A heat dissipation device, a control method of the heat dissipation device, and an electronic device

Abstract

This application discloses a heat dissipation device, a control method for the heat dissipation device, and an electronic device. It belongs to the field of heat dissipation technology for electronic devices. The heat dissipation device includes a fan, a radiator, and a flow divider. The radiator includes a condenser and an evaporator connected to each other. The fan is spaced apart from the condenser of the radiator and is used to supply air to the condenser. The flow divider is hinged to the end of the condenser's windward side near the evaporator. The angle between the flow divider and the windward side of the condenser is adjustable to control whether a portion of the airflow delivered by the fan can flow to the evaporator.

Description

Technical Field

[0001] This application relates to the field of electronic heat dissipation technology, specifically to a heat dissipation device, a control method for the heat dissipation device, and an electronic device. Background Technology

[0002] As users' demand for computing power gradually increases, the power consumption of chips in information and communication equipment such as servers and switches is rising, especially in high-density, high-capacity communication devices. This places higher demands on the heat dissipation capabilities of the heat dissipation devices used to cool the chips.

[0003] See Figure 1 In the prior art, a heat dissipation device for a heat exchanger box has the following structure: a heat sink 1' is located at the position of a heat source 2', and a fan 3' is located inside the heat exchanger box. The cold air generated by the fan needs to travel a relatively long path to reach the heat sink 1' at the position of the heat source 2'. With this type of heat dissipation device, due to the high power consumption of the heat source 2', there is a thermal cascading problem along the airflow path. Furthermore, due to the compact space inside the heat exchanger box, the airflow resistance is high, and the efficiency of the fan 3' is low. Ultimately, this will cause the downstream heat source 2' along the airflow path to fail to meet the heat dissipation requirements. Summary of the Invention

[0004] In view of this, embodiments of this application aim to provide a heat dissipation device, a control method for the heat dissipation device, and an electronic device.

[0005] In a first aspect, embodiments of this application provide a heat dissipation device, including:

[0006] Fan;

[0007] A radiator includes a condenser and an evaporator connected to each other, and a fan is provided at an interval relative to the condenser of the radiator for supplying air to the condenser of the radiator;

[0008] A flow divider is hinged to the end of the condenser near the evaporator on the windward side. The angle between the flow divider and the windward side of the condenser is adjustable to control whether a portion of the airflow delivered by the fan can flow to the evaporator.

[0009] Secondly, embodiments of this application provide a control method for a heat dissipation device, wherein the heat dissipation device has a radiator for dissipating heat from multiple heat sources, and the multiple heat sources are configured in a one-to-one correspondence with multiple evaporators. The control method for the heat dissipation device includes:

[0010] Obtain the actual total power consumption of all said heat sources and the ultimate total power consumption of all said heat sources;

[0011] Obtain the ratio of the actual total power consumption to the maximum total power consumption;

[0012] The angle between the flow divider and the windward side of the condenser is controlled based on the ratio of the actual total power consumption to the maximum total power consumption.

[0013] Thirdly, embodiments of this application provide an electronic device, including:

[0014] Heat source;

[0015] In the aforementioned heat dissipation device, the evaporator of the heat sink is correspondingly arranged with the heat source to absorb the heat from the heat source. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the heat dissipation device of the plug-in box in the prior art;

[0017] Figure 2 This is an exploded view of the heat sink provided in Embodiment 1 of this application;

[0018] Figure 3 This is an exploded structural diagram of the evaporator provided in Embodiment 1 of this application;

[0019] Figure 4 This is a schematic diagram of a radiator with a regulating valve installed on the liquid branch pipe provided in Embodiment 1 of this application;

[0020] Figure 5 This is a schematic diagram of the radiator provided in Embodiment 1 of this application when the diameters of the various liquid branch pipes are different;

[0021] Figure 6 This is a schematic diagram of the heat dissipation device provided in Embodiment 3 of this application;

[0022] Figure 7 This is a flowchart of the control method for the heat dissipation device provided in Embodiment 4 of this application;

[0023] Figure 8 This is a schematic diagram of the installation position of the heat dissipation device provided in Embodiment 5 of this application in an electronic device;

[0024] Figure 9 This is a schematic diagram of the installation position of the heat dissipation device provided in Embodiment Six of this application in an electronic device;

[0025] Figure 10 This is a partial structural diagram of the heat sink in the electronic device provided in Embodiment 7 of this application;

[0026] Figure 11 This is a schematic diagram of the installation position of the heat dissipation device provided in Embodiment 8 of this application in an electronic device.

[0027] Figure 1 middle:

[0028] 1' Radiator; 2' Heat source; 3' Fan.

[0029] Figures 2-11 middle:

[0030] 100. Heat source; 200. Controller; 300. Circuit board; 400. Socket; 500. Signal line; 600. Control line;

[0031] 10. Fan; 20. Diverter; 201. Rotating shaft; 30. Air guide; 40. First baffle; 50. Second baffle;

[0032] 1. Condenser;

[0033] 2. Evaporator; 21. Steam chamber; 211. Evaporator outlet; 212. Support structure; 213. Enhanced boiling structure; 214. Liquid level detection element; 22. First fin; 23. Mounting hole; 24. First evaporator; 25. Second evaporator; 26. Third evaporator; 27. Fourth evaporator;

[0034] 3. Liquid tubing assembly; 31. Liquid tubing; 32. Liquid branch pipe; 321. Control valve; 33. Distributor;

[0035] 4. Steam pipe assembly; 41. Steam pipe; 42. Steam collector; 42. Steam branch pipe; 43. Steam collector. Detailed Implementation

[0036] To make the purpose, technical solution and beneficial effects of this application clearer, the embodiments of this application will be described below with reference to the accompanying drawings. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be arbitrarily combined with each other.

[0037] Example 1

[0038] See Figure 2 This application provides a heat sink capable of dissipating heat from multiple heat sources 100 in an electronic device. Specifically, the heat sink is capable of dissipating heat from multiple chips within a socket.

[0039] Specifically, the circuit board 300 of the electronic device is provided with multiple heat sources 100.

[0040] The radiator includes a condenser 1, a liquid pipe assembly 3, a steam pipe assembly 4, and multiple evaporators 2.

[0041] The condenser 1 includes a condensing chamber, which has a condenser inlet and a condenser outlet.

[0042] Evaporator 2 includes a steam chamber 21, which has an evaporator inlet and an evaporator outlet 211.

[0043] The liquid pipe assembly 3 includes multiple liquid branch pipes 32, the inlet of each liquid branch pipe 32 is connected to the outlet of the condenser, the outlet of the multiple liquid branch pipes 32 is connected to multiple evaporator inlets in a one-to-one correspondence, and the flow rates of at least two of the multiple liquid branch pipes 32 can be different.

[0044] The steam pipe assembly 4 includes multiple steam branch pipes 42, the inlets of which are connected to multiple evaporator outlets in a one-to-one correspondence, and the outlet end of each steam branch pipe 42 is connected to the condenser inlet.

[0045] In the embodiment of this application, the radiator provides that, during operation, multiple evaporators 2 are attached to multiple heat sources 100 of the electronic device in a one-to-one correspondence. The heat generated by the heat source 100 during operation can be transferred to the evaporator 2 attached to the corresponding heat source 100, causing the working fluid in the steam chamber 21 of the evaporator 2 to absorb heat and vaporize to form gas. The gas enters the condensation chamber of the condenser 1 through the steam branch pipe 42 connected to the evaporator 2. At the condenser 1, the gas liquefies and releases heat, thereby releasing the heat generated by the heat source 100 during operation. The liquefied working fluid flows to the steam chamber 21 of the multiple evaporators 2 through multiple liquid branch pipes 32 respectively. The working fluid circulates repeatedly to complete the heat dissipation of the heat source 100. Meanwhile, since the power of the multiple heat sources 100 of the electronic device may differ during operation, and the flow rates of at least two of the multiple liquid branch pipes 32 of the liquid pipe assembly 3 in the radiator can be different, it is possible to control the delivery of more liquid working fluid to the steam chamber 21 of the evaporator 2 corresponding to the heat source 100 with higher power, and to deliver less liquid working fluid to the steam chamber 21 of the evaporator 2 corresponding to the heat source 100 with lower power, so that the radiator has better heat dissipation uniformity for the multiple heat sources 100.

[0046] Specifically, the liquid pipe assembly 3 also includes a distributor 33 and a liquid pipe 31. The liquid pipe 31 is connected between the outlet of the condenser 1 and the inlet of the distributor 33, and the liquid branch pipe 32 is connected between the outlet of the distributor 33 and the inlet of the evaporator 2. It can be understood that the distributor 33 has multiple outlets, each corresponding to a different liquid branch pipe 32.

[0047] When the radiator is running, the liquid working fluid in the condenser 1 flows to the distributor 33 through the liquid pipe 31. The distributor 33 then distributes the liquid to each liquid branch pipe 32, so that the liquid working fluid in the condenser 1 flows to the steam chamber 21 of each evaporator 2.

[0048] Specifically, the steam pipe assembly 4 also includes a steam pipe 41 and a steam collector 43. The steam pipe 41 is connected between the inlet of the condenser 1 and the inlet of the steam collector 43, and the steam branch pipe 42 is connected between the inlet of the steam collector 43 and the outlet of the evaporator 2. It is understood that the steam collector 43 has multiple inlets, each corresponding to a different steam branch pipe 42.

[0049] When the radiator is running, the gaseous working fluid in the steam chamber 21 of each evaporator 2 enters the steam collector 43 through its corresponding steam branch pipe 42, and then enters the condenser 1 through the steam collector 43 and the steam pipe 41 to condense and form a liquid working fluid.

[0050] In some embodiments, see Figure 3 The steam chamber 21 has a supporting structure 212; and / or

[0051] The steam chamber 21 has an enhanced boiling structure 213, which helps to improve the heat exchange efficiency of the steam chamber 21.

[0052] The support structure 212 can support the evaporator 2 and ensure the structural stability of the evaporator 2.

[0053] Optionally, the steam chamber 21 may be provided with a separate support structure 212 or a separate enhanced boiling structure 213. Alternatively, both the support structure 212 and the enhanced boiling structure 213 may be provided simultaneously.

[0054] Specifically, the support structure 212 is columnar. The height of the support structure 212 is the same as the thickness of the steam chamber 21, and it provides support for the evaporator 2.

