High-precision wafer pre-pressing bonding mechanism

Abstract

This invention relates to the field of semiconductor manufacturing and advanced packaging equipment, specifically disclosing a high-precision wafer pre-compression bonding mechanism, including a support system, a chuck ring system, a pressure system, a spacer system, a wafer positioning and clamping system, a chuck motion system, and a pin lifting system. Through the coordinated operation of these systems, the invention sequentially completes wafer adsorption, rotation and circumferential alignment, precise center positioning in the horizontal plane, the formation of a uniform initial gap using a retractable spacer, and the concentric stacking of upper and lower wafers within an integrated mechanism. Finally, a pressure system with closed-loop pressure control applies precise pre-compression. This mechanism achieves integration and automation of the wafer alignment and pre-compression processes, solving the problems of positioning accuracy loss and uneven pressure control caused by process fragmentation in traditional methods, and enabling the formation of a stable and reliable temporary bonding interface.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor manufacturing and advanced packaging equipment, specifically a high-precision wafer pre-bonding mechanism. Background Technology

[0002] Wafer bonding technology is one of the core processes in modern semiconductor manufacturing and advanced packaging. It permanently or temporarily bonds two or more wafers together under specific conditions, providing a key technological approach for achieving three-dimensional integration, manufacturing microelectromechanical systems (MEMS), and heterogeneous integration of various functional devices. This process not only requires extremely high bonding strength and reliability at the bonding interface, but also demands precise alignment of the upper and lower wafers at the micrometer or even submicrometer level before bonding. Furthermore, it requires applying uniform and controllable pre-pressure during the initial contact stage to form a defect-free and slip-free initial bonding interface, laying a solid foundation for subsequent permanent bonding or processing.

[0003] Currently, the industry often uses separate, independent equipment or modules for wafer pre-alignment and initial bonding. A typical process includes: first, using an optical alignment system to match patterns and adjust positions between wafers; then, transferring them via mechanical clamping or vacuum adsorption; and finally, completing contact and pressurization within the bonding machine. However, this traditional method has a significant drawback: the precise wafer alignment and initial pre-pressurization processes are separated in space and time, lacking integrated collaborative control. Specifically, after alignment, the wafer may experience slight displacement during transfer to the pressurization station, leading to a loss of alignment accuracy. Simultaneously, the application of initial pre-pressure often relies on simple mechanical pressing, lacking real-time, precise force monitoring and feedback adjustment. This makes it difficult to ensure the uniformity and stability of pressure across the entire wafer contact surface, easily causing localized stress concentration or poor contact, thus introducing defects such as microbubbles and interface slippage, directly affecting the final bonding quality and product yield. Summary of the Invention

[0004] To address the aforementioned technical problems, this invention provides a high-precision wafer pre-compression bonding mechanism, which solves the problems in the prior art where wafer alignment and positioning are disconnected from the initial pre-compression process, resulting in poor coordination, easy loss of positioning accuracy, and uneven and inaccurate application of pre-compression force.

[0005] This invention provides a high-precision wafer pre-bonding mechanism, comprising:

[0006] The support system forms the mounting base for the entire mechanism;

[0007] The suction cup ring system is fixedly installed at the center above the support system to support and initially position the wafer;

[0008] A pressure system is fixedly installed on the upper part of the support system and located directly above the suction cup ring frame system, for providing controllable pre-compression bonding force;

[0009] The spacer system has multiple sets, which are uniformly fixedly installed along the circumferential direction on the upper edge of the suction cup ring system, and are used to extend during wafer placement to provide support and form an initial gap;

[0010] A wafer positioning and clamping system is fixedly installed on the upper edge of the chuck ring system and is used to push the wafer toward the positioning part on the chuck ring system and clamp it.

[0011] A suction cup motion system is fixedly installed at the bottom of the support system for adsorbing, lifting, and rotating wafers;

[0012] The ejector pin lifting system is fixedly installed on the suction cup motion system and is used to lift and support the wafer during the loading and unloading process.

