A full-automatic integrated circuit film expanding device

Abstract

This invention discloses a fully automated integrated circuit film expansion device, belonging to the field of semiconductor device manufacturing. It includes a main machine body with automatic loading and unloading modules arranged around its perimeter. An automatic die removal module is located inside the main machine body. An inverted die expansion module is located on one side of the automatic die removal module, and an automatic film transfer module is located above the inverted die expansion module. This invention can handle the entire process from product loading to unloading. Through modular units such as automatic loading, precise die removal, uniform film expansion, online detection, intelligent film transfer, and automatic unloading, it achieves full automation, high precision, and traceability of the wafer film expansion process, significantly improving the efficiency and yield of the pre-packaging process.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor device manufacturing technology, specifically referring to a fully automated integrated circuit film expansion device. Background Technology

[0002] The wafer expansion process is a core step after wafer dicing and before wafer pick-up. Its core function is to uniformly stretch a carrier film (such as blue film or UV film) on the wafer surface to widen the gaps between the dies, ensuring the stable operation of subsequent packaging processes such as pick-up and mounting. With the application of precision integrated circuits such as MEMS, the industry's requirements for the accuracy, stability, and efficiency of wafer expansion have significantly increased.

[0003] Currently, the wafer expansion process for MEMS and other products still largely relies on semi-automatic equipment combined with manual operation. Individual differences among operators can easily lead to uneven film stretching, wafer misalignment, or even damage. Furthermore, manual contact significantly increases the risk of contamination, affecting product yield. At the same time, the semi-manual mode is inefficient and cannot meet the needs of large-scale mass production.

[0004] Existing film expansion equipment suffers from insufficient stretching accuracy and low automation levels, failing to meet the demands of precision manufacturing. Furthermore, it cannot achieve full automation from material input to finished product, requiring significant manual intervention. In addition, most equipment does not support industrial data networking and remote diagnostics, resulting in low maintenance efficiency and making it difficult to adapt to the development trend of intelligent manufacturing. Summary of the Invention

[0005] In response to the above situation and to overcome the shortcomings of the existing technology, this invention provides a fully automated integrated circuit film expansion device. It effectively solves the problem that the current MEMS product wafer film expansion relies on manual operation and semi-manual equipment, which is prone to human error and contamination, resulting in low production efficiency. Furthermore, existing equipment cannot achieve high-precision expansion, stretching, flattening, and uniform expansion of wafer-bearing films such as blue film and UV film in the critical process stage after wafer dicing and before wafer picking. At the same time, the level of automation is insufficient, requiring a large amount of manual intervention. It cannot achieve fully automated production from material feeding to finished product, nor does it support industrial data networking and remote diagnosis, making it difficult to meet the needs of high-efficiency and precise production.

[0006] The technical solution adopted by the present invention is as follows: The present invention proposes a fully automatic integrated circuit film expansion device, including a machine body, an automatic loading and unloading module is arranged around the machine body, an automatic film removal module is arranged inside the machine body, an inverted die expansion module is arranged on one side of the automatic film removal module, and an automatic film transfer module is arranged above the inverted die expansion module.

[0007] Preferably, the automatic loading and unloading module includes a wafer ring loading and unloading module and a wafer loading and unloading module. The wafer loading and unloading module is disposed on one side of the wafer ring loading and unloading module. The wafer ring loading and unloading module includes a cassette loading and unloading platform. A cassette picking and placing gripper is provided at one end of the cassette loading and unloading platform. The cassette picking and placing gripper is slidably connected to the main body of the machine. A track is provided on the side of the cassette picking and placing gripper close to the cassette loading and unloading platform. A cassette picking and placing handle is provided on the side of the track away from the cassette loading and unloading platform.

[0008] The wafer loading and unloading module includes a second loading and unloading platform for wafer trays. The second loading and unloading platform for wafer trays is located on one side of the first loading and unloading platform for wafer trays. A second wafer tray pick-and-place gripper is provided at one end of the second loading and unloading platform for wafer trays. The second wafer tray pick-and-place gripper is slidably connected to the main body of the machine. A second track is provided on the side of the second wafer tray pick-and-place gripper that is close to the second loading and unloading platform for wafer trays. A second wafer tray pick-and-place handle is provided on the side of the second track that is away from the second loading and unloading platform for wafer trays.

