Piezoelectric ceramic testing device

Abstract

This invention discloses a piezoelectric ceramic testing device, comprising a housing, a mounting plate for the piezoelectric ceramic to be tested, and encapsulated piezoelectric ceramic contact points on the surface of the mounting plate. The mounting plate also includes quick-connect terminals for the piezoelectric ceramic wafer. A fixing clamp is provided within the housing, and an adjustable clamp is positioned directly above the encapsulated piezoelectric ceramic contact points. The housing also houses a piezoelectric ceramic parameter acquisition and display system, which includes a display module and an acquisition module. The display module is connected to a display screen. This invention significantly reduces the testing time for piezoelectric ceramic samples, greatly improves efficiency, and meets the needs of rapid testing.

Description

Technical Field

[0001] This invention relates to the field of negative ion technology, and in particular to a piezoelectric ceramic testing device. Background Technology

[0002] Piezoelectric ceramic samples must be soldered onto a dedicated PCB board to complete the testing process, which inevitably increases the complexity of the testing process.

[0003] The thickness of the piezoelectric ceramic to be tested also affects the versatility of the test device to be designed. Summary of the Invention

[0004] The present invention aims to solve the above-mentioned technical problems and provide a piezoelectric ceramic testing device, which can greatly shorten the detection time, effectively improve the detection efficiency of piezoelectric ceramic samples, and meet the needs of rapid detection.

[0005] To solve the above-mentioned technical problems, embodiments of the present invention provide a piezoelectric ceramic testing device, which includes a housing body, wherein the housing body is provided with a piezoelectric ceramic mounting plate to be tested, the surface of the piezoelectric ceramic mounting plate to be tested is provided with encapsulated piezoelectric ceramic contact points, the piezoelectric ceramic mounting plate to be tested is provided with piezoelectric ceramic bare die quick-connect terminal, the housing body is provided with a fixing clamp, and the fixing clamp is provided with an adjustable clamp head located directly above the encapsulated piezoelectric ceramic contact points;

[0006] The outer casing is equipped with a piezoelectric ceramic parameter acquisition and display system, which includes a display module and an acquisition module. The display module is connected to a display screen.

[0007] In the piezoelectric ceramic testing device provided by this invention, the fixing clamp includes a fixing base plate. A fixing screw is provided between the fixing base plate and the outer casing. A buffer spring is sleeved on the portion of the fixing screw above the fixing base plate. One end of the buffer spring abuts against the upper surface of the fixing base plate, and the other end abuts against the lower surface of the screw head. A support portion is vertically provided on the fixing base plate, and a clamping portion is provided on the support portion. The front end of the clamping portion has an elongated hole, and a threaded adjusting rod is provided in the elongated hole. An adjusting nut is installed on the portion of the adjusting rod above and below the elongated hole. A frustum-shaped rubber clamp head is provided at the lower end of the adjusting rod, and a soft sponge pad is provided on the frustum-shaped rubber clamp head. The adjustable rubber clamp head, soft sponge pad, and buffer spring allow the device to adapt to piezoelectric ceramics of different thicknesses.

[0008] In the piezoelectric ceramic testing device provided by the present invention, the support part has a lower support part and an upper support part with a thickness less than the lower support part. The lower support part is provided with a concave arc-shaped part and an upper convex arc-shaped part symmetrically distributed on the concave arc-shaped part. A clamping part located on the upper support part is provided on the upper left side of an upper convex arc-shaped part away from the frustum-shaped rubber clamp head via a rotating shaft. A torsion spring structure is provided at the rotating shaft.

[0009] The side clamping plate of the clamping part has a lower arc-shaped protrusion at the pivot point, and an upper arc-shaped recess is provided near the handle end of the lower arc-shaped protrusion. The upper arc-shaped recess and the upper arc-shaped protrusion are offset from each other. Due to the offset distribution of the upper arc-shaped recess and the upper arc-shaped protrusion, it can ensure that when the handle is pressed up, the soft sponge pad at the clamping head releases the encapsulated piezoelectric ceramic. It can also ensure that after the operator slowly releases the handle, the torsion spring will press the encapsulated piezoelectric ceramic placed at the contact point of the encapsulated piezoelectric ceramic again. Even if the operator accidentally releases the handle and the torsion spring presses down forcefully, the small gap between the upper arc-shaped recess and the upper arc-shaped protrusion prevents the pressure head from pressing down too much and damaging the encapsulated piezoelectric ceramic.

