Sensor chip pin on-off and insulation performance integrated detection equipment

Abstract

The application discloses a kind of sensor chip pin through and off and insulation performance integration detection equipment, belong to sensor chip detection field.A kind of sensor chip pin through and off and insulation performance integration detection equipment, including base and the backboard being set on base, further include two groups of test probe mounting seat, are slidably connected on base, and two groups of test probe mounting seat are all equipped with elastic test contact probe;Spring mounting seat is set on base, and spring accommodating groove is equipped with electrically-conductive contact spring;Supporting block and limiting block are slidably set on spring mounting seat top, and sensor chip body is inserted in supporting block and limiting block, and the top of sensor chip body is equipped with light emitting element;Electric test table is set on backplate;The application need not twice clamping transfer, and detection procedure is greatly simplified, and simultaneously thoroughly eliminates the contact of existing technology in secondary clamping brings about, positioning deviation and chip secondary damage risk, effectively improves the reliability and consistency of detection result.

Description

Technical Field

[0001] This invention relates to the field of sensor chip testing technology, and in particular to an integrated testing device for the continuity and insulation performance of sensor chip pins. Background Technology

[0002] In the manufacturing process of automotive oxygen sensor chips, the electrical performance between the heating electrode leads, sensing electrode leads, and the ceramic substrate directly determines the sensor's heating efficiency, signal output accuracy, and long-term operational reliability. Pin continuity is fundamental to the chip's heating function and signal transmission. If the electrode leads, pads, or internal circuitry have open circuits, poor soldering, or short circuits, the sensor will fail to heat properly or output oxygen concentration signals, leading to excessive engine emissions and reduced power performance. Insulation performance is crucial to prevent leakage between electrodes and breakdown of the ceramic substrate. Poor insulation between the heating electrode and sensing electrode, and between the electrode and the ceramic substrate, will cause signal drift, uncontrolled heating, or even short circuits and burnout under high temperature and high pressure conditions, directly affecting the sensor's lifespan and vehicle safety. Therefore, before the chips leave the factory, rigorous batch testing of pin continuity and insulation performance is essential to eliminate defective products and ensure product consistency and reliability.

[0003] Currently, the industry's testing of oxygen sensor chips is mostly done in a step-by-step, equipment-based manner. The chip needs to be tested for continuity on one device first, then transferred to another for insulation testing. This two-stage clamping and testing process is not only cumbersome and time-consuming, but also unsuitable for the rapid pace of online testing in mass chip production. More importantly, the contact position and pressure between the probe and electrode pads are difficult to maintain perfectly during the two clamping processes, easily leading to misjudgments in continuity testing due to poor contact. Furthermore, the chip may suffer mechanical damage during transfer, causing secondary defects and affecting the reliability of the test results. In addition, two independent sets of equipment occupy a large space and require two or more operators for testing and data recording, resulting in high labor costs, difficulties in data traceability, and hindering the automation and information management of the production process. This leads to errors, low efficiency, and fails to meet the current production requirements for high-reliability and high-efficiency testing of automotive-grade sensor chips. Therefore, this invention is proposed. Summary of the Invention

[0004] The purpose of this invention is to address the problems existing in the prior art by providing an integrated detection device for the continuity and insulation performance of sensor chip pins.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A sensor chip pin continuity and insulation performance integrated testing device includes a base and a backplate mounted on the base, and further includes: Two groups of test probe mounts are both slidably connected to the base, and the two groups of test probe mounts can approach or move away from each other simultaneously, and elastic test contact probes are provided on both of the two groups of test probe mounts; A shrapnel mount is provided on the base. A shrapnel receiving groove is provided in the shrapnel mount, and a conductive contact shrapnel is provided in the shrapnel receiving groove; A support block and a limiting block slidably arranged above the shrapnel mount. A sensor chip body is inserted into the support block and the limiting block, and a light-emitting component is provided at the top of the sensor chip body; An electrical test meter is provided on the back panel.

