Solid-state light source device, projection apparatus, and method for assembling solid-state light source device

Abstract

This application discloses a solid-state light source device, a projection device, and an assembly method for the solid-state light source device. The solid-state light source device includes a liquid cooler and a light source module. The liquid cooler includes a chamber, a liquid inlet, and a liquid outlet. An opening is formed on the top surface of the chamber. The liquid inlet is located on one side wall of the chamber, and the liquid outlet is located on the other side wall of the chamber. The light source module is disposed on the top surface of the liquid cooler and covers the opening. Through the opening, the light source module can directly contact the liquid in the chamber, allowing the heat generated by the light source module to be carried away by the liquid, thus improving the heat dissipation efficiency of the solid-state light source device.

Description

Technical Field

[0001] This application relates to the technical field of a light source device, and more particularly to a solid-state light source device, a projection device having a solid-state light source device, and a method for assembling the solid-state light source device. Background Technology

[0002] When using a projector, the user moves the projector to adjust the size or shape of the projected image so that the projected image is rectangular and fits the size of the environment, making it easier for viewers to view the projected image.

[0003] However, when using an ultra-short-throw projector, if the user wants to adjust the projected image, the short distance between the projected image and the user, and the large size of the projected image, mean that the user must move away from the projected image and the projector each time they need to make an adjustment. The user can then check whether the projected image is level by looking at the projected image. If the projected image is not level, the user must move closer to the projector to make the adjustment, and then move away from the projector again to check if the projected image is level. Thus, if the user wants to make the projected image level, they must move away from the projector and move closer to the projector multiple times, which makes the operation inconvenient and time-consuming.

[0004] Therefore, there is indeed a need to provide further improvements to the existing technology.

[0005] The "Background Art" paragraph is only used to help understand the content of this invention. Therefore, the content disclosed in the "Background Art" paragraph may include some known technologies that are not known to those skilled in the art. The content disclosed in the "Background Art" paragraph does not represent that the content or the problems to be solved by one or more embodiments of this invention were known or recognized by those skilled in the art prior to this application. Summary of the Invention

[0006] In view of the shortcomings of the prior art, the main objective of this invention is to design a solid-state light source device with a liquid cooler to reduce the impact of the metal plate on heat dissipation, thereby improving heat dissipation efficiency and reducing manufacturing costs.

[0007] Other objects and advantages of the present invention can be further understood from the technical features disclosed herein.

[0008] To achieve one or more of the above-mentioned objectives, or other objectives, an embodiment of the present invention provides a solid-state light source device comprising: a liquid cooler and a light source module. The liquid cooler includes: a chamber, a liquid inlet, and a liquid outlet. An opening is formed on the top surface of the chamber. The liquid inlet is located on a side wall of the chamber. The liquid outlet is located on the other side wall of the chamber. The light source module is disposed on the top surface of the liquid cooler, and the light source module covers the opening.

[0009] In one embodiment of this disclosure, the liquid cooler further includes a groove that is disposed adjacent to the opening and recessed downward along the outer periphery of the opening.

[0010] In one embodiment of this disclosure, a portion of the bottom surface of the light source module is located on a groove.

[0011] In one embodiment disclosed herein, the light source module includes: a light source assembly, an elastic member, a plate, and a circuit board. The elastic member is disposed at the bottom of the light source assembly, and a portion of the elastic member contacts a portion of the bottom surface of the light source assembly. The plate is located on the top surface of the liquid cooler and the elastic member, and is configured to expose a portion of the light source assembly. The circuit board is located on the top surface of the liquid cooler and the plate, and is configured to expose a portion of the plate and a portion of the light source assembly.

[0012] In one embodiment of this disclosure, the light source assembly includes: a plurality of light-emitting elements, a heat-conducting plate, and a plurality of electrical connecting wires. The plurality of light-emitting elements are disposed within the heat-conducting plate. The heat-conducting plate includes: a first connecting member and a second connecting member. The first connecting member extends outward from the front sidewall of the heat-conducting plate and near its bottom surface. The second connecting member extends outward from the rear sidewall of the heat-conducting plate and near its bottom surface. The plurality of electrical connecting wires are respectively connected to the plurality of light-emitting elements and pass through the heat-conducting plate.

