Coil assembly

Abstract

This disclosure provides a coil assembly comprising: a body; a plurality of through holes passing through the body; a plurality of pads disposed on a surface of the body, the plurality of pads being respectively connected to the plurality of through holes; a covering insulating layer covering a surface of the plurality of pads; an external electrode disposed on a surface of the covering insulating layer; and a via electrode passing through the covering insulating layer, the via electrode connecting the external electrode and the plurality of pads to each other.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2024-0197279, filed on December 26, 2024, with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] This disclosure relates to a coil assembly. Background Technology

[0003] An inductor (a type of coil assembly) can be a representative passive electronic component used in electronic devices along with resistors and capacitors.

[0004] As electronic devices are designed to have higher performance and smaller size, the number of electronic components used in electronic devices has increased and they have been miniaturized.

[0005] Coil assemblies have also been required to have reduced dimensions, and reducing the thickness of coil assemblies is likely to be a significant technical challenge. Furthermore, coil assemblies have been required to ensure design freedom to accommodate a wide range of applications. Summary of the Invention

[0006] One aspect of this disclosure is to provide a coil assembly with reduced thickness.

[0007] Another aspect of this disclosure is to provide a coil assembly with a high degree of design freedom, such as coil arrangement and connection.

[0008] According to one aspect of this disclosure, a coil assembly is provided, the coil assembly comprising: a body; a plurality of through holes passing through the body; a plurality of pads disposed on a surface of the body, the plurality of pads being respectively connected to the plurality of through holes; a covering insulating layer covering a surface of the plurality of pads; an external electrode disposed on a surface of the covering insulating layer; and a via electrode passing through the covering insulating layer, the via electrode connecting the external electrode and the plurality of pads to each other.

[0009] According to exemplary embodiments of this disclosure, the coil assembly may have a reduced thickness.

[0010] According to exemplary embodiments of this disclosure, coil assemblies may have improved design freedom. Attached Figure Description

[0011] The above and other aspects, features and advantages of this disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which: Figure 1 This is a perspective view of a coil assembly according to an exemplary embodiment of the present disclosure; Figure 2 yes Figure 1 A three-dimensional view of the internal components of the coil assembly; Figure 3 yes Figure 1 The diagram shows a top view of a coil assembly, which contains a portion of the structure. Figure 4 It is along Figure 3 A cross-sectional view taken from line I-I'; Figure 5A , Figure 5B , Figure 5C and Figure 5D This is a diagram illustrating various connection examples with multiple through holes; Figure 6A , Figure 6B and Figure 6C This is a diagram of a coil assembly according to a variation of this disclosure; Figure 7A , Figure 7B and Figure 7C This is a diagram of a coil assembly according to another variation of this disclosure; Figure 8A , Figure 8B and Figure 8C This is a diagram of a coil assembly according to another variation of this disclosure; and Figure 9A , Figure 9B , Figure 9C , Figure 9D , Figure 9E , Figure 9F , Figure 9G , Figure 9H and Figure 9I This is a diagram illustrating the manufacturing process of the coil assembly according to this disclosure. Detailed Implementation

[0012] The terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to limit the exemplary embodiments. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. As used herein, the term "and / or" includes any one of the associated listed items and any combination of any two or more. It will be further understood that the terms "comprising" and / or "including" mean the presence of the stated features, quantities, steps, operations, elements, components, or combinations thereof, but do not exclude the presence or addition of one or more other features, quantities, steps, operations, elements, components, or combinations thereof. Additionally, the terms "set on," "located on," etc., may mean that an element is located on or below the target portion and do not necessarily mean that the element is located on the upper side of the target portion relative to the direction of gravity.

[0013] Additionally, as used herein, terms including ordinal numbers such as “first” and “second” may be used to describe various elements, but elements are not limited by these terms. These terms are only used to distinguish one element from another.

[0014] Furthermore, when a portion such as a layer or membrane is described as being "on" or "above" another portion, this includes not only the case where the portion is directly on the other portion, but also the case where other portions are located between them. In contrast, when a portion is described as being "directly" on another portion, it means that no other portions are located between them. Additionally, when a portion is described as being "on" or "above" a reference portion, this includes the case where the portion is located above or below the reference portion, and does not necessarily mean that the portion is located "on" or "above" the reference portion in a direction opposite to the direction of gravity.

[0015] The terms “integrated into” and “connected to” can refer not only to elements that are in direct and physical contact with each other, but also to a structure in which another element is located between the elements such that the elements are also in contact with the other element.

