Machining tools or other workpieces comprising ceramic-metal composites, machining methods, motion transmission methods, machining machines and complex elements

Abstract

This invention relates to machining tools and surface finishing methods using the DL (deep-drilling) method, the tools comprising ceramic-metal composites with uniformly polished surfaces. In some embodiments, the machining tool exhibits compressive stress less than -500 MPa after polishing, or equal to or greater than 40% of the compressive stress generated during the grinding process. In some embodiments of the invention, the machining tool has a uniformly polished surface along the cutting edge, i.e., perfect flatness between the metal and ceramic components of the tool, such that the roughness of the cutting edge is in the sub-micron range. In some cases, the machining tool has a roughness variation along the cutting edge and adjacent surfaces along the tool's uniform or regular cutting edge.

Description

Technical Field

[0001] This invention can be applied to all types of workpieces made of polished ceramic-metal composites, where workpiece durability is an important aspect. The ceramic-metal compound may be present only in portions of the workpiece surface or throughout the entire workpiece. In some examples, the ceramic-metal compound is a surface coating of a workpiece made of another material.

[0002] One example is a machining tool, which is generally made of a polished ceramic-metal composite material and allows for the formation of parts or materials by removing, extracting, separating or deforming materials, for example by chip removal, grinding or cutting.

[0003] The patent must cover the concept of processing tools in a broad sense, including, for example, sharp tools, excavator blades, tunnel boring machine cutting blades, or hammering tools.

[0004] The machining tool is an important example, but there are other parts made of polished ceramic-metal composites whose durability is important and are also protected by this patent.

[0005] For example, motion transmission elements such as gears or cams can also be made of ceramic-metal composites, which wear down due to friction. Another example is components used in the aerospace industry, which wear down due to continuous friction.

[0006] Component durability is a critical aspect of the maintenance and repair of complex components, such as machining equipment or aircraft. Maintenance and repair of complex components involves planning to replace components that are nearing the end of their service life. In most cases, the replacement of these components means downtime for the complex component, resulting in economic losses.

[0007] In summary, the increased durability of components incorporating polished ceramic-metal composites means a longer service life and a reduced need to replace them, as well as lower economic costs associated with the operation of complex components, such as those containing polished ceramic-metal composites (e.g., machinery or aircraft). Background Technology

[0008] Processing is a manufacturing process that includes a series of operations that form a workpiece by removing, extracting, separating, or deforming material (e.g., by chip removal, grinding, or cutting).

[0009] One type of machining involves using a machining tool to broach or cut material, resulting in scrap or chips. The machining tool typically consists of one or more cutting edges or inserts that remove chips from the workpiece with each pass.

[0010] Some machining tools are electric drills or drill bits, cutting tools of planers, broaches of broaching machines, turning tools of lathes, or milling cutters of milling machines.

[0011] Machining tools are used to manufacture ceramic-metal composites (inorganic composites), such as cemented carbide, also known as hard metal (Widia, Vidia in German), metal carbide, or tungsten carbide.

[0012] Tungsten carbide is a composite material with a non-uniform distribution of hard ceramic particles of tungsten carbide (WC) embedded in a metal mold (typically cobalt (Co)). The ceramic particles provide enhanced hardness and wear resistance to the final material, while the metal binder provides high fracture toughness. Furthermore, tungsten carbide is also a material resistant to medium / high temperatures.

[0013] For the reasons mentioned above, tungsten carbide is widely used in the manufacture of machining tools or other types of parts, where durability is an important aspect.

[0014] Parts made from ceramic-metal composites (such as machining tools) are primarily post-processed using grinding techniques, where abrasive products are used, typically by rotating grinding wheels, to remove small material chips from the manufactured part. The grinding process generates compressive stresses of approximately -1500 MPa to -2000 MPa in the surface layer (ranging from an initial 10 to 20 micrometers), depending on the content of the metal binder (called the binder) and the size of the reinforcing phase (ceramic phase), which can range from ultrafine to coarse.

[0015] These compressive stresses increase the durability of components under operating conditions; however, the roughness (Ra on the order of 0.1 to 0.6 micrometers) caused by the grinding process can create surface defects such as localized oxidation effects or nanoscale protrusions resulting from the preferential polishing of the less hard phase. These surface defects, for example, prevent the machining tool from properly removing chips under operating conditions, thus leading to a shortened tool life.

[0016] For this reason, it is necessary to strike a compromise between surface quality in terms of residual compressive stress and the final roughness of parts made of ceramic-metal composites.

[0017] Therefore, workpieces made of ceramic-metal composites (such as machining tools) are now polished after grinding.

[0018] Due to the extremely high hardness of ceramic-metal composites, parts made of ceramic-metal composites (such as machining tools) are typically polished using mechanical systems, mechanical-chemical systems (CMP), chemical systems, or electrochemical systems.

[0019] Some well-known polishing processes cause a significant reduction (or even disappearance) of the compressive stress layer because these processes extract tens of micrometers from the surface layer. Specifically, the compressive stress generated during the grinding process of a part (typically between -1500 MPa and -2000 MPa) is reduced by 60% to 80%. As a result, the durability of the part is reduced after polishing because it exhibits only 20% to 40% of the initial compressive stress.

[0020] When components made of ceramic-metal composites are subjected to chemical or electrochemical polishing, the polishing process is uneven due to the differences in mechanical properties between the ceramic particles and the metal binder, resulting in varying levels of polish at the interface between the two components. Furthermore, due to the pH value of the medium or polishing liquid used in the electrochemical process, localized selective erosion occurs within the metal binder, completely dissolving the metal elements in the surface layer of the material being polished. This erosion of the interface ranges from a few nanometers to a few micrometers, and in some cases, can reach tens of micrometers. This phenomenon is known as "leaching."

[0021] When components comprising ceramic-metal composites are polished using standard chemical or electrochemical processes, the ceramic elements of the composite protrude from the metal elements, thus absorbing most of the stress generated during the processing. This ceramic phase of the material is the most brittle and can act as the initiation point for fracture cracks or as a stress concentration point.

[0022] Ceramic-metal composites can consist of more than two phases; these are called γ phases. These phases exhibit precipitates that are harder than WC, such as TiC, TaC, NbC, etc.; the most common is WC-(W,Ti,Ta,Nb)C-Co. These hardening particles can be tungsten carbide, titanium, niobium, tantalum, etc. During the machining of parts with these γ phase particles in their microstructure, the significant difference between the mechanical properties of these parts and the rest of the die can cause inhomogeneity and spalling, which reduces the mechanical properties of the tool surface, decreases its performance under operating conditions, and shortens the tool's lifespan.

[0023] Uneven polishing of the surface in specific areas of cutting tools (including the cutting edges of such tools) including ceramic-metal composites significantly reduces the mechanical properties of the tool and thus reduces its durability, because it cannot uniformly transfer the stress generated on the cutting edge to the rest of the tool during the machining process.

[0024] After a thorough micron- or submicron-scale analysis of both the geometry and microstructure of machining tools, including ceramic-metal composites, and polished by conventional polishing methods (e.g., mechanical, CMP, chemical, or electrochemical), a reduction in compressive stress generated in the machining tool after the grinding process was observed, as well as non-uniform polishing within the machining tool region due to greater extraction of metal elements relative to ceramic elements when the machining tool exhibits inhomogeneous and / or complex geometries.

[0025] Conventional techniques cannot uniformly reduce the roughness inside the cutting edge and cause unstable chip removal under working conditions; they also cause hot spots in the internal channels, thereby reducing their durability.

[0026] Similarly, on machining tools that include ceramic-metal composites and are polished by conventional polishing methods (e.g., mechanical, CMP, chemical, or electrochemical), uneven or irregular roughness variations along the cutting edge of the tool are observed between the cutting edge and the face adjacent to the cutting edge.

[0027] In the special case of drills or end mills, the performance of these cutting tools depends on what is called... K The properties of a factor. K The factor is a parameter characterizing the micrometer-scale geometry of the cut-off angle, defined as the ratio of the detachment surface to the principal incident surface (S). γ / S α Its optimal value depends on the material processed with this tool. K = 0.7-0.8 is the optimal value for tungsten carbide drills or end mills used for machining titanium alloys, while K = 1 is the optimal value for tungsten carbide drills or end mills used for machining other metals (such as aluminum, iron, etc.) and their corresponding alloys. This is achieved by maintaining the smoothness between the different metal and ceramic components present in the microstructure of the composite material. K Factors cannot be achieved through conventional polishing methods.