[0013] In one embodiment disclosed herein, the elastic member includes a first top surface, a side surface, a first bottom surface, and an extension surface. The first top surface faces and contacts both the first connector and the second connector. The side surface surrounds the light source assembly. The first bottom surface is connected to the side surface. The extension surface extends outward from the outer side of the side surface, and the extension surface and the first bottom surface are stepped.

[0014] In one embodiment of this disclosure, a first top surface is disposed above the first connector and the second connector.

[0015] In one embodiment of this disclosure, the first bottom surface is located above the groove, and the bottom surface of the extended surface is located on a portion of the top surface of the liquid cooler.

[0016] In one embodiment of this disclosure, the elastic member further includes a first rib and a second rib. The first rib extends downward from the bottom surface of the first bottom surface and is annular. The second rib extends downward from the bottom surface of the extension surface and is annular.

[0017] In one embodiment of this disclosure, the plate surrounds the light source assembly and has a first through-hole, and the plate also includes a notch formed by flaring outward from the first through-hole.

[0018] In one embodiment of this disclosure, a circuit board surrounds a light source assembly, and the circuit board has two protrusions. The two protrusions have a plurality of side grooves, which are spaced apart.

[0019] To achieve one or more of the above-mentioned objectives, or other objectives, an embodiment of the present invention provides a projection device comprising: the aforementioned solid-state light source device, an optical engine module, and a projection lens. The optical engine module is configured to receive the light beam emitted by the light source module and convert it into an image beam. The projection lens is configured in the transmission path of the image beam to project the image beam.

[0020] To achieve one or more of the above-mentioned objectives, or other objectives, an embodiment of the present invention provides a method for assembling a solid-state light source device, comprising the following steps: providing a light source assembly and an elastic member; fitting the elastic member onto the bottom of the light source assembly; providing a liquid cooler, wherein the liquid cooler includes a chamber, a liquid inlet, and a liquid outlet; the top surface of the chamber has an opening, and the liquid inlet and liquid outlet are located on the side walls of the chamber; covering the opening with the bottom surface of the light source assembly with the elastic member fitted; providing a plate; placing the plate on the light source assembly and liquid cooler with the elastic member fitted, with a portion of the light source assembly exposed on the plate; providing a circuit board; placing the circuit board on the plate and liquid cooler, with a portion of the light source assembly with the elastic member fitted and a portion of the plate exposed on the circuit board; and translating the circuit board to a soldering position.

[0021] In one embodiment of this disclosure, the method further includes: securing the plate to the liquid cooler with a plurality of screws, and securing the plate and the light source assembly with the elastic element attached to the liquid cooler with a plurality of screws.

[0022] In one embodiment of this disclosure, the method further includes securing the circuit board to the liquid cooler using a plurality of screws.

[0023] By using the aforementioned solid-state light source device, projection equipment, and assembly method, the light source module can directly contact the liquid inside the chamber through the opening, eliminating the need for indirect heat dissipation through the top surface of the liquid cooler, thus improving heat dissipation efficiency. Furthermore, the bottom surface of the light source module is not limited by the flatness of the contact surface, still achieving a good heat dissipation effect, thereby reducing manufacturing costs. Attached Figure Description

[0024] Figure 1 This is a three-dimensional schematic diagram of the solid-state light source device of the present invention.

[0025] Figure 2 This is a top view schematic diagram of the solid-state light source device of the present invention.

[0026] Figure 3 This is an exploded view of the solid-state light source device of the present invention.

[0027] Figure 4 yes Figure 2 A schematic diagram of the cross section A-A'.

[0028] Figure 5 yes Figure 2 A schematic diagram of the cross section B-B'.

[0029] Figure 6 This is a block diagram of the projection device of the present invention.

[0030] Figure 7 This is a flowchart of the assembly method of the solid-state light source device of the present invention.

[0031] Figure 8 This is another flowchart of the assembly method of the solid-state light source device of the present invention.

[0032] Figure 9 This is another flowchart of the assembly method of the solid-state light source device of the present invention.

[0033] Figure 10 This is a schematic diagram of the combination of the light source assembly and the elastic element of the present invention.

[0034] Figure 11 This is a schematic diagram of the combination of the various components of the present invention.

[0035] Figure 12 This is another schematic diagram showing a combination of the components of the present invention.

[0036] Figure 13 This is a top view schematic diagram of the assembled circuit board of the present invention.

[0037] Figure 14 This is a schematic diagram illustrating the translation of the circuit board according to the present invention.

