Faraday shield and reaction chamber

Abstract

This invention discloses a Faraday shield and a reaction chamber. The Faraday shield includes a conductive ring, which is divided into multiple alternating first regions and multiple second regions along its circumference. The conductive ring has a first sub-slit and a second sub-slit. The first sub-slit is located within the first region, and the second sub-slit is located within the second region. The first and second sub-slits are not connected, and the angle between the extension direction of the second sub-slit and the extension direction of the first sub-slit is greater than 0°. This solution addresses the problem of high production costs caused by the need for multiple heat treatment devices when performing various heat treatment processes.

Description

[0001] This application is a Chinese patent application filed on July 27, 2017, entitled "Faraday Shielding Component and Reaction Chamber". The application is a divisional application of CN201710623037.3. Technical Field

[0002] This invention relates to the field of semiconductor manufacturing technology, and more specifically, to a Faraday shield and a reaction chamber. Background Technology

[0003] In the process of manufacturing integrated circuits and MEMS devices using inductively coupled plasma (ICP) devices, the generated plasma contains a large number of active particles such as electrons, ions, excited-state atoms, molecules and free radicals. These active particles interact with the substrate, causing various physical and chemical reactions on the material surface, thereby changing the surface properties of the material.

[0004] Figure 1 This is a cross-sectional view of an existing ICP installation. See also... Figure 1 The ICP apparatus includes a reaction chamber 1, on which a dielectric cylinder 3 is disposed on a side wall 2. An RF coil 4 is arranged around the outside of the dielectric cylinder 3, and is electrically connected to an upper RF power supply 6 via an upper matching connector 5. The upper RF power supply 6 is used to apply RF power to the RF coil 4. The electromagnetic field generated by the RF coil 4 can be fed into the reaction chamber 1 through the dielectric cylinder 3 to excite the process gas in the reaction chamber 1 to form plasma. Furthermore, a base 9 is disposed in the reaction chamber 1, and is electrically connected to a lower RF power supply 8 via a lower matching connector 7. The lower RF power supply 8 is used to apply a negative RF bias voltage to the base 9 to attract plasma to etch the substrate surface. In addition, a Faraday shield 10 is arranged around the inside of the dielectric cylinder 3 to protect it from plasma etching and to prevent residues sputtered from the substrate surface from adhering to the inner wall of the dielectric cylinder 3, thereby improving the energy coupling efficiency of the dielectric cylinder 3 and reducing particulate contamination within the reaction chamber 1.

[0005] Figure 2 This is a structural diagram of an existing Faraday shield. Please refer to [link / reference needed]. Figure 2 The Faraday shield 10 is a ring, and a slit 101 is formed on the ring along its axial direction. The slit 101 completely breaks the ring between the upper and lower end faces of the ring, that is, the ring is discontinuous in its circumferential direction, thereby avoiding eddy current loss and heat generation in the Faraday shield 10.

[0006] In the structure of the Faraday shield 10 described above, since the slit 101 is arranged along the axial direction of the ring body, as... Figure 3As shown, this means that only the magnetic field component A of the electromagnetic field generated by the RF coil 4 in the axial direction of the ring can pass through the slot 101, while the electric field component B of the electromagnetic field in the circumferential direction of the ring has difficulty passing through the slot 101, resulting in low magnetic field coupling efficiency. Lower magnetic field coupling efficiency often requires applying higher RF power to the RF coil 4 to achieve plasma ignition, maintain a certain processing rate, and use the upper electrode for separate ignition to reduce damage to the substrate dielectric layer when it is made of low-k material. However, applying higher RF power to the RF coil 4 can cause the Faraday shield 10 to overheat due to eddy current losses and ion bombardment, thereby increasing the risk of particulate contamination in the reaction chamber 1. Summary of the Invention

[0007] The present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a Faraday shield and reaction chamber, which can improve the overall coupling efficiency of the electromagnetic field, thereby reducing the radio frequency power that needs to be applied to the radio frequency coil.

[0008] To achieve the purpose of this invention, a Faraday shield is provided, comprising a conductive ring body with a slit formed thereon. The slit includes a first sub-slit, which is disposed along the circumferential direction of the conductive ring body and forms an angle with the axis of the conductive ring body, thereby increasing the total coupling efficiency of the electromagnetic field by increasing the coupling efficiency of the electric field component of the electromagnetic field in the circumferential direction of the conductive ring body.

