A heat-curable silicone-modified adhesive set, and a preparation method and application thereof

Abstract

This invention belongs to the field of adhesive technology, and relates to a thermosetting silicone-modified adhesive, its preparation method, and its application. The raw materials of the thermosetting silicone-modified adhesive include a specific amount of silicone-modified epoxy resin, epoxy reinforcing agent, solubilizer, curing agent, and curing accelerator. The silicone-modified epoxy resin is obtained by reacting epoxy monomers and hydrogen-containing silicone oil under catalytic conditions. By chemically bonding silicone and epoxy groups onto the same molecule, thermodynamically stable compatibility of the silicone-modified epoxy resin is achieved, avoiding the phase separation problem of physical blending. With the addition of epoxy reinforcing agent and solubilizer, the final thermosetting silicone-modified adhesive has excellent mechanical properties, bonding properties, long-term weather resistance, heat resistance, and storage stability, and has the characteristic of continuous stable application at medium and high temperature.

Description

Technical Field

[0001] This invention belongs to the field of adhesive technology, and relates to a thermosetting silicone-modified adhesive, its preparation method, and its application. Background Technology

[0002] With the rapid development of semiconductor technology, high-bandwidth memory (HBM), as a new type of stacked memory, has been widely used in high-performance computing, artificial intelligence, data centers, and other fields due to its advantages of high bandwidth and low power consumption. In the wafer HBM fabrication process, temporary bonding is a crucial step. This process requires temporarily bonding an ultra-thin wafer to a carrier wafer to provide sufficient support strength, ensuring the smooth progress of subsequent processing steps such as dicing, grinding, and bonding.

[0003] As a temporary bonding material, the performance of adhesives directly affects the success or failure of the bonding process. Currently, there are numerous studies and reports on adhesives for temporary bonding in the industry, with silicone-modified epoxy resins or acrylates being the mainstream approach. For example, CN119709116A discloses a flexible epoxy-modified silicone adhesive and its preparation method and application, which involves introducing epoxy resin into a silicone matrix and combining it with toughening agents and catalysts, employing physical blending modification. Another example is CN120424281A, which discloses a method for synthesizing moisture-curing silicone resin and its application, obtaining a silicone-modified resin through a two-step polymerization reaction, employing chemical modification. However, existing modification technologies including the above schemes still have the following problems: ① Compatibility and phase stability issues: Organosilicon (non-polar) and epoxy or acrylate (polar) are thermodynamically incompatible. Simple physical blending easily leads to phase separation, poor storage stability, internal phase division after curing, uneven performance, and easy damage at the interface; ② Limited degree of modification: Most methods use physical blending or simple end-group reactions. The chemical bonding force between organosilicon segments and the main resin is weak, failing to achieve uniform modification at the molecular level. Under stress or heat, the modifier is prone to migration or failure, failing to fully utilize the durable advantages of organosilicon; ③ Performance balance problem: Improving adhesive strength often comes at the cost of sacrificing flexibility and heat resistance, while improving heat resistance may lead to material embrittlement; ④ Complex processes and high costs: Some effective modification processes (such as the synthesis of special silane coupling agents, multi-step polymerization, etc.) are complex and have high requirements for raw materials and equipment, which is not conducive to large-scale industrial production and application.

[0004] Therefore, it remains very important to develop a thermosetting silicone-modified adhesive that combines excellent adhesion, mechanical properties, long-term weather resistance, and storage stability to address the aforementioned technical problems. Summary of the Invention

[0005] To address the shortcomings of existing technologies, the present invention aims to provide a thermosetting silicone-modified adhesive, its preparation method, and its application. The thermosetting silicone-modified adhesive achieves optimal synergy among bonding performance, comprehensive mechanical properties, long-term weather resistance / heat resistance, and storage stability. Furthermore, the preparation process is simple and suitable for large-scale industrial production and application.

[0006] To achieve this objective, the present invention adopts the following technical solution: In a first aspect, the present invention provides a thermosetting silicone-modified adhesive, wherein the raw materials of the thermosetting silicone-modified adhesive comprise the following components in parts by weight: 100 parts by weight of silicone-modified epoxy resin; Epoxy reinforcing agent 20-60 parts by weight; Solubilizer: 0.5-2 parts by weight; Curing accelerator: 0.2-2 parts by weight; 5-20 parts by weight of curing agent; The organosilicon-modified epoxy resin is obtained by reacting epoxy monomers and hydrogen-containing silicone oil under catalytic conditions.