[0010] Furthermore, the front end of the clamping part is a rectangular block, the free end of which is a semi-circular structure and the other end is a Y-shaped structure. The elongated holes are distributed along the length direction of the rectangular block, and the elongated holes are symmetrically provided with limiting grooves on opposite sidewalls along the length direction. The adjusting rod is provided with a detachable limiting horizontal rod that cooperates with the limiting groove.

[0011] Furthermore, the adjusting rod is equipped with a compression spring sleeved on the rod body at the upper and lower adjustment through holes, and the compression spring is held between the two adjusting nuts.

[0012] The acquisition module includes an acquisition module control chip U4. The acquisition module has a first terminal (connected to pin 1 of the piezoelectric ceramic transformer), a second terminal (connected to pin 3 of the piezoelectric ceramic transformer), and a third terminal (connected to pin 4 of the piezoelectric ceramic transformer) for connecting to the piezoelectric ceramic transformer to be tested.

[0013] Pin 2 of the acquisition module control chip U4 is connected to pin 3 of the crystal oscillator X1, pin 1 of the crystal oscillator X1 is connected to pin 3 of the acquisition module control chip U4, and a capacitor C19 with its other end grounded is connected to pin 3 of the crystal oscillator X1. Pins 2 and 4 of the crystal oscillator X1 are grounded.

[0014] Pin 4 of the acquisition module control chip U4 is an empty pin;

[0015] Pins 5 and 6 of the acquisition module control chip U4 are connected to a +3V power supply, and pins 5 and 6 of the acquisition module control chip U4 are connected to capacitors C21 and C22, with the other ends of capacitors C21 and C22 grounded.

[0016] Pin 7 of the acquisition module control chip U4 is grounded;

[0017] Pin 13 of the acquisition module control chip U4 is connected to MOSFET Q2. MOSFET Q2 is connected to a bidirectional transient voltage suppressor diode. The drain (D) of MOSFET Q2 is connected to inductor L1 and the first terminal (connected to pin 1 of the piezoelectric ceramic transformer). The source (S) of MOSFET Q2 is grounded. The other end of inductor L1 is connected to capacitor C8 and control chip U2. The other end of capacitor C8 is grounded. The first terminal is also connected to capacitor C9, with its other end grounded. The second terminal is grounded. The third terminal is connected to diodes D2 and D3. Diodes D2 and D3 are connected to capacitor C10. One end of capacitor C10 is grounded. Capacitor C10 and diode D3 are connected to resistor R13. Resistor R13 is connected to resistor R15, capacitor C13, and pin 20 of the acquisition module control chip U4. Resistor R15 is connected to a +3V power supply, and capacitor C13... The acquisition module control chip U4 has a grounded pin 20 connected to a diode D5 with the other end grounded. The control chip U2 has a grounded pin 3 connected to a capacitor C7. The control chip U2 has a grounded pin 2 connected to an inductor L2. The inductor L2 is connected to capacitors C6 and C5 and dual MOSFET Q3. Capacitors C6 and C5 and the control chip U2 have a grounded pin 1. The dual MOSFET Q3 has a grounded pin 1 connected to a resistor R11. The other end of the resistor R11 is connected to the dual MOSFET Q3 pin 2 and the acquisition module control chip U4 pin 17. The dual MOSFET Q3 pin 4 is connected to a resistor R12 and a capacitor C11. The dual MOSFET Q3 pin 4 is connected to the +VBAT power supply. The resistor R12 and capacitor C11 are connected to a diode D1. The dual MOSFET Q3 pin 5 is connected to a diode D1. The dual MOSFET Q3 pin 6 is connected to a diode D1 through a resistor R10.

[0018] Pin 16 of the acquisition module control chip U4 is connected to resistors R17 and R18. Resistor R17 is connected to the +VBAT power supply, and resistor R18 is connected in parallel with capacitor C18. Resistor R18 is grounded.

[0019] The present invention has the following beneficial effects: the present invention greatly shortens the detection time of piezoelectric ceramic samples and greatly improves the efficiency, thus meeting the needs of rapid detection. Attached Figure Description

[0020] Figure 1 The piezoelectric ceramic testing device in Example 1 is in three dimensions. Figure 1 .

[0021] Figure 2 The piezoelectric ceramic testing device in Example 1 is three-dimensional. Figure 2 .