[0038] Explanation of reference numerals in the attached figures:

[0039] 1: Solid-state light source device;

[0040] 10: Liquid cooler;

[0041] 11: Chamber;

[0042] 111: Opening;

[0043] 12: Liquid inlet;

[0044] 13: Liquid outlet;

[0045] 14: Groove;

[0046] 20: Light source module;

[0047] 21: Light source assembly;

[0048] 210: Light-emitting components;

[0049] 211: Lens array;

[0050] 212: Heat-conducting plate body;

[0051] 2121: First mating component;

[0052] 2122: Second mating component;

[0053] 2123: Electrical connection wire;

[0054] 22: Elastic element;

[0055] 221: First top surface;

[0056] 222: Side view;

[0057] 223: First base surface;

[0058] 224: Extended surface;

[0059] 225: Opening;

[0060] 226: First prominent rib;

[0061] 227: Second rib;

[0062] 23: Parts;

[0063] 231: Front stepped surface;

[0064] 232: Back stepped surface;

[0065] 233: Notch;

[0066] 234: First penetration;

[0067] 24: Circuit board;

[0068] 241: Second penetration;

[0069] 242: convex part;

[0070] 2421: Side groove;

[0071] 30: Projection equipment;

[0072] 31: Optomechanical module;

[0073] 32: Projection lens. Detailed Implementation

[0074] The foregoing and other technical contents, features, and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as up, down, left, right, front, or back, are merely for reference to the accompanying drawings. Therefore, the directional terms used are for illustrative purposes and not for limiting the present invention.

[0075] Figure 1 This is a three-dimensional schematic diagram of the solid-state light source device of the present invention. Figure 1 As shown, the solid-state light source device 1 includes a liquid cooler 10 and a light source module 20. The light source module 20 is fixed to the liquid cooler 10, and the light source module 20 is located on the top surface of the liquid cooler 10, so that the bottom surface of the light source module 20 can contact the liquid inside the liquid cooler 10, and heat is dissipated from the light source module 20 through the flowing liquid. In this embodiment, the liquid inside the liquid cooler 10 can be water or other cooling liquid. A first direction X, a second direction Y, and a third direction Z are defined, wherein the first direction X, the second direction Y, and the third direction Z are perpendicular to each other.

[0076] Specifically Figure 2 This is a top view schematic diagram of the solid-state light source device of the present invention. Figure 3 This is an exploded view of the solid-state light source device of the present invention. Figure 4 yes Figure 2 A schematic diagram of the cross section A-A'. Figure 5 yes Figure 2 The diagram shows a cross-sectional view along line B-B'. Line A-A' is a cross-section along the liquid inlet and outlet of the solid-state light source device 1 of the present invention, while line B-B' is a cross-section along the side of the liquid cooler 10 where there are no liquid inlet and outlet. Figure 2 , Figure 3 , Figure 4 and Figure 5As shown, the liquid cooler 10 includes a chamber 11, a liquid inlet 12, and a liquid outlet 13. The chamber 11 is located inside the liquid cooler 10, and the liquid cooler 10 has an opening 111 formed on the top surface of the chamber 11. The liquid inlet 12 is located on one side wall of the chamber 11, while the liquid outlet 13 is located on the other side wall of the chamber 11. Specifically, the liquid inlet 12 and the liquid outlet 13 are disposed on opposite side walls, and liquid can flow into the chamber 11 from the liquid inlet 12 and leave the chamber 11 from the liquid outlet 13. The light source module 20 is disposed on the top surface of the liquid cooler 10, and the bottom surface of the light source module 20 covers the opening 111 of the liquid cooler 10. The bottom surface of the light source module 20 is larger than the diameter of the opening 111. Liquid flows into the chamber 11 from the liquid inlet 12, allowing the liquid to contact the bottom surface of the light source module 20 through the opening 111. The liquid carries away the heat generated by the light source module 20, and the heated liquid can further flow from the chamber 11 through the liquid outlet 13 to the outside of the liquid cooler 10. In this way, the light source module 20 can achieve the effect of heat dissipation.

[0077] In one embodiment, such as Figure 3 , Figure 4 and Figure 5 As shown, the liquid cooler 10 also includes a groove 14. The groove 14 is disposed adjacent to the opening 111, and the groove 14 is disposed along the outer periphery of the opening 111 and recessed downward from the top surface of the liquid cooler 10. In other words, the groove 14 surrounds the outer periphery of the opening 111.