[0009] Preferably, the automatic film transfer module includes a heating plate, which is disposed between the automatic core removal module and the inverted crystal expansion module. An annular UV film bonding and reinforcement device is disposed on one side of the heating plate, which is disposed above the crystal expansion platform. A suction cup is disposed on the annular UV film bonding and reinforcement device, and a spring is disposed between the annular UV film bonding and reinforcement device and the suction cup.

[0010] Preferably, the automatic core removal module includes a core removal platform, which is disposed on one side of the material box pick-and-place gripper. A circumferential blade is disposed above the core removal platform, and the circumferential blade is slidably connected to the machine body. A die expansion pick-and-place gripper is disposed above the circumferential blade.

[0011] Preferably, the inverted die expansion module includes a die expansion platform, which is disposed inside the material box pick-and-place gripper 2. Springs are provided at both ends of the die expansion platform, a wafer ring fixing mechanism is provided above the die expansion platform, and a circumferential cutter 2 is provided on one side of the die expansion platform.

[0012] Preferably, the expansion method of the fully automated integrated circuit expansion device includes the following steps:

[0013] Step 1: The automatic loading and unloading module transports the wafer ring with the wafer to the automatic wafer removal module;

[0014] Step 2: The automatic core stripping module automatically peels off the central support layer of the original film on the wafer ring;

[0015] Step 3: After the automatic loading and unloading module transports the wafer ring to the inverted die expansion module, the inverted die expansion module flips the wafer and performs a film expansion operation.

[0016] Step 4: The automatic loading and unloading module transports the wafer to the automatic transfer module, where the wafer is transferred and bonded.

[0017] Step 5: The automatic loading and unloading module moves the wafer to the unloading station.

[0018] Preferably, in step one, the first material box pick-up and place gripper picks up the wafer ring with the wafer, and transfers the wafer from the wafer removal platform to the first track. The first material box pick-up and place gripper pushes the wafer into the material box in the wafer ring infeed module. At the same time, the second material box pick-up and place gripper picks up the empty wafer ring that has had the wafer removed from the wafer expansion platform, places the empty wafer ring on the second track, and then pushes the empty wafer ring into the material box in the wafer infeed module.

[0019] Preferably, in step five, a cassette containing a wafer ring with an empty film is placed on a cassette loading / unloading platform one. The cassette pick-and-place gripper one picks up the wafer ring with the empty film and moves it to a track one. The cassette pick-and-place handle one picks up the wafer ring with the empty film on track one and places it on a core removal platform in preparation for core removal. At the same time, a cassette containing diced wafers is placed on a cassette loading / unloading platform two. The cassette pick-and-place gripper two picks up the diced wafers and moves them to a track two. The cassette pick-and-place handle one picks up the diced wafers on track two and places them on a flipped and inverted expansion platform.

[0020] Preferably, in step three, after the diced wafer is placed on the wafer expansion platform by the wafer ring fixing mechanism, the inverted wafer expansion module flips downward. After the flipping action is completed, the wafer expansion platform presses down and forms a reverse force with the wafer ring fixing mechanism, applying downward pressure from the UV film on the back of the wafer to perform the UV film expansion action. When the UV film deforms and expands, it drives the grains on the wafer to expand outward synchronously, so that the grains form a uniform spacing, completing the film expansion action. After the film expansion is completed, the inverted wafer expansion module flips upward. After the flipping action is completed, the circumferential blade extends and cuts and removes the wrinkled parts of the UV film, removing the wrinkled parts of the wafer and UV film, and retaining the intermediate wafer body after the film expansion treatment.

[0021] Preferably, in step four, the circumferential cutter automatically removes the UV film wrinkles and wafer rings caused by the film expansion on the outer periphery of the wafer. The suction cup picks up the wafer ring with the film core removed and places it on the expansion platform, performing a pressing action to bond the wafer with the film core removed, after film expansion and removal of the wafer ring and UV film wrinkles, to the wafer ring with the film core removed. After bonding is completed, the suction cup is lifted, and the wafer and wafer ring bonded together are automatically transferred to the heating plate for reinforcement bonding.

[0022] The beneficial effects achieved by the present invention using the above structure are as follows:

[0023] (1) By integrating automatic loading and unloading module, automatic core removal module, inverted die expansion module and automatic film transfer module, the wafer expansion operation is fully automated from loading to unloading. No manual intervention is required in each link such as loading and unloading, core removal, film expansion, film transfer and unloading. This significantly reduces the risk of uneven film stretching, wafer contamination and breakage caused by human operation, greatly improves production efficiency and product yield, and meets the requirements of large-scale mass production for equipment uptime and stability.

