Multilayer electronic component

Abstract

This disclosure provides a multilayer electronic component, comprising: a body including a dielectric layer and inner electrodes alternately disposed with respect to the dielectric layer in a first direction; the body including a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface opposite to each other in a second direction perpendicular to the first direction, and a fifth surface and a sixth surface opposite to each other in a third direction perpendicular to the first and second directions; a metal layer disposed on an edge connecting the first and fifth surfaces, an edge connecting the first and sixth surfaces, an edge connecting the second and fifth surfaces, and an edge connecting the second and sixth surfaces; a first outer electrode disposed on the third surface; and a second outer electrode disposed on the fourth surface. The metal layer includes nickel (Ni) and further includes at least one of phosphorus (P) and boron (B).

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2024-0195095, filed on December 24, 2024, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0002] This disclosure relates to a multilayer electronic component. Background Technology

[0003] Multilayer ceramic capacitors (MLCCs, a type of multilayer electronic component) are chip capacitors mounted on printed circuit boards in various electronic products, such as video display devices (such as liquid crystal displays (LCDs) and plasma display panels (PDPs)), computers, smartphones and mobile phones, and on-board chargers (OBCs) and DC-DC converters for electric vehicles, for charging or discharging.

[0004] Examples of methods for improving the moisture resistance reliability of multilayer ceramic capacitors include methods for densely forming the external electrodes or methods for forming the external electrodes with greater thickness. However, methods for densely forming the external electrodes may have limitations because it may be difficult to improve the density of the external electrodes in the miniaturization of multilayer ceramic capacitors, and methods for forming the external electrodes with greater thickness may lead to problems in ensuring sufficient capacitance per unit volume as the proportion (e.g., volume ratio) of the external electrodes in the entire multilayer ceramic capacitor increases.

[0005] Specifically, when the substrate electrode layer of the outer electrode of a multilayer ceramic capacitor is formed by coating and firing conductive paste, the thickness of the substrate electrode layer coated to the edge of the body becomes thinner. This may cause chipping due to subsequent plating processes, resulting in a reduction in the sealing performance of the multilayer ceramic capacitor.

[0006] Furthermore, depending on the application of the multilayer ceramic capacitor, there are cases where a ground electrode is formed in addition to the terminal electrodes. In this case, since a separate process of coating and firing conductive paste is performed to form the ground electrode, there may be issues with performing additional processes, and the aforementioned problem of reduced sealing performance of the multilayer ceramic capacitor may occur in the process of forming the ground electrode at the edge of the body.

[0007] Therefore, structural improvements are needed that can easily achieve miniaturization and high capacitance of multilayer ceramic capacitors while improving sealing performance. Summary of the Invention

[0008] One aspect of this disclosure is to provide a multilayer electronic assembly in which the problem of reduced sealing performance of the multilayer electronic assembly due to the thinness of the external electrodes coated to the edge of the body is mitigated.

[0009] One aspect of this disclosure is to alleviate the problem of difficulty in forming a uniform substrate electrode layer when a conductive paste is used to form the substrate electrode layer of the external electrode by firing.

[0010] One aspect of this disclosure is to mitigate the problem of reduced sealing performance that may occur when a ground electrode is formed in a multilayer electronic assembly.

[0011] One aspect of this disclosure is to solve the problem that a process of applying conductive paste must be performed when forming a ground electrode in a multilayer electronic assembly.

[0012] According to one aspect of this disclosure, a multilayer electronic component includes: a body comprising a dielectric layer and inner electrodes alternately disposed with respect to the dielectric layer in a first direction; the body including a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface opposite to each other in a second direction perpendicular to the first direction, and a fifth surface and a sixth surface opposite to each other in a third direction perpendicular to the first and second directions; a metal layer disposed on an edge connecting the first surface and the fifth surface, an edge connecting the first surface and the sixth surface, an edge connecting the second surface and the fifth surface, and an edge connecting the second surface and the sixth surface; a first outer electrode disposed on the third surface; and a second outer electrode disposed on the fourth surface. The metal layer comprises nickel (Ni) and at least one selected from the group consisting of phosphorus (P) and boron (B). Attached Figure Description

[0013] The above and other aspects, features and advantages of this disclosure will be more clearly understood through the following detailed embodiments, taken in conjunction with the accompanying drawings, in which: Figure 1 A perspective view of a multilayer electronic assembly according to an embodiment is schematically shown; Figure 2 Schematic illustration along Figure 1 A cross-sectional view taken from line I-I'; Figure 3 Schematic illustration along Figure 1 A cross-sectional view taken from line II-II'; Figure 4 schematically shown Figure 3 A magnified view of region P; Figure 5 Schematic illustration along Figure 1 A cross-sectional view taken from line III-III'; Figure 6 Schematic illustration along Figure 1 A cross-sectional view taken from line IV-IV'; Figure 7 A perspective view of the main body according to an embodiment is schematically shown; Figure 8 This is a schematic perspective view of a main body having a metal layer formed thereon, according to an embodiment. Figure 9 An exploded perspective view of the main body according to an embodiment is schematically shown; Figure 10 A perspective view of a multilayer electronic assembly according to another embodiment is schematically shown; Figure 11 A perspective view of the main body according to another embodiment is schematically shown; Figure 12 This is a schematic perspective view of a body having a metal layer formed thereon, according to another embodiment; and Figure 13 This is an exploded perspective view of the main body according to another embodiment. Detailed Implementation

[0014] In the following description, this disclosure will be illustrated with reference to specific embodiments and accompanying drawings. However, embodiments may be modified in various other forms, and the scope of this disclosure is not limited to the embodiments described below. Furthermore, embodiments are provided to provide a more complete explanation of this disclosure to those skilled in the art. Therefore, for clarity of explanation, the shape and size of elements in the drawings may be exaggerated, and elements indicated by the same reference numerals in the drawings are the same elements.