[0007] The amount of epoxy reinforcing agent can be 20 parts by weight, 25 parts by weight, 30 parts by weight, 35 parts by weight, 40 parts by weight, 45 parts by weight, 50 parts by weight, 55 parts by weight, or 60 parts by weight, etc.

[0008] The amount of the solubilizer can be 0.5 parts by weight, 0.7 parts by weight, 0.9 parts by weight, 1.1 parts by weight, 1.3 parts by weight, 1.5 parts by weight, 1.7 parts by weight, 1.9 parts by weight, or 2 parts by weight, etc.

[0009] The amount of the curing accelerator can be 0.2 parts by weight, 0.4 parts by weight, 0.6 parts by weight, 0.8 parts by weight, 1 part by weight, 1.2 parts by weight, 1.4 parts by weight, 1.6 parts by weight, 1.8 parts by weight, or 2 parts by weight, etc.

[0010] The amount of the curing agent can be 5 parts by weight, 10 parts by weight, 15 parts by weight, or 20 parts by weight, etc.

[0011] First, the thermosetting silicone-modified adhesive provided by this invention uses silicone-modified epoxy resin as the base material. The silicone-modified epoxy resin is obtained by reacting epoxy monomers and hydrogen-containing silicone oil under catalytic conditions. Through chemical bonding (hydrosilylation), silicone and epoxy groups are linked to the same molecule, achieving thermodynamically stable compatibility and avoiding the phase separation problem of physical blending. The epoxy monomers provide reactive double bonds and strongly polar epoxy groups, acting as a bridge between the silicone and epoxy systems, thereby achieving chemical modification of the silicone, solving the compatibility problem, and laying the foundation for high-strength adhesion. The hydrogen-containing silicone oil serves as the main chain of the silicone, providing S... The i-O-Si framework provides heat resistance, weather resistance, and flexibility, ensuring the adhesive has a high elongation at break, is stable at medium and high temperatures, and prevents the epoxy network from easily degrading or softening at high temperatures. Secondly, the epoxy reinforcing agent can participate in curing together with the epoxy groups in the silicone-modified epoxy resin to form a dense cross-linked network, which greatly improves the cohesive strength, modulus, and hardness of the resulting adhesive. Thirdly, the solubilizer can further ensure the uniformity and stability of each component during storage, prevent phase separation, and improve storage stability. Finally, the curing agent and curing accelerator can initiate and accelerate the thermosetting reaction of the epoxy groups, determining the curing temperature, speed, and the integrity of the final network structure.

[0012] Preferably, the epoxy monomer comprises any one or a combination of at least two of 4-vinylcyclohexene dioxide, allyl glycidyl ether, or glycidyl methacrylate.

[0013] Preferably, the hydrogen-containing silicone oil includes phenyl-containing hydrogen-containing silicone oil and phenyl-free hydrogen-containing silicone oil.

[0014] Preferably, the catalyst comprises any one or a combination of at least two of the following: a cassiterite catalyst, a Pt-cyclovinylmethylsiloxane, or a chloroplatinic acid-olefin complex.

[0015] Preferably, the mass ratio of the epoxy monomer to the hydrogen-containing silicone oil is 1:(1~3), for example, 1:1, 1:1.2, 1:1.4, 1:1.6, 1:1.8, 1:2, 1:2.2, 1:2.4, 1:2.6, 1:2.8 or 1:3, etc.

[0016] Preferably, the mass percentage of platinum in the catalyst is 5 to 20 ppm of the reaction system, such as 5 ppm, 7 ppm, 9 ppm, 11 ppm, 13 ppm, 15 ppm, 17 ppm, 19 ppm or 20 ppm.

[0017] Preferably, the reaction temperature is 60~100℃, for example 60℃, 65℃, 70℃, 75℃, 80℃, 85℃, 90℃, 95℃ or 100℃.

[0018] Preferably, the reaction time is 6 to 12 hours, such as 6 hours, 7 hours, 8 hours, 9 hours, 10 hours, 11 hours, or 12 hours.

[0019] Preferably, the reaction is carried out in solvent A.

[0020] Preferably, solvent A includes any one or a combination of at least two of toluene, xylene, cyclopentanone, or methyl isobutyl ketone.

