Method for manufacturing micro display and micro display

Abstract

This invention discloses a method for manufacturing a microdisplay, comprising the steps of: S1, preparing a display module; S2, forming a baffle wall on one side of the display module; S3, forming a liquid crystal layer within the baffle wall; and S4, forming a cover plate on the side of the baffle wall away from the display module, the cover plate having multiple ring-shaped conductive films, and the liquid crystal layer located between the display module and the cover plate. This method for manufacturing a microdisplay can improve the light collimation of the microdisplay screen, increase the light output from the front of the microdisplay screen, and simplify the optomechanical lens assembly of the microdisplay screen and waveguide lens, thus reducing the size and weight of the assembly. This invention also discloses a microdisplay.

Description

Technical Field

[0001] This invention belongs to the field of microdisplay technology. Specifically, this invention relates to a method for manufacturing a microdisplay and a microdisplay. Background Technology

[0002] With the gradual technological updates and popularization of AI (Artificial Intelligence), AR+AI (Augmented Reality + Artificial Intelligence) smart glasses are expected to become the next-generation computing platform comparable to mobile phones. The reasons are: 1) In terms of product form, compared to other AI products (VR, MR, AI, etc.), glasses have a long history, and AR smart glasses have a lower cost of wearing; 2) In terms of information acquisition, AR smart glasses are close to the human body, enabling interaction and information acquisition anytime, anywhere. AR glasses also have a unique perspective advantage, allowing for real-time analysis and feedback of the scene seen by the wearer; 3) In terms of user experience, unlike traditional products such as mobile phones and PCs, AR smart glasses can overcome the limitations of physical size through technologies such as virtual imaging, providing wearers with a wider visual experience.

[0003] For AR+AI (Augmented Reality + Artificial Intelligence) smart glasses, wearers use them daily, so they must meet characteristics such as lightweight, low power consumption, and small size. Focusing on these requirements, the components of AR+AI smart glasses, such as the micro-display screen and the optical engine lens, need to be optimized in terms of size reduction, weight reduction, power consumption reduction, and brightness improvement. The micro-display screen provides images and video information, while the optical engine lens connects the screen to the waveguide lens; therefore, both are indispensable components of the entire AR+AI smart glasses system.

[0004] The micro-displays on current AR+AI (Augmented Reality + Artificial Intelligence) smart glasses emit relatively diffuse light, resulting in relatively low brightness in the forward direction. Considering the overall light efficiency of the glasses, increasing the brightness entering the eye requires higher brightness emanating from the micro-display, which in turn increases overall power consumption. Furthermore, the optical-mechanical lens that shapes the light beam into collimated light requires multiple convex and concave lenses and prisms, making the lens complex, large, and heavy. This contradicts the requirements of AR+AI smart glasses: lightweight, low power consumption, and small size.

[0005] The aim is to provide an improved method for fabricating an OLED / LED / fast-LCD display device structure and the OLED / LED / fast-LCD display device structure, particularly regarding how to improve the light output collimation of a microdisplay screen. Summary of the Invention

[0006] The present invention aims to at least solve one of the technical problems existing in the prior art. To this end, the present invention provides a method for manufacturing a microdisplay, the purpose of which is to improve the light collimation of the microdisplay screen.

[0007] To achieve the above objectives, the technical solution adopted by the present invention is: a method for manufacturing a microdisplay, comprising the following steps:

[0008] S1. Prepare the display module;

[0009] S2. A retaining wall is formed on one side of the display module;

[0010] S3. A liquid crystal layer is formed inside the retaining wall;

[0011] S4. A cover plate is formed on the side of the retaining wall away from the display module. The cover plate has multiple ring-shaped conductive films, and the liquid crystal layer is located between the display module and the cover plate.

[0012] The display module is OLED / LED / LCD, etc.

[0013] In step S2, the barrier is located at the edge of the display module, with a width of 0.4 to 1 mm and a height of 50 to 100 μm.

[0014] In step S3, the thickness of the liquid crystal layer is 40-80 μm.

[0015] In step S4, the multi-ring conductive film is arranged in an inner and outer nested manner on the cover plate.

[0016] This invention also provides another method for manufacturing a microdisplay, comprising the following steps:

[0017] S1. Provide a substrate and a display screen;

[0018] S2. A transparent conductive film is formed on one side of the substrate;

[0019] S3. A barrier is formed on the side of the transparent conductive film away from the substrate;

[0020] S4. A liquid crystal layer is formed inside the retaining wall;

[0021] S5. The transparent conductive film is fabricated into a multi-ringed conductive film;

[0022] S6. A cover plate is formed on the side of the retaining wall away from the display module, and the liquid crystal layer is located between the display module and the cover plate to form a liquid crystal module;

[0023] S7. Assemble the liquid crystal module with the display screen.