[0028] For certain applications, coatings are applied after machining and polishing or finishing stages to improve some mechanical properties of the cutting tool surface. Typically, to increase the tool's cutting ability and durability under extreme operating conditions (e.g., temperature, lubricants, etc.), these coatings have higher hardness and corrosion resistance than the ceramic-metal substrate, which in turn is detrimental to its toughness. The fragility of the coating makes it prone to crack nucleation and propagation, which can penetrate the substrate and cause catastrophic defects to the tool itself. Therefore, methods exist to reduce and / or eliminate defects (e.g., droplets generated during the deposition process) before they penetrate into the tool mold. If the critical defective area is removed in this process without compromising the integrity of the rest of the tool, the tool can be reused after a subsequent coating of the previously peeled area. In these processes, the possibility of propagating damage to the tool's mechanical or surface integrity using conventional methods, such as mechanical processes, is high. This means that the likelihood of success during the recovery or repair process of a cutting tool with a defective coating is low.

[0029] Another problem that arises during the polishing of workpieces, including ceramic-metal composites, is the uneven polishing between different areas of the workpiece, for example, between the cutting edge of the machining tool and the chip removal area, which is typically concave.

[0030] During polishing processes involving chemical or electrochemical methods, areas with higher electrolyte mobility are more easily polished than areas with lower electrolyte mobility. The roughness variation between areas of a cutting tool polished by chemical and / or electrochemical polishing processes is uneven or irregular.

[0031] This situation also causes the stress applied to the cutting edge to be unevenly or irregularly transmitted to the rest of the machining tool, thereby reducing the durability of the machining tool.

[0032] In addition to tool durability, a lack of uniformity or regularity in the cutting edge and / or a lack of uniformity or regularity in the roughness variation between areas of the tool can lead to reduced machining accuracy and increased machining time and energy required to perform the machining.

[0033] Parts made of other ceramic-metal composites (such as Ti(C,N)-FeNi, and other composites or cermets) exhibit the same problems once polished by mechanical, CMP, chemical, or electrochemical polishing.

[0034] Therefore, the object of the present invention is a new processing tool or another type of component comprising a polished ceramic-metal composite material having greater durability than materials polished using conventional processes. Summary of the Invention

[0035] This invention can be applied to all types of workpieces made of polished ceramic-metal composites, where workpiece durability is an important aspect. Machining tools are an important example, but others include motion transmission components such as gears, cams, or bearings, or components used in the aerospace field.

[0036] The present invention also covers components made of materials exhibiting two or more distinct phases and highly different chemical properties, and therefore highly different physical, mechanical, and electrochemical properties, resulting in surface finishes or non-uniform smoothness, depending on the rate of interaction between the medium and each component. Examples could be, for instance, iron castings or aluminum alloys with high silicon concentrations.

[0037] The object of the present invention is a machining tool or other type of component comprising a ceramic-metal composite material that maintains the highest percentage of compressive stress generated by the grinding process after post-processing (polishing), in order to increase the durability and accuracy of the cutting tool or other type of component, while reducing the time and energy required in the machining method.

[0038] Furthermore, the subject of this invention is a machining method performed with a machining tool having ceramic-metal composite material, a motion transmission method with a workpiece having ceramic-metal composite material, a machine tool including a machining tool having ceramic-metal composite material, and a complex workpiece component (such as an aircraft) having ceramic-metal composite material.

[0039] Component durability is a critical aspect of maintaining and repairing complex components, such as machining equipment or aircraft. In the maintenance and repair of complex components, the plan is to replace components that are nearing the end of their service life. In most cases, the replacement of these components means downtime of the machine or complex component, resulting in economic losses.

[0040] In summary, the increased durability of components incorporating polished ceramic-metal composites means a longer service life, thus reducing the need for replacement and the economic costs associated with operating complex components, such as those incorporating polished ceramic-metal composites (e.g., machines or aircraft).

[0041] The present invention relates at least in part to a machining tool, including a cutting and / or drilling tool (which comprises a metal-ceramic composite material), or another type of component comprising a uniformly polished surface.

[0042] The present invention also covers polishing methods, including both processes and electrolytes, by which tools are polished to achieve the beneficial effects detailed in this report.

[0043] In this specification, machining tools are defined as including applications, characteristics, and uses such as turning, drilling and milling, shaping, brushing, sawing, cutting, and broaching.

[0044] The uniform surface polishing according to the invention includes, in some embodiments, a ceramic-metal interface with a roughness between 20 nm and 100 nm. In some embodiments, the roughness is less than 20 nm. Examples of uniform roughness according to the invention include roughnesses of less than 15 nm, less than 10 nm, and less than or equal to 5 nm.

[0045] Surface or surface layer refers to any part of a tool that comes into contact with the surrounding medium (e.g., the workpiece to be machined). Specifically, uniform surface polishing includes polishing the cutting edge and / or the surface adjacent to the cutting edge.

[0046] The object of the present invention includes a cutting and / or drilling tool comprising a ceramic-metal composite material that maintains the highest percentage of compressive stress generated by the grinding process after a polishing process, and allows the stress applied to the cutting edge to be uniformly transferred to the rest of the tool during its use, and indirectly increases its durability under operating conditions through the applied polishing process.

[0047] Furthermore, the subject of this invention is a machining method performed with a machining tool having ceramic-metal composite material, a motion transmission method with a workpiece having ceramic-metal composite material, a machine tool including a machining tool having ceramic-metal composite material, and a complex component (such as an aircraft) including a component having ceramic-metal composite material. Explanation of the invention

[0048] According to the present invention, the processing tool comprises a ceramic-metal composite material, in some embodiments including tungsten carbide (WC), W(Ti,Ta), W-Co, or Ti(C,N)-FeNi, etc., and a uniform surface polishing. In some embodiments, the metal binder included in the mold comprises cobalt, nickel, iron, chromium, or combinations thereof in different proportions.

[0049] Specifically, the processing tools or other types of parts, including ceramic-metal composite materials, for the purposes of this invention, have a compressive stress of less than -400 MPa after polishing. Preferably, the compressive stress after polishing is less than -500 MPa, less than -1000 MPa, less than -1500 MPa, or less than -2000 MPa. In a specific embodiment of this invention, the compressive stress after polishing is between -1600 MPa and -1800 MPa.

[0050] The grinding process generates compressive stress in the workpiece between -1500 MPa and -2000 MPa, typically between -1600 MPa and -1800 MPa. Machining tools or other types of parts comprising ceramic-metal composite materials according to the invention, after polishing following grinding, include at least 25% of the initial compressive stress before polishing. Preferably, the post-polishing compressive stress is at least 40%, or 50%, or 60%, or 70%, or 80%, or 90%, or 99% of the initial compressive stress. In a specific embodiment of the invention, the post-polishing compressive stress is between 80% and 90% of the compressive stress generated during the grinding process.

[0051] In some preferred embodiments, the workpiece comprising a ceramic-metal composite material, for the purposes of this invention, experiences compressive stress between -1280 MPa and -1620 MPa after grinding and post-polishing processes. Therefore, the durability of the cutting tool does not decrease to the extent that the workpiece would have been polished via a conventional polishing process (which is a standard mechanochemical polishing process).

[0052] The compressive stress on a component can be measured using X-ray diffraction (XRD) technology, and the sin... 2 The ψ method is used for analysis.

[0053] The polishing process for obtaining the component for the purpose of this invention preferably includes an ion transport phase between the workpiece to be polished and a set of solid particles, the solid particles comprising an internal liquid electrolyte and covered with a liquid that has lower conductivity than the solid particles and is immiscible.

[0054] In some cases, during this polishing process, two solid particles come into contact or one solid particle comes into contact with the workpiece to be polished, resulting in ion exchange, which allows for conductivity between the solid particles or between the solid particles and the workpiece to be polished.

[0055] Unlike other electrochemical methods, this polishing process restricts ion transport to the surface protrusions due to the contact between conductive particles and these protrusions, enabling more precise polishing with less material extraction to achieve the desired surface finish. Furthermore, this polishing process alters the surface state (whether for its tribological conditions, impact, or other applications) without changing internal stresses or any other microstructural conditions.

