Anti-loosening chip resistor

Abstract

The application discloses a kind of anti-loosening chip resistors, relating to chip resistor technical field, including circuit board and the multiple resistance bodies of installation on circuit board, resistance body includes ceramic matrix and the electrode of being arranged in the both sides of ceramic matrix, the resistance body is provided with heat dissipation mechanism, heat dissipation mechanism includes heat dissipation fin and the lower heat-conducting plate of being fixed in the bottom of ceramic matrix, the bottom of electrode and circuit board are fixedly provided with pole piece, for lifting resistance body and accelerating air flow;The application is designed by heat dissipation mechanism, resistance body is lifted by pole piece, air flow is accelerated, heat dissipation effect is improved, a plurality of upper heat-conducting plates are connected by heat-conducting frame, when part resistance body works while other does not work, the heat of working resistance body can be transferred to the heat dissipation fin corresponding to non-working resistance body, share heat dissipation is realized, avoid heat dissipation fin idle, effectively reduce working resistance body temperature and improve overall heat dissipation efficiency.

Description

Technical Field

[0001] This invention belongs to the field of surface mount resistor technology, specifically a surface mount resistor designed to prevent loosening. Background Technology

[0002] Surface mount resistors, also known as chip resistors, are a type of metal-glass enamel resistor. They offer advantages such as small size, light weight, high mounting density, strong shock resistance, strong anti-interference capability, and good high-frequency characteristics. They can significantly save circuit space and costs, allowing for more refined electronic device designs. Currently, surface mount resistors are widely used in consumer electronics, communication equipment, industrial control, automotive electronics, medical equipment, and other fields.

[0003] To address the heat dissipation problem of surface mount resistors during operation, existing technologies mainly employ natural convection cooling or forced air cooling. Natural convection cooling utilizes the temperature difference between the surface mount resistor surface and the surrounding air, allowing heat to be carried away by natural airflow. Forced air cooling uses fans or other devices to generate forced airflow, accelerating heat dissipation from the resistor surface. However, both of these heat dissipation methods share a common limitation: the gap between the bottom of the surface mount resistor and the circuit board is extremely small, severely restricting airflow. This makes it difficult to effectively dissipate the heat generated at the bottom of the resistor, leading to localized heat accumulation. Even with forced air cooling, it is difficult to improve the heat dissipation conditions at the bottom of the resistor. This heat accumulation at the bottom can accelerate the aging of the resistor material during long-term high-temperature operation, reducing the resistor's lifespan and reliability. Therefore, we propose a surface mount resistor designed to prevent loosening. Summary of the Invention

[0004] The purpose of this invention is to provide a surface mount resistor that prevents loosening, so as to solve the technical problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a surface mount resistor designed to prevent loosening, comprising a circuit board and a plurality of resistor bodies mounted on the circuit board. Each resistor body includes a ceramic substrate and electrodes disposed on both sides of the ceramic substrate. A heat dissipation mechanism is provided on each resistor body, the heat dissipation mechanism comprising: Heat dissipation fins and a lower heat-conducting plate fixed to the bottom of the ceramic substrate; an electrode plate is fixed between the bottom of the electrode and the circuit board to lift the resistor body and accelerate airflow. Two gravity-type thermal diodes are fixedly installed on the top of the lower heat conduction plate for unidirectional heat conduction to the heat dissipation fins; An upper heat-conducting plate is fixedly installed between the top of the gravity-type thermal diode and the heat dissipation fins. A heat-conducting frame is fixedly installed between multiple upper heat-conducting plates to share heat dissipation for the resistor body.

[0006] Preferably, a column is fixedly provided between the bottom of the upper heat-conducting plate and the circuit board to support and fix the upper heat-conducting plate.

[0007] Preferably, the heat dissipation fins are provided with a cleaning component, which includes a cleaning brush disposed above one side of the heat dissipation fins. The cleaning brush is used to clean the dust adhering to the surface. A second I-shaped rod is provided above the cleaning brush, and a second slip ring is slidably mounted on the second I-shaped rod.

[0008] Preferably, a first I-shaped rod is provided above the cleaning brush, and a first slip ring is slidably provided on the outside of the first I-shaped rod.

[0009] Preferably, a nickel-titanium shape memory alloy spring is sleeved on the outside of the second I-shaped rod.

[0010] Preferably, an L-shaped frame is fixedly installed on the column to drive the cleaning brush to reciprocate; A fixing plate is fixedly installed at the end of the L-shaped frame.

