A method of optimizing connector fan-out area trace impedance discontinuity

By locating, separating, and simulating the optimization of trace segments in the connector fan-out area, the problem of impedance abrupt change is solved, achieving high-precision and low-cost impedance control, which is applicable to impedance optimization of connector and BGA fan-out areas.

CN122263804APending Publication Date: 2026-06-23EMDOOR ELECTRONICS TECH

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
EMDOOR ELECTRONICS TECH
Filing Date
2026-02-25
Publication Date
2026-06-23

AI Technical Summary

Technical Problem

Existing impedance optimization methods in the connector fan-out region have low overall control accuracy and high cost, and cannot effectively eliminate impedance abrupt changes, affecting the continuity and performance of high-speed signal transmission.

Method used

By locating the target fan-out routing, establishing a positioning benchmark, separating the routing segments, setting line width variables, simulating and optimizing the line width, and selecting the optimal impedance, independent control of impedance-sensitive areas can be achieved, eliminating impedance abrupt changes.

Benefits of technology

It can accurately locate impedance change regions, improve impedance control accuracy, reduce design and production costs, adapt to various impedance change scenarios, and improve link impedance continuity.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The application relates to a method for optimizing the impedance mutation of a fan-out area of a connector, comprising the following steps: positioning a target fan-out trace passing through a reverse pad area of the connector; establishing a positioning reference at the boundary of the reverse pad area corresponding to the target fan-out trace; separating a trace segment from other parts of the target fan-out trace based on the positioning reference to construct a width-adjustable trace segment; changing the line width of the width-adjustable trace segment by traversing different line width variables to obtain different impedance results through simulation; and screening the optimal impedance matching the preset standard to obtain the line width value corresponding to the optimal impedance. The application accurately positions the specific trace segment of the target fan-out trace corresponding to the reverse pad area, constructs a width-adjustable trace segment to realize independent impedance regulation and control of the area, and greatly improves the regulation and control accuracy; by traversing the line width variable and simulation analysis, the optimal line width value matching the preset standard is screened out, and the impedance mutation problem caused by the insufficient reference plane of the reverse pad area is eliminated.
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Description

Technical Field

[0001] This invention relates to the field of circuit design technology, and more specifically, to a method for optimizing impedance changes in the fan-out region of a connector. Background Technology

[0002] As the core carrier of physical support and signal transmission in electronic products, the printed circuit board (PCB) plays a crucial role in high-speed circuit systems. The signal integrity of areas such as connector fan-out and BGA fan-out determines the overall product performance. To improve via impedance characteristics, the industry commonly adopts a design with larger via anti-pads. However, after the anti-pads are removed, the fan-out traces inevitably experience impedance abrupt changes when passing through this area due to the lack of sufficient reference planes. This problem is particularly prominent in high-speed signal transmission scenarios, severely disrupting link impedance continuity and leading to increased signal reflection, distortion, and transmission loss, becoming a key bottleneck restricting the improvement of high-speed circuit performance.

[0003] Existing impedance optimization methods for anti-pad areas include those that improve impedance by adjusting the overall trace width or modifying the anti-pad structure, but these methods suffer from low overall trace control precision and difficulty in completely eliminating impedance abrupt changes. Modifying the anti-pad structure, on the other hand, affects the electrical characteristics of the vias themselves and increases the complexity of PCB manufacturing processes. Other methods optimize the trace layout through overall simulation, but these have long design iteration cycles and high time costs, failing to meet the industry's demand for efficient, flexible, and low-cost impedance optimization solutions.

[0004] The above problems are worth solving. Summary of the Invention

[0005] To overcome the problems of low accuracy and high cost of existing overall trace control methods, this invention provides a method for optimizing the impedance change of the trace in the fan-out region of a connector.

[0006] The technical solution of this invention is as follows:

[0007] A method for optimizing impedance abrupt changes in the fan-out region of a connector includes the following steps:

[0008] Step 1: Locate the target fan-out trace that passes through the connector anti-solder pad area;

[0009] Step 2: Establish a positioning reference at the boundary of the anti-pad area on the target fan-out routing line;

[0010] Step 3: Based on the positioning reference, separate the routing segment from the other parts of the target fan-out routing;

[0011] Step 4: Set the line width variable for the routing segment to construct an adjustable width line segment;

[0012] Step 5: Iterate through the values ​​of different line width variables, change the line width of the adjustable line segment, and simulate the target fan-out routing to obtain different impedance results;

[0013] Step 6: Select the optimal impedance that matches the preset standard from several impedance results, and obtain the optimal linewidth parameter corresponding to the optimal impedance.