[0013] Preferably, the suction cup motion system includes a suction cup, a guide rail, a hollow shaft motor, a linear slider, a motor mounting base, and a lifting drive unit;

[0014] The guide rail frame is fixedly installed on the support system;

[0015] The linear slider is slidably mounted on the guide rail of the guide rail frame;

[0016] The motor mounting base is fixedly connected to the linear slider;

[0017] The hollow shaft motor is fixedly mounted on the motor mounting base, and its output shaft is set vertically upward;

[0018] The suction cup is fixedly installed at the end of the output shaft of the hollow shaft motor;

[0019] The lifting drive unit is connected to the motor mounting base and is used to drive the motor mounting base to move up and down along the guide rail frame.

[0020] Preferably, the spacer system includes a first micro finger cylinder, a first connecting plate, a first micro guide rail pair, a spacer mounting base, and a spacer;

[0021] The first connecting plate is fixedly installed on the suction cup ring frame system;

[0022] The guide rail of the first miniature guide rail pair is fixedly mounted on the first connecting plate;

[0023] The spacer mounting base is fixedly mounted on the slider of the first micro guide rail pair;

[0024] The spacer is fixedly mounted on the spacer mounting base;

[0025] The cylinder body of the first miniature finger cylinder is fixedly mounted on the suction cup ring system, and its piston rod is connected to the spacer mounting base to drive the spacer to extend or retract horizontally along the first miniature guide rail pair.

[0026] Preferably, the wafer positioning and clamping system includes a second micro finger cylinder, a second connecting plate, a second micro guide rail pair, a clamping block fixing seat, and a clamping block;

[0027] The second connecting plate is fixedly installed on the suction cup ring frame system;

[0028] The guide rail of the second miniature guide rail pair is fixedly mounted on the second connecting plate;

[0029] The clamping block fixing seat is fixedly installed on the slider of the second micro guide rail pair;

[0030] The clamping block is fixedly installed on the clamping block fixing seat;

[0031] The cylinder body of the second miniature finger cylinder is fixedly mounted on the suction cup ring frame system, and its piston rod is connected to the clamping block fixing seat to drive the clamping block to extend or retract horizontally along the second miniature guide rail pair.

[0032] Preferably, the pressure system includes a first cylinder, a pressure plate, and a pressure sensor;

[0033] The cylinder body of the first cylinder is fixedly installed, and its piston rod is set downward;

[0034] The pressure sensor is connected to the end of the piston rod of the first cylinder;

[0035] The pressure plate is connected to the bottom of the pressure sensor and is used to contact and press the wafer together.

[0036] Preferably, the pressure system further includes a support frame and a cylinder connecting plate;

[0037] The support frame is fixedly installed on the support system;

[0038] The cylinder connecting plate is fixedly installed on the support frame;

[0039] The cylinder body of the first cylinder is fixedly mounted on the cylinder connecting plate.

[0040] Preferably, the pressure system further includes a NOTCH detection sensor, which is mounted on the outer edge of the cylinder connecting plate via an adjustment assembly, for detecting the notch position of the wafer during rotation.

[0041] Preferably, the suction cup ring system includes an annular suction cup ring and at least two radial positioning pins fixed to the inner side of the suction cup ring.

[0042] Preferably, the ejector pin lifting system includes a slide cylinder, an ejector pin frame, and multiple ejector pins;

[0043] The slide cylinder is fixedly mounted on the guide rail of the suction cup motion system;

[0044] The ejector pin frame is fixedly connected to the movable slide of the slide cylinder;

[0045] The ejector pin is fixedly mounted on the ejector pin holder in a vertical direction;

[0046] The suction cup has a through hole corresponding to the position of the ejector pin.

[0047] Preferably, the lifting drive unit is a second cylinder, the cylinder body of the second cylinder is fixedly installed at the bottom of the guide rail frame by a cylinder fixing bracket, and its piston rod is connected to the motor fixing seat.

[0048] Compared with the prior art, the present invention has the following beneficial effects:

[0049] By driving the wafer rotation through a suction cup motion system and combining it with a pressure system integrated with positioning detection, precise alignment of the wafer's circumferential angle is achieved.

[0050] By cooperating with the positioning part on the wafer positioning clamping system and the chuck ring system, precise center positioning of the wafer in the horizontal plane is achieved;

[0051] The spacer system, which allows for precise control of extension and retraction, provides a uniform initial gap for the stacking of upper and lower wafers, creating conditions for smooth contact in the future.

