Substrate clamps and substrate clamping methods
By setting air grooves and support parts on the pressure plate, the clamping problem of warped substrates is solved by using negative pressure and pressure adjustment components, so as to achieve flat and safe clamping of the substrate, adapt to substrates with different warp degrees and materials, and reduce the space occupied by the clamp.
CN122358296APending Publication Date: 2026-07-10ACM RES (SHANGHAI) INC
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- ACM RES (SHANGHAI) INC
- Filing Date
- 2025-01-10
- Publication Date
- 2026-07-10
AI Technical Summary
Technical Problem
Warped substrates are difficult to hold securely in electroplating equipment, leading to wear or breakage problems.
Method used
A pressure plate with air grooves and support is used to create negative pressure by evacuating air to flatten the substrate. The support supports the back of the substrate, and the pressure is adjusted according to the warpage and material information of the substrate by combining a pressure adjustment component.
Benefits of technology
It effectively flattens warped substrates, avoids wear or breakage, adapts to the clamping requirements of different types of substrates, and reduces the space occupied by the clamp in the vertical direction.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN122358296A_ABST
Abstract
This application provides a substrate clamp and a substrate clamping method. The substrate clamp, used to clamp a substrate, includes: a clamping plate configured to enclose a clamping space; a sealing member for forming a seal between the substrate and the clamping plate when the substrate is clamped; a pressure plate for pressing down on the back side of the substrate to make the substrate press against the sealing member; and a pressure plate lifting assembly for driving the pressure plate to move up and down. The pressure plate has an air groove, a support portion, and an outer periphery. The air groove and the support portion are located inside the outer periphery. The air groove is configured to connect to a vacuum device to create a negative pressure between the pressure plate and the substrate when the vacuum device evacuates the air groove, thereby flattening the substrate. The bottom of the support portion is flush with the bottom of the outer periphery and is used to contact and support the back side of the substrate. By creating a negative pressure between the pressure plate and the substrate to flatten a warped substrate, and by having the support portion and the outer periphery contact and support the substrate, reverse warping or breakage of the substrate can be avoided during the vacuuming process of the air groove.
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