Substrate transfer device, substrate transfer method, and substrate processing device

Abstract

The present application provides a substrate carrying device, a substrate carrying method and a substrate processing device, in a substrate carrying technology which carries a substrate while keeping the peripheral portion of the substrate in a floating state, and a substrate processing technology which supplies a processing liquid to the upper surface of the substrate while carrying the substrate using the substrate carrying technology, a plurality of substrates having different substrate sizes in the carrying direction can be handled. The first holding portion has a plurality of first holding members capable of holding a substrate. Furthermore, the plurality of first holding members are respectively independently provided freely movable in a first horizontal direction along a first short guide member, and the relative positions of the plurality of first holding members with respect to the first sliding member can be adjusted by a first positioning portion. Therefore, the positions of the plurality of first holding members are appropriately adjusted according to the substrate size in the first horizontal direction, i.e. the carrying direction, and thus a plurality of substrates can be handled.

Description

Technical Field

[0001] This invention relates to a substrate transport apparatus, a substrate transport method, and a substrate processing apparatus that supplies processing liquid to the upper surface of a substrate being transported along a predetermined transport direction by blowing fluid onto the lower surface of the substrate, thereby maintaining the substrate in a horizontal, floating state. Furthermore, the substrates include glass substrates for FPD (flat panel display) devices such as liquid crystal display devices or organic EL display devices, substrates for semiconductor wafers, glass substrates for photomasks, substrates for filters, substrates for recording discs, substrates for solar cells, substrates for electronic paper, and substrates for semiconductor packaging (hereinafter simply referred to as "substrates"). Background Technology

[0002] In the manufacturing process of electronic devices such as semiconductor devices or liquid crystal display devices, a substrate processing apparatus is used to supply a liquid, such as a photoresist solution, to the surface of a substrate and apply the liquid to the substrate. For example, the substrate processing apparatus described in Japanese Patent Application Publication No. 2024-30264 transports the substrate while keeping it in a floating state, delivers liquid to a slit nozzle, and sprays the liquid from the nozzle's outlet onto the surface of the substrate, thus coating the substrate approximately across its entire surface.

[0003] This substrate processing apparatus includes: a floating stage section, from which gas is blown from the upper surface of the floating stage, which is opposite to the center of the lower surface of the substrate, to lift the substrate; and an adsorption travel control mechanism, which is an example of the substrate transport apparatus of the present invention. Furthermore, the adsorption travel control mechanism adsorbs and holds the periphery of the substrate, which is lifted by the floating stage section, and transports it along a horizontal transport direction. With this configuration, even large-sized substrates can be precisely controlled in terms of their relative position to the slit nozzle (an example of the "coating position" to be described later), resulting in a uniform coating film thickness.

[0004] In the manufacturing process of such substrates, in addition to standardized standard sizes, substrates with different external dimensions are sometimes used. For example, in glass substrates for manufacturing liquid crystal display panels, a substrate size with half the length along the transport direction is sometimes used, relative to the substrate size commonly referred to as G8 (2160mm × 2460mm). In this specification, the large substrate is referred to as a full-size substrate, and the substrate with half the length along the transport direction is referred to as a half-size substrate.

[0005] On the other hand, in the substrate processing apparatus, the floating stage section is divided into three stages. More specifically, the floating stage section includes: a coating stage, positioned opposite the slit nozzle; an upstream floating stage, disposed upstream of the coating stage in the substrate transport direction; and a downstream floating stage, disposed downstream of the coating stage in the same transport direction. Once the substrate is moved into the upstream floating stage, the substrate transport section (corresponding to the "substrate transport apparatus" of the present invention) begins to pick up and transport the substrate. At this time, the position of the substrate when it is moved into the upstream floating stage, for example, the position of the front end of the substrate in the transport direction, varies depending on the substrate size. Furthermore, in existing substrate processing apparatuses, the design is already optimized for substrates of a specific size, and the holding position of the peripheral portion of the substrate is fixed using a clamping mechanism. As a result, since the substrate sizes vary in the transport direction, it is necessary to redesign and manufacture a substrate transport section that matches them. Summary of the Invention

[0006] The present invention was made in view of the above-mentioned problems, and its object is to provide a technology that can handle a variety of substrates with different substrate sizes in the transport direction, in a substrate transport technology that transports the substrate while keeping it in a floating state at its periphery and in a substrate processing technology that supplies processing liquid to the upper surface while transporting the substrate using the substrate transport technology.

[0007] A substrate transport apparatus according to a first aspect of the present invention, wherein a substrate is held above a floating platform on which gas is ejected upwards, and the substrate is transported along a first horizontal direction, the substrate transport apparatus is characterized by comprising: a first elongated guide member extending along the floating platform in the first horizontal direction on one side of a second horizontal direction orthogonal to the first horizontal direction; a first sliding member freely movable along the first elongated guide member in the first horizontal direction; a first short guide member extending along the upper surface of the first sliding member in the first horizontal direction; a first holding portion having a plurality of first holding members capable of holding the substrate, the plurality of first holding members being independently and freely movable along the first short guide member in the first horizontal direction; a first positioning portion capable of positioning the plurality of first holding members at different positions relative to the first sliding member in the first horizontal direction; a first moving portion configured to move the first sliding member, the first short guide member, the first holding portion, and the first positioning portion integrally along the first elongated guide member in the first horizontal direction; and a control portion for controlling the first positioning portion.

[0008] Furthermore, the substrate handling method of the second aspect of the present invention uses the substrate handling device of claim 1 to handle a substrate that has been moved into the upper part of the floating platform through which gas is ejected upwards, above the floating platform. The substrate handling method is characterized by comprising: a holding step in which a first sliding member, a first short guide member, a first holding part, and a first positioning part are moved integrally to the substrate loading position, and after adjusting the relative positions of a plurality of first holding members relative to the first sliding member, the substrate is held by the first holding part; and a moving step in which, while the substrate is held by the first holding member, the substrate, the first sliding member, the first short guide member, the first holding part, and the first positioning part are moved integrally along the first horizontal direction.

[0009] Furthermore, the third aspect of the present invention includes: a substrate transport unit having the same structure as the substrate transport apparatus described above, which holds a substrate being transported above the floating platform where gas is ejected upwards while transporting the substrate along a first horizontal direction; and a processing liquid supply mechanism that supplies processing liquid to the substrate being transported along the first horizontal direction using the substrate transport unit.

[0010] In this invention, the first holding portion has a plurality of first holding members capable of holding the substrate. Furthermore, each of the plurality of first holding members is independently and freely movable along the first short guide member in a first horizontal direction, and their relative positions with respect to the first sliding member can be adjusted using the first positioning portion. Therefore, the positions of the plurality of first holding members are appropriated according to the substrate dimensions in the first horizontal direction, i.e., the transport direction.

[0011] The effects of the invention

[0012] As described above, according to the present invention, it is possible to handle a variety of substrates with different substrate sizes in the transport direction. Attached Figure Description

[0013] Figure 1 This is a schematic diagram showing the overall structure of the coating apparatus as a first embodiment of the substrate processing apparatus of the present invention.

[0014] Figure 2 This is a top view of the coating apparatus viewed from vertical.

[0015] Figure 3 From Figure 2 Top view of the coating mechanism after it has been removed.

[0016] Figure 4 This is a schematic diagram showing the traveling section of the adsorption travel control mechanism.

[0017] Figure 5This is a schematic diagram illustrating the clamping unit of the adsorption travel control mechanism.

[0018] Figure 6 It means by Figure 1 The flowchart shows the coating action performed by the coating device.

[0019] Figure 7 It is a diagram showing the positional relationship between the substrate and the fixture in the horizontal plane when it is moved above the upstream floating platform.

[0020] Figure 8 This is a top view of the coating apparatus, a second embodiment of the substrate processing apparatus of the present invention, as viewed from vertical above.

[0021] Figure 9 This is a diagram showing the positional relationship between the loading substrate and the fixture in the horizontal plane in the second embodiment.

[0022] Figure 10 This is a diagram showing the positional relationship between the loading substrate and the clamp in the horizontal plane in the third embodiment of the present invention.

[0023] Figure 11 This is a diagram showing the positional relationship between the loading substrate and the clamp in the horizontal plane in the fourth embodiment of the present invention.

[0024] Figure 12 This is a top view of the coating apparatus, a fifth embodiment of the substrate processing apparatus of the present invention, as viewed from vertical above.

[0025] Figure 13 This is a diagram showing the positional relationship between the loading substrate and the fixture in the horizontal plane in the fifth embodiment.

