Automobile seat with rapid cooling function based on semiconductor refrigeration

Abstract

This invention belongs to the field of automotive seat technology, and specifically relates to an automotive seat with rapid cooling function based on semiconductor refrigeration. It includes a base, a backrest, an upper part of the backrest, a lower part of the base, a cooling module, and auxiliary components. The lower part of the base has a heat dissipation vent. Both the base and the backrest contain a cooling module, which includes a semiconductor refrigeration plate. The cold end of the semiconductor refrigeration plate is connected to a heat-conducting plate, and the hot end is connected to heat dissipation fins. A semiconductor hot-end cooling fan is attached to the heat dissipation fins of the semiconductor refrigeration plate. This invention enables rapid cooling of the seat, improving comfort during the initial stages of seating in high temperatures. By setting an air vent baffle, once the seat temperature drops to a comfortable range, the semiconductor refrigeration plate can be turned off, leaving only the seat fan running. This allows airflow to pass through another ventilation path for regular ventilation, thus avoiding discomfort caused by prolonged direct exposure to cold air.

Description

Technical Field

[0001] This invention relates to the field of automotive seat technology, specifically to an automotive seat with rapid cooling function based on semiconductor refrigeration. Background Technology

[0002] As people's demands for driving comfort continue to increase, the comfort of car seats, as one of the components that come into closest contact with the human body, has become an important standard for measuring the level of car interiors. After being exposed to the sun for a long time in the hot summer, the temperature inside the car rises to a high level, especially the surface temperature of dark-colored seats, which brings an extremely uncomfortable experience to drivers and passengers. It also increases the energy consumption and time cost of turning on the air conditioning to cool down the car after getting in.

[0003] To address the issue of overheated seats in summer, most solutions on the market currently rely on seat ventilation to cool them down. However, this method requires the air conditioning system to cool the interior first. As seats are in direct contact with the human body, the cooling process is slow, failing to address the core pain point of rapid seat cooling. Summary of the Invention

[0004] The purpose of this section is to outline some aspects of the embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the invention.

[0005] To solve the above-mentioned technical problems, according to one aspect of the present invention, the present invention provides the following technical solution: a car seat with rapid cooling function based on semiconductor refrigeration, comprising a base, a backrest, an upper part of the backrest, a lower part of the base, a refrigeration module, and auxiliary components. The lower part of the base has a heat dissipation vent. A refrigeration module is disposed within both the base and the backrest. The refrigeration module includes a semiconductor refrigeration plate. The cold end of the semiconductor refrigeration plate is connected to a heat-conducting plate, and the hot end is connected to heat dissipation fins. A semiconductor hot-end cooling fan is attached to the heat dissipation fins of the hot end of the semiconductor refrigeration plate. The auxiliary components include a primary ventilation duct for conveying cold air, a heat dissipation duct for conveying hot air, and a secondary ventilation duct for achieving conventional ventilation functions, all disposed within the base and the backrest. A seat fan is disposed within the base and is connected to the refrigeration module via an air inlet duct. The refrigeration module is connected to the air inlet duct, the heat dissipation duct, the primary ventilation duct, and the secondary ventilation duct.

[0006] As a preferred embodiment of the automotive seat with rapid cooling function based on semiconductor refrigeration described in this invention, heat insulation cotton is provided between the cold end and the hot end of the semiconductor refrigeration plate.

[0007] As a preferred embodiment of the automotive seat with rapid cooling function based on semiconductor refrigeration described in this invention, air outlet baffles are provided at the ventilation openings of the first ventilation duct and the second ventilation duct.

[0008] As a preferred embodiment of the automotive seat with rapid cooling function based on semiconductor refrigeration described in this invention, a moisture-absorbing layer is provided at the connection between the refrigeration module and the air inlet duct and the second air outlet duct.

[0009] As a preferred embodiment of the automotive seat with rapid cooling function based on semiconductor refrigeration described in this invention, a condensate collection pipe is also provided at the connection of the second air outlet duct of the refrigeration module, and a condensate collection box is connected to the outlet end of the condensate collection pipe.

[0010] As a preferred embodiment of the automotive seat with rapid cooling function based on semiconductor refrigeration described in this invention, sealing cotton is provided around the cold air delivery path of the first ventilation duct.

[0011] As a preferred embodiment of the car seat with rapid cooling function based on semiconductor refrigeration described in this invention, an air guide layer for the base and an air guide layer for the backrest are respectively provided inside the base and the backrest. A ventilation net is provided on both the base air guide layer and the backrest air guide layer. A base sponge and a backrest sponge are respectively provided inside the base and the backrest. The air outlet of the first ventilation duct is connected to the ventilation net.

