A protection chip packaging device for integrated circuits

Abstract

This invention relates to the field of wafer testing technology, specifically to a protective chip packaging device for integrated circuits. The device includes a base with an outer cover. Two sets of motorized slide rails A are mounted on the upper end of the base, and slide blocks are slidably connected to the outer sides of the two sets of motorized slide rails A. A fixed seat is mounted at the center of the upper end of each slide block. A sealing groove is mounted on the upper end of the base, and connecting pipes A for conveying hot gas are mounted on both sides of the sealing groove. A detection seat slides inside the sealing groove, and one end of the detection seat is electrically connected to a controller. This invention transmits vibration force to the chip through the slide block, enabling simultaneous testing of the chip under vibration, power-on, and thermal conditions. This simulates the vibration and stress scenarios under actual chip operating conditions, improving the accuracy of the test results. Simultaneously, through continuous tapping vibration, it detects stability issues such as poor contact or structural loosening caused by vibration when the chip is powered on in a hot state, further improving the accuracy of chip packaging testing.

Description

Technical Field

[0001] This invention relates to the field of wafer testing technology, specifically to a protective chip packaging device for integrated circuits. Background Technology

[0002] Integrated circuit protection chips, as key protective components inside electronic devices, are widely used in many fields such as industrial control, communication, and precision electronics. Their packaging quality and operational stability are directly related to the safety protection capability and service life of the entire circuit. Before leaving the factory, chips need to rely on dedicated packaging and testing equipment to complete multiple verification processes such as high temperature environment adaptation, structural shock resistance, electrical continuity and disconnection tolerance, and film sealing packaging, so as to ensure the reliability of the product under subsequent complex working conditions. Traditional equipment struggles to simulate the real-world conditions of chips under complex usage scenarios and external influencing factors. Consequently, it cannot simulate the actual stress and electrical environment experienced by chips during long-term service. This makes it difficult for test data to accurately reflect the subtle performance fluctuations and changes of chips under different complex environments, thus affecting the reference value of test results. Summary of the Invention

[0003] This invention transmits vibration force to the chip through a slide block, enabling the chip to be tested simultaneously under vibration, power-on, and thermal conditions. This simulates the vibration and stress scenarios under actual chip operating conditions, improving the accuracy of the test results. At the same time, through continuous tapping vibration, it detects stability issues such as poor contact or structural loosening caused by vibration when the chip is powered on in a hot state, thus improving the accuracy of chip packaging testing.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a protective chip packaging device for integrated circuits, comprising a base, an outer cover provided on the outside of the base, two sets of electric slide rails A mounted on the upper end of the base, a slide block slidably connected to the outside of the two sets of electric slide rails A, a fixed seat mounted at the center of the upper end of the slide block, a sealing groove mounted on the upper end of the base, a connecting pipe A for conveying hot gas mounted on both sides of the sealing groove, a detection seat slidably inside the sealing groove, a controller electrically connected to one end of the detection seat, two sets of reciprocating screws rotating inside the sealing groove, sliders driven by the reciprocating screws sliding on the outside of the two sets of reciprocating screws, a connecting rod rotatably connected to one side of each set of sliders, and multiple sets of protrusions fixedly connected to the upper end of the slide block, the connecting rod vibrating the slide block by contacting the protrusions during the sliding process; One end of one set of sliders is fixedly connected to an electrode plate A, and an electrode plate B is embedded in the inner wall of the sealing groove. Electrode plate A and electrode plate B are electrically connected, and electrode plate B is electrically connected to the controller. During the sliding process of the slider, electrode plate A and electrode plate B are intermittently in contact. An electric slide rail B is installed on the upper end of the base, and an adsorption plate slides on the lower end of the electric slide rail B. One end of the adsorption plate is connected to a fan. An air outlet groove is embedded inside the base, and the air outlet groove is connected to the inside of the sealing groove.

[0005] Preferably, baffles are fixedly connected to both sides of the slide, and distance sensors are installed inside the slide and at the upper end of the sealing groove. The two sets of distance sensors are located on the same plane, and one end of each set of connecting pipes A is connected to a hot air blower.