[0024] The display screen is a microOLED or microLED type screen.

[0025] In step S3, the barrier is located at the edge of the transparent conductive film, with a width of 0.4 to 1 mm and a height of 50 to 100 μm.

[0026] In step S4, the thickness of the liquid crystal layer is 40-80 μm.

[0027] In step S5, the multi-ring conductive film is arranged in an inner and outer nested configuration.

[0028] The present invention also provides a microdisplay, which is manufactured using the microdisplay manufacturing method described above.

[0029] The method for manufacturing a microdisplay of the present invention can improve the collimation of light output from the microdisplay screen, increase the amount of light emitted from the front of the microdisplay screen, and simplify the optomechanical lens assembly of the microdisplay screen and waveguide lens, thereby reducing the size and weight of the assembly. Attached Figure Description

[0030] This manual includes the following figures, which illustrate the following:

[0031] Figures 1 to 7 This is a schematic diagram of the fabrication process of the microdisplay in Embodiment 1;

[0032] Figures 8 to 15 This is a schematic diagram of the fabrication process of the microdisplay in Embodiment 2;

[0033] Figure 16 This is a schematic diagram of the refractive index anisotropy of liquid crystal molecules;

[0034] Figure 17 This is a schematic diagram of the arrangement of liquid crystal molecules before and after applying a gradient electric field;

[0035] Figure 18 This is a schematic diagram showing the light emission of liquid crystal molecules distributed in a regular pattern without additives.

[0036] The diagram is marked as follows:

[0037] 1. Substrate; 2. Anode; 3. Light-emitting layer; 4. Cathode; 5. Encapsulation layer; 6. Barrier; 7. Annular conductive film; 8. Cover plate; 9. Transparent conductive film. Detailed Implementation

[0038] The specific embodiments of the present invention will be further described in detail below with reference to the accompanying drawings, in order to help those skilled in the art to have a more complete, accurate and in-depth understanding of the concept and technical solutions of the present invention, and to facilitate its implementation.

[0039] Example 1

[0040] like Figures 1 to 7 As shown, this embodiment provides a method for manufacturing a microdisplay, including the following steps:

[0041] S1. Prepare the display module;

[0042] S2. A retaining wall is formed on one side of the display module;

[0043] S3. A liquid crystal layer is formed inside the retaining wall;

[0044] S4. A cover plate is formed on the side of the barrier away from the display module. The cover plate has multiple ring-shaped conductive films, and the liquid crystal layer is located between the display module and the cover plate.

[0045] Specifically, in order to overcome the technical problems of relatively diffused light emitted from the micro-display of AR+AI (Augmented Reality + Artificial Intelligence) smart glasses in the prior art, such as high screen power consumption, complex structure of optical and mechanical lenses, large size and heavy weight, this embodiment provides a method for manufacturing a micro-display to solve the technical problem of diffused light emitted from the micro-display screen.

[0046] The technical solution adopted in this embodiment is as follows: After the microdisplay process is completed, a liquid crystal layer is fabricated on its upper part, and then a cover plate containing electrodes with a certain regularity is attached; by utilizing the characteristics of electrical anisotropy and refractive index anisotropy of liquid crystal molecules, and with the help of the regularly distributed electrode electric field, the liquid crystal molecules of the liquid crystal layer are distributed in a certain regularity, so as to achieve a gradient distribution of refractive index of the liquid crystal layer from the center of the screen to the edge of the screen; by utilizing the propagation principle of light in materials with different refractive indices, the light rays exiting the cover plate are finally collimated; this regular liquid crystal layer also enables light that does not have large-angle total internal reflection to be emitted from the entire surface.

[0047] Compared with the prior art, the beneficial effects of this embodiment are: collimation of light output from the micro-display, increased front light output, and simplified optomechanical lens assembly of the micro-display and waveguide lens, reducing the size and weight of the assembly.

[0048] In step S1 above, the display module is an OLED. The OLED display module is fabricated using semiconductor coating, exposure, and development processes, as well as OLED device evaporation and thin-film encapsulation processes. The display module is as follows: Figure 1 As shown.