[0024] (2) With the help of the circumferential cutter, the UV film wrinkles and excess wafer rings after film expansion are precisely removed, which effectively ensures the roundness and edge flatness of the wafer after film expansion. The roundness accuracy after film expansion can be controlled within 2mm, which significantly improves the film expansion accuracy and the reliability of subsequent chip picking process. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the structure of a fully automated integrated circuit film expansion device proposed in this invention;

[0026] Figure 2 This is a schematic diagram of the circumferential blade of a fully automated integrated circuit film expansion device proposed in this invention;

[0027] Figure 3 This is a schematic diagram of the circumferential blade of a fully automated integrated circuit film expansion device proposed in this invention;

[0028] Figure 4 This is a schematic diagram of the wafer ring fixing structure of a fully automated integrated circuit film expansion device proposed in this invention;

[0029] Figure 5 This is a schematic diagram of a suction cup and annular UV film bonding and reinforcement device for a fully automatic integrated circuit film expansion device proposed in this invention.

[0030] The components include: 1. Automatic loading and unloading module; 2. Wafer ring loading and unloading module; 21. Material box loading and unloading platform one; 22. Material box picking and placing gripper one; 23. Track one; 24. Material box picking and placing gripper one; 3. Wafer loading and unloading module; 31. Material box loading and unloading platform two; 32. Material box picking and placing gripper two; 33. Track two; 34. Material box picking and placing gripper two; 4. Automatic core removal module; 41. Core removal platform; 42. Circumferential knife one; 43. Die expansion picking and placing gripper; 5. Inverted die expansion module; 51. Die expansion platform; 52. Wafer ring fixing mechanism; 53. Circumferential knife two; 6. Automatic film transfer module; 61. Suction cup; 62. Annular UV film bonding and reinforcement device; 63. Heating plate.

[0031] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used together with the embodiments of the invention to explain the invention and do not constitute a limitation thereof. Detailed Implementation

[0032] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0033] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0034] like Figures 1-5 As shown, this invention proposes a fully automated integrated circuit film expansion device, such as... Figure 1 As shown, the process includes step one: placing a cassette containing an empty wafer ring onto the cassette loading / unloading platform 21; cassette gripper 22 gripping the empty wafer ring and transferring it to track 23; then, cassette handle 24 picking up the empty wafer ring from track 23 and placing it on the wafer removal platform 41 to prepare for the wafer removal operation. This ensures that the wafer ring and wafer are transferred without damage or misalignment, providing accurate initial positioning for subsequent wafer removal and wafer expansion operations. Simultaneously, a cassette containing diced wafers is placed on the cassette loading / unloading platform 31; cassette gripper 32 gripping the diced wafers and transferring them to track 33; and cassette handle 34 picking up the diced wafers from track 33 and placing them on the inverted wafer expansion platform 51. This allows the wafer removal and wafer expansion preparation operations to start in parallel, effectively shortening the overall process cycle and improving equipment uptime. The parallel feeding setup of wafer ring feeding module 2 and wafer feeding module 3 enables synchronous transport of the wafer ring with the blank film and the diced wafer, avoiding the waiting time of a single feeding group and improving the overall process efficiency.

[0035] like Figure 2As shown, in step two: after the empty film wafer ring is placed on the core removal platform 41, the circumferential cutter 42 moves above the core removal platform 41, then descends and rotates to cut, automatically removing the middle part of the UV film on the wafer ring, removing the core, and retaining only the edge ring film structure. Through the coordinated action of the core removal platform 41 and the circumferential cutter 42, the entire process is automated, requiring no manual intervention. This avoids problems such as UV film tearing, wafer ring positioning deviation, and core residue caused by manual core removal, significantly improving product yield and process consistency. Finally, the wafer ring is placed on the expansion platform 51 using the die expansion gripper 43.