[0055] Specifically, the enhanced boiling structure 213 can be tiny pits or grooves machined into the inner wall of the steam chamber 21. This enhanced boiling structure 213 enables the liquid to quickly form evaporation bubble nuclei, improving boiling heat exchange efficiency and thus allowing evaporation to proceed rapidly. Simultaneously, the enhanced boiling structure 213 also guides the steam within the steam chamber 21 to flow towards the upper wall of the steam chamber 21, allowing the evaporator 2 to exchange heat with the outside air, thereby promoting the initial condensation and heat release of the steam on the upper wall of the steam chamber 21.

[0056] Specifically, the evaporator 2 includes an evaporator shell and an evaporator cover plate. The evaporator shell encloses a steam chamber 21 with one end open. A support structure 212 and a boiling enhancement structure 213 are both disposed on the bottom wall of the evaporator shell. The evaporator cover plate is placed on the evaporator shell to seal the opening of the steam chamber 21. One end of the support structure 212 is vertically fixed to the bottom wall of the evaporator shell, and the other end can abut against the evaporator cover plate, thereby providing support for the evaporator 2.

[0057] The steam chamber 21 stores a liquid working fluid that is in direct contact with the heat source 100. The liquid working fluid in the steam chamber 21 vaporizes, absorbs heat, and generates steam. Each steam chamber 21 is connected to a steam branch pipe 42 and a liquid branch pipe 32 to discharge steam and receive return liquid, ensuring that the evaporation process continues.

[0058] The evaporator housing is provided with mounting holes 23 to allow the evaporator housing to be mounted on the circuit board 300. Specifically, the mounting holes 23 are threaded holes.

[0059] Furthermore, the evaporator cover plate is provided with first fins 22. The first fins 22 can increase the heat dissipation area, thereby further dissipating heat from the heat source 100.

[0060] Specifically, the evaporator 2 includes an evaporator body and first fins 22. The steam chamber 21 is disposed in the evaporator body, and multiple first fins 22 are disposed on the outer surface of the evaporator body.

[0061] Optionally, the first fins 22 of the multiple evaporators 2 have the same density; or

[0062] Along the direction away from the condenser 1, the density of the first fins 22 of the multiple evaporators 2 gradually increases.

[0063] Specifically, the evaporator body includes an evaporator shell and an evaporator cover.

[0064] The first fin 22 increases the contact area between the evaporator 2 and the outside world, thereby increasing the heat dissipation area of ​​the evaporator 2 and improving the heat exchange efficiency between the evaporator 2 and the outside air. This improves the primary heat release efficiency of the steam in the evaporator 2 and avoids the safety hazards caused by the evaporator 2 being too hot.

[0065] Understandably, the greater the density of the first fins 22 on the evaporator 2, the smaller the distance between two adjacent first fins 22. Furthermore, the condenser 1 is provided with second fins, which exchange heat with the external airflow, allowing the steam entering the condenser 1 to be quickly liquefied into a liquid working fluid.

[0066] It is understandable that the condenser 1 is equipped with multiple second fins to increase the heat exchange area between the condenser 1 and the outside environment, thereby improving the heat dissipation efficiency of the condenser 1.

[0067] In some embodiments, see Figure 4 In order to ensure that at least two of the multiple liquid branch pipes 32 have different flow rates, each liquid branch pipe 32 is equipped with a regulating valve 321.

[0068] By adjusting the opening of the regulating valve 321, the flow rate of the liquid branch pipe 32 corresponding to the regulating valve 321 can be regulated.

[0069] It is understandable that the flow rates of multiple liquid branch pipes 32 can be made the same, or at least two different, by adjusting the opening of multiple regulating valves 321.

[0070] When this radiator is applied to a specific product, multiple heat sources 100 on the product are arranged vertically at intervals. Therefore, the multiple evaporators 2 of the radiator also need to be arranged vertically at intervals, and the condensers 1 are generally positioned above the uppermost evaporator 2 at intervals. This results in different vertical height differences between the various evaporators 2 and condensers 1, and different flow rates of liquid inside the liquid branch pipes 32 under gravity, causing uneven liquid return to the steam chamber 21. The regulating valve 321 provides additional resistance to regulate the flow rate between different liquid branch pipes 32, thereby maintaining the normal liquid level in each steam chamber 21. For example, when the heat power of all heat sources 100 is the same, the regulating valve 321 connected to the uppermost steam chamber 21 has the largest opening, the second highest regulating valve 321 has a slightly smaller opening, and the third highest regulating valve 321 has an even smaller opening, decreasing sequentially from top to bottom, to achieve uniform distribution of the liquid working fluid. When only part of the heat source 100 is started, the regulating valve 321 connected to the unstarted heat source 100 is closed to prevent liquid from flowing into the unstarted steam chamber 21 and causing insufficient liquid return to the normally operating steam chamber 21.

[0071] In some embodiments, see Figure 5 At least two of the multiple liquid branch pipes 32 have different flow cross-sectional areas. With this configuration, there is no need to install a regulating valve 321, which can achieve different flow rates for at least two of the multiple liquid branch pipes 32, saving costs and simplifying control.

[0072] It is understandable that for a heat source 100 with higher power, the flow cross-sectional area of ​​its corresponding liquid branch pipe 32 is relatively large; for a heat source 100 with lower power, the flow cross-sectional area of ​​its corresponding liquid branch pipe 32 is relatively small.

[0073] Example 2

[0074] This application provides a method for controlling a radiator, which is used to control the radiator of Embodiment 1.

[0075] The radiator is used to dissipate heat from multiple heat sources 100, and the multiple heat sources 100 are set up one-to-one with multiple evaporators 2.

[0076] Specifically, the control methods for the radiator include:

[0077] The flow rates in the multiple liquid branch pipes 32 are controlled differently depending on the working conditions of the heat source 100.

[0078] Specifically, the flow rates in the multiple liquid branch pipes 32 are controlled differently according to the power of the multiple heat sources 100. A larger amount of liquid working fluid is supplied to the steam chamber 21 of the evaporator 2 corresponding to the heat source 100 with higher power, while a smaller amount of liquid working fluid is supplied to the steam chamber 21 of the evaporator 2 corresponding to the heat source 100 with lower power, thus improving the uniformity of heat dissipation from the radiator to the multiple heat sources 100.

[0079] Specifically, in this embodiment, controlling the different flow rates in the multiple liquid branch pipes 32 includes the following operations:

[0080] Each liquid branch pipe 32 is equipped with a regulating valve 321, and multiple regulating valves 321 are controlled to achieve different flow rates in the multiple liquid branch pipes 32; or,

[0081] At least two of the multiple liquid branch pipes 32 have different flow cross-sectional areas.

[0082] Specifically, each liquid branch pipe 32 is equipped with a regulating valve 321. Controlling multiple regulating valves 321 to achieve different flow rates in multiple liquid branch pipes 32 includes:

[0083] The opening degree of the regulating valve 321 corresponding to the steam chamber 21 is controlled according to the liquid level in the steam chamber 21.

[0084] In response to the liquid level in the steam chamber 21 being lower than the preset liquid level, the opening degree of the regulating valve 321 corresponding to the steam chamber 21 is increased.

[0085] In response to the liquid level in the steam chamber 21 being higher than the preset liquid level, the opening degree of the regulating valve 321 corresponding to the steam chamber 21 is reduced.

[0086] Specifically, each steam chamber 21 is equipped with a liquid level detection element 214, and the control method for the radiator also includes:

[0087] Obtain the actual liquid level height detected by each liquid level detection element 214;

[0088] Determine the ratio of the actual liquid level height to the total height of the steam chamber 21;

[0089] In response to the ratio of the actual liquid level height to the total height of the steam chamber 21 being within a preset range, the flow rate of the liquid branch pipe 32 corresponding to the steam chamber 21 is kept constant.

[0090] In response to the ratio of the actual liquid level height to the total height of the steam chamber 21 being less than the minimum value of the preset range, the flow rate of the liquid branch pipe 32 corresponding to the steam chamber 21 is increased until the ratio of the actual liquid level height to the total height of the steam chamber 21 is increased to be within the preset range.

[0091] In response to the ratio of the actual liquid level height to the total height of the steam chamber 21 being greater than the maximum value of a preset range, the flow rate of the liquid branch pipe 32 corresponding to the steam chamber 21 is reduced until the ratio of the actual liquid level height to the total height of the steam chamber 21 is reduced to within the preset range.

[0092] Example 3

[0093] This application provides a heat dissipation device that can dissipate heat from electronic devices and ensure their normal operation.

[0094] See Figure 6 The heat dissipation device includes a fan 10, a radiator, and a distribution component 20.

[0095] The radiator includes a condenser 1 and an evaporator 2 that are connected to each other.

[0096] The fan 10 is positioned at an interval relative to the condenser 1 of the radiator, and is used to supply air to the condenser 1 of the radiator.

[0097] Optionally, the heat sink can be the heat sink of Embodiment 1. Of course, in other embodiments, the heat sink can also be a heat sink with other structures.

[0098] The flow divider 20 is hinged to the end of the condenser 1 near the evaporator 2 on the windward side. The angle between the flow divider 20 and the windward side of the condenser 1 can be adjusted to control whether part of the airflow delivered by the fan 10 can flow to the evaporator 2.

[0099] When the heat dissipation device is in operation, the radiator is mounted on the electronic device, and the condensers 1 of the radiator are spaced above the evaporators 2. This ensures that the multiple evaporators 2 of the radiator are fitted one-to-one with the multiple heat sources 100 of the electronic device. The heat generated by the heat source 100 during operation is transferred to the corresponding evaporator 2, causing the working fluid in the steam chamber 21 of the evaporator 2 to absorb heat and vaporize, forming a gas. The gas enters the condensation chamber of the condenser 1 through the steam branch pipe 42 connected to the evaporator 2. At the condenser 1, the gas liquefies and releases heat, thereby releasing the heat generated by the heat source 100 during operation. Simultaneously, the cooling airflow blown by the fan 10 flows onto the condenser 1, accelerating heat dissipation from the condenser 1. The liquefied working fluid flows through multiple liquid branch pipes 32 to the steam chambers 21 of the multiple evaporators 2; the working fluid circulates repeatedly, completing the heat dissipation from the heat source 100.

