A computer server chassis and its mounting structure

Abstract

This invention discloses a computer server chassis and its mounting structure, belonging to the technical field of modular computer chassis devices. It includes an outer shell assembly and a mounting structure. The outer shell assembly includes dual short-diameter plates, a heat dissipation top cover, a bottom shell support plate, and front and rear closing assemblies. The front and rear closing assemblies are connected to the dual short-diameter plates and the bottom shell support plate via slot assemblies. Through the coordinated design of the heat dissipation top cover and the mounting structure, the air duct within the heat dissipation top cover can communicate with the heat transfer channel to form an exhaust path, dissipating heat from three independent storage units. This allows the three independent units to exist independently, reducing electromagnetic interference between units. The airflow opening and closing plates on the storage mounting plate and the motherboard mounting plate can both blow air onto the finned heat-conducting plate, achieving an auxiliary heat dissipation effect. Furthermore, the drive motor can change the tilt angle of the airflow opening and closing plates, realizing the autonomous adjustment function of the heat dissipation system to ensure efficient and stable operation of each module.

Description

Technical Field

[0001] This invention relates to the field of modular computer chassis technology, and more particularly to a computer server chassis and its mounting structure. Background Technology

[0002] A computer server is a high-performance computer that acts as a node in a network, storing and processing data and information on the network. The server chassis serves as the outer shell of the computer server, providing protection. The mounting structure serves as the partitioning of various electronic modules and the connection between the computer's outer shell and the server itself.

[0003] Existing computer server chassis cannot partition the various modules through the installation structure. Power modules, storage modules, and motherboard modules are all installed inside the chassis shell, resulting in electromagnetic interference between modules. At the same time, air-cooling systems usually have two fans on both sides of the chassis to complete the heat dissipation work, which cannot reasonably allocate heat dissipation resources according to the load of each module during operation, so as to ensure the efficient operation and stability of each module. Summary of the Invention

[0004] The purpose of this invention is to solve the problems in the prior art where modules cannot be partitioned, electromagnetic interference between modules is easy to occur, affecting information transmission, and the wind power system cannot reasonably allocate heat dissipation efficiency according to the load of each module. Therefore, this invention proposes a computer server chassis and its installation structure.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A computer server chassis and its mounting structure include an outer shell assembly and a mounting assembly. The outer shell assembly includes dual short-diameter plates, a heat dissipation top cover plate, a bottom shell support plate, and a front and rear closing assembly. The front and rear closing assembly is connected to the dual short-diameter plates and the bottom shell support plate via a slot assembly. The dual short-diameter plates are connected to the bottom shell support plate via a snap-fit ​​assembly. The heat dissipation top cover plate is connected to the dual short-diameter plates and the front and rear closing assembly via a locking assembly. A heat dissipation module mounting slot is provided on the side of the heat dissipation top cover plate. An air guide cavity is provided inside the heat dissipation top cover plate. The heat dissipation module mounting slot is connected to the air guide cavity. A finned heat conduction plate is fixed at one end of the air guide cavity, and a guide exhaust hole is provided at the other end of the air guide cavity. A circulation guide plate is fixed on one side of the guide exhaust hole. The installation assembly includes a power supply plate, a storage plate, a main board plate, and two sets of airflow adjustment components connected to the outer casing assembly via plug-in components. The power supply plate and the storage plate are equipped with fixing components. The heat transfer channel formed on the outer side of the power supply plate, the storage plate, and the main board plate is connected to the guide exhaust hole. A finned heat-conducting plate is fixed on the surface of the power supply plate. The airflow adjustment component includes a drive motor. One end of the drive motor is connected to an airflow opening and closing plate via a transmission component. The airflow opening and closing plate is hinged to the inner wall of the heat dissipation communication hole via a shaft.

[0006] Preferably, the front and rear closure assembly includes a front sealing plate and a rear external plate. The surface of the front sealing plate is provided with a power switch mounting hole, and the surface of the rear external plate is provided with a power module insertion hole, a storage module insertion hole, and a motherboard external connection hole.

[0007] Preferably, the slot assembly includes a vertical insertion slot formed on the inner side of the two short diameter plates and a limiting slot formed on the surface of the bottom shell support plate. Both sides of the front sealing plate and the rear outer plate are inserted into the inner wall of the vertical insertion slot, and the bottom of the front sealing plate and the rear outer plate are inserted into the inner wall of the limiting slot.

[0008] Preferably, the engaging assembly includes engaging grooves formed at both ends of the upper surface of the bottom shell support plate, and mating tongues are inserted into the inner walls of the engaging grooves, with the tops of the mating tongues fixed to the bottoms of the two short diameter plates.

