Interlock device, semiconductor processing system, interlock kit and related interlock method

Abstract

An interlocking device includes a signal lead, a first mechanical switch, and a second mechanical switch. The signal lead has a first end and a second end. The first mechanical switch is connected to the first end of the signal lead and has a normally closed position and an open position. The second mechanical switch connects the first mechanical switch to the second end of the signal lead and has a normally open position and a closed position. A semiconductor processing system including the interlocking device and a method of execution at the interlocking device are also described.

Description

Technical Field

[0001] This disclosure relates generally to fluid systems, and more specifically to controlling the flow of fluid from a fluid source in a fluid system. Background Technology

[0002] Films are typically deposited onto substrates, such as during the fabrication of semiconductor devices. Film deposition is generally accomplished by supporting the substrate within a reaction chamber, heating the substrate to the desired deposition temperature, and contacting the substrate with a material layer precursor under selected environmental conditions (e.g., temperature and pressure) to deposit the film onto the substrate. Once the film has developed the desired properties, the substrate is typically removed from the reaction chamber and sent for further processing, which is applicable to devices fabricated using the film. In some deposition operations, etchant may be supplied to the vent of the reaction chamber and used to maintain pressure during film deposition onto the substrate, for example, to remove accumulated material from the vent duct that could clog it. Countermeasures can be employed to limit (or completely eliminate) the risk of etchant backflow into the reaction chamber, potentially damaging the reaction chamber components.

[0003] Such methods and systems are generally considered suitable for their intended purpose. However, there is still a need in the art for improved interlocking devices, semiconductor processing systems including interlocking devices, interlocking kits, and related methods for interlocking fluid sources. This disclosure provides solutions to this and other needs. Summary of the Invention

[0004] An interlocking device is provided. The interlocking device may include a signal lead having a first end and a second end. The interlocking device may also include a first mechanical switch connected to the first end of the signal lead. The first mechanical switch may have a normally closed position and an open position. The interlocking device may further include a second mechanical switch connecting the first mechanical switch to the second end of the signal lead. The second mechanical switch may have a normally open position and a closed position.

[0005] In addition to one or more of the features described above, or as an alternative, an example may include a first relay comprising a first mechanical switch. The first relay may also include a first relay housing surrounding the first mechanical switch. The first relay may also include a first relay coil disposed within the first relay housing, configured to move the first mechanical switch between a normally closed position and an open position when energized.

[0006] In addition to one or more of the features described above, or as an alternative, other examples may include: a power lead connected to the first relay coil; and a power return lead connected to the first relay coil and thus connected to the power lead.

[0007] In addition to one or more of the features described above, or as an alternative, an example may include a valve opening switch connected to a power return lead, which may be configured to electrically connect the return lead to a first relay when the manual valve is moved to the valve open position.

[0008] In addition to one or more of the features described above, or alternatively, examples may include a first pair of mechanical switches disposed within a first relay housing. The first pair of mechanical switches may have a normally open position and a closed position. A first relay coil may be configured to move the first pair of mechanical switches between the normally open and closed positions when energized.

[0009] In addition to one or more of the features described above, or as an alternative, an example may include a valve-opening switch that connects a first relay coil to a first pair of mechanical switches. Another example may include an analog-to-digital converter connected to the first pair of mechanical switches and thus to the valve-opening switch.

[0010] In addition to one or more of the features described above, or as an alternative, an example may include a second relay, which may include a second mechanical switch. The second relay may also include a second relay housing surrounding the second mechanical switch. The second relay may also include a second relay coil disposed within the second relay housing, configured to move the second mechanical switch between a normally open position and a closed position when energized.

[0011] In addition to one or more of the features described above, or as an alternative, examples may also include: a power supply lead connected to the second relay coil; and a power return lead connected to the second relay coil and thus connected to the power supply lead.

[0012] In addition to one or more of the features described above, or as an alternative, an example may also include a valve shut-off switch connected to a power return lead, which may be configured to electrically connect the power return lead to a second relay when the manual valve is moved to the valve closed position.

[0013] In addition to one or more of the features described above, or alternatively, examples may also include a second pair of mechanical switches disposed within a housing of the second relay. The second pair of mechanical switches may have a normally open position and a closed position. The coil of the second relay may be configured to move the second pair of mechanical switches between the normally open and closed positions when energized.

[0014] In addition to one or more of the features described above, or as an alternative, examples may also include: a valve shut-off switch that connects the second relay coil to the second pair of mechanical switches; and an analog-to-digital converter that connects to the second pair of mechanical switches and thus to the valve shut-off switch.

[0015] In addition to one or more of the features described above, or as an alternative, examples may also include a manual valve. A manual valve may include a valve body having an inlet port and an outlet port. The manual valve may also include a valve member supported for movement within the valve body between an open position and a closed position. The inlet port may be fluidly coupled to the outlet port in the open position. The inlet port may be fluidly disengaged from the outlet port in the closed position. The manual valve may also include a valve open switch operably associated with and configured to electrically close when the valve member is in the open position. The manual valve may also include a valve close switch operably associated with and configured to electrically close when the valve member is in the closed position. The valve open switch may be operably associated with a first mechanical switch. The valve close switch may be operably associated with a second mechanical switch. Additionally, both the valve open switch and the valve close switch may be electrically disconnected when the valve member is between the open and closed positions.

[0016] In addition to one or more of the features described above, or as an alternative, an example may include a signaling relay. The signaling relay may include a signaling relay housing. The signaling relay may also include a mechanical signaling switch disposed within the signaling relay housing and connecting a first end of a signal lead to a first mechanical switch. The mechanical signaling switch may have a normally open position and a closed position. The signaling relay may also include a signaling coil disposed within the signaling relay housing and configured to move the mechanical signaling switch to the closed position when energized. An interlocking device may include a signaling power lead connected to the signaling coil and configured to connect the signaling coil to a current source, and a signaling return lead connected to the signaling coil and thereby connected to the signaling power lead, the signaling return lead being configured to connect the signaling coil to the current source.

[0017] In addition to one or more of the features described above, or alternatively, examples may include a halogen-containing fluid source coupled to a second end of a signal lead via a first mechanical switch and a second mechanical switch, and thereby coupled to the first end of the signal lead. The halogen-containing fluid source may be configured to allow halogen-containing fluid to flow into the semiconductor processing system when both the first and second mechanical switches electrically connect the first end of the signal lead to the second end of the signal lead.