[0012] Compared with existing technologies, the advantages of this invention are as follows: By incorporating a semiconductor cooling plate, a heat-conducting plate, heat dissipation fins, and a ventilation structure, the semiconductor cooling plate is activated when rapid cooling of the car seat is required. The cold energy generated at the cold end is then transferred to the base and backrest area via the heat-conducting plate and ventilation ducts, thereby increasing the cooling speed of the seat and achieving rapid cooling. Simultaneously, the heat generated at the hot end is dissipated through the heat dissipation fins and fan to ensure cooling efficiency. Compared to traditional ventilated seats that rely on slow heat exchange through airflow, this invention enables rapid seat cooling, improving comfort during the initial stages of seating in high temperatures. By incorporating an air outlet baffle, the semiconductor cooling plate can be deactivated once the seat temperature has dropped to a comfortable range, leaving only the seat fan running. This allows airflow to be routed through another ventilation path for regular ventilation, thus avoiding discomfort caused by prolonged, continuous direct exposure to cold air. Attached Figure Description

[0013] To more clearly illustrate the technical solutions of the embodiments of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and detailed embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein:

[0014] Figure 1 This is a schematic diagram of the structure of a car seat with rapid cooling function based on semiconductor refrigeration according to the present invention;

[0015] Figure 2 This is a bottom view of a car seat with rapid cooling function based on semiconductor refrigeration according to the present invention.

[0016] Figure 3 This is a schematic diagram of the semiconductor cooling plate and heat dissipation fins of an automobile seat with rapid cooling function based on semiconductor refrigeration according to the present invention.

[0017] Figure 4 This is a schematic diagram of the structure of a car seat fan with rapid cooling function based on semiconductor refrigeration according to the present invention;

[0018] Figure 5 This is a schematic diagram of the semiconductor cooling plate and insulation cotton for a car seat with rapid cooling function based on semiconductor refrigeration according to the present invention.

[0019] Figure 6 This is a schematic diagram of the relative positions of the cooling module cavity and its internal components of an automotive seat with rapid cooling function based on semiconductor refrigeration, according to the present invention.

[0020] Figure 7 This is a schematic diagram of the structure of a fan, ventilation duct, and auxiliary components for a car seat based on semiconductor refrigeration with rapid cooling function, which has both rapid cooling and conventional ventilation functions.

[0021] Figure 8 This is a schematic diagram illustrating the working principle of the condensate collection pipe of the semiconductor cooling plate at the bottom of the base of a car seat with rapid cooling function based on semiconductor refrigeration according to the present invention.

[0022] Figure 9 This is a schematic diagram showing the relative positional relationship between the seat fan and the cold air ventilation duct of a car seat with rapid cooling function based on semiconductor refrigeration according to the present invention.

[0023] Figure 10 This is a schematic diagram of the user control logic for switching between rapid cooling and conventional ventilation functions in a car seat based on semiconductor refrigeration with rapid cooling function according to the present invention.

[0024] Figure 11 This is a schematic diagram of an air outlet baffle structure for a car seat with rapid cooling function based on semiconductor refrigeration, which enables rapid cooling and switching between normal ventilation functions according to the present invention.

[0025] Figure 12 This is a schematic diagram showing the relative positions of the seat foam, ventilation mesh, and fan in the seat back of a car seat with rapid cooling function based on semiconductor refrigeration, according to the present invention.

[0026] Figure 13 This is a schematic diagram showing the positional relationship between the ventilation holes in the seat foam and the air vent in the seat back of a car seat with rapid cooling function based on semiconductor refrigeration, according to the present invention.

[0027] Figure 14 This is a schematic diagram showing the positional relationship between the ventilation holes of the seat sponge and the air vent in the seat base of a car seat with rapid cooling function based on semiconductor refrigeration, according to the present invention.

[0028] Figure 15 This is a schematic diagram showing the positional relationship of the condensate collection pipes in a car seat with rapid cooling function based on semiconductor refrigeration, according to the present invention.

[0029] In the diagram: 101, base; 102, backrest; 201, heat dissipation vent; 202, upper backrest; 203, lower base; 301, semiconductor cooling plate; 302, heat conduction plate; 303, heat dissipation fins; 401, seat fan; 501, insulation cotton; 601, cooling module; 602, semiconductor hot end cooling fan; 701, air inlet duct; 702, moisture-absorbing layer; 703, heat dissipation duct; 704, No. 1 air outlet duct; 705, No. 2 air outlet duct; 706, condensate collection duct; 901, sealing cotton; 1101, air outlet baffle; 1201, air venting mesh; 1202, backrest sponge; 1301, backrest air guide layer; 1401, base air guide layer; 1402, base sponge; 1501, condensate collection box. Detailed Implementation

[0030] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0031] Secondly, the present invention is described in detail with reference to the schematic diagrams. When detailing the embodiments of the present invention, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged, not according to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of the present invention. In addition, actual fabrication should include three-dimensional spatial dimensions of length, width, and depth.