[0006] Preferably, an electric actuator A is installed at the upper end of the sealing groove, and the output end of the electric actuator A is connected to the detection seat.

[0007] Preferably, two sets of motors are installed on one side of the sealing groove, and the other ends of the two sets of reciprocating lead screws pass through the sealing groove and are connected to the output end of the motor.

[0008] Preferably, both sets of sliders are connected to two sets of reciprocating lead screw ball nut pairs, and both sets of sliders are slidably connected to the inner wall of the sealing groove.

[0009] Preferably, one end of each of the two sets of connecting rods is connected to a spring rod, and the other end of each of the two sets of spring rods is connected to a slider.

[0010] Preferably, multiple sets of protrusions are fixedly connected to both sides of the upper end of the sealing groove, and the multiple sets of protrusions are located on the same plane as the two sets of connecting rods.

[0011] Preferably, one side of the sealing groove is connected to a connecting pipe B, and the other end of the connecting pipe B passes through the base and is connected to the air outlet groove, which is installed at an angle inside the base.

[0012] Preferably, an electric push rod B is slidably connected inside the electric slide rail B, and the output end of the electric push rod B is connected to the adsorption plate.

[0013] Compared with the prior art, the beneficial effects of the present invention are: 1. This invention transmits vibration force to the chip through a slide block, enabling the chip to be tested simultaneously under vibration, power-on, and thermal conditions. This simulates the vibration and stress scenarios under actual chip operating conditions, improving the accuracy of the test results. At the same time, through continuous tapping vibration, it detects stability issues such as poor contact or structural loosening caused by vibration when the chip is powered on in a hot state, thus improving the accuracy of chip packaging testing.

[0014] 2. This invention uses intermittent power outages to disconnect the probe from the chip contacts, simulating the phenomenon of power switching or momentary power failure in actual use. It accurately detects the voltage stability and resistance to momentary power failure during the power switching process, providing a more comprehensive test of the chip's stability. Furthermore, it works synergistically with power switching and vibration detection, further mimicking the complex operating conditions of chips in real-world applications, thus improving the comprehensiveness and accuracy of packaging testing.

[0015] 3. This invention utilizes the combined effect of oblique hot airflow and the suction force of the exhaust fan to automatically smooth the encapsulation film at the lower end of the suction plate, preventing defects such as bubbles or wrinkles from forming when the encapsulation film is bonded to the chip. This improves the flatness and aesthetics of the encapsulation surface. At the same time, the hot airflow acts on the contact surface between the encapsulation film and the chip, which softens the adhesive layer of the encapsulation film, enhances the fluidity and adhesion of the adhesive layer, and makes the encapsulation film and the chip adhere more tightly, improving the sealing performance and bonding strength of the encapsulation, and preventing the chip from getting damp or oxidized. Attached Figure Description

[0016] Figure 1 This is one of the overall structural schematic diagrams of the present invention; Figure 2 This is a second schematic diagram of the overall structure of the present invention; Figure 3 The third schematic diagram of the overall structure of the present invention; Figure 4 This is one of the internal structural diagrams of the sealing groove of the present invention; Figure 5 This is the second internal structural diagram of the sealing groove of the present invention; Figure 6 This is one of the partial structural cross-sectional views of the present invention; Figure 7 This is a second partial structural cross-sectional view of the present invention.