[0009] Preferably, the locking assembly includes a fastening bolt inserted into the inner wall of the heat dissipation top cover, the bottom of which is threaded to the top of the two short-diameter plates.

[0010] Preferably, the plug-in assembly includes a transverse sliding groove formed on one side of the dual short-diameter plates and a push sliding groove formed on the surface of the bottom shell support plate. One end of the power buckle plate and the storage buckle plate are both inserted into the inner wall of the transverse sliding groove, and one end of the main board buckle plate is inserted into the inner wall of the push sliding groove.

[0011] Preferably, the fixing component includes a fixing post fixed between the power supply buckle plate and the storage buckle plate and a positioning support post fixed to one side of the storage buckle plate, with one end of the positioning support post tightly attached to the surface of the main board buckle plate.

[0012] Preferably, the transmission assembly includes a directional arm hinged to one end of a drive motor via a shaft, the bottoms of the two sets of drive motors are respectively fixed to the upper surfaces of the storage buckle plate and the main board buckle plate, one end of the directional arm is hinged to a push connecting rod via a shaft, the inner wall of the push connecting rod is hinged to one end of a wind direction opening plate via a shaft, and the heat dissipation communication hole is opened on the top of the storage buckle plate and the main board buckle plate.

[0013] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. This invention, through the coordinated design of the heat dissipation top cover and the mounting structure, allows the air duct within the heat dissipation top cover to connect with the heat transfer channel, forming an exhaust path. This dissipates heat from the three independent storage units—the power supply cover, storage cover, and motherboard cover—allowing each unit to exist independently and reducing electromagnetic interference between them. The airflow opening and closing plates on the storage cover and motherboard cover can both blow air onto the finned heat-conducting plate, achieving auxiliary heat dissipation. This allows the power supply cooling system to exist independently, without occupying air cooling resources. Furthermore, the drive motor, through a transmission component, changes the angle of the airflow opening and closing plates according to the temperature of each unit, thereby changing the airflow speed extracted from the storage cover and motherboard cover. This enables the cooling system to autonomously adjust, ensuring efficient and stable operation of each module.

[0014] 2. The present invention, through the combined arrangement of finned heat-conducting plates and air-guiding chambers, allows the finned heat-conducting plates located on the short-diameter plates on both sides to further dissipate heat through the air blown out of the guide exhaust holes. The circulating guide plate can cause the air to be blown through the guide exhaust holes to the finned heat-conducting plates and then extracted from the air-cooling module installed in the heat dissipation module mounting slot. This allows the power supply module to dissipate heat independently without occupying the air-cooling system, enabling the server chassis to achieve better heat dissipation under the fixed air-cooling module.

[0015] 3. The present invention uses the combination of air guide cavity and heat transfer channel. The air guide cavity draws external air into the separate storage space formed by the storage buckle plate and the motherboard buckle plate through a set of horizontal air-cooling modules. The heated air is drawn out through the heat dissipation communication hole and sent into the air guide cavity for discharge through the guide exhaust hole, so that the air flow path is more regular and the heat dissipation effect is more obvious. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of a computer server chassis and its mounting structure proposed in this invention; Figure 2 This is an exploded structural diagram of a computer server chassis and its mounting structure proposed in this invention. Figure 3 This is a schematic diagram of the heat transfer channel of a computer server chassis and its mounting structure proposed in this invention. Figure 4 This is a schematic diagram of the structure of the guide vent of a computer server chassis and its mounting structure proposed in this invention; Figure 5 This is a schematic diagram of the heat dissipation and communication holes of a computer server chassis and its mounting structure proposed in this invention. Figure 6 This is a schematic diagram of the push-connecting rod of a computer server chassis and its mounting structure proposed in this invention.

[0017] In the diagram: 1. Double-sided short-diameter plate; 2. Heat dissipation top cover plate; 3. Bottom shell support plate; 4. Heat dissipation module mounting slot; 5. Air guide cavity; 6. Finned heat conduction plate; 7. Guide exhaust hole; 8. Circulation guide plate; 9. Power supply buckle plate; 10. Storage buckle plate; 11. Main board buckle plate; 12. Heat transfer channel; 13. Drive motor; 14. Airflow opening and closing plate; 15. Heat dissipation connecting hole; 16. Front sealing plate; 17. Rear external plate; 18. Vertical insertion slot; 19. Limiting slot; 20. Docking tongue; 21. Fastening bolt; 22. Horizontal slide groove; 23. Push slide groove; 24. Fixing column; 25. Positioning support column; 26. Adjusting arm; 27. Push connecting rod. Detailed Implementation