[0100] If the heat source 100 has a large power, the heat dissipation effect of the condenser 1 alone is poor. In this case, the angle between the flow divider 20 and the windward side of the condenser 1 can be adjusted so that the airflow blown by the fan 10 can flow to the evaporator 2. The airflow flowing to the evaporator 2 can assist the evaporator 2 in heat dissipation, thereby reducing the heat transferred from the evaporator 2 to the condenser 1 and improving the heat dissipation effect of the condenser 1.

[0101] In other words, due to the arrangement of the flow divider 20, the heat dissipation device has two modes. In the first mode, the angle between the flow divider 20 and the windward surface of the condenser 1 is a right angle or an obtuse angle. In this mode, the airflow blown by the fan 10 cannot reach the evaporator 2 located below the condenser 1, and all the airflow blown by the fan 10 flows to the condenser 1. In the second mode, the angle between the flow divider 20 and the windward surface of the condenser 1 is an acute angle. In this mode, the airflow blown by the fan 10 is divided into two parts: one part flows along the lower surface of the flow divider 20 to the evaporator 2, and the other part flows to the condenser 1. When the power of the heat source 100 is large, the second mode is used; when the power of the heat source 100 is small, the first mode is sufficient.

[0102] Understandably, in the first mode, the power of the heat source 100 is relatively small. After the evaporator 2 absorbs the heat from the heat source 100, it transfers the heat from the heat source 100 to the condenser 1. The condenser 1 is fully capable of meeting the heat dissipation requirements of the heat source 100. Therefore, the airflow blown out by the fan 10 flows entirely to the condenser 1, ensuring the heat dissipation of the condenser 1.

[0103] In the second mode, since the heat source 100 has a large power, the heat dissipation effect of the condenser 1 alone is poor. At this time, the airflow blown by the fan 10 is divided into two parts. One part flows along the lower surface of the splitter 20 to the evaporator 2, and the other part flows to the condenser 1. The airflow flowing to the evaporator 2 can assist the evaporator 2 in heat dissipation, thereby reducing the heat transferred from the evaporator 2 to the condenser 1 and improving the heat dissipation effect of the condenser 1.

[0104] Specifically, the heat source 100 is a chip on the circuit board 300 of the electronic device. Since the circuit board 300 is generally located inside the enclosure 400 of the electronic device, the heat dissipation device is also located inside the enclosure 400.

[0105] Specifically, the flow divider 20 has a plate-like structure and is hinged to the end of the condenser 1 near the evaporator 2 on the windward side via a rotating shaft 201. The rotating shaft 201 is driven by a driving component, which can optionally be a motor.

[0106] In some embodiments, in order to ensure that a portion of the airflow blown out by the fan 10 can accurately flow to the evaporator 2 when the heat dissipation device adopts the second mode, the heat dissipation device further includes an air guide 30, which is disposed between the fan 10 and the evaporator 2. When the angle between the flow divider 20 and the windward surface of the condenser 1 is an acute angle, a flow divider channel is formed between the flow divider 20 and the air guide 30.

[0107] That is, in the second mode of the heat dissipation device, the airflow blown by the fan 10 is divided into two parts: one part flows along the diversion channel to the evaporator 2, and the other part flows to the condenser 1.

[0108] Since the condenser 1 of the radiator is spaced above the evaporator 2, that is, the evaporator 2 is located below the condenser 1, in order to ensure that the airflow flowing along the branch channel can directly blow on the evaporator 2 and ensure the heat dissipation effect on the evaporator 2, in some embodiments, the heat dissipation device also includes a first baffle 40. The first baffle 40 is disposed between the condenser 1 and the evaporator 2. The first baffle 40 and the air guide 30 are spaced apart to form a guide channel. The guide channel can guide the airflow in the branch channel to flow toward the evaporator 2.

[0109] That is, in the second mode of the heat dissipation device, the airflow blown by the fan 10 is divided into two parts. One part blows directly from above the evaporator 2 along the diversion channel and the guide channel in sequence, so as to avoid some airflow escaping directly without passing through the evaporator 2.

[0110] In some embodiments, the heat dissipation device further includes a second baffle 50, which is disposed opposite to the evaporator 2 and the condenser 1 with the same airflow facing surface.

[0111] The second baffle 50 is located on the same surface facing the windward side of the evaporator 2 and the condenser 1 to prevent the airflow flowing to the evaporator 2 from escaping from the same surface facing the windward side of the evaporator 2 and the condenser 1 instead of flowing through the evaporator.

[0112] Specifically, with Figure 6 Taking the orientation shown as an example, the condenser 1 is set with its windward side facing left, and the second baffle 50 is located on the left side of the evaporator 2 to ensure that the airflow can flow from top to bottom and pass through each evaporator 2.

[0113] In some embodiments, the heat dissipation device includes a plurality of heat sinks.

[0114] In electronic devices, the casing 400 often contains multiple vertically extending circuit boards 300, each circuit board 300 having multiple chips spaced apart along the vertical direction, which are also multiple heat sources 100. To meet the heat dissipation requirements of the multiple circuit boards 300, each circuit board 300 is equipped with a corresponding heat sink.

[0115] Specifically, in this embodiment, the heat sink in the heat dissipation device is the heat sink in Embodiment 1.

[0116] The radiator includes a condenser 1, a liquid pipe assembly 3, a vapor pipe assembly 4, and multiple evaporators 2.

[0117] The condenser 1 includes a condensing chamber, which has a condenser inlet and a condenser outlet.

[0118] Evaporator 2 includes a steam chamber 21, which has an evaporator inlet and an evaporator outlet 211.

[0119] The liquid pipe assembly 3 includes multiple liquid branch pipes 32, the inlet of each liquid branch pipe 32 is connected to the outlet of the condenser, the outlet of the multiple liquid branch pipes 32 is connected to multiple evaporator inlets in a one-to-one correspondence, and the flow rates of at least two of the multiple liquid branch pipes 32 can be different.

[0120] The steam pipe assembly 4 includes multiple steam branch pipes 42, the inlets of which are connected to multiple evaporator outlets in a one-to-one correspondence, and the outlet end of each steam branch pipe 42 is connected to the condenser inlet.

[0121] In the embodiment of this application, the radiator provides that, during operation, multiple evaporators 2 are attached to multiple heat sources 100 of the electronic device in a one-to-one correspondence. The heat generated by the heat source 100 during operation can be transferred to the evaporator 2 attached to the corresponding heat source 100, causing the working fluid in the steam chamber 21 of the evaporator 2 to absorb heat and vaporize to form gas. The gas enters the condensation chamber of the condenser 1 through the steam branch pipe 42 connected to the evaporator 2. At the condenser 1, the gas liquefies and releases heat, thereby releasing the heat generated by the heat source 100 during operation. The liquefied working fluid flows to the steam chamber 21 of the multiple evaporators 2 through multiple liquid branch pipes 32 respectively. The working fluid circulates repeatedly to complete the heat dissipation of the heat source 100. Meanwhile, since the power of the multiple heat sources 100 of the electronic device may differ during operation, and the flow rates of at least two of the multiple liquid branch pipes 32 of the liquid pipe assembly 3 in the radiator can be different, it is possible to control the delivery of more liquid working fluid to the steam chamber 21 of the evaporator 2 corresponding to the heat source 100 with higher power, and to deliver less liquid working fluid to the steam chamber 21 of the evaporator 2 corresponding to the heat source 100 with lower power, so that the radiator has better heat dissipation uniformity for the multiple heat sources 100.

[0122] Specifically, the liquid pipe assembly 3 also includes a distributor 33 and a liquid pipe 31. The liquid pipe 31 is connected between the outlet of the condenser 1 and the inlet of the distributor 33, and the liquid branch pipe 32 is connected between the outlet of the distributor 33 and the inlet of the evaporator 2. It can be understood that the distributor 33 has multiple outlets, each corresponding to a different liquid branch pipe 32.

[0123] When the radiator is running, the liquid working fluid in the condenser 1 flows to the distributor 33 through the liquid pipe 31. The distributor 33 then distributes the liquid to each liquid branch pipe 32, so that the liquid working fluid in the condenser 1 flows to the steam chamber 21 of each evaporator 2.

[0124] Specifically, the steam pipe assembly 4 also includes a steam pipe 41 and a steam collector 43. The steam pipe 41 is connected between the inlet of the condenser 1 and the inlet of the steam collector 43, and the steam branch pipe 42 is connected between the inlet of the steam collector 43 and the outlet of the evaporator 2. It is understood that the steam collector 43 has multiple inlets, each corresponding to a different steam branch pipe 42.

[0125] When the radiator is running, the gaseous working fluid in the steam chamber 21 of each evaporator 2 enters the steam collector 43 through its corresponding steam branch pipe 42, and then enters the condenser 1 through the steam collector 43 and the steam pipe 41 to condense and form a liquid working fluid.

[0126] In some embodiments, see Figure 3 The steam chamber 21 has a supporting structure 212; and / or

[0127] The steam chamber 21 has an enhanced boiling structure 213, which helps to improve the heat exchange efficiency of the steam chamber 21.

[0128] The support structure 212 can support the evaporator 2 and ensure the structural stability of the evaporator 2.

[0129] Optionally, the steam chamber 21 may be provided with a separate support structure 212 or a separate enhanced boiling structure 213. Alternatively, both the support structure 212 and the enhanced boiling structure 213 may be provided simultaneously.

[0130] Specifically, the support structure 212 is columnar. The height of the support structure 212 is the same as the thickness of the steam chamber 21, and it provides support for the evaporator 2.

[0131] Specifically, the enhanced boiling structure 213 can be tiny pits or grooves machined into the inner wall of the steam chamber 21. This enhanced boiling structure 213 enables the liquid to quickly form evaporation bubble nuclei, improving boiling heat exchange efficiency and thus allowing evaporation to proceed rapidly. Simultaneously, the enhanced boiling structure 213 also guides the steam within the steam chamber 21 to flow towards the upper wall of the steam chamber 21, allowing the evaporator 2 to exchange heat with the outside air, thereby promoting the initial condensation and heat release of the steam on the upper wall of the steam chamber 21.

[0132] Specifically, the evaporator 2 includes an evaporator shell and an evaporator cover plate. The evaporator shell encloses a steam chamber 21 with one end open. A support structure 212 and a boiling enhancement structure 213 are both disposed on the bottom wall of the evaporator shell. The evaporator cover plate is placed on the evaporator shell to seal the opening of the steam chamber 21. One end of the support structure 212 is vertically fixed to the bottom wall of the evaporator shell, and the other end can abut against the evaporator cover plate, thereby providing support for the evaporator 2.