[0052] Ultimately, by integrating a pressure system with pressure sensing and feedback control, a controllable and uniform pre-pressure can be applied to the aligned and stacked wafers. Attached Figure Description

[0053] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0054] Figure 2 This is a two-dimensional schematic diagram of the present invention;

[0055] Figure 3 This is an exploded structural diagram of the present invention;

[0056] Figure 4 This is a schematic diagram of the support system of the present invention;

[0057] Figure 5This is a schematic diagram of the pressure system of the present invention;

[0058] Figure 6 This is a two-dimensional schematic diagram of the pressure system of the present invention;

[0059] Figure 7 This is a schematic diagram of the suction cup ring frame system of the present invention;

[0060] Figure 8 This is a schematic diagram of the spacer system of the present invention;

[0061] Figure 9 This is a schematic diagram of the wafer positioning and clamping system of the present invention;

[0062] Figure 10 This is a schematic diagram of the suction cup motion system of the present invention;

[0063] Figure 11 This is a two-dimensional schematic diagram of the suction cup motion system of the present invention;

[0064] Figure 12 This is an exploded structural diagram of the suction cup motion system of the present invention;

[0065] Figure 13 This is a schematic diagram of the pin lifting system of the present invention;

[0066] Figure 14 This is a schematic diagram of the wafer (with NOTCH port) of the present invention;

[0067] Figure 15 This is a schematic diagram of the wafer substrate of the present invention;

[0068] Figure 16 This is a schematic diagram of the state of the mechanical finger transporting the wafer according to the present invention;

[0069] Figure 17 This is a schematic diagram of the state of the mechanical finger transporting the wafer substrate according to the present invention;

[0070] Figure 18 This is a schematic diagram of the working state of the spacer of the present invention;

[0071] Figure 19 This is a schematic diagram showing the placement of the wafer substrate according to the present invention.

[0072] In the diagram: 1. Support system; 11. Upper plate of support frame; 12. Side plate of support frame; 2. Pressure system; 21. First cylinder; 22. NOTCH sensor mount; 23. NOTCH sensor adjustment plate; 24. NOTCH sensor; 25. Cylinder connecting plate; 26. Support frame; 27. Pressure plate; 28. Pressure sensor; 29. ​​First cylinder stroke adjustment screw; 3. Suction cup ring frame system; 31. Wafer radial positioning pin; 32. Suction cup ring frame; 4. Spacer system; 41. Spacer; 42. Spacer mounting base; 43. First micro guide rail 44. First connecting plate; 45. First micro finger cylinder; 5. Wafer positioning and clamping system; 51. Clamping block; 52. Clamping block fixing seat; 53. Second micro guide rail pair; 54. Second connecting plate; 55. Second micro finger cylinder; 6. Suction cup motion system; 61. Suction cup; 62. Guide rail frame; 63. Hollow shaft motor; 64. Linear slider; 65. Motor fixing seat; 66. Vacuum seat; 67. Vacuum joint; 68. Cylinder fixing frame; 69. Second cylinder stroke adjusting screw; 610. Second cylinder; 7. Ejector pin lifting system; 71. Ejector pin; 72. Ejector pin frame; 73. Slide table cylinder. Detailed Implementation

[0073] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0074] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this invention, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0075] This invention provides a high-precision wafer pre-pressure bonding mechanism for aligning two wafers with high precision and applying controllable initial pre-pressure before the wafer bonding process, so as to form a stable and reliable temporary bonding interface.

[0076] Example 1: Please refer to Figures 1 to 3 The high-precision wafer pre-compression bonding mechanism in this embodiment mainly consists of seven parts: support system 1, pressure system 2, chuck ring system 3, spacer system 4, wafer positioning and clamping system 5, chuck motion system 6, and ejector pin lifting system 7.

[0077] The connections and location relationships between the systems are as follows:

[0078] The support system 1 constitutes the mounting base for the entire mechanism.

[0079] The suction cup ring system 3 is fixedly installed at the center position above the support system 1.

[0080] The pressure system 2 is fixedly installed on the upper part of the support system 1 and is located directly above the suction cup ring frame system 3.

[0081] Four sets of the spacer system 4 are evenly fixedly installed along the circumferential direction on the upper edge of the suction cup ring frame system 3.