[0018] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0019] In the description of this invention, it should be noted that the terms "upper," "lower," "inner," "outer," "top / bottom," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0020] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "sleeved / connected," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0021] Example, refer to Figures 1 to 6 A computer server chassis and its mounting components include an outer shell assembly and a mounting structure. The outer shell assembly includes a double-sided short-diameter plate 1, a heat dissipation top cover plate 2, a bottom shell support plate 3, and a front and rear closing assembly. Further, the front and rear closing assembly includes a front sealing plate 16 and a rear external plate 17. The surface of the front sealing plate 16 is provided with a power switch mounting hole, and the surface of the rear external plate 17 is provided with a power module insertion hole, a storage module insertion hole, and a motherboard external connection hole.

[0022] The further advantages of the above are: the front enclosure plate 16, the rear external plate 17, the double-sided short diameter plates 1, the heat dissipation top cover plate 2 and the bottom shell support plate 3 form the outer shell structure. The various modules are installed, protected and fixed by the installation structure inside the outer shell structure. The power switch mounting hole, power module insertion hole, storage module insertion hole and motherboard external connection hole opened on the front enclosure plate 16 and the rear external plate 17 can realize the external connection of the power source.

[0023] It is worth noting that wire grooves are provided on both short diameter plates 1 and bottom shell support plate 3. The wire grooves are used to connect the wire sources between the various partitions. At the same time, sealing plates are inserted into the wire groove ports to prevent air leakage through the wire grooves when the air-cooled module is drawing air, which would affect the heat dissipation effect of each partition component.

[0024] The front and rear closing components are connected to the double short diameter plates 1 and the bottom shell support plate 3 through the slot assembly. Further, the slot assembly includes a vertical insertion slot 18 opened on the inner side of the double short diameter plates 1 and a limiting slot 19 opened on the surface of the bottom shell support plate 3. Both sides of the front closing plate 16 and the rear outer plate 17 are inserted into the inner wall of the vertical insertion slot 18, and the bottom of the front closing plate 16 and the rear outer plate 17 are inserted into the inner wall of the limiting slot 19.

[0025] The further advantage of the above is that the front sealing plate 16 and the rear external plate 17 are installed through the vertical insertion slot 18. At the same time, the front sealing plate 16 and the rear external plate 17 can also seal the two ends of the power supply plate 9, the storage plate 10 and the motherboard plate 11, so that the power supply plate 9, the storage plate 10 and the motherboard plate 11 form a closed storage space, thereby forming a directional airflow to dissipate heat from each module.

[0026] The two short diameter plates 1 are connected to the bottom shell support plate 3 through a snap-fit ​​assembly. Further, the snap-fit ​​assembly includes snap-fit ​​grooves opened at both ends of the upper surface of the bottom shell support plate 3. The inner wall of the snap-fit ​​groove is fitted with a mating tongue 20, and the top of the mating tongue 20 is fixed to the bottom of the two short diameter plates 1.

[0027] The further advantage of adopting the above is that the splicing of the short diameter plates 1 on both sides and the bottom shell support plate 3 can be completed by using the docking tongue 20.

[0028] The heat dissipation top cover 2 is connected to the double short diameter plates 1 and the front and rear closing assembly through a locking assembly. Furthermore, the locking assembly includes a fastening bolt 21 inserted into the inner wall of the heat dissipation top cover 2, and the bottom of the fastening bolt 21 is threaded to the top of the double short diameter plates 1.

[0029] A further advantage of the above is that the heat dissipation top cover 2 can be fixed to the top of the double short diameter plates 1, the front sealing plate 16 and the rear outer plate 17 by means of fastening bolts 21.

[0030] The heat dissipation top cover plate 2 has a heat dissipation module mounting groove 4 on its side and an air guide cavity 5 inside the heat dissipation top cover plate 2. The heat dissipation module mounting groove 4 is connected to the air guide cavity 5. A finned heat conduction plate 6 is fixed at one end of the air guide cavity 5 and a guide exhaust hole 7 is opened at the other end of the air guide cavity 5. A circulation guide plate 8 is fixed on one side of the guide exhaust hole 7. The guide exhaust port 7 directs the airflow to the surface of the finned heat-conducting plate 6 at one end of the air guide cavity 5, and then the air-cooling module installed in the heat dissipation module mounting slot 4 extracts the airflow to complete the heat dissipation cycle. The circulation guide plate 8 prevents the air from being directly drawn away from the guide exhaust port 7 by the air-cooling module.