[0133] The steam chamber 21 stores a liquid working fluid that is in direct contact with the heat source 100. The liquid working fluid in the steam chamber 21 vaporizes, absorbs heat, and generates steam. Each steam chamber 21 is connected to a steam branch pipe 42 and a liquid branch pipe 32 to discharge steam and receive return liquid, ensuring that the evaporation process continues.

[0134] The evaporator housing is provided with mounting holes 23 to allow the evaporator housing to be mounted on the circuit board 300. Specifically, the mounting holes 23 are threaded holes.

[0135] Furthermore, the evaporator cover plate is provided with first fins 22. The first fins 22 can increase the heat dissipation area, thereby further dissipating heat from the heat source 100.

[0136] Specifically, the evaporator 2 includes an evaporator body and first fins 22. The steam chamber 21 is disposed in the evaporator body, and multiple first fins 22 are disposed on the outer surface of the evaporator body.

[0137] Optionally, the first fins 22 of the multiple evaporators 2 have the same density; or

[0138] Along the direction away from the condenser 1, the density of the first fins 22 of the multiple evaporators 2 gradually increases.

[0139] Specifically, the evaporator body includes an evaporator shell and an evaporator cover.

[0140] The first fin 22 increases the contact area between the evaporator 2 and the outside world, thereby increasing the heat dissipation area of ​​the evaporator 2 and improving the heat exchange efficiency between the evaporator 2 and the outside air. This improves the primary heat release efficiency of the steam in the evaporator 2 and avoids the safety hazards caused by the evaporator 2 being too hot.

[0141] Understandably, the greater the density of the first fins 22 on the evaporator 2, the smaller the distance between two adjacent first fins 22. Furthermore, the condenser 1 is provided with second fins, which exchange heat with the external airflow, allowing the steam entering the condenser 1 to be quickly liquefied into a liquid working fluid.

[0142] It is understandable that the condenser 1 is equipped with multiple second fins to increase the heat exchange area between the condenser 1 and the outside environment, thereby improving the heat dissipation efficiency of the condenser 1.

[0143] Preferably, in this embodiment, the density of the first fins 22 of the plurality of evaporators 2 gradually increases along the direction away from the condenser 1.

[0144] In this embodiment, when the second mode is adopted, the airflow flowing to the evaporator 2 along the lower surface of the flow divider 20 in the direction away from the condenser 1 is smaller. Furthermore, due to thermal cascading, the further the evaporator 2 is from the condenser 1, the higher the temperature of the airflow flowing to the evaporator 2. Therefore, along the direction away from the condenser 1, the density of the first fins 22 of the multiple evaporators 2 gradually increases, making the surface area of ​​the evaporators 2 further away from the condenser 1 larger. This increases the heat dissipation area of ​​the evaporators 2, thereby improving the heat exchange efficiency between the evaporators 2 and the outside air.

[0145] In some embodiments, see Figure 4 In order to ensure that at least two of the multiple liquid branch pipes 32 have different flow rates, each liquid branch pipe 32 is equipped with a regulating valve 321.

[0146] By adjusting the opening of the regulating valve 321, the flow rate of the liquid branch pipe 32 corresponding to the regulating valve 321 can be regulated.

[0147] It is understandable that the flow rates of multiple liquid branch pipes 32 can be made the same, or at least two different, by adjusting the opening of multiple regulating valves 321.

[0148] When this radiator is applied to a specific product, multiple heat sources 100 on the product are arranged vertically at intervals. Therefore, the multiple evaporators 2 of the radiator also need to be arranged vertically at intervals, and the condensers 1 are generally positioned above the uppermost evaporator 2 at intervals. This results in different vertical height differences between the various evaporators 2 and condensers 1, and different flow rates of liquid inside the liquid branch pipes 32 under gravity, causing uneven liquid return to the steam chamber 21. The regulating valve 321 provides additional resistance to regulate the flow rate between different liquid branch pipes 32, thereby maintaining the normal liquid level in each steam chamber 21. For example, when the heat power of all heat sources 100 is the same, the regulating valve 321 connected to the uppermost steam chamber 21 has the largest opening, the second highest regulating valve 321 has a slightly smaller opening, and the third highest regulating valve 321 has an even smaller opening, decreasing sequentially from top to bottom, to achieve uniform distribution of the liquid working fluid. When only part of the heat source 100 is started, the regulating valve 321 connected to the unstarted heat source 100 is closed to prevent liquid from flowing into the unstarted steam chamber 21 and causing insufficient liquid return to the normally operating steam chamber 21.

[0149] In some embodiments, see Figure 5At least two of the multiple liquid branch pipes 32 have different flow cross-sectional areas. With this configuration, there is no need to install a regulating valve 321, which can achieve different flow rates for at least two of the multiple liquid branch pipes 32, saving costs and simplifying control.

[0150] It is understandable that for a heat source 100 with higher power, the flow cross-sectional area of ​​its corresponding liquid branch pipe 32 is relatively large; for a heat source 100 with lower power, the flow cross-sectional area of ​​its corresponding liquid branch pipe 32 is relatively small.

[0151] Example 4

[0152] This application provides a control method for a heat dissipation device, which controls the heat dissipation device. The heat dissipation device's radiator is used to dissipate heat from multiple heat sources 100. The radiator includes multiple evaporators 2, and the multiple heat sources 100 are arranged in a one-to-one correspondence with the multiple evaporators 2.

[0153] See Figure 7 The control methods for the heat dissipation device include:

[0154] S1. Obtain the actual total power consumption of all heat sources 100 and the ultimate total power consumption of all heat sources 100;

[0155] S2. Obtain the ratio of actual total power consumption to maximum total power consumption;

[0156] S3. Based on the ratio of actual total power consumption to ultimate total power consumption, control the angle between the flow divider 20 and the windward side of the condenser 1.

[0157] The control method of the above-mentioned heat dissipation device enables the heat dissipation device to dissipate heat from multiple heat sources 100 with optimal heat dissipation efficiency.

[0158] The heat sink of the heat dissipation device is installed on the electronic device, and the condensers 1 of the heat sink are spaced above the evaporators 2. This ensures that the multiple evaporators 2 of the heat sink are fitted one-to-one with the multiple heat sources 100 of the electronic device. The heat generated by the heat source 100 during operation is transferred to the corresponding evaporator 2, causing the working fluid in the vapor chamber 21 of the evaporator 2 to absorb heat and vaporize, forming a gas. This gas enters the condensation chamber of the condenser 1 through the vapor branch pipe 42 connected to the evaporator 2. At the condenser 1, the gas liquefies and releases heat, thus releasing the heat generated by the heat source 100 during operation. Simultaneously, the cooling airflow blown by the fan 10 flows onto the condenser 1, accelerating heat dissipation. The liquefied working fluid flows through multiple liquid branch pipes 32 to the vapor chambers 21 of the multiple evaporators 2; the working fluid circulates repeatedly, completing the heat dissipation of the heat source 100.

[0159] Based on the ratio of actual total power consumption to ultimate total power consumption, the angle between the flow divider 20 and the windward side of the condenser 1 is controlled to achieve the optimal angle between the flow divider 20 and the windward side of the condenser 1.

[0160] In some embodiments, controlling the angle between the shunt element 20 and the windward side of the condenser 1 based on the ratio of actual total power consumption to maximum total power consumption includes:

[0161] In response to the ratio of actual total power consumption to limit total power consumption being less than a first set value, the flow divider 20 is controlled to rotate to a preset position to prevent the airflow delivered by the fan 10 from flowing to the evaporator 2;

[0162] If the ratio of actual total power consumption to ultimate total power consumption is greater than a first set value, the flow divider 20 is controlled to rotate away from the preset position so that part of the airflow delivered by the fan 10 can flow to the evaporator 2.

[0163] Furthermore, based on the ratio of actual total power consumption to ultimate total power consumption, controlling the angle between the shunt element 20 and the windward side of the condenser 1 also includes:

[0164] In response to the ratio of actual total power consumption to maximum total power consumption being equal to a first set value, the flow divider 20 is controlled to rotate away from the preset position, so that a portion of the airflow delivered by the fan 10 can flow to the evaporator 2; or,

[0165] In response to the ratio of actual total power consumption to ultimate total power consumption being equal to a first set value, the flow divider 20 is controlled to rotate to a preset position to prevent the airflow delivered by the fan 10 from flowing to the evaporator 2.

[0166] That is, when the ratio of the actual total power consumption to the maximum total power consumption is equal to the first set value, the shunt component 20 can be controlled to be in a preset position or to leave the preset position. It can be set as needed, and this application does not impose too many restrictions.

[0167] Specifically, the size of the first set value can be set as needed, and this application embodiment does not impose too many restrictions.

[0168] Optionally, the first setting value is 50%-70%; further optionally, the first setting value is 50%, 55%, 60%, 65%, or 70%.

[0169] Specifically, the preset position is such that the flow divider 20 is perpendicular to the windward side of the condenser 1, so as to prevent the airflow delivered by the fan 10 from flowing to the evaporator 2.

[0170] Specifically, if the ratio of actual total power consumption to maximum total power consumption is greater than a first set value, it indicates that the heat dissipation pressure of condenser 1 will be relatively high. In this case, the flow divider 20 is controlled to rotate upward from a preset position so that part of the airflow delivered by fan 10 can flow to evaporator 2. Optionally, the angle at which the flow divider 20 rotates upward from the preset position is less than a set angle. Further optionally, the set angle is 30°. Of course, in other embodiments, the set angle can also be set to other values, and this application does not impose too many restrictions.

[0171] Evaporator 2 includes a steam chamber 21. In some embodiments, each steam chamber 21 is provided with a liquid level detection element 214, and the control method of the heat dissipation device further includes:

[0172] Obtain the actual liquid level height detected by each liquid level detection element 214;

[0173] Determine the ratio of the actual liquid level height to the total height of the steam chamber 21;

[0174] In response to the ratio of the actual liquid level height to the total height of the steam chamber 21 being within a preset range, the flow rate of the liquid branch pipe 32 corresponding to the steam chamber 21 is kept constant.

[0175] In response to the ratio of the actual liquid level height to the total height of the steam chamber 21 being less than the minimum value of the preset range, the flow rate of the liquid branch pipe 32 corresponding to the steam chamber 21 is increased until the ratio of the actual liquid level height to the total height of the steam chamber 21 is increased to be within the preset range.

