An on-line full-automatic semiconductor cleaning device

Abstract

The application discloses an online full-automatic semiconductor cleaning device, and relates to the technical field of semiconductor cleaning, which comprises a rack, double cleaning chambers arranged on the rack, vacuum chuck mechanisms and carbon dioxide snow cleaning mechanisms arranged on the inner sides of the two double cleaning chambers, and two anti-recontamination assemblies. A high-speed airflow dynamic isolation barrier composed of directional airflow is formed between the spray head and the cleaned area and the uncleaned area by the air wall element, so that the pollutants are blocked from flying to the cleaned area, and the dispersed pollutants are actively guided and gathered to a specific collection position for effective capture. For the area that is difficult to cover by the exhaust system, the air wall provides local enhanced airflow control to compensate for the limitations of the fixed exhaust system, greatly reduces the recontamination risk, and reduces the phenomenon of post-circuit short circuit or open circuit and damage to the precision structure caused by the unqualified surface cleanliness after cleaning.

Description

Technical Field

[0001] This invention relates to the field of semiconductor cleaning technology, and more specifically to an online fully automatic semiconductor cleaning device. Background Technology

[0002] In semiconductor manufacturing, cleaning is not an optional process, but a core step that must be carried out throughout the entire process. This is because the cleanliness of the wafer surface directly affects the yield and performance of the product. A single nanoparticle can render an entire wafer unusable. Carbon dioxide snowflake cleaning equipment is a dry cleaning device that uses the expansion of liquid CO2 to form solid snowflake particles, which are then sprayed at high speed to achieve surface cleaning. It does not require subsequent drying, leaves no liquid residue after cleaning, does not use chemical agents or abrasive media, requires no waste liquid treatment, and causes minimal damage to the substrate. It is suitable for high-value, highly sensitive surfaces and can remove particles from submicron to nanometer scale. It is currently widely used in the semiconductor manufacturing field.

[0003] During use, carbon dioxide snow cleaning equipment may experience recontamination for various reasons. The main cause of recontamination is improper airflow organization. When the high-pressure snow flow impacts the surface and removes contaminants, these contaminants will move with the high-speed airflow. If they are not sucked away in time, these suspended contaminants will disperse in the air and eventually settle back onto the cleaned surface. Once particles re-attach to the cleaned area, the surface cleanliness will not meet the standards, leading to short circuits or open circuits and damage to precision structures. Summary of the Invention

[0004] The purpose of this invention is to provide an online fully automatic semiconductor cleaning device that solves the problem that traditional cleaning devices are prone to recontamination due to improper airflow organization. Once particles re-adhere to the cleaned area, the surface cleanliness will not meet the standards, leading to short circuits or open circuits and damage to precision structures.

[0005] This invention solves the above-mentioned technical problems through the following technical solution: An online fully automatic semiconductor cleaning device, comprising: The frame is provided with dual cleaning chambers, and the inner sides of the two dual cleaning chambers are provided with a vacuum suction cup mechanism and a carbon dioxide snowflake cleaning mechanism. Two anti-recontamination components are respectively disposed inside the two dual cleaning chambers. Each anti-recontamination component includes two C-shaped mounting brackets, an air wall component, an adhesive attachment, and an expansion component. Two mounting rods are fixed between the two C-shaped mounting brackets, and T-shaped sliding brackets are slidably disposed on both mounting rods. Two air wall components are provided. The air wall components are used to clean up the pollutants that have been removed. The adhesive attachment is used to collect the pollutants. The expansion component is used to expand the working range of the air wall components.

[0006] Preferably, the air wall component includes an air outlet box and a collection box. One side of the air outlet box is provided with at least one air outlet groove, and the other side of the air outlet box is provided with a multi-head air injection pipe. A telescopic air connection pipe is connected between the multi-head air injection pipes of the two air wall components.