[0015] Furthermore, to clearly explain this disclosure in the accompanying drawings, parts irrelevant to the explanation have been omitted, and for ease of explanation, the dimensions (e.g., thickness) of each component shown in the drawings have been arbitrarily indicated; therefore, this disclosure is not necessarily limited to what is shown. Additionally, components having the same function within the scope of the same concept are described using the same reference numerals. Moreover, throughout the specification, unless otherwise specifically stated, when a part is referred to as "comprising" a component, this does not mean that the part excludes other components, but may include other components.

[0016] In the accompanying drawings, the first direction can be defined as the stacking direction or the thickness direction, the second direction can be defined as the length direction, and the third direction can be defined as the width direction.

[0017] Figure 1 A perspective view of a multilayer electronic assembly according to an embodiment is schematically shown.

[0018] Figure 2 Schematic illustration along Figure 1The cross-sectional view taken from line I-I'.

[0019] Figure 3 Schematic illustration along Figure 1 The cross-sectional view taken from line II-II'.

[0020] Figure 4 schematically shown Figure 3 A magnified view of region P.

[0021] Figure 5 Schematic illustration along Figure 1 The cross-sectional view taken from line III-III'.

[0022] Figure 6 Schematic illustration along Figure 1 A cross-sectional view taken from line IV-IV'.

[0023] Figure 7 A perspective view of the main body according to an embodiment is shown schematically.

[0024] Figure 8 A perspective view of a body having a metal layer formed thereon, according to an embodiment, is shown schematically.

[0025] Figure 9 An exploded perspective view of the main body according to an embodiment is shown schematically.

[0026] Figure 10 A perspective view of a multilayer electronic assembly according to another embodiment is schematically shown.

[0027] Figure 11 A perspective view of the subject according to another embodiment is shown schematically.

[0028] Figure 12 This is a schematic perspective view of a body having a metal layer formed thereon, according to another embodiment.

[0029] Figure 13 This is a schematic exploded perspective view of the body according to another embodiment.

[0030] In the following text, reference will be made to Figures 1 to 13 Detailed description of the multilayer electronic components 100 and 100' according to embodiments and various variations thereof.

[0031] A multilayer electronic component 100 according to an embodiment may include: a body 110 including a dielectric layer 111 and inner electrodes 121 and 122 alternately disposed with respect to the dielectric layer 111 in a first direction, and the body 110 having a first surface 1 and a second surface 2 opposite to each other in the first direction, a third surface 3 and a fourth surface 4 opposite to each other in a second direction perpendicular to the first direction, and a fifth surface 5 and a sixth surface 6 opposite to each other in a third direction perpendicular to the first and second directions; a metal layer 120 disposed on the edges connecting the first surface 1 and the fifth surface 5, the edges connecting the first surface 1 and the sixth surface 6, the edges connecting the second surface 2 and the fifth surface 5, and the edges connecting the second surface 2 and the sixth surface 6; a first outer electrode 130 disposed on the third surface 3; and a second outer electrode 140 disposed on the fourth surface 4. The metal layer 120 includes nickel (Ni) and may also include at least one of phosphorus (P) and boron (B).

[0032] The main body 110 may include a dielectric layer 111 and inner electrodes 121 and 122, and the dielectric layer 111 and the inner electrodes 121 and 122 may be alternately disposed in a first direction. For example, in this disclosure, the first direction may refer to the stacking direction of the dielectric layer 111 and the inner electrodes 121 and 122.

[0033] The specific shape of the main body 110 is not particularly limited, but as... Figure 7 As shown, the body 110 can be formed into a hexahedral shape or a shape similar to a hexahedron. Because the ceramic powder included in the body 110 shrinks during the firing process, the body 110 may not have a hexahedral shape with perfect straight lines, but may have a substantially hexahedral shape.

[0034] The main body 110 may have a first surface 1 and a second surface 2 that are opposite to each other in a first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and are opposite to each other in a second direction perpendicular to the first direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1 and the second surface 2, connected to the third surface 3 and the fourth surface 4 and are opposite to each other in a third direction perpendicular to the first direction and the second direction.