[0082] The wafer positioning and clamping system 5 is also fixedly installed on the upper edge of the suction cup ring system 3.

[0083] The suction cup motion system 6 is fixedly installed at the bottom of the support system 1.

[0084] The ejector pin lifting system 7 is fixedly installed on the guide rail frame 62 of the suction cup motion system 6, and is used to lift and support the wafer during the loading and unloading process to realize the transfer of the wafer between the robot and the suction cup.

[0085] One specific embodiment of the support system 1 of the present invention:

[0086] See Figure 4 The support system 1 mainly includes an upper support plate 11 and a side support plate 12. The upper support plate 11 is a horizontally set rigid plate, which provides a stable support plane for the subsequent descent of the suction cup 61, ensuring that the wafer does not shift during the pre-pressing process.

[0087] One specific embodiment of the pressure system 2 of the present invention:

[0088] See Figure 5 and Figure 6 The pressure system 2 is used to provide precise and controllable pre-bonding pressure; the system includes a first cylinder 21, a NOTCH sensor seat 22, a NOTCH sensor adjustment plate 23, a NOTCH sensor 24, a cylinder connecting plate 25, a support frame 26, a pressure plate 27, a pressure sensor 28, and a first cylinder stroke adjustment screw 29.

[0089] The support frame 26 is fixedly installed on the support system 1, forming the main load-bearing and installation frame of the pressure system 2; the cylinder connecting plate 25 is fixedly installed on the support frame 26; the cylinder body (rear end) of the first cylinder 21 is fixedly installed on the cylinder connecting plate 25, and its piston rod (front end) penetrates vertically downward through the cylinder connecting plate 25; the end of the piston rod of the first cylinder 21 is connected to the top of the pressure sensor 28, and the bottom of the pressure sensor 28 is connected to the pressure plate 27;

[0090] The pressure plate 27 is used to directly contact and press the wafer. Its diameter is designed to be smaller than that of the wafer to be bonded to ensure that it will not interfere with the surrounding wafer positioning and clamping system 5 and other components that are already in place during the pressing process. The pressure sensor 28 is used to detect the actual pressure value that the first cylinder 21 transmits through the piston rod and finally applies to the wafer in real time and accurately, and feeds the signal back to the control system of the equipment to form a pressure closed-loop control, thereby realizing the precise adjustment and stable maintenance of the pre-pressing bonding pressure.

[0091] The NOTCH sensor mount 22 is fixed to the outer edge of the cylinder connecting plate 25; the NOTCH sensor adjustment plate 23 is fixedly mounted on the NOTCH sensor mount 22, and has an elongated hole for position adjustment. The NOTCH sensor 24 is fixedly mounted on the outside of the NOTCH sensor adjustment plate 23. The position of the NOTCH sensor 24 in the horizontal direction can be finely adjusted using the adjustment plate 23 to ensure accurate capture of the V-notch position of the rotating wafer, thereby achieving precise positioning of the wafer's circumferential angle.

[0092] The first cylinder stroke adjusting screw 29 is installed on the piston rod of the first cylinder 21 to mechanically limit and fine-tune the extension length of the piston rod, thereby finally limiting and calibrating the downward stroke of the pressure plate 27.

[0093] Through the coordinated operation of the above components, the pressure system 2 not only provides controllable downward pressure, but also integrates wafer circumferential positioning detection function, realizing the integration of pressing and alignment detection.

[0094] A specific embodiment of the suction cup ring frame system 3 of the present invention:

[0095] See Figure 7 The suction cup ring system 3 is used to carry and initially position the wafer; it includes an annular suction cup ring 32 and two wafer radial positioning pins 31; the two positioning pins 31 are fixed on the inner circumference of the suction cup ring 32, and the central angle between them is 120°; this design allows the wafer edge to stably contact the two positioning pins 31 when subjected to radial thrust, thereby achieving precise center positioning.

[0096] A specific embodiment of the spacer system 4 of the present invention:

[0097] See Figure 8 In this embodiment, four identical spacer systems 4 are evenly distributed around the suction cup ring frame 32.