[0011] Preferably, the heat dissipation fins are provided with a collection component, which includes a collection box fixed to the bottom of both sides of the heat dissipation fins. The collection box has a negative pressure groove inside, which is used to collect dust during the cleaning brushing process under negative pressure.

[0012] Preferably, a connecting pipe is fixedly installed inside the column, with both ends of the connecting pipe extending into the interior of the collection box.

[0013] Preferably, the column has a hollow cavity inside, and a negative pressure pipe is fixedly installed between the two columns, with an interface provided on the negative pressure pipe.

[0014] Preferably, a resistive film is provided on the top of the ceramic substrate, and a protective layer is provided on the top of the resistive film.

[0015] Compared with the prior art, the beneficial effects of the present invention are: (1) The present invention uses a heat dissipation mechanism to lift the resistor body through the electrode plate, so that a gap is formed between the bottom of the resistor body and the circuit board, which accelerates the air flow and improves the heat dissipation effect. At the same time, the lower heat-conducting plate absorbs the heat of the ceramic substrate and conducts it to the heat dissipation fins in one direction through the gravity thermal diode for heat dissipation. The unidirectional heat conduction characteristic of the gravity thermal diode is used to prevent heat from flowing back to the non-working resistor body and avoid thermal interference. Multiple upper heat-conducting plates are connected by a heat-conducting frame. When some resistor bodies are working and others are not working, the heat of the working resistor body can be transferred to the heat dissipation fins corresponding to the non-working resistor body to achieve shared heat dissipation, avoid the heat dissipation fins being idle, effectively reduce the temperature of the working resistor body and improve the overall heat dissipation efficiency.

[0016] (2) The present invention uses a cleaning component designed to cause the nickel-titanium memory alloy spring to deform and shrink after being heated to the phase change temperature, which drives the cleaning brush to move away from the fixed plate to clean the surface of the heat sink fins. When the dust is removed, the temperature drops and the nickel-titanium memory alloy spring returns to its original shape, driving the cleaning brush to reset. This achieves automatic cleaning with temperature self-feedback, without the need for external energy or sensors, and further improves the heat dissipation effect of the heat sink fins.

[0017] (3) The present invention uses a designed collection component, through the collection box and the negative pressure groove inside it, to generate suction force when cleaning the dust by brushing, to immediately draw the swept dust into the collection box and then discharge it, preventing the dust from falling back and adhering to the heat dissipation fins, affecting heat dissipation or polluting the surrounding environment. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 For the present invention Figure 1 Enlarged structural diagram of section A in the middle; Figure 3 This is a bottom view of the heat conduction frame structure of the present invention; Figure 4 This is a bottom view of the upper heat-conducting plate and heat dissipation fins of the present invention; Figure 5 This is a schematic diagram of the heat sink fin structure of the present invention; Figure 6 This is a schematic diagram of the cleaning component structure of the present invention; In the diagram: 100, circuit board; 101, resistor body; 102, electrode; 103, ceramic substrate; 200, electrode plate; 201, heat-conducting frame; 202, heat dissipation fins; 203, column; 204, lower heat-conducting plate; 205, gravity-type thermal diode; 206, upper heat-conducting plate; 300, cleaning brush; 301, L-shaped frame; 302, connecting pipe; 303, first I-shaped rod; 304, second I-shaped rod; 305, nickel-titanium memory alloy spring; 306, fixing plate; 400, collection box; 401, negative pressure pipe. Detailed Implementation