[0014] As a preferred technical solution of the present invention, the specific steps of step 1 are as follows: based on the geometric position of the connector anti-solder pad area, identify and select the fan-out trace passing through the anti-solder pad area as the target fan-out trace.

[0015] Furthermore, the target fan-out trace is no more than 10 mil away from the corresponding anti-pad area.

[0016] As a preferred embodiment of the present invention, step 2 includes the following specific steps:

[0017] A first working coordinate system is established at the position of the first boundary of the anti-pad area corresponding to the target fan-out trace;

[0018] A second working coordinate system is established at the position of the second boundary of the anti-pad area corresponding to the target fan-out trace;

[0019] Furthermore, the direction from the first boundary to the second boundary is along the extension direction of the target fan-out path; the first working coordinate system and the second working coordinate system constitute the two positioning references of the target fan-out path.

[0020] Furthermore, the specific steps for establishing the working coordinate system are as follows: In the simulation modeling software, use the relative coordinate offset command to move the origin of the working coordinate system to the target position.

[0021] As a preferred embodiment of the present invention, step 3 includes the following specific steps:

[0022] Define a virtual partition plane perpendicular to the direction of trace extension;

[0023] The virtual segmentation plane is set at the positioning reference, with its normal direction parallel to the extension direction of the trace.

[0024] Performing the split causes the target fan-out routing to be disconnected in the virtual split plane;

[0025] After completing two divisions, the resulting line segments are located between the two virtual division planes and other line segments located outside the two virtual division planes.

[0026] As a preferred embodiment of the present invention, step 4 includes the following specific steps:

[0027] Set a line width variable to represent the width adjustment range, and the value of the line width variable represents the increase or decrease in the width of the trace segment on one side based on its original line width.

[0028] Based on the value of the line width variable, the adjustable line segment with the corresponding width adjustment is generated by offsetting its two side edge surfaces at equal distances along the line width direction of the line segment.

[0029] As a preferred technical solution of the present invention, a step is further included between step 4 and step 5: performing a smooth curve transition processing on the abrupt width connection between the adjustable width line segment and its adjacent trace end.

[0030] Furthermore, the specific steps of the smooth curve transition processing are as follows: modify the geometric model at the abrupt width connection point, and replace the angular structure with a transition surface with continuous curvature.

[0031] As a preferred embodiment of the present invention, step 5 includes the following specific steps:

[0032] Set the scan range and scan step value of the line width variable;

[0033] Within the scanning range, several discrete linewidth variable values ​​are generated sequentially based on the scanning step value;

[0034] For several linewidth variable values, the target fan-out trace containing the adjustable line width segment is simulated to obtain the corresponding impedance results.

[0035] As a preferred technical solution of the present invention, the specific steps of screening the optimal impedance matching the preset standard in step 6 are as follows: compare and analyze the impedance curves of several impedance results, and select the impedance curve whose overall impedance characteristics in the required frequency band are closest to the preset target impedance value. The corresponding linewidth variable value is taken as the optimal linewidth parameter.

[0036] According to the above-described solution, the beneficial effects of this invention are as follows:

[0037] This invention locates specific trace segments in the anti-pad region corresponding to the target fan-out trace, accurately pinpoints impedance change areas, constructs adjustable-width trace segments, and achieves independent control of this impedance-sensitive region, significantly improving the accuracy of impedance control. Furthermore, by traversing the trace width variable values ​​and combining simulation analysis, it can systematically obtain the correlation between different trace widths and impedance, thereby selecting the optimal trace width value that perfectly matches the preset standard, effectively eliminating impedance change problems in the anti-pad region caused by insufficient reference plane, and significantly improving link impedance continuity.

[0038] As can be seen, this invention does not require modification of the anti-pad structure or the overall routing layout. It only optimizes specific routing segments and adapts to various impedance change scenarios caused by via anti-pad cutouts, such as connector fan-out and BGA fan-out. It is flexible in implementation and highly compatible, reducing design iteration and production costs. Attached Figure Description

[0039] Figure 1 This is a flowchart of the method of the present invention;

[0040] Figure 2 This is a schematic diagram of the structure of the present invention;

[0041] Figure 3 A schematic diagram showing the separation of routing segments from the target fan-out routing;

[0042] Figure 4 This is an enlarged view of the structure of the separated adjustable-width line segment.

[0043] Figure 5 This is an impedance characteristic curve of several linewidth variables in a specific embodiment.