[0018] A semiconductor processing system is provided. The semiconductor processing system may include a chamber body connected to an exhaust source via an exhaust duct. The semiconductor processing system may also include a substrate support disposed within the chamber body and supported therein for rotation about an axis of rotation. The semiconductor processing system may also include a connector along the exhaust duct and connecting a halogen-containing fluid source to the exhaust duct. The semiconductor processing system may also include a manual valve disposed along the exhaust duct between the chamber body and the connector. The manual valve may include a valve body having an inlet port and an outlet port. The manual valve may also include a valve member supported for movement within the valve body between an open position and a closed position. The inlet port may be fluidly connected to the outlet port in the open position. The inlet port may be fluidly separated from the outlet port in the closed position. The semiconductor processing system may also include an interlocking device. The interlocking device may include a signal lead having a first end and a second end. The interlocking device may also include a first mechanical switch coupled to the first end of the signal lead. The first mechanical switch may have a normally closed position and an open position. The interlocking device may also include a second mechanical switch coupled to the second end of the signal lead. The second mechanical switch may have a normally open position and a closed position. The semiconductor processing system may also include a valve opening switch, operably associated with a valve member and configured to electrically close when the valve member is in the open position. The semiconductor processing system may also include a valve closing switch, operably associated with a valve member and configured to electrically close when the valve member is in the closed position. The valve opening switch may be operably associated with a first mechanical switch. The valve closing switch may be operably associated with a second mechanical switch. Both the valve opening switch and the valve closing switch can be electrically disconnected when the valve member is between the open and closed positions.

[0019] In addition to one or more of the features described above, or as an alternative, an example may include a silicon-containing precursor source coupled to an exhaust duct via the chamber body. The silicon-containing precursor source may include a silicon-containing precursor selected from silanes, silanes, propanes, dichlorosilanes, and trichlorosilanes. The halogenated fluid source may include a halogenated fluid selected from hydrochloric acid, chlorine, and chlorine trifluoride.

[0020] In addition to one or more of the features described above, or as an alternative, other examples may include a mechanical signaling switch that connects a first end of a signal lead to a first mechanical switch. Other examples may include a power supply connected to the first end of the signal lead. Other examples may include a controller operably connected to the mechanical signaling switch and, in response to instructions recorded in a memory, to: receive user input from a user input terminal; and, in response to the user input, electrically connect the power supply to the first mechanical switch using the signaling switch to allow halogenated fluid to flow to the connector. When the valve member is not in the closed position, one of the first or second mechanical switches may electrically disconnect the power supply from the second end of the signal lead to interlock the flow of halogenated fluid to the exhaust duct.

[0021] A method for interlocking a halogenated fluid source is provided. The method can be performed at an interlocking device, which may include a signal lead having a first end and a second end. The interlocking device may also include a first mechanical switch coupled to the first end of the signal lead. The first mechanical switch may have a normally closed position and an open position. The interlocking device may also include a second mechanical switch coupled to the second end of the signal lead. The second mechanical switch may have a normally open position and a closed position. The method may include receiving user input at a user input terminal of a controller. In response to the receipt of the user input, a voltage is applied to the first end of the signal lead to cause halogenated fluid to flow from the halogenated fluid source. When the first mechanical switch is in the open position and / or the second mechanical switch is in the normally open position, the halogenated fluid is not allowed to flow from the halogenated fluid source. When the first mechanical switch is in the normally closed position and the second mechanical switch is in the closed position, the second end of the signal lead is electrically coupled to the first end of the signal lead through the first and second mechanical switches, causing the halogenated fluid to flow.

[0022] In addition to one or more of the features described above, or as an alternative, additional examples may include interlocking devices comprising a valve open switch and a valve close switch operably associated with a valve member of a manual valve arranged along an exhaust duct. The method may further include moving the valve member to an open position such that the valve open switch closes, thereby retaining a second mechanical switch in a normally open position, and the second mechanical switch disengaging a second end of a signal lead from a first end of the signal lead to interlock the halogen-containing fluid source. The method may also include allowing a silicon-containing precursor to flow through the valve and into the exhaust duct while the halogen-containing fluid source is interlocked, such that no halogen-containing fluid flows from the halogen-containing fluid source into the exhaust duct.

[0023] In addition to one or more of the features described above, or as an alternative, another example may include moving the valve member from the open position to a position intermediate between the open and closed positions, thereby disengaging the valve opening switch, retaining the second mechanical switch in the normally open position, and separating the second end of the signal lead from the first end of the signal lead to interlock the halogen-containing fluid source. The method may also include allowing additional silicon-containing precursor to flow through the valve and into the exhaust duct while the halogen-containing fluid source remains interlocked, such that no halogen-containing fluid flows from the halogen-containing fluid source into the exhaust duct.

[0024] In addition to one or more of the features described above, or as an alternative, other examples may include: moving a valve member to a closed position, whereby a valve shut-off switch is closed and a second mechanical switch is moved to a closed position, such that a second end of a signal lead is electrically connected to a first end of the signal lead via both the first and second mechanical switches. The method may also include allowing halogenated fluid to flow into an exhaust duct to remove silicon-containing precursors and / or residues from within the exhaust duct without returning the halogenated fluid to the chamber body connected to the exhaust duct via a manual valve.

[0025] An interlock kit for a halogen-containing fluid source is provided. The interlock kit may include a signal lead having a first end and a second end. The first end of the signal lead may be configured to connect to a power source. The second end of the signal lead may be configured to connect to the halogen-containing fluid source. The interlock kit may also include a first mechanical switch configured to be connected to the first end of the lead. The first mechanical switch may have a normally closed position and an open position. The interlock kit may also include a second mechanical switch configured to connect the first mechanical switch to the second end of the lead. The second mechanical switch may have a normally open position and a closed position.

[0026] This synopsis is provided to introduce some concepts in a simplified form. These concepts are further described in detail in the following detailed description of examples of this disclosure. This synopsis is not intended to identify key or essential features of the claimed subject matter, nor is it intended to limit the scope of the claimed subject matter. Attached Figure Description

[0027] These and other features, aspects, and advantages of the invention disclosed herein are described below with reference to the accompanying drawings of certain embodiments, which are intended to illustrate rather than limit the invention.

[0028] Figure 1 This is a schematic diagram of a semiconductor processing system including interlocking devices.

[0029] Figure 2 yes Figure 1 This is part of an example interlocking device.

[0030] Figure 3A and Figure 3B This is a block diagram of a method for interlocking halogenated fluid sources.

[0031] Figure 4 Example components of the controller are shown.