[0007] Preferably, the adhesive attachment is disposed on the inner side of the collection box. The adhesive attachment includes a pneumatic drive component and an adhesive component. The pneumatic drive component is used to drive the adhesive component to work. The pneumatic drive component includes a rotating rod that rotates on the inner side of the air outlet box via a support bar, a main gear plate that rotates on the top of the air outlet box, and two driven gear plates that rotate on the top of the collection box. Fan blades and a main bevel gear are fixed at both ends of the rotating rod, respectively. A driven bevel gear is fixed at the central shaft at the bottom of the main gear plate via a mounting shaft. The main bevel gear and the driven bevel gear mesh with each other. A toothed synchronous belt is provided between the main gear plate and the two driven gear plates.

[0008] Preferably, the adhesive includes two limiting rollers rotating between the top and bottom of the inner wall of the collection box, a winding roller rotating between the top and bottom of the inner wall of the collection box, and a disassembly head disposed at the top and bottom of the inner wall of the collection box. An unwinding roller is disposed between the two disassembly heads, and an adhesive tape is wound on the unwinding roller.

[0009] Preferably, one of the driven gears is connected to one of the corresponding disassembly heads via a short shaft, while the other driven gear is fixedly connected to one end of the take-up roller via a connecting shaft.

[0010] Preferably, the expansion member includes two mounting strips fixed between two C-shaped mounting brackets, slide rails respectively fixed on two T-shaped sliding brackets, support seats respectively fixed on the top of the two T-shaped sliding brackets, and two through shaft arms respectively fixed on the top of the vent box and the top of the collection box. At least one shaft is fixed on each of the two mounting strips. A hollow rotating arm is rotatably mounted on one side of the support base. One end of the shaft arm passes through the inner side of the hollow rotating arm. A slide rail head is fixed to one end of the shaft arm, and the slide rail head slides on the slide rail.

[0011] Preferably, the expansion member further includes two slide rails fixed to the bottom of the air outlet box and the bottom of the collection box respectively, and mounting arms fixed to one side of the two T-shaped sliding frames respectively. Gravity reset arms slide on both slide rails, and a V-shaped hollow frame is fixed to one end of each of the two mounting arms. One end of each gravity reset arm passes through the inner side of the two V-shaped hollow frames respectively.

[0012] Preferably, the carbon dioxide snow cleaning mechanism includes a linear motor fixed between two C-shaped mounting brackets and vertical slot plates respectively fixed to the bottom of two T-shaped sliding brackets. One end of each of the two T-shaped sliding brackets is fixed to the moving part of the linear motor. A cylinder is fixed to one side of each of the two vertical slot plates. Multiple nozzles slide between the two vertical slot plates.

[0013] Compared with the prior art, the beneficial effects of the present invention are as follows: By using air-wall components, a high-speed dynamic airflow isolation barrier composed of directional airflow is formed between the nozzle and the cleaned and uncleaned areas. This prevents pollutants from flying into the cleaned area. While passively blocking, it can also actively guide the pollutants, gathering them at specific collection locations for effective capture. For areas that are difficult to cover by the exhaust system, the air-wall provides locally enhanced airflow control to compensate for the limitations of the fixed exhaust system, greatly reducing the risk of recontamination and reducing the occurrence of short circuits or open circuits and damage to precision structures caused by substandard surface cleanliness after cleaning. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the anti-recontamination component in this invention; Figure 3 This is a schematic diagram showing the disassembled anti-recontamination component and the carbon dioxide snowflake cleaning mechanism in this invention; Figure 4 This is a partially exploded cross-sectional view of the anti-recontamination component in this invention; Figure 5 This is a split cross-sectional view of the adhesive attachment in this invention; Figure 6 for Figure 5 Enlarged diagram of section A in the middle; Figure 7 for Figure 5 Enlarged schematic diagram of section B.