[0021] Preferably, the mass ratio of epoxy segments to silicone segments in the silicone-modified epoxy resin is (16~20):(30~60), for example, 16:30, 16.5:35, 17:40, 17.5:45, 18:50, 19:55, or 20:60. On the one hand, if the proportion of epoxy segments in the silicone-modified epoxy resin is too large, it is easy to lead to limited modification of the epoxy resin, resulting in a decrease in the mechanical properties of the final silicone-modified adhesive. On the other hand, if the proportion of silicone segments in the silicone-modified epoxy resin is too large, it is easy to lead to uneven physicochemical properties of the final silicone-modified adhesive because the obtained silicone-modified epoxy resin is not miscible with epoxy reinforcing agents, curing agents, etc.

[0022] Preferably, the epoxy reinforcing agent comprises any one or a combination of at least two of the following: triglycidyl ether p-aminophenol, diglycidyl dimethyl biphenyl, diglycidyl-4,5-epoxycyclohexane-1,2-dicarboxylate, bisphenol A epoxy resin, or tetrafunctional epoxy resin. More preferably, it comprises any one or a combination of at least two of the following: triglycidyl ether p-aminophenol, diglycidyl dimethyl biphenyl, diglycidyl-4,5-epoxycyclohexane-1,2-dicarboxylate, or tetrafunctional epoxy resin.

[0023] Preferably, the solubilizer includes any one or a combination of at least two of polyether-modified polysiloxane, epoxy silane coupling agent, or organosilicon-polyether copolymer.

[0024] Preferably, the curing accelerator includes imidazole curing accelerators and / or tertiary amine curing accelerators.

[0025] Preferably, the curing agent comprises any one or a combination of at least two of pyrogallol A, 4,4'-diaminodiphenyl sulfone, or methylhexahydrophthalic anhydride.

[0026] Preferably, the raw materials of the thermosetting silicone-modified adhesive further include solvent B.

[0027] Preferably, the amount of solvent B in the raw materials of the thermosetting silicone modified adhesive is 100 to 500 parts by weight, such as 100 parts by weight, 150 parts by weight, 200 parts by weight, 250 parts by weight, 300 parts by weight, 350 parts by weight, 400 parts by weight, 450 parts by weight, or 500 parts by weight.

[0028] Preferably, solvent B comprises any one or a combination of at least two of toluene, xylene, cyclopentanone, or methyl isobutyl ketone.

[0029] In a second aspect, the present invention provides a method for preparing a thermosetting silicone-modified adhesive as described in the first aspect, the method comprising: mixing a silicone-modified epoxy resin, an epoxy reinforcing agent, a solubilizer, a curing accelerator and a curing agent in a solvent B to obtain the thermosetting silicone-modified adhesive.

[0030] Preferably, the mixing temperature is 20~30℃, such as 20℃, 21℃, 22℃, 23℃, 24℃, 25℃, 26℃, 27℃, 28℃, 29℃ or 30℃.

[0031] Preferably, the mixing time is 3 to 6 hours, such as 3 hours, 3.5 hours, 4 hours, 4.5 hours, 5 hours, 5.5 hours, or 6 hours.

[0032] Thirdly, the present invention provides an application of the curable silicone-modified adhesive as described in the first aspect in wafer processing.

[0033] Compared with the prior art, the present invention has the following beneficial effects: (1) The raw materials of the thermosetting silicone-modified adhesive provided by the present invention include a specific amount of silicone-modified epoxy resin, epoxy reinforcing agent, solubilizer, curing agent and curing accelerator. The silicone-modified epoxy resin is obtained by reacting epoxy monomer and hydrogen-containing silicone oil under catalytic conditions. The silicone and epoxy groups are linked to the same molecule through chemical bonding (hydrosilylation), which achieves thermodynamically stable compatibility of the silicone-modified epoxy resin and avoids the phase separation problem of physical blending. With the addition of epoxy reinforcing agent and solubilizer, the final thermosetting silicone-modified adhesive has excellent mechanical properties, heat resistance, long-term weather resistance and storage stability. The tensile strength is as high as 8~22MPa, the elongation at break is as high as 14~47%, and the modulus is as high as 202~560. With a strength of MPa and a Tg as high as 130~158℃, the heat resistance test shows a 5% weight loss temperature as high as 376~403℃. Moreover, the adhesive remains uniform and stable after being stored at room temperature for 3 months, demonstrating its stable performance under medium and high temperature conditions.

