A method for improving the hot forming diffusion bonding capability using electric field energy
By applying pulsed current and optimizing electric field parameters in hot forming diffusion welding, the problem of unstable welding quality of multilayer boards and easily oxidized materials in conventional air environment was solved, achieving high-efficiency, low-cost, and high-quality welding results.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- BEIJING HANGXING TECH
- Filing Date
- 2026-05-08
- Publication Date
- 2026-07-10
AI Technical Summary
Existing thermoforming diffusion welding technology suffers from problems such as unstable quality, low yield, and poor repeatability in welding multilayer plate structures and easily oxidized materials. In particular, it is difficult to achieve high-quality connections in a normal air environment, and vacuum thermoforming equipment is expensive.
By applying pulsed current during the thermoforming diffusion welding process, an electric field is used to establish a thermo-pressure field environment, ensuring that the current passes perpendicularly through the diffusion surface. Combined with multi-path mold design and high-temperature insulating coating, the electric field and thermoforming diffusion welding are synchronized, optimizing the matching of current parameters and material properties.
It improves the diffusion welding quality and repeatability of multilayer boards, reduces equipment costs, enables high-quality multilayer board welding in non-vacuum environments, and enhances welding efficiency and system reliability.
Smart Images
Figure CN122353141A_ABST