[0016] Throughout the specification, the term "connection" may mean not only that two or more elements are directly connected to each other, but also that two or more elements are indirectly connected to each other, physically connected to each other, electrically connected to each other through another element, or that two or more elements are integrated with each other although they are named differently according to their location or function.

[0017] The accompanying drawings are provided merely to facilitate understanding of the exemplary embodiments disclosed herein. The technical spirit of the disclosure herein should not be construed as being limited to the drawings. It should be understood that this disclosure covers all modifications, equivalents, and alternatives falling within the spirit and scope of this disclosure. For ease of description, dimensions (e.g., thickness) of elements are arbitrarily shown in the drawings, and this disclosure is not limited to the dimensions shown.

[0018] In the accompanying drawings, the X direction can be defined as a first direction or the thickness direction, the Y direction can be defined as a second direction or the length direction, and the Z direction can be defined as a third direction or the width direction.

[0019] In the following description, a coil assembly according to an exemplary embodiment of the present disclosure will be described in detail with reference to the accompanying drawings. In the description with reference to the drawings, the same or corresponding elements are indicated by the same reference numerals, and repeated descriptions thereof will be omitted.

[0020] Various types of electronic components can be used in electronic devices, and various types of coil components can be appropriately used among such electronic components to remove noise.

[0021] In other words, in electronic devices, coil assemblies can be used as power inductors, high-frequency (HF) inductors, ordinary ferrite beads, high-frequency ferrite beads (e.g., ferrite beads suitable for the GHz band), common-mode filters, etc.

[0022] Figure 1 This is a perspective view of a coil assembly according to an exemplary embodiment of the present disclosure. Figure 2 yes Figure 1 A three-dimensional view of the internal components of the coil assembly. Figure 2 Some lines have been omitted to clearly show the internal structure. Figure 3 yes Figure 1 The diagram shows a top view of a coil assembly, which is part of the structure. Figure 4 It is along Figure 3 The cross-sectional view taken from line I-I'.

[0023] Reference Figures 1 to 4 According to an example embodiment of the present disclosure, the coil assembly 1000 may include a body 100, a plurality of through holes 200, a plurality of pads 320, a covering insulating layer 410, through-hole electrodes 450, and an external electrode 500, and may also include an insulating film IF (see [link to original document]). Figure 5A ), main insulation layer 310 and outer insulation layer 600.

[0024] The body 100 may form the shape of the coil assembly 1000 according to this example embodiment, and a plurality of through holes 200 may be provided in the body.

[0025] based on Figures 1 to 4 In the direction of the orientation, the main body 100 may have a first surface 101 and a second surface 102 opposite to each other in a first direction (X direction), a third surface 103 and a fourth surface 104 opposite to each other in a second direction (Y direction), and a fifth surface 105 and a sixth surface 106 opposite to each other in a third direction (Z direction). The third surface 103, the fourth surface 104, the fifth surface 105, and the sixth surface 106 of the main body 100 may be side surfaces of the main body 100 that connect the first surface 101 and the second surface 102 of the main body 100 to each other. In the following, the first surface 101 of the main body 100 may refer to the lower surface of the main body, but this disclosure is not limited thereto.

[0026] The body 100 may include a magnetic material and a resin. Specifically, the body 100 may be formed by laminating one or more magnetic composite sheets in which magnetic materials are dispersed in a resin. However, the body 100 may have a structure other than that in which magnetic materials are dispersed in a resin. For example, the body 100 may be formed using a magnetic material such as ferrite, or it may be formed using a non-magnetic material.

[0027] Magnetic materials can be ferrite particles or magnetic metal particles.

[0028] Ferrites can be at least one of the following: spinel-type ferrites (such as Mg-Zn-based ferrites, Mn-Zn-based ferrites, Mn-Mg-based ferrites, Cu-Zn-based ferrites, Mg-Mn-Sr-based ferrites, Ni-Zn-based ferrites, etc.), hexagonal ferrites (such as Ba-Zn-based ferrites, Ba-Mg-based ferrites, Ba-Ni-based ferrites, Ba-Co-based ferrites, Ba-Ni-Co-based ferrites, etc.), garnet-type ferrites (such as Y-based ferrites, etc.), and Li-based ferrites.