[0036] It should be noted that the core removal platform 41 can stably support the wafer ring with the empty film attached, preventing wafer ring displacement during the cutting process. This provides stable support for the precise cutting of the circumferential cutter 42. The circumferential cutter 42 adopts an integrated cutting method of movement, descent, and rotation, which can achieve precise circumferential cutting of the middle area of ​​the UV film. The cut edges are neat and burr-free, avoiding core residue or damage to the edge annular film. This provides a flat and intact edge annular film substrate for subsequent bonding of the wafer and wafer ring. The design of retaining only the edge annular film reduces material redundancy during subsequent film expansion and bonding. Furthermore, the tensile support of the edge annular film ensures the structural stability of the wafer and wafer ring after core removal and bonding, preventing wafer displacement or detachment after bonding.

[0037] like Figures 3-4 As shown, in step three: After the diced wafer is fixed on the wafer expansion platform 51 by the wafer ring fixing mechanism 52, the inverted wafer expansion module 5 is flipped downwards. After the flip is completed, the wafer expansion platform 51 presses down and forms a reverse force with the wafer ring fixing mechanism 52, applying downward pressure from the UV film on the back of the wafer, causing the UV film to deform and expand, driving the dies on the wafer to expand outwards uniformly, so that a uniform spacing is formed between the chips. After the film expansion is completed, the inverted wafer expansion module 5 is flipped upwards, and the circumferential cutter 53 extends and cuts away the wrinkled part of the UV film and the wafer ring, leaving only the intermediate wafer body after the film expansion process.

[0038] It should be noted that the wafer ring fixing mechanism 52 can firmly fix the diced wafer on the wafer expansion platform 51, avoiding wafer displacement and shaking during the film expansion process. The downward flipping design of the inverted wafer expansion module 5 allows the wafer expansion platform 51 to apply downward pressure from the UV film on the back of the wafer, forming a uniform reverse force with the wafer ring fixing mechanism 52. This avoids die damage caused by front pressure, while ensuring uniform deformation and synchronous expansion of the UV film, driving the dies on the wafer to diffuse outwards uniformly, creating a uniform spacing between chips and ensuring the convenience of subsequent die pick-up. After the film expansion is completed, the inverted wafer expansion module 5 flips upward, restoring the wafer to a position suitable for dicing. The circumferential cutter 53 extends and makes precise cuts, effectively removing wrinkles and excess wafer rings from the UV film, eliminating interference from wrinkles on subsequent bonding, reducing material redundancy, and enabling the intermediate wafer body after film expansion to accurately adhere to the wafer ring after the film core is removed, improving bonding accuracy. The flipping action of the inverted die expansion module 5 enables the attitude switching of the die expansion platform 51, allowing for seamless connection between the die expansion and dicing processes. This avoids errors in the secondary positioning of the wafer, improves process stability and efficiency, and ensures that the precise cutting of the circumferential cutter 53 ensures that the edge of the wafer body is neat and free of excess film residue, thus guaranteeing the quality of subsequent bonding.

[0039] like Figure 5 As shown, in step four: the suction cup 61 picks up the wafer ring with the core removed, places it on the wafer expansion platform 51 and performs a pressing action, so that the wafer with the core removed and the wafer ring and UV film wrinkles removed are bonded to the wafer ring with the core removed; after the bonding is completed, the suction cup 61 is lifted and the wafer and wafer ring bonded together are automatically transferred to the heating plate 63, and the ring UV film bonding and strengthening device 62 is used for heating and strengthening, so that the two UV films are firmly bonded.

[0040] It should be noted that the suction cup 61 can accurately pick up the wafer ring after the film core has been removed, avoiding deformation and damage to the wafer ring during the picking process. At the same time, through precise positioning, it is placed on the wafer expansion platform 51. With the downward pressing action, it can ensure that the wafer after film expansion and edge cutting is completely aligned with the edge ring film after the film core has been removed from the wafer ring. This avoids uneven edge tension caused by adhesion misalignment, ensures the structural stability of the two after bonding, and prevents separation or misalignment during subsequent transportation. The heating plate 63 provides a uniform and stable heating environment. With the cooperation of the heating plate 63, the ring UV film bonding and reinforcement device 62 heats and reinforces the bonded wafer and wafer ring, making the UV film on the wafer surface and the edge ring film molecules of the wafer ring more tightly bonded. The bonding strength is significantly improved, which can withstand the mechanical stress of subsequent transportation, testing and other processes, avoids interlayer peeling, and further ensures the reliability of the product structure. The suction cup 61, heating plate 63, and annular UV film bonding and reinforcement device 62 work together to achieve automatic bonding and reinforcement of the wafer and the empty wafer ring after film expansion, without the need for manual assistance. This reduces the risk of contamination and damage caused by manual contact, while ensuring bonding accuracy and consistency and improving process stability.