[0015] 1. Frame; 2. Dual cleaning chambers; 3. Vacuum suction cup mechanism; 4. Carbon dioxide snowflake cleaning mechanism; 41. Linear motor; 42. Vertical groove plate; 43. Cylinder; 44. Multi-position nozzle; 5. Anti-recontamination component; 51. C-type mounting bracket; 52. Mounting rod; 53. T-type sliding bracket; 54. Air outlet box; 55. Collection box; 56. Multi-head air injection pipe; 57. Telescopic air inlet pipe; 58. Rotating rod; 59. Main gear plate; 510. Driven gear plate; 511. Fan blade; 512. Main bevel gear; 513. Driven bevel gear; 514. Toothed synchronous belt; 515. Limiting roller; 516. Take-up roller; 517. Disassembly head; 518. Unwinding roller; 519. Adhesive tape; 520. Mounting strip; 521. Slide rail strip; 522. Support base; 523. Through-shaft arm; 524. Shaft body; 525. Hollow rotating arm; 526. Slide rail head; 527. Slide rail plate; 528. Mounting arm; 529. Gravity reset arm; 530. V-type hollow frame. Detailed Implementation

[0016] The above-mentioned and other technical features and advantages of the present invention will be described in more detail below with reference to the accompanying drawings.

[0017] This invention provides a technical solution: an online fully automatic semiconductor cleaning device, such as... Figures 1-7 As shown, the system includes a frame 1, which is constructed from a combination of aluminum profiles and stainless steel plates, providing excellent rigidity and stability. The surface is treated with an anti-static coating. A control system is mounted on the frame 1, comprising a PLC controller, a touchscreen human-machine interface, a sensor network, and a data acquisition module. This system enables automated control of the equipment, precise adjustment of process parameters, real-time monitoring, and data recording. The frame 1 also features dual cleaning chambers 2, consisting of a symmetrically arranged left and right cleaning chamber. Each chamber is equipped with a sealing door, an observation window, a vacuum system, and an exhaust system. The sealing door 13 is pneumatically driven, made of transparent polycarbonate, and fitted with a silicone sealing ring. The observation window is made of tempered glass for easy real-time observation of the cleaning process. This is a mature configuration of existing equipment, so it will not be described in detail here. Vacuum suction cup mechanism 3 and carbon dioxide snowflake cleaning mechanism 4 are provided on the inner side of the two double cleaning chambers 2. The carbon dioxide snowflake cleaning mechanism 4 includes a linear motor 41 and two vertical slot plates 42. As is well known to those skilled in the art, the working principle and wiring method of the linear motor 41 are common and are all conventional means or common knowledge, so they will not be described in detail here. Those skilled in the art can make any selection according to their needs or convenience. The vertical slot plate 42 can be regarded as a vertical plate with a vertical through slot. The linear motor 41 is fixed between two C-shaped mounting brackets 51, and the two vertical slot plates 42 are respectively fixed to the bottom center of two T-shaped sliding brackets 53. One end of each of the two T-shaped sliding frames 53 is fixed to the moving base (i.e., the moving platform) on the linear motor 41. A cylinder 43 is fixed to one side of each of the two vertical slot plates 42. The working principle and wiring method of the cylinder 43 are commonplace and belong to conventional methods or common knowledge, and will not be elaborated here. Those skilled in the art can arbitrarily select and match according to their needs or convenience. A multi-position nozzle 44 slides between the two vertical slot plates 42. The multi-position nozzle 44 includes a multi-nozzle nozzle, with hollow cylinders fixed at both ends. Insertion pins rotate on the inner sides of both hollow cylinders, and a sealing structure is provided at the rotating connection between the hollow cylinders and the insertion pins. One end of each insertion pin passes through and slides within the vertical slot plate 42. In the vertical through groove, one end of the telescopic rods of two cylinders 43 is fixed to one end of two plug-in pins respectively. A toothed ring is fixed on the outer surface of one of the hollow cylinders. A servo motor is fixed on the plug-in pin corresponding to the hollow cylinder. A gear is fixed to one end of the output shaft of the servo motor. The gear and the toothed ring mesh. The servo motor can drive the gear to rotate. The gear drives the toothed ring and the corresponding hollow cylinder through the meshing teeth, thereby driving the multi-nozzle to rotate. This can change the spray angle of the multi-position nozzle 44. The telescopic rods of the cylinders 43 can drive the plug-in pins and the multi-nozzle to move up and down along the vertical through groove, thereby realizing the adjustment of the spray distance (i.e., the distance between the multi-position nozzle 44 and the top of the semiconductor to be cleaned).