[0022] Figure 3 This is a partial cross-sectional view of the buffer spring in Example 1.

[0023] Figure 4This is a perspective view of the outer casing in Example 1.

[0024] Figure 5 This is a partial enlarged view of the support portion in Example 1.

[0025] Figure 6 This is a schematic diagram of the piezoelectric ceramic parameter acquisition and display system in the piezoelectric ceramic testing device of Example 2.

[0026] Figure 7 This is a circuit diagram of the display module in Example 2.

[0027] Figure 8 This is the circuit diagram of the acquisition module in Example 2.

[0028] Figure 9 This is a circuit diagram of the LED status indicator light in the display module circuit of Example 2.

[0029] Figure 10 This is a power management circuit diagram in the display module of Example 2.

[0030] Figure 11 for Figure 10 A diagram of the voltage regulator circuit connected to the power management circuit.

[0031] Figure 12 for Figure 10 The circuit diagram of the decoupling capacitor for the 5V power supply connection in the power management circuit.

[0032] Figure 13 This is a circuit diagram of the communication activity indicator light connected to the display module in Example 2.

[0033] Figure 14 This is a partial enlarged view of Example 3. Detailed Implementation

[0034] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below with reference to specific embodiments.

[0035] Example 1: See Figures 1-2 As shown, this embodiment provides a piezoelectric ceramic testing device, which includes a housing body 1 and a display screen 2 disposed on the housing body. The housing body is provided with a piezoelectric ceramic mounting plate 3 to be tested. The surface of the piezoelectric ceramic mounting plate 3 to be tested is provided with encapsulated piezoelectric ceramic contact points 4. These encapsulated piezoelectric ceramic contact points 4 can be used for the contact connection requirements of encapsulated (encapsulated piezoelectric) ceramic transformers. The piezoelectric ceramic mounting plate 4 to be tested is provided with piezoelectric ceramic bare die quick-connect terminal 5. The piezoelectric ceramic bare die can insert the wire end into the quick-connect terminal. The housing body is provided with a fixing clamp 6. The fixing clamp is provided with an adjustable clamp 7 located directly above the encapsulated piezoelectric ceramic contact point.

[0036] The piezoelectric ceramic mounting plate 4 is equipped with quick-connect terminals 5 for bare piezoelectric ceramic sheets, which can facilitate the measurement of some shell-less piezoelectric ceramic transformers. Through simple quick-release cold pressing of the wire harness, the piezoelectric ceramic transformer can be quickly measured.

[0037] The housing is equipped with a piezoelectric ceramic parameter acquisition and display system, which includes a display module and an acquisition module. The display screen 2 connected to the display module can display data such as the current frequency, current boost ratio, and lock-in frequency at the highest boost ratio obtained from the test. Figure 2 The circuit board 8 of the acquisition module is shown in the figure. The piezoelectric ceramic parameter acquisition and display system includes a display module and an acquisition module. The display module is connected to a display screen 2. The acquisition module, etc., can adopt existing technologies.

[0038] See Figure 3-4As shown, considering the thickness detection requirements of different packaged piezoelectric ceramics, it is essential to be able to adapt to packaged piezoelectric ceramics of different thicknesses. The fixing clamp 6 of this invention includes a fixing base plate 6a. The outer shell body 1 is an integrally formed structure, which consists of a horizontal part 1-1 and a trapezoidal raised part 1-2. The inclined surface of the trapezoidal raised part is used to install screens and other structures. Considering weight reduction, the lower part of the horizontal part and the non-visible part of the trapezoidal raised part can adopt a hollow structure and be equipped with corresponding reinforcing ribs to meet structural strength. A recessed platform 1a for mounting the fixing base plate is provided on the outer shell body. A fixing screw 9 is provided between the fixing base plate and the outer shell body. The fixing screw passes through the recessed platform plate and extends into the hollow structure of the horizontal part. A buffer spring 10 is sleeved on the part of the fixing screw 9 above the fixing base plate. One end of the buffer spring abuts against the upper surface of the fixing base plate and the other end abuts against the lower surface of the bolt head. When the entire clamping structure is lifted by a thicker packaged piezoelectric ceramic due to the need to install a thicker sample, the buffer spring... The entire clamping structure can be used to clamp the sample. It should be noted that the clamping requirement in this embodiment is only to ensure that the sample maintains electrical contact with the detection point. It does not require a large clamping force, and the elasticity of the buffer spring is sufficient to meet the clamping structure's requirement for electrical contact between the sample and the detection point. The fixed base plate is vertically provided with a support part 6b, and the support part 6b is provided with a clamping part. The clamping part completes the clamping and releasing action of the sample. The front end of the clamping part has an elongated hole 6c. An adjusting rod 6d with a thread is provided in the elongated hole. Adjusting nuts 6e are installed on the adjusting rod above and below the elongated hole. These two adjusting nuts can move the adjusting rod down or up to move closer to or away from the piezoelectric ceramic mounting plate to be tested. The lower end of the adjusting rod is provided with a frustum-shaped rubber clamp head 6f, and the frustum-shaped rubber clamp head is provided with a soft sponge pad 6g. As can be seen from the above, the present invention, through the adjustable rubber clamp head + soft sponge pad and buffer spring, enables the device to adapt to encapsulated piezoelectric ceramics of different thicknesses.