[0032] It should be understood that the elements in the accompanying drawings are shown for simplicity and clarity and are not necessarily drawn to scale. For example, the relative dimensions of some elements in the drawings may be exaggerated relative to other elements to aid in understanding the embodiments shown in this disclosure. Detailed Implementation

[0033] Reference will now be made to the accompanying drawings, wherein like reference numerals identify similar structural features or aspects of this disclosure. Partial views of examples of semiconductor processing systems including interlocking devices according to this disclosure are provided for purposes of explanation and illustration, and not limitation. Figure 1 As shown in the figure, and generally indicated by reference numeral 100. Figures 2 to 4 Other examples of related methods or aspects of semiconductor processing systems, mixing blocks, fixtures, and purging mixing blocks according to this disclosure are provided, as will be described. The systems and methods of this disclosure can be used in channels within mixing blocks employed in purging fluid systems, such as mixing blocks for providing material layer precursors in semiconductor processing systems used to deposit material layers onto substrates using atomic layer deposition (ALD) or chemical vapor deposition (CVD) techniques, but this disclosure is not limited to any particular deposition technique or material layer deposition in general.

[0034] Reference Figure 1 The semiconductor processing system 100 may include a chamber device 102, which includes a chamber body 104. The chamber device may also include a substrate support 106 configured to receive a substrate 108. Although specific example arrangements of the chamber device 102 (e.g., a cold-wall crossflow chamber device) have been shown and described, it should be understood and appreciated that semiconductor processing systems having other types of chamber devices may also benefit from this disclosure.

[0035] The chamber body 104 may have an injection end 110 and a longitudinally opposed exhaust end 112 substantially opposite the injection end 110, and an interior 114. The interior 114 of the chamber body 104 may be defined by a top wall 116 extending between the injection end 110 and the exhaust end 112 of the chamber body 104, a bottom wall 118 extending below the top wall 116 and between the injection end 110 and the exhaust end 112 of the chamber body 104, a first sidewall extending between and / or connecting the lateral edges of the top wall 116 and the bottom wall 118 to each other, and a second laterally opposed sidewall extending between and / or connecting the opposing lateral edges of the top wall 116 and the bottom wall 118 to each other. In an example configuration, the top wall 116 and / or the bottom wall 118 may be ribbed. For example, refer to... Figure 1 The top wall 116 and / or the bottom wall 118 may include a plurality of ribs extending from their outer surfaces. In other example configurations, the top wall 116 and / or the bottom wall may not be ribbed. In some example configurations, the chamber body 104 or a portion thereof may be formed of a substantially transparent material, such as a material transparent to electromagnetic radiation in the infrared band, such as a ceramic material like fused silica or quartz. A substantially transparent material can transmit electromagnetic radiation, for example, emitted by the heater element.

[0036] A substrate 108 (e.g., a wafer) may be disposed and / or supported within a chamber body 104. For example, a heater element 120 and / or an array of heater elements may be used to heat the substrate 108. According to some example configurations, at least a portion of the chamber body 104 may be formed of quartz. As described above, the top wall 116 and / or bottom wall 118 of the chamber body 104 may include ribs 122. Ribs 122 may extend outwardly from one or more of the top wall 116 and bottom wall 118. Ribs 122 may provide structural support to the chamber body 104 and / or allow the interior 114 of the chamber body 104 to maintain a relatively low pressure relative to the external environment. In alternative example configurations, ribs 122 of one or more of the top wall 116 and bottom wall 118 may be omitted.

[0037] As used herein, the term "substrate" can refer to any one or more underlying materials, including any one or more underlying materials that can be modified or on which devices, circuits, or material layers (e.g., films) can be formed. Substrates can be continuous or discontinuous; rigid or flexible; solid or porous; and combinations thereof. Substrates can be in any form, such as (but not limited to) powder, plate, or workpiece. Plate-type substrates can include wafers of various shapes and sizes, such as wafers including 300 mm. Substrates can be formed from semiconductor materials, including, for example, silicon (Si), silicon germanium (SiGe), silicon oxide (SiO2), gallium arsenide (GaAs), gallium nitride (GaN), and silicon carbide (SiC). Substrates can include patterned or unpatterned materials, such as so-called blanket substrates. As an example, powder-type substrates can have applications for pharmaceutical manufacturing. Porous substrates can include one or more polymers. Examples of workpieces can include medical devices (e.g., stents and syringes), jewelry, tooling devices, components for battery manufacturing (e.g., anodes, cathodes, or separators), or components for photovoltaic cells, etc. Continuous substrates can extend beyond the boundaries of the processing chamber where the deposition process occurs. In some processes, the continuous substrate can move through a processing chamber, allowing the process to continue until the end of the substrate is reached. Continuous substrates can be supplied from a continuous substrate supply system to allow the continuous substrate to be manufactured and output in any suitable form. Non-limiting examples of continuous substrates may include sheets, nonwoven films, rolls, foils, fiber webs, flexible materials, bundles of continuous filaments or fibers (e.g., ceramic or polymer fibers). Continuous substrates may also include a carrier or sheet on which one or more discontinuous substrates are mounted.

[0038] A substrate support 106 may be disposed within and supported therein at the interior 114 of the chamber body 104 to rotate about a rotation axis 124, and may include a substrate support structure. The substrate support 106 may be supported by a support member 128. The substrate support 106 may be disposed relative to the support member 128 along the rotation axis 124 and / or may include the rotation axis 124. The substrate support 106 may be configured to be fixedly rotatable relative to the support member 128. The support member 128 may be fixedly rotatable relative to a shaft 126. The shaft 126 may be supported to rotate about the rotation axis 124. The shaft 126 may extend through the bottom wall 118 of the chamber body 104 and may connect the substrate support 106 and the support member 128 to a drive module 130. The drive module 130 may be operatively connected to the substrate support 106, for example, via the shaft 126 and the support member 128. The drive module 130 may be configured to rotate a substrate support 106 about a rotation axis 124, for example, during the deposition of a material layer 132 onto a substrate 108 via an axis 126 and a support member 128. The substrate 108 may include a wafer, such as a semiconductor wafer. The material layer 132 may include an epitaxial material layer, such as a silicon-containing and / or germanium-containing material layer. It is also contemplated, according to certain example configurations, that the material layer 132 may be a thick epitaxial material layer, for example, formed during the fabrication of a power electronic device. Example power devices may include insulated-gate bipolar transistor semiconductor devices. A “thick” layer may include layers with a thickness greater than 25 micrometers, greater than 50 micrometers, greater than 75 micrometers, greater than 100 micrometers, or between about 25 micrometers and about 100 micrometers.