[0019] The technical solution of the present invention will be clearly and completely described below with reference to the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] Example 1 Please see Figures 1-6The present invention provides a technical solution: a surface mount resistor with anti-loosening feature, comprising a circuit board 100 and a plurality of resistor bodies 101 mounted on the circuit board 100. Each resistor body 101 includes a ceramic substrate 103 and electrodes 102 disposed on both sides of the ceramic substrate 103. A heat dissipation mechanism is provided on each resistor body 101, the heat dissipation mechanism including: The heat dissipation fins 202 and the lower heat-conducting plate 204 fixed to the bottom of the ceramic substrate 103 (the lower heat-conducting plate 204, the upper heat-conducting plate 206, and the heat-conducting frame 201 are all made of copper, which has good thermal conductivity) absorb the heat generated by the ceramic substrate 103 and conduct the heat to the two gravity-type thermal diodes 205 fixedly installed on its top. An electrode 200 is fixedly installed between the bottom of the electrode 102 and the circuit board 100, lifting the resistor body 101 and causing the resistor to... A suspended gap is formed between the bottom of the resistor body 101 and the circuit board 100, allowing air to circulate freely, accelerating the heat dissipation from the bottom of the resistor body 101 and improving heat dissipation conditions. The ceramic substrate 103 and the electrode 200, as well as the electrode 200 and the circuit board 100, are fixedly connected by soldering. Soldering increases the firmness of the connection between the ceramic substrate 103 and the electrode 200, and between the electrode 200 and the circuit board 100, preventing them from falling off and lifting the resistor body 101 to accelerate airflow. Two gravity-type thermal diodes 205 are fixedly installed on the top of the lower heat-conducting plate 204 for unidirectional heat conduction to the heat dissipation fins 202. The gravity-type thermal diodes 205 utilize gravity to achieve unidirectional heat conduction, that is, heat can only be conducted upward from the lower heat-conducting plate 204 to the upper heat-conducting plate 206, and cannot be conducted in the reverse direction, thereby preventing heat from flowing back into the resistor body 101. An upper heat-conducting plate 206 is fixedly disposed between the top of the gravity-type thermal diode 205 and the heat dissipation fins 202. Heat is transferred to the heat dissipation fins 202 through the upper heat-conducting plate 206. The heat dissipation fins 202 dissipate heat into the surrounding air by increasing the heat dissipation area. A heat-conducting frame 201 is fixedly disposed between multiple upper heat-conducting plates 206 for sharing heat dissipation of the resistor body 101. The heat-conducting frame 201 connects the upper heat-conducting plates 206 corresponding to multiple resistor bodies 101 together. When some resistor bodies 101 are working and generating heat while other resistor bodies 101 are not working [in electronic circuits, multiple resistor bodies 101 often correspond to different functional modules or working circuits, and these functional modules are started in a time-sharing manner based on the working state of the device, timing control, or user instructions, and will not run simultaneously. Therefore, the heating periods of each resistor body 101 are staggered], the heat generated by the working resistor body 101 can be transferred through the heat-conducting frame 201 to the corresponding heat dissipation fins 202 in the non-working resistor body 101, so that the heat dissipation fins 202 on the non-working resistor body 101 also perform heat dissipation work, realizing shared heat dissipation, avoiding the idle heat dissipation fins 202 on the non-working resistor body 101, thereby effectively reducing the temperature of the working resistor body 101 and improving the overall heat dissipation efficiency; A column 203 is fixedly installed between the bottom of the upper heat-conducting plate 206 and the circuit board 100 to support and fix the upper heat-conducting plate 206.

[0021] Example 2 Please refer to Example 1. Figures 1-6 A cleaning assembly is provided on the heat sink 202. The cleaning assembly includes a cleaning brush 300 disposed above one side of the heat sink 202. The cleaning brush 300 is used to clean the dust attached to the surface of the heat sink 202. When the cleaning brush 300 is driven to move, the second slip ring slides along the second I-shaped rod 304 to guide the cleaning brush 300 to move along a predetermined trajectory, ensuring that the cleaning brush 300 can smoothly and accurately sweep across the surface of the heat sink 202, remove the accumulated dust, and restore the heat dissipation efficiency of the heat sink 202. A second I-shaped rod 304 is provided above the cleaning brush 300, and a second slip ring is slidably provided on the second I-shaped rod 304. The cleaning brush 300 is fixed to the bottom of the second slip ring. A first I-shaped rod 303 is also provided above the cleaning brush 300. A first slip ring is slidably provided on the outside of the first I-shaped rod 303. The first slip ring is fixedly connected to the cleaning brush 300. The cooperation between the first I-shaped rod 303 and the first slip ring provides additional guidance and support for the cleaning brush 300, so that the cleaning brush 300 remains stable during movement, avoiding uneven cleaning or jamming due to shaking, thereby improving the cleaning effect and movement stability. A nickel-titanium shape memory alloy spring 305 is sleeved on the outside of the second I-shaped rod 304. One end of the nickel-titanium shape memory alloy spring 305 is fixedly connected to the first slip ring, and the other end is fixedly connected to the second I-shaped rod 304. The nickel-titanium shape memory alloy spring 305 has shape memory characteristics. When the heat dissipation efficiency of the heat sink 202 decreases and the temperature rises due to dust accumulation, the nickel-titanium shape memory alloy spring 305 deforms and contracts after reaching its phase transition temperature (it can only move along the second I-shaped rod 304 after being limited by the second I-shaped rod 304). The second I-shaped rod 304 moves along its length, driving the first slip ring to move along the first I-shaped rod 303, which in turn drives the cleaning brush 300 to move away from the fixed plate 306 to clean the heat dissipation fins 202. After the dust is removed, the heat dissipation fins 202 continue to dissipate heat. Subsequently, the temperature of the heat dissipation fins 202 drops, and the nickel-titanium memory alloy spring 305 returns to its original state, driving the cleaning brush 300 to move closer to the fixed plate 306 to reset. This structure realizes automatic cleaning with temperature self-feedback, without the need for external energy or sensors. An L-shaped frame 301 is fixedly installed on the column 203 for driving the cleaning brush 300 to reciprocate. A fixing plate 306 is fixedly installed at the end of the L-shaped frame 301, and one end of the second I-shaped rod 304 and the first I-shaped rod 303 are both fixed on the fixing plate 306.