[0029] Magnetic metal particles may include one or more selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu), and nickel (Ni). For example, magnetic metal particles may be at least one of pure iron particles, Fe-Si based alloy particles, Fe-Si-Al based alloy particles, Fe-Ni based alloy particles, Fe-Ni-Mo based alloy particles, Fe-Ni-Mo-Cu based alloy particles, Fe-Co based alloy particles, Fe-Ni-Co based alloy particles, Fe-Cr based alloy particles, Fe-Cr-Si based alloy particles, Fe-Si-Cu-Nb based alloy particles, Fe-Ni-Cr based alloy particles, and Fe-Cr-Al based alloy particles.

[0030] The magnetic metal particles can be amorphous or crystalline. For example, the magnetic metal particles can be Fe-Si-B-Cr based amorphous alloy particles, but this disclosure is not limited to this.

[0031] Each of the ferrite particles and magnetic metal particles may have an average diameter of about 0.1 μm to about 30 μm, but this disclosure is not limited thereto.

[0032] The body 100 may include two or more types of magnetic materials dispersed in the resin. Here, different types of magnetic materials mean that the magnetic materials dispersed in the resin are distinguishable from each other in at least one aspect of average diameter, composition, crystallinity, and shape.

[0033] The resin may include, alone or in combination, epoxy resin, polyimide, liquid crystal polymer, etc., but this disclosure is not limited thereto.

[0034] The thickness of the body 100 in the first direction (X direction) may be less than 500 μm, preferably from 50 μm to 300 μm. The coil assembly according to this example embodiment may use a magnetic sheet having a thickness of tens of micrometers (μm) to form the body. In this case, a coil assembly with desired dimensions and characteristics can be achieved by adjusting the stack thickness.

[0035] Multiple through holes 200 allow passage through the main body 100. (See reference) Figure 4 Multiple through holes 200 can extend to the first surface 101 and the second surface 102 of the body 100 and can completely pass through the body 100.

[0036] The coil assembly 1000 according to this example embodiment can utilize multiple through-holes 200 to realize the coil of the coil assembly. Each through-hole can be formed by forming a through-hole in the body 100 and then filling the interior of the through-hole with a conductive material to form a unit coil. The through-holes can be electrically connected to each other via multiple pads 320 described below, and can be used as a single coil.

[0037] Reference Figure 2 and Figure 3 The plurality of through holes 200 may include a first through hole 210, a second through hole 220, a third through hole 230, a fourth through hole 240, a fifth through hole 250, a sixth through hole 260, a seventh through hole 270, and an eighth through hole 280. For ease of description, the plurality of through holes 200 are referred to as the first through hole 210, the second through hole 220, the third through hole 230, the fourth through hole 240, the fifth through hole 250, the sixth through hole 260, the seventh through hole 270, and the eighth through hole 280 in the order in which the plurality of through holes 200 are connected to the first external electrode 510 described below. However, such a configuration is merely an example, and coil assemblies including at least two through holes are included in the exemplary embodiments of this disclosure.

[0038] Multiple through holes 200 may be spaced apart from each other in a second direction (Y direction) and / or a third direction (Z direction). (See reference...) Figure 3 The first through hole 210 may be spaced apart from the fourth through hole 240, the fifth through hole 250 and the eighth through hole 280 in the second direction (Y direction). The first through hole 210 may be spaced apart from the second through hole 220 in the third direction (Z direction).

[0039] Multiple through-holes 200 can be formed by forming through-holes in the body 100 and filling the through-holes with a conductive material. For example, the conductive material may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof, and preferably includes copper (Cu), but this disclosure is not limited thereto. Each of the multiple through-holes 200 may include an electroless plating layer (e.g., a chemically plated copper layer) and an electroplated layer (e.g., an electrolytically plated copper layer), but this disclosure is not limited thereto. A sputtered layer may be formed instead of an electroless plating layer, or both may be included.

[0040] Multiple pads 320 may be disposed on the surface of the body 100, for example, on one or both surfaces of the body 100, and may be respectively connected to multiple through holes 200. At least a portion of the multiple pads 320 may be disposed in the body insulating layer 310, which will be described below. The multiple pads 320 may pass through at least a portion of the body insulating layer 310 and may be respectively connected to multiple through holes 200.

[0041] The pads can be formed to correspond to a plurality of through holes 200. Specifically, the plurality of pads 320 may include a first pad 321, a second pad 322, a third pad 323, a fourth pad 324, a fifth pad 325, a sixth pad 326, a seventh pad 327, and an eighth pad 328, and the first through hole 210, the second through hole 220, the third through hole 230, the fourth through hole 240, the fifth through hole 250, the sixth through hole 260, the seventh through hole 270, and the eighth through hole 280 may be connected to the first pad 321, the second pad 322, the third pad 323, the fourth pad 324, the fifth pad 325, the sixth pad 326, the seventh pad 327, and the eighth pad 328, respectively.