[0017] In the diagram: 1. Base; 2. Outer cover; 3. Sealing groove; 4. Electric slide rail A; 5. Slide seat; 6. Baffle; 7. Fixed seat; 8. Distance sensor; 9. Motor; 10. Reciprocating lead screw; 11. Slider; 12. Spring rod; 13. Connecting rod; 14. Protrusion; 15. Connecting pipe A; 16. Electrode plate A; 17. Electrode plate B; 18. Controller; 19. Electric push rod A; 20. Detection seat; 21. Connecting pipe B; 22. Electric slide rail B; 23. Electric push rod B; 24. Adsorption plate; 25. Air outlet groove. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0019] Reference Figures 1 to 7 This invention provides a protective chip packaging device for integrated circuits, including a base 1, an outer cover 2 on the outside of the base 1, two sets of electric slide rails A4 mounted on the upper end of the base 1, a slide block 5 slidably connected to the outside of the two sets of electric slide rails A4, a fixed seat 7 mounted at the center of the upper end of the slide block 5, a sealing groove 3 mounted on the upper end of the base 1, connecting pipes A15 for conveying hot gas mounted on both sides of the sealing groove 3, a detection seat 20 sliding inside the sealing groove 3, a controller 18 electrically connected to one end of the detection seat 20, two sets of reciprocating screws 10 rotating inside the sealing groove 3, sliders 11 driven by the reciprocating screws 10 sliding on the outside of the two sets of reciprocating screws 10, a connecting rod 13 rotatably connected to one side of each of the two sets of sliders 11, and multiple sets of protrusions 14 fixedly connected to the upper end of the slide block 5. During the sliding process, the connecting rod 13 vibrates the slide block 5 by contacting the protrusions 14. One end of one set of sliders 11 is fixedly connected to an electrode plate A16, and an electrode plate B17 is embedded in the inner wall of the sealing groove 3. Electrode plate A16 and electrode plate B17 are electrically connected, and electrode plate B17 is electrically connected to the controller 18. During the sliding process of slider 11, electrode plate A16 and electrode plate B17 are in intermittent contact. An electric slide rail B22 is installed on the upper end of the base 1, and an adsorption plate 24 slides on the lower end of the electric slide rail B22. One end of the adsorption plate 24 is connected to the exhaust fan. An air outlet groove 25 is embedded inside the base 1, and the air outlet groove 25 is connected to the inside of the sealing groove 3.

[0020] In an optional embodiment, baffles 6 are fixedly connected to both sides of the slide 5, and distance sensors 8 are installed inside the slide 5 and the upper part of the sealing groove 3. The two sets of distance sensors 8 are located on the same plane, and one end of each set of connecting pipes A15 is connected to a hot air blower. When using the device, the operator places the chip to be packaged inside the fixing seat 7 and fixes it. After fixing the chip, the operator then uses two sets of electric slide rails A4 to transport the slide 5 into the sealing groove 3. When the slide 5 enters the sealing groove 3 and the two sets of distance sensors 8 are on the same vertical plane, the slide 5 will stop sliding. When the slide 5 stops sliding, the two sets of baffles 6 will seal the two sides of the sealing groove 3. At this time, the two sets of hot air blowers will start simultaneously. When the hot air blowers start, they will deliver hot air into the sealing groove 3 through the two sets of connecting pipes A15, thereby raising the temperature inside the sealing groove 3.

[0021] In an optional embodiment, an electric actuator A19 is installed at the upper end of the sealing groove 3, and the output end of the electric actuator A19 is connected to the detection seat 20; As described above, after the slide 5 stops, the detection seat 20 and the fixed seat 7 will be on the same vertical plane. At this time, the electric push rod A19 will drive the detection seat 20 to descend and contact the chip. One end of the detection seat 20 is equipped with a probe. When the detection seat 20 descends and contacts the chip, the probe will contact the chip contacts. After the probe contacts the chip, the controller 18 will supply power to the detection seat 20, which will then work with the hot air entering the sealing groove 3 to raise the temperature inside the sealing groove 3, thereby detecting the stability of the chip when powered on in a hot environment.

[0022] In an optional embodiment, two sets of motors 9 are installed on one side of the sealing groove 3, and the other ends of the two sets of reciprocating lead screws 10 pass through the sealing groove 3 and are connected to the output end of the motors 9. As described above, when the slide 5 stops, the two sets of motors 9 will synchronously drive the two sets of reciprocating lead screws 10 to rotate.

[0023] In an optional embodiment, both sets of sliders 11 are connected to two sets of ball nut pairs of reciprocating screws 10, and both sets of sliders 11 are slidably connected to the inner wall of the sealing groove 3. When the two sets of reciprocating lead screws 10 rotate, the two sets of reciprocating lead screws 10 will drive the two sets of sliders 11 to move back and forth along the inner wall of the sealing groove 3.