[0026] Explanation of reference numerals in the attached figures: 1: Coating apparatus (substrate processing apparatus) 3A: Upstream floating platform 3B: Central Floating Platform 3C: Downstream floating platform 5: Substrate handling section 7: Coating organization 9: Control Unit 51: Fixture mechanism 51L, 51R: Fixture Unit 51a~51f: Fixtures 52: Adsorption and travel control mechanism 52L, 52R: Propeller section 53L, 53R: Interval Adjustment Section Dt: Direction of transport Pfb: (Full-size substrate) Rear end position Pff: (Full-size substrate) Front end position Phb: (Rear end position of half-size substrate) Phf: (Front-end position of half-size substrate) Psb: (The rear position of the fixture) Psf: (Front position of the fixture) Psw: Standby position S: Substrate Sb: (substrate) lower surface Sf: Full-size substrate Sh: Half-size substrate X: X direction (first horizontal direction) Y: Y direction (second horizontal direction) Detailed Implementation

[0027] <First Implementation>

[0028] Figure 1 This is a schematic diagram showing the overall structure of a coating apparatus according to a first embodiment of the substrate processing apparatus of the present invention. The coating apparatus 1 is used to coat substrates from... Figure 1 A slit coating machine is used to coat the upper surface Sa of a substrate S, which is carried horizontally with its left side facing the right side, with a coating liquid applied. For example, this coating apparatus 1 is preferred for coating the upper surface Sa of various substrates S, such as glass substrates and semiconductor substrates, with a coating liquid containing a resist film, a coating liquid containing an electrode material, or other processing liquids, to form a uniform coating film.

[0029] Furthermore, in the following figures, to clarify the configuration relationships of the various parts of the device, such as... Figure 1 As shown, a right-handed XYZ orthogonal coordinate system is established. The transport direction of substrate S is referred to as the "X direction". Figure 1 The horizontal direction from the left hand side to the right hand side is called the "+X direction," and its opposite direction is called the "-X direction." Furthermore, the front side (near the front in the diagram) of the device in the horizontal direction Y, which is orthogonal to the X direction, is called the "-Y direction," and the back side of the device is called the "+Y direction." Additionally, the upward and downward directions in the vertical direction Z are called the "+Z direction" and "-Z direction," respectively. Furthermore, the (-X) side is called the upstream side of the X direction, and the (-X) side is called the downstream side of the X direction.

[0030] In the coating apparatus 1, the input conveyor 100, the input transfer unit 2, and the lifting unit 3 are arranged close to each other in sequence along the transport direction Dt (+X direction) of the substrate S, as detailed below, and together they form a transport path of the substrate S extending in a generally horizontal direction.

[0031] The substrate S, which is the object of processing, is removed from... Figure 1 The substrate S is fed into the input conveyor 100 from the left side. The input conveyor 100 includes a roller conveyor 101 and a rotation drive mechanism 102 that rotates the roller conveyor 101. By rotating the roller conveyor 101, the substrate S is transported horizontally downstream in the (+X) direction. The input transfer unit 2 includes a roller conveyor 21 and a rotation lifting drive mechanism 22, which has the function of rotating and driving the roller conveyor 21 and lifting and lowering the roller conveyor 21. By rotating the roller conveyor 21, the substrate S is further transported in the (+X) direction. In addition, by lifting and lowering the roller conveyor 21, the vertical position of the substrate S is changed. Using the input transfer unit 2 configured in this way, the substrate S is transferred from the input conveyor 100 to the floating unit 3.

[0032] Figure 2 This is a top view of the coating apparatus from a vertical perspective. Additionally, Figure 3 From Figure 2 A top view of the coating mechanism after removal. The following is a reference to these attachments. Figure 1 The specific mechanical structure of the coating apparatus 1 will be described below. For some mechanisms, a more detailed understanding of the structure can be obtained by referring to the contents of Japanese Patent Application Publication No. 2024-30264. Furthermore, in Figure 2 and Figure 3 The description of the rollers in the input conveyor 100, etc., is omitted.

[0033] like Figure 3 As shown, the levitation section 3 consists of three levitation platforms. The upstream levitation platform 3A and the downstream levitation platform 3C each have a plurality of air ejection holes arranged in a matrix pattern across the entire surface of a plate-shaped platform. Furthermore, by applying compressed air to each ejection hole, the airflow generated by the compressed air ejected from each hole causes the substrate S to levitate. Thus, on the upstream levitation platform 3A and the downstream levitation platform 3C, the substrate S levitates from the platform surface to a predetermined levitation height, for example, 10 to 500 micrometers. To supply compressed air to each ejection hole, as follows... Figure 1 As shown, a buoyancy control mechanism 35 is provided. Thus, in this embodiment, air is used as the "gas" of the present invention.

[0034] In addition, although the illustration is omitted, the upstream floating platform 3A and the downstream floating platform 3C, in addition to the aforementioned ejection holes, also have a plurality of lifting pins. Furthermore, as... Figure 1As shown, lifting pin drive mechanisms 34 and 36 are respectively provided for the upstream floating platform 3A and the downstream floating platform 3C to enable the lifting pins to move up and down. A plurality of lifting pins are configured to pass through the gaps between the ejection holes and are spaced at predetermined intervals, directly opposite the lower surface Sb of the substrate S. The lifting pins are driven by the lifting pin drive mechanisms 34 and 36 located below the platform surface to move up and down in the vertical direction (Z-axis direction). That is, the substrate S is raised and / or lowered on the upstream floating platform 3A and the downstream floating platform 3C. Thus, as explained later, in the upstream floating platform 3A, the floating substrate S is transferred to the substrate transport unit 5 by the movement of the lifting pins driven by the lifting pin drive mechanism 34. On the other hand, in the downstream floating platform 3C, the substrate S raised by the lifting pin drive mechanism 36 is handed over to the transfer robot (not shown). In addition, in this embodiment, the unloading process is performed by a transfer robot. However, similar to the device described in Japanese Patent Application Publication No. 2024-30264, an output transfer unit and an output conveyor may be provided on the downstream side of the downstream floating platform 3C, and the unloading process may be performed by them.

[0035] On the other hand, the central floating platform 3B is configured to have higher floating accuracy than the upstream floating platform 3A and the downstream floating platform 3C. Specifically, the central floating platform 3B has a rectangular, plate-shaped platform surface. In this central floating platform 3B, a plurality of holes are distributed in a matrix pattern with a narrower spacing than the ejection holes provided in the upstream floating platform 3A and the downstream floating platform 3C. Furthermore, unlike the upstream and downstream floating platforms 3A and 3C, in the central floating platform 3B, half of the holes function as compressed air ejection holes, and the remaining half function as suction holes. That is, compressed air is ejected from the ejection holes towards the lower surface Sb of the substrate S, thereby supplying compressed air into the space between the platform surface and the lower surface Sb of the substrate S. On the other hand, it is configured to draw air from the space via the suction holes. By ejecting and drawing air into the aforementioned space, the compressed air flow ejected from each ejection hole diffuses horizontally within the space and is then drawn into the air layer (pressurized gas layer) adjacent to that ejection hole, resulting in a more stable pressure balance. This allows for highly precise and stable control of the levitation height of the substrate S. Furthermore, the levitation control mechanism 35 controls the supply of compressed air to each ejection hole and the drawing of air from the suction hole.

[0036] The substrate S, which is transferred into the floating section 3 via the input transfer unit 2, is propelled in the (+X) direction by the rotation of the roller conveyor 21, and thus transferred onto the upstream floating stage 3A. The upstream floating stage 3A, the central floating stage 3B, and the downstream floating stage 3C support the substrate S in a floating state, but do not have the function of moving the substrate S in the horizontal direction. The transfer of the substrate S in the floating section 3 is performed by the substrate transfer unit 5, which is located below the upstream floating stage 3A, the central floating stage 3B, and the downstream floating stage 3C.

[0037] The substrate transport unit 5 includes a clamping mechanism 51 and an adsorption travel control mechanism 52. The clamping mechanism 51 has four clamps 51a to 51d, all of which partially abut against the peripheral portion of the lower surface of the substrate S, thereby supporting the substrate S from below. The clamps 51a and 51b located on the (+Y) side are configured to move independently along the X direction on the base 521 on the (+Y) side, and the separation distance of the clamps 51a and 51b in the X direction can be adjusted. Adsorption pads are provided on the upper surfaces of these clamps 51a and 51b, and the entire upper surface of the clamps 51a and 51b functions as a holding surface for adsorbing and holding the peripheral portion of the lower surface of the substrate S. Furthermore, the base 521 on the (+Y) side can move along the X direction while supporting the clamps 51a and 51b.

[0038] Similarly, the clamps 51c and 51d provided on the (-Y) side are also configured to move independently and freely in the X direction on the base 521 on the (-Y) side, and the separation distance of the clamps 51c and 51d in the X direction can be adjusted. An adsorption pad is provided on the upper surface of such clamps 51c and 51d, and the entire upper surface of the clamps 51c and 51d functions as a holding surface for adsorbing and holding the peripheral portion of the lower surface of the substrate S. Furthermore, the base 521 on the (-Y) side can move in the X direction while supporting the clamps 51c and 51d.