[0056] In tools with coatings applied after machining and polishing or finishing stages, cracks may appear in the coating, and the propagation of these cracks towards the substrate impairs its structural integrity under operating conditions, potentially reducing its durability. By means of a polishing method according to the invention, comprising conductive solid particles, once one or more cracks are detected in the coating, the layer can be removed without damaging the substrate, allowing it to be reused through the coating process, thereby increasing the tool's lifespan and reducing associated costs. The invention covers processes for extending the lifespan of tools comprising ceramic-metal molds and coatings. In some cases, the tool is coated with a single or multiple layers of coating, with different bilayer cycles and different ceramic systems, such as binary (e.g., CrN, TiN, ZrN, etc.), ternary (e.g., TiAlN, TiSiN, AlCrN, etc.), and / or quaternary (e.g., AlCrSiN, etc.).

[0057] Figure 3 The results show that the workpiece after the grinding process has a compressive stress of approximately -1800 MPa. If the same workpiece is polished by an EDM process after grinding, the compressive stress is completely eliminated and traction stress is generated. If the same workpiece is polished by a mechanical-chemical polishing (P) process after grinding, the residual stress after polishing is approximately 400 MPa. Finally, it was observed that if the same workpiece is polished by a DL process after grinding, the residual stress after polishing is approximately -1600 MPa.

[0058] Figure 4 The diagram schematically illustrates the different damages obtained on a workpiece during ball indentation testing for the most common industrial surface conditions: grinding, electrical discharge machining (EDM), post-grinding mechanical polishing (P), or post-grinding solid conductive particle polishing according to the present invention.

[0059] Figure 4 b shows the number of cracks generated in the workpiece during ball indentation testing for the most common industrial surface conditions: grinding, electrical discharge machining (EDM), post-grinding mechanical polishing (P), or post-grinding solid conductive particle polishing according to the present invention.

[0060] Figure 4 c shows the crack length produced in the workpiece during ball indentation testing for the most common industrial surface conditions: grinding, electrical discharge machining (EDM), post-grinding mechanical polishing (P), or post-grinding solid conductive particle polishing according to the present invention.

[0061] It can be observed that, after the grinding process, the workpiece polished by the solid conductive particles according to the present invention has greater durability (fewer cracks and shorter crack lengths) than the same workpiece polished by EDM or P after the grinding process.

[0062] Specifically, when the polished workpiece comprising a ceramic-metal composite material, which is the object of this invention, is a machining tool, the tool exhibits flatness along the cutting edge between the metal and ceramic elements of the tool. In this invention, flatness is considered to be present when the roughness is in the submicron range (i.e., equal to or less than one micrometer, specifically less than 20 nm).

[0063] This feature allows the stress applied to the cutting edge to be evenly distributed to the rest of the cutting tool, thereby increasing the durability of the cutting tool.

[0064] Preferably, the surface roughness of the machining tool at the cutting edge is less than 20 nm, less than 15 nm, less than 10 nm, or less than 8 nm.

[0065] Preferably, the machining tool exhibits a uniform or regular roughness variation along the cutting edge of the tool between the cutting edge and the face adjacent to the cutting edge.

[0066] Similarly, this feature allows the stress applied to the cutting edge to be evenly distributed to the rest of the cutting tool, thus increasing the durability of the cutting tool.

[0067] Polishing methods using conductive solid particles are particularly efficient in uniformly reducing the roughness of all components present in the microstructure of a material surface. This includes, in some cases, high-hardness precipitates known as the γ phase. Tools according to the invention, in some cases, incorporate uniform polishing without exhibiting defects associated with differences in the properties of these particles and the remaining phases present in the mold.

[0068] As mentioned above, K Factors are key variables in defining the performance of cutting tools. The object of this invention is a polishing cutting tool comprising a material made of a metal-ceramic mold, the required... K The factor depends on each embodiment of the invention detailed in this report, on the material to be processed, and thus retains at least 40%, or 50%, or 60%, or 70%, or 80%, or 90%, or 99% of the compressive stress prior to the polishing process.

[0069] Specifically, the present invention includes a polishing cutting tool comprising a material made of a metal-ceramic mold, the desired... KThe factor depends on each embodiment of the invention detailed in this report, on the material to be processed, and thus retains at least 40%, or 50%, or 60%, or 70%, or 80%, or 90%, or 99% of the compressive stress prior to the polishing process. In some embodiments, these tools exhibit height differences on the order of nanometers between different constituent phases, and achieve flatness on the order of nanometers or even lower, even between different microscopic components of the mold. More specifically, the present invention covers tools that exhibit the aforementioned degree of flatness, minimizing defects such as regrowth or erosion within the metal mold. Attached Figure Description

[0070] To supplement the description and to aid in a better understanding of the features of the invention, several pages of illustrative and non-limiting figures are included as part of the invention, wherein the following are shown:

[0071] Figure 1 - A perspective section of the machining tool area is shown, in which the cutting edge and the adjacent surfaces of the cutting edge are observed. In this figure, it is observed that the variation in roughness between the cutting edge and the adjacent surfaces is not constant along the cutting edge of the tool.

[0072] Figure 2 - A top view of the machining tool area is shown, in which the cutting edge and adjacent surfaces are observed. In this figure, the roughness variation between the cutting edge and the adjacent surfaces is observed to be constant along the cutting edge of the tool, and the polishing is uniform within the cutting edge region.

[0073] Figure 3 - A schematic diagram of the stresses generated in the ceramic-metal sample is shown, which are for the three most common types of surface treatments and the surface treatment types described in this invention; grinding process and EDM, and in both cases, residual compressive stress starting from the ground surface (the same as the compressive stress presented in the graph of sample-G), residual compressive stress after the polishing process P, or residual compressive stress on the surface of the workpiece by the conductive solid particles (DL) according to the invention.

[0074] Figure 4 - This diagram illustrates different damages obtained on a workpiece according to radar plot P in a ball indentation test. (b) and (c) compare the damage caused by different surface conditions (after grinding and EDM, and after polishing by conductive solid particles (DL) according to the invention) based on the number and length of cracks, respectively.

[0075] Figure 5 - This illustrates a drill bit comprising a ceramic-metal composite material with uniform polishing.

[0076] Figure 6- This diagram shows a set of gears comprising a ceramic-metal composite material with uniform polishing.

[0077] Figure 7 - An excavator bucket according to the present invention comprises a ceramic-metal composite material having a uniform polish.

[0078] Figure 8 - A micrograph taken by scanning electron microscopy on the cutting surface of a machined milling cutter made of tungsten carbide is shown, wherein the surface results obtained after treatment with four different electrolytes (L800, L803, L807 and L808) according to the invention, which are described later in the examples, while keeping the electrical parameters constant and using them as the only variable, can be compared in terms of the level of smoothness between polishing penetration and composition.

[0079] Figure 9 - A micrograph taken by scanning electron microscopy on the cutting surface of a micro-drill bit made of tungsten carbide is shown, wherein the surface results obtained after treatment with four different electrolytes (L800, L803, L807 and L808) according to the invention, which are described later in the examples, while keeping the electrical parameters constant, can be compared in terms of the level of smoothness between polishing penetration and composition.

[0080] Figure 10 - This illustrates the process by which the cutting radius of the tungsten carbide tool according to the present invention changes with polishing time.

[0081] Figure 11 - This illustrates the process by which the peeling level of a titanium nitride (TIN) coating deposited on a tungsten carbide substrate according to the present invention changes with polishing time. Detailed Implementation

[0082] A preferred embodiment for obtaining the processing tool for the purposes of this invention is through an electrochemical polishing process, which includes an ion transport phase between the workpiece to be polished and a set of ion-transporting solid particles, in some cases comprising an internal liquid electrolyte. In some embodiments, the particles comprise water. In some embodiments, the particles are coated with a liquid that is less conductive than the solid particles and, in some cases, is immiscible with any other components.

[0083] During this polishing process, ion exchange occurs when two solid particles come into contact or when one solid particle comes into contact with the workpiece to be polished, thereby allowing conductivity between the solid particles or between the solid particles and the workpiece to be polished.

[0084] The solid particles in the polishing method DL covered by the present invention can be ceramic, polymer, organic, inorganic, plant-derived, etc.