[0039] The semiconductor processing system may also include an exhaust source 134. The exhaust source 134 may be connected to an exhaust end 112 of the chamber body 104. The chamber body 104 may be coupled to the exhaust source 134 via an exhaust duct 156. The exhaust source 134 may be configured to couple the chamber body 104 to an exhaust source, such as a scrubber. In some example configurations, the chamber body 104 may include an exhaust flange extending outwardly from and around a wall of the chamber body 104. The exhaust source 134 may be coupled to the exhaust flange. The semiconductor processing system may also include an injection flange 136. The injection flange 136 may be connected to an injection end 110 of the chamber body 104. The injection flange 136 may couple a first precursor source 138, one or more second precursor sources 140, a purge gas / carrier gas source 142, and / or a halide source 144 to the chamber body 104. In some example configurations, chamber body 104 may include an injection flange 136 that extends outward, for example, from and around the injection end 110 of chamber body 104. One or more of chamber body 104, injection flange 136, and exhaust source 134 may be substantially as shown and described in U.S. Patent Application Publication No. 2010 / 0116207A1 entitled “Reaction chamber”, filed November 5, 2009, the contents of which are incorporated herein by reference in their entirety.

[0040] The first precursor source 138 may be fluidly coupled to the chamber body 104 via an injection flange 136. The first precursor source 138 may be further configured to provide a first precursor 146 to the chamber body 104 (e.g., to the interior 114 of the chamber body 104). In some example configurations, the first precursor 146 may include a silicon-containing precursor. As a non-limiting example, examples of silicon-containing precursors may include silanes (SiH4), dichlorosilanes (Si2H6), propane (H2Si(SiH3)2), dichlorosilanes (H2SiCl2), trichlorosilanes (HCl3Si), and more advanced silane compounds, such as tetramethylsilane (Si(CH3)4).

[0041] One or more second precursor sources 140 may be fluidly coupled to the chamber body 104 via injection flange 136. The one or more second precursor sources 140 may be configured to provide one or more second precursors 148 to the chamber body 104 (e.g., to the interior 114 of the chamber body 104). In some example configurations, the one or more second precursors 148 may contain dopants, such as precursors containing n-type and / or p-type dopants. The one or more second precursors 148 may include, for example, germanium precursors. As a non-limiting example, examples of germanium precursors may include germane (GeH4), germanium tetrafluoride (GeF4), and tributylgermanium hydride ([CH3(CH2)3]3GeH).

[0042] The purge gas / carrier gas source 142 can be fluidly coupled to the chamber body 104 via the injection flange 136. The purge gas / carrier gas source 142 can be configured to supply purge gas / carrier gas 150 to the chamber body 104 (e.g., to the interior 114 of the chamber body 104). In some examples, the purge gas / carrier gas 150 may include hydrogen (H2), helium (He), nitrogen (N2), argon (Ar), and / or krypton (Kr) or mixtures thereof.

[0043] A halide source 144 can be fluidly coupled to the interior 114 of the chamber body 104 via an injection flange 136. The halide source 144 can be configured to supply a halide 152 to the chamber body 104 (e.g., the interior 114 of the chamber body 104). In some examples, the halide 152 may include chlorine. For example, the halide 152 may include hydrochloric acid (HCl) or chlorine (Cl2). The deposition of a material layer 132 onto the substrate 108 can be facilitated and / or assisted by supporting the substrate 108 on a substrate support 106 within the chamber body 104, heating the substrate 108 to a predetermined material layer deposition temperature, rotating the substrate 108 about a rotation axis 124 using the substrate support 106, and allowing a first precursor 146 and / or a second precursor 148 to flow through the substrate 108. The material layer 132 can be deposited onto the substrate 108 as the first precursor 146 and / or the second precursor 148 flow through the substrate 108. Material layer 132 can be deposited on substrate 108 depending on the temperature of substrate 108. Heating of substrate 108 can be accomplished via heating elements (e.g., heater element 120) or an array of heating elements. Heating element 120 and / or the array of heating elements can be positioned outside chamber body 104. Heater element 120 or the array of heater elements can be arranged above top wall 116 of chamber body 104. Alternatively or additionally, heater element 120 and / or the array of heater elements can be radially coupled to substrate support 106 (and substrate 108) via walls of chamber body 104 (e.g., top wall 116 and / or bottom wall 118). Top reflector 154 (e.g., part of a cooling kit) can be disposed above heater element 120. Top reflector 154 can be configured to cooperate with heater element 120, for example, to reflect electromagnetic radiation emitted from heater element 120 back to chamber body 104 in a direction substantially opposite to chamber body 104, for example, to radially heat substrate support 106 and / or substrate 108. An example configuration of chamber 104 may be arranged substantially as shown and described in U.S. Application Publication No. 2018 / 0363139A1 entitled “Semiconductor Processing Apparatus and Methods for Calibrating ASemiconductor Processing Apparatus”, filed April 25, 2018, the contents of which are incorporated herein by reference in their entirety.

[0044] The semiconductor processing system 100 may also include one or more pyrometers 153. The pyrometers 153 may be coupled (e.g., optically coupled) to the top reflector 154. Alternatively or additionally, the pyrometers 153 may be configured to record and / or report the temperature of one or more of the chamber body 104, the substrate support 106, and / or the substrate 108 (e.g., a wafer).

[0045] The semiconductor processing system 100 may also include an interlocking device 158. The interlocking device 158 may operate on an exhaust duct 156, for example, between an exhaust end 112 (e.g., an exhaust flange) and an exhaust source 134. The semiconductor processing system 100 (e.g., at the interlocking device 158) may also include a halogen-containing fluid source 162. The semiconductor processing system 100 (e.g., at the interlocking device 158) may also include a connector 160. The connector 160 may be arranged (e.g., positioned) along the exhaust duct 156. The connector 160 may connect (e.g., fluidly connect) the halogen-containing fluid source 162 to the exhaust duct 156. For example, the halogen-containing fluid source 162 may be configured to provide a halogen-containing fluid 176 to the exhaust duct 156 and / or the exhaust source 134, for example, to remove silicon precursors and / or deposits, such as those from a deposition process, from the exhaust duct 156 and / or the exhaust source 134.

[0046] The semiconductor processing system 100 may also include (e.g., at interlock device 158) a manual valve 164. The manual valve 164 may be arranged (e.g., set, connected, etc.) along an exhaust duct 156, for example, between the chamber body and connector 160. The manual valve 164 may include a valve body 166. The valve body 166 may include an inlet port 168 and an outlet port 170. The manual valve 164 may also include a valve member 172 supported to move within the valve body 166 between an open position and a closed position. In an example configuration, if (e.g., when) the valve member 172 is in the open position, the inlet port 168 may be fluidly coupled to the outlet port 170. Alternatively, if (e.g., when) the valve member 172 is in the closed position, the inlet port 168 may be fluidly disengaged from the outlet port 170.

[0047] The semiconductor processing system 100 may also include a controller 174. The controller 174 may be operatively coupled to one or more of the following: a first precursor source 138, one or more second precursor sources 140, a purge gas / carrier gas source 142, a halide source 144, a halogen-containing fluid source 162, an exhaust source 134, an interlock device 158, and a drive module 130. The controller 174 is described in more detail herein.