[0039] It is worth mentioning that, see Figure 5The support portion 6b has a lower support portion 6b-1 and an upper support portion 6b-2 with a thickness less than the lower support portion. The lower support portion is provided with a concave arc-shaped portion 6b-1-1 and symmetrically distributed convex arc-shaped portions 6b-1-2 on the concave arc-shaped portion. A clamping portion located on the upper support portion is provided on the upper left side of the convex arc-shaped portion away from the head of the truncated cone-shaped rubber clamp via a rotating shaft 11. A torsion spring structure is provided at the rotating shaft, so that the raised fixing clamp can be reset to press and seal the piezoelectric ceramic on the mounting plate of the piezoelectric ceramic to be tested. The side clamping plate 12 of the clamping portion is provided with a lower arc-shaped protrusion 12-1 at the rotating shaft. The lower arc-shaped protrusion is provided with an upper arc-shaped recess 12-2 near the handle end. The upper arc-shaped recess is offset from the upper arc-shaped portion. Because the upper arc-shaped concave part and the upper convex arc-shaped part are misaligned, it can ensure that when the handle is pressed up, the soft sponge pad at the clamping head releases the encapsulated piezoelectric ceramic. It can also ensure that after the operator slowly releases the handle, the torsion spring presses the encapsulated piezoelectric ceramic placed at the contact point of the encapsulated piezoelectric ceramic again. Even if the operator accidentally releases the handle and the torsion spring presses down forcefully, the small gap between the upper arc-shaped concave part and the upper convex arc-shaped part can prevent the pressure head from pressing down too much and damaging the encapsulated piezoelectric ceramic.

[0040] The piezoelectric ceramic testing device can be used for rapid testing of piezoelectric ceramic samples (encapsulated, bare wafers), eliminating the cumbersome process of soldering piezoelectric ceramic samples onto a dedicated PCB board for testing. Bare piezoelectric ceramic wafers can have their wire ends inserted into quick-connect terminals (the piezoelectric ceramic terminals provided by the acquisition module, such as the first, second, and third terminals). Encapsulated piezoelectric ceramics can be placed on the corresponding contacts on the mounting plate and secured with clamps. The piezoelectric ceramic sample on the mounting plate is connected to the data conversion board. After analysis, relevant important parameters can be displayed in real time on the screen for easy reading.

[0041] Example 2: This example differs from Example 1 in that it provides corresponding circuits for the display module and the acquisition module. The following is a detailed explanation... Figure 7-13 Provide a detailed description.

[0042] See Figure 7The display module includes a third control chip U3 and a fourth control chip U4 (ATMEGA328P-MU). Pins 1, 2, 9-17, 23-28, and 30-32 of the fourth control chip U4 are connected to connectors J (including connectors J1 and J2). Pins 3 and 5 of the fourth control chip U4 are grounded. Pins 4 and 6 of the fourth control chip U4 are connected to a +5V power supply (pins 4 and 6 are connected to a capacitor C6 with its other end grounded). Pins 7 and 8 of the fourth control chip U4 are connected to an external 16MHz power supply. The external crystal oscillator circuit (quartz crystals XTAL1 and XTAL2, two load capacitors, and resistor R2) connects pin 18 of the fourth control chip U4 of the display module to inductor L2 and capacitor C10. Inductor L2 is connected to the +5V power supply, and the other end of capacitor C10 is grounded. Pin 20 of the fourth control chip U4 of the display module is grounded through capacitor C4. Pins 19 and 22 of the fourth control chip U4 of the display module are unused. Pin 21 of the fourth control chip U4 of the display module is grounded. Pin 29 of the fourth control chip U4 of the display module is connected to a 10kΩ pull-up resistor (resistor array RN1D) connected to +5V, and a fast recovery diode D2 is connected in parallel. Pin 29 of the fourth control chip U4 of the display module is connected to the reset button RESET and the ICSP interface. The ICSP interface is also connected to pins 16 and 17 of the fourth control chip U4 of the display module.