[0031] The mounting components include a power supply plate 9, a storage plate 10, a main board plate 11, and two sets of wind power adjustment components, which are connected to the housing components via plug-in components. Further, the plug-in components include a horizontal sliding groove 22 opened on one side of the dual short diameter plates 1 and a push sliding groove 23 opened on the surface of the bottom shell support plate 3. One end of the power supply plate 9 and the storage plate 10 are both inserted into the inner wall of the horizontal sliding groove 22, and one end of the main board plate 11 is inserted into the inner wall of the push sliding groove 23.

[0032] A further advantage of the above is that the horizontal slide 22 and the push slide 23 are used to install and fix the power supply plate 9, the storage plate 10 and the main board plate 11.

[0033] The power supply plate 9 and the storage plate 10 are provided with fixing components. Further, the fixing components include fixing posts 24 fixed between the power supply plate 9 and the storage plate 10 and positioning support posts 25 fixed on one side of the storage plate 10. One end of the positioning support post 25 is tightly attached to the surface of the main plate 11.

[0034] A further advantage of the above is that the positioning support column 25 can prevent the power supply plate 9 and the storage plate 10 from detaching from the horizontal slide groove 22.

[0035] The heat transfer channel 12 formed on the outer side of the power supply plate 9, storage plate 10, and main board plate 11 is connected to the guide exhaust hole 7. The surface of the power supply plate 9 is fixed with a finned heat conduction plate 6. The wind power adjustment component includes a drive motor 13. One end of the drive motor 13 is connected to a wind direction opening and closing plate 14 through a transmission component. Further, the transmission component includes a directional arm 26 that is hinged to one end of the drive motor 13 through a shaft. The bottoms of the two sets of drive motors 13 are respectively fixed to the upper surfaces of the storage plate 10 and the main board plate 11. One end of the directional arm 26 is hinged to a push connecting rod 27 through a shaft. The inner wall of the push connecting rod 27 is hinged to one end of the wind direction opening and closing plate 14 through a shaft. The heat dissipation communication hole 15 is opened on the top of the storage plate 10 and the main board plate 11.

[0036] A further advantage of the above is that the drive motor 13 can change the tilt angle of the airflow opening and closing plate 14 by adjusting the directional arm 26 and the push connecting rod 27 according to the operation of the storage module and the motherboard module in the storage plate 10 and the motherboard plate 11, thereby providing different degrees of airflow for heat dissipation according to the operation of the module.

[0037] The airflow opening and closing plate 14 is hinged to the inner wall of the heat dissipation connecting hole 15 via a shaft.

[0038] In use, the double-sided short diameter plate 1 is spliced ​​onto the bottom shell support plate 3 through the docking tongue 20. Then, the power buckle plate 9, storage buckle plate 10 and main board buckle plate 11 are installed onto the double-sided short diameter plate 1 and the bottom shell support plate 3 through the horizontal sliding groove 22 and the pushing sliding groove 23. The wiring source passes through the wire grooves on the double short diameter plates 1 and the bottom shell support plate 3 to realize the electrical connection between the modules. The motherboard module and the storage module are fixed to the board base inside the storage bracket 10 and the motherboard bracket 11 by bolts. After the power supply is installed, insert the front enclosure plate 16 and the rear external plate 17 through the vertical insertion slot 18 to complete the splicing work. Then insert the storage hard drive and power supply through the mounting slots on the rear external plate 17. Finally, the heat dissipation top cover plate 2 is installed on the top of the double short diameter plates 1, the front sealing plate 16 and the rear outer plate 17 by fastening bolts 21. During operation, the air-cooled module on the heat dissipation module mounting slot 4 starts to run and exhaust air. The air in the storage plate 10 and the motherboard plate 11 can be drawn out through the heat dissipation connection hole 15 and the air direction opening plate 14. After being guided by the air direction opening plate 14, it can be blown onto the surface of the fin heat conduction plate 6 on the power plate 9. The drive motor 13 can change the tilt angle of the air direction opening plate 14 according to the operation of the storage module and the motherboard module to adjust the size of the air outlet, so as to achieve reasonable allocation of heat dissipation resources. The air flowing out from the heat dissipation connection hole 15 flows through the heat transfer channel 12 to the guide exhaust hole 7, then enters the air guide cavity 5, and then blows onto the fin heat conduction plate 6. The circulation guide plate 8 prevents the air from being directly drawn away from the guide exhaust hole 7 by the air-cooled module.