[0078] In one embodiment, a portion of the bottom surface of the light source module 20 is located on the groove 14.

[0079] In an embodiment, such as Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown, the light source module 20 includes a light source assembly 21, an elastic member 22, a plate 23, and a circuit board 24. The elastic member 22 is disposed at the bottom of the light source assembly 21, and a portion of the elastic member 22 contacts a portion of the bottom surface of the light source assembly 21. The plate 23 is located on the top surface of the liquid cooler 10 and on the elastic member 22, and the plate 23 is configured to expose a portion of the light source assembly 21. The circuit board 24 is located on the top surface of the liquid cooler 10 and on the plate 23, and the circuit board 24 is configured to expose portions of both the light source assembly 21 and the plate 23.

[0080] In detail, refer to Figure 2The light source assembly 21 includes multiple light-emitting elements 210, a lens array 211, and a heat-conducting plate 212. The light-emitting elements 210 are covered by the lens array 211 and are disposed within the heat-conducting plate 212. The light-emitting elements 210 contact the heat-conducting plate 212, and the heat-conducting plate 212 provides heat dissipation for the light-emitting elements 210. The light source assembly 21 also includes multiple electrical connection lines 2123, with each of the multiple light-emitting elements 210 connected to a different electrical connection line 2123, and the multiple electrical connection lines 2123 passing through the heat-conducting plate 212. Specifically, the heat-conducting plate 212 includes a first connecting member 2121 and a second connecting member 2122. (Reference) Figure 5 The first connector 2121 extends outward from the front sidewall of the heat-conducting plate 212 near the bottom surface of the heat-conducting plate 212, and is perpendicularly adjacent to the front sidewall of the heat-conducting plate 212. The second connector 2122 extends outward from the rear sidewall of the heat-conducting plate 212 near the bottom surface of the heat-conducting plate 212, and is perpendicularly adjacent to the rear sidewall of the heat-conducting plate 212. Specifically, in the second direction Y, the first connector 2121 and the second connector 2122 extend from the front and rear sidewalls of the heat-conducting plate 212, respectively. In the first direction X, the electrical connection line 2123 extends outward from the sidewall of the heat-conducting plate 212. In this embodiment, the light-emitting element 210 is a solid-state light source, such as a laser diode or a light-emitting diode, and is used to emit a light beam. The heat-conducting plate 212 can be made of metal, such as copper.

[0081] In one embodiment, the elastic member 22 includes a first top surface 221, a side surface 222, a first bottom surface 223, and an extension surface 224. The first top surface 221 faces and contacts the first coupling member 2121 and the second coupling member 2122. The side surface 222 surrounds the light source assembly 21. The first bottom surface 223 is connected to the side surface 222. The extension surface 224 extends outward from the outside of the side surface 222, and the extension surface 224 and the first bottom surface 223 are stepped. Specifically, the elastic member 22 also has a through-hole 225, which is configured to accommodate the light source assembly 21. The first top surface 221 is disposed above the first coupling member 2121 and the second coupling member 2122. A stepped shape is formed between the extension surface 224 and the first bottom surface 223. In this embodiment, a portion of the first coupling member 2121 and a portion of the second coupling member 2122 are housed within the first top surface 221, the side surface 222, and the first bottom surface 223. The first bottom surface 223 is located above the groove 14, and the bottom surface of the extension surface 224 is located on a portion of the top surface of the liquid cooler 10. Thus, the stepped structure formed by the first bottom surface 223 and the extension surface 224 corresponds tightly to the groove 14 and the top surface of the liquid cooler 10, preventing liquid leakage from the chamber 11. In this embodiment, the elastic member 22 can be made of rubber.

[0082] In one embodiment, the elastic member 22 further includes a first protruding rib 226 and a second protruding rib 227. The first protruding rib 226 is located at the middle of the bottom surface near the first bottom surface 223 and protrudes downward from the bottom surface of the first bottom surface 223; moreover, the first protruding rib 226 is annular. The second protruding rib 227 is located on the extension surface 224 near the side surface 222 and protrudes downward from the bottom surface of the extension surface 224; moreover, the second protruding rib 227 is annular. The arrangement of the first protruding rib 226 and the second protruding rib 227 allows for the addition of two closed rings between the light source module 20 and the top surface of the liquid cooler 10, thus preventing liquid from flowing out through the gap between the top surface of the light source module 20 and the liquid cooler 10. In this embodiment, the first protruding rib 226 and the second protruding rib 227 are integrally formed with the elastic member 22; therefore, the first protruding rib 226 and the second protruding rib 227 are also made of rubber.