[0098] Each spacer system 4 includes a spacer 41, a spacer mounting base 42, a first micro guide rail pair 43, a first connecting plate 44, and a first micro finger cylinder 45.

[0099] The first connecting plate 44 is fixedly mounted on the suction cup ring frame 32 by screws, serving as the mounting base for the entire mechanism; the guide rail portion of the first micro guide rail pair 43 is fixedly mounted on the first connecting plate 44; the spacer mounting base 42 is fixedly mounted on the slider of the first micro guide rail pair 43, thereby allowing precise sliding along the guide rail; the spacer 41 is fixedly mounted on the spacer mounting base 42, and its top is used to directly contact and support the wafer substrate.

[0100] The cylinder body of the first micro finger cylinder 45 is fixedly mounted on the suction cup ring frame 32, and the end of its piston rod is fixedly connected to the spacer mounting base 42. When the first micro finger cylinder 45 is activated, its piston rod drives the spacer mounting base 42, which in turn drives the spacer 41 fixed thereon to extend horizontally or retract in the opposite direction along the first micro guide rail pair 43 toward the wafer center.

[0101] The function of the spacer system 4 is to provide stable temporary support for the upper wafer (substrate) when it is placed; by precisely controlling its extension position, it can ensure that a small, uniform initial gap (e.g., 0.1 mm) is maintained between the upper wafer substrate and the lower wafer that has been positioned below, creating ideal alignment and contact conditions for subsequent pre-bonding.

[0102] One specific embodiment of the wafer positioning and clamping system 5 of the present invention:

[0103] See Figure 9 The wafer positioning and clamping system 5 is used to push the wafer toward the positioning pin and clamp it. It includes a clamping block 51, a clamping block fixing seat 52, a second micro guide rail pair 53, a second connecting plate 54, and a second micro finger cylinder 55.

[0104] The second connecting plate 54 is fixedly mounted on the suction cup ring frame 32 by screws, serving as the mounting base for the clamping system. The guide rail portion of the second micro guide rail pair 53 is fixedly mounted on the second connecting plate 54; the clamping block fixing seat 52 is fixedly mounted on the slider of the second micro guide rail pair 53, thereby enabling precise linear reciprocating motion along the guide rail; the clamping block 51 is fixedly mounted on the clamping block fixing seat 52, and its working surface is used to contact and push the wafer edge.

[0105] The cylinder body of the second micro finger cylinder 55 is fixedly mounted on the suction cup ring frame 32, and the end of its piston rod is fixedly connected to the clamping block fixing seat 52. When the second micro finger cylinder 55 is activated, its piston rod drives the clamping block fixing seat 52, which in turn drives the clamping block 51 fixed thereon to extend horizontally or retract in the opposite direction along the second micro guide rail pair 53 toward the wafer center.

[0106] When the clamping block 51 extends forward, its working surface pushes and presses the outer edge of the wafer against the two radial positioning pins 31, achieving precise circumferential positioning and clamping of the wafer; when the clamping block 51 retracts, the wafer is released; this clamping system, together with the positioning pins, achieves high-precision positioning of the wafer in the horizontal plane.

[0107] One specific embodiment of the suction cup motion system 6 of the present invention:

[0108] See Figures 10 to 12 The suction cup motion system 6 is the core of realizing wafer adsorption, vertical lifting and rotation.

[0109] The system includes a suction cup 61, a guide rail frame 62, a hollow shaft motor 63, a linear slider 64, a motor mounting base 65, a vacuum seat 66, a vacuum joint 67, a cylinder mounting bracket 68, a second cylinder stroke adjusting screw 69, and a second cylinder 610.

[0110] The guide rail frame 62 is fixedly installed at the bottom of the support frame upper plate 11 of the support system 1, forming the installation foundation and load-bearing frame of the entire motion system; the linear slider 64 is slidably installed on the guide rail of the guide rail frame 62, forming a linear guide rail pair; the motor mounting base 65 is fixedly connected to the linear slider 64. Through this connection, the linear slider 64 provides precise vertical guidance for the motor mounting base 65, enabling it to make stable vertical lifting and lowering movements along the guide rail frame 62.

[0111] The hollow shaft motor 63 is fixedly mounted on the motor mounting base 65; the suction cup 61 is fixedly mounted on the output shaft end of the upper end of the hollow shaft motor 63, and the hollow shaft motor 63 can drive the suction cup 61 and the wafer vacuum-adsorbed by it to rotate.