[0022] Example 3 Please refer to Example 2. Figures 1-3 , Figure 5 and Figure 6 The heat dissipation fins 202 are provided with a collection component, which includes a collection box 400 fixed to the bottom of both sides of the heat dissipation fins 202. The collection box 400 has a negative pressure groove inside, which is used to collect the dust swept by the cleaning brush 300 under negative pressure. When the cleaning brush 300 sweeps the dust on the surface of the heat dissipation fins 202, the negative pressure groove inside the collection box 400 generates suction, which sucks the swept dust into the collection box 400, preventing the dust from falling back and adhering to the heat dissipation fins 202 or polluting the surrounding environment, thus realizing the centralized collection and treatment of dust and maintaining a long-lasting cleaning effect. A connecting pipe 302 is fixedly installed inside the column 203. Both ends of the connecting pipe 302 extend into the inside of the collection box 400. The connecting pipe 302 connects the two collection boxes 400, so that negative pressure can be transmitted between the two collection boxes 400, ensuring that the negative pressure in the multiple collection boxes 400 is balanced, and improving the coverage and efficiency of dust collection. The inside of the column 203 has a hollow cavity. A negative pressure pipe 401 is fixedly installed between the two columns 203. An interface is provided on the negative pressure pipe 401. An external negative pressure source is connected to the negative pressure pipe 401 through the interface. The negative pressure is transmitted to the collection box 400 through the hollow cavity of the column 203 and the connecting pipe 302, forming a complete negative pressure circuit.

[0023] In this embodiment, a resistive film is provided on the top of the ceramic substrate 103, and a protective plate is provided on the top of the resistive film.

[0024] Working principle and usage process of this invention: When in use, the electrode 200 raises the resistor body 101, creating a suspended gap between the bottom of the resistor body 101 and the circuit board 100. Air can circulate freely in this gap, accelerating the heat dissipation from the bottom of the resistor body 101 and improving heat dissipation conditions. Furthermore, the lower heat-conducting plate 204 absorbs the heat generated by the ceramic substrate 103 during operation. The heat is conducted from the lower heat-conducting plate 204 to the evaporation end (lower end) of the gravity-type thermal diode 205. The gravity-type thermal diode 205 uses gravity to conduct the heat unidirectionally to its condensation end (upper end), preventing heat from flowing back into the resistor body 101. The heat from the gravity-type thermal diode 205 is transferred to the upper heat-conducting plate 206, and then through the upper heat-conducting plate 206 to the heat dissipation fins 202. The heat dissipation fins 202 dissipate the heat into the surrounding air to achieve heat dissipation. When some resistor bodies 101 are working and generating heat while other resistor bodies 101 are not working, the heat generated by the working resistor bodies 101 is transferred through the heat conduction frame 201 to the heat dissipation fins 202 corresponding to the non-working resistor bodies 101 (transferred through the heat conduction frame 201 to the upper heat conduction plate 206 corresponding to the non-working resistor body 101, and then to the corresponding heat dissipation fins 202), so that the heat dissipation fins 202 corresponding to the non-working resistor bodies 101 also dissipate heat, thereby achieving shared heat dissipation; When dust adheres to the surface of the heat dissipation fins 202 during use, the heat generated by the resistor body 101 during operation is transferred to the corresponding heat dissipation fins 202. Because the heat dissipation fins 202 are covered by dust, the heat is difficult to dissipate into the surrounding air. At this time, the temperature of the heat dissipation fins 202 begins to rise, and the heat dissipation efficiency decreases. When the nickel-titanium memory alloy spring 305 is heated to its phase transition temperature, it deforms and contracts, driving the cleaning brush 300 to move away from the surface of the fixed plate 306 to clean the dust on the surface of the heat dissipation fins 202. When the dust is removed, the temperature of the heat dissipation fins 202 drops, the nickel-titanium memory alloy spring 305 returns to its original shape, and the cleaning brush 300 moves closer to the fixed plate 306 to reset, cleaning the dust on the surface of the heat dissipation fins 202 again. When it moves to the original position, it stops moving and waits for the temperature to rise again to start moving again, realizing cyclical automatic cleaning. When the cleaning brush 300 moves back and forth to sweep away dust, the external negative pressure source is turned on, which creates negative pressure in the long negative pressure groove inside the collection box 400. The cleaning brush 300 sucks up some of the dust that is scattered during the sweeping process. At the same time, the dust is swept into the collection box 400 by the sweeping of the cleaning brush 300 and sucked in by the long negative pressure groove. This avoids incomplete cleaning due to dust not being removed, which would reduce the cleaning effect and improve the heat dissipation efficiency of the heat dissipation fins 202.