[0006] Preferably, a support plate is provided in the base. A high-voltage power supply module and a low-voltage power supply module are provided on the support plate. Detection connection lines communicating with the elastic test contact probes are provided on both of the two groups of test probe mounts. One end of the detection connection line far away from the test probe mount is connected to the high-voltage power supply module, and the high-voltage power supply module is connected to the electrical test meter through a wire.

[0007] Further, a connecting line is provided in the shrapnel mount. Two ends of the connecting line are respectively connected to the conductive contact shrapnel and the low-voltage power supply module. An electrode plate is provided on the sensor chip body, and the electrode plate contacts the elastic test contact probe and the conductive contact shrapnel.

[0008] Further, the high-voltage power supply module is configured to output a fixed insulation test voltage , and the electrical test meter is used to measure the leakage current of the insulation test circuit , and a leakage current determination scale is marked on the dial of the electrical test meter. The current value corresponding to this determination scale is the maximum allowable leakage current calculated according to the formula , where is a preset qualified insulation resistance threshold. When the electrical test meter measures the leakage current of the insulation test circuit, it is determined that the insulation performance of the sensor chip body is qualified.

[0009] Further, the low-voltage power supply module is configured to output a fixed low-voltage test voltage , and the equivalent resistance of the circuit of the sensor chip body is denoted as . When the electrode plate is conducting with the conductive contact shrapnel, the circuit current and the equivalent resistance of the circuit satisfy: . When the circuit current reaches the preset conduction current threshold, the light-emitting component is lit to indicate that the sensor chip body is in a conduction state.

[0010] ​Preferably, the spring mounting base is provided with a guide rod, a sleeve is fitted on the guide rod, an annular plate is provided on the sleeve, the support block is slidably connected to the guide rod, and the support block abuts against the top outer wall of the annular plate. The outer wall of the guide rod is also threadedly connected with a locking nut that abuts against the top outer wall of the support block.

[0011] Furthermore, a spring is sleeved on the outer wall of the guide rod, the spring is disposed between the annular plate and the top outer wall of the spring mounting seat, and the spring is sleeved on the outer wall of the sleeve. The support block and the limiting block are both provided with slots, the sensor chip body is inserted into the slot, and the slot is provided with a clamping spring for supporting the sensor chip body.

[0012] Furthermore, a pressure plate is slidably connected to the guide rod. The pressure plate is positioned above the sensor chip body. A clamping plate is provided at both ends of the pressure plate. A clamping block is provided on the clamping plate. A slot is provided on both the support block and the limiting block. A protrusion corresponding to the clamping block is provided in the slot. An arc groove is also provided on the slot.

[0013] Preferably, a U-shaped frame is provided on a test probe mounting base away from the back plate, a pull rod is fixedly mounted on the U-shaped frame, a mounting plate is fixedly mounted on the base, a mounting platform is provided on the mounting plate, a support lug is provided on the mounting platform, a connector is rotatably connected to the end of the pull rod, an L-rod is rotatably connected to the support lug, the end of the connector away from the pull rod is rotatably connected to the corner of the L-rod, a handle is provided on the L-rod, the connection between the support lug and the L-rod is flush with the axis of the pull rod, a sliding sleeve is provided on the mounting platform, and the pull rod is slidably connected in the sliding sleeve.

[0014] Furthermore, the base is provided with a slide rail, and the bottom of the two test probe mounting seats is provided with sliders that are slidably connected to the slide rail. The slide rail is provided with a small gear, and the two test probe mounting seats are each provided with a rack plate that meshes with the small gear. The test probe mounting seat is provided with a first push block, and the first push block is provided with a first inclined surface. The outer wall of the limiting block is provided with a second push block, and the second push block is provided with a second inclined surface corresponding to the first inclined surface.

[0015] Compared with the prior art, the present invention provides an integrated detection device for the continuity and insulation performance of sensor chip pins, which has the following advantages: 1. This integrated sensor chip pin continuity and insulation performance testing device transforms the abstract insulation resistance threshold into a leakage current scale that can be intuitively displayed on an electrical test meter, achieving visualized and standardized judgment of insulation performance, avoiding errors from manual estimation, and improving detection accuracy. Secondly, it clarifies the current triggering logic of the continuity detection circuit, making the illumination judgment of the light-emitting component more stable and reliable, eliminating misjudgments caused by poor contact, and ensuring the consistency of continuity detection results. It is suitable for both high-voltage insulation detection and low-voltage continuity detection scenarios, achieving dual-performance quantitative detection without the need for additional computing components, simplifying the equipment structure while significantly improving the judgment efficiency and accuracy of integrated detection.