[0048] Figure 2 yes Figure 1 This is a part of the example interlocking device 158. (See reference) Figure 2 The manual valve 164 may also include a valve open switch 202. The valve open switch 202 may be operatively associated with a valve member (e.g., valve member 172) and may be configured to electrically close if (e.g., when) the valve member is in the open position. The manual valve 164 may also include a valve close switch 204. The valve close switch 204 may be operatively associated with a valve member and may be configured to electrically close if (e.g., when) the valve member is in the closed position.

[0049] Valve open switch 202 may be operatively associated with a first mechanical switch 206. The first mechanical switch may include a normally closed (NC) position and an open position. Valve close switch 204 may be operatively associated with a second mechanical switch 208. The second mechanical switch 208 may include a normally open (NO) position and a closed position. Both valve open switch 202 and valve close switch 204 may be electrically disconnected if (e.g., when) a valve member (e.g., valve member 172) is between the open and closed positions.

[0050] Continue to refer to Figure 2 The interlocking device 158 may include a signal lead 210. The signal lead 210 may include (e.g., a first end 212) and (e.g., a second end 214). A first mechanical switch 206 may be connected to the first end 212 of the signal lead 210. A second mechanical switch 208 may be configured to connect the first mechanical switch 206 to the second end 214 of the signal lead 210.

[0051] The interlock device 158 may further include a first relay 216. The first relay 216 may include a first mechanical switch 206. The first relay 216 may also include a first relay housing 218, which, for example, surrounds the first mechanical switch 206. The first relay 216 may also include a first relay coil 220. The first relay coil 220 may be disposed within the first relay housing 218. The first relay coil 220 may be configured to move the first mechanical switch between a normally closed (NC) position and an open position, for example, if energized. A power lead 222 may be connected to the first relay coil 220. Additionally, a power return lead 224 may be connected to the first relay coil 220, and thereby to the power lead 222. A valve open switch 202 may be connected to the power return lead 224. Furthermore, for example, if the manual valve 164 is moved to the valve open position, the valve open switch may be configured to electrically connect the power return lead 224 to the first relay 216.

[0052] The first relay 216 may also include a first pair of mechanical switches 226. The first pair of mechanical switches 226 may be arranged (e.g., disposed) within the first relay housing 218. The first pair of mechanical switches 226 may include a normally open (NO) position and a closed position. The first relay coil 220 may be configured to move the first pair of mechanical switches 226 between the normally open (NO) position and the closed position, for example, if (e.g., when) energized.

[0053] As described, the manual valve 164 may include a valve opening switch 202. The valve opening switch 202 may be configured and / or arranged to connect a first relay coil 220 to a first pair of mechanical switches 226. The interlocking device 158 may also include an analog-to-digital converter 228 (ADC) (e.g., embodied in one or more circuit boards, such as printed circuit boards). The ADC 228 may be connected to the first pair of mechanical switches 226, and thereby connected to the valve opening switch 202.

[0054] The interlocking device 158 may also include a second relay 230. The second relay 230 may include a second mechanical switch 208. The second relay 230 may also include, for example, a second relay housing 232 surrounding the second mechanical switch 208. Additionally, the second relay 230 may also include a second relay coil 234. The second relay coil 234 may be arranged (e.g., disposed) within the second relay housing 232. The second relay coil 234 may be configured to, for example, move the second mechanical switch 208 between a normally open (NO) position and a closed position if (e.g., when) energized. In one or more example configurations, the interlocking device 158 may also include a second power lead 236 connected to the second relay coil 234. Additionally, the interlocking device 158 may also include a second power return lead 238 connected to the second relay coil 234 and thereby connected to the second power lead 236.

[0055] As described herein, the interlock device 158 may include a valve close switch 204. The valve close switch 204 may be connected to a second power return lead 238. The valve close switch 204 may be configured to electrically connect the second power return lead 238 to a second relay 230, for example, if (e.g., when) the manual valve 164 (e.g., via valve member 172) is in the valve closed position.

[0056] In one or more example configurations, the second relay 230 may also include a second pair of mechanical switches 240. The second pair of mechanical switches 240 may be arranged (e.g., disposed) within the second relay housing 232. The second pair of mechanical switches 240 may include a normally open (NO) position and a closed position. The second relay coil 234 may be configured to move the second pair of mechanical switches 240 between the normally open (NO) position and the closed position, for example, if (e.g., when) energized.

[0057] As described, the interlock device 158 (e.g., connected to the manual valve 164) may include a valve shut-off switch 204. The valve shut-off switch 204 may be configured to connect a second relay coil 234 to a second pair of mechanical switches 240. Additionally, an analog-to-digital converter 228 may be connected to the second pair of mechanical switches 240, and thereby connected to the valve shut-off switch 204.

[0058] The interlock device 158 may also include a signaling relay 242. The signaling relay 242 may also include a signaling relay housing 244. The signaling relay 242 may also include a mechanical signaling switch 246. The mechanical signaling switch 246 may be arranged (e.g., disposed) within the signaling relay housing 244. The mechanical signaling switch 246 may be arranged and / or configured to connect a first end 212 of the signal lead 210 to a first mechanical switch 206. Additionally, the mechanical signaling switch 246 may include a normally open (NO) position and a closed position. The signaling relay 242 may also include a signaling coil 248. The signaling coil 248 may be arranged (e.g., disposed) within the signaling relay housing 244 and may be configured to move the mechanical signaling switch 246 to the closed position, for example, if (e.g., when) energized. The interlock device 158 may also include a signaling power lead 250. Signaling power lead 250 can be connected to signaling coil 248 and can be configured to connect signaling coil 248 to a current source (e.g., power supply 254), which may in turn include a printed circuit board and controller 174. Figure 1 (As shown) The signaling coil 248 communicates via this printed circuit board. The interlock device 158 may also include a signaling return lead 252. The signaling return lead 252 may be connected to the signaling coil 248 and thereby to the signaling power lead 250. The signaling return lead 252 may be configured to connect the signaling coil 248 to a current source (e.g., power supply 254).

[0059] As described, the semiconductor processing system 100 may include, for example, a halogen-containing fluid source 162 located at and / or connected to an interlocking device 158. The halogen-containing fluid source 162 may be coupled to a second end 214 of a signal lead 210. The second end 214 of the signal lead 210 may be coupled to the first end 212 of the signal lead 210 via the halogen-containing fluid source 162 by a first mechanical switch 206 and a second mechanical switch 208. The halogen-containing fluid source 162 may be configured to allow halogen-containing fluid 176 to flow to the semiconductor processing system (e.g., when) both the first mechanical switch 206 and the second mechanical switch 208 electrically connect the first end 212 of the signal lead 210 to the second end 214 of the signal lead 210. Figure 1 Semiconductor processing system 100 (e.g., flowing to) Figure 1 Exhaust duct 156 and / or exhaust source 134).