[0025] The above embodiments are only used to illustrate the technical methods of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical methods of the present invention without departing from the spirit and scope of the technical methods of the present invention.

Claims

1. A surface mount resistor designed to prevent loosening, comprising a circuit board and a plurality of resistor bodies mounted on the circuit board, each resistor body comprising a ceramic substrate and electrodes disposed on both sides of the ceramic substrate, wherein the resistor body is provided with a heat dissipation mechanism, characterized in that, The heat dissipation mechanism includes: Heat dissipation fins and a lower heat-conducting plate fixed to the bottom of the ceramic substrate; an electrode plate is fixed between the bottom of the electrode and the circuit board to lift the resistor body and accelerate airflow. Two gravity-type thermal diodes are fixedly installed on the top of the lower heat conduction plate for unidirectional heat conduction to the heat dissipation fins; An upper heat-conducting plate is fixedly installed between the top of the gravity-type thermal diode and the heat dissipation fins. A heat-conducting frame is fixedly installed between multiple upper heat-conducting plates to share heat dissipation for the resistor body.

2. The anti-loosening chip resistor according to claim 1, characterized in that, A column is fixedly installed between the bottom of the upper heat-conducting plate and the circuit board to support and fix the upper heat-conducting plate.

3. The anti-loosening chip resistor according to claim 2, characterized in that, The heat dissipation fins are provided with a cleaning component, which includes a cleaning brush disposed above one side of the heat dissipation fins. The cleaning brush is used to clean the dust adhering to the surface. A second I-shaped rod is provided above the cleaning brush, and a second slip ring is slidably mounted on the second I-shaped rod.

4. The anti-loosening chip resistor according to claim 3, characterized in that, A first I-shaped rod is also provided above the cleaning brush, and a first slip ring is slidably provided on the outside of the first I-shaped rod.

5. The anti-loosening chip resistor according to claim 4, characterized in that, The second I-shaped rod is fitted with a nickel-titanium shape memory alloy spring.

6. The anti-loosening chip resistor according to claim 5, characterized in that, An L-shaped frame is fixedly installed on the column to drive the cleaning brush to move back and forth. A fixing plate is fixedly installed at the end of the L-shaped frame.

7. The anti-loosening chip resistor according to claim 2, characterized in that, The heat dissipation fins are provided with a collection component, which includes a collection box fixed to the bottom of both sides of the heat dissipation fins. The collection box has a negative pressure groove inside, which is used to collect dust during the cleaning brushing process under negative pressure.

8. The anti-loosening chip resistor according to claim 7, characterized in that, A connecting pipe is fixedly installed inside the column, with both ends of the connecting pipe extending into the inside of the collection box.

9. A surface mount resistor for preventing loosening according to claim 8, characterized in that, The column has a hollow cavity inside, and a negative pressure pipe is fixed between the two columns. The negative pressure pipe is equipped with an interface.

10. A surface mount resistor for preventing loosening according to claim 1, characterized in that, A resistive film is disposed on the top of the ceramic substrate, and a protective plate is disposed on the top of the resistive film.

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