119] Step 6, Finished Product: The structure formed in Step 5 is then subjected to subsequent cleaning (rinsing with deionized water) and drying (drying at a temperature of 80℃-100℃ for 10 minutes) to complete the fabrication of the inductor device 100.

[0120] In some embodiments, a thickness and proportion detection step is included after step 5 and before step 6. Specifically, after electroplating is completed in step 5, the product is removed and... Figure 8 (e) The formed structure is cut, and the cross-section of electrode 30 is observed using a metallographic microscope. The thickness of the first electrode portion 31, the thickness of the second electrode portion 32, and the distance from the edge of the first electrode portion 31 to the edge of the second electrode portion 32 are measured, and the value of S1 / (S1+S2) is calculated. If the test results meet all design parameter requirements, it is deemed qualified. If there are any parameter non-compliance issues, the process is returned to the corresponding step for adjustment (for example, if the thickness of the second electrode portion 32 is insufficient, it is re-plated; if the position of the first electrode portion 31 is offset, it is repositioned).

[0121] The inductor 100 manufactured in the above process is soldered to the PCB circuit board 60, and a pushing force of 15N is applied to the inductor 100. No detachment occurs. Furthermore, the inductor 100 is subjected to a drop test at a height of 1.5m. The test results show that the electrode 30 prepared in this embodiment does not detach when subjected to an axial tensile force of 15N. The test meets the requirement of 30 inductor devices 100 participating in the 1.5M drop test with zero failures. Therefore, the inductor 100 of this embodiment can meet the high reliability requirements of smart wearables.

[0122] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0123] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. An inductive device, characterized by include: Magnetic body; as well as A coil is disposed within the magnetic body, and at least one electrode is provided at the end of the coil. The electrode includes a first electrode portion and a second electrode portion. A portion of the structure of the first electrode portion is embedded within the magnetic body, and a portion of the structure is exposed outside the magnetic body. The second electrode portion is connected to the outer surface of the magnetic body and is connected to the portion of the first electrode portion that is exposed outside the magnetic body. The area S1 of the projection of the first electrode portion along the first direction and the area S2 of the projection of the second electrode portion along the first direction satisfy: 10%≤S1 / (S1+S2)≤40%; wherein, the first direction is the thickness direction of the inductor device.

2. An inductor device, characterized in that, include: Magnetic body; as well as A coil is disposed within the magnetic body, and at least one electrode is provided at the end of the coil. The electrode includes a first electrode portion and a second electrode portion. A portion of the structure of the first electrode portion is embedded within the magnetic body, and a portion of the structure is exposed outside the magnetic body. The second electrode portion is connected to the outer surface of the magnetic body and is connected to the portion of the first electrode portion that is exposed outside the magnetic body. The margin between the outer edge of the second electrode portion and the outer surface edge of the magnet is L, which satisfies: 40 micrometers ≤ L ≤ 160 micrometers.

3. The inductor device according to claim 2, characterized in that, The outer surface of the magnetic body is a side surface along a first direction, and the outer surface of the magnetic body has two first sides along a second direction and two second sides along a third direction; The second electrode portion includes two portions, which are spaced apart along the second direction, and the two second electrode portions are respectively disposed adjacent to the first side; The second electrode portion has the margin amount near the outer edge of the first side in the second direction to the first side, and / or the second electrode portion has the margin amount near the outer edge of the second side in the third direction to the second side; The second direction and the third direction are perpendicular to the first direction.

4. The inductor device according to claim 1 or 2, characterized in that, The area S1 of the projection of the first electrode portion along the first direction and the area S2 of the projection of the second electrode portion along the first direction satisfy: 20%≤S1 / (S1+S2)≤40%.

5. The inductor device according to claim 4, characterized in that, The value of S1 / (S1+S2) is: 20%, 25%, or 30%.

6. The inductor device according to claim 1 or 2, characterized in that, The surface of the first electrode portion exposed to the outside of the magnetic body includes a connecting end face and at least one first connecting side face, the connecting end face being located on the end side of the first electrode portion away from the magnetic body, and the first connecting side face being arranged circumferentially around the outer contour of the connecting end face. The second electrode portion completely covers each of the first connecting sides of the first electrode portion.

7. The inductor device according to claim 6, characterized in that, The minimum distance m1 between the outer contour edge of the projection of the first electrode portion along the first direction and the outer contour edge of the projection of the second electrode portion along the first direction satisfies: 5 micrometers ≤ m1 ≤ 30 micrometers.

8. The inductor device according to claim 6, characterized in that, The top surface of the second electrode portion facing away from the magnetic body is flush with the connecting end surface of the first electrode portion; and / or The surface of the first electrode portion embedded in the magnetic body includes a bottom end face, which is disposed opposite to the connecting end face, and an insulating film is sandwiched between the bottom end face and the magnetic body, and the second electrode portion is in contact with the magnetic body.

9. The inductor device according to claim 6, characterized in that, The projections of the first electrode portion and the second electrode portion along the first direction are combined to form a rectangle, and a set of adjacent sides of the rectangle are parallel to the second direction and the third direction, respectively. The first electrode portion extends d1 along the second direction by 0.3 mm, and the first electrode portion extends d2 along the third direction by 1 mm. The extension dimension h1 of the second electrode portion along the second direction is 0.8 mm, and the extension dimension h2 of the second electrode portion along the third direction is 2 mm; Wherein, the second direction and the third direction are perpendicular to the first direction, and the size of the inductor along the second direction is larger than the size of the inductor along the third direction.

10. The inductor according to claim 1 or 2, characterized in that, The extension dimension d2 of the first electrode portion along the third direction satisfies the following relationship with the extension dimension d0 of the inductor device along the third direction: 20%≤d2 / d0≤50%, wherein the third direction is perpendicular to the first direction.

11. The inductor device according to claim 1 or 2, characterized in that, The thickness W2 of the second electrode portion along the first direction satisfies: 5 micrometers ≤ W2 ≤ 15 micrometers.

12. The inductor device according to claim 11, characterized in that, The thickness W1 of the first electrode portion along the first direction satisfies: 24 micrometers ≤ W1 ≤ 302 micrometers.

13. The inductor device according to claim 12, characterized in that, The thickness W4 of the portion of the first electrode embedded in the magnetic body along the first direction satisfies: 5 micrometers ≤ W4 ≤ 20 micrometers.

14. The inductor according to claim 1 or 2, characterized in that, The inductor also includes a connecting metal, which is disposed in a one-to-one correspondence with the electrodes. The connecting metal includes a first metal layer and a second metal layer of different materials. The first metal layer and the second metal layer are stacked sequentially on the electrodes in a direction away from the magnetic body.

15. The inductor device according to claim 14, characterized in that, The first metal layer comprises nickel, and the second metal layer comprises tin; The thickness W11 of the first metal layer satisfies: 2 micrometers ≤ W11 ≤ 7 micrometers; The thickness W12 of the second metal layer satisfies: 5 micrometers ≤ W12 ≤ 10 micrometers.

16. The inductor according to claim 1 or 2, characterized in that, The inductor also includes an insulating coating layer, which wraps around the outer surface of the magnet except for the area covered by the electrodes.

17. An electronic device, characterized in that, Including the inductor as described in any one of claims 1-16.

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