[0112] The second cylinder 610 serves as the lifting drive source, and its cylinder body is fixedly mounted on the bottom of the guide rail frame 62 via the cylinder mounting bracket 68. The piston rod of the second cylinder 610 extends upward and is connected to the motor mounting base 65. When the second cylinder 610 is working, its piston rod drives the motor mounting base 65, thereby driving the hollow shaft motor 63 and suction cup 61 mounted thereon to perform vertical lifting and lowering movements along the guide rail of the guide rail frame 62. The second cylinder stroke adjustment screw 69 is installed at the corresponding position of the piston rod or cylinder body of the second cylinder 610 for mechanical fine-tuning and limiting the lifting stroke.

[0113] The vacuum seat 66 is fixedly installed at the bottom of the hollow shaft motor 63 and communicates with the hollow shaft of the motor to form a vacuum passage; the vacuum joint 67 is installed at the bottom of the vacuum seat 66 and is used to connect to the external vacuum pipeline; when the external vacuum system is working, the vacuum is transmitted to the suction cup 61 through the vacuum joint 67, the vacuum seat 66 and the hollow shaft of the hollow shaft motor 63, so that a negative pressure is generated on the surface of the suction cup 61, thereby adsorbing the back side of the wafer; when the vacuum is released, the wafer is released.

[0114] Through the coordinated work of the above components, the suction cup motion system 6 integrates the functions of vacuum adsorption, precision lifting and rotation of wafers, and is a key module for realizing wafer transfer, alignment and positioning.

[0115] One specific embodiment of the pin lifting system 7 of the present invention:

[0116] See Figure 13 The ejector pin lifting system 7 is used to support the wafer during loading and unloading; it includes four ejector pins 71, an ejector pin holder 72, and a slide cylinder 73.

[0117] The slide cylinder 73 is fixedly installed on the guide rail frame 62 of the suction cup motion system 6. The ejector pin frame 72 is fixedly connected to the movable slide of the slide cylinder 73. The four ejector pins 71 are fixedly installed on the ejector pin frame 72 in the vertical direction and rise and fall synchronously with the ejector pin frame 72.

[0118] The suction cup 61 has a through hole corresponding to the position of the ejector pin 71. When the slide cylinder 73 drives the ejector pin holder 72 and ejector pin 71 to rise to the high position, the ejector pin 71 extends upward through the through hole on the suction cup 61, so that it can pick up and support the wafer placed above the suction cup from the robot arm. When the slide cylinder 73 drives the ejector pin 71 to descend to the low position, the ejector pin 71 retracts to below the through hole of the suction cup 61, so that the wafer is smoothly transferred to the suction cup 61, and space is made for the suction cup to pick up the wafer and for the subsequent pre-bonding process.

[0119] Through the above structure, the ejector pin lifting system 7 realizes the function of smooth wafer handover and position conversion.

[0120] Example 2: Based on the above structure, the pre-compression bonding process of this embodiment of the invention is carried out according to the following steps:

[0121] a. Wafer loading and precision positioning:

[0122] The slide cylinder 73 of the ejector lifting system 7 drives the four ejector pins 71 to rise to the high position.

[0123] An external robotic arm places the lower wafer (with a NOTCH port) onto four ejector pins 71, and then the robotic arm moves away.

[0124] The second cylinder 610 of the suction cup motion system 6 drives the suction cup 61 to rise, so that the upper surface of the suction cup 61 contacts the back side of the lower wafer, and starts a vacuum to adsorb it.

[0125] The slide cylinder 73 drives the ejector pin 71 to descend to the low position, disengaging from the support of the lower wafer.

[0126] The hollow shaft motor 63 starts, driving the lower wafer adsorbed on the suction cup 61 to rotate.

[0127] The NOTCH detection sensor 24 in the pressure system 2 detects in real time. When the NOTCH port of the lower wafer is rotated to the preset direction of the clamping block 51 of the wafer positioning clamping system 5, the hollow shaft motor 63 stops, completing the circumferential angle positioning of the lower wafer.