[0176] In response to the ratio of the actual liquid level height to the total height of the steam chamber 21 being greater than the maximum value of a preset range, the flow rate of the liquid branch pipe 32 corresponding to the steam chamber 21 is reduced until the ratio of the actual liquid level height to the total height of the steam chamber 21 is reduced to within the preset range.

[0177] Furthermore, in order to regulate the flow rate of each liquid branch pipe 32, each liquid branch pipe 32 is equipped with a regulating valve 321. When regulating the flow rate of the liquid branch pipe 32, the opening of the regulating valve 321 is adjusted according to a preset speed.

[0178] Optionally, in this embodiment, the preset range is 70%-80% (including the two endpoint values). If the ratio of the actual liquid level height to the total height of the steam chamber 21 is within 70%-80%, it indicates that the steam chamber 21 is at a healthy liquid level, and the opening of the regulating valve 321 corresponding to the steam chamber 21 remains unchanged.

[0179] If the ratio of the actual liquid level height to the total height of the steam chamber 21 is less than 70%, the opening of the regulating valve 321 corresponding to the steam chamber 21 is increased. Optionally, when adjusting the opening of the regulating valve 321, the opening is adjusted according to a first set speed. Further optionally, the first set speed can be selected as controlling the regulating valve 321 to increase at a speed of 1%-5% / min until the liquid level height in the steam chamber 21 exceeds 70%. Of course, in other embodiments, the first set speed can also be set to other values ​​as needed. Specifically, when selecting the first set speed, the number of heat sources 100 and the system complexity of the heat dissipation device need to be considered. The greater the system complexity, the slower the first set speed should be, so as to allow the system response time.

[0180] If the ratio of the actual liquid level height to the total height of the steam chamber 21 is greater than 80%, the opening of the regulating valve 321 corresponding to the steam chamber 21 is reduced. Optionally, when adjusting the opening of the regulating valve 321, its opening is adjusted according to a second set speed. Further optionally, the second set speed can be selected as controlling the regulating valve 321 to decrease at a speed of 1%-5% / min until the liquid level height in the steam chamber 21 is lower than 80%. Of course, in other embodiments, the second set speed can also be set to other values ​​as needed. Specifically, when selecting the second set speed, the number of heat sources 100 and the system complexity of the heat dissipation device need to be considered. The greater the system complexity, the slower the second set speed should be, so as to allow the system response time.

[0181] Example 5

[0182] This application provides an electronic device.

[0183] The electronic device includes the aforementioned heat dissipation device and multiple heat sources 100. The electronic device includes heat sources 100 and the aforementioned heat dissipation device, wherein the evaporator 2 of the heat sink of the heat dissipation device is correspondingly arranged with the heat source 100 to absorb heat from the heat source 100.

[0184] More specifically, the multiple evaporators 2 of the heat dissipation device are arranged one-to-one with the multiple heat sources 100 to absorb the heat from the heat sources 100.

[0185] When the electronic device is working, the heat source 100 generates a large amount of heat, and the increased temperature will affect the normal operation of the heat source 100. A heat dissipation device is installed on the electronic device, and the condensers 1 of the heat source 1 are spaced above the evaporators 2. This ensures that the multiple evaporators 2 of the heat source 100 are correspondingly attached to the multiple heat sources 100 of the electronic device. The heat generated by the heat source 100 during operation can be transferred to the corresponding evaporator 2, causing the working fluid in the steam chamber 21 of the evaporator 2 to absorb heat and vaporize, forming a gas. The gas enters the condensation chamber of the condenser 1 through the steam branch pipe 42 connected to the evaporator 2. At the condenser 1, the gas liquefies and releases heat, thereby releasing the heat generated by the heat source 100 during operation. Simultaneously, the cooling airflow blown by the fan 10 can flow onto the condenser 1, accelerating the heat dissipation of the condenser 1. The liquefied working fluid flows through multiple liquid branch pipes 32 to the steam chambers 21 of multiple evaporators 2 respectively; the working fluid circulates back and forth to complete the heat dissipation of the heat source 100.

[0186] In other words, due to the arrangement of the flow divider 20, the heat dissipation device has two modes. In the first mode, the angle between the flow divider 20 and the windward surface of the condenser 1 is a right angle or an obtuse angle. In this mode, the airflow blown by the fan 10 cannot reach the evaporator 2 located below the condenser 1, and all the airflow blown by the fan 10 flows to the condenser 1. In the second mode, the angle between the flow divider 20 and the windward surface of the condenser 1 is an acute angle. In this mode, the airflow blown by the fan 10 is divided into two parts: one part flows along the lower surface of the flow divider 20 to the evaporator 2, and the other part flows to the condenser 1. When the power of the heat source 100 is large, the second mode is used; when the power of the heat source 100 is small, the first mode is sufficient.

[0187] Specifically, the heat source 100 is a chip on the circuit board 300 of the electronic device. Since the circuit board 300 is generally located inside the enclosure 400 of the electronic device, the heat dissipation device is also located inside the enclosure 400.

[0188] Furthermore, in some embodiments, see Figure 8 The electronic device also includes a controller 200, which is electrically connected to the shunt 20 to control the rotation angle of the shunt 20.

[0189] Specifically, the controller 200 is electrically connected to each heat source 100, and at the same time, the controller 200 is electrically connected to the diverter 20, so that the controller 200 can control the rotation of the diverter 20 according to the specific working state of the heat source 100.

[0190] If the controller 200 detects that the power of the heat source 100 is too high, the heat dissipation effect of the condenser 1 alone is poor. At this time, the controller 200 adjusts the angle between the flow divider 20 and the windward side of the condenser 1, so that the airflow blown by the fan 10 can flow to the evaporator 2. The airflow flowing to the evaporator 2 can assist the evaporator 2 in heat dissipation, thereby reducing the heat transferred from the evaporator 2 to the condenser 1 and improving the heat dissipation effect of the condenser 1.

[0191] Specifically, the controller 200 is electrically connected to the heat source 100 via signal line 500, and the controller 200 is electrically connected to the rotating shaft 201 via control line 600.

[0192] In some embodiments, the controller 200 can control the flow rate in the liquid branch pipe 32. Specifically, each liquid branch pipe 32 is provided with a regulating valve 321, and the controller 200 is electrically connected to the regulating valve 321. By adjusting the opening of the regulating valve 321, the flow rate of the liquid branch pipe 32 can be regulated.

[0193] Specifically, in electronic devices, after the heat dissipation device is installed, a main flow channel is formed between the diverter 20 and the top plate of the housing. When a local heat source 100 is under high load, the total load is low, and the diverter channel can be closed, allowing the condenser 1 to dissipate heat. This reduces the design volume of the condenser 1, making the heat dissipation structure compact and effectively reducing size and cost. When all heat sources 100 are at full load, the total load is high, and a diverter channel is formed between the diverter 20 and the air guide 30. A portion of the airflow blown by the fan 10 flows directly along the main flow channel through the condenser 1, reducing pressure loss and increasing the airflow through the electronic device, thereby improving the heat dissipation capacity of the electronic device. Another portion of the airflow blown by the fan 10 blows along the diverter channel towards the evaporator 2, dissipating heat from the evaporator 2 and effectively sharing the heat dissipation pressure of the condenser 1, avoiding the problem of efficiency reduction caused by an excessively long airflow duct in the condenser 1. The flow distribution of the two airflow channels, the main flow channel and the diverter channel, can be flexibly adjusted according to the actual power consumption distribution of the heat source 100, improving the heat dissipation efficiency and adaptability of the heat dissipation device.

[0194] Meanwhile, in electronic devices, since the circuit board 300 is generally installed vertically inside the casing 400, the multiple heat sources 100 on the circuit board 300 are also arranged vertically at intervals. The condenser 1 is located above the evaporator 2, and the multiple evaporators 2 in the radiator are arranged one-to-one with the multiple heat sources 100 on the circuit board 300. Therefore, the multiple evaporators 2 of the radiator are also arranged vertically in sequence. Similarly, the liquid branch pipes 32 corresponding to the evaporators 2 are also arranged vertically. Due to the height difference between the multiple evaporators 2 of the radiator, there is an uneven liquid return problem. Moreover, since the multiple heat sources 100 also have different heat consumption during operation, the multiple evaporators 2 also have a local drying problem caused by the uneven distribution of heat consumption of the heat sources 100. In this embodiment, the controller 200 can control the flow rate in the liquid branch pipe 32, ensuring the reasonable distribution of the liquid working fluid and improving the reliability and adaptability of the radiator.

[0195] Each evaporator 2 is configured in a one-to-one correspondence with each heat source 100, enabling independent deployment of each evaporator 2 and resolving the contact problems caused by the height differences of the heat sources 100. This avoids the additional thermal resistance introduced by the introduction of tolerance-based interface materials and improves heat dissipation efficiency.

[0196] Example 6

[0197] See Figure 9 This application provides an electronic device, which includes a housing 400. A circuit board 300 arranged vertically is disposed inside the housing 400. A plurality of heat sources 100 are arranged vertically on the circuit board 300, and the plurality of heat sources 100 operate with the same rated power.

[0198] Specifically, the heat source 100 is a chip. There are multiple circuit boards 300, which are arranged side by side in the bottom space of the insertion box 400.

[0199] The electronic device is equipped with the aforementioned heat dissipation device. The number of heat sinks in the heat dissipation device is the same as the number of circuit boards 300, and the two are set in a one-to-one correspondence.

[0200] The heat dissipation device includes a radiator. The radiator includes a condenser 1, a liquid pipe assembly 3, a vapor pipe assembly 4, and multiple evaporators 2. The condenser 1 includes a condensation chamber having a condenser inlet and a condenser outlet.

[0201] Evaporator 2 includes a steam chamber 21, which has an evaporator inlet and an evaporator outlet 211.

[0202] The liquid pipe assembly 3 includes multiple liquid branch pipes 32, the inlet of each liquid branch pipe 32 is connected to the outlet of the condenser, the outlet of the multiple liquid branch pipes 32 is connected to multiple evaporator inlets in a one-to-one correspondence, and the flow rates of at least two of the multiple liquid branch pipes 32 can be different.

[0203] The steam pipe assembly 4 includes multiple steam branch pipes 42, the inlets of which are connected to multiple evaporator outlets in a one-to-one correspondence, and the outlet end of each steam branch pipe 42 is connected to the condenser inlet.