[0039] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A computer server chassis and its mounting structure, comprising an outer shell assembly and a mounting assembly, characterized in that: The outer shell assembly includes a double-sided short diameter plate (1), a heat dissipation top cover plate (2), a bottom shell support plate (3), and a front and rear closing assembly. The front and rear closing assembly is connected to the double-sided short diameter plate (1) and the bottom shell support plate (3) through a slot assembly. The double-sided short diameter plate (1) is connected to the bottom shell support plate (3) through a snap-fit ​​assembly. The heat dissipation top cover plate (2) is connected to the double-sided short diameter plate (1) and the front and rear closing assembly through a locking assembly. A heat dissipation module mounting groove (4) is provided on the side of the heat dissipation top cover plate (2). An air guide cavity (5) is provided inside the heat dissipation top cover plate (2). The heat dissipation module mounting groove (4) is connected to the air guide cavity (5). A finned heat conduction plate (6) is fixed at one end of the air guide cavity (5). A guide exhaust hole (7) is provided at the other end of the air guide cavity (5). A circulation guide plate (8) is fixed on one side of the guide exhaust hole (7). The installation assembly includes a power supply buckle plate (9), a storage buckle plate (10), a main board buckle plate (11) and two sets of wind power adjustment components connected to the outer shell assembly via plug-in components. The power supply buckle plate (9) and the storage buckle plate (10) are provided with fixing components. The heat transfer channel (12) formed on the outside of the power supply buckle plate (9), the storage buckle plate (10) and the main board buckle plate (11) is connected to the guide exhaust hole (7). The surface of the power supply buckle plate (9) is fixed with a finned heat conduction plate (6). The wind power adjustment component includes a drive motor (13). One end of the drive motor (13) is connected to a wind direction opening and closing plate (14) via a transmission component. The wind direction opening and closing plate (14) is hinged to the inner wall of the heat dissipation communication hole (15) via a shaft.

2. The computer server chassis and its mounting structure according to claim 1, characterized in that, The front and rear closure assembly includes a front closure plate (16) and a rear external plate (17). The surface of the front closure plate (16) is provided with a power switch mounting hole, and the surface of the rear external plate (17) is provided with a power module insertion hole, a storage module insertion hole and a motherboard external hole.

3. A computer server chassis and its mounting structure according to claim 2, characterized in that, The slot assembly includes a vertical insertion slot (18) opened on the inner side of the double short diameter plate (1) and a limiting slot (19) opened on the surface of the bottom shell support plate (3). The two sides of the front sealing plate (16) and the rear outer plate (17) are inserted into the inner wall of the vertical insertion slot (18), and the bottom of the front sealing plate (16) and the rear outer plate (17) are inserted into the inner wall of the limiting slot (19).

4. A computer server chassis and its mounting structure according to claim 1, characterized in that, The engaging assembly includes engaging grooves at both ends of the upper surface of the bottom shell support plate (3), and the inner wall of the engaging groove is fitted with a mating tongue (20), the top of which is fixed to the bottom of the double-sided short diameter plate (1).

5. A computer server chassis and its mounting structure according to claim 1, characterized in that, The locking assembly includes a fastening bolt (21) inserted into the inner wall of the heat dissipation top cover (2), and the bottom of the fastening bolt (21) is threaded to the top of the double-sided short diameter plate (1).

6. A computer server chassis and its mounting structure according to claim 1, characterized in that, The plug-in assembly includes a horizontal slide groove (22) opened on one side of the double short diameter plate (1) and a push slide groove (23) opened on the surface of the bottom shell support plate (3). One end of the power buckle plate (9) and the storage buckle plate (10) are both inserted into the inner wall of the horizontal slide groove (22), and one end of the main board buckle plate (11) is inserted into the inner wall of the push slide groove (23).

7. A computer server chassis and its mounting structure according to claim 1, characterized in that, The fixing assembly includes a fixing post (24) fixed between the power supply buckle plate (9) and the storage buckle plate (10) and a positioning support post (25) fixed to one side of the storage buckle plate (10), with one end of the positioning support post (25) tightly attached to the surface of the main board buckle plate (11).

8. A computer server chassis and its mounting structure according to claim 1, characterized in that, The transmission assembly includes a directional arm (26) hinged to one end of a drive motor (13) via a shaft. The bottoms of the two sets of drive motors (13) are respectively fixed to the upper surfaces of the storage buckle plate (10) and the main board buckle plate (11). One end of the directional arm (26) is hinged to a push connecting rod (27) via a shaft. The inner wall of the push connecting rod (27) is hinged to one end of a wind direction opening plate (14) via a shaft. The heat dissipation connecting hole (15) is opened on the top of the storage buckle plate (10) and the main board buckle plate (11).

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