[0035] In addition, since the edge regions of the dielectric layer 111 where the internal electrodes 121 and 122 are not provided overlap each other, steps are generated due to the thickness of the internal electrodes 121 and 122, and the edges connecting the first surface 1 and the third surface 3 to the sixth surface 6 and / or the edges connecting the second surface 2 and the third surface 3 to the sixth surface 6 may have a shape that is centrally contracted in the first direction toward the main body 110 with respect to the first surface 1 or the second surface 2. Alternatively, due to the shrinkage behavior of the main body 110 during the sintering process, the edges connecting the first surface 1 and the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6 and / or the edges connecting the second surface 2 and the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6 may have a shape that is centrally contracted in the first direction toward the main body 110 with respect to the first surface 1 or the second surface 2. Alternatively, in order to prevent chipping defects and the like, the edges connecting the respective surfaces of the main body 110 may be rounded by performing a separate process, so that the edges connecting the first surface 1 and the third surface 3 to the sixth surface 6 and / or the edges connecting the second surface 2 and the third surface 3 to the sixth surface 6 may have a rounded shape.

[0036] The plurality of dielectric layers 111 forming the main body 110 are in a sintered state, and adjacent dielectric layers 111 may be integrated to such an extent that it is difficult to identify the boundary between them without using a scanning electron microscope (SEM). The number of stacked dielectric layers 111 is not particularly limited and may be determined in consideration of the size of the multilayer electronic component 100. For example, the main body 110 may be formed by stacking 400 or more dielectric layers 111.

[0037] The dielectric layer 111 may be formed by: manufacturing a ceramic slurry containing ceramic powder, an organic solvent, and a binder, coating the ceramic slurry on a carrier film and drying it to prepare a ceramic green sheet, and then firing the ceramic green sheet. The ceramic powder is not particularly limited as long as sufficient electrostatic capacitance can be obtained using it. For example, barium titanate (BaTiO3)-based powder or calcium zirconate (CaZrO3)-based paraelectric powder may be used as the ceramic powder. For a more specific example, the barium titanate (BaTiO3)-based powder may be at least one of BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), and Ba(Ti 1-y Zr y )O3 (0 < y < 1), and the calcium zirconate (CaZrO3)-based paraelectric powder may be (Ca1-x Sr x (Zr) 1- y Ti y O3 (0≤x<1, 0≤y<1).

[0038] There is no particular limitation on the average thickness td of dielectric layer 111.

[0039] In order to miniaturize the multilayer electronic component 100 and increase its capacitance, the average thickness td of the dielectric layer 111 can be less than or equal to 0.35 μm, and in order to improve the reliability of the multilayer electronic component 100 under high temperature and high voltage, the average thickness td of the dielectric layer 111 can be greater than or equal to 3 μm.

[0040] The average thickness td of dielectric layer 111 can refer to the average thickness of at least one of the multiple dielectric layers.

[0041] The average thickness td of dielectric layer 111 can be measured by scanning images of cross-sections of the body 110 in the first and second directions using a scanning electron microscope (SEM). For example, the average thickness td of dielectric layer 111 can be obtained by scanning and obtaining images of cross-sections of the body 110 cut from the center of the width direction in the first and second directions using a scanning electron microscope (SEM), and averaging the thickness of the dielectric layer measured at 1 / 4, 2 / 4, and 3 / 4 points, which are adjacent to a dielectric layer at a point where the center line of the length direction and the center line of the thickness direction of the capacitor forming portion intersect. If the measurement is extended to two dielectric layers, one above and one below, with equal spacing between them, adjacent to a dielectric layer at a point where the center line of the length direction and the center line of the thickness direction of the capacitor forming portion intersect, the average thickness of the dielectric layer can be further generalized.

[0042] The main body 110 may include: a capacitor forming portion Ac disposed inside the main body 110, wherein a capacitor is formed in the capacitor forming portion Ac by including an alternately arranged first inner electrode 121 and a second inner electrode 122 and a dielectric layer 111 therebetween; and covering portions 112 and 113 formed above and below the capacitor forming portion Ac in a first direction.

[0043] The capacitor forming portion Ac is the part that contributes to the capacitance formation of the capacitor, and it can be formed by repeatedly stacking a plurality of first internal electrodes 121 and a plurality of second internal electrodes 122 with a dielectric layer 111 located between them, and can refer to the region where the first internal electrodes 121 and the second internal electrodes 122 are stacked in the first direction. In addition, the first internal electrode 121 can be provided at the top end of the capacitor forming portion Ac in the first direction, and the second internal electrode 122 can be provided at the bottom end of the capacitor forming portion Ac in the first direction.

[0044] The inner electrodes 121 and 122 may include a first inner electrode 121 and a second inner electrode 122. The first inner electrode 121 and the second inner electrode 122 may be alternately arranged facing each other, and the dielectric layer 111 forming the body 110 may be located between the first inner electrode 121 and the second inner electrode 122. The first inner electrode 121 and the second inner electrode 122 may be exposed on the third surface 3 and the fourth surface 4 of the body 110, respectively. For example, in an embodiment, one end of the first inner electrode 121 in a second direction may contact the third surface 3, and one end of the second inner electrode 122 in a second direction may contact the fourth surface 4.

[0045] Reference Figure 2 The first inner electrode 121 can be connected to the first outer electrode 130, and the second inner electrode 122 can be connected to the second outer electrode 140.

[0046] The first inner electrode 121 can be connected to the first outer electrode 130 but not to the second outer electrode 140, and the second inner electrode 122 can be connected to the second outer electrode 140 but not to the first outer electrode 130. For example, the first inner electrode 121 can be formed at a certain distance from the fourth surface 4, and the second inner electrode 122 can be formed at a certain distance from the third surface 3. In addition, each of the first inner electrode 121 and the second inner electrode 122 can be disposed at a certain distance from the fifth surface 5 and the sixth surface 6 of the body 110.