[0204] Specifically, the liquid pipe assembly 3 also includes a distributor 33 and a liquid pipe 31. The liquid pipe 31 is connected between the outlet of the condenser 1 and the inlet of the distributor 33, and the liquid branch pipe 32 is connected between the outlet of the distributor 33 and the inlet of the evaporator 2. It can be understood that the distributor 33 has multiple outlets, each corresponding to a different liquid branch pipe 32.

[0205] Specifically, the steam pipe assembly 4 also includes a steam pipe 41 and a steam collector 43. The steam pipe 41 is connected between the inlet of the condenser 1 and the inlet of the steam collector 43, and the steam branch pipe 42 is connected between the inlet of the steam collector 43 and the outlet of the evaporator 2. It is understood that the steam collector 43 has multiple inlets, each corresponding to a different steam branch pipe 42.

[0206] The steam chamber 21 is equipped with a support structure 212 and a boiling enhancement structure 213.

[0207] Furthermore, four heat sources 100 are arranged vertically at intervals on each circuit board 300. Each heat source 100 operates at a constant power Q. The vertical heights between the four heat sources 100 from top to bottom are h1, h2, h3, and h4, respectively (this height is the distance between the lowest point of heat source 100 and the bottom plate of the insertion box 400). Each heat source 100 is equipped with an evaporator 2. A first baffle 40 is positioned above and perpendicular to the circuit board 300. A fan 10 is located at the entrance of the space above the insertion box 400, generating cool air into the insertion box 400.

[0208] The flow divider 20 is hinged to the windward side of the condenser 1, see [reference]. Figure 9 When the flow divider 20 is adjusted to form an acute angle with the windward surface, it can divide the cold airflow from the fan 10 into two parts. The upper part of the flow divider 20 is the main flow channel, and part of the cold air flows horizontally through the condenser 1 of the radiator in the main flow channel, carrying away some of the heat.

[0209] The rotating shaft 201 is located at the connection between the flow divider 20 and the condenser 1. By rotating and adjusting the flow divider 20, 70% of the flow rate enters the main flow channel to provide heat dissipation for the condenser 1; and 30% of the flow rate enters the flow divider channel to provide auxiliary heat dissipation for the evaporator 2.

[0210] The air guide 30 is located below the flow divider 20, forming a downward airflow channel with the flow divider 20. This allows some of the cold air blown out by the fan 10 to flow in from below the flow divider 20 and blow down through multiple evaporators 2, carrying away some of the heat from the evaporators 2.

[0211] The first baffle 40 is placed vertically above the circuit board 300. The first baffle 40 and the air guide 30 are arranged at intervals to form a flow channel. The flow channel can guide the airflow in the flow channel toward the evaporator 2 and prevent cold air from being discharged from above the circuit board 300.

[0212] Specifically, the radiator includes four evaporators 2, one condenser 1, one distributor 33, one steam collector 43, one steam pipe 41, one liquid pipe 31, four steam branch pipes 42, four liquid branch pipes 32, and four regulating valves 321. Figure 9 (Not shown in the image).

[0213] Optionally, the heat sink is made of aluminum alloy.

[0214] Along the direction of the airflow through the evaporator 2, the spacing between the first fins 22 on each evaporator 2 decreases from top to bottom to increase the heat dissipation area and ensure that the first fins 22 on each evaporator 2 generate 20%Q of heat dissipation under thermal cascading conditions.

[0215] A regulating valve 321 is installed on each liquid branch pipe 32. Specifically, the regulating valve 321 is connected in series with each liquid branch pipe 32. Since the power consumption of each heat source 100 is the same, the evaporation rate is the same. Therefore, the opening degree of the regulating valve 321 is determined according to the height difference between the distributor 33 and the evaporator 2 connected to the liquid branch pipe 32. The opening degrees of the regulating valve 321 corresponding to the evaporators with heights of h1, h2, h3 and h4 are 80%, 70%, 60% and 50% respectively, decreasing step by step, to increase the return liquid resistance of the relatively lower evaporator 2, forcing a portion of the liquid to be distributed to the relatively upper evaporator 2, so as to ensure uniform return liquid and stability of the liquid level in each evaporator 2.

[0216] Example 7

[0217] See Figure 10 This application provides an electronic device, which includes a housing 400. A circuit board 300 arranged vertically is disposed inside the housing 400. Multiple heat sources 100 are arranged vertically on the circuit board 300. The multiple heat sources 100 operate at the same rated power for a long time.

[0218] Specifically, the heat source 100 is a chip. There are multiple circuit boards 300, which are arranged side by side in the bottom space of the insertion box 400.

[0219] The electronic device is equipped with the aforementioned heat dissipation device. The number of heat sinks in the heat dissipation device is the same as the number of circuit boards 300, and the two are set in a one-to-one correspondence.

[0220] The heat dissipation device includes a radiator. The radiator includes a condenser 1, a liquid pipe assembly 3, a vapor pipe assembly 4, and multiple evaporators 2. The condenser 1 includes a condensation chamber having a condenser inlet and a condenser outlet.

[0221] Evaporator 2 includes a steam chamber 21, which has an evaporator inlet and an evaporator outlet 211.

[0222] The liquid pipe assembly 3 includes multiple liquid branch pipes 32, the inlet of each liquid branch pipe 32 is connected to the outlet of the condenser, the outlet of the multiple liquid branch pipes 32 is connected to multiple evaporator inlets in a one-to-one correspondence, and the flow rates of at least two of the multiple liquid branch pipes 32 can be different.

[0223] The steam pipe assembly 4 includes multiple steam branch pipes 42, the inlets of which are connected to multiple evaporator outlets in a one-to-one correspondence, and the outlet end of each steam branch pipe 42 is connected to the condenser inlet.

[0224] Specifically, the liquid pipe assembly 3 also includes a distributor 33 and a liquid pipe 31. The liquid pipe 31 is connected between the outlet of the condenser 1 and the inlet of the distributor 33, and the liquid branch pipe 32 is connected between the outlet of the distributor 33 and the inlet of the evaporator 2. It can be understood that the distributor 33 has multiple outlets, each corresponding to a different liquid branch pipe 32.

[0225] Specifically, the steam pipe assembly 4 also includes a steam pipe 41 and a steam collector 43. The steam pipe 41 is connected between the inlet of the condenser 1 and the inlet of the steam collector 43, and the steam branch pipe 42 is connected between the inlet of the steam collector 43 and the outlet of the evaporator 2. It is understood that the steam collector 43 has multiple inlets, each corresponding to a different steam branch pipe 42.

[0226] The steam chamber 21 is equipped with a support structure 212 and a boiling enhancement structure 213.

[0227] Specifically, the heat source 100 is a chip. There are multiple circuit boards 300, which are arranged side by side in the bottom space of the insertion box 400.

[0228] The electronic device is equipped with the aforementioned heat dissipation device. The number of heat sinks in the heat dissipation device is the same as the number of circuit boards 300, and the two are set in a one-to-one correspondence.

[0229] Furthermore, four heat sources 100 are arranged vertically at intervals on each circuit board 300. Each heat source 100 operates at a constant power Q. The vertical heights between the four heat sources 100 from top to bottom are h1, h2, h3, and h4, respectively (this height is the distance between the lowest point of heat source 100 and the bottom plate of the insertion box 400). Each heat source 100 is equipped with an evaporator 2. A first baffle 40 is positioned above and perpendicular to the circuit board 300. A fan 10 is located at the entrance of the space above the insertion box 400, generating cool air into the insertion box 400.

[0230] The flow divider 20 is hinged to the windward side of the condenser 1. When the flow divider 20 is adjusted to form an acute angle with the windward side, it can divide the cold airflow from the fan 10 into two parts. The upper part of the flow divider 20 is the main flow channel, and part of the cold air flows horizontally through the main flow channel across the condenser 1 of the radiator, carrying away some heat.

[0231] The rotating shaft 201 is located at the connection between the flow divider 20 and the condenser 1. By rotating and adjusting the flow divider 20, 70% of the flow rate enters the main flow channel to provide heat dissipation for the condenser 1; and 30% of the flow rate enters the flow divider channel to provide auxiliary heat dissipation for the evaporator 2.

[0232] The air guide 30 is located below the flow divider 20, forming a downward airflow channel with the flow divider 20. This allows some of the cold air blown out by the fan 10 to flow in from below the flow divider 20 and blow down through multiple evaporators 2, carrying away some of the heat from the evaporators 2.

[0233] The first baffle 40 is placed vertically above the circuit board 300. The first baffle 40 and the air guide 30 are arranged at intervals to form a flow channel. The flow channel can guide the airflow in the flow channel toward the evaporator 2 and prevent cold air from being discharged from above the circuit board 300.

[0234] Specifically, the radiator includes four evaporators 2, one condenser 1, one distributor 33, one steam collector 43, one steam pipe 41, one liquid pipe 31, as well as four steam branch pipes 42, four liquid branch pipes 32 and four regulating valves 321.

[0235] Optionally, the heat sink is made of aluminum alloy.

[0236] Along the direction of the airflow through the evaporator 2, the spacing between the first fins 22 on each evaporator 2 decreases from top to bottom to increase the heat dissipation area and ensure that the first fins 22 on each evaporator 2 generate 20%Q of heat dissipation under thermal cascading conditions.

[0237] Unlike Embodiment Six, in this embodiment, no regulating valve 321 is provided on the liquid branch pipe 32, and the flow areas of the four liquid branch pipes 32 are different, so as to achieve uniform liquid distribution to the four evaporators 2.

[0238] See Figure 10 For ease of description, the four evaporators 2 from top to bottom are referred to as the first evaporator 24, the second evaporator 25, the third evaporator 26, and the fourth evaporator 27, respectively. The diameters of the first evaporator 24, the second evaporator 25, the third evaporator 26, and the fourth evaporator 27 are d1, d2, d3, and d4, respectively. The heights of the distributor 33 and the first evaporator 24, the second evaporator 25, the third evaporator 26, and the fourth evaporator 27 from top to bottom are l1, l2, l3, and l4, respectively.