[0085] Preferably, the conductive particles are ion-exchange resins because they are advantageous for ionic conductivity in this manner. More preferably, the particles are cation-exchange resins because they are able to capture metal ions extracted during electropolishing and maintain their initial properties in this manner.

[0086] Ion exchange particles with high porosity are generally referred to as macroporous particles, while microporous particles are referred to as gel-type particles. Both types are applicable to this invention.

[0087] Preferably, the particles have a liquid retention capacity of 20% to 100% of the total mass based on the mass of water, specifically 40% to 100% of the total mass based on the mass of water, and more specifically 40% to 70% of the total mass based on the mass of water.

[0088] In some implementations, the particles retain acid to facilitate ion exchange.

[0089] The functional groups present in the exchange resin can be cation exchange type, such as sulfonic acid / sulfonate, carboxylic acid / carboxylate; anion exchange type, such as amine / ammonium, quaternary ammonium; or chelate type, such as iminodiacetic acid, aminophosphonic acid, polyamine, 2-pyridinemethylamine, thiourea, amylopyridine oxime, isothiourea or bispyridinemethylamine, because these groups are suitable for ion trapping and facilitate electropolishing.

[0090] The base polymer can be a polymer based on monomers such as styrene and its derivatives (e.g., divinylbenzene, acrylate-type, methacrylate, and their derivatives with different functional groups) or phenolic resins. Preferably, the solid particles are resins of sulfonated styrene and divinylbenzene copolymers, whether gel-type, macroporous, or other structures, because they are able to trap ions and have good electrical, chemical, and mechanical stability.

[0091] When an electrolyte medium is used in an electropolishing process, transport occurs at the particle / surface contact point, that is, only at the peak of surface roughness. Therefore, the effect of the electrolyte medium can be tuned by adjusting the shape of the particles.

[0092] The particles can flow over the surface of the workpiece to be polished, thus producing a uniform effect across its entire surface. A generally favorable shape for particle movement on the surface to be treated is spherical. In some cases, the particles are essentially spherical or have a spherical geometry, as this allows them to adapt to a wide variety of geometries. Preferably, the center value of this set of spheres is between 50 micrometers and 2 mm. This metric, through geometry, helps to eliminate the roughness typical of tooling.

[0093] Preferably, a set of spheres with a bimodal particle size distribution can be used to achieve the speed provided by the large particles and the detail polishing provided by the smaller particles.

[0094] Depending on the geometry of the surface being polished, using other shapes that are more suited to the requirements can be useful. Examples include discs, cylinders, rods, fibers, cones, and pointed shapes. In some cases, it is preferable to use fragments of broken particles, which facilitates entry into areas with small concave radii.

[0095] Commercially available poly(styrene-divinylbenzene) sulfonated gel-type or macroporous cation exchange resin spheres are preferred for use in this invention. In some cases, the electrolyte used in this invention comprises chemically active particles capable of neutralizing galvanic residues emitted during polishing, for example, a weakly basic anion exchange resin formed by crosslinking a divinylbenzene with an acrylic backbone and functionalizing it with tertiary amines.

[0096] The following are some of the components included in the electrolyte DL used in some embodiments of the present invention.

[0097] – Retain water:

[0098] Solid electrolyte particles retain a certain amount of water. This retained water is responsible for dissolving oxides and salts formed on the surface to be polished during the electropolishing process. Furthermore, it is water, or more precisely, the water-particle combination, that acts as a conductor of electrical conductivity, possibly through ion transport mechanisms.

[0099] Before preparing the electrolyte medium, it is preferable to wash the solid particles with liquid retention capacity with distilled water and partially dry them so that they retain liquid. After this process, the particles still contain a certain amount of water, which is retained in the electrolyte particles rather than being free; that is, in some cases, the particles do not exude the retained water after this process. In some embodiments of the invention, the particles are washed with water once or multiple times at a temperature between 60°C and 200°C, preferably between 60°C and 150°C, specifically above the boiling point. Washing the resin is to remove any excess possible acid residue present in the solid structure. In some cases, it is preferable to continue the washing process until the pH of the wash water is between 4 and 7, specifically between 5 and 7, specifically 5.4 or a similar value.

[0100] Preferably, the ion exchange resin particles retain between 10% and 50% water relative to the total mass of water. This amount ensures sufficient liquid to produce a salt-soliciting effect.

[0101] The water retained in the particles can originate from a particle cleaning process. That is, a washing process is performed on a group of particles with the ability to retain liquid, which includes a final stage of washing with water. Preferably, the water used for washing is distilled water with a conductivity of less than 10 micrometers / cm. This low conductivity keeps the electrochemical process under control.

[0102] - Liquids with low conductivity:

[0103] The main characteristic of this liquid is that its electrical conductivity is lower than that of conductive particles. For example, the conductivity of a liquid with lower conductivity is 90%, 50%, 20%, 5%, or 1% lower than that of conductive particles.

[0104] When involved in an electrochemical process, the liquid with lower conductivity exhibits high chemical and thermal stability in some cases due to the localized high temperatures during the electropolishing process.

[0105] In some cases, liquids with lower conductivity are not miscible with water, so they will not mix or diffuse with the water retained in the particles.

[0106] In other cases, the non-conductive liquid is water, and in other cases it is a mixture of water and other non-conductive liquids, and in some cases it is miscible, and in other cases it is immiscible.

[0107] Furthermore, this low-conductivity liquid must remain in a liquid or fluid state within the operating range. Since the process involves distilled water, the operating range is in some cases between 0°C and 100°C. The operating range is preferably below 60°C.

[0108] Because solid particles behave similarly to granular materials, it is convenient in some cases to use liquids with lower conductivity as lubricants or fluidizing agents, or a combination of both.

[0109] The lubricating effect of low-conductivity liquids helps reduce friction between two objects. This friction occurs both between two conductive particles and between the conductive particles and the workpiece to be polished. In both cases, the amount of lower-conductivity liquid expelled due to contact between conductive particles and other conductive particles or the workpiece results in less erosion and a more controlled polishing process, ultimately reducing the intensity of the polishing process.

[0110] The fluidization effect of a lower conductivity liquid is beneficial for reducing the viscosity of the combination of conductive particles and the lower conductivity liquid. By changing the overall rheological properties, the hydrodynamics of conductive particles circulating on a metal surface can be altered. Increasing the ratio of liquid (lower conductivity) to conductive particles may reduce the overall viscosity, which is detrimental to conductivity. A higher amount of liquid (lower conductivity) results in a lower density of conductive particles that transfer the electric field from the cathode to the anode, leading to a slower surface treatment speed.

[0111] Liquids with lower conductivity that can be used in this application include, but are not limited to, aliphatic and / or aromatic hydrocarbons, organosilicones, organic solvents, fluorinated solvents, fatty acids, fatty alcohols, ethylene glycol, sulfoxides, etc. In some cases, these liquids with lower conductivity can be mixed with solvents such as distilled water (in some cases, the conductivity of liquids such as organosilicones and hydrocarbons will be lower than that of distilled water).

[0112] The solvent-to-hydrocarbon ratio is, for example, 5:1, although it can be as low as 4:1 or 3:1.

[0113] Organosilicones are of particular interest in this application due to their electrical, chemical, and thermal stability.

[0114] Liquid silicones exhibit high thermal and chemical stability, while also acting as electrical insulators and possessing lubricating properties. These characteristics make them an excellent candidate for this application. All of these contribute to their influence on the solid electropolishing process of this invention.

[0115] In this document, organosilicon is broadly understood to include all compounds, oligomers, or polymers containing a siloxane group and the general formula [-OSiR 2-]n, whether linear, branched, or cyclic. The R group is preferably a hydrocarbon group, such as, but not limited to, methyl, ethyl, n-propyl, isopropyl, tert-butyl, n-hexyl, cyclohexyl, phenyl, etc.

[0116] The preferred group of liquid silicones are those containing poly(dimethylsiloxane) because they have low viscosity and are non-toxic. Preferably, low-viscosity liquid silicones with a dynamic viscosity of less than 20 cp are used, preferably in the range of 1 cp to 10 cp at 25°C.

[0117] Cyclic liquid organosilicones, such as cyclosiloxanes, including octamethylcyclotetrasiloxane D4, decamethylcyclopentasiloxane D5, or dodecylcyclohexasiloxane D6, are also preferred due to their good solvent properties. Cyclohexane is preferred for low-temperature applications due to its volatility.