[0044] In the diagram,

[0045] 1. Circuit board; 11. Via; 12. Anti-soldering pad area;

[0046] 2. Target fan-out routing; 21. Adjustable width line segment; 210. Rounded corner;

[0047] 3. Working coordinate system. Detailed Implementation

[0048] To better understand the purpose, technical solution, and technical effects of this invention, the invention will be further explained and described below in conjunction with the accompanying drawings and embodiments. It should be noted that similar reference numerals and letters in the following drawings indicate similar items; therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. It is also stated that the embodiments described below are only for explaining this invention and are not intended to limit this invention.

[0049] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it can be directly on the other component or there may be an intermediate component. When a component is referred to as "connected to" another component, it can be directly connected to the other component or there may be an intermediate component.

[0050] The terms “first” and “second” are used for descriptive purposes only and should not be construed as indicating or implying relative importance or specifying the number of technical features. “Several” means two or more, unless otherwise expressly and specifically defined.

[0051] like Figures 1 to 3 As shown, a method for optimizing impedance abrupt changes in the fan-out region of a connector achieves independent, high-precision optimization of impedance-sensitive areas through several steps including precise local positioning, separation, adjustment, and simulation screening. Specifically, the method includes the following steps:

[0052] Step 1: Locate the target fan-out trace 2 that passes through the connector anti-solder pad area 12;

[0053] Because the connector via 11 is capacitive, a larger anti-pad area 12 needs to be removed to better improve the impedance of via 11. However, the traces fanned out from other vias 11 will lack sufficient reference planes when passing through this anti-pad area 12. First, based on the PCB design layout data and geometric coordinate information, the anti-pad area 12 is located, and then the target fanned-out trace 2 that needs to be optimized is determined. By clarifying the optimization object, ineffective processing of irrelevant traces is avoided, which greatly improves the targeting and execution efficiency of the entire impedance optimization work and reduces redundant operations.

[0054] Step 2: Establish a positioning reference at the boundary of the trace segment corresponding to the anti-pad area 12 in the target fan-out trace 2;

[0055] After selecting a target fan-out trace 2 to be optimized, determine the start and end boundaries of the anti-pad region 12 along the trace direction. The two start and end boundaries of the trace segment are: the two ends of the trace segment in the target fan-out trace 2 that completely corresponds to the connector anti-pad region 12, which are also the connection points between this trace segment and other parts of the target fan-out trace 2. During operation, first, based on the geometric range of the connector anti-pad region 12, determine the boundary position in the target fan-out trace 2 that completely corresponds to this region, clarifying the two end boundaries of the trace segment along its own extension direction. Step 2 establishes two positioning references along the trace extension direction, defining the range of the trace segment corresponding to the anti-pad region 12. This provides a clear boundary for the separation of the trace segment, avoiding mismatch between the separated trace segment and the anti-pad region 12 due to segmentation position deviations, thereby ensuring the regional accuracy of subsequent impedance adjustment.

[0056] Step 3: Based on the positioning reference, separate the routing segment from the other parts of the target fan-out routing 2;

[0057] This step achieves physical isolation of the trace segments in the target fan-out trace 2 from other parts at the simulation model level. Subsequently, the trace segments can be independently adjusted in terms of line width, completely avoiding interference to other parts of the target fan-out trace 2 without impedance issues during the adjustment process.

[0058] Step 4: Set the line width variable for the routing segment to construct the adjustable width line segment 21;

[0059] In this step, the line width variable is a numerical parameter that represents the increase or decrease in the width of a single side of the trace segment. The width of the trace segment can be flexibly adjusted by changing its value. A positive value increases the width and a negative value decreases the width, thus realizing independent and flexible line width control of the trace segment corresponding to the anti-pad area 12, breaking through the limitations of overall trace width adjustment.

[0060] Step 5: Iterate through the values ​​of different line width variables, change the line width of the adjustable line segment 21, and simulate the target fan-out trace 2 to obtain different impedance results.

[0061] Based on the principle of electromagnetic simulation, the electromagnetic characteristics of the complete target fan-out trace 2 model, including the adjustable-width line segment 21, are analyzed in the simulation software. Multiple impedance results of the target fan-out trace 2 in the observation frequency band are obtained. These are simulation results with impedance characteristic curves as the carrier, reflecting the impedance values ​​at different frequencies. This step differs from other simulation methods in that it simulates the complete target fan-out trace 2 model, rather than only simulating the adjustable-width line segment 21 locally, which helps to ensure the authenticity and accuracy of the impedance results.