[0060] Continue to refer to Figure 2 Mechanical signaling switch 246 can connect the first end 212 of signal lead 210 to the first mechanical switch 206. Additionally, a power source (e.g., power source 254) can be connected to the first end 212 of signal lead 210 via signaling coil 248.

[0061] As described, the semiconductor processing system 100 may include a controller 174. The controller 174 may be operatively coupled (directly or indirectly) to a mechanical signaling switch 246. The controller may include one or more processors (e.g., processors with a memory for storing instructions). Figure 4 The processor 402), when executed by one or more processors (e.g., in response to instructions recorded in memory), configures the controller 174 to perform one or more of the following processes. For example, the controller 174 may be configured to receive user input (e.g., from a user input interface and / or device). The controller 174 may also be configured, for example, in response to user input, to use a mechanical signaling switch 246 to electrically connect a power supply to a first mechanical switch 206 to allow a halogen-containing fluid (e.g., halogen-containing fluid 176) to flow to a connector (e.g., ...). Figure 1 (Connector 160 in the middle). Additionally, for example, if (e.g., when) the valve component (e.g.) Figure 1 If the valve component 172 is not in the closed position, one of the first mechanical switch 206 or the second mechanical switch 208 electrically disconnects the power supply from the second terminal 214 of the signal lead 210, for example, to interlock the halogenated fluid to the exhaust duct (e.g. Figure 1 The flow of the exhaust duct 156.

[0062] Additionally, it is understood that the interlocking device 158 may be provided as an interlocking kit. For example, the interlocking kit may include a signal lead 210, having, for instance, a first end 212 and a second end 214. The first end 212 of the signal lead 210 may be configured to be connected to a power source, and the second end 214 of the signal lead may be configured to be connected to a halogen-containing fluid source 162. The interlocking kit may also include a first mechanical switch 206 (e.g., as part of a first relay 216) configured to be connected to the first end 212 of the signal lead 210. The first mechanical switch 206 may include a normally closed (NC) position and an open position. The interlocking kit may also include a second mechanical switch 208 (e.g., as part of a second relay 230) configured to connect the first mechanical switch 206 to the second end 214 of the signal lead 210. The second mechanical switch 208 may include a normally open (NO) position and a closed position.

[0063] Figure 3A and Figure 3B It is an interlocked halogen-containing fluid source (e.g.) Figure 1 and Figure 2 A block diagram of the method for using a halogenated fluid source 162. Figure 3A and Figure 3B One or more steps of the example method can be controlled by a controller (e.g., Figure 1 and Figure 2 The controller 174) or other computing device performs and / or causes this. Alternatively or alternatively, Figure 3A and Figure 3B Some or all of the steps of the example method may be performed and / or caused by hardware (e.g., manual valve 164, connector 160, first relay 216, second relay 230, signaling relay 242, etc.), software (e.g., operable relative to controller 174), user, or a combination thereof. Figure 3A and Figure 3B The steps of the example method may be omitted, performed in a different order, and / or modified in other ways, and / or one or more additional steps may be added. Alternatively or alternatively, Figure 3A and Figure 3B One or more steps of the example method may be performed at and / or by an interlocking device (e.g., interlocking device 158), for example at an interlocking device comprising: a signal lead (e.g., signal lead 210) having a first end (e.g., first end 212) and a second end (e.g., second end 214); a first mechanical switch (e.g., first mechanical switch 206) coupled to the first end of the signal lead, wherein the first mechanical switch includes a normally closed (NC) position and an open position; and a second mechanical switch (e.g., second mechanical switch 208) coupled to the second end of the signal lead, wherein the second mechanical switch includes a normally open (NO) position and a closed position.

[0064] refer to Figure 3A In step 301, user input may be received. For example, a controller (e.g., controller 174) may receive user input at a user interface (e.g., user interface 414). Alternatively, the controller may receive an indication of user input from the user interface.

[0065] In step 303, in response to receiving user input (and / or receiving an indication of user input), a voltage may be applied to a first end (e.g., first end 212) of a signal lead (e.g., signal lead 210) to cause a halogenated fluid (e.g., halogenated fluid 176) to flow from a halogenated fluid source (e.g., halogenated fluid source 162).

[0066] In step 305, if (e.g., when) the first mechanical switch (e.g., the first mechanical switch 206) is in the off position and / or the second mechanical switch 208 is in the normally open (NO) position, then (e.g., the flow of halogenated fluid from the halogenated fluid source can be prevented / prevented) (e.g., through the exhaust duct (e.g., exhaust duct 156)).

[0067] In step 307, if (e.g., when) the first mechanical switch is in the normally closed (NC) position and the second mechanical switch is in the closed position, the halogen-containing fluid can be allowed to flow (e.g., caused to flow). For example, such a configuration can electrically connect the second end (e.g., second end 214) of the signal lead to the first end of the signal lead via the first and second mechanical switches.

[0068] Alternatively, the interlocking device may include a valve open switch (e.g., valve open switch 202) and a valve close switch (e.g., valve close switch 204). One or more of the valve open switch and valve close switch may be operatively associated with a valve member (e.g., valve member 172) of a manual valve (e.g., manual valve 164) arranged along an exhaust duct (e.g., exhaust duct 156). In step 309, the valve member may be moved (e.g., by a user and / or actuator) to the open position, causing the valve open switch to close. The second mechanical switch may be held (e.g., maintained) in the normally open (NO) position, and the second mechanical switch may disconnect a second end of a signal lead from a first end of a signal lead, for example, to interlock a halogenated fluid source (e.g., to prevent its flow through the exhaust duct).

[0069] In step 311, the silicon-containing precursor (e.g., first precursor 146) may flow through (e.g., may be allowed to flow through) a manual valve and into an exhaust duct (e.g., exhaust duct 156), while the halogen-containing fluid source is (e.g., held) interlocked so that no halogen-containing fluid flows from the halogen-containing fluid source to the exhaust duct.

[0070] refer to Figure 3B In step 313, the valve component can be moved (e.g., by a user and / or actuator) from the open position to a position between the open and closed positions. The valve component can be moved such that the valve opening switch is disconnected and the second mechanical switch remains in the normally open (NO) position, and the second mechanical switch disconnects the second end of the signal lead from the first end of the signal lead to interlock the halogen-containing fluid source.

[0071] In step 315, while the halogenated fluid source remains interlocked, another silicon-containing precursor can be allowed to flow through (and / or through) the valve and into the exhaust duct, so that no halogenated fluid flows from the halogenated source to the exhaust duct.