[0024] In an optional embodiment, one end of each of the two sets of connecting rods 13 is connected to a spring rod 12, and the other end of each of the two sets of spring rods 12 is connected to a slider 11. When slider 11 moves back and forth, slider 11 will drive connecting rod 13 to move synchronously through spring rod 12.

[0025] In an optional embodiment, multiple sets of protrusions 14 are fixedly connected to both sides of the upper end of the sealing groove 3, and the multiple sets of protrusions 14 are all located on the same plane as the two sets of connecting rods 13. As described above, when the connecting rod 13 moves, it will contact the protrusion 14. When the connecting rod 13 contacts the protrusion 14, it will flip through the spring rod 12. As the slider 11 continues to move, the connecting rod 13 will disengage from the base 1. At this time, the connecting rod 13 will quickly return to its original position due to the force of the spring rod 12. When the spring rod 12 quickly returns to its original position, it will contact the protrusion 14 again, thereby generating a knocking vibration on the protrusion 14. The protrusion 14 will transmit the vibration force to the slide block 5. When force is applied to the slide 5, the slide 5 will simultaneously generate a tapping vibration on the chip, thereby detecting the stability of the chip when it is powered on in a hot environment and subjected to vibration. The vibration force is transmitted to the chip through the slide 5, so that the chip is tested synchronously with vibration, power-on and thermal environment, simulating the vibration and stress scenario under the actual working conditions of the chip, improving the accuracy of the test results. At the same time, through continuous tapping vibration, the stability problems such as poor contact or loose structure caused by vibration when the chip is powered on in a hot state are detected, thus improving the accuracy of chip packaging test. Simultaneously, when one set of sliders 11 moves to the other end inside the sealing groove 3, electrode A16 will contact electrode B17. When electrode A16 contacts electrode B17, electrode B17 will de-energize the detection socket 20 through controller 18. When electrode A16 and electrode B17 disengage, controller 18 will restore power supply to the detection socket 20. Thus, during chip testing, the detection socket 20 will intermittently de-energize, causing the probe at one end of the detection socket 20 to cancel power supply to the chip contacts. This intermittent power de-energization simulates the phenomenon of power switching or instantaneous power failure in actual use, accurately detecting the voltage stability and resistance to instantaneous power failure impact of the chip during power switching, and more comprehensively detecting the stability of the chip. At the same time, the combination of power switching action and vibration detection forms a synergistic effect, further closely reflecting the complex working conditions of the chip in actual use scenarios, and improving the comprehensiveness and accuracy of packaging testing.

[0026] In an optional embodiment, a connecting pipe B21 is connected to one side of the sealing groove 3, and the other end of the connecting pipe B21 passes through the base 1 and is connected to the air outlet groove 25. The air outlet groove 25 is installed at an angle inside the base 1. Because the openings on both sides of the sealing groove 3 are blocked by two sets of baffles 6, as hot air continues to enter the sealing groove 3, the hot air will enter the connecting pipe B21 through the increased air pressure inside the sealing groove 3. After the hot air enters the connecting pipe B21, the connecting pipe B21 will transport the hot air to the air outlet groove 25 and spray it out. Because the air outlet groove 25 is installed at an angle, when the hot air is sprayed out of the air outlet groove 25, the airflow will be sprayed out at an angle upward.