[0039] The adsorption travel control mechanism 52 has the functions of applying negative pressure to the adsorption pad of the adsorption member provided at the upper end of the clamping mechanism 51 to adsorb and hold the substrate S; reciprocatingly moving the base 521 along the travel guide 523 in the X direction; moving the clamps 51a and 51b along the X direction on the (+Y) side of the base 521 to position the clamps 51a and 51b relative to the base 521; and moving the clamps 51c and 51d along the X direction on the (-Y) side of the base 521 to position the clamps 51c and 51d relative to the base 521. The adsorption travel control mechanism 52 is controlled by the control unit 9 to move the clamps 51a to 51d so that clamps 51a and 51c are always in the same position in the X direction, and clamps 51b and 51d are in the same position. Thus, the four clamps 51a to 51d appear to move as a single clamping mechanism 51. In this specification, this type of movement is referred to as "integrated movement type" to distinguish it from the "unit-based movement type" used in the embodiments described later. Furthermore, a more detailed description of the structure of the substrate transport unit 5 will follow.

[0040] The clamping mechanism 51 holds the substrate S that has been moved from the input transfer unit 2 into the floating unit 3. In this state, the clamping mechanism 51 moves in the (+X) direction, thereby transporting the substrate S from above the upstream floating platform 3A, over the central floating platform 3B, to above the downstream floating platform 3C. After the substrate S is lifted from the downstream floating platform 3C by the lifting pin drive mechanism 36, it is handed over to the transfer robot (not shown).

[0041] Along the transport path of the substrate S transported in the manner described above, a coating mechanism 7 is provided for applying a coating liquid to the upper surface Sa of the substrate S. The coating mechanism 7 has a slit nozzle 71. Additionally, as... Figure 1 As shown, the slit nozzle 71 is connected to a nozzle drive mechanism 8. The nozzle drive mechanism 8 has a lifting section that raises and lowers the slit nozzle 71 in the Z direction and a moving section that moves the slit nozzle 71 in the X direction. Therefore, according to the command from the control unit 9, the lifting section and / or the moving section are activated, thereby positioning the slit nozzle 71 in a coating position above the central floating platform 3B, an upper position separated from the coating position, a contact position slightly below the coating position for performing contact actions, or a maintenance position. Furthermore, the slit nozzle 71 is connected to a coating liquid supply mechanism (not shown), from which coating liquid is supplied, and the coating liquid is sprayed out as a treatment liquid from the spray outlet 711 that opens downward at the lower part of the nozzle.

[0042] The slit nozzle 71 has an outlet 711 extending along the Y direction and is supported by a nozzle support 701 to spray coating liquid vertically downwards (towards the -Z side). The nozzle support is connected to the nozzle drive mechanism 8. When coating liquid is supplied to the upper surface Sa of the substrate S using the slit nozzle 71, the lifting and moving parts are controlled by the control unit 9, causing the slit nozzle 71 to move with the outlet 711 in the upper position. Then, the lifting part is controlled by the control unit 9 to adjust the gap between the outlet 711 and the substrate S to a predetermined value by descending to the contact position (contact action) and rising to the coating position. Then, in the state where the gap adjustment is completed, coating liquid is sprayed from the outlet 711 onto the upper surface Sa of the substrate S, while the substrate S is transported along the (+X) direction.

[0043] Furthermore, the nozzle support 701 is configured to move in the X direction. Specifically, a pair of travel guides 81L and 81R extending in the X direction are respectively mounted on the upper surfaces of the (+Y) and (-Y) side ends of the base 10. The nozzle support 701 engages with the travel guides 81L and 81R via a sliding member (not shown) mounted at its lower part, allowing it to move freely in the X direction along the travel guides 81L and 81R. Therefore, by controlling the moving part via the control unit 9, the slit nozzle 71 is moved in the X direction.

[0044] In order to perform the prescribed maintenance on the slit nozzle 71 configured as described above, such as Figure 1 As shown, a nozzle cleaning standby unit 79 is provided on the coating mechanism 7. The nozzle cleaning standby unit 79 mainly includes a roller 791, a cleaning section 792, and a roller groove 793. The roller groove 793 is supported by a roller groove support section 702 extending along the Y direction. The roller groove support section 702 engages with travel guides 84L and 84R via a sliding member (not shown) mounted on its lower part, and moves freely along the travel guides 84L and 84R in the X direction. Therefore, the control unit 9 controls the moving section, thereby moving the nozzle cleaning standby unit 79 along the X direction. Furthermore, with the slit nozzle 71 positioned in the maintenance position, nozzle cleaning and pre-ejection processing are performed appropriately, adjusting the nozzle outlet of the slit nozzle 71 to a state suitable for the next coating process.

[0045] Next, refer to Figures 2 to 5 The detailed structure of the substrate transport unit 5 will be described. Figure 4 This diagram schematically illustrates the traveling section of the adsorption traveling control mechanism, extracting and illustrating the structure of the traveling section that transports the substrate in the levitation section. Figure 5 This is a schematic diagram of the clamping unit of the adsorption travel control mechanism, extracting and schematically showing the structure for adsorbing the substrate above the levitation part.

[0046] In the clamping mechanism 51, clamps 51a and 51b, which are independently movable along the X direction and are mounted on the base 521 on the (+Y) side, function as clamping unit 51L. Clamps 51c and 51d, which are independently movable along the X direction and are mounted on the base 521 on the (-Y) side, function as clamping unit 51R. Additionally, a spacing adjustment section 53L is provided on the base 521 on the (+Y) side, which adjusts the spacing between clamps 51a and 51b in the X direction by allowing them to move independently along the X direction. Similarly, a spacing adjustment section 53R is provided on the base 521 on the (-Y) side, which adjusts the spacing between clamps 51c and 51d in the X direction by allowing them to move independently along the X direction. Furthermore, a traveling section 52L for moving the base 521, which is equipped with the clamp unit 51L and the spacing adjustment section 53L, in the transport direction Dt is provided on the (+Y) side of the floating section 3, and a traveling section 52R for moving the base 521, which is equipped with the clamp unit 51R and the spacing adjustment section 53R, in the transport direction Dt is provided on the (-Y) side of the floating section 3. The traveling sections 52L and 52R, and the spacing adjustment sections 53L and 53R, have the same structure, such as... Figure 3 As shown, when viewed from above, they are symmetrically arranged across the floating section 3. Similarly, the clamping units 51L and 51R are also arranged in the same manner. Therefore, in this specification, refer to... Figure 3 and Figure 5 The structure of the clamping unit 51R, the traveling part 52R, and the interval adjustment part 53R is described in detail. On the other hand, the same reference numerals are used to refer to the structure of the clamping unit 51L, the traveling part 52L, and the interval adjustment part 53L, and the description is omitted.

[0047] The traveling unit 52R includes a base 521, sliders 522, a traveling guide 523, and a linear motor 524. The base 521 has a flat plate shape extending in the X direction, and its upper surface is machined to be flat. A clamping unit 51R is mounted on the upper surface of the base 521 via a spacing adjustment part 53R. Two sliders 522 are mounted on the lower surface of the base 521. The sliders 522 engage with the traveling guide 523. Thus, the base 521 can travel in the X direction along the traveling guide 523 while holding the substrate S held by the clamping unit 51R and the clamping unit 51R.

[0048] In addition, a linear motor 524 is provided to enable the base 521 to move. Specifically, the magnet module 524M of the linear motor 524 extends along the X direction on the base 10 as a fixing member, and the coil module 524C is mounted on the lower part of the base 521 as a moving member. The linear motor 524 operates according to control commands from the control unit 9, thereby moving the base 521 along the X direction. As a result, the substrate S, which is attracted to the clamping unit 51R on the base 521, moves along the transport direction Dt. Furthermore, the X-direction position of the clamping unit 51R can be detected using a linear scale (not shown). While the linear motor 524 is used to move the substrate S in the first embodiment, it is also possible to use other traveling mechanisms, such as a ball screw mechanism, and to use an encoder to detect the X-direction position of the clamping unit 51R.

[0049] Next, the interval adjustment unit 53R will be described. The interval adjustment unit 53R includes short bases 531 and 532, sliders 533 and 534, a travel guide 535, and a linear motor 536. The short bases 531 and 532 are flat plates extending in the X direction with a shorter dimension than the base 521 in the X direction, and their upper surfaces are machined to be flat. The clamps 51c and 51d constituting the clamp unit 51R are respectively mounted on the short bases 531 and 532 (see reference). Figure 5 ).

[0050] Sliding members 533 and 534 are respectively mounted on the lower surfaces of short bases 531 and 532. Sliding members 533 and 534 engage with a travel guide 535 fixed to base 521. Thus, clamps 51c and 51d respectively mounted on short bases 531 and 532 can move independently along the X direction. Furthermore, a linear motor 536 is provided to enable the short bases 531 and 532 to travel. Specifically, the magnet module 536M of the linear motor 536 extends along the X direction on base 521 as a fixed member, and coil modules 536C1 and 536C2 are respectively mounted as moving members on the lower parts of short bases 531 and 532.