[0049] In step S2 above, a barrier is fabricated using semiconductor coating, exposure, and development processes. For example... Figure 2 As shown, the barrier is located at the edge of the display module, with a width of 0.4 to 1 mm and a height of 50 to 100 μm.

[0050] In step S3 above, such as Figure 3 As shown, a mixed liquid, comprising liquid crystal and solution, is filled into the retaining wall using processes such as spraying to form a liquid crystal layer located within the cavity of the retaining wall. The thickness of the liquid crystal layer is 40–80 μm.

[0051] In step S4 above, a transparent conductive film is fabricated on the cover plate using a sputtering process, and semiconductor coating, exposure, and development processes are used to prepare the transparent conductive film into ring-shaped conductive films of different widths. For example... Figure 4 As shown, the annular conductive film is ring-shaped, with multiple rings nested on the cover plate. Each annular conductive film consists of two parallel long sides and two parallel short sides, with the two ends of the two long sides connected to the two short sides, forming a closed ring. The outermost annular conductive film has the largest width, as does the innermost annular conductive film. The width directions of all annular conductive films are parallel, and the width of all annular conductive films increases sequentially from the inside out. There is a certain distance between adjacent annular conductive films.

[0052] In step S4 above, as Figure 5 As shown, using high-precision bonding technology, the cover plate with the prepared annular conductive film is bonded to the barrier wall on the screen filled with liquid crystal prepared in step S3. The cover plate is fixedly installed on the barrier wall, and the liquid crystal layer is located between the display module and the cover plate to form a micro display.

[0053] Based on step S5, power is supplied to the display module, and a high potential is applied to the cover plate with the annular conductive film. An electric field is formed between the cathode of the display module and the cover plate. Due to the different widths of the annular conductive film, the electric field strength also varies. Due to their inherent properties, the liquid crystal molecules deflect under the electric field. When the light emitted from the display module passes through the liquid crystal layer, the horizontal liquid crystal molecules exhibit a gradient distribution due to the gradient electric field strength. Following the refractive index formula, the light ultimately exits the screen in parallel. The electric field distribution and liquid crystal deflection are as follows: Figure 6 As shown, the light emission pattern is as follows: Figure 7 As shown.

[0054] The present invention also provides a microdisplay, which is manufactured using the microdisplay manufacturing method of the above embodiment one.

[0055] Example 2

[0056] like Figures 8 to 15As shown in the figure, this embodiment of the present invention also provides a method for manufacturing a microdisplay, including the following steps:

[0057] S1. Provide a substrate and a display screen;

[0058] S2. A transparent conductive film is formed on one side of the substrate;

[0059] S3. A barrier is formed on the side of the transparent conductive film away from the substrate;

[0060] S4. A liquid crystal layer is formed inside the retaining wall;

[0061] S5. Fabricate the transparent conductive film into a multi-ring conductive film;

[0062] S6. A cover plate is formed on the side of the retaining wall away from the display module, and the liquid crystal layer is located between the display module and the cover plate to form a liquid crystal module;

[0063] S7. Assemble the LCD module and the display screen.

[0064] In step S1 above, the provided display screen can be a microOLED or microLED type screen.

[0065] In step S2 above, as Figure 8 As shown, a transparent conductive film is fabricated on a substrate using a sputtering process. The transparent conductive film can be a metal oxide such as indium tin oxide (IZO) or indium zinc oxide (IZO).

[0066] In step S3 above, a barrier is fabricated using semiconductor coating, exposure, and development processes. For example... Figure 9 As shown, a transparent conductive film is located between the barrier and the substrate. The barrier is located at the edge of the transparent conductive film. The width of the barrier is 0.4 to 1 mm, and the height of the barrier is 50 to 100 μm.

[0067] In step S4 above, as Figure 10 As shown, a mixed liquid, comprising liquid crystal and a solution, is filled into the retaining wall using processes such as spraying to form a liquid crystal layer located within the cavity of the retaining wall. The thickness of the liquid crystal layer is 40–80 μm. After filling with the liquid crystal, a liquid crystal cell is formed.

[0068] In step S5 above, semiconductor coating, exposure, and development processes are used to fabricate a transparent conductive film into a multi-ring conductive film of different widths. For example... Figure 11As shown, the annular conductive film is ring-shaped, with multiple rings arranged in a nested configuration. Each annular conductive film consists of two parallel long sides and two parallel short sides, with the two ends of the two long sides connected to the two short sides, forming a closed ring. The outermost annular conductive film has the largest width, as does the innermost annular conductive film. The width directions of all annular conductive films are parallel, and the width of all annular conductive films increases sequentially from the inside out. There is a certain distance between adjacent annular conductive films.