[0128] The second cylinder 610 drives the suction cup 61 to descend, so that the lower surface of the suction cup 61 rests stably on the upper plate 11 of the support frame of the support system 1.

[0129] The suction cup 61 briefly breaks the vacuum, releasing the adsorption on the lower wafer.

[0130] The second micro finger cylinder 55 of the wafer positioning and clamping system 5 drives the clamping block 51 to extend forward along the second micro guide rail pair 53, pushing and pressing the outer edge of the lower wafer against the two radial positioning pins 31 of the chuck ring system 3, thereby achieving precise circumferential positioning of the lower wafer.

[0131] The suction cup 61 restarts the vacuum and re-adsorbs and fixes the wafer.

[0132] The second miniature finger cylinder 55 drives the clamping block 51 to retract along the second miniature guide rail pair 53.

[0133] b. Wafer (substrate) loading and pre-bonding:

[0134] like Figure 18The first micro finger cylinders 45 of the four spacer systems 4 synchronously drive their respective spacers 41 to extend horizontally along the first micro guide rail pair 43 toward the center of the wafer, so that a uniform gap of about 0.1 mm is formed between the bottom surface of the spacer 41 and the upper surface of the positioned lower wafer.

[0135] like Figure 17 and 19 External robotic arms (such as) Figure 16 The schematic diagram of the mechanical finger transporting the wafer is shown. The wafer substrate (its structural features can be found in [reference]) is then placed on the substrate. Figure 15 (Diagram of wafer substrate) is placed on four protruding spacer41s.

[0136] Clamp 51 extends forward again, pushing and pressing the outer edge of the upper wafer substrate against and onto the same set of radial positioning pins 31, thus achieving connection between the upper wafer substrate and the lower wafer (its feature with a NOTCH port can be found in [reference]). Figure 14 Concentric alignment (wafer schematic diagram).

[0137] The first cylinder 21 of the pressure system 2 drives the pressure plate 27 to descend until the bottom surface of the pressure plate 27 lightly touches the upper surface of the wafer substrate.

[0138] The first micro-finger cylinder 45 drives the four sets of spacers 41 to retract synchronously, while the second micro-finger cylinder 55 drives the clamping block 51 to retract again.

[0139] The pressure plate 27 continues to descend under the drive of the first cylinder 21. Based on the feedback from the pressure sensor 28, it applies a set precision pressure to the stacked upper and lower wafers to complete the pre-pressure bonding process and form a stable and reliable initial bonding interface.

[0140] The embodiments of the present invention are given for the purposes of illustration and description. Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Any changes, modifications, substitutions and variations made by those skilled in the art to the above embodiments within the scope of the present invention should be included within the protection scope of the present invention.

Claims

1. A high-precision wafer pre-bonding mechanism, characterized in that, include: The support system (1) forms the mounting base for the entire mechanism; The suction cup ring system (3) is fixedly installed at the center above the support system (1) to support and initially position the wafer; The pressure system (2) is fixedly installed on the upper part of the support system (1) and located directly above the suction cup ring frame system (3) to provide a controllable pre-compression bonding force; The spacer system (4) is provided in multiple sets and is uniformly fixedly installed on the upper edge of the suction cup ring system (3) along the circumferential direction, for extending to provide support and form an initial gap when the upper wafer is placed; The wafer positioning and clamping system (5) is fixedly installed on the upper edge of the suction cup ring system (3) and is used to push the wafer toward the positioning part on the suction cup ring system (3) and clamp it. The suction cup motion system (6) is fixedly installed at the bottom of the support system (1) and is used to adsorb, lift and rotate the wafer; The ejector pin lifting system (7) is fixedly installed on the suction cup motion system (6) and is used to lift and support the wafer during the loading and unloading process.

2. The high-precision wafer pre-bonding mechanism according to claim 1, characterized in that, The suction cup motion system (6) includes a suction cup (61), a guide rail frame (62), a hollow shaft motor (63), a linear slider (64), a motor mounting base (65), and a lifting drive unit; The guide rail frame (62) is fixedly installed on the support system (1); The linear slider (64) is slidably mounted on the guide rail of the guide rail frame (62); The motor mounting base (65) is fixedly connected to the linear slider (64); The hollow shaft motor (63) is fixedly mounted on the motor mounting base (65), and its output shaft is set vertically upward; The suction cup (61) is fixedly installed at the end of the output shaft of the hollow shaft motor (63); The lifting drive unit is connected to the motor mounting base (65) and is used to drive the motor mounting base (65) to move up and down along the guide rail frame (62).