[0034] (2) The thermosetting silicone-modified adhesive provided by the present invention is a common solution polymerization and mixing process in the whole preparation process. The steps are clear, the conditions are controllable, and it is easy to realize industrial scale-up production. Detailed Implementation

[0035] The technical solution of the present invention will be further illustrated below through specific embodiments. Those skilled in the art should understand that the embodiments described are merely illustrative of the present invention and should not be construed as limiting the invention in any way.

[0036] The detailed information of some of the raw materials involved in the following specific implementation methods is shown below: (1) Hydrogen-containing silicone oil: with a hydrogen content of 0.18%, purchased from Shanghai Silicon Power Materials Co., Ltd., model number MH180; (2) Phenyl hydrogen-containing silicone oil: with a hydrogen content of 0.3%, purchased from Shandong Dayi Chemical Co., Ltd., model DY-PH212; (3) Tetrafunctional epoxy resin: purchased from Guangzhou Hengchuang New Material Technology Co., Ltd., model number HC-80.

[0037] Preparation Example 1 An organosilicon-modified epoxy resin A1, wherein the mass ratio of epoxy segments to organosilicon segments is 16:40. The preparation method includes: adding 50 g of allyl glycidyl ether, 0.045 g of caster catalyst (specification 5000ppm) and 100 g of toluene into a reaction vessel, stirring and heating to 80°C, and then slowly adding 90 g of hydrogen-containing silicone oil into the reaction vessel. Under nitrogen protection, the reaction is carried out for 500 min to obtain the organosilicon modified epoxy resin A1.

[0038] Preparation Example 2 An organosilicon-modified epoxy resin A2, wherein the mass ratio of epoxy segments to organosilicon segments is 16:40. The preparation method includes: adding 50 g of 4-vinylcyclohexene dioxide, 0.045 g of caster catalyst (specification 5000 ppm) and 100 g of toluene into a reaction vessel, stirring and heating to 90°C, and then slowly adding 90 g of phenyl hydrogen silicone oil dropwise into the reaction vessel. Under nitrogen protection, the reaction is carried out for 500 min to obtain the organosilicon modified epoxy resin A2.

[0039] Preparation Example 3 An organosilicon-modified epoxy resin A3, wherein the mass ratio of epoxy segments to organosilicon segments is 16:40. The preparation method includes: adding 50 g glycidyl methacrylate, 0.045 g caster catalyst (specification 5000 ppm) and 100 g toluene into a reaction vessel, stirring and heating to 90°C, then slowly adding 90 g hydrogen-containing silicone oil dropwise into the reaction vessel, and reacting for 500 min under nitrogen protection to obtain the organosilicon modified epoxy resin A3.

[0040] Preparation Example 4 An organosilicon-modified epoxy resin A4 differs from Preparation Example 1 in that the mass of the hydrogen-containing silicone oil is adjusted to 198 g, so that the mass ratio of epoxy segments to organosilicon segments in the final organosilicon-modified epoxy resin A4 is 10:55. Other substances, amounts, and preparation methods are the same as in Preparation Example 1.

[0041] Preparation Example 5 An organosilicon-modified epoxy resin A5 differs from Preparation Example 1 in that the mass of the hydrogen-containing silicone oil is adjusted to 50 g, so that the mass ratio of epoxy segments to organosilicon segments in the final organosilicon-modified epoxy resin A5 is 30:30. Other substances, amounts, and preparation methods are the same as in Preparation Example 1.

[0042] Comparative Preparation Example 1 A silicone-modified epoxy resin D1 is prepared by means of: adding 50 g of octamethylcyclotetrasiloxane and 2 g of sulfuric acid to a reaction vessel, stirring and heating to 80°C, reacting for 60 min, then slowly adding 1.5 g of water to the reaction vessel, stirring and heating to 100°C, reacting for 180 min, stirring and cooling to 80°C, then slowly adding 10 g of hydrogen peroxide to the reaction vessel, reacting for 300 min; then slowly adding 10 g of vinyl MT resin to the reaction vessel, reacting for 300 min, and after the reaction is completed and cooled to room temperature, washing with water to remove sulfuric acid, thereby obtaining the silicone-modified epoxy resin D1.