[0072] In step 317, the valve component may be moved (e.g., by a user and / or an actuator) to the closed position. The valve component may be moved to the closed position such that the valve shut-off switch is closed (and / or closed) and the second mechanical switch is moved (and / or moved) to the closed position such that the second end of the signal lead is electrically connected to the first end of the signal lead via the first mechanical switch and the second mechanical switch.

[0073] In step 319, halogenated fluid may be allowed to flow into (and / or be allowed to flow into) an exhaust duct, for example, to remove silicon-containing precursors and / or residues from the exhaust duct, without allowing the halogenated fluid to flow back into the chamber body (e.g., chamber body 104) connected to the exhaust duct via a manual valve.

[0074] Figure 4 Example elements of controller 174 are shown. Controller 174 may include one or more processors 402 that can execute instructions stored in random access memory (RAM) 404, removable media 410 (such as a Universal Serial Bus (USB) drive, optical disc (CD) or digital versatile disc (DVD) or floppy disk drive), or any other desired storage medium. Instructions may also be stored in an attached (or internal) hard disk drive 406. When executed, the instructions may cause one or more processors 402 to configure controller 174 to perform or cause the performance of one or more steps and / or operations described herein. Controller 174 may also include a security processor (not shown) that can execute instructions of one or more computer programs to monitor processes executing on processor 402 and any processes requesting access to any hardware and / or software components of controller 174 (e.g., ROM 408, RAM 404, removable media 410, hard disk drive 406, network interface (e.g., I / O) 412, etc.). Controller 174 may include one or more output devices, such as user interface 414 (e.g., screen, display device, monitor, etc.), and may include one or more output device controllers, such as video processors. One or more user input devices 416 may also be present, such as keyboards, mice, touchscreens, microphones, etc. Controller 174 may also include one or more network interfaces, such as network interface 412, which may be a wired interface, a wireless interface, or a combination of both. Network interface 412 provides an interface for controller 174 to communicate with network 418 (e.g., RAN or any other network). Network interface 412 may include a modem, and network 418 may include a communication link, an external network, a provider's wireless, coaxial, fiber, or hybrid fiber / coaxial distribution system, or any other desired network. Additionally, controller 174 may include a driver module 130 that communicates with one or more processors 402. Alternatively, driver module 130 may be external to controller 174 and may include hardware, software, or a combination of both, and communicate with controller 174. Furthermore, controller 174 may include one or more device interfaces 420 for interfacing with and / or communicating with one or more external devices.

[0075] Figure 4The examples shown can be hardware configurations, although the components illustrated can also be implemented as software and / or a combination of hardware and software. Modifications can be made as needed to add, remove, combine, partition, etc., components of the controller. Furthermore, components can be implemented using basic computing devices and components, and any other computing devices and components described herein can be implemented using the same components (e.g., processor 402, ROM storage 408, user interface 414, etc.). For example, the various components described herein can be implemented using a computing device having components such as a processor that executes computer-executable instructions stored on a computer-readable medium, such as... Figure 4 As shown. Some or all of the entities described herein may be software-based and may coexist in a common physical platform (e.g., the requesting entity may be a software process and program separate from the subordinate entities, both of which may be executed as software on a common computing device).

[0076] Although this disclosure has been provided with reference to certain embodiments and examples, those skilled in the art will understand that this disclosure extends beyond the specifically described embodiments to other alternative embodiments and / or uses of embodiments, as well as their obvious modifications and equivalents. Furthermore, while several variations of embodiments of this disclosure have been shown and described in detail, other modifications based on this disclosure and within its scope will be apparent to those skilled in the art. It is also contemplated that various combinations or sub-combinations of specific features and aspects of the embodiments may be made and still fall within the scope of this disclosure. It should be understood that various features and aspects of the disclosed embodiments may be combined or substituted with each other to form variations of embodiments of this disclosure. Therefore, it is intended that the scope of this disclosure should not be limited to the specific embodiments described above.

[0077] The headings provided herein (if any) are for convenience only and do not necessarily affect the scope or meaning of the apparatus and methods disclosed herein.

Claims

1. An interlocking device, comprising: A signal lead having a first end and a second end; A first mechanical switch is connected to the first end of the signal lead, and the first mechanical switch has a normally closed position and an open position; as well as A second mechanical switch connects the first mechanical switch to the second end of the signal lead. The second mechanical switch has a normally open position and a closed position.

2. The interlocking device according to claim 1 further includes a first relay, which includes the first mechanical switch, and the first relay further includes: A first relay housing surrounds a first mechanical switch; as well as A first relay coil disposed within a first relay housing is configured to move a first mechanical switch between the normally closed position and the open position when energized.

3. The interlocking device according to claim 2 further includes: A power lead is connected to the coil of the first relay. as well as The power return lead is connected to the first relay coil and thus to the power lead.

4. The interlocking device according to claim 3 further includes a valve opening switch connected to the power return lead and configured to electrically connect the power return lead to the first relay when the manual valve is moved to the valve open position.

5. The interlocking device according to claim 2, wherein, The first relay further includes a first pair of mechanical switches disposed within the housing of the first relay, the first pair of mechanical switches having a normally open position and a closed position, and the first relay coil being configured to move the first pair of mechanical switches between the normally open position and the closed position when energized.

6. The interlocking device according to claim 5, further comprising: The valve opens the switch, which connects the first relay coil to the first pair of mechanical switches; as well as An analog-to-digital converter is connected to a first pair of mechanical switches and thus to a valve opening switch.

7. The interlocking device according to claim 1 further includes a second relay, which includes the second mechanical switch, and the second relay further includes: The second relay housing surrounds the second mechanical switch; as well as A second relay coil is disposed within a second relay housing and is configured to move a second mechanical switch between the normally open position and the closed position when energized.

8. The interlocking device according to claim 7, further comprising: A power lead is connected to the second relay coil; as well as The power return lead is connected to the second relay coil and thus to the power lead.

9. The interlocking device of claim 8 further includes a valve closing switch connected to the power return lead and configured to electrically connect the power return lead to the second relay when the manual valve is moved to the valve closed position.

10. The interlocking device according to claim 7, wherein, The second relay further includes a second pair of mechanical switches disposed within the housing of the second relay, the second pair of mechanical switches having a normally open position and a closed position, and the coil of the second relay being configured to move the second pair of mechanical switches between the normally open position and the closed position when energized.

11. The interlocking device according to claim 10, further comprising: The valve closes the switch, which connects the second relay coil to the second paired mechanical switch; as well as An analog-to-digital converter is connected to a second pair of mechanical switches and thus to a valve shut-off switch.