[0016] 2. This integrated testing equipment for sensor chip pin continuity and insulation performance utilizes a single clamping station and time-division multiplexing of high-voltage and low-voltage power supply modules to achieve integrated testing of sensor chip pin continuity and insulation performance. It eliminates the need for two clamping and two chip transfer operations, significantly simplifying the testing process and shortening the testing cycle for a single chip. Simultaneously, it completely eliminates the risks of poor contact, positioning deviations, and secondary chip damage caused by secondary clamping in existing technologies, effectively improving the reliability and consistency of test results. This ensures the safety of sensor chip testing and enhances the operational stability and lifespan of the equipment itself.

[0017] 3. This sensor chip pin continuity and insulation performance integrated testing device can control the movement of the test probe mounting base by rotating the handle, and at the same time bring the two test probe mounting bases closer to each other, driving the elastic test contact probe to achieve detection. While moving, the limit block can also be controlled to move, so that the bottom of the sensor chip body moves to contact the conductive contact spring to achieve detection. The detection effects of the two parts are linked together, improving the efficiency of use. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of an integrated detection device for the continuity and insulation performance of sensor chip pins proposed in this invention. Figure 1 ; Figure 2 This is a schematic diagram of the structure of an integrated detection device for the continuity and insulation performance of sensor chip pins proposed in this invention. Figure 2 ; Figure 3 This is a schematic diagram of the back of a sensor chip pin continuity and insulation performance integrated detection device proposed in this invention; Figure 4 This is a schematic diagram of the structure of two test probe mounting bases in an integrated testing device for sensor chip pin continuity and insulation performance proposed in this invention; Figure 5This is a side view of the spring plate mounting base, support block, and limiting block in an integrated testing device for the continuity and insulation performance of sensor chip pins proposed in this invention. Figure 6 This is a schematic diagram of the installation of the U-shaped frame and mounting platform in the integrated testing device for the continuity and insulation performance of sensor chip pins proposed in this invention. Figure 7 This is a schematic diagram of the structure of the first pusher block in the sensor chip pin continuity and insulation performance integrated detection device proposed in this invention; Figure 8 This invention proposes an integrated testing device for the continuity and insulation performance of sensor chip pins. Figure 4 An enlarged schematic diagram of part A in the middle.

[0019] In the diagram: 1. Base; 101. Backplate; 102. Slide rail; 103. Electrical test meter; 104. Support plate; 105. High-voltage power supply module; 106. Low-voltage power supply module; 2. Test probe mounting base; 201. Slider; 202. Rack plate; 203. Support cylinder; 204. Elastic test contact probe; 205. Detection connection line; 206. First push block; 207. First inclined surface; 3. Spring mounting base; 301. Spring receiving groove; 302. Conductive contact spring; 303. Connecting line; 304. Guide rod; 305. Spring; 306. Sleeve; 30 7. Annular plate; 4. Support block; 401. Limiting block; 402. Slot; 403. Clamping spring; 404. Second push block; 405. Second inclined surface; 406. Locking nut; 5. Sensor chip body; 501. Light-emitting element; 502. Electrode sheet; 6. Pressure plate; 601. Card plate; 602. Card block; 603. Card slot; 604. Protrusion; 605. Arc groove; 7. U-shaped frame; 701. Pull rod; 702. Connector; 703. L-shaped rod; 704. Handle; 705. Mounting plate; 706. Mounting platform; 707. Sliding sleeve; 708. Support ear. Detailed Implementation