[0018] Two anti-recontamination components 5 are respectively installed inside the two dual-cleaning chambers 2. Each of the two dual-cleaning chambers 2 is equipped with a high-pressure CO2 supply device and a high-purity nitrogen supply device. The high-pressure CO2 supply device is used to provide 30-60... The high-pressure liquid CO2 in the bar is fixedly connected to a telescopic bellows at one end of the multi-position nozzle 44 (i.e., one end of the plug-in column). One end of the telescopic bellows is connected to one end of the multi-position nozzle 44, and the other end is fixedly connected to the outlet of the high-pressure CO2 supply device. This allows the high-pressure CO2 supply device to supply gas to the multi-position nozzle 44 for cleaning. The high-purity nitrogen gas is dry, clean, and inert, and will not react with the cleaning process or introduce moisture or particulate contamination. Therefore, it can prevent condensation and avoid secondary contamination. It will not condense or freeze in a low-temperature cleaning environment. If there is concern that nitrogen gas may cause local cooling on the semiconductor to be cleaned, the nitrogen gas can be slightly preheated to further prevent condensation. Since the high-pressure CO2 supply device is a mature and deployed equipment in existing cleaning equipment, and nitrogen supply devices are also maturely applied in various fields, the working principle and wiring method of the high-pressure CO2 supply device and the high-purity nitrogen supply device are common knowledge and are conventional methods or common sense. They will not be described in detail here. Those skilled in the art can choose any configuration according to their needs or convenience.

[0019] The anti-recontamination component 5 includes two C-shaped mounting brackets 51, an air wall component, an adhesive attachment, and an expansion component. The two C-shaped mounting brackets 51 are fixedly installed below the two sets of high-pressure CO2 supply devices to connect the multi-position nozzles 44, the air wall component, and the air supply unit. Two mounting rods 52 are fixed between the two C-shaped mounting brackets 51, and T-shaped sliding brackets 53 are slidably installed on both mounting rods 52. Two air wall components are provided, one in front of the other in front of the multi-position nozzles 44. The air wall components should not be too close to the multi-position nozzles 44, as this will interfere with the main airflow, and if they are too far away, the interception effect will be weakened. The specific spacing can be set through prior experimentation. The width of the air wall component (i.e., the thickness of the air outlet box 54 and the thickness of the air outlet) should be 20-30% larger than the cleaning width to ensure full coverage without any gaps. The air wall component is used to clean up the contaminants that have been removed, the adhesive attachment is used to collect the contaminants, and the expansion component is used to expand the working range of the air wall component.

[0020] The air wall component includes an air outlet box 54 and a collection box 55, which are respectively located at both ends of the multi-position nozzle 44. One side of the air outlet box 54 has at least one air outlet groove. The specific number of air outlet grooves depends on the thickness of the air outlet box 54 and the width of the air outlet grooves. In general, the air wall formed by all air outlet grooves should be slightly larger than the cleaning width. The other side of the air outlet box 54 has a multi-head air injection pipe 56, with multiple ends of the multi-head air injection pipe 56 connected to the air outlet box 54. A telescopic air connector 57 connects the multi-head air injection pipes 56 in the two air wall components. One end of the telescopic air connector 57 is connected to a high-purity nitrogen supply device. The outlet end of the device is fixedly connected (the specific fixing method can be through a flange, which also facilitates later disassembly and maintenance). The outlet end of the high-purity nitrogen supply device is equipped with a precision pressure regulating valve and a solenoid valve. The precision regulating valve is used to regulate and stabilize the pressure of the gas wall. A precision type with a pressure gauge can be selected, which has high adjustment accuracy and fast response. The solenoid valve is used to control the opening or closing of the gas wall and automatically activate the corresponding side gas wall. Since the working principle and wiring method of the precision pressure regulating valve and the solenoid valve are common and are all conventional means or common knowledge, they will not be described in detail here. Those skilled in the art can select any combination according to their needs or convenience.