[0069] In step S6 above, such as Figure 12 As shown, using high-precision bonding technology, the cover plate is bonded to the baffle wall on the liquid crystal cell prepared in step S4. The cover plate is fixedly installed on the baffle wall to form a liquid crystal module, with the liquid crystal layer located between the transparent conductive film and the cover plate.

[0070] In step S7 above, as Figure 13 As shown, high-precision bonding technology is used to bond the liquid crystal module to the display screen, and the substrate of the liquid crystal module is fixedly mounted on the display screen to form a micro-display.

[0071] Based on step S7, power is applied to both ends of the liquid crystal module completed in step S6, forming an electric field between the substrate and cover plate of the liquid crystal module. Due to the regularity of the width gradient of the annular conductive film, the electric field intensity also has a regular distribution. Due to its inherent properties, the liquid crystal molecules deflect under the electric field. When light from the display screen passes through the liquid crystal layer, the deflection of the liquid crystal molecules in the horizontal direction exhibits a gradient distribution under the regular electric field intensity. The emitted light is subject to the refractive index formula, and finally, when it exits the screen, the light is emitted parallel to each other. The electric field distribution and liquid crystal deflection are as follows. Figure 14 As shown, the light emission pattern is as follows: Figure 15 As shown.

[0072] The present invention also provides a microdisplay, which is manufactured using the microdisplay manufacturing method of Embodiment 2 described above.

[0073] The present invention has been described above by way of example with reference to the accompanying drawings. Obviously, the specific implementation of the present invention is not limited to the above-described manner. Any non-substantial improvements made using the inventive concept and technical solution; or the direct application of the inventive concept and technical solution to other situations without modification, are all within the protection scope of the present invention.

Claims

1. A method for manufacturing a microdisplay, characterized in that, Including the following steps: S1. Prepare the display module; S2. A retaining wall is formed on one side of the display module; S3. A liquid crystal layer is formed inside the retaining wall; S4. A cover plate is formed on the side of the retaining wall away from the display module. The cover plate has multiple ring-shaped conductive films, and the liquid crystal layer is located between the display module and the cover plate.

2. The method for manufacturing a microdisplay according to claim 1, characterized in that, The display module is OLED, LED, or LCD.

3. The method for manufacturing a microdisplay according to claim 1, characterized in that, In step S2, the barrier is located at the edge of the display module, with a width of 0.4 to 1 mm and a height of 50 to 100 μm.

4. The method for manufacturing a microdisplay according to any one of claims 1 to 3, characterized in that, In step S3, the thickness of the liquid crystal layer is 40-80 μm.

5. The method for manufacturing a microdisplay according to any one of claims 1 to 3, characterized in that, In step S4, the multi-ring conductive film is arranged in an inner and outer nested manner on the cover plate.

6. A microdisplay, characterized in that, The microdisplay is manufactured using the method for manufacturing a microdisplay according to any one of claims 1 to 5.

7. A method for manufacturing a microdisplay, characterized in that, Including the following steps: S1. Provide a substrate and a display screen; S2. A transparent conductive film is formed on one side of the substrate; S3. A barrier is formed on the side of the transparent conductive film away from the substrate; S4. A liquid crystal layer is formed inside the retaining wall; S5. The transparent conductive film is fabricated into a multi-ringed conductive film; S6. A cover plate is formed on the side of the retaining wall away from the display module, and the liquid crystal layer is located between the display module and the cover plate to form a liquid crystal module; S7. Assemble the liquid crystal module with the display screen.

8. The method for manufacturing a microdisplay according to claim 7, characterized in that, The display screen is a microOLED or microLED type screen.

9. The method for manufacturing a microdisplay according to claim 7, characterized in that, In step S3, the barrier is located at the edge of the transparent conductive film, with a width of 0.4 to 1 mm and a height of 50 to 100 μm.

10. The method for manufacturing a microdisplay according to any one of claims 7 to 9, characterized in that, In step S4, the thickness of the liquid crystal layer is 40-80 μm.

11. The method for manufacturing a microdisplay according to any one of claims 7 to 9, characterized in that, In step S5, the multi-ring conductive film is arranged in an inner and outer nested configuration.

12. A microdisplay, characterized in that, The microdisplay is manufactured using the method for manufacturing a microdisplay according to any one of claims 7 to 11.

Images