[0009] Preferably, the included angle between the first sub-slit and the axis of the conductive ring is 45°.

[0010] Preferably, the slit further includes a second sub-slit disposed along the axial direction of the conductive ring.

[0011] Preferably, the second sub-slit intersects with the first sub-slit.

[0012] Preferably, there are one or more second sub-slits, and the plurality of second sub-slits are spaced apart along the extension direction of the first sub-slit.

[0013] Preferably, the first sub-slit completely breaks the conductive ring between the two end faces of the conductive ring; The second sub-slit breaks off a portion of the conductive ring between the two end faces of the conductive ring.

[0014] Preferably, the first sub-slit breaks off a portion of the conductive ring between the two end faces of the conductive ring; The second sub-slit completely breaks the conductive ring between the two end faces of the conductive ring.

[0015] Preferably, the included angle between the first sub-slit and the axis of the conductive ring is 90°.

[0016] Preferably, there are one or more first sub-slits, and the plurality of first sub-slits are distributed at intervals along the axial direction of the conductive ring.

[0017] Preferably, the conductive ring is divided into a plurality of first regions and a plurality of second regions in the circumferential direction, and the plurality of first regions and the plurality of second regions are arranged alternately. Each of the first regions is provided with a first sub-slit, and there are at least two first sub-slits, which are spaced apart along the axial direction of the conductive ring. A second sub-slit is provided in each of the second regions, and there are at least two second sub-slits, which are spaced apart along the circumferential direction of the conductive ring.

[0018] Preferably, the plurality of first regions and the plurality of second regions are evenly distributed relative to the circumference of the conductive ring; At least two of the first sub-slits are evenly distributed relative to the first region; at least two of the second sub-slits are symmetrically distributed relative to the second region.

[0019] Preferably, the width of the first region in the circumferential direction of the conductive ring is 50 to 200 mm.

[0020] Preferably, there are one or more slits, and the plurality of slits are spaced apart and evenly distributed along the circumferential direction of the conductive ring.

[0021] Preferably, a blocking portion is provided on the conductive ring body and located in the slit, the blocking portion causing the slit to form a tortuous channel between the outer ring wall and the inner ring wall of the conductive ring body.

[0022] Preferably, there are two blocking parts, namely a first blocking part and a second blocking part, which are respectively disposed on the first end face and the second end face of the conductive ring at the slit. The first blocking portion extends from the first end face toward the second end face and has a first gap with the second end face; The second blocking portion extends from the second end face toward the first end face and has a second gap with the first end face; A third gap exists between the first blocking portion and the second blocking portion in the radial direction of the conductive ring; The first gap, the second gap, and the third gap constitute the tortuous channel.

[0023] Preferably, the slit is filled with a medium material.

[0024] Preferably, the width of the slit is in the range of 2 to 10 mm.

[0025] As another technical solution, the present invention also provides a reaction chamber, including a dielectric cylinder, a Faraday shield, and a radio frequency coil, wherein the radio frequency coil is arranged around the outside of the dielectric cylinder; the Faraday shield is arranged around the inside of the dielectric cylinder, and the Faraday shield is the Faraday shield provided by the present invention.

[0026] Preferably, the radio frequency coil is a cylindrical three-dimensional spiral coil in the shape of a strip; the width of any turn of the cylindrical three-dimensional spiral coil in its axial direction is greater than the diameter of any turn of the cylindrical three-dimensional spiral coil with a circular cross-section.

[0027] Preferably, the axial spacing between any two adjacent turns of the cylindrical three-dimensional spiral coil is 6-10 mm.

[0028] Preferably, the reaction chamber is a pre-cleaning chamber.

[0029] The present invention has the following beneficial effects: The Faraday shield provided by this invention includes a conductive ring with a slit formed on it. The slit includes a first sub-slit, which is arranged along the circumference of the conductive ring and forms an angle with the axis of the conductive ring. This sub-slit increases the overall coupling efficiency of the electromagnetic field by increasing the coupling efficiency of the electric field component in the circumferential direction of the conductive ring. This reduces the radio frequency (RF) power required to be applied to the RF coil, enabling plasma ignition even with lower RF power, maintaining a certain processing rate, and allowing for individual ignition using the upper electrode. This reduces damage to the substrate dielectric layer when it is made of low-k material. Furthermore, applying lower RF power avoids overheating of the Faraday shield, thereby reducing the risk of particulate contamination in the reaction chamber.