[0032] To make the objectives, technical solutions, and advantages of the present invention clearer, the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

[0033] Please see Figures 1-2 A car seat with rapid cooling function based on semiconductor refrigeration includes a base 101, a backrest 102, a backrest upper part 202, a base lower part 203, a cooling module 601, and auxiliary components. The base lower part 203 has a heat dissipation vent 201. The cooling module 601 is disposed within both the base 101 and the backrest 102. (See also...) Figure 3 The cooling module 601 includes a semiconductor cooling plate 301. The cold end of the semiconductor cooling plate 301 is connected to a heat-conducting plate 302 via thermally conductive silicone grease. The heat-conducting plate 302 is made of aluminum to improve cold energy transfer efficiency. The hot end is connected to heat dissipation fins 303 via thermally conductive silicone grease. The heat dissipation fins 303 are also made of aluminum to improve heat transfer efficiency. Please refer to [link to relevant documentation]. Figure 6 The heat dissipation fins 303 of the hot end of the semiconductor cooling plate 301 are attached to a semiconductor hot end cooling fan 602. The auxiliary components include a primary ventilation duct 704 for conveying cold air and a heat dissipation duct 703 for conveying hot air, and a secondary ventilation duct 705 for performing conventional ventilation functions, both disposed within the base 101 and backrest 102. Please refer to [link / reference]. Figure 4 The base 101 is equipped with a seat fan 401. Please refer to [link / reference]. Figure 7 The seat fan 401 is connected to the cooling module 601 via the air inlet duct 701. The cooling module 601 is connected to the air inlet duct 701, the heat dissipation duct 703, the first ventilation duct 704, and the second ventilation duct 705. The heat-conducting plate 302 is configured to cooperate with the seat fan 401, the first air outlet duct 704, and the second air outlet duct 705. The heat dissipation fins 303 are configured to cooperate with the heat dissipation fan 602 and the heat dissipation duct 703 at the hot end of the semiconductor cooling plate. When the working mode is rapid cooling mode, the cold end of the semiconductor cooling plate 301 generates cold energy, which is transferred through the heat-conducting plate 302 and, under the action of the seat fan 401, is transported to the first ventilation duct 704 via the air inlet duct 701. Please refer to [link / reference]. Figures 12-14The base 101 and backrest 102 are respectively provided with a base air guide layer 1401 and a backrest air guide layer 1301. Both the base air guide layer 1401 and the backrest air guide layer 1301 are provided with a ventilation net 1201. The base 101 and backrest 102 are respectively provided with a base sponge 1402 and a backrest sponge 1202. The air outlet of the first ventilation duct 704 is connected to the ventilation net 1201. Cooling energy is delivered to the ventilation net 1201, the backrest air guide layer 1301 and the base air guide layer 1401, and then to the area of ​​the base 101 and the backrest 102, thereby rapidly cooling the interior of the seat and the contact area. Meanwhile, the heat generated by the hot end of the semiconductor cooling plate 301 is conducted through the heat dissipation fins 303 and enters the hot air heat dissipation pipe 703 under the action of the heat dissipation fan 602 at the hot end of the semiconductor cooling plate, and is finally discharged through the heat dissipation port 201 at the bottom of the base 101, so as to timely discharge the heat generated by the hot end of the semiconductor cooling plate 301 and improve the cooling efficiency.

[0034] Please see Figure 5 and Figure 8 A heat insulation cotton 501 is provided between the cold end and the hot end of the semiconductor cooling plate 301 to reduce heat transfer between the cold end and the hot end of the semiconductor cooling plate 301, thereby improving the cooling efficiency.

[0035] Please see Figure 7 and Figure 10 and Figure 11 Air outlet baffles 1101 are provided at the ventilation openings of the first ventilation duct 704 and the second ventilation duct 705. The air outlet baffles 1101 are used to switch the airflow path. When rapid cooling is required, the semiconductor cooling plate 301 is activated, and the seat fan 401 draws air into the base and backrest areas. The air enters the air inlet duct 701, is then cooled by the heat conduction plate 302, and is then delivered to the base 101 and backrest 102 areas through the first ventilation duct 704 to achieve rapid cooling. When the temperature in the base 101 and backrest 102 areas drops to a comfortable range, the semiconductor cooling plate 301 can be turned off. By adjusting the air outlet baffles 1101, the seat fan 401 drives the airflow through the air inlet duct 701 and the second ventilation duct 705 to achieve normal ventilation function, thereby avoiding discomfort caused by prolonged direct exposure to cold air.