[0083] In one embodiment, a plate 23 surrounds a light source assembly 21. The plate 23 has a first through-hole 234 configured to accommodate the light source assembly 21. A front stepped surface 231 of the plate 23 corresponds to a first coupling 2121, and a rear stepped surface 232 of the plate 23 corresponds to a second coupling 2122. The plate 23 also includes a notch 233 formed by flaring outwards from the first through-hole 234. The plate 23 is, for example, made of metal, such as aluminum or stainless steel.

[0084] In one embodiment, a circuit board 24 surrounds a light source assembly 21. The circuit board 24 has a second through-hole 241 configured to accommodate the light source assembly 21. The circuit board 24 has two protrusions 242, each corresponding to a recess 233 in a plate 23. Each protrusion 242 has a plurality of side grooves 2421 spaced apart. Specifically, the protrusions 242 protrude toward the second through-hole 241. Each side groove 2421 is recessed from the side of the protrusion 242 near the second through-hole 241. The arrangement of the side grooves 2421 allows for the bonding of the circuit board 24 with the light source assembly 21, and the soldering of electrical connection wires 2123 to the protrusions 242 of the circuit board 24, with each electrical connection wire 2123 located above the protrusions 242.

[0085] Figure 6 This is a block diagram of the projection device of the present invention. Figure 6 As shown, the projection device 30 includes the aforementioned solid-state light source device 1, optical engine module 31, and projection lens 32. The solid-state light source device 1 is configured to provide a light beam. The optical engine module 31 is used to receive the light beam emitted by the light source module 20 and to convert it into an image beam. The projection lens 32 is disposed in the transmission path of the image beam to project the image beam. In one embodiment, the optical engine module 31 includes, for example, a phosphor wheel, a light guide element (e.g., a lens or a mirror), and a light valve, but is not limited thereto. The light valve is, for example, a reflective light modulator such as a Liquid Crystal On Silicon panel (LCoS panel) or a Digital Micro-Mirror Device (DMD), but is not limited thereto. The projection lens 32 includes, for example, a combination of one or more optical lenses with refractive power, such as various combinations of non-planar lenses such as biconcave lenses, biconvex lenses, concave-convex lenses, convex-concave lenses, plano-convex lenses, and plano-concave lenses.

[0086] Figure 7 This is a flowchart of the assembly method of the solid-state light source device of the present invention. Figure 7 As shown, the assembly method of solid-state light source device 1 includes the following steps, but the assembly order is not limited:

[0087] Provide a light source assembly and a flexible element (S10);

[0088] The elastic element is fitted onto the bottom of the light source assembly (S11);

[0089] A liquid cooler is provided, wherein the liquid cooler includes a chamber, a liquid inlet and a liquid outlet, the top surface of the chamber has an opening, and the liquid inlet and liquid outlet are located on two side walls of the chamber (S12).

[0090] Cover the opening on the bottom surface of the light source assembly with the elastic element already fitted (S13);

[0091] Provide sheet metal (S14);

[0092] The plate is placed on the light source assembly and liquid cooler that have been fitted with elastic members, with part of the light source assembly exposed on the plate (S15).

[0093] Provide circuit board (S16);

[0094] The circuit board is placed on the board and the liquid cooler, and the portion of the light source assembly with the elastic element already fitted and the portion of the board are exposed on the circuit board (S17).

[0095] Move the circuit board to the soldering position (S18).

[0096] In detail, Figure 10 This is a schematic diagram of the combination of the light source assembly 21 and the elastic member 22 of the present invention. Figure 3 , Figure 7 and Figure 10 As shown, when steps S10 and S11 are performed, a light source assembly 21 and an elastic member 22 are provided. The operator places the elastic member 22 on the bottom of the light source assembly, such that the first top surface 221 of the elastic member 22 covers the top surface of the first connecting member 2121 and the top surface of the second connecting member 2122 of the heat-conducting plate 212.