[0030] The reaction chamber provided by this invention, by employing the Faraday shielding described above, can reduce the radio frequency power required to be applied to the radio frequency coil. This allows for plasma ignition even with lower radio frequency power, maintaining a certain processing rate, and enabling individual ignition using the upper electrode. This reduces damage to the substrate dielectric layer when it is made of low-k material. Furthermore, applying lower radio frequency power also prevents the Faraday shielding from overheating, thereby reducing the risk of particulate contamination in the reaction chamber. Attached Figure Description

[0031] Figure 1 A cross-sectional view of an existing ICP device; Figure 2 Here is a structural diagram of an existing Faraday shield; Figure 3 This is a partial structural diagram of an existing Faraday shield. Figure 4A This is a structural diagram of the Faraday shield provided in the first embodiment of the present invention; Figure 4B This is a partial structural diagram of a Faraday shield provided in the first embodiment of the present invention; Figure 4C This is a partial structural diagram of another Faraday shield provided in the first embodiment of the present invention; Figure 4D This is another partial structural diagram of the Faraday shield provided in the first embodiment of the present invention; Figure 4E This is another partial structural diagram of the Faraday shield provided in the first embodiment of the present invention; Figure 5 A partial structural diagram of the Faraday shield provided in the second embodiment of the present invention; Figure 6 This is a side view of the Faraday shield provided in the third embodiment of the present invention; Figure 7A A radial cross-sectional view of the Faraday shield provided in the fourth embodiment of the present invention; Figure 7B for Figure 7A Enlarged view of region I in the middle; Figure 8 A cross-sectional view of the reaction chamber provided in an embodiment of the present invention; Figure 9 This is a structural diagram of a radio frequency coil used in an embodiment of the present invention; Figure 10 This is a structural diagram of another radio frequency coil used in an embodiment of the present invention. Detailed Implementation

[0032] To enable those skilled in the art to better understand the technical solution of the present invention, the Faraday shield and reaction chamber provided by the present invention will be described in detail below with reference to the accompanying drawings.

[0033] Please refer to the following: Figure 4A and Figure 4BThe Faraday shield provided in the first embodiment of the present invention includes a conductive ring 11 with a slit formed thereon. The slit includes a first sub-slit 111, which is arranged along the circumferential direction of the conductive ring and forms an angle α with the axis of the conductive ring 11. The electromagnetic field generated by the radio frequency coil 204 surrounding the conductive ring 11 can be divided into a magnetic field component A along the axial direction of the conductive ring 11 and an electric field component B along the circumferential direction of the conductive ring 11. By employing the first sub-slit 111, the sub-component of the magnetic field component A along the axial direction of the conductive ring 11 in the inclined direction of the first sub-slit 111 can be fed into the reaction chamber through the first sub-slit 111, while the sub-component of the electric field component B along the circumferential direction of the conductive ring 11 in the inclined direction of the first sub-slit 111 can also be fed into the reaction chamber through the first sub-slit 111.

[0034] The Poynting vector is the energy flux density vector in an electromagnetic field, representing the energy passing through a unit area perpendicular to the field per unit time, measured in watts per meter (W / m). Assuming the electric field strength is E and the magnetic field strength is H at a certain point in space, the energy flux density of the electromagnetic field at that point is S = E × H, with the direction determined by the right-hand screw rule for E and H. The magnitude of the energy flux density at that point is |S| = |E||H|sinθ, where θ is the angle between E and H.

[0035] Based on the above principle, if the slit is set along the axial direction of the conductive ring 11 as in the prior art, then E≈0, so S≈0. Assuming the angle α between the first sub-slit 111 and the axis of the conductive ring 11 is 45°, then θ=45°. Substituting this into the above formula, we get: |S|=|E|cos45°×|H|sin45°×sin45°. Therefore, the energy flux density through the first sub-slit 111 is greater than that through the slit set along the axial direction of the conductive ring 11 in the prior art, thereby increasing the overall electromagnetic field coupling efficiency. This reduces the RF power required to be applied to the RF coil 204. That is, even with a lower RF power, plasma ignition can be achieved, maintaining a certain processing rate, and individual ignition using the upper electrode can be used to reduce damage to the substrate dielectric layer when it is a low-k material. Furthermore, applying a lower RF power can also prevent the Faraday shield from overheating, thereby reducing the risk of particulate contamination in the reaction chamber.