[0051] Linear motor 536 operates according to control commands from control unit 9, thereby allowing short bases 531 and 532 to move independently along the X direction. Consequently, clamps 51c and 51d can be positioned at different locations in the X direction, and the spacing between clamps 51c and 51d in the X direction can be adjusted. For example, when transporting a full-size substrate Sf in the transport direction Dt, as described later... Figure 7As shown in column (a), clamps 51c and 51d can be positioned at the (-X) side end and (+X) side end of the travel guide 535, respectively. This allows for a wider spacing between clamps 51c and 51d. Consequently, the peripheral portions of the two corners on the (-Y) side can be held and held on the lower surface of the full-size substrate Sf. Furthermore, for example, as... Figure 7 As shown in column (b), when clamps 51c and 51d are positioned at the (-X) side end and near the center of the travel guide 535, respectively, the spacing between clamps 51c and 51d can be adjusted to be relatively narrow. As a result, the two corners can be held and held at the periphery on the (-Y) side of the lower surface of the half-size substrate Sh.

[0052] When the substrate S held in this adsorption manner is transported in the transport direction Dt, the linear motor 524 operates according to the control command from the control unit 9, and the base 521 moves in the X direction. Thus, the substrate S, adsorbed by the clamping unit 51R with its spacing adjusted as described above, travels in the transport direction Dt on the base 521. Furthermore, the X-direction position of the clamping unit 51R can be detected by a linear scale (not shown). In the first embodiment, the substrate S is moved using linear motors 524 and 536, but it is also possible to use other traveling mechanisms, such as ball screw mechanisms, and to use an encoder to detect the X-direction position of the clamping unit 51R.

[0053] The fixtures 51c and 51d that constitute the fixture unit 51R have the same structure. Therefore, only the structure of fixture 51c will be described, and the structure of the other fixture will be omitted.

[0054] The clamp 51c has a retaining member 511 mounted on the short base 531. The retaining member 511 is configured to be freely attached and detached from the short base 531, for example, by means of a fastening member 512 such as bolts to the base 521. The upper end of the retaining member 511 is machined to be flat, and at least one (two in this example) adsorption pad 513 is provided on the upper surface. By supplying negative pressure to the adsorption pad 513 from the negative pressure application part 514, the retaining member 511 adsorbs and holds the substrate S in a state where the adsorption pad 513 abuts against the lower surface Sb of the substrate S.

[0055] The upper surface of the short base 531 is machined to be flat and has a plurality of threaded holes 521a for mounting the retaining member 511. On the other hand, the retaining member 511 has a through hole 515 for the insertion of the fixing member 512. The retaining member 511 is joined to the short base 531 by screwing the fixing member 512, which is inserted through the through hole 515 of the retaining member 511, into the threaded hole 521a of the short base 531.

[0056] Here, the short base 531 has more threaded holes 521a than the retaining member 511 has through holes 515. Specifically, the retaining member 511 has a plurality of (three in this example) through holes 515 at constant intervals in the X direction. On the other hand, the short base 531 has more (five in this example) threaded holes 521a arranged in the X direction at the same intervals as the through holes 515 in the retaining member 511 than the through holes 515 on the retaining member 511. Moreover, the short base 531 has a plurality of (three columns in this example) rows of threaded holes 521a arranged in this way in the X direction at different positions in the Y direction.

[0057] Therefore, the mounting position of retaining member 511 relative to short base 531 is not unique, and multiple members are provided in both the X and Y directions. That is to say, on short base 531, retaining member 511 can be positioned in multiple levels.

[0058] The negative pressure supply unit 514 is mounted on the short base 531 corresponding to the retaining member 511 mounted on the short base 531. The negative pressure supply unit 514 has: a manifold portion 514a, which has a cavity formed inside to form a manifold space; and a flexible tube 514b connected to the manifold portion 514a. With the retaining member 511 mounted on the short base 531, the flexible tube 514b is connected to the suction port 519 provided on the retaining member 511 and communicating with the suction pad 513. The internal space of the manifold portion 514a is connected to a suction source such as a vacuum pump (see figure) via a pipe 516 in a cable bracket (not shown) connected to the base 521. Figure 3 (Connection). Additionally, an on / off valve 517 is installed on piping 516.

[0059] Therefore, when the on / off valve 517 is opened according to the opening command from the control unit 9, the negative pressure supplied from the suction source is supplied to the adsorption pad 513 via the manifold 514a and the flexible tube 514b. As a result, the peripheral portion of the lower surface of the substrate S is adsorbed and held.

[0060] A control unit 9 is provided to control each part of the coating apparatus 1 configured as described above. Figure 1As shown, the control unit 9 is configured as a general computer system consisting of an arithmetic unit 91 (e.g., a CPU) that performs various arithmetic operations, a storage unit 92 (e.g., a ROM or RAM) that stores basic programs and various information, and a bus. The bus also connects a disk 93 (e.g., a hard disk drive) for storing coating programs, a display unit 94 (e.g., a monitor) for displaying various information, and an input unit 95 (e.g., a keyboard and mouse) for receiving input from the operator. Alternatively, a touch panel display integrating the display unit 94 and the input unit 95 can be used. Furthermore, by receiving signals from sensors installed in various parts of the device via an interface (not shown), the arithmetic unit 91 of the control unit 9 controls each part of the device according to the coating program to perform the coating process described below.

[0061] Furthermore, although the substrate S transported into the upstream floating stage 3A via the input conveyor 100 and the input transfer unit 2 has a rectangular shape, there are cases where "small-sized substrates" and "large-sized substrates" with different dimensions in the transport direction Dt are floated and transported while coating is being performed. Here, "large-sized substrate" refers to a substrate with a first length (and thereafter) in the transport direction Dt. Figure 7 In the attached diagram, the first and second sides of a substrate (referred to as Lf) are opposite each other in the Y direction. "Small-size substrate" refers to a substrate with the same width as the large-size substrate (hereinafter referred to as Lf). Figure 7 (referring to the figure in Figure W), and has a second length shorter than the first length in the transport direction Dt (thereafter). Figure 7 The first and second sides of the substrate (referred to as Lh in the attached figure) are opposite each other in the Y direction. As a representative example, there is a case where full-size substrates Sf and half-size substrates Sh are mixed. Therefore, as will be explained below, the arithmetic unit 91 determines whether the substrate S being moved into the upstream floating stage 3A is a full-size substrate or a half-size substrate. Then, based on this determination result, the arithmetic unit 91 selectively performs a first transport step that adapts the transport method of substrate S to the transport method of a full-size substrate or a second transport step that adapts the transport method of substrate S to the transport method of a half-size substrate. Thus, in the first embodiment, as... Figure 1 As shown, the arithmetic unit 91 functions as a "substrate size determination unit", "first transport control unit", and "second transport control unit".

[0062] Figure 6 It means by Figure 1 The flowchart shows the coating action performed by the coating device. Figure 7This diagram shows the horizontal positional relationship between the substrate and the clamps being moved to the upper part of the upstream floating platform. Column (a) shows the relationship between the full-size substrate Sf and the clamps 51a-51d, and column (b) shows the relationship between the half-size substrate Sh and the clamps 51a-51d. Additionally, in Figure 7 In this diagram, to indicate the adsorption / adsorption cessation of clamps 51a to 51d, additional points are added to each clamp 51a to 51d only during adsorption. These points will be explained later. Figure 9 The same applies to the attached diagrams.

[0063] In this coating apparatus 1, the slit nozzle 71 used for coating is moved to a maintenance position to perform a pre-dispensing process. Additionally, compressed air in the starting levitation section 3 is ejected and drawn in to prepare for the levitation of the substrate S being transported. Furthermore, the slit nozzle 71 can be cleaned before the pre-dispensing process.

[0064] Next, the substrate S is fed into the coating apparatus 1. The substrate S, to be processed, is placed on the input conveyor 100 via a separate processing unit and a transport robot on the upstream side, and is transported in the (+X) direction by the rotating roller conveyor 101. Through the coordinated operation of the input transfer unit 2, which positions the upper surface of the roller conveyor 21 at the same height as the roller conveyor 101 of the input conveyor 100, the substrate S is transported to the upper part of the upstream floating stage 3A, where buoyancy is applied to the substrate S by the ejection of compressed air. Furthermore, when the substrate S is fed into the upstream floating stage 3A, the lifting pin provided on the upstream floating stage 3A is positioned by the lifting pin drive mechanism 34 at an upper position where its upper end protrudes upwards from the upper surface of the upstream floating stage 3A. Here, if the substrate S being fed is a full-size substrate Sf, as... Figure 7 As shown in column (a), in the transport direction Dt, the front end position Pff of the full-size substrate Sf is located at the end of the upstream floating stage 3A on the (+X) side, and the rear end position Pfb of the substrate S is located at the input transfer section 2. On the other hand, when the substrate S being transported is a half-size substrate Sh, as shown in column (a), the rear end position Pfb of the substrate S is located at the input transfer section 2. Figure 7 As shown in column (b), in the transport direction Dt, similar to the case of the full-size substrate Sf, the rear end position Phb of substrate S is located at the input transfer section 2, but the front end position Phf of substrate S is located in the middle of the upstream floating stage 3A. In other words, the transport position of substrate S at the time of transport varies depending on the substrate size.