[0020] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0021] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0022] Example 1: Refer to Figures 1-8 An integrated testing device for the continuity and insulation performance of sensor chip pins includes a base 1 and a back plate 101 mounted on the base 1. It also includes two sets of test probe mounting seats 2, both slidably connected to the base 1, and capable of simultaneously approaching or moving away from each other. Each set of test probe mounting seats 2 is equipped with an elastic test contact probe 204. A spring plate mounting seat 3 is mounted on the base 1, with a spring plate receiving groove 301 inside, and a conductive contact spring plate 302 inside the spring plate receiving groove 301. A support block 4 and a limiting block 401 are slidably mounted above the spring plate mounting seat 3. A sensor chip body 5 is inserted into the support block 4 and the limiting block 401, and a light-emitting element 501 is provided on the top of the sensor chip body 5. An electrical test meter 103 is mounted on the back plate 101.

[0023] In this embodiment, during use, the sensor chip body 5 to be tested is first inserted into the support block 4 and the limiting block 401, so that its bottom extends out of the limiting block 401. It should be noted that in this application, one hundred sensor chip bodies 5 can be simultaneously inserted into the support block 4 and the limiting block 401 for simultaneous testing. Similarly, one hundred electrical test meters 103 are also provided, arranged in a ten-by-ten pattern, and each electrical test meter 103 is numbered to indicate its sequence for easy correspondence with the sensor chip body 5. One electrical test meter 103 is used to test one sensor chip body 5. Then, the two test probe mounting bases 2 are controlled to simultaneously approach each other, thereby making the elastic test contact probe 204 contact the sensor chip body 5. In the above, a support cylinder 203 is also provided on the outer wall of the test probe mounting base 2. The elastic test contact probe 204 can slide inside the support cylinder 203, so that when the elastic test contact probes 204 on the two test probe mounting bases 2 are in contact with the sensor chip body 5 at the same time, space is left for the elastic test contact probes 204 to move, so that the elastic test contact probes 204 will not come into contact with the sensor chip body 5 and be damaged. The support cylinder 203 and the elastic test contact probes 204 are provided with multiple corresponding to the sensor chip body 5. Each elastic test contact probe 204 completes the detection effect of a single sensor chip body 5. The elastic test contact probe 204 contacts the sensor chip body 5, thereby completing the insulation performance detection operation.

[0024] Furthermore, before the elastic test contact probe 204 contacts the sensor chip body 5, the movement of the test probe mounting base 2 will also drive the support block 4 and the limiting block 401 to move downward, so that the bottom of the sensor chip body 5 is inserted into the spring receiving groove 301 on the spring mounting base 3 and contacts the conductive contact spring 302, thereby achieving the detection effect of pin continuity.

[0025] The base 1 is equipped with a support plate 104, on which a high-voltage power module 105 and a low-voltage power module 106 are mounted. Both sets of test probe mounting bases 2 are equipped with test connection lines 205 that are connected to the elastic test contact probes 204. The end of the test connection line 205 away from the test probe mounting base 2 is connected to the high-voltage power module 105. The high-voltage power module 105 is connected to the electrical test meter 103 through a wire.

[0026] The spring mounting base 3 is provided with a connecting line 303. The two ends of the connecting line 303 are connected to the conductive contact spring 302 and the low-voltage power supply module 106, respectively. The sensor chip body 5 is provided with an electrode plate 502, which is in contact with the elastic test contact probe 204 and the conductive contact spring 302.

[0027] In this embodiment, the high-voltage power module 105 and the low-voltage power module 106 installed on the support plate 104 provide test power support for insulation performance testing and pin continuity performance testing, respectively. The two power modules work in a time-sharing isolation manner to avoid mutual interference between the high-voltage and low-voltage circuits during the testing process.

[0028] High-voltage power supply module 105 is configured to output a fixed insulation test voltage. The electrical test meter 103 is used to measure the leakage current of the insulation test circuit. The dial of the electrical tester 103 is marked with a leakage current determination scale. The current value corresponding to this determination scale is based on the formula... The calculated maximum allowable leakage current ,in, To determine the preset acceptable insulation resistance threshold, when the leakage current of the insulation test circuit is measured by the electrical test meter 103... The insulation performance of the sensor chip body 5 was determined to be qualified.