[0027] In an optional embodiment, an electric push rod B23 is slidably connected inside the electric slide rail B22, and the output end of the electric push rod B23 is connected to the adsorption plate 24. After chip testing is complete, the electric push rod B23 slides inside the electric slide rail B22, and the encapsulation film is adsorbed onto the lower end of the adsorption plate 24 by the suction force of the fan. At this time, in conjunction with the upward-sloping hot airflow, the hot airflow will generate a counter-pushing force on the encapsulation film, thereby automatically smoothing the encapsulation film at the lower end of the adsorption plate 24 by the pushing force of the hot air and the adsorption force of the fan, preventing air bubbles and wrinkles from forming when the encapsulation film adheres to the chip surface. At the same time, when the hot airflow acts on the contact surface between the encapsulation film and the chip, the hot airflow will soften the encapsulation film. The adhesive layer makes the encapsulation film adhere more firmly to the chip. Through the combined action of the oblique hot airflow and the suction force of the exhaust fan, the encapsulation film can be automatically smoothed at the lower end of the suction plate 24, preventing defects such as bubbles or wrinkles when the encapsulation film is attached to the chip, improving the flatness and aesthetics of the encapsulation surface. At the same time, the hot airflow acts on the contact surface between the encapsulation film and the chip, which can soften the adhesive layer of the encapsulation film, enhance the fluidity and adhesion of the adhesive layer, make the encapsulation film and the chip adhere more tightly, improve the sealing performance and bonding strength of the encapsulation, and prevent the chip from getting damp or oxidized.

[0028] Working principle: When using the device, the operator places the chip to be packaged inside the fixing seat 7 and fixes it. After fixing the chip, the operator then uses two sets of electric slide rails A4 to transport the slide 5 into the sealing groove 3. When the slide 5 enters the sealing groove 3 and the two sets of distance sensors 8 are on the same vertical plane, the slide 5 will stop sliding. When the slide 5 stops sliding, the two sets of baffles 6 will seal the two sides of the sealing groove 3. At this time, the two sets of hot air blowers will start simultaneously. When the hot air blowers start, they will deliver hot air into the sealing groove 3 through two sets of connecting pipes A15, thereby raising the temperature inside the sealing groove 3. When the slide block 5 stops, the two sets of motors 9 will synchronously drive the two sets of reciprocating screws 10 to rotate. When the two sets of reciprocating screws 10 rotate, they will drive the two sets of sliders 11 to reciprocate along the inner wall of the sealing groove 3. When the sliders 11 reciprocate, they will synchronously drive the connecting rod 13 to move via the spring rod 12. When the connecting rod 13 moves, it will contact the protrusion 14. When the connecting rod 13 contacts the protrusion 14, it will flip via the spring rod 12. As the slider 11 continues to move, the connecting rod 13 will disengage from the base 1. Then, the connecting rod 13 will quickly reset under the force of the spring rod 12. When the spring rod 12 resets quickly, it will re-engage with the bump 14, thereby generating a knocking vibration on the bump 14. The bump 14 will transmit the vibration force to the slide block 5. When the vibration force acts on the slide block 5, the slide block 5 will synchronously generate a knocking vibration on the chip, thereby detecting the stability of the chip when it is subjected to vibration while powered on in a hot environment. When one of the sliders 11 moves to the other end inside the sealing groove 3, electrode A16 will contact electrode B17. When electrode A16 contacts electrode B17, electrode B17 will de-energize the detection seat 20 through controller 18. When electrode A16 and electrode B17 lose contact, controller 18 will restore power supply to the detection seat 20. Thus, when detecting the chip, the detection seat 20 will be intermittently de-energized, causing the probe at one end of the detection seat 20 to cancel power supply to the chip contacts. Because the openings on both sides of the sealing groove 3 are blocked by two sets of baffles 6, as hot air continues to enter the sealing groove 3, the hot air will enter the connecting pipe B21 through the increased air pressure inside the sealing groove 3. After the hot air enters the connecting pipe B21, the connecting pipe B21 will transport the hot air to the air outlet 25 and spray it out. Since the air outlet 25 is installed at an angle, when the hot air is sprayed out of the air outlet 25, the airflow will be sprayed out at an angle upward. When the chip detection is completed, the electric push rod B23 will slide inside the electric slide rail B22 and adsorb the encapsulation film onto the lower end of the adsorption plate 24 by the suction force of the fan. At this time, in conjunction with the upward hot airflow, the hot airflow will generate a counter-pushing force on the encapsulation film, thereby causing the encapsulation film to be automatically smoothed at the lower end of the adsorption plate 24 by the pushing force of the hot air and the adsorption force of the fan, preventing air bubbles and wrinkles from being generated when the encapsulation film is attached to the chip surface. At the same time, when the hot airflow acts on the contact surface between the encapsulation film and the chip, the hot airflow will soften the adhesive layer of the encapsulation film.