[0097] Figure 11 This is a schematic diagram showing the combination of the various components of the present invention. For example... Figure 7 and Figure 11 As shown, when step S12 is performed, a liquid cooler 10 is provided. Next, step S13 is performed, where the bottom surface of the light source assembly 21 with the elastic member 22 attached is aligned with the opening 111 of the liquid cooler 10, and the bottom surface of the light source assembly 21 with the elastic member 22 attached covers the opening 111, allowing the bottom surface of the light source assembly 21 with the elastic member 22 to contact the liquid inside the chamber 11 of the liquid cooler 10 through the opening 111, thereby achieving heat dissipation. The bottom surface of the light source assembly with the elastic member 22 attached is larger than the diameter of the opening 111. The bottom surface of the light source assembly 21 with the elastic member 22 attached covers the opening 111. Step S14 is performed, and a plate 23 is provided. Step S15 is performed, where the plate 23 is placed on the light source assembly 21 with the elastic member 22 attached and the liquid cooler 10, with a portion of the light source assembly 21 with the elastic member 22 attached exposed on the plate 23. The plate 23, the light source assembly 21 with the elastic element 22 already fitted, and the liquid cooler 10 are fixed by multiple screws.

[0098] Figure 12 This is another schematic diagram showing a combination of the components of the present invention. Figure 13 This is a top view schematic diagram of the assembled circuit board of the present invention. For example... Figure 7 , Figure 12 and Figure 13 As shown, step S16 is performed to provide circuit board 24. Then, step S17 is performed to place circuit board 24 on board 23 and liquid cooler 10, with portions of the light source assembly 21 (with elastic member 22 already fitted) and board 23 exposed on circuit board 24. Circuit board 24 and liquid cooler 10 are secured with multiple screws.

[0099] Figure 14 This is a schematic diagram illustrating the translation of the circuit board according to the present invention. (As shown...) Figure 7 , Figure 13 and Figure 14 As shown, after each electrical connection line 2123 passes through the side groove 2421 of the circuit board 24, step S18 is executed, and the circuit board 24 is translated along the translation direction (i.e., the second direction Y) to the soldering position of the protrusion 242, so that each electrical connection line 2123 forms an electrical connection with the circuit board 24.

[0100] Figure 8 This is another flowchart of the assembly method of the solid-state light source device of the present invention. In this embodiment, steps S11 to S18 are largely the same as those in the above embodiment, with the difference being that, as Figure 8 and Figure 11 As shown, after the aforementioned steps have been performed up to the step of "placing the plate on the light source assembly and liquid cooler with the elastic element already fitted, and with part of the light source assembly exposed on the plate (S15)", the assembly method includes the following steps:

[0101] The plate is secured to the liquid cooler by means of multiple screws, and the plate and the light source assembly with elastic members are secured to the liquid cooler by means of multiple screws (S151).

[0102] Figure 9 This is another flowchart of the assembly method of the solid-state light source device of the present invention. In this embodiment, steps S11 to S18 are largely the same as those in the above embodiment, with the difference being that, as Figure 9 and Figure 14 As shown, after the aforementioned steps have reached the step of "moving the circuit board to a soldering position (S18)", the assembly method includes the following sub-steps:

[0103] The circuit board is screwed onto the liquid cooler using multiple screws (S181).

[0104] In summary, the solid-state light source device, projection equipment, and assembly method of the solid-state light source device of the present invention have at least one of the following advantages: the light source module can directly contact the liquid in the chamber through the opening, so that the light source module does not need to be indirectly cooled through the top surface of the liquid cooler, thereby improving the heat dissipation efficiency; and the bottom surface of the light source module is not limited by the flatness of the contact surface, and can still achieve a better heat dissipation effect, thereby reducing manufacturing costs.

[0105] The above description is merely a preferred embodiment of the present invention and should not be construed as limiting the scope of the invention. Any simple equivalent changes and modifications made in accordance with the claims and description of the invention are still within the scope of the patent. Furthermore, no embodiment or claim of the present invention needs to achieve all the objectives, advantages, or features disclosed in the invention. In addition, the abstract and headings are merely for assisting in patent document searches and are not intended to limit the scope of the invention. Moreover, the terms "first," "second," etc., used in this specification or claims are only used to name elements or distinguish different embodiments or scopes, and are not intended to limit the upper or lower limit of the number of elements.

Claims

1. A solid-state light source device, characterized in that, include: Liquid coolers, including: A chamber, wherein the top surface of the chamber forms an opening; A liquid inlet is located on the side wall of the chamber; The liquid outlet is located on the other side wall of the chamber; and A light source module is disposed on the top surface of the liquid cooler, and the light source module covers the opening.