[0043] See also Figure 7The third control chip U3 of the display module has pins 1 and 2 connected to a 16MHz crystal Y1, dual 22pF load capacitors (capacitors C9 and C11), and a 1MΩ feedback resistor R1. Pin 3 of the third control chip U3 is grounded. Pin 4 of the third control chip U3 is connected to capacitor C7 and a +5V power supply, with the other end of capacitor C7 grounded. Pin 8 of the third control chip U3 is connected to pin 31 of the fourth control chip U4 of the display module through resistor array RN4A. Pin 9 of the third control chip U3 is connected to pin 30 of the fourth control chip U4 of the display module through resistor array RN4B. Pin 10 of the third control chip U3 is connected to diode RX YELLOW, which is connected to resistor array RN2B, which is connected to a +5V power supply. Pin 11 of the third control chip U3 is connected to diode TX YELLOW, which is connected to... YELLOW is connected to resistor array RN2C, which is connected to a +5V power supply. Pin 13 of the third control chip U3 of the display module is connected to resistor array RN2D (the other end of resistor array RN2D is grounded) and capacitor C5. Capacitor C5 is connected to a +5V power supply (capacitor C5 is connected to the RESET-EN jumper). Pins 15, 16, and 17 of the third control chip U3 of the display module are connected to the ICSP1 interface. Pins 18, 19, 20, and 21 of the third control chip U3 of the display module are connected to connector JP2. Pin 24 of the third control chip U3 of the display module is connected to the ICSP1 interface. Pin 27 of the third control chip U3 of the display module is connected to capacitor C8 (the other end is grounded). Pin 28 of the third control chip U3 of the display module is grounded. Pin 29 of the third control chip U3 of the display module is connected to resistor array RN3D, which is connected to a USB-B female connector. Pin 30 of the third control chip U3 of the display module is connected to resistor array RN3A, which is connected to a USB-B female connector. The female connector is used to connect pin 32 of the third control chip U3 of the display module to a +5V power supply.

[0044] See Figure 9 The LED status indicator circuit of the display module includes a green LED (GREEN) with one end grounded. This green LED is connected to resistor arrays RN4D and RN4C, which are connected to a +5V power supply.

[0045] Figure 10The diagram shows the power management circuit of the display module. The power management circuit of the display module includes an operational amplifier U5A, a second control chip, pin 3 of the operational amplifier U5A connected to resistors RN1A and RN1B, the other end of resistor RN1B grounded, resistor RN1A connected to the external input voltage interface VIN, pin 2 of the operational amplifier U5A connected to a +3V3 power supply, pin 1 of the operational amplifier U5A connected to a field-effect transistor T1, field-effect transistor T1 connected to a +5V power supply, and a second control chip U2. Pin 2 of the second control chip U2 is grounded, pin 5 of the second control chip U2 is connected to a +3V3 power supply, and pin 5 of the second control chip U2 is grounded through capacitor C3. Figure 11 This is a voltage regulator circuit connected to the power management circuit. The voltage regulator circuit includes a power management chip U1 (NCP1117ST50T3G). Pin 1 of the power management chip U1 is grounded. Pins 2 and 4 of the power management chip U1 are connected to the +5V power output interface. Capacitors PC2 and C2, with their other ends grounded, are connected to pins 2 and 4 of the power management chip U1. Pin 3 of the power management chip U1 is connected to diode D1 and capacitor PC1, with its other end grounded. Diode D1 is connected to power interface X1. (See also...) Figure 12 The decoupling capacitor circuit connected to the 5V power supply of the power management circuit includes capacitor C1, with one end of capacitor C1 connected to the +5V power supply and the other end grounded.

[0046] See Figure 8 The acquisition module includes an acquisition module control chip U4. The acquisition module has a first terminal (connected to pin 1 of the piezoelectric ceramic transformer), a second terminal (connected to pin 3 of the piezoelectric ceramic transformer), and a third terminal (connected to pin 4 of the piezoelectric ceramic transformer) for connecting to the piezoelectric ceramic transformer to be tested.