[0042] Each of the first pad 321, the second pad 322, the third pad 323, the fourth pad 324, the fifth pad 325, the sixth pad 326, the seventh pad 327, and the eighth pad 328 may include a lower pad disposed on the first surface 101 of the body 100 and an upper pad disposed on the second surface 102 of the body 100.

[0043] Multiple pads 320 can electrically connect at least two of the multiple through-holes 200 to each other. That is, multiple pads 320 can be used to electrically connect multiple through-holes 200 to each other. (See reference...) Figure 3The first pad 321 can be connected to the second pad 322 on the upper surface of the body, thus connecting the first through-hole 210 and the second through-hole 220 to each other. The second pad 322 can be connected to the third pad 323 on the lower surface of the body, thus connecting the second through-hole 220 and the third through-hole 230 to each other. The third pad 323 can be connected to the fourth pad 324 on the upper surface of the body, thus connecting the third through-hole 230 and the fourth through-hole 240 to each other. The fourth pad 324 can be connected to the fifth pad 325 on the lower surface of the body, thus connecting the fourth through-hole 240 and the fifth through-hole 250 to each other. The fifth pad 325 can be connected to the sixth pad 326 on the upper surface of the body, thus connecting the fifth through-hole 250 and the sixth through-hole 260 to each other. The sixth pad 326 can be connected to the seventh pad 327 on the lower surface of the body, thus connecting the sixth through-hole 260 and the seventh through-hole 270 to each other. The seventh pad 327 can be connected to the eighth pad 328 on the upper surface of the body, so that the seventh through hole 270 and the eighth through hole 280 can be connected to each other.

[0044] However, Figure 3 and Figure 4 This is just one example of a method of connecting multiple pads 320 to each other, but this disclosure is not limited thereto.

[0045] Multiple pads 320 may be formed using one of the following processes: semi-additive process (SAP), modified semi-additive process (MSAP), tenting process (TT), and subtractive process, but this disclosure is not limited thereto. Each of the multiple pads 320 may include an electroless plating layer (e.g., a chemically plated copper layer) as a seed layer and an electrolytic plating layer (e.g., an electrolytically plated copper layer) as a plating layer, but this disclosure is not limited thereto. A sputtered layer may be formed instead of an electroless plating layer. Copper foil may be further included if desired.

[0046] Figures 5A to 5D This is a diagram illustrating various connection examples involving multiple through holes. Figures 5A to 5D For clarity, the external electrode and via electrode have been omitted.

[0047] For ease of description, Figures 5A to 8C A coil assembly including four through holes 210, 220, 230 and 240 is shown, but this disclosure is not limited thereto.

[0048] Each of the through-holes 210, 220, 230 and 240 of the coil assembly according to this disclosure can be used as a unit coil, and the capacity (e.g., inductance) and other characteristics of the coil assembly can vary depending on the method by which the through-holes 210, 220, 230 and 240 are connected to each other by a plurality of pads 321, 322, 323 and 324.

[0049] Reference Figure 5A Through holes 210, 220, 230, and 240 may not be connected to each other. (Refer to...) Figure 5B The first through hole 210 and the second through hole 220 can be connected in parallel, and the third through hole 230 and the fourth through hole 240 can be connected in parallel. (Refer to...) Figure 5C The first through hole 210 and the second through hole 220 can be connected in parallel, and the third through hole 230 and the fourth through hole 240 can be connected in series. (Refer to...) Figure 5D The first through hole 210 and the second through hole 220 may not be connected to each other, while the third through hole 230 and the fourth through hole 240 may be connected in series.

[0050] As described above, the through-hole 200 can: i) be connected to an adjacent through-hole without using the pad 320, ii) be connected to an adjacent through-hole in parallel using the pad 320, or iii) be connected to an adjacent through-hole in series using the pad 320.

[0051] That is, pad 320i) may not be connected to adjacent pads, ii) may be connected to adjacent pads on both the upper and lower parts of the body, or iii) may be connected to adjacent pads only on one of the upper and lower parts of the body.