[0047] The conductive metal included in the inner electrodes 121 and 122 may be at least one of Ni, Cu, Pd, Ag, Au, Pt, In, Sn, Al, Ti and alloys thereof, and this disclosure is not limited thereto.

[0048] The average thickness te of the inner electrodes 121 and 122 is not particularly limited and can be varied according to the purpose of this disclosure. In order to miniaturize the multilayer electronic component 100, the average thickness te of the inner electrodes 121 and 122 can be less than or equal to 0.35 μm, and in order to improve the reliability of the multilayer electronic component 100 under high temperature and high voltage, the average thickness te of the inner electrodes 121 and 122 can be greater than or equal to 3 μm.

[0049] The average thickness te of inner electrodes 121 and 122 may refer to the average thickness of at least one of the multiple inner electrodes.

[0050] The average thickness *te* of the inner electrodes 121 and 122 can be measured by scanning images of the first and second cross-sections of the body 110 using a scanning electron microscope (SEM). For example, the average thickness *te* of the inner electrodes 121 and 122 can be obtained by averaging the thickness of an inner electrode measured at 1 / 4, 2 / 4, and 3 / 4 points, which divide the inner electrode into four equal parts along its length, based on an inner electrode adjacent to the point where the center line of the capacitor forming portion intersects with the center line of the capacitor forming portion along its length. If this measurement is extended to two inner electrodes, one above and one below, with equal spacing, adjacent to an inner electrode at the point where the center line of the capacitor forming portion intersects with the center line of the capacitor forming portion along its length, the average thickness of the inner electrodes can be further generalized.

[0051] Reference Figure 2 Cover portions 112 and 113 may be disposed on the upper and lower surfaces of the capacitor forming portion Ac in the first direction.

[0052] The covers 112 and 113 primarily serve to prevent damage to the internal electrodes due to physical and / or chemical stress.

[0053] Cover portions 112 and 113 may comprise the same material as the dielectric layer 111. For example, cover portions 112 and 113 may comprise a ceramic material, such as a barium titanate (BaTiO3) based ceramic material.

[0054] Furthermore, the thickness of the covering portions 112 and 113 does not need to be particularly limited. For example, the thickness tc of the covering portions 112 and 113 can be less than or equal to 20 μm.

[0055] The average thickness tc of the covers 112 and 113 may refer to their average size in the first direction, and may be the average of the first-direction dimensions of the covers 112 and 113 measured at five equally spaced points above or below the capacitor forming portion Ac.

[0056] Reference Figure 5 Edge portions 114 and 115 may be provided on the side surface of capacitor forming portion Ac.

[0057] Edge portions 114 and 115 may include a first edge portion 114 disposed on one side surface of the capacitor forming portion Ac in the third direction and a second edge portion 115 disposed on the other side surface of the capacitor forming portion Ac in the third direction. For example, edge portions 114 and 115 may be disposed on two side surfaces of the capacitor forming portion Ac in the width direction, respectively.

[0058] like Figure 5 As shown, the edges 114 and 115 refer to the area between the two ends of the first inner electrode 121 and the second inner electrode 122 and the outer surface of the body 110 in a cross section cut along the width-thickness direction of the body 110.

[0059] The edges 114 and 115 primarily serve to prevent damage to the internal electrodes due to physical and / or chemical stress.

[0060] Edges 114 and 115 can be formed by coating the area of ​​the ceramic green sheet, excluding the area where the edge is to be formed, with a conductive paste for forming the internal electrode.

[0061] Furthermore, the widths of the edges 114 and 115 do not need to be particularly limited. For example, the average widths of the edges 114 and 115 can be less than or equal to 20 μm.

[0062] The average width of the edges 114 and 115 can refer to the average dimension of the region between the inner electrode and the fifth surface in the third direction and the average dimension of the region between the inner electrode and the sixth surface in the third direction, and can be the average value of the third-direction dimensions of the edges 114 and 115 measured at five equally spaced points on the side surface of the capacitor forming part Ac.

[0063] External electrodes 130 and 140 can be disposed on the main body 110, and specifically, they can be disposed on the third surface 3 and the fourth surface 4 of the main body 110, respectively.

[0064] The external electrodes 130 and 140 may include a first external electrode 130 disposed on the third surface 3 of the body 110 and a second external electrode 140 disposed on the fourth surface 4 of the body 110.

[0065] Furthermore, the external electrodes 130 and 140 are not necessarily limited to being disposed only on the third surface 3 and the fourth surface 4 of the main body 110. (See reference...) Figure 1 and Figure 2The first external electrode 130 may be configured to extend from the third surface 3 of the body 110 to a portion of the first surface 1, a portion of the second surface 2, a portion of the fifth surface 5 and a portion of the sixth surface 6, and the second external electrode 140 may be configured to extend from the fourth surface 4 to a portion of the first surface 1, a portion of the second surface 2, a portion of the fifth surface 5 and a portion of the sixth surface 6.

[0066] The outer electrodes 130 and 140 may include electrode layers 131 and 141 disposed on the body 110 and connected to the inner electrodes 121 and 122.