[0047] Pin 2 of the acquisition module control chip U4 is connected to pin 3 of crystal oscillator X1, and pin 1 of crystal oscillator X1 is connected to pin 3 of acquisition module control chip U4. A capacitor C19 with its other end grounded is connected to pin 3 of crystal oscillator X1. Pins 2 and 4 of crystal oscillator X1 are grounded. Pin 4 of acquisition module control chip U4 is an unused pin. Pins 5 and 6 of acquisition module control chip U4 are connected to a +3V power supply, and capacitors C21 and C22 are connected to pins 5 and 6 of acquisition module control chip U4. The other ends of capacitors C21 and C22 are grounded. Pin 7 of acquisition module control chip U4 is grounded.

[0048] Pin 13 of the acquisition module control chip U4 is connected to MOSFET Q2. MOSFET Q2 is connected to a bidirectional transient voltage suppressor diode. The drain (D) of MOSFET Q2 is connected to inductor L1 and the first terminal (connected to pin 1 of the piezoelectric ceramic transformer). The source (S) of MOSFET Q2 is grounded. The other end of inductor L1 is connected to capacitor C8 and control chip U2. The other end of capacitor C8 is grounded. The first terminal is also connected to capacitor C9, with its other end grounded. The second terminal is grounded. The third terminal is connected to diodes D2 and D3. Diodes D2 and D3 are connected to capacitor C10. One end of capacitor C10 is grounded. Capacitor C10 and diode D3 are connected to resistor R13. Resistor R13 is connected to resistor R15, capacitor C13, and pin 20 of the acquisition module control chip U4. Resistor R15 is connected to a +3V power supply, and capacitor C13... The acquisition module control chip U4 has a grounded pin 20 connected to a diode D5 with the other end grounded. The control chip U2 has a grounded pin 3 connected to a capacitor C7. The control chip U2 has a grounded pin 2 connected to an inductor L2. The inductor L2 is connected to capacitors C6 and C5 and dual MOSFET Q3. Capacitors C6 and C5 and the control chip U2 have a grounded pin 1. The dual MOSFET Q3 has a grounded pin 1 connected to a resistor R11. The other end of the resistor R11 is connected to the dual MOSFET Q3 pin 2 and the acquisition module control chip U4 pin 17. The dual MOSFET Q3 pin 4 is connected to a resistor R12 and a capacitor C11. The dual MOSFET Q3 pin 4 is connected to the +VBAT power supply. The resistor R12 and capacitor C11 are connected to a diode D1. The dual MOSFET Q3 pin 5 is connected to a diode D1. The dual MOSFET Q3 pin 6 is connected to a diode D1 through a resistor R10.

[0049] Pin 16 of the acquisition module control chip U4 is connected to resistors R17 and R18. Resistor R17 is connected to the +VBAT power supply, and resistor R18 is connected in parallel with capacitor C18. Resistor R18 is grounded.

[0050] See Figure 13 The fourth control chip U4 of the display module is connected to a communication activity indicator circuit at pin 17. This circuit includes an operational amplifier U5B. Pin 7 of the operational amplifier U5B is connected to a resistor RN2A, and the resistor RN2A is connected to a diode YELLOW.

[0051] The main functions of the acquisition module in the system structure of this invention are to acquire piezoelectric ceramic signals, calculate the optimal operating frequency, and calculate the boost ratio (achieved through hardware such as piezoelectric ceramic sensors, signal acquisition circuits, and main control units). The display module mentioned in this invention mainly receives and parses the data, displaying the optimal frequency and boost ratio on the LCD screen, while the acquisition module acquires relevant data from the piezoelectric ceramic transformer, processes it, and sends the data to the display module via a serial port.

[0052] Existing measurement methods for piezoelectric ceramic transformers cannot quickly measure and lock their boost ratio performance. This invention performs frequency sweeping on the piezoelectric ceramic and uploads the data to a host computer display screen in real time. The display screen calculates the period and converts it into frequency. The host computer, with its display screen, can lock the highest output voltage at the resonant frequency, convert it into a boost ratio, and lock the display. The entire host computer displays the current frequency, current boost ratio, the locked frequency at the highest boost ratio, and the measured highest boost ratio. The entire piezoelectric ceramic testing device includes a pressing fixture for convenient pressing and testing of the negative ion module, avoiding the need for welding.