[0065] Therefore, the calculation unit 91 acquires substrate size information indicating the transport direction dimension of the substrate S being moved into the upstream floating platform 3A (step S1). Then, the calculation unit 91 determines whether the substrate S is a full-size substrate Sf or a half-size substrate Sh based on the substrate size information (step S2). Furthermore, the aforementioned substrate size information can be obtained using sensor output information detected by a size detection sensor pre-installed on the upstream floating platform 3A, substrate information contained in the specifications stored in the fixed disk 93, etc.

[0066] When the computing unit 91 determines that the substrate S being transported is a full-size substrate Sf (determined as "full-size substrate" in step S2), it performs a first transport process suitable for the full-size substrate Sf (steps S3A, S4A, S5-S7) while simultaneously performing a coating process. Conversely, when the computing unit 91 determines that the substrate S being transported is a half-size substrate Sh (determined as "half-size substrate" in step S2), it performs a second transport process suitable for the half-size substrate Sh (steps S3B, S4B, S5-S7) while simultaneously performing a coating process.

[0067] In the first handling process, such as Figure 7 As shown in column (a), the bases 521 on the (+Y) and (-Y) sides are moved to the loading position of the substrate S, and after adjusting the relative positions of the clamps 51a to 51d with respect to the base 521, the clamps 51a to 51d hold the substrate S in the loading position. More specifically, steps S3A and S4A, which correspond to an example of the "holding process" of the present invention, are performed sequentially. In step S3A, on the clamp unit 51L side, the base 521 is moved to a position directly below the loading position. This movement, either before or in parallel with the movement, positions the clamps 51a and 51b at the (-X) side end and (+X) side end of the travel guide 535, respectively, so that the interval between the rear position Psb of the clamp 51a and the front position Psf of the clamp 51b is consistent with the X-direction length Lf of the full-size substrate Sf. In addition, on the clamp unit 51R side, the same process as on the clamp unit 51L side is also performed. As a result, viewed from above, the front position Psf of the clamping mechanism 51, i.e., the front end position of clamps 51b and 51d, coincides with the front end position Pff of the full-size substrate S. Furthermore, the rear position Psb of the clamping mechanism 51, i.e., the rear end position of clamps 51a and 51c, coincides with the rear end position Pfb of the full-size substrate Sf. Thus, the relationship between the loading position of the full-size substrate Sf and the holding position of the clamping mechanism 51 can be adjusted. In this embodiment, the front end position Pff and the rear end position Pfb of the full-size substrate Sf correspond to an example of the "substrate loading position" of the present invention, and the front position Psf and the rear position Psb of the clamping mechanism 51 correspond to an example of the substrate holding position.

[0068] By executing step S3A, the clamps 51a-51d are positioned so that they approach the four corners of the full-size substrate Sf in the vertical direction Z. Then, by lowering the lifting pins, the full-size substrate Sf is transferred to the clamping mechanism 51. Next, an opening command is issued to the on / off valve 517, applying negative pressure to the suction pads 513 of the clamps 51a-51d (step S4A). As a result, the clamping mechanism 51 holds the periphery of the four corners of the lower surface of the full-size substrate Sf. In this state, the full-size substrate Sf moves in the transport direction Dt (an example of the "moving process" of the present invention). That is, in step S5, the movement of the full-size substrate Sf in the transport direction Dt begins. After this movement begins, the full-size substrate Sf is transported until its front end is at the coating start position, and then temporarily stopped. In parallel with this, the slit nozzle 71 moves from the pre-dispensing position to the coating position and is positioned. That is, the slit nozzle 71 is moved to a position above the coating position using the nozzle drive mechanism 8. Next, the slit nozzle 71 descends towards the full-size substrate Sf, and the coating liquid adhering near the nozzle 711 comes into contact with the upper surface of the full-size substrate Sf at the coating start position. As a result, a meniscus of coating liquid is formed on the upper surface of the full-size substrate Sf at the coating start position.

[0069] After the meniscus is formed, the slit nozzle 71 rises from the contact position by a distance corresponding to the thickness of the coating liquid using the nozzle drive mechanism 8. This adjusts the gap between the nozzle outlet 711 and the upper surface of the full-size substrate Sf, the so-called coating gap. After adjusting this coating gap, the coating operation begins. That is, the coating liquid ejected from the nozzle outlet 711 of the slit nozzle 71 falls onto the upper surface Sa of the substrate S. Meanwhile, the clamping mechanism 51 restarts the movement of the full-size substrate Sf, transporting it at a constant speed so that the full-size substrate Sf passes through the coating area held by the slit nozzle 71 and the stage. Thus, the slit nozzle 71 applies the coating liquid to the upper surface Sa of the full-size substrate Sf, forming a coating film of constant thickness using the coating liquid.

[0070] The coating process continues until the full-size substrate Sf is transported to the end position where coating should be completed. When the full-size substrate Sf reaches the end position, the slit nozzle 71 disengages from the coating position and returns to the maintenance position, performing a pre-ejection process again. Meanwhile, the clamping mechanism 51 moves in the transport direction Dt until the calculation unit 91 determines that the front end of the full-size substrate Sf is located at the (+X) side end of the downstream floating stage 3C, i.e., the transport end position ("Yes" in step S6). After the clamping mechanism 51 stops at the transport end position, it issues a closing command to the on / off valve 517, stopping the supply of negative pressure to the full-adsorption pad 513. This releases the adsorption and holding of the full-size substrate Sf (step S7). The full-size substrate Sf is then handed over to the transfer robot (not shown) and sent to the downstream unit (unloading process).

[0071] On the other hand, in the second handling process, such as Figure 7 As shown in column (b), except that the front position Psf of the clamps 51b and 51d (hereinafter referred to as the "front clamp pair") on the (+Y) side of the clamps 51a to 51d constituting the clamp mechanism 51 coincides with the front end position Phf of the half-size substrate Sh, the same process as the first transport process is performed. That is, steps S3B and S4B are performed sequentially. In step S3B, on the clamp unit 51L side, the base 521 is moved to a position directly below the loading position. Before or in parallel with this movement, the clamps 51a and 51b are respectively positioned near the (-X) side end and center of the travel guide 535, so that the interval between the rear position Psb of the clamp 51a and the front position Psf of the clamp 51b coincides with the X-direction length Lh of the half-size substrate Sh. In addition, on the clamp unit 51R side, the same process as on the clamp unit 51L side is also performed. As a result, viewed from above, the front position Psf of the clamping mechanism 51, i.e., the front end position of clamps 51b and 51d, coincides with the front end position Phf of the half-size substrate Sh. Furthermore, the rear position Psb of the clamping mechanism 51, i.e., the rear end position of clamps 51a and 51c, coincides with the rear end position Phb of the half-size substrate Sh. Thus, the relationship between the loading position of the full-size substrate Sf and the holding position of the clamping mechanism 51 is adjusted. Moreover, in this embodiment, the front end position Phf and the rear end position Phb of the half-size substrate Sh correspond to an example of the "substrate loading position" of the present invention, and the front position Psf and the rear position Psb of the clamping mechanism 51 correspond to an example of the substrate holding position.

[0072] When the clamps 51b and 51d are positioned close to the (+Y) side periphery of the half-size substrate Sh in the vertical direction Z after step S3B, the half-size substrate Sh is transferred to the clamp mechanism 51 by the descent of the lifting pin. Next, an opening command is issued to the on / off valve 517, applying negative pressure to the suction pads 513 of the clamps 51a to 51d (step S4B). As a result, the clamp mechanism 51 holds the periphery of the four corners of the lower surface of the half-size substrate Sh, and in this state, moves the half-size substrate Sh in the transport direction Dt (an example of the "moving process" of the present invention). Thereafter, similar to the first transport process, the coating process and unloading process are performed.

[0073] As described above, according to the first embodiment, the clamping unit 51L has two clamps 51a and 51b. The clamps 51a and 51b are each independently and freely movable in the X direction along the travel guide 535, and their relative positions to the base 521 on the (+Y) side are adjusted according to the substrate size. Similarly, the clamping unit 51R adjusts the relative positions of the clamps 51c and 51d to the base 521 on the (-Y) side according to the substrate size. As a result, for either a full-size substrate Sf or a half-size substrate Sh, the substrate S can be lifted and transported while simultaneously holding the periphery of the four corners of the lower surface of the substrate S by the clamping mechanism 51. Thus, the coating apparatus 1 can handle substrates S of different sizes using a single clamping mechanism 51, exhibiting high versatility. Therefore, it is unnecessary to design and manufacture the substrate transport section 5 required in existing apparatuses. In addition, when the substrate to be coated is switched from a full-size substrate Sf to a half-size substrate Sh, or from a half-size substrate Sh to a full-size substrate Sf, the changeover adjustment of the equipment becomes easier.