[0021] An adhesive attachment is located inside the collection box 55. The adhesive attachment includes a pneumatic drive component and an adhesive component. The pneumatic drive component drives the adhesive component. The pneumatic drive component includes a rotating rod 58 that rotates inside the air outlet box 54 via a support bar, a main gear 59 that rotates on the top of the air outlet box 54, and two driven gears 510 that rotate on the top of the collection box 55. The support bar is fixed to the top of the inner wall of the air outlet box 54. The rotating rod 58 is located in a relatively high position within the air outlet box 54. A fan blade 511 and a main bevel gear 512 are fixed to both ends of the rotating rod 58, respectively. The fan blade 511 is located near the position where it connects to the multi-head air injection pipe 56. One end of the multi-head air injection pipe 56 connects to the air outlet box 54 at the location where it is positioned. At the position facing the fan blade 511, there is enough flowing gas to drive the fan blade 511 to rotate. At the central shaft at the bottom of the main gear disk 59, a driven bevel gear 513 is fixed by a mounting shaft (one end of the mounting shaft is fixed at the central shaft of the main gear disk 59, and the other end passes through and extends to the inside of the air outlet box 54, and the driven bevel gear 513 is fixed at the end extending to the inside of the air outlet box 54). The main bevel gear 512 and the driven bevel gear 513 mesh with each other. A toothed synchronous belt 514 is meshed between the main gear disk 59 and the two driven gear disks 510. The toothed synchronous belt 514 has multiple holes for the teeth on the main gear disk 59 and the two driven gear disks 510 to pass through, hence it is called a toothed synchronous belt 514.

[0022] The adhesive components include two limiting rollers 515 rotating between the top and bottom of the inner wall of the collection box 55, a take-up roller 516 rotating between the top and bottom of the inner wall of the collection box 55, and disassembly / assembly heads 517 disposed at the top and bottom of the inner wall of the collection box 55. The width of the two limiting rollers 515 is greater than the inlet width of the collection box 55. The inlet of the collection box 55 and the outlet of the vent box 54 are positioned opposite each other. An unwinding roller 518 is disposed between the two disassembly / assembly heads 517. The unwinding roller 518 and the take-up roller 516 are positioned opposite each other. An adhesive tape 519 is wound on the unwinding roller 518. The adhesive tape 519 is similar to traditional transparent tape or other types of adhesive film. The disassembly / assembly heads 517... 7 consists of a rectangular casing and a rectangular block. Two disassembly heads 517 are arranged opposite each other. The rectangular casing is rotatably connected to the top or bottom of the inner wall of the collection box 55. The rectangular casing has a threaded hole. The rectangular block is fixed to one end of the unwinding roller 518. A threaded rod is threadedly connected to the rectangular block. One end of the threaded rod is provided with an anti-slip button. The size of the rectangular block is adapted to the inner size of the rectangular casing. When the unwinding roller 518 is installed into the inner side of the collection box 55, the rectangular blocks at both ends of the unwinding roller 518 can be placed into the two rectangular casings respectively. However, one end of the threaded rod should be aligned with the threaded hole opened in the rectangular casing. Then, the threaded rod is screwed into the threaded hole to fix it. The back of the frame 1 is equipped with a sealed concealed door corresponding to the sealed door on the dual cleaning chamber 2. It is important to note that a hinged, openable inspection door is located on the collection box 55 corresponding to the position of the unwinding roller 518. The inspection doors on the two collection boxes 55 in each anti-recontamination assembly 5 are respectively located near the sealed door and the sealed concealed door on the frame 1. After the adhesive tape 519 on the unwinding roller 518 is used up, open the sealed door and the sealed concealed door, and then open the corresponding inspection door. Simply unscrew the threaded rod out of the threaded hole to remove the unwinding roller 518. After removal, the used tape is wound onto the winding mechanism. Remove the adhesive tape 519 from roller 516, then wrap one end of the adhesive tape 519 on the new unwinding roller 518 around the two limit rollers 515 and stick it to the take-up roller 516. Then install the unwinding roller 518 and manually rotate it to adjust the tightness of the adhesive tape 519. One of the toothed discs 510 is connected to the rectangular wrapping shell in one of the corresponding disassembly and assembly heads 517 through a short shaft. The other toothed disc 510 is fixedly connected to one end of the take-up roller 516 through a connecting shaft. One end of the adhesive tape 519 wraps around the two limit rollers 515 in sequence and sticks to the take-up roller 516.