[0052] Multiple through holes 200 can be independent of each other and can form individual coils. (See reference) Figure 5A The first through-hole 210 and the second through-hole 220 may not be connected to each other. The first pad 310 and the second pad 320 may not be connected to each other. Additionally, as described below, one of the plurality of through-holes may be connected to the first external electrode and the second external electrode, and another of the plurality of through-holes may be connected to the third external electrode and the fourth external electrode. (Refer to...) Figure 8C The first through hole 210 can be connected to the first external electrode 510 and the second external electrode 520, and the second through hole 220 can be connected to the third external electrode 530 and the fourth external electrode 540.

[0053] Multiple through-holes 200 can be connected in parallel. At least two of the multiple through-holes 200 can be connected to each other via pads 320 located on the upper and lower parts of the body 100. That is, at least two of the multiple through-holes 200 can form a closed loop through the multiple pads. (Refer to...) Figure 5B The first pad 321 and the second pad 322 can be connected to each other on the upper and lower parts of the main body 100. The first through hole 210 and the second through hole 220 can form a closed loop through the first pad 321 and the second pad 322.

[0054] Multiple through holes 200 can be connected in series. At least two of the multiple through holes 200 can be connected to each other via pads 320 located on one of the upper and lower parts of the body 100. (Refer to...) Figure 5C The third pad 323 and the fourth pad 324 may be connected to each other on the upper part of the body 100, and may not be connected to each other on the lower part of the body 100.

[0055] Reference Figure 5A An insulating film IF may be disposed between the plurality of through holes 200 and the body 100. The insulating film IF may be disposed along the inner wall of the through holes and may extend to the first surface 101 and the second surface 102 of the body. The insulating film IF provides electrical insulation between the plurality of through holes 200 and the body 100.

[0056] The insulating film IF may include known insulating materials such as parylene, but this disclosure is not limited thereto. As another example, the insulating film IF may include insulating materials other than parylene, such as epoxy resin. The insulating film IF may be formed using chemical vapor deposition (CVD) or atomic layer deposition (ALD), but this disclosure is not limited thereto.

[0057] In this disclosure, the insulating film IF may be an optional element. The insulating film IF may be omitted when the body 100 can ensure sufficient resistance under the operating conditions of the coil assembly 1000 according to this example embodiment.

[0058] The main insulating layer 310 may be disposed on at least one surface of the main body 100. (Refer to...) Figure 4 The main insulating layer 310 may be disposed on the first surface 101 and the second surface 102 of the main body 100. At least a portion of the plurality of pads 320 may be disposed in the main insulating layer 310.

[0059] The covering insulation layer 410 may be disposed on the main insulation layer 310. (Refer to...) Figure 4 The covering insulation layer 410 may be disposed on the lower surface of the main insulation layer 310 disposed on the first surface 101 of the body, and may be disposed on the upper surface of the main insulation layer 310 disposed on the second surface 102 of the body. The covering insulation layer 410 may be disposed on the main insulation layer 310 to cover one surface of each of the plurality of pads 320. The covering insulation layer 410 prevents the plurality of pads 320 from being exposed to the outside of the coil assembly.

[0060] The main insulating layer 310 and the cover insulating layer 410 may each include an insulating material. As an insulating material, insulating resins such as thermosetting resins (such as epoxy resins) or thermoplastic resins (such as polyimide) may be used, or materials in which the above-mentioned resins are mixed with inorganic fillers (such as silica), or materials obtained by impregnating inorganic fillers and core materials (such as glass fibers) together in the above-mentioned resins, for example, Ajinomoto build-up film (ABF), prepreg, etc., but this disclosure is not limited thereto.

[0061] The via electrode 450 can pass through the covering insulating layer 410 and can be connected to multiple pads 320. The via electrode 450 can be used to connect the external electrodes 510 and 520, which will be described below, to the multiple pads 320.

[0062] The via electrode 450 may include: a first via electrode 451 connecting the first external electrode 510 and one of a plurality of pads to each other; and a second via electrode 452 connecting the second external electrode 520 and another of the plurality of pads to each other. (See reference...) Figure 4 A first via electrode 451 can connect the first external electrode 510 and the first pad 321 to each other, and a second via electrode 452 can connect the second external electrode 520 and the eighth pad 328 to each other, but this disclosure is not limited thereto. As will be described below, the coil assembly may include two or more external electrodes, and the number of via electrodes may be configured to correspond to the number of external electrodes. For example, refer to... Figure 8A The coil assembly may include a first external electrode 510, a second external electrode 520, a third external electrode 530, and a fourth external electrode 540, and may include a first through-hole electrode 451, a second through-hole electrode 452, a third through-hole electrode 453, and a fourth through-hole electrode 454 corresponding to the first external electrode 510, the second external electrode 520, the third external electrode 530, and the fourth external electrode 540.