[0239] Under stable operating conditions, for each liquid branch pipe 32 corresponding to evaporator 2, the liquid inside the pipe is driven by gravitational potential difference. According to Bernoulli's equation, neglecting local resistance, the following mechanical equilibrium exists:

[0240]

[0241] Among them l i (i = 1, 2, 3, 4) represent the height differences between different evaporators 2 and distributors 33; ΔP represents the fluid friction resistance, and the Darcy-Weisbach equation is introduced to calculate the pipe friction loss. The Darcy-Weisbach equation can be expressed as:

[0242]

[0243] Where L is the height difference; D is the pipe diameter. is the average liquid velocity. f is the friction factor along the flow path. The drag factor for laminar flow can be calculated using the following formula:

[0244] f = 64 / Re

[0245] Combining the above formulas, we can obtain the relationship between the velocity of the fluid flowing into evaporator 2 and the pipe diameter under a certain height difference L:

[0246]

[0247] Based on the pipeline flow rate Q 回液 Relationship with speed:

[0248]

[0249] By combining the above formulas, we can obtain the relationship between a certain height difference L, the inner diameter d of the pipe, and the return fluid flow rate Q:

[0250]

[0251] Given a specific return flow rate Q 回液Based on the different height differences l1, l2, l3, and l4, the required pipe diameters d1, d2, d3, and d4 of the liquid branch pipe 32 can be calculated. If R1233zd refrigerant is used as the working fluid, the return liquid flow rate Q of each pipe... 回液 =0.00135kg / s, the height difference between evaporator 2 and distributor 33 from top to bottom are: d1=140mm, d2=260mm, d3=390mm, d4=510mm, and the corresponding liquid branch pipe diameters are calculated to be: l1=1.3mm, l1=1.1mm, l1=1.0mm, l1=0.9mm.

[0252] Example 8

[0253] See Figure 11 This embodiment provides an electronic device. The electronic device includes a housing 400, in which a circuit board 300 arranged vertically is disposed. Multiple heat sources 100 are arranged vertically on the circuit board 300. The multiple heat sources 100 do not work simultaneously, and only some heat sources work in each time period.

[0254] Specifically, the heat source 100 is a chip. There are multiple circuit boards 300, which are arranged side by side in the bottom space of the insertion box 400.

[0255] The electronic device is equipped with the aforementioned heat dissipation device. The number of heat sinks in the heat dissipation device is the same as the number of circuit boards 300, and the two are set in a one-to-one correspondence.

[0256] The heat dissipation device includes a radiator. The radiator includes a condenser 1, a liquid pipe assembly 3, a vapor pipe assembly 4, and multiple evaporators 2. The condenser 1 includes a condensation chamber having a condenser inlet and a condenser outlet.

[0257] Evaporator 2 includes a steam chamber 21, which has an evaporator inlet and an evaporator outlet 211.

[0258] The liquid pipe assembly 3 includes multiple liquid branch pipes 32, the inlet of each liquid branch pipe 32 is connected to the outlet of the condenser, the outlet of the multiple liquid branch pipes 32 is connected to multiple evaporator inlets in a one-to-one correspondence, and the flow rates of at least two of the multiple liquid branch pipes 32 can be different.

[0259] The steam pipe assembly 4 includes multiple steam branch pipes 42, the inlets of which are connected to multiple evaporator outlets in a one-to-one correspondence, and the outlet end of each steam branch pipe 42 is connected to the condenser inlet.

[0260] Specifically, the liquid pipe assembly 3 also includes a distributor 33 and a liquid pipe 31. The liquid pipe 31 is connected between the outlet of the condenser 1 and the inlet of the distributor 33, and the liquid branch pipe 32 is connected between the outlet of the distributor 33 and the inlet of the evaporator 2. It can be understood that the distributor 33 has multiple outlets, each corresponding to a different liquid branch pipe 32.

[0261] Specifically, the steam pipe assembly 4 also includes a steam pipe 41 and a steam collector 43. The steam pipe 41 is connected between the inlet of the condenser 1 and the inlet of the steam collector 43, and the steam branch pipe 42 is connected between the inlet of the steam collector 43 and the outlet of the evaporator 2. It is understood that the steam collector 43 has multiple inlets, each corresponding to a different steam branch pipe 42.

[0262] The steam chamber 21 is equipped with a support structure 212 and a boiling enhancement structure 213.

[0263] Furthermore, four heat sources 100 are arranged vertically at intervals on each circuit board 300. Only one of the four heat sources 100 operates at a constant power Q, while the others are off. The vertical heights between the four heat sources 100 from top to bottom are h1, h2, h3, and h4, respectively (this height is the distance between the lowest point of heat source 100 and the bottom plate of the insertion box 400). Each heat source 100 is equipped with an evaporator 2. A first baffle 40 is positioned above and perpendicular to the circuit board 300. A fan 10 is located at the entrance of the space above the insertion box 400, generating cool air into the insertion box 400.

[0264] The flow divider 20 is hinged to the windward side of the condenser 1. When the flow divider 20 is adjusted to form an acute angle with the windward side, it can divide the cold airflow from the fan 10 into two parts. The upper part of the flow divider 20 is the main flow channel, and part of the cold air flows horizontally through the main flow channel across the condenser 1 of the radiator, carrying away some heat.

[0265] In this embodiment, only the local heat source 100 generates heat, resulting in a relatively small total power consumption. The heat dissipation of the branch flow channel is small, and the pressure drop is large, which would reduce the efficiency of the cold source utilization and waste fan energy. By adjusting the branch component 20 through the rotating shaft 201, the branch flow channel is closed, allowing all the airflow generated by the fan 10 to enter the main flow channel for heat dissipation by the condenser 1. Adjusting the branch component 20 flexibly distributes the airflow, reducing the total airflow expenditure and improving the overall heat dissipation efficiency.

[0266] The air guide 30 is located below the flow divider 20, forming a downward airflow channel with the flow divider 20. This allows some of the cold air blown out by the fan 10 to flow in from below the flow divider 20 and blow down through multiple evaporators 2, carrying away some of the heat from the evaporators 2.

[0267] The first baffle 40 is placed vertically above the circuit board 300. The first baffle 40 and the air guide 30 are arranged at intervals to form a flow channel. The flow channel can guide the airflow in the flow channel toward the evaporator 2 and prevent cold air from being discharged from above the circuit board 300.

[0268] Specifically, the radiator includes four evaporators 2, one condenser 1, one distributor 33, one steam collector 43, one steam pipe 41, one liquid pipe 31, as well as four steam branch pipes 42, four liquid branch pipes 32 and four regulating valves 321.

[0269] Optionally, the heat sink is made of aluminum alloy.

[0270] A regulating valve 321 is installed on each liquid branch pipe 32. Specifically, the regulating valve 321 is connected in series with each liquid branch pipe 32. Since only one heat source 100 is working, the opening degree of the regulating valve 321 is determined according to the height difference between the distributor 33 and the evaporator 2 connected to the liquid branch pipe 32.

[0271] Specifically, in Figure 11 In this system, only the second heat source from top to bottom is working. The opening degree of the regulating valve 321 corresponding to the evaporator 2 at height h2 is 100%, while the regulating valves 321 corresponding to the evaporators 2 at heights h1, h3, and h4 are closed, forming a single loop to ensure that the steam generated from the second heat source is completely returned after condensation, thus maintaining the stability of the liquid level in the evaporator 2.

[0272] Example 9

[0273] This application provides an electronic device, which includes a housing 400. A circuit board 300 arranged vertically is disposed inside the housing 400. A plurality of heat sources 100 are arranged vertically on the circuit board 300, and the plurality of heat sources 100 operate with the same rated power.

[0274] Specifically, the heat source 100 is a chip. There are multiple circuit boards 300, which are arranged side by side in the bottom space of the insertion box 400.

[0275] The electronic device is equipped with the aforementioned heat dissipation device. The number of heat sinks in the heat dissipation device is the same as the number of circuit boards 300, and the two are set in a one-to-one correspondence.

[0276] The heat dissipation device includes a radiator. The radiator includes a condenser 1, a liquid pipe assembly 3, a vapor pipe assembly 4, and multiple evaporators 2. The condenser 1 includes a condensation chamber having a condenser inlet and a condenser outlet.

[0277] Evaporator 2 includes a steam chamber 21, which has an evaporator inlet and an evaporator outlet 211.

[0278] The liquid pipe assembly 3 includes multiple liquid branch pipes 32, the inlet of each liquid branch pipe 32 is connected to the outlet of the condenser, the outlet of the multiple liquid branch pipes 32 is connected to multiple evaporator inlets in a one-to-one correspondence, and the flow rates of at least two of the multiple liquid branch pipes 32 can be different.

[0279] The steam pipe assembly 4 includes multiple steam branch pipes 42, the inlets of which are connected to multiple evaporator outlets in a one-to-one correspondence, and the outlet end of each steam branch pipe 42 is connected to the condenser inlet.

[0280] Specifically, the liquid pipe assembly 3 also includes a distributor 33 and a liquid pipe 31. The liquid pipe 31 is connected between the outlet of the condenser 1 and the inlet of the distributor 33, and the liquid branch pipe 32 is connected between the outlet of the distributor 33 and the inlet of the evaporator 2. It can be understood that the distributor 33 has multiple outlets, each corresponding to a different liquid branch pipe 32.

[0281] Specifically, the steam pipe assembly 4 also includes a steam pipe 41 and a steam collector 43. The steam pipe 41 is connected between the inlet of the condenser 1 and the inlet of the steam collector 43, and the steam branch pipe 42 is connected between the inlet of the steam collector 43 and the outlet of the evaporator 2. It is understood that the steam collector 43 has multiple inlets, each corresponding to a different steam branch pipe 42.

[0282] The steam chamber 21 is equipped with a support structure 212 and a boiling enhancement structure 213.

[0283] Specifically, the maximum power of each heat source 100 is 400W, and the operating power of each heat source 100 changes dynamically.

[0284] Furthermore, four heat sources 100 are arranged vertically at intervals on each circuit board 300. The vertical heights between the four heat sources 100 from top to bottom are h1, h2, h3, and h4, respectively (this height is the distance between the lowest point of the heat source 100 and the bottom plate of the insertion box 400). Each heat source 100 is equipped with an evaporator 2. A first baffle 40 is disposed above the circuit board 300 and perpendicular to the circuit board 300. A fan 10 is located at the entrance of the space above the insertion box 400, generating cool air into the insertion box 400.