[0036] Preferably, the angle α formed between the first sub-slit 111 and the axis of the conductive ring 11 is 45°, which maximizes the length of the first sub-slit 111, thereby maximizing the energy flux density and thus maximizing the overall coupling efficiency of the electromagnetic field.

[0037] It should be noted that in this embodiment, the first sub-slit 111 is in a straight line shape, but the present invention is not limited to this. In practical applications, the first sub-slit 111 can also be in a broken line shape or an arc shape, etc., as long as it can increase the coupling efficiency of the magnetic field component in the circumferential direction of the electromagnetic field in the conductive ring 11, so as to increase the total coupling efficiency of the electromagnetic field.

[0038] As a preferred embodiment of this solution, such as Figure 4C As shown, in addition to the first sub-slit 111, a second sub-slit 112 is added to the aforementioned slit. The second sub-slit 112 is arranged along the axial direction of the conductive ring 11 and intersects with the first sub-slit 111, forming an included angle b. With the help of the second sub-slit 112, the coupling efficiency of the aforementioned magnetic field component A can be further increased.

[0039] In this embodiment, the first sub-slit 111 completely disconnects the conductive ring 11 between its two end faces to avoid eddy current losses and heat generation within the conductive ring 11. Furthermore, the second sub-slit 112 partially disconnects the conductive ring 11 between its two end faces; that is, the second sub-slit 112 does not completely disconnect the conductive ring 11 between its two end faces, thus maintaining the integral structure of the conductive ring 11.

[0040] To minimize corrosion of components (e.g., dielectric cylinders) located inside the Faraday shield at the slot without affecting magnetic field coupling efficiency, the width h of the slot is ranged from 2 to 10 mm, preferably 5-8 mm. The width h of the slot is the same as the width of the first sub-slot 111 and the second sub-slot 112, and the widths of the first sub-slot 111 and the second sub-slot 112 can be the same or different.

[0041] like Figure 4D As shown, to prevent components (e.g., dielectric cylinders) located inside the Faraday shield from corrosion at the slits, a dielectric material 12, such as ceramic, can be filled into the slits. Electromagnetic fields can then be fed into the reaction chamber through this dielectric material 12.

[0042] It should be noted that in this embodiment, there is only one second sub-slit 112, but the present invention is not limited to this. In practical applications, such as... Figure 4E As shown, there can be multiple second sub-slits 112, and the multiple second sub-slits 112 are distributed at intervals along the extension direction (inclination direction) of the first sub-slit 111.

[0043] It should also be noted that in this embodiment, the second sub-slit 112 and the first sub-slit 111 intersect each other. However, the present invention is not limited to this. In practical applications, the second sub-slit 112 and the first sub-slit 111 can also be separated from each other.

[0044] It should also be noted that in practical applications, there can be one or more slots, and these slots are spaced apart and evenly distributed along the circumference of the conductive ring 11 to ensure process uniformity. It is easy to understand that the more slots there are, the greater the overall coupling efficiency of the electromagnetic field.

[0045] Please see Figure 5 The Faraday shield provided in the second embodiment of the present invention includes a conductive ring 21, on which a slit is formed. The slit includes two first sub-slits 212 arranged along the circumferential direction of the conductive ring 21, and the two first sub-slits 212 are spaced apart along the axial direction of the conductive ring 21. The angle formed between the first sub-slits 212 and the axis of the conductive ring 21 is 90°, so that the electric field component B in the circumferential direction of the conductive ring 21 can be fed into the reaction chamber through the first sub-slits 212.

[0046] Furthermore, the aforementioned slit also includes a second sub-slit 211 arranged along the axial direction of the conductive ring 21, which intersects with the first sub-slit 212. Since the second sub-slit 211 is arranged along the axial direction of the conductive ring 21, it can feed the axial magnetic field component A of the conductive ring 11 into the reaction chamber.

[0047] As can be seen from the above, by using the first sub-slit 212 and the second sub-slit 211, the electric field component B and the magnetic field component A can be fed into the reaction chamber respectively. Compared with the prior art, which can only feed in the magnetic field component A, this increases the overall coupling efficiency of the electromagnetic field, thereby reducing the radio frequency power required to be applied to the radio frequency coil. That is, even with a lower radio frequency power applied, plasma ignition can be achieved, a certain processing rate can be maintained, and the upper electrode can be used for separate ignition, thus reducing damage to the substrate dielectric layer when it is a low-k material. In addition, applying a lower radio frequency power can also avoid excessive temperature of the Faraday shield, thereby reducing the risk of particulate contamination in the reaction chamber.

