Preparation method of silver electrode

By using modified conductive additives and optimizing the preparation process in silver electrodes, the problems of high cost and insufficient conductivity of silver electrodes in the prior art have been solved, achieving a significant reduction in silver content and an improvement in electrode density, making them suitable for the industrial production of electronic components.

CN122266890APending Publication Date: 2026-06-23SHENZHEN NEW PULP TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202610552656.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-04-24
Publication Date
2026-06-23

AI Technical Summary

Technical Problem

Existing technologies struggle to reduce the cost of silver electrodes while maintaining their conductivity and structural density, especially given the trend towards miniaturization and high-frequency operation of electronic components, which places higher demands on the density and conductivity stability of silver electrodes.

Method used

By replacing some of the silver with modified conductive additives such as nickel powder, tungsten powder, and molybdenum powder, and combining them with glass powder with excellent sintering properties, a silver electrode is formed through optimized preparation process, ensuring the electrode's conductivity and structural density.

Benefits of technology

This method achieves a significant reduction in silver content, thereby lowering production costs, while ensuring the conductivity and structural density of the silver electrode, making it suitable for large-scale industrial production.

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Abstract

The invention discloses a preparation method of a silver electrode, and belongs to the technical field of electronic component metallization. The method comprises the four steps of glass raw material preparation, glass powder preparation, silver paste preparation and silver electrode sintering, modified nickel powder, tungsten powder and other conductive additives are adopted to replace part of silver, SiO2-B2O3-Bi2O3-Na2CO3-Al2O3 glass powder is matched, and the mass ratio of the silver powder is controlled to be 12-72 wt.%. The defects of high silver content, high cost or poor conductivity in the prior art are overcome, the prepared silver electrode is compact in structure, stable in conductivity and simple in process, industrial production can be achieved, and the production cost of electronic components is effectively reduced.
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