[0029] Low-voltage power supply module 106 is configured to output a fixed low-voltage test voltage. The equivalent circuit resistance of the sensor chip body 5 is denoted as When electrode 502 is connected to conductive contact spring 302, the circuit current... equivalent resistance of the circuit satisfy: When the loop current When the preset conduction current threshold is reached, the light-emitting element 501 lights up to indicate that the sensor chip body 5 is in a conducting state.

[0030] Specifically, the high-voltage power supply module 105 provides a high voltage for insulation testing. Its output is connected to the electrical test meter 103 via a wire, and simultaneously connected to the elastic test contact probes 204 on the two sets of test probe mounting bases 2 via a test connection line 205. During the insulation testing phase, the circuit of the low-voltage power supply module 106 is in an open state, and the high-voltage power supply module 105 outputs a preset insulation test voltage. The test line 205 is applied to the elastic test contact probe 204; the elastic test contact probe 204 contacts the electrode plate 502 on the sensor chip body 5, forming an insulation test circuit between the two test points where insulation performance needs to be tested, and the leakage current in the circuit... The voltage is collected by electrical tester 103 and combined with the output insulation test voltage of high-voltage power supply module 105. It can be done through the formula Insulation resistance was obtained by conversion This is in turn related to the preset qualified insulation resistance threshold. The comparison allows for the determination of insulation performance; to facilitate rapid on-site assessment, the equipment is pre-programmed with the formula at the factory. The calculated maximum allowable leakage current And mark the corresponding values ​​on the dial of the electrical test meter 103. The determination scale is set so that during testing, it is only necessary to observe whether the pointer of the electrical test meter 103 exceeds the scale to quickly determine whether the insulation performance is qualified.

[0031] The low-voltage power supply module 106 provides a safe low voltage for pin continuity testing. Its output is connected to the conductive contact spring 302 in the spring mounting base 3 via the connecting line 303. During the continuity testing phase, the circuit of the high-voltage power supply module 105 is in the open state, and the low-voltage power supply module 106 outputs a preset low-voltage insulation test voltage. The current is applied to the conductive contact spring 302 through the connecting line 303; the conductive contact spring 302 contacts the electrode plate 502 on the sensor chip body 5, and at the same time, the electrode plate 502 forms a conductive circuit with the light-emitting element 501 through the electrode circuit inside the chip. When the electrode circuit is fully conductive, the circuit current... With low voltage insulation test voltage Equivalent resistance of sensor chip electrode circuit Satisfying Ohm's Law When the loop current When the preset conduction current threshold is reached, the light-emitting element 501 illuminates, visually indicating that the pins of the sensor chip body 5 are in a conducting state; if there is an open circuit, poor soldering, or short circuit defect in the electrode circuit, the circuit current... If the value is zero or far exceeds the normal range, the 501 light-emitting component will not light up or will light up abnormally. This is used to determine whether the pin continuity performance is qualified.

[0032] This device adopts a time-division detection mode under the same clamping state. After the sensor chip body 5 is clamped, the pin continuity performance is first tested by the low-voltage power supply module 106, and then the high-voltage power supply module 105 is switched to complete the insulation performance test. The two performance tests can be integrated without secondary clamping, avoiding contact errors and mechanical damage caused by secondary clamping. At the same time, the time-division isolation design of high and low voltage circuits prevents high voltage from entering the low voltage side and damaging equipment components or internal circuits of the chip, ensuring the safety and reliability of the detection process.

[0033] Example 2: Refer to Figures 1-8 A sensor chip pin continuity and insulation performance integrated testing device is basically the same as in Embodiment 1. Furthermore, the spring plate mounting base 3 is provided with a guide rod 304, a sleeve 306 is sleeved on the guide rod 304, an annular plate 307 is provided on the sleeve 306, a support block 4 is slidably connected to the guide rod 304, and the support block 4 abuts against the top outer wall of the annular plate 307. The outer wall of the guide rod 304 is also threadedly connected with a locking nut 406 that abuts against the top outer wall of the support block 4.