[0062] Step 6: Select the optimal impedance that matches the preset standard from several impedance results, and obtain the optimal line width parameter corresponding to the optimal impedance.

[0063] The preset standard is an impedance target requirement set according to the transmission needs of high-speed signals, usually a fixed target impedance value, such as 90 ohms. Step 6 involves the following steps: First, collect all impedance results (impedance characteristic curves) obtained in Step 5; then, based on the preset target impedance value for high-speed signal transmission, compare and analyze all impedance curves, focusing on the impedance value changes within the required frequency band of the high-speed signal; finally, select the impedance curve that best approximates the target impedance value and has the smallest impedance fluctuation within the required frequency band. The linewidth variable value corresponding to this curve is the optimal linewidth parameter.

[0064] In summary, this invention locates specific trace segments in the anti-pad region corresponding to the target fan-out trace, accurately pinpoints impedance abrupt change areas, constructs adjustable-width trace segments, and achieves independent control of this impedance-sensitive region, significantly improving the accuracy of impedance control. Furthermore, by traversing trace width variables and combining simulation analysis, it can systematically obtain the correlation between different trace widths and impedance, thereby selecting the optimal trace width value that perfectly matches the preset standard. This effectively eliminates impedance abrupt changes in the anti-pad region caused by insufficient reference planes, significantly improving link impedance continuity. Moreover, this invention does not require modification of the anti-pad structure or the overall trace layout; it only optimizes specific trace segments, adapting to various impedance abrupt change scenarios caused by via anti-pad cutouts, such as connector fan-out and BGA fan-out. It is flexible and highly compatible, reducing design iteration and production costs.

[0065] In this embodiment, step 1 specifically involves: based on the geometric position of the connector anti-pad region 12, identifying and selecting the fan-out trace passing through the anti-pad region 12 as the target fan-out trace 2. The specific implementation process is as follows:

[0066] First, the original data of the PCB design layout is retrieved to extract the precise geometric location and complete geometric range of the connector anti-pad region 12, including its outer edge contour, planar dimensions, and board layer, forming the area to be analyzed. Based on the determined geometric range of the anti-pad region, all traces extending in the connector fan-out direction are retrieved from the PCB design layout. Fan-out traces whose physical paths directly pass through the anti-pad region are identified and included in the candidate list of target traces, while irrelevant traces that do not pass through the region at all are eliminated.

[0067] Furthermore, the electromagnetic influence of the fan-out traces in the candidate list is quantitatively determined. Using the outer edge of the anti-pad area as the measurement benchmark, the shortest straight-line distance between the centerline of the candidate trace and the outer edge is calculated. Traces with a shortest distance not exceeding 10 μm are selected and ultimately identified as the target fan-out trace 2 requiring impedance optimization. Specific identification rules and quantitative definition standards based on PCB design data are clearly defined to accurately identify the target trace and define the trace range affected by the anti-pad area 12, avoiding subjective errors from manual identification and ensuring the accuracy of the target fan-out trace 2 location result.

[0068] In this embodiment, step 2 specifically includes the following steps:

[0069] A first working coordinate system is established at the position of the first boundary of the anti-pad area 12 corresponding to the target fan-out trace 2; a second working coordinate system is established at the position of the second boundary of the target fan-out trace 2 corresponding to the anti-pad area 12; and the direction from the first boundary to the second boundary is along the extension direction of the target fan-out trace 2; the first working coordinate system and the second working coordinate system constitute the two positioning references of the target fan-out trace 2. The dual spatial coordinate reference standard jointly constituted by the first working coordinate system and the second working coordinate system, with the origins of the two coordinate systems corresponding to the two boundaries of the trace segment respectively, jointly defines the range of the trace segment corresponding to the anti-pad area 12.

[0070] Furthermore, the specific steps for establishing the working coordinate system 3 are as follows: In the simulation modeling software, use the working coordinate system 3 in the simulation modeling software. The working coordinate system 3 is used as the basic coordinate reference system for spatial position calibration and model editing operations. It includes core elements such as the origin and coordinate axis directions. The spatial coordinates of its origin can be flexibly adjusted through software commands. Call up the relative coordinate offset command and move the origin of the working coordinate system 3 to the specified spatial target position by setting the offset amount.

[0071] In this embodiment, step 3 specifically includes the following steps:

[0072] Define a virtual dividing plane perpendicular to the extension direction of the trace; set the virtual dividing plane at the positioning reference so that its normal direction is parallel to the extension direction of the trace; in specific operation, in the trace model editing interface of the simulation modeling software, based on the two working coordinate systems 3 of step 2 and the extension direction of the target fan-out trace 2, define two virtual dividing planes and constrain them to be perpendicular to the extension direction of the trace.

