Precursor pipeline and thin film deposition system
By installing a flow regulating device in the precursor pipeline, the problems of difficult needle valve regulation and pressure deviation risk are solved, achieving higher flow limiting capability and better sealing performance, thus improving the process effect of the thin film deposition system.
Patent Information
- Application Number
- CN202411999731.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2026-06-30
AI Technical Summary
In the existing technology, the needle valve of the precursor pipeline is difficult to adjust and there is a risk of pressure deviation, making it difficult to meet the flow restriction requirements of high vapor pressure.
A flow regulating device is installed between the inlet end of the precursor pipeline and the needle valve. The device includes a main body, a tubular joint, a locking nut, a stepped seal, and a sealing ring, forming a nested sealing structure to reduce the pressure of the precursor when it reaches the needle valve and improve the opening degree and sealing performance of the needle valve.
This reduces the difficulty of adjusting the needle valve and the risk of pressure deviation, while improving the control difficulty and process effect of the thin film deposition system.