[0041] Step 5: The first gripper 24 picks up the wafer that has completed the film expansion and bonding and transfers it to the first track 23. The first gripper 22 pushes the wafer into the cassette in the wafer ring loading and unloading module 2. At the same time, the second gripper 34 picks up the empty wafer ring that has been removed from the wafer expansion platform 51 and places it on the second track 33. The second gripper 32 pushes the empty wafer ring into the cassette in the wafer loading and unloading module 3, completing the automatic unloading process.

[0042] It should be noted that the unloading mechanism, consisting of the first material box pick-and-place gripper 24, the first track 23, and the first material box pick-and-place clamp 22, is responsible for unloading finished wafers that have completed film expansion and bonding, and accurately transferring them to the material boxes within the wafer ring infeed module 2. The recycling mechanism, consisting of the second material box pick-and-place gripper 34, the second track 33, and the second material box pick-and-place clamp 32, is responsible for recycling empty wafer rings that have had their wafers removed from the wafer expansion platform 51, and accurately transferring them to the material boxes within the wafer infeed module 3. This classified unloading and recycling design avoids the risk of finished products mixing with empty wafer rings. The parallel unloading and recycling actions of the wafer ring infeed module 2 and the wafer infeed module 3, together with the parallel loading in step one, form a complete closed loop, significantly improving the overall operating efficiency of the equipment. At the same time, the automatic storage of the material boxes can directly connect to subsequent testing or packaging processes, improving the continuity of the production line and adapting to the needs of large-scale mass production. The entire unloading process is completed by the grabbing and suction actions of the material box pick-up and drop gripper 1 24 and the material box pick-up and drop gripper 2 34, which reduces product contamination and damage caused by manual contact and ensures the quality stability of finished wafers. At the same time, the orderly recycling of empty wafer rings can realize resource reuse and reduce production costs.

[0043] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0044] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

[0045] The present invention and its embodiments have been described above. This description is not restrictive, and the accompanying drawings are only one embodiment of the present invention; the actual structure is not limited thereto. In conclusion, if those skilled in the art are inspired by this description and design similar structures and embodiments without departing from the spirit of the invention, such designs should fall within the protection scope of the present invention.

Claims

1. A fully automated integrated circuit film expansion device, characterized in that: The machine includes a main body, an automatic loading and unloading module (1) is provided around the main body, an automatic core removal module (4) is provided inside the main body, an inverted die expansion module (5) is provided on one side of the automatic core removal module (4), and an automatic film transfer module (6) is provided above the inverted die expansion module (5).

2. The fully automatic integrated circuit film expansion device according to claim 1, characterized in that: The automatic loading and unloading module (1) includes a wafer ring loading and unloading module (2) and a wafer loading and unloading module (3). The wafer loading and unloading module (3) is located on one side of the wafer ring loading and unloading module (2). The wafer ring loading and unloading module (2) includes a cassette loading and unloading platform (21). One end of the cassette loading and unloading platform (21) is provided with a cassette pick-and-place gripper (22). The cassette pick-and-place gripper (22) is slidably connected to the main body of the machine. The cassette pick-and-place gripper (22) is provided with a track (23) on the side of the cassette pick-and-place gripper (22) close to the cassette loading and unloading platform (21). The track (23) is provided with a cassette pick-and-place handle (24) on the side of the track (23) away from the cassette loading and unloading platform (21). The wafer loading and unloading module (3) includes a second loading and unloading platform (31), which is located on one side of the first loading and unloading platform (21). A second loading and unloading claw (32) is provided at one end of the second loading and unloading platform (31). The second loading and unloading claw (32) is slidably connected to the main body of the machine. A second track (33) is provided on the side of the second loading and unloading claw (32) close to the second loading and unloading platform (31). A second loading and unloading gripper (34) is provided on the side of the second track (33) away from the second loading and unloading platform (31).

3. The fully automatic integrated circuit film expansion device according to claim 1, characterized in that: The automatic film transfer module (6) includes a heating plate (63), which is located between the automatic film core removal module (4) and the inverted crystal expansion module (5). An annular UV film bonding and reinforcement device (62) is provided on one side of the heating plate (63). The annular UV film bonding and reinforcement device (62) is located above the crystal expansion platform (51). A suction cup (61) is provided on the annular UV film bonding and reinforcement device (62). A spring is provided between the annular UV film bonding and reinforcement device (62) and the suction cup (61).