[0073] The segmentation process causes the target fan-out routing line 2 to break at the virtual segmentation plane. In practice, the segmentation function is activated in the simulation software, and the complete model of the target fan-out routing line 2 is selected as the segmentation object. First, the segmentation operation is performed on the virtual segmentation plane that is laid out at the first positioning reference. The software will cut the routing model according to the spatial position of the plane, so that the target fan-out routing line 2 is broken at the model level at the virtual segmentation plane. To maintain the consistency between the segmentation object and the segmentation rules, a second segmentation operation is performed on the virtual segmentation plane that is laid out at the second positioning reference.

[0074] After the two divisions are completed, the trace segment located between the two virtual division planes is the trace segment to be adjusted corresponding to the anti-solder pad area 12 of the connector via 11; the two trace segments located outside the two virtual division planes are the other parts of the target fan-out trace 2.

[0075] In this embodiment, step 4 specifically includes the following steps:

[0076] A line width variable is set to represent the range of width adjustment. The value of this line width variable represents the increase or decrease in the width of one side of the trace segment based on its original line width. The value can be positive or negative. When the value is positive, it means that the one-sided edge of the trace segment extends outward and widens, and the line width of the trace segment is widened. When the value is negative, it means that the one-sided edge of the trace segment contracts inward and narrows, and the line width of the trace segment is narrowed. When the value is 0, the trace segment maintains its original line width.

[0077] Based on the value of the linewidth variable, by offsetting the two edge surfaces of the trace segment at equal intervals along the linewidth direction, the simulation modeling software automatically updates the geometry of the trace segment model, generating an adjustable-width trace segment 21 with corresponding width adjustments. The linewidth direction is a lateral direction perpendicular to the extension direction of the target fan-out trace 2, representing the extension direction of the trace segment width and also the direction of subsequent edge surface offset. Through equal-interval offset, the two edge surfaces of the trace segment move synchronously at the same distance but in opposite directions, ensuring that the trace centerline does not shift. It is evident that the linewidth variable and the linewidth of the adjustable-width trace segment 21 have a one-to-one quantitative relationship; only the value of the linewidth variable needs to be modified to quickly generate adjustable-width trace segment 21 models with different linewidths. During subsequent impedance simulation, only the parameters of the independent adjustable-width trace segment 21 model need to be modified; there is no need to reconstruct the entire target fan-out trace 2 model.

[0078] like Figure 4 As shown, in this embodiment, between steps 4 and 5, a step is further included: performing a smooth curve transition processing on the abrupt width change connection between the adjustable width segment 21 and its adjacent trace end. The specific steps of the smooth curve transition processing are: modifying the geometric model at the abrupt width change connection, replacing the angular structure with a continuous curvature transition surface, that is, forming an arc angle 210 at the connection between the adjustable width segment 21 and its adjacent trace, allowing the line width change to be a smooth transition state. This eliminates the impedance abrupt change caused by the angular structure, reduces high-speed signal reflection and distortion, and also improves the realism of the simulation model, conforming to the actual PCB manufacturing process. The smooth curve transition processing operation is a native geometric model editing function of the simulation modeling software, requiring no additional custom plugin development or software configuration modification. Designers can directly implement the operation based on existing software. The continuous curvature transition surface can flexibly adapt to different line width adjustments of the adjustable width segment 21, achieving a smooth line width transition.

[0079] In this embodiment, step 5 specifically includes the following steps:

[0080] Set the scanning range and scanning step value of the linewidth variable; the upper and lower limits of the scanning range should be within the allowable range of the process, for example, 0.05mil to 0.35mil; the step value is positively correlated with the accuracy requirements of the impedance of the high-speed signal, while taking into account the simulation workload, and avoiding the simulation workload being too large and the efficiency being low due to the step value being too small, and the value is taken as 0.03 to 0.15mil.

[0081] The simulation software starts from the lower limit of the scanning range and increments it sequentially at intervals of scanning steps until the upper limit of the scanning range is reached, forming an ordered list of discrete values. Each value in the list represents an independent linewidth variable.