[0118] The amount of silicone added to the particles can vary depending on the size and shape of the workpiece to be polished. Surfaces with cavities and corners that result in low particle migration rates achieve better results with a higher proportion of silicone.

[0119] When you want to polish a workpiece with cavities, the less conductive liquid tends to accumulate in the valleys (cavities) of the workpiece, while charged solid particles accumulate in the peaks. This results in a situation where polishing, performed by a combination of solid conductive particles within a less conductive liquid, cannot uniformly polish a workpiece with cavities.

[0120] Hydrophobic elements, such as hydrocarbons (e.g., aliphatic hydrocarbons), are another type of liquid with low electrical conductivity, which facilitates the polishing process of parts with cavities. Thanks to their physicochemical properties, hydrophobic elements give the particle groups cohesiveness, a property that allows the particle groups to penetrate into the cavities of the workpiece, resulting in a more uniform polish.

[0121] Non-conductive liquids incorporating hydrophobic elements can be obtained in an electrolyte medium (a group of conductive particles plus a liquid with lower conductivity) that combines two antagonistic phases. On one hand, the hydrophobic element is hydrophobic; on the other hand, the internally hydrated solid particles are hydrophilic. This combination helps to make the electrolyte medium (a group of conductive particles plus a liquid with lower conductivity and hydrophobic elements) more cohesive and to penetrate more uniformly into the cavity of the workpiece to be polished, thus performing the most uniform polishing.

[0122] In one embodiment, the low conductivity liquid having hydrophobic elements also includes surfactant elements.

[0123] Surfactant elements alter the spacing between solid particles to maintain conductivity between them. Surfactants help modulate the meniscus shape of the conductive fluid typically contained within solid particles, which occurs when two solid particles come into contact or come into close proximity. This characteristic helps modulate the conductivity or current flow between solid particles.

[0124] An example of an application of an electrolyte medium consisting of a group of particles containing acid and water is as follows, wherein the particles are surrounded by a low-conductivity liquid including hydrophobic elements:

[0125] Electrolyte medium for polishing ceramic-metal composites (specifically carbides): a low-conductivity liquid (200 g aqueous medium + 40 g aliphatic hydrocarbons) + 500 g solid particles containing 50% acid and aqueous medium.

[0126] Polishing a component using an electrolyte medium consisting of a set of particles and water (the particles being surrounded by a less conductive liquid containing hydrophobic elements) can be performed by immersing the workpiece in a bucket containing the electrolyte medium, or by spraying the electrolyte medium onto the workpiece to be polished.

[0127] Besides hydrocarbons, surfactants, and organosilicones, other chemical elements as defined above that do not significantly contribute to conductivity may also be used. Some chemical compounds exhibit synergistic effects between conductive solid particles, their distribution and flowability in water, and their ability to coat metal surfaces. These compounds act as resistive layers, protecting metal surfaces from excessive erosion that may occur during the polishing process. Compounds exhibiting such synergistic effects include, for example, fatty acids (C8-C20), fatty alcohols (C2-C20), glycols (C2-C20), and organosulfur compounds such as sulfoxides (C2-C20), specifically dimethyl sulfoxide (DMSO). Other compounds with properties similar to those detailed below also fall within the scope of this invention.

[0128] In some embodiments of the invention, the elements included in the low-conductivity phase have the following properties: a molecular weight between 50 g / mol and 300 g / mol, and a polarity (dipole, D) between 4.5 and 1. In some cases, their melting points are between 150°C and 300°C, and between 0°C and 60°C. In some embodiments of the invention, the dielectric constants of these substances are between 1 and 50. In some cases, the substances used in the invention have acidic (pKa = 4-5), weakly acidic (pKa = 14-16), substantially neutral acid / base properties, and high, moderate, or low hydrophilicity.

[0129] In some embodiments of the invention, liquids with high solubility for salts or ionic compounds are used, specifically sulfoxides, and more specifically dimethyl sulfoxide (DMSO). Sulfoxides are organosulfur compounds having the general formula RS(=O)-R'. In DMSO, both R- groups are methyl (CH3), yielding (CH3)2SO. This molecule exhibits polarization, distribution, and uniform solubility in water, making it an excellent candidate for addition to water in the presence of a non-conductive fluid that surrounds conductive solid particles and coats metallic parts, forming a resistive layer around the workpiece during the working pulse. This results in greater polishing uniformity and fewer defects due to localized erosion or regrowth of the metal binder phase present in the microstructure. The addition of DMSO not only modulates the resistivity of the polishing process but also affects the viscosity of the assembly, giving it shape memory properties, which is particularly relevant in applications or parts exhibiting extrusion or rotational geometry.

[0130] Fatty acids are organic molecules with long hydrocarbon chains and terminal carboxyl groups, which have non-zero polarization. They are present in natural fats and oils. They can be saturated (without double bonds), such as stearic acid or caprylic acid, or unsaturated (with one or more double bonds). These are divided into monounsaturated (with a single double bond, such as oleic acid) and polyunsaturated (with two or more double bonds, such as linoleic acid). The above properties and their high polarity make these molecules excellent candidates for addition to the water present in a non-conductive fluid that surrounds conductive solid particles according to some embodiments of the present invention and covers metal components, forming micelles and structures that are capable of migrating to the metal surface under an electric field and covering it with a resistive layer during a working pulse, resulting in greater polishing uniformity and fewer defects due to local erosion or regrowth of the metal binder phase present in the microstructure. Fatty acids, depending on their proportion in polar and non-polar liquids present in the non-conductive fluid surrounding the conductive solid particles, can change the overall fluidity, which depends on their proportion and the length of the hydrocarbon chain. They act as lubricants in small proportions (0.1% to 10% by weight) and with short chains (<C10), however, at higher proportions and longer chains, they can have the opposite effect. Depending on the polishing time, all of these can cover a range regarding the polishing depth along a specific geometry.

[0131] Some embodiments of the present invention include fatty alcohols, such as dodecanol or hexadecanol, and diols, such as ethylene glycol or propylene glycol, which are composed of hydrocarbon chains containing one or several hydroxyl groups respectively. Fatty alcohols can be saturated or unsaturated and have properties similar to fatty acids. Diols are known for their high solubility in water and are commonly used as solvents, containing properties similar to sulfoxides. They are also molecules that exhibit a dipole moment and have the properties necessary to act as resistive protectants for metal surfaces.

[0132] On the other hand, as described above, the second aspect of the present invention relates to a method of dry electro-polishing with the described electrolyte medium.

[0133] The described electrolyte medium alone is not sufficient to produce a satisfactory electro-polishing effect on inorganic composites. The electrolyte medium is supplemented by the method, specifically by utilizing the type of current applied, to obtain the best results.

[0134] In some embodiments, these solid particles are projected onto the tool to be polished. In other embodiments, the tool is immersed in a particulate compound comprising these particles. This particulate compound includes gaseous elements between the particle groups in some cases and regions of the compound. In other embodiments, the particulate compound is immersed in a liquid medium. Examples of liquid media include liquid electrolytes that are the same as or different from the solid particles, or electrically neutral buffer liquids, or liquid electrolytes with lower conductivity than conventional electrolytes.

[0135] A method incorporating charged solid particles, such as the DL method, allows for adjustment of the radius of the cutting zone and the generation of a contoured or uniform polishing front (see [link to documentation]). Figure 1 , Figure 8 and Figure 9 This allows for the establishment of tolerances between the cutting edge and the roughness variation boundary.

[0136] Examples of DL polishing methods, apparatus, and systems for this type of technology include polishing with charged solid particles, such as porous solid particles, which include, for example, a liquid that provides conductivity to such solid particles through absorption. These examples of methods and electrolytes used for polishing the tool are described in detail in the Examples section.