[0043] Examples 1-8 and Comparative Examples 1-4 Examples 1-8 and Comparative Examples 1-4 each provide a thermosetting silicone-modified adhesive. The components and amounts of the raw materials are shown in Table 1 below. In Table 1, the amount of each component is in "parts by weight". Table 1 The preparation method of the thermosetting silicone modified adhesives provided in Examples 1-8 and Comparative Examples 1-4 includes: mixing each component at 25°C for 180 min according to the dosage ratio in Table 1 to obtain the thermosetting silicone modified adhesive.

[0044] Comparative Example 5 A thermosetting silicone-modified adhesive, the preparation method of which includes the following steps: Weigh 40 g of vinyl-terminated silicone oil, 30 g of hydrogen-containing silicone oil, and 5 g of γ-aminopropyltriethoxysilane into a beaker. Stir the mixture at 300 rpm at room temperature until homogeneous. Evacuate the mixture to -0.1 MPa and maintain the vacuum for 60 min to eliminate bubbles, thus obtaining component A for later use. Weigh 60 g of vinyl-terminated silicone oil, 10 g of flexible epoxy resin, 5 g of platinum catalyst, 3 g of accelerator, and 2 g of inhibitor into a beaker. Stir the mixture at 300 rpm at room temperature until homogeneous. Evacuate the mixture to -0.1 MPa and maintain the vacuum for 60 min to eliminate bubbles, thus obtaining component B for later use. Mix component A and component B at a mass ratio of 1:1 to prepare the adhesive.

[0045] Performance testing: (1) Film appearance: The adhesive was coated on the silicon wafer substrate, cured at 130°C for 5 min, and then cured at 190°C for 120 min to form a 50 μm thick adhesive film layer on one side of the silicon wafer substrate. The adhesive film was observed under a microscope and the film surface condition was recorded.

[0046] (2) Tensile breaking strength and tensile breaking elongation: The adhesive was coated on the PTFE film, cured at 130℃ for 5 min, and then cured at 190℃ for 120 min to form a film layer with a thickness of 100 μm. The film was peeled off, the sample was cut, and the tensile breaking strength and tensile breaking elongation were tested using a universal testing machine.

[0047] (3) Dynamic mechanical properties: The adhesive was coated on the PTFE film, cured at 130℃ for 5 min, and then cured at 190℃ for 120 min to form a film layer with a thickness of 100 μm. The film was peeled off, and a sample was cut to perform DMA testing. The modulus and Tg were recorded.

[0048] (4) Heat resistance: The adhesive was coated on the silicon wafer substrate and cured at 130°C for 5 min, and then cured at 190°C for 120 min to form a 50 μm thick adhesive film layer on one side of the silicon wafer substrate. The adhesive film was scraped off and subjected to TGA test, and the 5% weight loss temperature was recorded.

[0049] (5) Storage stability: Store at room temperature and observe regularly to see if the adhesive solution is uniform.

[0050] The thermosetting silicone-modified adhesives provided in Examples 1-8 and Comparative Examples 1-5 were tested according to the above test methods. The test results are shown in Table 2. Table 2 According to the data in Table 2: The thermosetting silicone-modified adhesives provided in Examples 1-8 possess excellent mechanical properties, storage stability, long-term weather resistance, heat resistance, and a clear film appearance. In particular, the silicone-modified adhesives provided in Examples 1-5 have a tensile breaking strength of up to 9-15 MPa, a tensile breaking elongation of 21-45%, a modulus of 202-304 MPa, a Tg of 148-158℃, and a 5% thermogravimetric temperature of 378-403℃ in the heat resistance test.

[0051] Compared with Example 1, although the thermosetting silicone-modified adhesive provided in Comparative Example 1 meets the requirements in terms of physicochemical properties, the preparation process of the silicone-modified epoxy resin D1 used in it is relatively complicated and cumbersome, which is not conducive to industrial mass production and use.

[0052] Compared with Example 1, the amount of epoxy reinforcing agent added in the thermosetting silicone modified adhesive provided in Comparative Example 2 was too low, resulting in poor tensile strength, modulus and heat resistance; while the amount of epoxy reinforcing agent added in the thermosetting silicone modified adhesive provided in Comparative Example 3 was too high, resulting in reduced tensile elongation at break and poor flexibility.

[0053] Compared with Example 1, the thermosetting silicone-modified adhesive provided in Comparative Example 4 had very poor storage stability due to the lack of added solubilizer, and fogging occurred after one month.