[0082] The simulation software sequentially calls each linewidth variable value from the discrete value list, automatically adjusts the linewidth of the adjustable line segment 21, and performs electromagnetic simulation on the complete signal path of the target fan-out trace 2 containing the adjustable line segment 21. The software automatically outputs the impedance characteristic curve corresponding to each linewidth variable value. For example, for 0.05mil, 0.10mil, 0.15mil, 0.20mil, 0.25mil, 0.30mil, and 0.35mil, the simulation results are as follows: Figure 5 The figure shows impedance characteristic curves for several linewidth variables. As can be seen from the figure, in this embodiment, when the linewidth variable is selected to be 0.25 mil, that is, the linewidth is increased by 0.5 mil, the impedance is very close to the optimal impedance of the preset standard, that is, 90 ohms.

[0083] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0084] The above embodiments merely illustrate several implementation methods of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A method for optimizing impedance abrupt changes in the fan-out region of a connector, characterized in that, Includes the following steps: Step 1: Locate the target fan-out trace that passes through the connector anti-solder pad area; Step 2: Establish a positioning reference at the boundary of the anti-pad area on the target fan-out routing line; Step 3: Based on the positioning reference, separate the routing segment from the other parts of the target fan-out routing; Step 4: Set the line width variable for the routing segment to construct an adjustable width line segment; Step 5: Iterate through the values ​​of different line width variables, change the line width of the adjustable line segment, and simulate the target fan-out routing to obtain different impedance results; Step 6: Select the optimal impedance that matches the preset standard from several impedance results, and obtain the optimal linewidth parameter corresponding to the optimal impedance.

2. The method for optimizing the impedance change of the connector fan-out region according to claim 1, characterized in that, The specific steps of step 1 are as follows: based on the geometric position of the connector anti-pad area, identify and select the fan-out trace passing through the anti-pad area as the target fan-out trace.

3. The method for optimizing the impedance change of the connector fan-out region according to claim 1, characterized in that, The specific steps of step 2 include: A first working coordinate system is established at the position of the first boundary of the anti-pad area corresponding to the target fan-out trace; A second working coordinate system is established at the position of the second boundary of the anti-pad area corresponding to the target fan-out trace; Furthermore, the direction from the first boundary to the second boundary is along the extension direction of the target fan-out path; the first working coordinate system and the second working coordinate system constitute the two positioning references of the target fan-out path.

4. The method for optimizing the impedance change of the connector fan-out region according to claim 3, characterized in that, The specific steps to establish a working coordinate system are as follows: In the simulation modeling software, use the relative coordinate offset command to move the origin of the working coordinate system to the target position.

5. The method for optimizing the impedance change of the connector fan-out region according to claim 1, characterized in that, The specific steps of step 3 include: Define a virtual partition plane perpendicular to the direction of trace extension; The virtual segmentation plane is set at the positioning reference, with its normal direction parallel to the extension direction of the trace. Performing the split causes the target fan-out routing to be disconnected in the virtual split plane; After completing two divisions, the resulting line segments are located between the two virtual division planes and other line segments located outside the two virtual division planes.

6. The method for optimizing the impedance change of the connector fan-out region according to claim 1, characterized in that, The specific steps of step 4 include: Set a line width variable to represent the width adjustment range, and the value of the line width variable represents the increase or decrease in the width of the trace segment on one side based on its original line width. Based on the value of the line width variable, the adjustable line segment with the corresponding width adjustment is generated by offsetting its two side edge surfaces at equal distances along the line width direction of the line segment.

7. The method for optimizing the impedance change of the connector fan-out region according to claim 1, characterized in that, Between step 4 and step 5, there is also a step of: performing a smooth curve transition at the abrupt width transition between the adjustable width line segment and its adjacent trace end.

8. The method for optimizing the impedance change of the connector fan-out region according to claim 7, characterized in that, The specific steps of the smooth curve transition processing are as follows: modify the geometric model at the abrupt width connection point, and replace the angular structure with a transition surface with continuous curvature.

9. The method for optimizing the impedance change of the connector fan-out region according to claim 1, characterized in that, The specific steps of step 5 include: Set the scan range and scan step value of the line width variable; Within the scanning range, several discrete linewidth variable values ​​are generated sequentially based on the scanning step value; For several linewidth variable values, the target fan-out trace containing the adjustable line width segment is simulated to obtain the corresponding impedance results.

10. The method for optimizing the impedance change of the connector fan-out region according to claim 9, characterized in that, The specific steps for selecting the optimal impedance that matches the preset standard in step 6 are as follows: compare and analyze the impedance curves of several impedance results, select the impedance curve whose overall impedance characteristics in the required frequency band are closest to the preset target impedance value, and take the corresponding linewidth variable value as the optimal linewidth parameter.