[0137] Example 1 describes a polishing method for machined end mills and micro drills made of tungsten carbide. The results of polishing with different electrolytes are shown in [reference 1]. Figure 8 and Figure 9 In the micrographs taken using a secondary electron detector emitted by a scanning electron microscope, you can observe that the smoothness level obtained after all treatments is in the micrometer range. After applying various polishing processes, a radius of 8 micrometers is obtained in the cutting thread for machining milling cutters and a radius of 3 micrometers is obtained for micro drills. In the micrographs, it can be observed that the electrolyte exhibiting greater microstructural surface uniformity, higher smoothness, and fewer defects is the treatment described in Example 1.2, which includes an electrolyte based on DMSO in its non-conductive liquid phase. On the other hand, the method with greater polishing depth and therefore higher speed in reducing machining marks is the method described in Example 1.3, which includes an electrolyte based on octanoic acid in its non-conductive liquid phase. Therefore, the best approach to achieve a good trade-off between the extraction rate of machining marks and the uniformity and microstructure smoothness of the polished surface involves a series of steps, including a first step with a longer polishing duration, depending on the radius requirements in the cutting wire, using an electrolyte based on octanoic acid in its non-conductive liquid phase, and a final step (with a shorter polishing time) using an electrolyte based on DMSO or ethylene glycol in its non-conductive liquid phase.

[0138] like Figure 10As shown, the final cutting radius can vary depending on the polishing time. Increasing the polishing time will increase this radius. This is also related to... K The factors have similar correlations.

[0139] According to the present invention, a tool with a uniformly polished surface includes, in some embodiments, a radius of the cutting region between 2 micrometers and 20 micrometers; in some embodiments, between 2 micrometers and 10 micrometers; and in some cases, even a radius with a value of about 5 micrometers.

[0140] According to the present invention, the tolerance between the cutting edge of the tool and the roughness variation boundary includes values ​​between 100 nm and 2000 nm, for example, a tolerance value between 250 nm and 750 nm, and in some embodiments, a tolerance of about 500 nm.

[0141] The purpose of this invention is to provide a machining tool or other type of component made of a ceramic-metal composite material, including a compressive stress of less than -400 MPa after polishing, to improve the durability and precision of the cutting tool or other type of component, while reducing the time and energy required in the machining process. Preferably, the compressive stress after polishing is less than -500 MPa, less than -1000 MPa, less than -1500 MPa, or less than -2000 MPa. In a specific embodiment of the invention, the compressive stress after polishing is between -1600 MPa and -1800 MPa.

[0142] The grinding process generates compressive stress in the workpiece between -1500 and -2000 MPa, typically between -1600 and -1800 MPa. Machining tools or other types of parts comprising ceramic-metal composite materials according to the invention have a compressive stress after polishing that is at least 25% of the compressive stress before the polishing process. Preferably, the post-polishing compressive stress is at least 40%, or 50%, or 60%, or 70%, or 80%, or 90% of the pre-polishing compressive stress, including 99%. In a specific embodiment of the invention, the post-polishing compressive stress is between 80% and 90% of the compressive stress generated during the grinding process.

[0143] In some embodiments, machining tools or other types of workpieces made of ceramic-metal composites exhibit compressive stresses of at least 25% of the pre-polishing compressive stress compared to other tools with the same roughness but polished by other polishing methods. Preferably, the compressive stress of the machining tool or other component made of ceramic-metal composites after polishing is at least 40%, or 50%, or 60%, or 70%, or 80%, or 90%, or even up to 99% of the pre-polishing compressive stress. In one specific embodiment of the invention, the compressive stress of the machining tool or other type of component made of ceramic-metal composites after polishing is between 80% and 90% of the compressive stress generated during the grinding process.

[0144] Figure 5 and Figure 7 One embodiment of the invention is shown, in which a processing tool is observed, specifically a tool for extracting materials, for example... Figure 5 drill bit and Figure 7 The excavator bucket in the example comprises a ceramic-metal composite material with a uniformly polished finish as described in this descriptive report. In this embodiment, a material extraction tool, such as... Figure 5 drill bit and Figure 7 The excavator bucket, after polishing, exhibits a compressive stress of less than -400 MPa to increase the durability and precision of cutting tools or other types of components, while reducing the time and energy required in the machining process. Preferably, the compressive stress after polishing is less than -500 MPa, less than -1000 MPa, less than -1500 MPa, or less than -2000 MPa. In a specific embodiment of the invention, the compressive stress after polishing is between -1600 MPa and -1800 MPa.

[0145] Thanks to this uniform polishing of the drill bit, machined tools, such as drill bits or excavator buckets, are obtained with greater durability than those polished using methods known to date. The durability of machined tools is a critical aspect of machine tool maintenance and repair. In the maintenance and repair of machine tools, the planned replacement of machined tools that are nearing the end of their service life is crucial. In most cases, the replacement of these machined tools means downtime of the machine tool, resulting in economic losses.

[0146] In addition, thanks to processing tools (such as Figure 5 The uniform polishing of the drill bit shown results in a machining tool with higher precision and efficiency, which allows for a reduction in the time and energy required in the machining process compared to machining tools polished using methods known to date.

[0147] Another embodiment of the present invention is in Figure 6The image shows a motion-transmitting component (specifically, a set of gears) comprising a ceramic-metal composite material with uniform polishing as described in this descriptive report. In this embodiment, the motion-transmitting component, specifically the set of gears, exhibits a compressive stress of less than -400 MPa after polishing to increase the durability of the motion-transmitting component (specifically, the set of gears). Preferably, the compressive stress after polishing is less than -500 MPa, less than -1000 MPa, less than -1500 MPa, or less than -2000 MPa. In a specific embodiment of the invention, the compressive stress after polishing is between -1600 MPa and -1800 MPa.

[0148] Thanks to this uniform polishing of motion transmission components (such as gear assemblies), motion transmission components with higher durability than those polished using methods known to date have been achieved. The durability of motion transmission components is a critical aspect of the maintenance and repair of complex components that include them. When maintaining and repairing complex components that include them (such as aircraft), plans are made to replace motion transmission components that are nearing the end of their service life. In most cases, the replacement of these motion transmission components means downtime of the complex components that include them (such as aircraft), and incurs economic losses due to such downtime.

[0149] A further object of the present invention is a machining tool comprising a machining tool having a ceramic-metal composite material, and a complex component comprising a part, such as a motion transmission component (e.g., an aircraft), having a ceramic-metal composite material with uniform polishing as described in any part of this descriptive report. The machining tool having a ceramic-metal composite material included in the machining tool and the motion transmission component having a ceramic-metal composite material included in the complex component (e.g., an aircraft) exhibit a compressive stress of less than -400 MPa after polishing, in order to increase the durability of the motion transmission component (specifically, a gear set). Preferably, the compressive stress after polishing is less than -500 MPa, less than -1000 MPa, less than -1500 MPa, or less than -2000 MPa. In a specific embodiment of the invention, the compressive stress after polishing is between -1600 MPa and -1800 MPa.

[0150] In some embodiments, machining tools comprising ceramic-metal composite materials, and motion transmission components comprising uniformly polished ceramic-metal composite materials in complex components (such as aircraft), exhibit compressive stresses at least 25% of their pre-polishing compressive stresses compared to other tools with the same roughness but polished by other polishing methods. Preferably, the compressive stresses of the machining tools or other components made of ceramic-metal composite materials after polishing are at least 40%, 50%, 60%, 70%, 80%, 90%, or even up to 99% of their pre-polishing compressive stresses. In one specific embodiment of the invention, the compressive stresses of the machining tools or other types of components made of ceramic-metal composite materials after polishing are between 80% and 90% of the compressive stresses generated during the grinding process. Machining tools or complex components comprising machining tools or components containing uniformly polished ceramic-metal composite materials are more efficient than other machining tools or complex components.

[0151] Machine tools, and complex components including machining tools with uniformly polished ceramic-metal composites, or complex components with uniformly polished ceramic-metal composites (e.g., motion transmission parts), should not be frequently stopped to perform tasks involving replacing machining tools or components with uniformly polished ceramic-metal composites, as they offer greater durability.

[0152] In the maintenance and repair of machine tools or complex components (such as aircraft), the plan is to replace machining tools or motion transmission components that are nearing the end of their service life. In most cases, the replacement of these components means downtime of the machine tool or the complex components that include it (such as aircraft), and incurs economic losses due to such downtime.

[0153] like Figure 11 As shown, there is a polished metal-ceramic composite processing tool, which is then coated with, for example, a ternary TiAlN-TiSiN type coating. Specifically, Figure 11 The illustration demonstrates how polishing methods using conductive solid particles to remove titanium nitride (TIN) coatings enhance the polishing process. This means locally eliminating areas where the coating might exhibit defects (e.g., droplets), while covering the rest of the tool. This prevents catastrophic crack propagation into the tool mold, allowing the tool to be reused under operating conditions after subsequent coating.