[0074] In addition, since the substrate S is moved while holding the four corners of the substrate S with the adsorption pad 513, regardless of the substrate size, the substrate S can be moved stably.

[0075] In the first embodiment described above, the X direction and Y direction correspond to the "first horizontal direction" and "second horizontal direction" of the present invention, respectively. The (+X) side and (-X) side correspond to the "upstream side of the first horizontal direction" of the present invention. The (+Y) side and (-Y) side correspond to the "one side of the second horizontal direction" of the present invention, and the other side corresponds to the "other side of the second horizontal direction" of the present invention. The travel guide 523 on the (+Y) side and the travel guide 523 on the (-Y) side correspond to the "first long guide member" of the present invention, and the other side corresponds to the "second long guide member" of the present invention. The base 521 on the (+Y) side and the base 521 on the (-Y) side correspond to the "first sliding member" and the "second sliding member" of the present invention, respectively. The travel guide 535 on the (+Y) side and the travel guide 535 on the (-Y) side correspond to the "first short guide member" and the "second short guide member" of the present invention, respectively. The linear motors 524 and 536 on the (+Y) side correspond to the "first moving part" and the "first positioning part" of the present invention, respectively. The linear motors 524 and 536 on the (-Y) side correspond to the "second moving part" and "second positioning part" of the present invention, respectively. The travel guide 535 and the travel guide 535 on the (-Y) side correspond to the "first guiding member" and "second short guiding member" of the present invention, respectively. The clamps 51a and 51b correspond to an example of the "first holding member" of the present invention, and the clamp unit 51L having clamps 51a and 51b corresponds to an example of the "first holding part" of the present invention. The clamps 51c and 51d correspond to an example of the "second holding member" of the present invention, and the clamp unit 51R having clamps 51c and 51d corresponds to an example of the "second holding part" of the present invention. The coating mechanism 7 corresponds to an example of the "treatment fluid supply mechanism" of the present invention.

[0076] <Second Implementation>

[0077] In the first embodiment described above, regardless of the substrate size, the substrate S is lifted and transported while adsorbing and holding the peripheral portions of the four corners of the substrate S. However, the number of substrates adsorbed and held can vary depending on the substrate size (second embodiment). Hereinafter, refer to Figure 8 and Figure 9 The second embodiment will be described.

[0078] Figure 8 This is a top view of the coating apparatus, a second embodiment of the substrate processing apparatus of the present invention, as viewed from vertical above. Figure 9This diagram illustrates the positional relationship between the substrate and the clamps in the horizontal plane in the second embodiment. A major difference between this second embodiment and the first embodiment is that the end of the travel guide 523 on the (-X) direction side extends into the adjacent area of ​​the input conveyor 100; in the process of transporting the half-size substrate Sh (the second transport process), it is held by the front clamp pair (i.e., clamps 51b, 51d), while the clamps 51a, 51c on the (-X) side (hereinafter referred to as the "rear clamp pair") move away from the loading position of the half-size substrate Sh in the (-X) direction and stand by; common opening and closing valves 517a and 517b are provided corresponding to the front clamp pair and the rear clamp pair, respectively. Furthermore, the other structures and operations are the same as those in the first embodiment. Therefore, the following description focuses on the differences, and the same reference numerals are used for the same structures, with structural descriptions omitted.

[0079] In the second embodiment, when the arithmetic unit 91 determines that the substrate S being moved in is a full-size substrate Sf (determined as "full-size substrate" in step S2), as follows: Figure 9 As shown in column (a), the coating process is performed in parallel while performing the first transport step (steps S3A, S4A, S5-S7) the same as in the first embodiment. Conversely, when the calculation unit 91 determines that the substrate S being transported is a half-size substrate Sh (determined as a "half-size substrate" in step S2), as... Figure 9 As shown in column (b), unlike the first embodiment, the clamping mechanism 51 moves the half-size substrate Sh in the transport direction Dt while adsorbing and holding the peripheral portions of the two front corners of the lower surface of the half-size substrate Sh.

[0080] In the second transport step of the second embodiment, such as Figure 9As shown in column (b), the base 521 on the (+Y) side moves to a position directly below the loading position. Before or in parallel with this movement, the clamps 51a and 51b are positioned near the center of the travel guide 535 and at the (+X) side end, respectively. Consequently, the distance between the rear position Psb of clamp 51a and the front position Psf of clamp 51b becomes longer than the X-direction length Lh of the half-size substrate Sh, and the front position Psf of clamp 51b coincides with the front end position Phf of the half-size substrate Sh. Through this operation of clamp unit 51L, clamp 51a is in standby position Psw, adjacent to the (-X) side, relative to the rear end position Phb of the half-size substrate Sh. Furthermore, the same process as on clamp unit 51L is performed on clamp unit 51R. As a result, viewed from vertical above, the front position Psf of the clamping mechanism 51, i.e., the front end position of clamps 51b and 51d, coincides with the front end position Phf of the half-size substrate Sh. Furthermore, the rear position Psb of the clamping mechanism 51, i.e., the rear end position of clamps 51a and 51c, is positioned at the standby position Psw, separated from the half-size substrate Sh in the (-X) direction. Thus, the relationship between the loading position of the half-size substrate Sh and the holding position of the clamping mechanism 51 is adjusted. That is, in this embodiment, the front end position Phf of the half-size substrate Sh corresponds to an example of the "loading position" of the present invention, and the front position Psf of the clamping mechanism 51 corresponds to an example of the holding position. Additionally, the standby positions Psw of clamps 51a and 51c correspond to examples of the "first standby position" and "second standby position" of the present invention, respectively.

[0081] When the clamps 51b and 51d are positioned close to the (+X) side periphery of the half-size substrate Sh in the vertical direction Z after step S3B, the half-size substrate Sh is transferred to the clamping mechanism 51 by the descent of the lifting pin. Next, an opening command is issued only to the first common opening / closing valve 517b, applying negative pressure to the suction pads 513 of the clamps 51b and 51d. As a result, the periphery of the two front corners of the lower surface of the half-size substrate Sh is suctioned and held (step S4B). Meanwhile, the first common opening / closing valve 517b remains closed. Thus, the clamping mechanism 51 suctions and holds the periphery of the two front corners of the lower surface of the half-size substrate Sh, and while holding the rear clamp pair (i.e., clamps 51a and 51c) in a non-suction state, it begins to move the half-size substrate Sh in the transport direction Dt (step S5). After that, the same operation as the second transport step in the first embodiment is performed. After the meniscus of the coating liquid is formed and the coating liquid is applied, the unloading process is performed.

[0082] As described above, according to the second embodiment, the coating apparatus 1 can handle substrates S of different sizes through a single clamping mechanism 51, and can achieve the same effect as the first embodiment.

[0083] Furthermore, the second embodiment has the following advantages. When the number of adsorption holding elements during the movement of the half-size substrate Sh is reduced from four to two, for example, in the first embodiment, it is possible to simply stop supplying negative pressure to the clamps 51a and 51c. However, the half-size substrate Sh is moved while the clamps 51a and 51c are positioned directly below it. Therefore, during this movement, the clamps 51a and 51c may come into contact with the lower surface of the half-size substrate Sh, generating particles, etc. In contrast, in the second embodiment, the clamps 51a and 51c, which do not perform adsorption holding, are moved together with the half-size substrate Sh while in a standby state, having moved away from the half-size substrate Sh in the (-X) direction, i.e., the reverse transport direction. Therefore, it is possible to reliably prevent the moving clamps 51a and 51c from contacting the half-size substrate Sh.

[0084] <Third Implementation Method>

[0085] In the first and second embodiments described above, two clamps are provided in each clamp unit 51L and 51R, but the number of clamps is not limited to this. For example, more than three clamps may be provided in each clamp unit 51L and 51R.

[0086] Figure 10 This diagram illustrates the positional relationship between the loading substrate and the clamps in the horizontal plane according to the third embodiment of the present invention. The major difference between this third embodiment and the second embodiment is that in each clamp unit 51L, 51R, the three clamps are arranged to move freely relative to each other along the travel guide 523. Furthermore, the other structures and operations are the same as those in the second embodiment. Therefore, the following description focuses on the differences, using the same reference numerals for identical structures and omitting structural descriptions.

[0087] In the third embodiment, the handling and coating process of the full-size substrate Sf is performed in the same manner as in the first and second embodiments (see reference). Figure 10 (see column (a)). However, with the addition of clamps 51e and 51f, the number of parts adsorbing and holding the lower peripheral edge of the full-size substrate Sf increased from four to six.

[0088] In addition, the handling and coating process of the half-size substrate Sh is performed in the same manner as in the second embodiment (see reference). Figure 10 (see column (b)). However, with the addition of clamps 51e and 51f, the number of parts adsorbing and holding the lower peripheral edge of the half-size substrate Sh increased from two to four.