[0036] Please see Figure 11 The cooling module 601 is provided with a moisture-absorbing layer 702 at the connection between the air inlet duct 701 and the second air outlet duct 705 to dehumidify the air flowing through it, thereby reducing the risk of condensation and improving comfort.

[0037] Please see Figure 7 and Figure 15The cooling module 601 is also equipped with a condensate collection pipe 706 at the connection of the second air outlet pipe 705. The condensate collection pipe 706 is set with an inclined angle and a vertical placement. The outlet end of the condensate collection pipe 706 is connected to a condensate collection box 1501 to discharge the condensate generated by the heat conduction plate 302 connected to the cold end of the semiconductor cooling plate 301 in a timely manner. The condensate collection pipe 706 is connected to the condensate collection box 1501. The condensate collection box 1501 can be detached and removed to discharge the collected condensate.

[0038] Please see Figure 9 The cold air delivery path of the first ventilation duct 704 is surrounded by sealing cotton 901 to improve air delivery efficiency.

[0039] In summary, this application constructs a seat thermal management system that combines rapid cooling and conventional ventilation by incorporating a semiconductor cooling plate 301, a heat conduction plate 302, heat dissipation fins 303, an air duct, and auxiliary structures inside the car seat. This not only improves the cooling response speed of the seat in high-temperature environments but also enhances overall seating comfort, demonstrating significant application value.

[0040] Although the present invention has been described above with reference to embodiments, various modifications can be made and components can be replaced with equivalents without departing from the scope of the invention. In particular, as long as there is no structural conflict, the features in the disclosed embodiments can be combined with each other in any manner. The lack of an exhaustive description of these combinations in this specification is merely for the sake of brevity and resource conservation. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A car seat with rapid cooling function based on semiconductor refrigeration, comprising a base (101), a backrest (102), a backrest upper part (202), a base lower part (203), a refrigeration module (601), and auxiliary components, characterized in that, The lower part (203) of the base is provided with a heat dissipation vent (201). A cooling module (601) is provided inside both the base (101) and the backrest (102). The cooling module (601) includes a semiconductor cooling plate (301). The cold end of the semiconductor cooling plate (301) is connected to a heat-conducting plate (302), and the hot end is connected to heat dissipation fins (303). A semiconductor hot-end cooling fan (602) is attached to the heat dissipation fins (303) at the hot end of the semiconductor cooling plate (301). The auxiliary components include those provided in the base (101). 1) The base (101) contains a first ventilation duct (704) for conveying cold air, a heat dissipation duct (703) for conveying hot air, and a second ventilation duct (705) for realizing conventional ventilation function. A seat fan (401) is provided in the base (101). The seat fan (401) is connected to the cooling module (601) through the air inlet duct (701). The cooling module (601) is connected to the air inlet duct (701), the heat dissipation duct (703), the first ventilation duct (704), and the second ventilation duct (705).

2. A car seat with rapid cooling function based on semiconductor refrigeration according to claim 1, characterized in that, A heat insulation cotton (501) is provided between the cold end and the hot end of the semiconductor cooling plate (301).

3. A car seat with rapid cooling function based on semiconductor refrigeration according to claim 1, characterized in that, Air outlet baffles (1101) are provided at the ventilation openings of the No. 1 ventilation duct (704) and the No. 2 ventilation duct (705).

4. A car seat with rapid cooling function based on semiconductor refrigeration according to claim 1, characterized in that, A moisture-absorbing layer (702) is provided at the connection between the refrigeration module (601) and the air inlet pipe (701) and the second air outlet pipe (705).

5. A car seat with rapid cooling function based on semiconductor refrigeration according to claim 4, characterized in that, A condensate collection pipe (706) is also provided at the connection of the second air outlet pipe (705) of the refrigeration module (601), and the outlet end of the condensate collection pipe (706) is connected to a condensate collection box (1501).

6. A car seat with rapid cooling function based on semiconductor refrigeration according to claim 1, characterized in that, The cold air delivery path of the No. 1 ventilation duct (704) is surrounded by sealing cotton (901).

7. A car seat with rapid cooling function based on semiconductor refrigeration according to claim 1, characterized in that, The base (101) and backrest (102) are respectively provided with a base air guide layer (1401) and a backrest air guide layer (1301). Both the base air guide layer (1401) and the backrest air guide layer (1301) are provided with a ventilation net (1201). The base (101) and backrest (102) are respectively provided with a base sponge (1402) and a backrest sponge (1202). The air outlet of the first ventilation duct (704) is connected to the ventilation net (1201).

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