[0029] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A protective chip packaging device for integrated circuits, comprising a base (1), characterized in that: An outer cover (2) is provided on the outside of the base (1). Two sets of electric slide rails A (4) are installed on the upper end of the base (1). Slide seats (5) are slidably connected to the outside of the two sets of electric slide rails A (4). A fixed seat (7) is installed at the center of the upper end of the slide seat (5). A sealing groove (3) is installed on the upper end of the base (1). A connecting pipe A (15) for conveying hot air is installed on both sides of the sealing groove (3). A detection seat (20) slides inside the sealing groove (3). One end is electrically connected to a controller (18). Inside the sealing groove (3), there are two sets of reciprocating screws (10). On the outside of the two sets of reciprocating screws (10), there are sliders (11) driven by the reciprocating screws (10). On one side of the two sets of sliders (11), there are connecting rods (13). The upper end of the slide (5) is fixedly connected to multiple sets of protrusions (14). During the sliding process, the connecting rods (13) vibrate the slide (5) by contacting the protrusions (14). One end of one of the sliders (11) is fixedly connected to an electrode plate A (16), and an electrode plate B (17) is embedded in the inner wall of the sealing groove (3). The electrode plate A (16) and the electrode plate B (17) are electrically connected, and the electrode plate B (17) is electrically connected to the controller (18). During the sliding process, the slider (11) causes the electrode plate A (16) and the electrode plate B (17) to come into intermittent contact. An electric slide rail B (22) is installed on the upper end of the base (1), and an adsorption plate (24) slides on the lower end of the electric slide rail B (22). One end of the adsorption plate (24) is connected to the exhaust fan. An air outlet groove (25) is embedded inside the base (1), and the air outlet groove (25) is connected to the sealing groove (3).

2. The protective chip packaging equipment for integrated circuits according to claim 1, characterized in that, Both sides of the slide (5) are fixedly connected with baffles (6). Both the inside of the slide (5) and the upper end of the sealing groove (3) are equipped with distance sensors (8), and the two sets of distance sensors (8) are located on the same plane. One end of both sets of connecting pipes A (15) is connected to the hot air blower.

3. The protective chip packaging equipment for integrated circuits according to claim 2, characterized in that, An electric actuator A (19) is installed at the upper end of the sealing groove (3), and the output end of the electric actuator A (19) is connected to the detection seat (20).

4. The protective chip packaging equipment for integrated circuits according to claim 1, characterized in that, Two sets of motors (9) are installed on one side of the sealing groove (3), and the other ends of the two sets of reciprocating screws (10) pass through the sealing groove (3) and are connected to the output end of the motors (9).

5. The protective chip packaging equipment for integrated circuits according to claim 1, characterized in that, Both sets of sliders (11) are connected to the ball nut pairs of the two sets of reciprocating screws (10), and both sets of sliders (11) are slidably connected to the inner wall of the sealing groove (3).

6. The protective chip packaging equipment for integrated circuits according to claim 1, characterized in that, One end of each of the two sets of connecting rods (13) is connected to a spring rod (12), and the other end of each of the two sets of spring rods (12) is connected to a slider (11).

7. The protective chip packaging equipment for integrated circuits according to claim 1, characterized in that, Multiple sets of protrusions (14) are fixedly connected to both sides of the upper end of the sealing groove (3), and the multiple sets of protrusions (14) are all located on the same plane as the two sets of connecting rods (13).

8. The protective chip packaging equipment for integrated circuits according to claim 1, characterized in that, One side of the sealing groove (3) is connected to a connecting pipe B (21), and the other end of the connecting pipe B (21) passes through the base (1) and is connected to the air outlet groove (25). The air outlet groove (25) is installed obliquely inside the base (1).

9. The protective chip packaging equipment for integrated circuits according to claim 1, characterized in that, The electric slide rail B (22) is internally connected to an electric push rod B (23), and the output end of the electric push rod B (23) is connected to the adsorption plate (24).

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