[0054] Compared with Example 1, Comparative Example 5 uses physical blending to prepare the adhesive, which results in a hazy film appearance and poor storage stability, with delamination occurring after 2-3 weeks of storage.

[0055] The above description is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Those skilled in the art should understand that any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention fall within the protection and disclosure scope of the present invention.

Claims

1. A thermally curable silicone-modified adhesive, characterized by, The raw materials of the thermosetting silicone-modified adhesive include the following components in parts by weight: 100 parts by weight of silicone-modified epoxy resin; Epoxy reinforcing agent 20-60 parts by weight; Solubilizer: 0.5-2 parts by weight; Curing accelerator: 0.2-2 parts by weight; 5-20 parts by weight of curing agent; The organosilicon-modified epoxy resin is obtained by reacting epoxy monomers and hydrogen-containing silicone oil under catalytic conditions.

2. The thermally curable silicone-modified adhesive according to claim 1, characterized in that The epoxy monomer includes any one or a combination of at least two of 4-vinylcyclohexene dioxide, allyl glycidyl ether, or glycidyl methacrylate. Preferably, the hydrogen-containing silicone oil includes phenyl-containing hydrogen-containing silicone oil and phenyl-free hydrogen-containing silicone oil; Preferably, the catalyst comprises any one or a combination of at least two of the following: a cassiterite catalyst, a Pt-cyclovinylmethylsiloxane, or a chloroplatinic acid-olefin complex; Preferably, the mass ratio of the epoxy monomer to the hydrogen-containing silicone oil is 1:(1~3); Preferably, the mass percentage of platinum in the catalyst is 5-20 ppm of the reaction system; Preferably, the reaction temperature is 60~100℃ and the time is 6~12 h; Preferably, the reaction is carried out in solvent A; Preferably, solvent A includes any one or a combination of at least two of toluene, xylene, cyclopentanone, or methyl isobutyl ketone.

3. The thermally curable silicone-modified adhesive according to claim 1 or 2, characterized in that, The mass ratio of epoxy segments to silicone segments in the silicone-modified epoxy resin is (16~20):(30~50).

4. The thermally curable silicone-modified adhesive according to any one of claims 1 to 3, characterized in that The epoxy reinforcing agent comprises any one or a combination of at least two of the following: triglycidyl ether p-aminophenol, diglycidyl dimethyl biphenyl, diglycidyl-4,5-epoxycyclohexane-1,2-dicarboxylate, bisphenol A epoxy resin, or tetrafunctional epoxy resin, preferably any one or a combination of at least two of the following: triglycidyl ether p-aminophenol, diglycidyl dimethyl biphenyl, diglycidyl-4,5-epoxycyclohexane-1,2-dicarboxylate, or tetrafunctional epoxy resin.

5. The thermally curable silicone-modified adhesive according to any one of claims 1 to 4, characterized in that The solubilizer includes any one or a combination of at least two of the following: polyether-modified polysiloxane, epoxy silane coupling agent, or organosilicon-polyether copolymer.

6. The thermally curable silicone-modified adhesive according to any one of claims 1 to 5, characterized in that The curing accelerator includes imidazole curing accelerators and / or tertiary amine curing accelerators; Preferably, the curing agent comprises any one or a combination of at least two of pyrogallol A, 4,4'-diaminodiphenyl sulfone, or methylhexahydrophthalic anhydride.

7. The heat-curable silicone-modified adhesive according to any one of claims 1 to 6, characterized by, The raw materials for the thermosetting silicone-modified adhesive also include solvent B; Preferably, the amount of solvent B in the raw materials of the thermosetting silicone-modified adhesive is 100-500 parts by weight. Preferably, solvent B comprises any one or a combination of at least two of toluene, xylene, cyclopentanone, or methyl isobutyl ketone.

8. A method for producing the thermally curable silicone-modified adhesive according to any one of claims 1 to 7, characterized by, The preparation method includes: mixing silicone-modified epoxy resin, epoxy reinforcing agent, solubilizer, curing accelerator and curing agent in solvent B to obtain the thermosetting silicone-modified adhesive.

9. The production method according to claim 8, characterized by, The mixing temperature is 20~30℃, and the time is 3~6 h.

10. The application of a curable silicone-modified adhesive as described in any one of claims 1 to 7 in wafer processing.

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