[0053] Example 3: The difference between this example and Example 1 is that the clamping part is provided with a limit component. Specifically, see [link to example]. Figure 14 The front end of the clamping part is a rectangular block. The free end of the rectangular block is a semi-circular structure S1, and the other end is a Y-shaped structure S2. The elongated holes 6c are distributed along the length of the rectangular block. The elongated holes are symmetrically provided with limiting grooves on opposite sidewalls along the length direction. The adjusting rod 6d is provided with a detachable limiting horizontal rod 6h that cooperates with the limiting groove 6i. The part between the two adjusting nuts on the adjusting rod is provided with an up-and-down adjusting through hole that cooperates with the detachable limiting horizontal rod. The height of the up-and-down adjusting through hole is 3-8cm. This design allows the detachable limiting horizontal rod to be located in the limiting groove of the clamping part, so as to prevent the adjusting rod from accidentally coming out of the entire clamping part. It also allows the height stroke of the up-and-down adjusting through hole to meet the height adjustment requirements of the piezoelectric ceramic transformers to be tested with different thicknesses. The adjusting rod wall where the up-and-down adjusting through hole is located is also provided with threads. In addition to avoiding the problem of disengagement, this design also allows the adjusting rod to move along the length of the clamping part for rapid movement to meet the needs of high efficiency.

[0054] It is worth mentioning that, as an improvement, the adjusting rod is equipped with a compression spring fitted onto the rod body at the upper and lower adjustment through holes. This compression spring is held between the two adjusting nuts. After the horizontal limit rod is removed, the compression spring remains between the two adjusting nuts. This prevents the adjusting rod from suddenly dropping and damaging the piezoelectric ceramic transformer during the tightening of the nuts. When testing ceramic transformers of the same specifications in batches, if it is necessary to remove the pressed piezoelectric ceramic transformer, the operator can simply hold the truncated cone-shaped rubber clamp head 6f and push it upwards to remove the piezoelectric ceramic transformer. This improves efficiency and facilitates sample disassembly and assembly. At this time, the two adjusting nuts do not completely limit the height that the adjusting rod can be raised, because air is reserved for lifting. The need to keep the adjusting rod pressed down on the sample by relying on the compression spring brings higher testing efficiency to the entire device.

[0055] The description of publicly known technologies has been omitted from the entire text.

[0056] Those skilled in the art will understand that the above embodiments are specific examples of implementing the present invention, and in practical applications, various changes in form and detail may be made without departing from the spirit and scope of the present invention.

Claims

1. A piezoelectric ceramic testing device, comprising a housing, characterized in that, The housing body is provided with a piezoelectric ceramic mounting plate to be tested. The surface of the piezoelectric ceramic mounting plate to be tested is provided with encapsulated piezoelectric ceramic contact points. The piezoelectric ceramic mounting plate to be tested is provided with quick-connect terminals for bare piezoelectric ceramic wafers. The housing body is provided with a fixing clamp. The fixing clamp is provided with an adjustable clamp head located directly above the encapsulated piezoelectric ceramic contact points. The outer casing is equipped with a piezoelectric ceramic parameter acquisition and display system, which includes a display module and an acquisition module. The display module is connected to a display screen.

2. The piezoelectric ceramic testing device according to claim 1, characterized in that, The fixing clamp includes a fixing base plate, and a fixing screw is provided between the fixing base plate and the outer casing. A buffer spring is sleeved on the part of the fixing screw above the fixing base plate. One end of the buffer spring abuts against the upper surface of the fixing base plate, and the other end abuts against the lower surface of the bolt head. The fixing base plate is vertically provided with a support part, and the support part is provided with a clamping part. The front end of the clamping part has an elongated hole, and a threaded adjusting rod is provided in the elongated hole. An adjusting nut is installed on the part of the adjusting rod above and below the elongated hole. The lower end of the adjusting rod is provided with a frustum-shaped rubber clamp head, and the frustum-shaped rubber clamp head is provided with a soft sponge pad.