[0089] Thus, in the third embodiment, regardless of the substrate size, the substrate S being transported can be lifted and transported in the transport direction, achieving the same effect as in the second embodiment. Furthermore, by adding clamps 51e and 51f, the adsorption and holding portion of the substrate S is increased, enabling the substrate S to be lifted and transported more stably than in the second embodiment.

[0090] <Fourth Implementation>

[0091] In the first to third embodiments described above, a so-called integrated moving type clamping mechanism 51 is used, in which a plurality of clamps constituting clamp unit 51L and a plurality of clamps constituting clamp unit 51R travel in the same position in the X direction. Here, a so-called unit-unit moving type clamping mechanism 51 can also be used, in which clamp units 51L and 51R move independently to transport the substrate S. Hereinafter, referring to… Figure 11 The fourth embodiment will be described.

[0092] Figure 11 This diagram illustrates the positional relationship between the loading substrate and the clamp in the horizontal plane according to the fourth embodiment of the present invention. The main difference between this fourth embodiment and the first embodiment is that the end of the travel guide 523 on the (-X) direction side extends into an adjacent area of ​​the input conveyor 100; the adsorption holding of clamp unit 51L and clamp unit 51R is switched according to the substrate size; and a common opening and closing valve is provided for each clamp unit 51L and 51R. Furthermore, the other structures and operations are the same as those of the first embodiment. Therefore, the following description focuses on the differences, using the same reference numerals for identical structures and omitting structural descriptions.

[0093] In the fourth embodiment, when the full-size substrate Sf is loaded, as shown in column (a) of the figure, on the clamp unit 51R side, the base 521 moves to a position directly below the loading position. Before or in parallel with this movement, clamps 51c and 51d are positioned at the (-X) side end and (+X) side end of the travel guide 535, respectively, so that the distance between the rear position of clamp 51c and the front position of clamp 51b is consistent with the X-direction length Lf of the full-size substrate Sf. On the other hand, on the clamp unit 51L side, the base 521 moves to the (-X) side end of the travel guide 523, so that the (-X) side end of the base 521 is located at a position separated from the full-size substrate Sf in the (-X) direction. Furthermore, by moving clamps 51a and 51b to the (-X) side end of the travel guide 535, clamps 51a and 51b are positioned in a standby position Psw, separated from the full-size substrate Sf in the (-X) direction. As a result, viewed from above, the front position Psf of the clamping mechanism 51, i.e., the front end position of clamp 51d, coincides with the front end position Pff of the full-size substrate S. Additionally, the rear position Psb of the clamping mechanism 51, i.e., the rear end position of clamp 51c, coincides with the rear end position Pfb of the full-size substrate Sf. Thus, the relationship between the loading position of the full-size substrate Sf and the holding position of the clamping unit 51R of the clamping mechanism 51 is adjusted. Furthermore, in this embodiment, the front end position Pff and the rear end position Pfb of the full-size substrate Sf correspond to an example of the "substrate loading position" of the present invention, and the front position Psf and the rear end position Psb of the clamping unit 51R correspond to an example of the substrate holding position.

[0094] By executing step S3A, the clamps 51c and 51d are positioned close to the two corners on the (-Y) side of the full-size substrate Sf in the vertical direction Z. Then, by lowering the lifting pin, the full-size substrate Sf is transferred to the clamping mechanism 51. Next, an opening command is issued to the on / off valve 517, which corresponds to the clamping unit 51R, applying negative pressure to the suction pads 513 of the clamps 51c and 51d (step S4A). As a result, the clamping unit 51R of the clamping mechanism 51 holds the periphery of the two corners on the (-Y) side of the lower surface of the full-size substrate Sf, and in this state, the full-size substrate Sf is moved in the transport direction Dt (an example of the "moving process" of the present invention). Furthermore, after performing the coating process in parallel with the substrate movement, an unloading process is performed.

[0095] On the other hand, when the half-size substrate Sh is loaded, as shown in column (b) of the figure, on the clamp unit 51L side, the base 521 moves to a position directly below the loading position. Before or in parallel with this movement, clamps 51a and 51b are positioned near the center position and (+X) side end of the travel guide 535, respectively, so that the distance between the rear position of clamp 51c and the front position of clamp 51b is consistent with the X-direction length Lf of the half-size substrate Sh. On the other hand, on the clamp unit 51R side, the base 521 moves to the (-X) side end of the travel guide 523, so that the (-X) side end of the base 521 is located at a position separated from the half-size substrate Sh in the (-X) direction. In addition, by moving clamps 51c and 51d to the (-X) side end of the travel guide 535, clamps 51c and 51d are positioned at a standby position Psw separated from the half-size substrate Sh in the (-X) direction. As a result, viewed from above, the front position Psf of the clamping mechanism 51, i.e., the front end position of the clamp 51b, coincides with the front end position Pff of the half-size substrate S. Furthermore, the rear position Psb of the clamping mechanism 51, i.e., the rear end position of the clamp 51a, coincides with the rear end position Phb of the half-size substrate Sh. Thus, the relationship between the loading position of the half-size substrate Sh and the holding position of the clamping unit 51L of the clamping mechanism 51 is adjusted. In addition, in this embodiment, the front end position Pff and the rear end position Pfb of the half-size substrate Sh correspond to an example of the "substrate loading position" of the present invention, and the front position Psf and the rear end position Psb of the clamping unit 51R correspond to an example of the substrate holding position.

[0096] By executing step S3B, the clamps 51a and 51b are positioned close to the two corners on the (+Y) side of the half-size substrate Sh in the vertical direction Z. Then, by lowering the lifting pin, the half-size substrate Sh is transferred to the clamping mechanism 51. Next, an opening command is issued to the on / off valve 517, which corresponds to the clamping unit 51L, applying negative pressure to the suction pads 513 of the clamps 51a and 51b (step S4B). As a result, the clamping unit 51L of the clamping mechanism 51 holds the periphery of the two corners on the (+Y) side of the lower surface of the half-size substrate Sh, and in this state, the half-size substrate Sh is moved in the transport direction Dt (an example of the "moving process" of the present invention). Furthermore, after the coating process is performed in parallel with the substrate movement, an unloading process is performed.

[0097] As described above, in the fourth embodiment, either the full-size substrate Sf or the half-size substrate Sh can be lifted and transported while the peripheral portions of two corners on the lower surface of the substrate S are held in place by the clamping mechanism 51. Therefore, the same effect as in the first embodiment can be obtained.

[0098] Furthermore, in the fourth embodiment, since a so-called unit-unit movement type clamping mechanism 51 is used to transport the substrate S by independently moving the clamping units 51L and 51R respectively, the following effects can be obtained. For example, when transporting the substrate S from the half-size substrate Sh ( Figure 11 (b) of the text refers to the full-size substrate Sf ( Figure 11 When switching from the standby position Psw to the rear position Psb and the front position Psf, respectively, the movement distance and time of the clamps 51a and 51c are significantly reduced. As a result, the time and energy required to switch from the half-size substrate Sh to the full-size substrate Sf can be saved. In addition, the movement distance and time of the clamps 51a and 51b when switching from the full-size substrate Sf to the half-size substrate Sh are also significantly reduced. As a result, the time and energy required to switch between the full-size substrate Sf and the half-size substrate Sh can be saved.

[0099] <Fifth Implementation>

[0100] In the first to fourth embodiments described above, the clamping mechanism 51 has two clamping units 51L and 51R, but it may also be composed of only one clamping unit.

[0101] Figure 12 This is a top view of the coating apparatus, a fifth embodiment of the substrate processing apparatus of the present invention, as viewed from vertical above. Figure 13 This diagram illustrates the positional relationship between the substrate and the clamp in the horizontal plane in the fifth embodiment. The major difference between this fifth embodiment and the first embodiment is that the clamping mechanism 51 consists only of clamping units 51L, which consistently holds and transports the two peripheral corners on the (+Y) side of the lower surface of the substrate S; opening and closing valves 517 are provided corresponding to the clamps 51a and 51b of the clamping unit 51L. Furthermore, the other structures and operations are the same as those in the first embodiment. Therefore, the following description focuses on the differences, using the same reference numerals for identical structures and omitting structural descriptions.

[0102] In the fifth embodiment, when the arithmetic unit 91 determines that the substrate S being moved in is a full-size substrate Sf (determined as a "full-size substrate" in step S2), as follows: Figure 13 As shown in column (a), except that only the clamping unit 51L is used, the coating process is performed in parallel while performing the same first transport step (steps S3A, S4A, S5-S7) as in the first embodiment. Conversely, when the arithmetic unit 91 determines that the substrate S being transported is a half-size substrate Sh (determined as a "half-size substrate" in step S2), as... Figure 13As shown in column (b), except that only the clamping unit 51L is used, the coating process is performed in parallel while performing the second transport process (steps S3B, S4B, S5 to S7) the same as in the first embodiment.

[0103] Thus, according to the fifth embodiment, the coating apparatus 1 can handle substrates S of different sizes through a single clamping mechanism 51, and can achieve the same effect as the first embodiment.