2. The solid-state light source device as described in claim 1, characterized in that, The liquid cooler also includes a groove that is located adjacent to the opening and is recessed downward along the outer periphery of the opening.

3. The solid-state light source device as described in claim 2, characterized in that, Part of the bottom surface of the light source module is located on the groove.

4. The solid-state light source device as described in claim 2, characterized in that, The light source module includes: Light source components; An elastic element is disposed at the bottom of the light source assembly, and a portion of the elastic element contacts a portion of the bottom surface of the light source assembly; A plate, located on the top surface of the liquid cooler and the elastic member, and configured to expose a portion of the light source assembly; and A circuit board is located on the top surface of the liquid cooler and on the plate, and is configured to expose a portion of the plate and a portion of the light source assembly.

5. The solid-state light source device as described in claim 4, characterized in that, The light source assembly includes: Multiple light-emitting components; A heat-conducting plate body, wherein the plurality of light-emitting elements are disposed within the heat-conducting plate body, and the heat-conducting plate body comprises: A first connecting member extends outward from the front sidewall of the heat-conducting plate body and near the bottom surface of the heat-conducting plate body; and The second coupling extends outward from the rear sidewall of the heat-conducting plate and near the bottom surface of the heat-conducting plate; and Multiple electrical connection wires are respectively connected to the multiple light-emitting elements and pass through the heat-conducting plate.

6. The solid-state light source device as described in claim 5, characterized in that, The elastic element includes: The first top surface faces and contacts the first coupling member and the second coupling member respectively; Side view, surrounding the light source assembly; A first bottom surface, connected to the side surface; and An extension surface extends outward from the outer side of the side surface, and the extension surface is stepped with the first bottom surface.

7. The solid-state light source device as described in claim 6, characterized in that, The first top surface is disposed above the first connector and the second connector.

8. The solid-state light source device as described in claim 7, characterized in that, The first bottom surface is located above the groove, and the bottom surface of the extension surface is located on a portion of the top surface of the liquid cooler.

9. The solid-state light source device as described in claim 8, characterized in that, The elastic element also includes: A first rib protrudes downward from the bottom surface of the first bottom surface, and the first rib is annular; and The second rib protrudes downward from the bottom surface of the extended surface, and the second rib is annular.

10. The solid-state light source device as described in claim 9, characterized in that, The plate surrounds the light source assembly and has a first through-hole. The plate also includes a notch formed by flaring outward from the first through-hole.

11. The solid-state light source device as described in claim 10, characterized in that, The circuit board surrounds the light source assembly and has two protrusions with multiple side grooves spaced apart.

12. A projection device, characterized in that, include: The solid-state light source device as described in claim 1; An optical-mechanical module is configured to receive the light beam emitted by the light source module and convert it into an image beam; and A projection lens is positioned in the transmission path of the image beam to project the image beam.

13. A method for assembling a solid-state light source device, characterized in that, Includes the following steps: Provide light source components and flexible parts; The elastic element is fitted onto the bottom of the light source assembly; A liquid cooler is provided, wherein the liquid cooler includes a chamber, a liquid inlet and a liquid outlet, the top surface of the chamber has an opening, and the liquid inlet and the liquid outlet are located on two side walls of the chamber; The bottom surface of the light source assembly, which has been fitted with the elastic element, covers the opening; Provide boards; The plate is placed on the light source assembly and the liquid cooler, which are already fitted with the elastic element, with a portion of the light source assembly exposed on the plate. Provide circuit boards; The circuit board is placed on the plate and the liquid cooler, with a portion of the light source assembly already fitted with the elastic member and a portion of the plate exposed on the circuit board; and Move the circuit board to the soldering position.

14. The assembly method of the solid-state light source device as described in claim 13, characterized in that, After the aforementioned steps are performed, such as placing the plate on the light source assembly and the liquid cooler with the elastic element already fitted on it, and with a portion of the light source assembly exposed above the plate, the assembly method includes the following steps: The plate is secured to the liquid cooler by a plurality of screws, and the plate and the light source assembly with the elastic element attached are secured to the liquid cooler by a plurality of screws.

15. The assembly method of the solid-state light source device as described in claim 13, characterized in that, After the aforementioned steps have been performed, including the step of moving the circuit board to the soldering position, the assembly method includes the following sub-steps: The circuit board is secured to the liquid cooler using multiple screws.

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