3. The piezoelectric ceramic testing device according to claim 2, characterized in that, The support portion has a lower support portion and an upper support portion with a thickness less than the lower support portion. The lower support portion is provided with a concave arc-shaped portion and an convex arc-shaped portion symmetrically distributed on the concave arc-shaped portion. A clamping portion located on the upper support portion is provided on the upper left side of an convex arc-shaped portion away from the conical rubber clamp head via a rotating shaft. A torsion spring structure is provided at the rotating shaft. The side clamping plate of the clamping part is provided with a lower arc-shaped protrusion at the pivot, and an upper arc-shaped recess is provided near the handle end of the lower arc-shaped protrusion. The upper arc-shaped recess and the upper arc-shaped protrusion are misaligned.

4. The piezoelectric ceramic testing device according to claim 2, characterized in that, The front end of the clamping part is a rectangular block. The free end of the rectangular block is semi-circular and the other end is Y-shaped. The elongated holes are distributed along the length of the rectangular block. Limiting grooves are symmetrically arranged on opposite sidewalls along the length of the elongated holes. The adjusting rod is provided with a detachable limiting horizontal rod that cooperates with the limiting groove. The adjusting rod is provided with an upper and lower adjustment through hole located between two adjusting nuts. The height of the upper and lower adjustment through hole is 3-8cm.

5. The piezoelectric ceramic testing device according to claim 1, characterized in that, The acquisition module includes an acquisition module control chip U4, and the acquisition module has a first terminal, a second terminal, and a third terminal for connecting to the piezoelectric ceramic transformer to be tested. Pin 2 of the acquisition module control chip U4 is connected to pin 3 of the crystal oscillator X1, pin 1 of the crystal oscillator X1 is connected to pin 3 of the acquisition module control chip U4, and a capacitor C19 with its other end grounded is connected to pin 3 of the crystal oscillator X1. Pins 2 and 4 of the crystal oscillator X1 are grounded. Pin 4 of the acquisition module control chip U4 is an empty pin; Pins 5 and 6 of the acquisition module control chip U4 are connected to a +3V power supply, and pins 5 and 6 of the acquisition module control chip U4 are connected to capacitors C21 and C22, with the other ends of capacitors C21 and C22 grounded. Pin 7 of the acquisition module control chip U4 is grounded; Pin 13 of the acquisition module control chip U4 is connected to MOSFET Q2. MOSFET Q2 is connected to a bidirectional transient voltage suppressor diode. The drain (D) of MOSFET Q2 is connected to inductor L1 and the first terminal (connected to pin 1 of the piezoelectric ceramic transformer). The source (S) of MOSFET Q2 is grounded. The other end of inductor L1 is connected to capacitor C8 and control chip U2. The other end of capacitor C8 is grounded. The first terminal is also connected to capacitor C9, with its other end grounded. The second terminal is grounded. The third terminal is connected to diodes D2 and D3. Diodes D2 and D3 are connected to capacitor C10. One end of capacitor C10 is grounded. Capacitor C10 and diode D3 are connected to resistor R13. Resistor R13 is connected to resistor R15, capacitor C13, and pin 20 of the acquisition module control chip U4. Resistor R15 is connected to a +3V power supply, and capacitor C13... The acquisition module control chip U4 has a grounded pin 20 connected to a diode D5 with the other end grounded. The control chip U2 has a grounded pin 3 connected to a capacitor C7. The control chip U2 has a grounded pin 2 connected to an inductor L2. The inductor L2 is connected to capacitors C6 and C5 and dual MOSFET Q3. Capacitors C6 and C5 and the control chip U2 have a grounded pin 1. The dual MOSFET Q3 has a grounded pin 1 connected to a resistor R11. The other end of the resistor R11 is connected to the dual MOSFET Q3 pin 2 and the acquisition module control chip U4 pin 17. The dual MOSFET Q3 pin 4 is connected to a resistor R12 and a capacitor C11. The dual MOSFET Q3 pin 4 is connected to the +VBAT power supply. The resistor R12 and capacitor C11 are connected to a diode D1. The dual MOSFET Q3 pin 5 is connected to a diode D1. The dual MOSFET Q3 pin 6 is connected to a diode D1 through a resistor R10. Pin 16 of the acquisition module control chip U4 is connected to resistors R17 and R18. Resistor R17 is connected to the +VBAT power supply, and resistor R18 is connected in parallel with capacitor C18. Resistor R18 is grounded.

6. The piezoelectric ceramic testing device according to claim 4, characterized in that, The adjusting rod is equipped with a compression spring that is sleeved on the rod body at the upper and lower adjustment through holes, and the compression spring is held between the two adjusting nuts.

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