[0048] In this embodiment, the second sub-slit 211 completely disconnects the conductive ring 21 between its two end faces to avoid eddy current losses and heat generation in the conductive ring 11. Furthermore, each first sub-slit 212 partially disconnects the conductive ring 21 between its two end faces; that is, the first sub-slit 212 does not completely disconnect the conductive ring 21 between its two end faces, thereby maintaining the integral structure of the conductive ring 11.

[0049] In this embodiment, there are two first sub-slits 212. However, the present invention is not limited to this. In practical applications, there may be one or more first sub-slits 212. The included angles formed between the multiple first sub-slits 212 and the axis of the conductive ring 21 may be the same or different.

[0050] Please see Figure 6 The Faraday shielding component provided in the third embodiment of the present invention includes a conductive ring 41, and a plurality of first regions 411 and a plurality of second regions 412 are divided in the circumferential direction of the conductive ring 41, and the plurality of first regions 411 and the plurality of second regions 412 are arranged alternately. Furthermore, a first sub-slit 42 is provided in each first region 411, and there are at least two first sub-slits 42, which are arranged along the axial direction of the conductive ring 41 (i.e., Figure 6 The second sub-slits 43 are spaced apart (as shown in the Y direction); each second region 412 is provided with at least two second sub-slits 43, and they are arranged along the circumferential direction of the conductive ring 41 (i.e., Figure 6 The X-direction (shown in the diagram) is spaced out. This also allows the electric field component B and the magnetic field component A to be fed into the reaction chamber respectively, thereby increasing the overall coupling efficiency of the electromagnetic field and thus reducing the radio frequency power required to be applied to the radio frequency coil.

[0051] To ensure process uniformity, preferably, the plurality of first regions 411 and the plurality of second regions 412 are evenly distributed around the circumference of the conductive ring 41. Furthermore, at least two first sub-slits 42 are evenly distributed around the first regions 411, and at least two second sub-slits 43 are symmetrically distributed around the second regions 412.

[0052] Preferably, the width of the first region 411 in the circumferential direction of the conductive ring 41 is 50 to 200 mm to minimize eddy currents.

[0053] Please refer to the following: Figure 7A and Figure 7B The Faraday shield provided in the fourth embodiment of the present invention is an improvement upon the first to third embodiments described above. Specifically, a blocking portion is provided on the conductive ring 31 within the slit, which causes the slit to form a tortuous channel 34 between the outer and inner ring walls of the conductive ring 31. This tortuous channel can further prevent corrosion of components (e.g., dielectric cylinders) located inside the Faraday shield at the slit without affecting the magnetic field coupling efficiency.

[0054] In this embodiment, there are two blocking portions, namely a first blocking portion 32 and a second blocking portion 33, which are respectively disposed on the first end face 331 and the second end face 312 at the slit of the conductive ring 31. The first end face 331 and the second end face 312 are the two cross-sections of the conductive ring 31 that are separated by the slit and are opposite to each other. The first blocking portion 32 extends from the first end face 311 toward the second end face 312 and has a first gap 321 between it and the second end face 312. The extension direction of the first blocking portion 32 is preferably the circumferential direction of the conductive ring 31. The second blocking portion 33 extends from the second end face 312 toward the first end face 331 and has a second gap 331 between it and the first end face 331. A third gap 341 is formed between the first blocking portion 32 and the second blocking portion 33 in the radial direction of the conductive ring 31. The first gap 321, the second gap 331 and the third gap 341 constitute the aforementioned tortuous channel 34.

[0055] In practical applications, the aforementioned blocking part can also adopt any other structure, as long as a labyrinthine tortuous channel can be formed in the radial direction of the conductive ring 31, the parts located inside the Faraday shield can be prevented from being corroded at the opening.

[0056] In summary, the Faraday shield provided in the above embodiments of the present invention includes a conductive ring with a slit formed thereon. The slit includes a first sub-slit, which is disposed along the circumferential direction of the conductive ring and forms an angle with the axis of the conductive ring. This sub-slit increases the overall coupling efficiency of the electromagnetic field by increasing the coupling efficiency of the magnetic field component in the circumferential direction of the conductive ring. This reduces the radio frequency power required to be applied to the radio frequency coil. That is, even with a lower radio frequency power, plasma ignition can be achieved, maintaining a certain processing rate, and ignition can be performed using the upper electrode alone, reducing damage to the substrate dielectric layer when it is a low-k material. Furthermore, applying a lower radio frequency power can prevent the Faraday shield from overheating, thereby reducing the risk of particulate contamination in the reaction chamber.