3. The high-precision wafer pre-bonding mechanism according to claim 1, characterized in that, The spacer system (4) includes a first micro finger cylinder (45), a first connecting plate (44), a first micro guide rail pair (43), a spacer mounting base (42), and a spacer (41). The first connecting plate (44) is fixedly installed on the suction cup ring frame system (3); The guide rail of the first miniature guide rail pair (43) is fixedly installed on the first connecting plate (44); The spacer mounting base (42) is fixedly mounted on the slider of the first micro guide rail pair (43); The spacer (41) is fixedly mounted on the spacer mounting base (42); The cylinder body of the first micro finger cylinder (45) is fixedly mounted on the suction cup ring system (3), and its piston rod is connected to the spacer mounting base (42) to drive the spacer (41) to extend or retract horizontally along the first micro guide rail pair (43).

4. The high-precision wafer pre-bonding mechanism according to claim 1, characterized in that, The wafer positioning and clamping system (5) includes a second micro finger cylinder (55), a second connecting plate (54), a second micro guide rail pair (53), a clamping block fixing seat (52), and a clamping block (51). The second connecting plate (54) is fixedly installed on the suction cup ring frame system (3); The guide rail of the second miniature guide rail pair (53) is fixedly mounted on the second connecting plate (54); The clamping block fixing seat (52) is fixedly installed on the slider of the second micro guide rail pair (53); The clamping block (51) is fixedly installed on the clamping block fixing seat (52); The cylinder body of the second micro finger cylinder (55) is fixedly mounted on the suction cup ring frame system (3), and its piston rod is connected to the clamping block fixing seat (52) to drive the clamping block (51) to extend or retract horizontally along the second micro guide rail pair (53).

5. The high-precision wafer pre-bonding mechanism according to claim 1, characterized in that, The pressure system (2) includes a first cylinder (21), a pressure plate (27), and a pressure sensor (28). The cylinder body of the first cylinder (21) is fixedly installed, and its piston rod is set downward; The pressure sensor (28) is connected to the end of the piston rod of the first cylinder (21); The pressure plate (27) is connected to the bottom of the pressure sensor (28) and is used to contact and press the wafer.

6. The high-precision wafer pre-bonding mechanism according to claim 5, characterized in that, The pressure system (2) also includes a support frame (26) and a cylinder connecting plate (25); The support frame (26) is fixedly installed on the support system (1); The cylinder connecting plate (25) is fixedly installed on the support frame (26); The cylinder body of the first cylinder (21) is fixedly mounted on the cylinder connecting plate (25).

7. The high-precision wafer pre-bonding mechanism according to claim 6, characterized in that, The pressure system (2) also includes a NOTCH detection sensor (24), which is mounted on the outer edge of the cylinder connecting plate (25) via an adjustment assembly to detect the notch position of the wafer during rotation.

8. The high-precision wafer pre-bonding mechanism according to claim 1, characterized in that, The suction cup ring system (3) includes an annular suction cup ring (32) and at least two radial positioning pins (31) fixed inside the suction cup ring (32).

9. The high-precision wafer pre-bonding mechanism according to claim 2, characterized in that, The ejector pin lifting system (7) includes a slide cylinder (73), an ejector pin frame (72), and multiple ejector pins (71). The slide cylinder (73) is fixedly installed on the guide rail frame (62) of the suction cup motion system (6); The ejector pin holder (72) is fixedly connected to the movable slide of the slide cylinder (73); The ejector pin (71) is fixedly mounted on the ejector pin holder (72) in the vertical direction; The suction cup (61) is provided with a through hole corresponding to the position of the ejector pin (71).

10. The high-precision wafer pre-bonding mechanism according to claim 2, characterized in that, The lifting drive unit is a second cylinder (610). The cylinder body of the second cylinder (610) is fixedly installed at the bottom of the guide rail frame (62) through a cylinder fixing bracket (68), and its piston rod is connected to the motor fixing seat (65).

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