[0154] In some cases, specifically in those where the parts machined by the tool include titanium alloys, the tool has KThe factor = 0.7 - 0.8, retaining at least 40%, or 50%, or 60%, or 70%, or 80%, further, or 90%, or 99% of the compressive stress before polishing, and exhibiting nanoscale (also known as flatness) inter-component height differences, and minimizing defects such as regrowth or localized erosion in the metal mold. These characteristics have been discussed above. Specifically, the present invention provides a tool for machining titanium alloys, wherein... K With a factor of 0.7 - 0.8, it exhibits nanoscale smoothness across different components and displays compressive stresses ranging from approximately -500 MPa to -1800 MPa. Specifically, it displays compressive stresses between -1000 MPa and -1750 MPa, more specifically between -1400 MPa and -1700 MPa, and more specifically between -1600 MPa and -1700 MPa.

[0155] In other cases, specifically where the parts machined by the tool include other types of alloys, such as aluminum alloys, the tool has approximately K A factor of 1 is used to retain at least 40%, 50%, 60%, 70%, 80%, 90%, or 99% of the pre-polishing compressive stress, while exhibiting nanoscale smoothness between different compositions, minimizing defects such as regrowth or localized erosion in the metal mold. Specifically, the present invention provides a tool for machining titanium alloys, the tool having a factor of approximately 1. K = 1, exhibiting nanoscale smoothness between different components, displaying compressive stress between approximately -500 MPa and -1800 MPa. Specifically, it exhibits compressive stress between -1000 MPa and -1750 MPa, more specifically between -1400 MPa and -1700 MPa, and more specifically between -1600 MPa and -1700 MPa.

[0156] Tools with two ceramic phases (called γ phases) embedded in a metal mold also fall under the protection of these polishing tools, which will not exhibit surface-related defects due to different polishing processes between different components.

[0157] Finally, the present invention also relates to machining methods using ceramic-metal composite machining tools and motion transmission methods using ceramic-metal composite workpieces. These methods are more efficient than those performed without using uniformly polished ceramic-metal composite machining tools or components as described in this descriptive report, because such methods do not require such frequent downtime when these workpieces have higher durability. In most cases, the replacement of these components means downtime of the machining method, the machine tool, or the motion transmission method of the complex element including the component, resulting in economic losses due to downtime.

[0158] Machining tools made of ceramic-metal composite materials used in the machining method, and motion transmission components made of ceramic-metal composite materials used in the motion transmission method, exhibit compressive stress below -400 MPa after polishing to increase the durability of the motion transmission components (specifically, a set of gears). Preferably, the compressive stress after polishing is less than -500 MPa, less than -1000 MPa, less than -1500 MPa, or less than -2000 MPa. In a specific embodiment of the invention, the compressive stress after polishing is between -1600 MPa and -1800 MPa.

[0159] In some embodiments, machining tools made of ceramic-metal composite materials used in machining methods and motion transmission components made of uniformly polished ceramic-metal composite materials used in motion transmission methods exhibit compressive stresses of at least 25% of the pre-polishing compressive stress, compared to other tools with the same roughness but polished by other polishing methods. Preferably, the compressive stress of the machining tool or other component made of ceramic-metal composite material after polishing is at least 40%, or 50%, or 60%, or 70%, or 80%, or 90%, or 99% of the pre-polishing compressive stress. In one specific embodiment of the invention, the compressive stress of the machining tool or other type of component made of ceramic-metal composite material after polishing is between 80% and 90% of the compressive stress generated during the grinding process. The nature of the invention and how it is practiced have been sufficiently described, and therefore a more detailed explanation is unnecessary so that any expert in the art can understand its scope and the advantages obtained.

[0160] Example

[0161] To illustrate the characteristics of some cutting tools that fall within the scope of this invention, and their corresponding polishing processes, the following cases or examples are described:

[0162] Example 1

[0163] Electropolishing processes have been performed on milling cutters and micro drills made of ceramic-metal composites based on WC tungsten carbide and cobalt metal binders.

[0164] The component connected to the first power terminal is immersed in a container filled with dry electrolyte, which has a platinum-titanium mesh peripheral cathode connected to the second power terminal. A rotational vibration with an amplitude of 1 mm and a frequency of 10 Hz is applied to the container along the longitudinal axis to ensure the movement or recirculation of the conductive solid particles of the dry electrolyte located within the cylindrical container; the container has a capacity of 1 L.

[0165] Two synchronous cyclic movements were performed; the first was linear in the direction of the tool's longitudinal axis and perpendicular to the surface of the dry electrolyte, with a frequency of 30 rpm and an amplitude on the order of the tool length; at the same time, the second was a rotational movement around the longitudinal axis of the workpiece, with an angle of 180° and a frequency of 30 rpm.

[0166] Specific electrical parameters have been applied. 20 V is applied during the anode pulse, with the workpiece as a reference, for 20 microseconds. 50 V is applied during the cathode pulse, with the workpiece as a reference, for 160 microseconds. A 0 V period is executed between each polarity change, lasting 10 microseconds.

[0167] The composition of the electrolyte used for polishing the workpiece is detailed below, named as different versions of Example 1:

[0168] Example 1.1

[0169] The polishing process described in the example uses an electrolyte called L800, which has the following composition:

[0170] - 500 g of conductive solid particles, comprising:

[0171] ○ 95.65% by weight of styrene-divinylbenzene sulfonated gel particles (Mitsubishi Relite CFH), with a diameter of 0.3 mm to 1.18 mm, are washed with deionized water (at a temperature above 100°C) until the pH of the wash water reaches 4.5-6, and then dried, resulting in a hydration level of 55% by weight.

[0172] ○ 4.35% weak base anion exchange resin, composed of an acrylic backbone crosslinked with divinylbenzene and functionalized with tertiary amine (Dupont Amberlite IRA67 Resin), with a hydration degree of 55% by weight, as chemically adjusted particles.

[0173] - 239 g of non-conductive fluid, comprising:

[0174] ○ 90.91% distilled water by weight

[0175] ○ 9.09% by weight of polydimethylsiloxane (PDMS)

[0176] The results obtained can be Figure 8 and Figure 9 I saw it in the middle.

[0177] Example 1.2

[0178] The polishing process described in the example uses an electrolyte called L803, which has the following composition:

[0179] - 500 g of conductive solid particles, comprising:

[0180] ○ 89.11% by weight of styrene-divinylbenzene sulfonated gel particles (Mitsubishi Relite CFH), with a diameter of 0.3 mm to 1.18 mm, were washed with deionized water (at a temperature above 100°C) until the pH of the wash water reached 4.5-6, and then dried, resulting in a hydration level of 55% by weight.

[0181] ○ 9.90% by weight of divinylbenzene styrene gel particles (Lewatit Relite CFH), 0.3 mm in diameter, after a sulfuric acid acidification process and subsequent washing with deionized water (at a temperature above 100°C) until the pH of the wash water reaches 4.5-6, and a subsequent drying process, with a hydration level of 55% by weight.

[0182] ○ 0.99% weakly basic anion exchange resin, composed of an acrylic backbone crosslinked with divinylbenzene and functionalized with tertiary amine (Dupont Amberlite IRA67 Resin), with a hydration degree of 55% by weight, as chemically adjusted particles.

[0183] - 167 g of non-conductive fluid, comprising:

[0184] ○ 33.33% by weight distilled water

[0185] ○ 66.67% by weight of dimethyl sulfoxide (DMSO)

[0186] The results obtained can be Figure 8 and Figure 9 I saw it in the middle.

[0187] Example 1.3

[0188] The polishing process described in the example uses an electrolyte called L807, which has the following composition:

[0189] - 500 g of conductive solid particles, comprising:

[0190] ○ 90% by weight of styrene-divinylbenzene sulfonated gel particles (Mitsubishi Relite CFH), with a diameter of 0.3 mm to 1.18 mm, are washed with deionized water (at a temperature above 100°C) until the pH of the wash water reaches 4.5-6, and then dried, resulting in a hydration level of 55% by weight.