[0023] The expansion components include two mounting strips 520 fixed between two C-shaped mounting brackets 51, slide rails 521 respectively fixed on two T-shaped sliding brackets 53, support seats 522 respectively fixed on the top of the two T-shaped sliding brackets 53, and two through-shaft arms 523 respectively fixed on the top of the vent box 54 and the top of the collection box 55. Figure 3 Each T-shaped sliding frame 53 is fixed with two slide rails 521, and each of the two mounting strips 520 is fixed with at least one shaft 524. The specific number of shafts 524 and the spacing between two adjacent shafts 524 can be set according to the length of the mounting strip 520 and the length of the upper end of the hollow rotating arm 525. A hollow rotating arm 525 is rotatably mounted on one side of the support base 522. When a shaft 524 moves the hollow rotating arm 525, the hollow rotating arm 525 needs to be moved once and reset before contacting the next shaft 524. A through groove is provided below the rotatable connection between the hollow rotating arm 525 and the support base 522. One end of the shaft arm 523 passes through the inner side of the hollow rotating arm 525 at the corresponding position. A slide rail head 526 is fixed to one end of the shaft arm 523. The slide rail head 526 slides on the slide rail 521 at the corresponding position to support the air outlet box 54 or the collection box 55.

[0024] The expansion component also includes two slide rail plates 527 fixed to the bottom of the air outlet box 54 and the bottom of the collection box 55 respectively, and mounting arms 528 fixed to one side of the two T-shaped sliding frames 53 respectively. The positions of the mounting arms 528 correspond to the air outlet box 54 and the collection box 55, and the number of mounting arms 528 is the same as the number of slide rail plates 527. Gravity reset arms 529 slide on both slide rail plates 527. One end of each mounting arm 528 is fixed to a V-shaped hollow frame 530. One end of each gravity reset arm 529 passes through the inner side of the two V-shaped hollow frames 530. When the slide rail head 526 is in the middle position of the slide rail 521, the hollow rotating arm 525 is in a vertical state. At this time, the gravity reset arm 529 is in the middle part of the V-shaped hollow frame 530.