[0063] Each via electrode 450 may include a metal, and the metal may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof, and preferably may include copper (Cu), but this disclosure is not limited thereto. Each via electrode 450 may include an electroless plating layer (e.g., a chemically plated copper layer) and an electrolytic plating layer (e.g., an electrolytically plated copper layer), but this disclosure is not limited thereto. A sputtered layer may be formed instead of an electroless plating layer, or both may be included.

[0064] The external electrode 500 can be disposed on one surface of the covering insulating layer 410.

[0065] The external electrode 500 may include a first external electrode 510 and a second external electrode 520 spaced apart from each other in a second direction (Y direction). The first external electrode 510 and the second external electrode 520 may be disposed on a first surface 101 of the body 100. (Refer to...) Figure 4 The first external electrode 510 and the second external electrode 520 may be disposed on the lower surface of the covering insulating layer 410 located on the lower part of the main body 100, and spaced apart from each other.

[0066] The external electrode 500 can be connected to the through-hole 200 via the through-hole electrode 450. (Refer to...) Figure 4 The first external electrode 510 can be connected to the first pad 321 through the first via electrode 451, and the second external electrode 520 can be connected to the eighth pad 328 through the second via electrode 452. Therefore, the plurality of through holes 200 can be used as coils in a coil assembly.

[0067] The first external electrode 510 and the second external electrode 520 may have a structure comprising a single layer or a structure comprising multiple layers. For example, the first external electrode 510 may include: a first layer comprising copper (Cu); a second layer disposed on the first layer, the second layer comprising nickel (Ni); and a third layer disposed on the second layer, the third layer comprising tin (Sn). Here, the first to third layers may be formed by plating, but this disclosure is not limited thereto. As another example, the first external electrode 510 may include a resin electrode comprising conductive particles such as silver (Ag) and resin, and a nickel (Ni) / tin (Sn) plating formed on the resin electrode.

[0068] The first external electrode 510 and the second external electrode 520 may be formed using conductive materials such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof, but this disclosure is not limited thereto.

[0069] Figures 6A to 6C This is a diagram of a coil assembly according to a variation of this disclosure.

[0070] Reference Figure 6AThe external electrode 500 may be disposed on the first surface 101 and / or the second surface 102 of the main body 100. Specifically, the external electrode 500 may be disposed on the lower surface of the covering insulating layer 410 located on the lower part of the main body 100, and / or may be disposed on the upper surface of the covering insulating layer 410 located on the upper part of the main body 100. The external electrode 500 may include: a first external electrode 510 and a third external electrode 530, disposed on the first surface 101 and connected to the pads through a first via electrode 451 and a third via electrode 453, respectively; and a second external electrode 520 and a fourth external electrode 540, disposed on the second surface 102 and connected to the pads through a second via electrode 452 and a fourth via electrode 454, respectively. Furthermore, when the coil assembly 1000 includes a first external electrode 510 and a second external electrode 520, both the first external electrode and the second external electrode can be disposed on the first surface 101 (or the second surface 102) of the main body 100, or the first external electrode can be disposed on the first surface 101 and the second external electrode can be disposed on the second surface 102 (or vice versa).

[0071] Reference Figure 6B The external electrode 500 can be in the form of solder balls, and the coil assembly 1000 can be used as a ball grid array (BGA) substrate, etc.

[0072] Reference Figure 6C The external electrode 500 may extend onto the external insulating layer 600, which will be described below, and may also be disposed on the side and top surfaces of the body.

[0073] An outer insulating layer 600 may be disposed on the second surface 102, the third surface 103, the fourth surface 104, the fifth surface 105, and the sixth surface 106 of the body 100. The outer insulating layer 600 may be used to protect the body 100 so that the body 100 is not exposed to the outside of the coil assembly.

[0074] Specifically, the outer insulating layer 600 may be disposed on the third surface 103, the fourth surface 104, the fifth surface 105, and the sixth surface 106 of the body 100, and may also be disposed on the upper surface of the covering insulating layer 410. The outer insulating layer 600 may be disposed in areas where the outer electrode is not formed, thereby exposing the outer electrode 500. When the outer electrode 500 is formed by plating, the outer insulating layer 600 may be used as a plating resist, but this disclosure is not limited thereto.