[0191] ○ 1% weak base anion exchange resin, composed of an acrylic backbone crosslinked with divinylbenzene and functionalized with tertiary amine (Dupont Amberlite IRA67 Resin), with a hydration degree of 55% by weight, as chemically adjusted particles.

[0192] - 233 g of non-conductive fluid, comprising:

[0193] ○ 43.48% by weight distilled water

[0194] ○ 56.52% by weight of octanoic acid with a purity of 98%.

[0195] The results obtained can be Figure 8 and Figure 9 I saw it in the middle.

[0196] Example 1.4

[0197] The polishing process described in the example uses an electrolyte called L808, which has the following composition:

[0198] - 500 g of conductive solid particles, comprising:

[0199] ○ 72.36% by weight of styrene-divinylbenzene sulfonated gel particles (Mitsubishi Relite CFH), with a diameter of 0.3 mm to 1.18 mm, were washed with deionized water (at a temperature above 100°C) until the pH of the wash water reached 4.5-6, and then dried, resulting in a hydration level of 55% by weight.

[0200] ○ 16.06% by weight of sulfonated styrene gel particles (Mitsubishi Relite CFH), with a diameter of 0.3 mm to 1.18 mm, are crushed into various shapes and sizes by two rollers, washed with deionized water (at a temperature above 100°C) until the pH of the wash water reaches 4.5-6, and then dried to a hydration level of 55% by weight.

[0201] ○ 8.04% by weight of divinylbenzene styrene gel particles (Lewatit Relite CFH), 0.3 mm in diameter, after a sulfuric acid acidification process and subsequent washing with deionized water (at a temperature above 100°C) until the pH of the wash water reaches 4.5-6, and a subsequent drying process, with a hydration level of 55% by weight.

[0202] ○ 3.23% by weight of glass microspheres (silicon oxide), with diameters between 0.04 and 0.07 micrometers.

[0203] ○ 0.31% weak base anion exchange resin, composed of an acrylic backbone crosslinked with divinylbenzene and functionalized with tertiary amine (Dupont Amberlite IRA67 Resin), with a hydration degree of 55% by weight, as chemical conditioning particles.

[0204] - 5 g of non-conductive fluid, including octanoic acid with 99% purity.

[0205] The results obtained can be Figure 8 and Figure 9 I saw it in the middle.

Claims

1. A machining tool or other type of component comprising a ceramic-metal composite material, characterized in that, This includes uniform surface polishing.

2. The machining tool or other type of component according to claim 1, characterized in that, Uniform surface polishing is performed along the cutting edge, i.e., the flatness between the metal and ceramic components of the tool, in such a way that the roughness of the cutting edge of the tool is at the submicron level.

3. The machining tool or other type of component according to claim 1, characterized in that, The surface roughness after polishing is less than 20 nm.

4. The machining tool or other type of component according to claim 1, characterized in that, The surface roughness after polishing is less than 15 nm.

5. The machining tool or other type of component according to claim 1, characterized in that, The surface roughness after polishing is less than 10 nm.

6. The machining tool or other type of component according to claim 1, characterized in that, The surface roughness after polishing is less than 9 nm.

7. The machining tool or other type of component according to any one of the preceding claims, characterized in that, The ceramic-metal material includes one or more of the following materials: tungsten carbide (WC), W(Ti,Ta)C-Co, Ti(C,N)-FeNi, and other carbides having a cobalt, nickel, iron, chromium-based or a combination thereof in different proportions as a metal binder.

8. The machining tool or other type of component according to any one of the preceding claims, characterized in that, The roughness between the cutting edge and the surface adjacent to the cutting edge varies uniformly or regularly along the cutting edge of the tool.

9. The machining tool or other type of component according to any one of the preceding claims, characterized in that, The machining tool or other type of component exhibits a compressive stress of less than -500 MPa or greater than 25% of the compressive stress generated during the grinding process after polishing.

10. A processing method using a processing tool comprising a ceramic-metal composite material, characterized in that, The processing tool includes a uniform surface polisher.

11. The processing method according to claim 10, characterized in that, The machining tool exhibits a uniform surface polish along the cutting edge, that is, perfect flatness between the metal and ceramic components of the tool, in such a way that the roughness of the cutting edge of the tool is in the submicron range.

12. The processing method according to claim 11, characterized in that, The machining tool exhibits a uniform surface polish of less than 20 nm along the cutting edge.

13. The processing method according to claim 12, characterized in that, The machining tool exhibits a uniform surface polish of less than 15 nm along the cutting edge.

14. The processing method according to claim 13, characterized in that, The machining tool exhibits a uniform surface polish of less than 10 nm along the cutting edge.

15. The processing method according to claim 14, characterized in that, The machining tool exhibits a uniform surface polish of less than 9 nm along the cutting edge.

16. The processing method according to any one of claims 10-15, characterized in that, The ceramic-metal material of the processing tool includes one or more of the following materials: tungsten carbide (WC), W(Ti,Ta)C-Co, Ti(C,N)-FeNi, and other carbides having a cobalt, nickel, iron, chromium-based or a combination thereof in different proportions as a metal binder.

17. The processing method according to any one of claims 10-16, characterized in that, The roughness between the cutting edge and the surface adjacent to the cutting edge varies uniformly or regularly along the cutting edge of the tool.

18. The processing method according to any one of claims 10-16, characterized in that, The tool exhibits a compressive stress of less than -500 MPa or greater than 25% of the compressive stress generated during the grinding process after polishing.

19. A motion transmission method using a motion transmission component comprising a ceramic-metal composite material, characterized in that, The motion transmission component includes a uniformly polished surface.

20. The motion transmission method according to claim 19, characterized in that, The ceramic-metal material of the processing tool includes one or more of the following materials: tungsten carbide (WC), W(Ti,Ta)C-Co, Ti(C,N)-FeNi, and other carbides having a cobalt, nickel, iron, chromium-based or a combination thereof in different proportions as a metal binder.

21. The motion transmission method according to claim 19, characterized in that, The motion transmission component exhibits between 80% and 90% of the compressive stress generated during the grinding process after polishing.

22. A processing machine tool, characterized in that, The machine tool includes a machining tool with a uniformly polished surface.

23. The machine tool according to claim 22, characterized in that, The machining tool exhibits a uniform surface polish along the cutting edge, i.e., the flatness between the metal and ceramic components of the tool, in such a way that the roughness of the cutting edge of the tool is in the submicron range.

24. The machine tool according to claim 22, characterized in that, The surface roughness of the processing tool is polished to be less than 20 nm, less than 15 nm, less than 10 nm, or less than 9 nm.

25. The machine tool according to any one of claims 22 to 24, characterized in that, Due to the ceramic-metal material, the processing tool includes one or more of the following material groups: tungsten carbide (WC), W(Ti,Ta)C-Co, Ti(C,N)-FeNi, and other carbides having a metal binder based on cobalt, nickel, iron, chromium, or combinations thereof in different proportions.

26. The machine tool according to any one of claims 22 to 25, characterized in that, The machining tool exhibits a uniform or regular variation in roughness between the cutting edge and the surface adjacent to the cutting edge along the cutting edge of the tool.

27. The machine tool according to any one of claims 22 to 26, characterized in that, The machining tool exhibits between 80% and 90% of the compressive stress generated during the grinding process after polishing.

28. A complex component, such as that of an aircraft, characterized in that, The complex component includes motion transmission parts with uniformly polished surfaces.

29. The complex element according to claim 28, characterized in that, The motion-transmitting workpiece exhibits at least a portion of its surface as uniformly polished, i.e., the flatness between the metal and ceramic components of the tool, in such a way that the roughness of the tool's cutting edge is in the submicron range.

30. The complex element according to claim 28, characterized in that, The surface roughness of the motion transmission component is polished to be less than 20 nm, less than 15 nm, less than 10 nm, or less than 9 nm.

31. The complex element according to any one of claims 28 to 30, characterized in that, Because of the ceramic-metal material, the processing tool is one or more of the following materials: tungsten carbide (WC), W(Ti,Ta)C-Co, Ti(C,N)-FeNi, and other carbides having a metal binder based on cobalt, nickel, iron, chromium, or combinations thereof in different proportions.

32. The complex element according to any one of claims 28 to 31, characterized in that, The machining tool exhibits a compressive stress of less than -500 MPa or greater than 25% of the compressive stress generated during the grinding process after polishing.

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