[0067] Specifically, the first external electrode 130 may include a first electrode layer 131 disposed on the body 110 and connected to the first internal electrode 121, and the second external electrode 140 may include a second electrode layer 141 disposed on the body 110 and connected to the second internal electrode 122. The first electrode layer 131 and the second electrode layer 141 are in contact with the third surface 3 and the fourth surface 4 of the body 110, respectively.

[0068] The first electrode layer 131 and the second electrode layer 141 can be connected to the inner electrodes 121 and 122 respectively, and can serve to ensure the electrical connection between the outer electrodes 130 and 140 and the inner electrodes 121 and 122.

[0069] The first electrode layer 131 and the second electrode layer 141 may include a conductive metal. Materials with excellent conductivity can be used as the conductive metal, and there are no particular limitations. For example, the conductive metal may be at least one of nickel (Ni), copper (Cu), and alloys thereof.

[0070] For a more specific example of the first electrode layer 131 and the second electrode layer 141, the electrode layer may be a sintered electrode comprising a conductive metal and glass, or it may be a resin-based electrode comprising a conductive metal and resin.

[0071] The first electrode layer 131 and the second electrode layer 141 may have a form in which a sintered electrode and a resin-based electrode are sequentially formed on the body. Furthermore, the electrode layers can be formed by transferring a sheet including a conductive metal onto the body, or by transferring a sheet including a conductive metal onto a sintered electrode.

[0072] In addition, the first external electrode 130 may also include a first plating layer 132 disposed on the first electrode layer 131, and the second external electrode 140 may also include a second plating layer 142 disposed on the second electrode layer 141.

[0073] The dimensions of the multilayer electronic component 100 are not particularly limited. For example, the length of the multilayer electronic component 100 can be from 0.1 mm to 10.0 mm, the thickness of the multilayer electronic component 100 can be from 0.1 mm to 10.0 mm, and the width of the multilayer electronic component 100 can be from 0.1 mm to 10.0 mm.

[0074] In this case, the length of the multilayer electronic component 100 may refer to the maximum dimension of the multilayer electronic component 100 in the second direction, the thickness of the multilayer electronic component 100 may refer to the maximum dimension of the multilayer electronic component 100 in the first direction, and the width of the multilayer electronic component 100 may refer to the maximum dimension of the multilayer electronic component 100 in the third direction.

[0075] As described above, the body 110 may include edges connecting the first surface 1 with the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6, as well as edges connecting the second surface 2 with the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6. The edges of the body 110 may become major penetration paths for external moisture or plating solutions. Specifically, because the electrode layers 131 and 141 of the external electrodes 130 and 140 are formed thin, the edges connecting the first surface 1 and the fifth surface 5, the first surface 1 and the sixth surface 6, the second surface 2 and the fifth surface 5, and the second surface 2 and the sixth surface 6 may become areas susceptible to external moisture or plating solutions. Therefore, it may be difficult to ensure the sealing of the multilayer electronic assembly 100.

[0076] In related technologies, attempts have been made to improve the hermeticity of the multilayer electronic assembly 100 by densely forming external electrodes on the edges of the body 110 or by making the external electrodes thicker. However, since it is difficult to improve the density of the external electrodes in the miniaturization of multilayer electronic assemblies, the method of densely forming external electrodes may have limitations. Furthermore, if the external electrodes are thicker, their proportion (e.g., volume ratio) in the entire multilayer electronic assembly 100 increases, which may lead to problems in ensuring sufficient capacitance per unit volume.

[0077] Therefore, in the embodiment, by providing a metal layer 120 on the edges connecting the first surface 1 and the fifth surface 5, the edges connecting the first surface 1 and the sixth surface 6, the edges connecting the second surface 2 and the fifth surface 5, and the edges connecting the second surface 2 and the sixth surface 6, the edges of the body 110 that are susceptible to the penetration of external moisture or plating solution are protected, and by forming external electrodes 130 and 140 with sufficient thickness on the edges of the body 110, the sealing performance of the multilayer electronic assembly 100 can be improved.

[0078] Furthermore, since the edges of the body 110 can be formed using the ceramic material of the dielectric layer 111, it may be difficult to ensure sufficient bonding strength between the metal layer 120 and the body 110 when forming a metal layer using a single element. Additionally, when forming the metal layer 120 by coating a conductive paste containing a conductive metal, it may be difficult to form a uniform metal layer 120 on the edges of the body 110.

[0079] Therefore, in embodiments of this disclosure, the metal layer 120 includes nickel (Ni) and also includes at least one of phosphorus (P) and boron (B), thereby forming a thin and uniform metal layer 120 on the edges connecting the first surface 1 and the fifth surface 5, the edges connecting the first surface 1 and the sixth surface 6, the edges connecting the second surface 2 and the fifth surface 5, and the edges connecting the second surface 2 and the sixth surface 6, and ensuring sufficient bonding strength between the metal layer 120 and the body 110.

[0080] Since the metal layer 120 is formed at the edge of the main penetration path of external moisture or plating solution into the body 110, the moisture resistance reliability of the multilayer electronic assembly 100 can be further improved when the metal layer 120 itself acts as a barrier against the penetration of external moisture or plating solution. Specifically, the metal layer 120 may substantially exclude glass components (components susceptible to plating solution effects) and may consist substantially only of metal or may include metal as the main component. For example, the content of metal elements may be greater than or equal to 80 at% relative to all elements included in the metal layer 120.