[0034] Reference Figures 1-5 and Figure 8 A spring 305 is sleeved on the outer wall of the guide rod 304. The spring 305 is located between the annular plate 307 and the top outer wall of the spring plate mounting seat 3, and the spring 305 is sleeved on the outer wall of the sleeve 306. The support block 4 and the limiting block 401 are both provided with slots 402. The sensor chip body 5 is inserted into the slot 402. The slot 402 is provided with a clamping spring 403 for supporting the sensor chip body 5.

[0035] Reference Figures 1-5 and Figure 8 A pressure plate 6 is slidably connected to the guide rod 304. The pressure plate 6 is positioned above the sensor chip body 5. A clamping plate 601 is provided at both ends of the pressure plate 6. A clamping block 602 is provided on the clamping plate 601. A slot 603 is provided on both the support block 4 and the limiting block 401. A protrusion 604 corresponding to the clamping block 602 is provided in the slot 603. An arc groove 605 is also provided on the slot 603.

[0036] In this embodiment, after multiple sensor chip bodies 5 are inserted into the slots 402 on the support block 4 and the limiting block 401, the clamping springs 403 can clamp and support the sensor chip bodies 5. Multiple sets of slots 402 and clamping springs 403 are provided to allow for the installation and testing of multiple sensor chip bodies 5. Then, pressing the pressure plate 6 causes the pressure plate 6 to press the sensor chip body 5 downwards a certain distance, causing the bottom of the sensor chip body 5 to extend out of the limiting block 401, facilitating subsequent connection with the conductive contact springs 302. When the pressure plate 6 is pressed, the clamping plate 601 moves downwards synchronously. The clamping plate 601 has a certain deformation capacity and can be made of materials such as plastic. When the clamping plate 601... When block 602 contacts the protrusion 604 in slot 603, since both block 602 and protrusion 604 have corresponding inclined sections, the contact plate 601 will deform upon contact, causing block 602 to move below protrusion 604, thus forming a latch between block 602 and protrusion 604. At this time, the position of pressure plate 6 will be fixed, and the bottom of plate 601 will contact the bottom inner wall of slot 603, thereby restricting pressure plate 6 from moving downward again, making the height of each sensor chip body 5 level, which facilitates subsequent detection operations and makes it easy to observe the light emission status of light-emitting element 501. In addition, pressure plate 6 is relatively narrow and can be set to a transparent state, so it will not block the light emission status of light-emitting element 501, which can be used better.

[0037] In this application, when it is necessary to reset the pressure plate 6, the clamping plate 601 is manually pulled through the arc groove 605, thereby disengaging the clamping block 602 from the protrusion 604, so that the clamping plate 601 and the pressure plate 6 can be moved upward. Alternatively, the pressure plate 6 can be directly removed from the guide rod 304, and then the sensor chip body 5 that has completed the test can be sorted and removed.

[0038] Reference Figure 7 A U-shaped frame 7 is provided on a test probe mounting base 2 away from the back plate 101. A pull rod 701 is fixedly installed on the U-shaped frame 7. A mounting plate 705 is fixedly installed on the base 1. A mounting platform 706 is provided on the mounting plate 705. A support ear 708 is provided on the mounting platform 706. A connector 702 is rotatably connected to the end of the pull rod 701. An L-rod 703 is rotatably connected to the support ear 708. The end of the connector 702 away from the pull rod 701 is rotatably connected to the corner of the L-rod 703. A handle 704 is provided on the L-rod 703. The connection between the support ear 708 and the L-rod 703 is flush with the axis of the pull rod 701. A sliding sleeve 707 is provided on the mounting platform 706. The pull rod 701 is slidably connected in the sliding sleeve 707.

[0039] Reference Figures 1-8The base 1 is provided with a slide rail 102. The bottom of the two test probe mounting seats 2 is provided with sliders 201 that are slidably connected to the slide rail 102. The slide rail 102 is provided with a small gear. The two test probe mounting seats 2 are each provided with a rack plate 202 that meshes with the small gear. The test probe mounting seat 2 is provided with a first push block 206. The first push block 206 is provided with a first inclined surface 207. The outer wall of the limiting block 401 is provided with a second push block 404. The second push block 404 is provided with a second inclined surface 405 that corresponds to the first inclined surface 207.