[0075] The outer insulating layer 600 can be disposed on the surface of the body 100 on which the outer electrode 500 is not formed, and can be used to electrically protect the coil assembly, reduce leakage current, and prevent plating diffusion during the formation of the outer electrode.

[0076] The outer insulating layer 600 may include thermoplastic resins (such as polystyrene resins, vinyl acetate resins, polyester resins, polyethylene resins, polypropylene resins, polyamide resins, rubber resins, acrylic resins, etc.), thermosetting resins (such as phenolic resins, epoxy resins, polyurethane resins, melamine resins, alkyd resins, etc.), photosensitive resins, parylene, SiO2, etc. x or SiN x .

[0077] Figures 7A to 7C This is a diagram of a coil assembly according to another variation of this disclosure.

[0078] according to Figures 7A to 7C The modified coil assembly may also include a metal layer 700 disposed on the outer insulation layer 600.

[0079] The metal layer 700 may be disposed directly on the surface of the outer insulation layer 600. The metal layer 700 may not cover the outer electrode 500, and the outer electrode 500 may be exposed to the outside of the coil assembly.

[0080] The metal layer 700 can block radiated noise that leaks from the coil assembly to the outside and / or noise that flows into the coil assembly from the outside.

[0081] The metal layer 700 may include a conductive material, and may include, for example, at least one of silver (Ag), copper (Cu), aluminum (Al), tin (Sn), gold (Au), nickel (Ni), lead (Pb) and titanium (Ti).

[0082] Figures 8A to 8C This is a diagram of a coil assembly according to another variation of this disclosure.

[0083] Reference Figures 8A to 8C At least two of the multiple through holes 200 in the coil assembly may not be connected to each other. That is, the coil assembly may be in the form of an array-type coil assembly comprising multiple coils.

[0084] Reference Figure 8A The coil assembly may include a first external electrode 510, a second external electrode 520, a third external electrode 530, and a fourth external electrode 540. The first external electrode 510, the second external electrode 520, the third external electrode 530, and the fourth external electrode 540 may be disposed on a first surface 101 of the body 100, spaced apart from each other in a second direction (Y direction). A first through-hole 210 and a second through-hole 220 may be connected to the first external electrode 510 and the second external electrode 520, and a third through-hole 230 and a fourth through-hole 240 may be connected to the third external electrode 530 and the fourth external electrode 540.

[0085] Reference Figure 8BThe first external electrode 510, the second external electrode 520, the third external electrode 530 and the fourth external electrode 540 can be in the form of solder balls, and the coil assembly 1000 can be used as a BGA substrate, etc.

[0086] Reference Figure 8C The coil assembly may include a first external electrode 510, a second external electrode 520, a third external electrode 530, a fourth external electrode 540, a fifth external electrode 550, a sixth external electrode 560, a seventh external electrode 570, and an eighth external electrode 580. The first external electrode 510, the third external electrode 530, the fifth external electrode 550, and the seventh external electrode 570 may be disposed on a first surface 101 of the body 100 and spaced apart from each other in a second direction (Y direction), and the second external electrode 520, the fourth external electrode 540, the sixth external electrode 560, and the eighth external electrode 580 may be disposed on a second surface 102 of the body 100 and spaced apart from each other in the second direction (Y direction). Each of the through holes 210, 220, 230, and 240 may be connected to two external electrodes. For example, the first through-hole 210 can be connected to the first external electrode 510 and the second external electrode 520 through the first through-hole electrode 451 and the second through-hole electrode 452, respectively; the second through-hole 220 can be connected to the third external electrode 530 and the fourth external electrode 540 through the third through-hole electrode 453 and the fourth through-hole electrode 454, respectively; the third through-hole 230 can be connected to the fifth external electrode 550 and the sixth external electrode 560 through the fifth through-hole electrode 455 and the sixth through-hole electrode 456, respectively; and the fourth through-hole 240 can be connected to the seventh external electrode 570 and the eighth external electrode 580 through the seventh through-hole electrode 457 and the eighth through-hole electrode 458, respectively.

[0087] Figures 9A to 9I This is a diagram illustrating the manufacturing process of the coil assembly according to this disclosure.

[0088] Reference Figure 9A The main body 100 can be formed by stacking multiple magnetic sheets with a thickness of tens of micrometers (μm).

[0089] Reference Figure 9B A cover can be formed on each of the upper and lower parts of the main body 100.

[0090] Reference Figure 9C A through hole H can be formed through the body 100 using CNC drilling, laser processing, etc.

[0091] Reference Figure 9D The carrier can be attached to the lower part of the main body 100.