[0057] As another technical solution, such as Figure 8As shown, this embodiment of the invention also provides a reaction chamber 201, in which a dielectric cylinder 203 is disposed in the sidewall 202 of the reaction chamber 201. An RF coil 204 is disposed around the outside of the dielectric cylinder 203, and is electrically connected to an upper RF power supply 206 via an upper matching connector 205. The upper RF power supply 206 is used to apply RF power to the RF coil 204. The electromagnetic field generated by the RF coil 204 can be fed into the reaction chamber 201 through the dielectric cylinder 203 to excite the process gas in the reaction chamber 201 to form plasma. Furthermore, a base 209 is also disposed in the reaction chamber 201, which is electrically connected to a lower RF power supply 208 via a lower matching connector 207. The lower RF power supply 208 is used to apply a negative RF bias voltage to the base 209 to attract plasma to etch the substrate surface. Furthermore, a Faraday shield 210 is arranged around the inner side of the dielectric cylinder 203 to protect it from plasma etching and to prevent residues sputtered from the substrate surface from adhering to the inner wall of the dielectric cylinder 203. This improves the energy coupling efficiency of the dielectric cylinder 203 and reduces particulate contamination within the reaction chamber 201. The Faraday shield 210 can be grounded or floating at a potential.

[0058] The Faraday shield 201 described above adopts the Faraday shield provided in the above embodiments of the present invention.

[0059] like Figure 9 As shown, in this embodiment, the radio frequency coil 204 is a cylindrical three-dimensional spiral coil, and the cross-section of the cylindrical three-dimensional spiral coil is circular. However, the present invention is not limited to this, and cylindrical three-dimensional spiral coils with other cross-sectional shapes can also be used. Preferably, such as Figure 10 As shown, the RF coil 204' is a cylindrical three-dimensional spiral coil in the shape of a strip. A cylindrical three-dimensional spiral coil in the shape of a strip refers to a coil formed by spirally winding a strip of wire. Furthermore, the width W of any turn of the cylindrical three-dimensional spiral coil in its axial direction is greater than that of a cylindrical three-dimensional coil with a circular cross-section (i.e., Figure 9 The diameter of any one turn of the coil (as shown in the coil structure) can be adjusted so that the cross-sectional area of ​​the strip-shaped cylindrical three-dimensional spiral coil is greater than that of the cylindrical three-dimensional spiral coil with a circular cross-section.

[0060] The parasitic capacitance between the cylindrical helical coil and the Faraday shield is proportional to the cross-sectional area of ​​the cylindrical helical coil. Furthermore, the smaller the parasitic capacitance, the weaker the capacitive coupling, resulting in a weaker electric field strength fed into the reaction chamber; conversely, the larger the parasitic capacitance, the stronger the capacitive coupling, resulting in a stronger electric field strength fed into the reaction chamber, thus providing sufficient electric field strength for plasma ignition. Based on this theory, by using a strip-shaped cylindrical helical coil for the radio frequency coil 204', and making the cross-sectional area of ​​the strip-shaped cylindrical helical coil larger than that of a cylindrical helical coil with a circular cross-section, the parasitic capacitance can be increased, thereby enhancing capacitive coupling and consequently increasing the electric field strength fed into the reaction chamber.

[0061] Preferably, the axial spacing d between any two adjacent turns of the strip-shaped cylindrical three-dimensional spiral coil is 6-10mm, which can prevent arcing due to potential difference between adjacent turns of the coil.

[0062] In practical applications, the thickness of the strip-shaped cylindrical three-dimensional spiral coil in its radial direction is 2-4 mm. Moreover, the height h of the strip-shaped cylindrical three-dimensional spiral coil cannot exceed the height of the dielectric cylinder 203, that is, the upper end of the strip-shaped cylindrical three-dimensional spiral coil is lower than the upper end of the dielectric cylinder 203, and the lower end of the strip-shaped cylindrical three-dimensional spiral coil is higher than the lower end of the dielectric cylinder 203.