12. The interlocking device according to claim 1, further comprising: Manual valves, including: The valve body has an inlet port and an outlet port; A valve component, which is supported for movement within the valve body between an open position and a closed position, wherein the inlet port is fluidly connected to the outlet port in the open position and fluidly separated from the outlet port in the closed position; A valve opening switch, operably associated with and configured to electrically close when the valve member is in the open position; and A valve shut-off switch, operably associated with and configured to electrically close when the valve member is in the closed position. The valve opening switch is operably associated with the first mechanical switch, the valve closing switch is operably associated with the second mechanical switch, and both the valve opening switch and the valve closing switch are electrically disconnected when the valve member is between the open and closed positions.

13. The interlocking device according to claim 1, further comprising: Signaling relays, including: Signaling relay housing; A mechanical signaling switch, disposed within the housing of a signaling relay and having a first end of the signal lead connected to the first mechanical switch, the mechanical signaling switch having a normally open position and a closed position; and The signaling coil is arranged inside the housing of the signaling relay and configured to move the mechanical signaling switch to the closed position when energized; Signaling power lead, which is connected to the signaling coil and configured to connect the signaling coil to a current source; and The signaling return lead is connected to the signaling coil and thus to the signaling power supply lead. The signaling return lead is configured to connect the signaling coil to a current source.

14. The interlocking device of claim 1 further includes a halogen-containing fluid source connected to a second end of the signal lead via the first mechanical switch and the second mechanical switch and thereby connected to a first end of the signal lead, the halogen-containing fluid source being configured to allow halogen-containing fluid to flow to the semiconductor processing system when both the first mechanical switch and the second mechanical switch electrically connect the first end of the signal lead to the second end of the signal lead.

15. A semiconductor processing system, comprising: The main body of the chamber is connected to the exhaust source via an exhaust duct; A substrate support is arranged within the chamber body and supported therein to rotate, thereby rotating about a rotation axis; A connector that runs along the exhaust duct and connects a halogenated fluid source to the exhaust duct; A manual valve, arranged along the exhaust duct between the chamber body and the connector, includes: The valve body has an inlet port and an outlet port; and Valve components, supported for movement within the valve body between an open position and a closed position, wherein the inlet port is fluidly connected to the outlet port in the open position and fluidly separated from the outlet port in the closed position; and The interlocking device as described in claim 1, further comprising: A valve opening switch, operably associated with and configured to electrically close when the valve member is in the open position; and A valve shut-off switch, operably associated with and configured to electrically close when the valve member is in the closed position. The valve opening switch is operably associated with the first mechanical switch, the valve closing switch is operably associated with the second mechanical switch, and both the valve opening switch and the valve closing switch are electrically disconnected when the valve member is between the open and closed positions.

16. The semiconductor processing system of claim 15, further comprising: A silicon-containing precursor source, connected to the exhaust duct via the chamber body, includes silicon-containing precursors selected from silanes, ethylsilanes, propanes, dichlorosilanes, and trichlorosilanes; and The halogenated fluid source includes halogenated fluids selected from hydrochloric acid, chlorine gas, and chlorine trifluoride.

17. The semiconductor processing system of claim 15, further comprising: A mechanical signaling switch that connects the first end of the signal lead to the first mechanical switch; The power supply is connected to the first end of the signal lead; The controller, operably coupled to a mechanical signaling switch and responding to instructions recorded in memory, can: Receive user input from the user input terminal; and In response to user input, a mechanical signaling switch is used to electrically connect the power supply to a first mechanical switch, allowing halogen-containing fluid to flow to the connector. Therefore, when the valve component is not in the closed position, one of the first or second mechanical switches electrically disconnects the power supply from the second end of the signal lead to interlock the flow of halogenated fluid into the exhaust duct.

18. A method for interlocking a halogen-containing fluid source, comprising: At the interlocking device, the interlocking device includes: a signal lead having a first end and a second end; a first mechanical switch connected to the first end of the signal lead, the first mechanical switch having a normally closed position and an open position; and a second mechanical switch connecting the first mechanical switch to the second end of the signal lead, the second mechanical switch having a normally open position and a closed position. Receive user input at the user input terminal of the controller; In response to the receipt of user input, a voltage is applied to the first end of the signal lead to cause the halogen-containing fluid to flow from the halogen-containing fluid source; When the first mechanical switch is in the open position and / or the second mechanical switch is in the normally open position, the halogen-containing fluid is prevented from flowing from the halogen-containing fluid source; and The second end of the signal lead is electrically connected to the first end of the signal lead through the first and second mechanical switches. When the first mechanical switch is in the normally closed position and the second mechanical switch is in the closed position, the halogen-containing fluid flows.

19. The method according to claim 18, wherein, The interlocking device includes a valve opening switch and a valve closing switch operably associated with a valve component of a manual valve arranged along an exhaust duct, and the method further includes: Moving the valve component to the open position closes the valve opening switch, thereby keeping the second mechanical switch in the normally open position. The second mechanical switch also disconnects the second end of the signal lead from the first end of the signal lead to interlock the halogen-containing fluid source; and While the halogenated fluid source is interlocked, the silicon-containing precursor is allowed to flow through the manual valve and into the exhaust duct, so that no halogenated fluid flows from the halogenated fluid source to the exhaust duct.

20. The method of claim 19, further comprising: The valve component is moved from the open position to a position between the open and closed positions, thereby disengaging the valve opening switch. The second mechanical switch remains in the normally open position, and the second mechanical switch disconnects the second end of the signal lead from the first end of the signal lead to interlock the halogen-containing fluid source; and While the halogenated fluid source remains interlocked, another silicon-containing precursor flows through the manual valve and into the exhaust duct, so that no halogenated fluid flows from the halogenated fluid source to the exhaust duct.

21. The method of claim 19, further comprising: The valve component is moved to the closed position, thereby closing the valve shut-off switch and moving the second mechanical switch to the closed position, such that the second end of the signal lead is electrically connected to the first end of the signal lead via both the first and second mechanical switches; and Allow halogenated fluid to flow into the exhaust duct to remove silicon-containing precursors and / or residues from the exhaust duct without returning the halogenated fluid to the chamber body connected to the exhaust duct via a manual valve.

22. An interlock kit for a halogen-containing fluid source, comprising: A signal lead having a first end and a second end, the first end of the signal lead being configured to be connected to a power source, and the second end of the signal lead being configured to be connected to a halogen-containing fluid source. A first mechanical switch is configured to be connected to a first end of a signal lead, the first mechanical switch having a normally closed position and an open position; as well as A second mechanical switch is configured to connect the first mechanical switch to a second end of the signal lead, the second mechanical switch having a normally open position and a closed position.

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