[0040] In this invention, in the initial state, the section of the L-rod 703 between the connector 702 and the support ear 708 is vertically positioned, and the handle 704 is horizontal. During use, pushing the handle 704 upwards causes the handle 704 and the L-rod 703 to rotate around the support ear 708. This causes the L-rod 703 to move the connector 702, which in turn moves the pull rod 701. The U-shaped frame 7 then moves the test probe mounting base 2 for subsequent testing operations. The process continues until the section of the L-rod 703 between the connector 702 and the support ear 708 rotates to a horizontal position, and the handle 704 rotates to a vertical position. This completes the driving of the test probe mounting base 2. It should be noted that the connection between the support ear 708 and the L-rod 703 is flush with the axis of the pull rod 701, which facilitates the movement of the connector 702 and completes the driving operation.

[0041] When one of the test probe mounting seats 2 is driven, the rack plate 202 on its outer wall moves, driving the meshing pinion to rotate. The pinion then drives the rack plate 202 on the other side to move, thereby moving the other test probe mounting seat 2. This allows the two test probe mounting seats 2 to move close to each other simultaneously. When the two test probe mounting seats 2 move, the first push block 206 and the second push block 404 on their outer walls come into contact. Under the action of the first inclined surface 207 and the second inclined surface 405, the second push block 404 can be driven to move downward, thereby moving the sensor chip body 5. The sensor chip body 5 is inserted into the spring receiving groove 301 on the spring mounting seat 3, and the electrode plate 502 comes into contact with the conductive contact spring plate 302, completing the subsequent detection operation. It should be noted that the elastic test contact probe 204 is set to be relatively long, so that it can contact the electrode plate 502 before the first push block 206 and the second push block 404 reach their limit positions, which facilitates the detection.

[0042] The guide rod 304 is provided to enable the support block 4 and the limit block 401 to move stably. The sleeve 306 and the annular plate 307 are provided to facilitate the placement of the support block 4. When the first push block 206 and the second push block 404 cooperate, the spring 305 will be compressed. After the test is completed, the support block 4 can be automatically reset by the spring 305.

[0043] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A sensor chip pin continuity and insulation performance integrated testing device, comprising a base (1) and a backplate (101) disposed on the base (1), characterized in that, Also includes: Two sets of test probe mounting bases (2) are slidably connected to the base (1), and the two sets of test probe mounting bases (2) can move closer or further away at the same time, and both sets of test probe mounting bases (2) are provided with elastic test contact probes (204). A spring mounting base (3) is provided on a base (1). The spring mounting base (3) is provided with a spring receiving groove (301), and a conductive contact spring (302) is provided in the spring receiving groove (301). A support block (4) and a limiting block (401) are slidably disposed above the spring plate mounting base (3). A sensor chip body (5) is inserted into the support block (4) and the limiting block (401). A light-emitting element (501) is provided on the top of the sensor chip body (5). An electrical test meter (103) is mounted on a backplate (101).

2. The integrated testing device for sensor chip pin continuity and insulation performance according to claim 1, characterized in that, The base (1) is provided with a support plate (104), and the support plate (104) is provided with a high voltage power module (105) and a low voltage power module (106). Both sets of test probe mounting bases (2) are provided with a detection connection line (205) that is connected to the elastic test contact probe (204). The end of the detection connection line (205) away from the test probe mounting base (2) is connected to the high voltage power module (105). The high voltage power module (105) is connected to the electrical test meter (103) through a wire.

3. The integrated detection device for sensor chip pin continuity and insulation performance according to claim 2, characterized in that, The spring mounting base (3) is provided with a connecting line (303), and the two ends of the connecting line (303) are respectively connected to the conductive contact spring (302) and the low-voltage power supply module (106). The sensor chip body (5) is provided with an electrode plate (502), and the electrode plate (502) is in contact with the elastic test contact probe (204) and the conductive contact spring (302).