[0063] In practical applications, the aforementioned reaction chamber 201 can be a pre-cleaning chamber. In this case, the frequency of the radio frequency power applied to the aforementioned radio frequency coil 204 can be 2MHz, 13.56MHz, or 60MHz, etc. Alternatively, pulsed radio frequency power can also be applied. The frequency of the radio frequency power applied to the aforementioned base 209 can be 400KHz, 2MHz, 13.56MHz, or 60MHz, etc. Alternatively, pulsed radio frequency power can also be applied. Alternatively, no radio frequency power can be applied to the aforementioned base 209.

[0064] The reaction chamber provided in this invention, by employing the Faraday shielding described in the above embodiments, can reduce the radio frequency power required to be applied to the radio frequency coil. This allows for plasma ignition even with lower radio frequency power, maintaining a certain processing rate, and enabling individual ignition using the upper electrode. This reduces damage to the substrate dielectric layer when it is made of low-k material. Furthermore, applying lower radio frequency power prevents the Faraday shielding from overheating, thereby reducing the risk of particulate contamination in the reaction chamber.

[0065] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A Faraday shield, characterized in that, The device includes a conductive ring, which is divided into a plurality of alternating first regions and a plurality of second regions in its circumferential direction, and the conductive ring is provided with a first sub-slit and a second sub-slit. The first sub-slit is opened in the first region, and the second sub-slit is opened in the second region; the first sub-slit and the second sub-slit are not connected, and the angle between the extension direction of the second sub-slit and the extension direction of the first sub-slit is greater than 0°.

2. The Faraday shielding component according to claim 1, characterized in that, Multiple first sub-slits are formed within the first region, and the first sub-slits are not connected to each other; and / or, Multiple second sub-slits are provided in the second region, and the second sub-slits are not connected to each other.

3. The Faraday shielding component according to claim 2, characterized in that, Each of the first sub-slits is parallel to each other; and / or, each of the second sub-slits is parallel to each other.

4. The Faraday shielding component according to claim 2, characterized in that, Multiple first sub-slits are evenly distributed in the first region; and / or multiple second sub-slits are evenly distributed in the second region.

5. The Faraday shielding component according to claim 2, characterized in that, The first sub-slit extends along the circumferential direction of the conductive ring, and the first sub-slits located within the same first region are spaced apart along the axial direction of the conductive ring; and / or, the second sub-slit extends along the axial direction of the conductive ring, and the second sub-slits located within the same second region are spaced apart along the circumferential direction of the conductive ring, wherein: The circumferential direction of the conductive ring is perpendicular to the axis of the conductive ring.

6. The Faraday shielding component according to claim 1, characterized in that, The extension direction of the first sub-slit forms an angle with the axial direction of the conductive ring, and the extension direction of the first sub-slit forms an angle with the circumferential direction of the conductive ring; and / or, the extension direction of the second sub-slit also forms an angle with the axial direction of the conductive ring, and the extension direction of the second sub-slit forms an angle with the circumferential direction of the conductive ring; wherein: The circumferential direction of the conductive ring is perpendicular to the axis of the conductive ring.

7. The Faraday shielding component according to claim 1, characterized in that, The first sub-slit and the second sub-slit are both located between two end faces of the conductive ring distributed along its axial direction, and the length of the extension component of the first sub-slit and the second sub-slit in the axial direction is less than the distance between the two end faces; The first sub-slit is located between two first edges distributed along the circumferential direction of the conductive ring in the first region where it is located, and the length of the extension component of the first sub-slit in the circumferential direction is less than the interval size of the two first edges in the circumferential direction; the second sub-slit is located between two second edges distributed along the circumferential direction of the second region where it is located, and the length of the extension component of the second sub-slit in the circumferential direction is less than the interval size of the two second edges in the circumferential direction.

8. The Faraday shielding component according to claim 1, characterized in that, Both the first sub-slit and the second sub-slit are filled with a medium material.

9. A reaction chamber, comprising a dielectric cylinder, a Faraday shield, and a radio frequency coil, wherein the radio frequency coil is arranged around the outer side of the dielectric cylinder; and the Faraday shield is arranged around the inner side of the dielectric cylinder, characterized in that, The Faraday shield is the Faraday shield as described in any one of claims 1-8.

10. The reaction chamber according to claim 9, characterized in that, The radio frequency collar is a three-dimensional spiral coil in the shape of a strip; the width of any one turn of the three-dimensional spiral coil in its axial direction is greater than its thickness.

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