[0081] Reference Figure 8 The metal layer 120 may include a first metal layer and a second metal layer, with one end of the first metal layer in a second direction contacting the third surface 3, and one end of the second metal layer in a second direction contacting the fourth surface 4. In this configuration, the first and second metal layers may be spaced apart from each other in the second direction. Therefore, electrical connection between the first and second metal layers can be prevented.

[0082] Reference Figure 3 and Figure 4 Electrode layers 131 and 141 can be configured to cover the metal layer 120. Therefore, the effect of inhibiting external moisture penetration or plating solution corrosion can be further improved.

[0083] Reference Figure 3 and Figure 4The second direction length of the main body 110 is denoted as L, the first direction thickness of the main body 110 is denoted as T, the second direction length of the metal layer 120 between one end of the metal layer 120 that is closer to the center of the second direction of the main body 110 and one of the third surface 3 and the fourth surface 4 that is closer to the other end of the metal layer 120 is denoted as lp, and the first direction thickness of the metal layer 120 is denoted as tp.

[0084] When lp / L is less than 0.05, the metal layer 120 may not adequately cover the edges of the body 110. When lp / L exceeds 0.33, the outer electrodes 130 and 140 formed on the metal layer 120 extend excessively in the second direction, making it difficult to ensure a sufficient gap between the outer electrodes 130 and 140. Therefore, in the embodiment, by ensuring that lp / L is greater than or equal to 0.05 and less than or equal to 0.33, the metal layer 120 can adequately ensure the protection of the edges of the body 110 while ensuring a sufficient gap between the outer electrodes 130 and 140.

[0085] Additionally, refer to Figure 3 and Figure 6 A portion of the metal layer 120 may be stacked with the first inner electrode 121 and the second inner electrode 122. Therefore, the effect of inhibiting external moisture penetration or plating solution corrosion can be further improved.

[0086] Reference Figure 3 , Figure 4 and Figure 8 The metal layer 120 may also be disposed on the edges connecting the first surface 1 with the third surface 3 and / or the fourth surface 4, and on the edges connecting the second surface 2 with the third surface 3 and / or the fourth surface 4. For example, the metal layer 120 may be configured to extend to a portion of the third surface 3 and / or a portion of the fourth surface 4. Therefore, the hermeticity improvement effect of the multilayer electronic assembly 100 according to the embodiments of the present disclosure can be further improved. In this case, if tp / T exceeds 0.04, the thickness of the external electrodes 130 and 140 formed in the regions other than the edges increases, which may reduce the effect of improving the unit volume capacitance of the multilayer electronic assembly 100. Therefore, in the embodiments, by ensuring that tp / T is less than or equal to 0.04, the hermeticity of the multilayer electronic assembly 100 according to the embodiments can be ensured, while preventing a reduction in the effect of improving the unit volume capacitance of the multilayer electronic assembly 100.

[0087] Furthermore, there is no particular limitation on the lower limit of tp / T, and tp can be greater than or equal to 1 μm to form a metal layer 120 with sufficient thickness.

[0088] The methods for measuring L, lp, T, and tp are not particularly limited. Other methods and / or tools, as understood by one of ordinary skill in the art, may be used even if not described in this disclosure. For example, equipment such as an optical microscope (OM) or a scanning electron microscope (SEM) may be used to examine a first and second direction section (e.g., a section of a multilayer electronic assembly 100 polished along a third direction to simultaneously expose the metal layer 120 and the internal electrodes 121 and 122) in a location. Figure 3 L, lp, T, and tp are measured in the cross-section shown. Here, L can represent the maximum dimension of the multilayer electronic component 100 in the second direction, T can represent the maximum dimension of the multilayer electronic component 100 in the first direction, lp can represent the second-direction length between one end of the metal layer 120 that is closer to the center of the body 110 in the second direction and one of the third surface 3 and the fourth surface 4 that is closer to the other end of the metal layer 120 in the second direction, and tp can represent the maximum thickness of the metal layer 120 in the first direction disposed on the surface of the body 110 in the first direction.

[0089] Reference Figure 6 In the region between the extension line Et of the first inner electrode 121 located at the uppermost position in the first direction and the extension line Eb of the first inner electrode 121 located at the lowermost position in the first direction, the first electrode layer 131 may have a maximum thickness tmax and a minimum thickness tmin. Compared to the case where no metal layer 120 is formed, when the metal layer 120 is provided on the edges connecting the first surface 1 and the fifth surface 5, the edges connecting the first surface 1 and the sixth surface 6, the edges connecting the second surface 2 and the fifth surface 5, and the edges connecting the second surface 2 and the sixth surface 6, as in the embodiment, the outer electrodes 130 and 140 can be formed to have a uniform thickness. Specifically, in the embodiment, tmin / tmax may be greater than or equal to 0.5 and less than or equal to 1. Furthermore, although Figure 6 This indicates the first electrode layer 131, but regarding... Figure 6 The thickness deviation characteristics of the first electrode layer 131 shown can be similarly applied to the second electrode layer 141 of the second outer electrode 140.