4. The integrated detection device for sensor chip pin continuity and insulation performance according to claim 3, characterized in that, The high-voltage power supply module (105) is configured to output a fixed insulation test voltage. The electrical test meter (103) is used to measure the leakage current of the insulation test circuit. The dial of the electrical test meter (103) is marked with a leakage current determination scale, and the current value corresponding to this determination scale is based on the formula... The calculated maximum allowable leakage current ,in, To set the preset qualified insulation resistance threshold, when the electrical test meter (103) measures the leakage current of the insulation test circuit... The sensor chip body (5) was found to have qualified insulation performance.

5. The integrated detection device for sensor chip pin continuity and insulation performance according to claim 3 or 4, characterized in that, The low-voltage power supply module (106) is configured to output a fixed low-voltage test voltage. The equivalent circuit resistance of the sensor chip body (5) is denoted as . When the electrode plate (502) is connected to the conductive contact spring (302), the circuit current... equivalent resistance of the circuit satisfy: When the loop current When the preset conduction current threshold is reached, the light-emitting element (501) lights up to indicate that the sensor chip body (5) is in the conduction state.

6. The integrated testing device for sensor chip pin continuity and insulation performance according to claim 1, characterized in that, The spring mounting base (3) is provided with a guide rod (304), a sleeve (306) is sleeved on the guide rod (304), an annular plate (307) is provided on the sleeve (306), the support block (4) is slidably connected to the guide rod (304), and the support block (4) abuts against the top outer wall of the annular plate (307). The outer wall of the guide rod (304) is also threaded with a locking nut (406) that abuts against the top outer wall of the support block (4).

7. The integrated detection device for sensor chip pin continuity and insulation performance according to claim 6, characterized in that, A spring (305) is sleeved on the outer wall of the guide rod (304). The spring (305) is located between the annular plate (307) and the top outer wall of the spring plate mounting seat (3). The spring (305) is sleeved on the outer wall of the sleeve (306). The support block (4) and the limiting block (401) are both provided with slots (402). The sensor chip body (5) is inserted into the slot (402). The slot (402) is provided with a clamping spring (403) for supporting the sensor chip body (5).

8. The integrated testing device for sensor chip pin continuity and insulation performance according to claim 6, characterized in that, A pressure plate (6) is slidably connected to the guide rod (304). The pressure plate (6) is positioned above the sensor chip body (5). A clamping plate (601) is provided at both ends of the pressure plate (6). A clamping block (602) is provided on the clamping plate (601). A slot (603) is provided on both the support block (4) and the limiting block (401). A protrusion (604) corresponding to the clamping block (602) is provided in the slot (603). An arc groove (605) is also provided on the slot (603).

9. A sensor chip pin continuity and insulation performance integrated testing device according to claim 1 or 8, characterized in that, A U-shaped frame (7) is provided on a test probe mounting base (2) away from the back plate (101). A pull rod (701) is fixedly mounted on the U-shaped frame (7). A mounting plate (705) is fixedly mounted on the base (1). A mounting platform (706) is provided on the mounting plate (705). A support ear (708) is provided on the mounting platform (706). A connector (702) is rotatably connected to the end of the pull rod (701). The support ear (708) An L-rod (703) is rotatably connected to the 708. The end of the connector (702) away from the pull rod (701) is rotatably connected to the corner of the L-rod (703). A handle (704) is provided on the L-rod (703). The connection between the support ear (708) and the L-rod (703) is flush with the axis of the pull rod (701). A sliding sleeve (707) is provided on the mounting platform (706). The pull rod (701) is slidably connected in the sliding sleeve (707).

10. The integrated detection device for sensor chip pin continuity and insulation performance according to claim 9, characterized in that, The base (1) is provided with a slide rail (102), and the bottom of the two test probe mounting seats (2) is provided with a slider (201) that is slidably connected to the slide rail (102). The slide rail (102) is provided with a small gear, and the two test probe mounting seats (2) are each provided with a rack plate (202) that meshes with the small gear. The test probe mounting seat (2) is provided with a first push block (206), and the first push block (206) is provided with a first inclined surface (207). The outer wall of the limiting block (401) is provided with a second push block (404), and the second push block (404) is provided with a second inclined surface (405) that corresponds to the first inclined surface (207).

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