[0285] The flow divider 20 is hinged to the windward side of the condenser 1, see [reference]. Figure 11 When the flow divider 20 is adjusted to form an acute angle with the windward surface, it can divide the cold airflow from the fan 10 into two parts. The upper part of the flow divider 20 is the main flow channel, and part of the cold air flows horizontally through the condenser 1 of the radiator in the main flow channel, carrying away some of the heat.

[0286] The rotating shaft 201 is located at the connection between the flow divider 20 and the condenser 1. By rotating and adjusting the flow divider 20, 70% of the flow rate enters the main flow channel to provide heat dissipation for the condenser 1; and 30% of the flow rate enters the flow divider channel to provide auxiliary heat dissipation for the evaporator 2.

[0287] The air guide 30 is located below the flow divider 20, forming a downward airflow channel with the flow divider 20. This allows some of the cold air blown out by the fan 10 to flow in from below the flow divider 20 and blow down through multiple evaporators 2, carrying away some of the heat from the evaporators 2.

[0288] The first baffle 40 is placed vertically above the circuit board 300. The first baffle 40 and the air guide 30 are arranged at intervals to form a flow channel. The flow channel can guide the airflow in the flow channel toward the evaporator 2 and prevent cold air from being discharged from above the circuit board 300.

[0289] Specifically, the radiator includes four evaporators 2, one condenser 1, one distributor 33, one steam collector 43, one steam pipe 41, one liquid pipe 31, as well as four steam branch pipes 42, four liquid branch pipes 32 and four regulating valves 321.

[0290] Optionally, the heat sink is made of aluminum alloy.

[0291] Along the direction of the airflow through the evaporator 2, the spacing between the first fins 22 on each evaporator 2 decreases from top to bottom to increase the heat dissipation area and ensure that the first fins 22 on each evaporator 2 generate 20%Q of heat dissipation under thermal cascading conditions.

[0292] A regulating valve 321 is installed on each liquid branch pipe 32. Specifically, the regulating valve 321 is connected in series with each liquid branch pipe 32. Since the power consumption of each heat source 100 is the same, the evaporation rate is the same. Therefore, the opening degree of the regulating valve 321 is determined according to the height difference between the distributor 33 and the evaporator 2 connected to the liquid branch pipe 32. The opening degrees of the regulating valve 321 corresponding to the evaporators with heights of h1, h2, h3 and h4 are 80%, 70%, 60% and 50% respectively, decreasing step by step, to increase the return liquid resistance of the relatively lower evaporator 2, forcing a portion of the liquid to be distributed to the relatively upper evaporator 2, so as to ensure uniform return liquid and stability of the liquid level in each evaporator 2.

[0293] Each steam chamber 21 is equipped with a liquid level detection element 214; the electronic equipment also includes a controller 200, a signal line 500 and a control line 600; specifically, the controller 200 is electrically connected to the heat source 100 through the signal line 500 to obtain the working power of each heat source 100 in real time; at the same time, the controller 200 is electrically connected to each liquid level detection element 214 through the signal line 500 to obtain the actual liquid level height in each steam chamber 21 in real time.

[0294] The controller 200 is electrically connected to the rotating shaft 201 via the control line 600, thereby adjusting and controlling the rotation angle of the diverter 20 in real time. The controller 200 is also electrically connected to each regulating valve 321 via the control line 600, thereby controlling the opening degree of each regulating valve 321 separately.

[0295] Specifically, the controller 200 adjusts the opening of the regulating valve 321 in real time according to the power consumption changes of each heat source 100 received, so as to ensure the stability of the liquid level in each evaporator 2.

[0296] For example, when the heat dissipation device control method provided in Embodiment 4 is used to control the heat dissipation process of the electronic device,

[0297] When all four heat sources 100 operate at 300W, the actual total power consumption / maximum total power consumption = 75%. Since the ratio of actual total power consumption to maximum total power consumption is greater than 50%, the controller 200 sends a control signal to the rotating shaft 201, adjusting the airflow angle of the diverter 20 to 15°, allowing 20% ​​of the airflow to pass through the evaporator 2 and 80% to pass through the condenser 1. When the four heat sources 100 operate at 100W, 100W, 300W, and 200W respectively, the actual total power consumption / maximum total power consumption = 43.75%. Since 43.75% < 50%, the controller 200 sends a control signal to the rotating shaft 201, setting the airflow angle of the diverter 20 to 0° and closing the diversion channel.

[0298] Meanwhile, the controller 200 continuously outputs opening adjustment information to the regulating valve 321 based on the signals from the liquid level detection elements 214 of the four evaporators 2, and the adjustment speed can be selected as 2% / min.

[0299] Although the embodiments disclosed in this application are as described above, their content is merely for the purpose of facilitating understanding of the technical solutions of this application and is not intended to limit this application. Any person skilled in the art to which this application pertains may make any modifications and changes in the form and details of the implementation without departing from the core technical solutions disclosed in this application, but the scope of protection defined in this application shall still be determined by the scope defined in the appended claims.

Claims

1. A heat dissipation device, characterized in that, include: Fan; A radiator includes a condenser and an evaporator connected to each other, and a fan is provided at an interval relative to the condenser of the radiator for supplying air to the condenser of the radiator; A flow divider is hinged to the end of the condenser near the evaporator on the windward side. The angle between the flow divider and the windward side of the condenser is adjustable to control whether a portion of the airflow delivered by the fan can flow to the evaporator.

2. The heat dissipation device according to claim 1, characterized in that, The heat dissipation device also includes an air guide, which is disposed between the fan and the evaporator. When the angle between the flow divider and the windward surface of the condenser is an acute angle, a flow divider channel is formed between the flow divider and the air guide.

3. The heat dissipation device according to claim 2, characterized in that, The heat dissipation device further includes a first baffle, which is disposed between the condenser and the evaporator. The first baffle and the air guide are arranged at intervals to form a flow channel, which can guide the airflow in the flow channel toward the evaporator.

4. The heat dissipation device according to claim 1, characterized in that, The heat dissipation device also includes a second baffle, which is arranged opposite to the surface of the evaporator that faces the same direction as the windward side of the condenser.

5. The heat dissipation device according to claim 1, characterized in that, The heat dissipation device includes a plurality of heat sinks.

6. The heat dissipation device according to any one of claims 1-5, characterized in that, The heat sink includes: A condenser, the condenser including a condensation chamber having a condenser inlet and a condenser outlet; Multiple evaporators, each evaporator including a steam chamber having an evaporator inlet and an evaporator outlet; The liquid pipe assembly includes multiple liquid branch pipes, the inlet of each liquid branch pipe is connected to the outlet of the condenser, the outlets of the multiple liquid branch pipes are connected to the inlets of the multiple evaporators in a one-to-one correspondence, and the flow rates in the multiple liquid branch pipes can be different. The steam pipe assembly includes multiple steam branch pipes, the inlets of which are connected to the outlets of the evaporators in a one-to-one correspondence, and the outlet end of each steam branch pipe is connected to the inlet of the condenser.

7. The heat dissipation device according to claim 6, characterized in that, Each of the liquid branch pipes is equipped with a regulating valve.

8. The heat dissipation device according to claim 6, characterized in that, At least two of the plurality of liquid branch pipes have different flow cross-sectional areas.

9. The heat dissipation device according to claim 6, characterized in that, The steam chamber has a supporting structure; and / or The steam chamber has an enhanced boiling structure.

10. The heat dissipation device according to claim 6, characterized in that, The evaporator includes an evaporator body and first fins. The steam chamber is disposed within the evaporator body, and a plurality of first fins are disposed on the outer surface of the evaporator body. The density of the plurality of first fins of the evaporator gradually increases along the direction away from the condenser.

11. A method for controlling a heat dissipation device, characterized in that, Controlling the heat dissipation device according to any one of claims 1-10, wherein the heat dissipation device has a radiator for dissipating heat from multiple heat sources, the radiator includes multiple evaporators, and the multiple heat sources are arranged in a one-to-one correspondence with the multiple evaporators; the control method of the heat dissipation device includes: Obtain the actual total power consumption of all said heat sources and the ultimate total power consumption of all said heat sources; Obtain the ratio of the actual total power consumption to the maximum total power consumption; The angle between the flow divider and the windward side of the condenser is controlled based on the ratio of the actual total power consumption to the maximum total power consumption.

12. The control method for the heat dissipation device according to claim 11, characterized in that, The step of controlling the angle between the flow divider and the windward side of the condenser based on the ratio of the actual total power consumption to the maximum total power consumption includes: In response to the ratio of the actual total power consumption to the maximum total power consumption being less than a first set value, the flow divider is controlled to rotate to a preset position to prevent the airflow delivered by the fan from flowing to the evaporator; If the ratio of the actual total power consumption to the maximum total power consumption is greater than a first set value, the flow divider is controlled to rotate away from the preset position so that part of the airflow delivered by the fan can flow to the evaporator.

13. The control method for the heat dissipation device according to claim 11, characterized in that, The evaporator includes a steam chamber, and each steam chamber is equipped with a liquid level detection element. The control method for the heat dissipation device further includes: Obtain the actual liquid level height detected by each of the liquid level detection devices; Determine the ratio of the actual liquid level height to the total height of the steam chamber; In response to the ratio of the actual liquid level height to the total height of the steam chamber being within a preset range, the flow rate of the liquid branch pipe corresponding to the steam chamber is controlled to remain constant. In response to the ratio of the actual liquid level height to the total height of the steam chamber being less than the minimum value of the preset range, the flow rate of the liquid branch pipe corresponding to the steam chamber is increased until the ratio of the actual liquid level height to the total height of the steam chamber is increased to be within the preset range. In response to the ratio of the actual liquid level height to the total height of the steam chamber being greater than the maximum value of the preset range, the flow rate of the liquid branch pipe corresponding to the steam chamber is reduced until the ratio of the actual liquid level height to the total height of the steam chamber is reduced to within the preset range.

14. The control method for the heat dissipation device according to claim 13, characterized in that, Each of the liquid branch pipes is equipped with a regulating valve. When adjusting the flow rate of the liquid branch pipe, the opening of the regulating valve is adjusted according to a preset speed.

15. An electronic device, characterized in that, include: Heat source; The heat dissipation device according to any one of claims 1-10, wherein the evaporator of the heat dissipation device is arranged correspondingly to the heat source to absorb the heat from the heat source.

16. The electronic device according to claim 15, characterized in that, The electronic device also includes a controller electrically connected to the shunt element to control the rotation angle of the shunt element.

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