[0090] The methods for measuring tmin and tmax are not particularly limited. Other methods and / or tools, as understood by one of ordinary skill in the art, may be used, even if not described in this disclosure. Equipment such as an optical microscope (OM) or a scanning electron microscope (SEM) can be used to polish, along the second direction, a cross-section (e.g., in the first and third directions) of a multilayer electronic assembly 100 such that the metal layer 120 and the first internal electrode 121 are simultaneously exposed. Figure 6tmin and tmax are measured in the cross section shown. tmin and tmax may correspond to the third-direction thickness of the first electrode layer 131 measured in the region between the extension line Et of the first inner electrode 121 located at the uppermost position in the first direction and the extension line Eb of the first inner electrode 121 located at the lowermost position in the first direction.

[0091] In an embodiment, the metal layer 120 may be configured to be spaced apart from the inner electrodes 121 and 122. Therefore, it is possible to prevent the outer electrodes 130 and 140 formed in the areas of the body 110 other than the edges from becoming excessively thick, thereby further enhancing the effect of improving the volumetric capacitance of the multilayer electronic component 100.

[0092] Reference Figure 10 According to another embodiment, the multilayer electronic assembly 100' may further include a third external electrode 150 disposed on the fifth surface 5 of the body 110' and a fourth external electrode 160 disposed on the sixth surface 6 of the body 110'.

[0093] like Figure 13 As shown, according to another embodiment, the body 110' may include a first inner electrode 121, a second inner electrode 122, and a third inner electrode 123. One end of the first inner electrode 121 in a second direction contacts a third surface 3, one end of the second inner electrode 122 in a second direction contacts a fourth surface 4, and one end of the third inner electrode 123 in a third direction contacts a fifth surface 5 and the other end in a third direction contacts a sixth surface 6. Additionally, the third inner electrode 123 may be located between the first inner electrode 121 and the second inner electrode 122 in a first direction. Besides including the third inner electrode 123, the body 110' according to another embodiment may include the same structure as the body 110 according to the above embodiments. For example, as... Figure 12 As shown, the metal layer 120 can be disposed on the edges of the main body 110' that connect the first surface 1 and the fifth surface 5, the edges that connect the first surface 1 and the sixth surface 6, the edges that connect the second surface 2 and the fifth surface 5, and the edges that connect the second surface 2 and the sixth surface 6.

[0094] Reference Figure 11 In the body 110' according to another embodiment, one end of the first inner electrode 121 contacts the third surface 3, and although not in Figure 11As directly shown, however, the second inner electrode 122 may contact the fourth surface 4, and the third inner electrode 123 may contact the fifth surface 5 and the sixth surface 6. Furthermore, in this disclosure, the simultaneous contact of each of the third inner electrodes 123 with both the fifth surface 5 and the sixth surface 6 is described as an example, but this disclosure is not limited thereto; for example, at least one of the third inner electrodes 123 may contact only the fifth surface 5 and / or at least one of the third inner electrodes 123 may contact only the sixth surface 6.

[0095] In another embodiment, the third external electrode 150 and the fourth external electrode 160 may include nickel (Ni), and may also include at least one of phosphorus (P) and boron (B). Therefore, the problem of reduced sealing that may occur when forming a ground electrode in a multilayer electronic assembly can be mitigated, and the problem of having to perform an additional process of applying conductive paste can be avoided.

[0096] In another embodiment, the metal layer 120 can be formed by an electroless plating process. Therefore, a uniform and dense metal layer 120 can be formed on the metal-free edges of the body 110.

[0097] There are no particular limitations on the method for controlling the formation length, thickness, and coating area of ​​the metal layer 120. For example, when the metal layer 120 is formed by electroless nickel plating, after sintering the body 110, decontamination and pretreatment are performed, and then the following method can be used: coating the area where the metal layer 120 will be formed with catalytic particles such as palladium (Pd) or forming other seed layers, immersing it in a solution containing Ni ions, and then reducing the Ni ions.

[0098] In another embodiment, the third external electrode 150 and the fourth external electrode 160 can be formed by electroless plating. Therefore, the third external electrode 150 and the fourth external electrode 160 can be uniformly and densely formed on the edge of the body 110' and on the fifth surface 5 and the sixth surface 6 of the body 110'. Furthermore, the third external electrode 150 and the fourth external electrode 160 can also be formed on the first surface 1 and the second surface 2 of the body 110'.

[0099] Furthermore, the third external electrode 150 and the fourth external electrode 160 can be formed by the same electroless plating method as the metal layer 120, but are not limited thereto.

[0100] As described above, according to the embodiments, a multilayer electronic assembly is provided, in which the problem of reduced sealing performance of the multilayer electronic assembly due to the thinness of the external electrodes coated to the edge of the body can be alleviated.

[0101] According to the embodiments, the problem of difficulty in forming a uniform substrate electrode layer when using conductive paste to form the substrate electrode layer of the external electrode by firing can be alleviated.

[0102] According to the embodiments, the problem of reduced sealing performance that may occur when a ground electrode is formed in a multilayer electronic assembly can be mitigated.

[0103] According to the embodiments, the problem that a process of applying conductive paste must be performed additionally when forming a ground electrode in a multilayer electronic assembly can be solved.