4. The fully automatic integrated circuit film expansion device according to claim 1, characterized in that: The automatic core removal module (4) includes a core removal platform (41), which is located on one side of the material box pick-and-place gripper (24). A circumferential blade (42) is located above the core removal platform (41), which is slidably connected to the machine body. A die expansion pick-and-place gripper (43) is located above the circumferential blade (42).

5. The fully automatic integrated circuit film expansion device according to claim 1, characterized in that: The inverted die expansion module (5) includes a die expansion platform (51), which is located inside the material box pick-and-place gripper (34). Springs are provided at both ends of the die expansion platform (51), a wafer ring fixing mechanism (52) is provided above the die expansion platform (51), and a circumferential cutter (53) is provided on one side of the die expansion platform (51).

6. A fully automated integrated circuit film expansion method using the apparatus described in any one of claims 1 to 5, characterized in that: The expansion method of the fully automated integrated circuit expansion device includes the following steps: Step 1: The automatic loading and unloading module (1) transports the wafer ring with the wafer to the automatic wafer removal module (4). Step 2: The automatic core stripping module (4) automatically peels off the central support layer of the original film on the wafer ring; Step 3: After the automatic loading and unloading module (1) transports the wafer ring to the inverted die expansion module (5), the inverted die expansion module (5) flips the wafer and performs a film expansion operation. Step 4: The automatic loading and unloading module (1) transports the wafer to the automatic transfer module (6) and performs a transfer bonding operation on the wafer; Step 5: The automatic loading and unloading module (1) moves the wafer to the unloading station.

7. The film expansion method according to claim 6, characterized in that: In step one, the first material box pick-up gripper (24) picks up the wafer ring with the wafer and transfers the wafer from the wafer removal platform (41) to the first track (23). The first material box pick-up gripper (22) pushes the wafer into the material box in the wafer ring inlet / outlet module (2). At the same time, the second material box pick-up gripper (34) picks up the empty wafer ring that has had the wafer removed from the wafer expansion platform (51), places the empty wafer ring on the second track (33), and then pushes the empty wafer ring into the material box in the wafer inlet / outlet module (3).

8. The film expansion method according to claim 6, characterized in that: In step five, the cassette loaded with the empty film wafer ring is placed on the cassette loading and unloading platform one (21). The cassette pick-and-place gripper one (22) picks up the empty film wafer ring and transfers it to the track one (23). The cassette pick-and-place handle one (24) picks up the empty film wafer ring on the track one (23) and places it on the core removal platform (41) in preparation for the core removal operation. At the same time, the cassette loaded with the diced wafer is placed on the cassette loading and unloading platform two (31). The cassette pick-and-place gripper two (32) picks up the diced wafer and transfers it to the track two (33). The cassette pick-and-place handle one (24) then picks up the diced wafer on the track two (33) and places it on the inverted expansion platform (51).

9. The film expansion method according to claim 6, characterized in that: In step three, after the cut wafer is placed on the expansion platform (51) by the wafer ring fixing mechanism (52), the inverted expansion module (5) flips downward. After the flipping action is completed, the expansion platform (51) presses down and forms a reverse force with the wafer ring fixing mechanism (52), applying downward pressure from the UV film on the back of the wafer to perform the UV film expansion action. When the UV film deforms and expands, it drives the grains on the wafer to expand outward synchronously, so that the grains form a gap and the gap is uniform, thus completing the expansion action. After the expansion is completed, the inverted expansion module (5) flips upward. After the flipping action is completed, the circumferential blade (53) extends and cuts and removes the wrinkled part of the UV film, removing the wrinkled part of the wafer and the UV film, and retaining the intermediate wafer body after the expansion process.

10. The film expansion method according to claim 6, characterized in that: In step four, the circumferential blade (53) automatically removes the UV film wrinkles and wafer rings caused by the film expansion on the outer periphery of the wafer. The suction cup (61) picks up the wafer ring with the removed film core and places it on the expansion platform (51) and performs a pressing action, so that the wafer with the expanded film core and the removed wafer ring and UV film wrinkles are bonded to the wafer ring with the removed film core. After the bonding is completed, the suction cup (61) is lifted and the wafer and wafer ring bonded together are automatically transferred to the heating plate (63) for reinforcement bonding.

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