[0025] In use: Place the semiconductor to be cleaned on the corresponding vacuum suction cup mechanism 3 and fix it in place. Start the equipment according to the set data. The linear motor 41 will drive the two T-shaped sliding frames 53 to move horizontally on the mounting rod 52 through the moving base, thereby moving the multi-position nozzle 44 on the semiconductor to be cleaned. The multi-position nozzle 44 will perform snowflake cleaning on the semiconductor to be cleaned through the high-pressure CO2 supply device. According to the thickness of the semiconductor to be cleaned, the cleaning height can be adjusted by extending and retracting the cylinder 43 to drive the multi-position nozzle 44 to rise and fall. During cleaning, the T-shaped sliding frame 53 will activate the anti-rebound mechanism. The contaminant component 5 moves together. During the movement, the high-purity nitrogen supply device blows nitrogen into the outlet boxes 54 located in front of and behind the multi-position nozzle 44 through the telescopic air inlet pipe 57 and the multi-head air injection pipe 56. The outlet grooves on the two outlet boxes 54 will cause the nitrogen flow to form an air wall in front of and behind the multi-position nozzle 44. The air wall will blow the cleaned contaminants into the collection box 55 to prevent the contaminants from floating in the air and then settling on the cleaned semiconductor to cause recontamination. The contaminants blown into the collection box 55 will be stuck by the adhesive tape 519 to prevent the contaminants from flying around due to airflow disturbance. When nitrogen gas is blown into the outlet box 54, it drives the fan blades 511 to rotate. The fan blades 511 then drive the main bevel gear 512 to rotate via the rotating rod 58. The main bevel gear 512 drives the main gear disk 59 to rotate via the driven bevel gear 513. The main gear disk 59 drives two driven gear disks 510 to rotate via the toothed synchronous belt 514. One of the driven gear disks 510 drives the unwinding roller 518 to rotate via the disassembly head 517, so that the unwinding roller 518 releases the adhesive tape 519. The other... The toothed disc 510 drives the take-up roller 516 to rotate, and the take-up roller 516 then winds up the released adhesive tape 519. During the unwinding and winding process, the clean part of the adhesive tape 519 passes through two limit rollers 515, so that the contaminants continuously blown into the collection box 55 can be stuck. The adhesive tape 519 with contaminants stuck will be wound onto the take-up roller 516. After the adhesive tape 519 on the unwind roller 518 is used up, the unwind roller 518 can be replaced.

[0026] Simultaneously, as the T-shaped sliding frame 53 moves, it drives the support base 522 and the mounting arm 528 to move as well. Therefore, the hollow rotating arm 525 moves along with it. During this movement, the hollow rotating arm 525 continuously passes the shaft 524. Under the constraint of the shaft 524, the hollow rotating arm 525 deflects. This deflection causes the through-shaft arm 523 and the slide rail head 526 to translate along the slide rail 521, thereby causing a certain degree of displacement of the exhaust box 54 and the collection box 55. This changes the position of the air wall, increasing the range within which the air wall can control and collect pollutants, thus improving the interception and treatment effect of pollutants. When the boxes 54 and 55 are displaced, the slide rail 527 fixed at their bottom will move along with them. When the slide rail 527 moves, it will drive the gravity reset arm 529 to move. Due to the limitation of the V-shaped hollow frame 530, the gravity reset arm 529 will move upward along the V-shaped hollow frame 530 and will move on the slide rail 527 so that the hollow rotating arm 525 can return to the vertical state under the reset of the gravity reset arm 529 after passing through a shaft 524. This is because the gravity reset arm 529 will return to the middle section (i.e., the lowest point) of the V-shaped hollow frame 530 under its own weight and the tilting path of the V-shaped hollow frame 530.

[0027] The above description is merely a preferred embodiment of the present invention and is illustrative rather than restrictive. Those skilled in the art will understand that many changes, modifications, and even equivalents can be made within the spirit and scope defined by the claims of the present invention, all of which will fall within the protection scope of the present invention.

Claims

1. An online fully automatic semiconductor cleaning device, characterized in that, include: The frame (1) is provided with a double cleaning chamber (2), and the inner sides of the two double cleaning chambers (2) are provided with a vacuum suction cup mechanism (3) and a carbon dioxide snowflake cleaning mechanism (4). Two anti-recontamination components (5) are respectively disposed inside the two double cleaning chambers (2). The anti-recontamination components (5) include two C-type mounting brackets (51), air wall components, adhesive attachments and expansion components. Two mounting rods (52) are fixed between the two C-type mounting brackets (51). T-type sliding brackets (53) are slidably disposed on the two mounting rods (52). Two air wall components are provided. The air wall components are used to clean up the pollutants that have been removed. The adhesive attachment is used to collect the pollutants. The expansion component is used to expand the working range of the air wall components.