[0104] Although embodiments of the present disclosure have been described in detail above, the present disclosure is not limited to the above embodiments and drawings, but is intended to be limited by the appended claims. Therefore, various substitutions, modifications and alterations can be made by those skilled in the art without departing from the technical concept of the present disclosure described in the claims, and such substitutions, modifications and alterations also fall within the scope of the present disclosure.

[0105] Furthermore, the expression "embodiment (one embodiment)" as used in this disclosure does not refer to the same embodiment, but is provided to emphasize and explain the unique features of different embodiments. However, the embodiments presented above do not preclude implementation in combination with features of other embodiments. For example, matters described in a particular embodiment may be understood as descriptions related to other embodiments even if they are not described in other embodiments, unless there is a description in other embodiments that contradicts or contradicts that matter.

[0106] The terminology used in this disclosure is for describing embodiments only and is not intended to limit the disclosure. In this context, singular expressions include plural expressions unless the context clearly indicates otherwise.

[0107] While exemplary embodiments have been shown and described above, it will be readily understood by those skilled in the art that modifications and variations may be made without departing from the scope of this disclosure as defined by the appended claims.

Claims

1. A multilayer electronic component, comprising: The body includes a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a first direction. The body includes a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface opposite to each other in a second direction perpendicular to the first direction, and a fifth surface and a sixth surface opposite to each other in a third direction perpendicular to the first direction and the second direction. A metal layer is disposed on the edge connecting the first surface and the fifth surface, the edge connecting the first surface and the sixth surface, the edge connecting the second surface and the fifth surface, and the edge connecting the second surface and the sixth surface; A first external electrode is disposed on the third surface; as well as The second external electrode is disposed on the fourth surface. The metal layer includes nickel and at least one selected from the group consisting of phosphorus and boron.

2. The multilayer electronic component according to claim 1, wherein, The inner electrode includes a first inner electrode and a second inner electrode, one end of the first inner electrode in the second direction is in contact with the third surface, and one end of the second inner electrode in the second direction is in contact with the fourth surface.

3. The multilayer electronic component according to claim 1, wherein, The metal layer includes a first metal layer and a second metal layer, one end of the first metal layer in the second direction is in contact with the third surface, the second metal layer is spaced apart from the first metal layer in the second direction, and one end of the second metal layer in the second direction is in contact with the fourth surface.

4. The multilayer electronic component according to claim 1, wherein, When the length of the body in the second direction is L, and the length of the metal layer in the second direction between one end of the metal layer that is closer to the center of the body in the second direction and one of the third and fourth surfaces that is closer to the other end of the metal layer in the second direction is lp, lp / L satisfies greater than or equal to 0.05 and less than or equal to 0.

33.

5. The multilayer electronic component according to claim 1, wherein, When the thickness of the main body in the first direction is T and the thickness of the metal layer in the first direction is tp, tp / T satisfies less than or equal to 0.

04.

6. The multilayer electronic assembly according to claim 1, wherein, The first external electrode includes a first electrode layer in contact with the third surface and a first plating layer disposed on the first electrode layer, and the second external electrode includes a second electrode layer in contact with the fourth surface and a second plating layer disposed on the second electrode layer. The first electrode layer and the second electrode layer cover the metal layer.

7. The multilayer electronic assembly according to claim 1, wherein, The first external electrode includes a first electrode layer in contact with the third surface and a first plating layer disposed on the first electrode layer, and the second external electrode includes a second electrode layer in contact with the fourth surface and a second plating layer disposed on the second electrode layer. Wherein, when the maximum thickness of the first electrode layer or the second electrode layer is tmax and the minimum thickness of the first electrode layer or the second electrode layer is tmin, tmin / tmax is greater than or equal to 0.5 and less than or equal to 1.

0.

8. The multilayer electronic component according to claim 1, wherein, The metal layer extends into a portion of the third surface and / or a portion of the fourth surface.

9. The multilayer electronic component according to claim 1, wherein, The metal layer is spaced apart from the inner electrode.

10. The multilayer electronic assembly according to claim 1, further comprising a third external electrode disposed on the fifth surface and a fourth external electrode disposed on the sixth surface.

11. The multilayer electronic assembly according to claim 10, wherein, The internal electrode includes a first internal electrode, a second internal electrode, and a third internal electrode. One end of the first inner electrode in the second direction is in contact with the third surface, one end of the second inner electrode in the second direction is in contact with the fourth surface, and the first end of the third inner electrode in the third direction is in contact with the fifth surface and the second end in the third direction is in contact with the sixth surface.

12. The multilayer electronic assembly according to claim 10, wherein, The third and fourth external electrodes comprise nickel and at least one selected from the group consisting of phosphorus and boron.

13. The multilayer electronic assembly according to claim 10, wherein, The third and fourth external electrodes are without electroplating.

14. The multilayer electronic assembly according to claim 1, wherein, The metal layer is an electroless plating layer.

15. The multilayer electronic assembly according to claim 11, wherein, The third inner electrode is disposed between the first inner electrode and the second inner electrode.

16. The multilayer electronic assembly according to claim 2, wherein, A portion of the metal layer is stacked with the first inner electrode and the second inner electrode.

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