[0092] Reference Figure 9E An insulating film IF can be formed on the inner wall of the through hole H using chemical vapor deposition, atomic layer deposition, or other methods.

[0093] Reference Figure 9F Conductive material can be filled into the through hole H.

[0094] Reference Figure 9G The carrier can be removed using polishing processes, and the portion of the cover and insulating film IF on each of the upper and lower parts of the body 100, except for the portion located on the inner wall of the through hole H, can be removed. As a result, multiple through holes 200 can be completed to form a unit coil.

[0095] Reference Figure 9H A main insulating layer 310 and a plurality of pads 320 may be formed on the upper and lower portions of the main body 100. The plurality of pads 320 may pass through at least a portion of the main insulating layer 310 and may be connected to a plurality of through-holes 200. The coil assembly according to this example embodiment may be implemented as needed according to the method by which the plurality of pads 320 are connected to each other (e.g., series or parallel connection between the plurality of through-holes 200). That is, depending on the method by which the plurality of pads 320 are connected to each other, a coil assembly having desired capacity (e.g., inductance) and other characteristics may be freely implemented.

[0096] Reference Figure 9I An insulating layer 410 and a via electrode 450 may be formed on the upper and lower parts of the main body 100, and then an outer insulating layer 600 and an outer electrode 500 may be formed.

[0097] While exemplary embodiments have been shown and described above, those skilled in the art will understand that modifications and variations may be made without departing from the scope of this disclosure as defined by the appended claims.

Claims

1. A coil assembly, comprising: main body; Multiple through holes pass through the main body; Multiple pads are disposed on one surface of the body, and the multiple pads are respectively connected to the multiple through holes; An insulating layer is applied to cover one surface of the plurality of pads. The external electrode is disposed on one surface of the covering insulating layer; as well as Via electrodes, passing through the covering insulating layer, connect the outer electrodes and the plurality of pads to each other.

2. The coil assembly according to claim 1, wherein, The body has a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connecting the first surface and the second surface to each other, and a fifth surface and a sixth surface connecting the third surface and the fourth surface to each other. The third surface and the fourth surface are opposite to each other in a second direction, and the fifth surface and the sixth surface are opposite to each other in a third direction. The plurality of through holes extend to the first surface and the second surface.

3. The coil assembly according to claim 2, wherein, The plurality of through holes are spaced apart from each other in the second direction, and The external electrodes include a first external electrode and a second external electrode spaced apart from each other.

4. The coil assembly according to claim 3, wherein, The via electrode includes: a first via electrode that connects the first external electrode and a first pad among the plurality of pads to each other; and a second via electrode that connects the second external electrode and a second pad among the plurality of pads to each other.

5. The coil assembly according to claim 3, wherein, The first external electrode and the second external electrode are disposed on the first surface of the body and spaced apart from each other in the second direction.

6. The coil assembly according to claim 3, wherein, The first external electrode is disposed on the first surface of the body, and the second external electrode is disposed on the second surface of the body.

7. The coil assembly according to claim 1, wherein, The plurality of pads connect at least two of the plurality of through holes to each other.

8. The coil assembly according to claim 1, wherein, The coil assembly also includes a plurality of pads disposed on another surface of the body opposite to the first surface.

9. The coil assembly according to claim 7, wherein, At least two of the plurality of through holes form a closed loop through the plurality of pads.

10. The coil assembly according to claim 1, wherein, The external electrodes include a first external electrode, a second external electrode, a third external electrode, and a fourth external electrode spaced apart from each other.

11. The coil assembly of claim 10, wherein: The first through hole of the plurality of through holes is connected to the first external electrode and the second external electrode, and The second through hole of the plurality of through holes is connected to the third external electrode and the fourth external electrode.

12. The coil assembly of claim 1, further comprising: An insulating film is disposed between the plurality of through holes and the main body. The insulating film extends to one surface of the body.

13. The coil assembly of claim 1, further comprising: The main insulating layer is directly disposed on one surface of the main body. The main insulating layer is disposed between the main body and the covering insulating layer, and At least a portion of the plurality of pads are disposed in the main insulating layer.

14. The coil assembly of claim 2, further comprising: An outer insulating layer is disposed on the second, third, fourth, fifth, and sixth surfaces of the body, the outer insulating layer exposing the outer electrode.

15. The coil assembly of claim 14, further comprising: A metal layer is disposed on the outer insulating layer, the metal layer exposing the outer electrode.

Images