2. The online fully automatic semiconductor cleaning equipment according to claim 1, characterized in that, The air wall component includes an air outlet box (54) and a collection box (55). One side of the air outlet box (54) is provided with at least one air outlet groove, and the other side of the air outlet box (54) is provided with a multi-head air injection pipe (56). A telescopic air connection pipe (57) is connected between the multi-head air injection pipes (56) of the two air wall components.

3. The online fully automatic semiconductor cleaning equipment according to claim 2, characterized in that, The adhesive attachment is located inside the collection box (55). The adhesive attachment includes a pneumatic drive component and an adhesive component. The pneumatic drive component is used to drive the adhesive component to work. The pneumatic drive component includes a rotating rod (58) that rotates inside the air outlet box (54) via a support bar, a main gear plate (59) that rotates on the top of the air outlet box (54), and two driven gear plates (510) that rotate on the top of the collection box (55). The two ends of the rotating rod (58) are respectively fixed with a fan blade (511) and a main bevel gear (512). A driven bevel gear (513) is fixed at the central shaft at the bottom of the main gear plate (59) via a mounting shaft. The main bevel gear (512) and the driven bevel gear (513) mesh with each other. A toothed synchronous belt (514) meshes between the main gear plate (59) and the two driven gear plates (510).

4. The online fully automatic semiconductor cleaning equipment according to claim 3, characterized in that, The adhesive includes two limiting rollers (515) rotating between the top and bottom of the inner wall of the collection box (55), a winding roller (516) rotating between the top and bottom of the inner wall of the collection box (55), and a disassembly head (517) disposed at the top and bottom of the inner wall of the collection box (55). A unwinding roller (518) is disposed between the two disassembly heads (517), and an adhesive tape (519) is wound on the unwinding roller (518).

5. The online fully automatic semiconductor cleaning equipment according to claim 4, characterized in that, One of the driven gears (510) is connected to one of the corresponding mounting heads (517) via a short shaft, while the other driven gear (510) is fixedly connected to one end of the take-up roller (516) via a connecting shaft.

6. The online fully automatic semiconductor cleaning equipment according to claim 5, characterized in that, The expansion component includes two mounting strips (520) fixed between two C-shaped mounting brackets (51), slide rails (521) respectively fixed on two T-shaped sliding brackets (53), support bases (522) respectively fixed on the top of the two T-shaped sliding brackets (53), and two through shaft arms (523) respectively fixed on the top of the vent box (54) and the top of the collection box (55). At least one shaft (524) is fixed on each of the two mounting strips (520). A hollow rotating arm (525) is rotatably mounted on one side of the support base (522). One end of the through-shaft arm (523) passes through the inner side of the hollow rotating arm (525). A slide rail head (526) is fixed to one end of the through-shaft arm (523). The slide rail head (526) slides on the slide rail (521).

7. The online fully automatic semiconductor cleaning equipment according to claim 6, characterized in that, The expansion component also includes two slide rails (527) fixed to the bottom of the air outlet box (54) and the bottom of the collection box (55) respectively, and mounting arms (528) fixed to one side of the two T-shaped sliding frames (53) respectively. Gravity reset arms (529) slide on both slide rails (527). A V-shaped hollow frame (530) is fixed to one end of each of the two mounting arms (528). One end of each gravity reset arm (529) passes through the inner side of the two V-shaped hollow frames (530).

8. The online fully automatic semiconductor cleaning equipment according to claim 1, characterized in that, The carbon dioxide snow cleaning mechanism (4) includes a linear motor (41) fixed between two C-shaped mounting brackets (51) and vertical slot plates (42) respectively fixed to the bottom of two T-shaped sliding brackets (53). One end of each of the two T-shaped sliding brackets (53) is fixed to the moving part of the linear motor (41). A cylinder (43) is fixed on one side of each of the two vertical slot plates (42). Multiple nozzles (44) slide between the two vertical slot plates (42).

Images