[0104] Furthermore, while the fifth embodiment uses the clamping unit 51L on the (+Y) side, it is obviously also possible to use only the clamping unit 51R on the (-Y) side. Additionally, the technical matter of using only one of the clamping units 51L and 51R, as described above, can also be applied to the second or third embodiment.

[0105] Furthermore, the present invention is not limited to the embodiments described above, and various modifications can be made in addition to the above without departing from its spirit. For example, in the above embodiments, a full-size substrate Sf is exemplified as a first substrate having a first length in a first horizontal direction (X direction) and a first side and a second side opposite to each other in a second horizontal direction (Y direction) orthogonal to the first horizontal direction, and a half-size substrate Sh is exemplified as a second substrate having a second length in a first horizontal direction shorter than the first length and a third side and a fourth side opposite to each other in a second direction, but the first substrate and the second substrate are not limited to these.

[0106] Furthermore, in the above embodiments, the present invention applies to a coating apparatus 1 that supplies coating liquid to the upper surface Sa of a substrate S, but the application scope of the present invention is not limited thereto. That is, it is applicable to all substrate processing techniques that perform a prescribed process by supplying processing liquid to a nozzle, thereby supplying processing liquid from the nozzle to the surface of the substrate while moving the substrate, which is levitated by receiving gas from a levitation stage, relative to the nozzle.

[0107] This invention is applicable to substrate handling techniques that hold a substrate in a floating state and maintain it in a horizontal position by blowing fluid onto the lower surface of the substrate and transporting the substrate along a predetermined transport direction, as well as all substrate processing techniques that use this substrate handling technique to supply processing liquid to the upper surface of the substrate being transported along the transport direction.

Claims

1. A substrate transport apparatus, wherein a substrate being transported above a floating platform on which gas is ejected upwards is held above the floating platform, and the substrate is transported along a first horizontal direction, characterized in that, The substrate handling device has: A first elongated guide member extends along the floating platform in the first horizontal direction on one side of a second horizontal direction orthogonal to the first horizontal direction. The first sliding member is disposed to move freely along the first elongated guide member in the first horizontal direction; A first short guide member is provided on the upper surface of the first sliding member along the first horizontal direction; The first holding portion has a plurality of first holding members capable of holding the substrate, and the plurality of first holding members are respectively disposed independently and freely movable along the first short guide member in the first horizontal direction; The first positioning part is capable of positioning a plurality of the first holding members at different positions relative to the first sliding member in the first horizontal direction; The first moving part is configured to allow the first sliding member, the first short guide member, the first holding part, and the first positioning part to move integrally along the first long guide member in the first horizontal direction; as well as The control unit controls the first positioning unit.

2. The substrate handling apparatus according to claim 1, wherein, The control unit controls the first positioning unit so that the positions of the plurality of first holding members in the first horizontal direction are different according to the length of the substrate in the first horizontal direction.

3. The substrate handling apparatus according to claim 2, wherein, The first retaining part has two first retaining members. The control unit controls the first positioning unit so that the interval between the front end position of the first holding member on the front side and the rear end position of the first holding member on the rear side in the first horizontal direction is consistent with the length of the substrate.

4. The substrate handling apparatus according to claim 2, wherein, The first retaining part has two first retaining members. When the substrate is a rectangular substrate having a first length in a first horizontal direction and first and second sides opposite to each other in a second horizontal direction, the control unit controls the first positioning unit to make the interval between the front end position of the first holding member on the front side and the rear end position of the first holding member on the rear side in the first horizontal direction consistent with the first length. When the substrate is a rectangular substrate having a second length shorter than the first length in the first horizontal direction and a third and fourth side opposite to each other in the second horizontal direction, the control unit controls the first positioning unit to make the front end position of the first holding member on the front side in the first horizontal direction consistent with the front end position of the substrate, and the first holding member on the rear side is located in a first standby position on the upstream side of the first horizontal direction relative to the substrate.

5. The substrate handling apparatus according to claim 4, wherein, The first standby position is located on the upstream side of the first horizontal direction, adjacent to the substrate.

6. The substrate handling apparatus according to any one of claims 1 to 5, wherein, The substrate transport device further comprises: A second elongated guide member is provided on the other side of the second horizontal direction, extending along the floating platform in the first horizontal direction; The second sliding member is disposed to move freely along the second elongated guide member in the first horizontal direction; A second short guide member is provided on the upper surface of the second sliding member, extending along the first horizontal direction; The second holding portion has a plurality of second holding members capable of holding the substrate, and the plurality of second holding members are respectively disposed independently and freely movable along the second short guide member in the first horizontal direction; The second positioning part is configured to position a plurality of the second holding members at different positions relative to the second sliding member in the first horizontal direction; as well as The second moving part is configured to allow the second sliding member, the second short guide member, the second holding part, and the second positioning part to move integrally along the second long guide member in the first horizontal direction. The control unit also controls the second positioning unit.

7. The substrate handling apparatus according to claim 6, wherein, The control unit controls the second positioning unit so that the positions of the plurality of second holding members in the first horizontal direction are different according to the length of the substrate in the first horizontal direction.

8. The substrate handling apparatus according to claim 7, wherein, The second retaining part has two second retaining members. The control unit controls the second positioning unit so that the interval between the front end position of the second holding member on the front side and the rear end position of the second holding member on the rear side in the first horizontal direction is consistent with the length of the substrate.

9. The substrate handling apparatus according to claim 7, wherein, The second retaining part has two second retaining members. When the substrate is a first substrate having a rectangular shape with a first length in a first horizontal direction and a first side and a second side opposite to each other in a second horizontal direction, the control unit controls the first positioning unit to make the interval between the front end position of the second holding member on the front side and the rear end position of the second holding member on the rear side in the first horizontal direction consistent with the first length. When the substrate is a rectangular substrate having a second length shorter than the first length in the first horizontal direction and third and fourth sides opposite to each other in the second horizontal direction, the control unit controls the first positioning unit to make the front end position of the second holding member on the front side in the first horizontal direction consistent with the front end position of the substrate, and the second holding member on the rear side is located in a second standby position on the upstream side of the first horizontal direction relative to the substrate.

10. The substrate handling apparatus according to claim 9, wherein, The second standby position is located on the upstream side of the first horizontal direction, adjacent to the substrate.

11. A substrate handling method, wherein a substrate being moved above a floating platform by means of the substrate handling device of claim 1 is used in a first horizontal direction above a floating platform, characterized in that, The substrate handling method has the following characteristics: The holding process involves moving the first sliding member, the first short guide member, the first holding part, and the first positioning part together to the loading position of the substrate, and after adjusting the relative positions of the plurality of first holding members relative to the first sliding member, holding the substrate with the first holding part. as well as In the moving process, while the substrate is held by the first holding member, the substrate, the first sliding member, the first short guide member, the first holding part, and the first positioning part are moved integrally along the first horizontal direction.

12. The substrate handling method according to claim 11, wherein, The substrate transport device further comprises: A second elongated guide member is provided on the other side of the second horizontal direction, extending along the floating platform in the first horizontal direction; The second sliding member is disposed to move freely along the second elongated guide member in the first horizontal direction; A second short guide member is provided on the upper surface of the second sliding member, extending along the first horizontal direction; The second holding portion has a plurality of second holding members capable of holding the substrate, and the plurality of second holding members are respectively disposed independently and freely movable along the second short guide member in the first horizontal direction; The second positioning part is configured to position a plurality of the second holding members at different positions relative to the second sliding member in the first horizontal direction; as well as The second moving part is configured to allow the second sliding member, the second short guide member, the second holding part, and the second positioning part to move integrally along the second long guide member in the first horizontal direction. The holding process includes moving the second sliding member, the second short guide member, the second holding portion, and the second positioning portion integrally to the loading position, and after adjusting the relative positions of the plurality of second holding members relative to the second sliding member, holding the substrate using the second holding portion. The moving process is a process in which the substrate, the first sliding member, the first short guide member, the second holding part, the second positioning part, the second sliding member, the second short guide member, the second holding part, and the second positioning part are moved integrally in the first horizontal direction while the substrate is held by the second holding member.

13. A substrate processing apparatus, characterized in that, The substrate processing apparatus includes: The substrate transport unit has the same structure as the substrate transport device according to claim 1, and transports the substrate along the first horizontal direction while holding the substrate that has been transported into the floating platform above the floating platform where gas is being ejected upwards. as well as The processing liquid supply mechanism supplies processing liquid to the substrate being transported along the first horizontal direction using the substrate transport section.

14. A substrate processing apparatus, characterized in that, The substrate processing apparatus includes: The substrate transport unit has the same structure as the substrate transport device according to claim 6, and transports the substrate along the first horizontal direction while holding the substrate that has been transported into the floating platform above the floating platform where gas is being ejected upwards. as well as The processing liquid supply mechanism supplies processing liquid to the substrate being transported along the first horizontal direction using the substrate transport section.

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