Cooling element and method of manufacturing a cooling element

Abstract

A cooling element and a method of manufacturing the cooling element are provided. A cooling element for cooling an electronic device is provided. The cooling element includes a first plate having a first surface, a second plate having the first surface and a second surface opposite to the first surface, wherein the second surface is configured to be attached to the electronic device, wherein the first plate and the second plate are attached to each other such that their respective first surfaces face each other, wherein a first structure is arranged between the first plate and the second plate to form a channel between the first plate and the second plate, and two liquid connectors in liquid communication with the channel for connecting the channel to a cooling circuit.

Description

Technical Field

[0001] This disclosure relates to cooling elements for using liquid-cooled electrical devices and methods for manufacturing such cooling elements. Background Technology

[0002] Many electrical devices, especially power semiconductor devices, generate heat during operation. This can cause the device to overheat, and if the heat is not removed by adequate cooling, the device may reach a critical temperature at which it may fail or even catch fire. This problem becomes more severe with increasing power density due to the reduced thermal mass and / or space available for cooling the device.

[0003] Conventional electronic devices are cooled by the convection of a cooling fluid, such as air. By attaching a heat sink to the device, the surface area for transferring heat from the device to the cooling fluid can be increased. Other conventional methods use liquids as the cooling medium. Compared to gaseous cooling fluids, liquids have the advantage of absorbing more heat. Therefore, coolant can remove more heat from the device.

[0004] However, conventional cooling solutions using liquids as the cooling medium are complex and difficult to set up correctly, including developing individually adapted radiators, sealing cooling channels, and pipe connections to enable the pumping of liquid through the cooling loop. Furthermore, conventional solutions are expensive, require significant space, and are not easily adaptable to changes in the electrical system layout.

[0005] One object of this disclosure is to provide an improved cooling element for using liquid-cooled electronic devices and a corresponding method for manufacturing such a cooling element. Summary of the Invention

[0006] According to a first aspect, a cooling element for cooling an electronic device is provided. The cooling element includes a first plate having a first surface; a second plate having the first surface and a second surface opposite to the first surface, wherein the second surface is configured to be attached to the electronic device, wherein the first plate and the second plate are attached to each other such that their respective first surfaces face each other, wherein a first structure is arranged between the first plate and the second plate to form a channel between the first plate and the second plate; and two liquid connectors in liquid communication with the channel, the two liquid connectors being used to connect the channel to a cooling circuit.

[0007] According to a second aspect, a cooling element for cooling an electronic device is provided. The cooling element includes a plate having a first surface and a first structure formed on the first surface; a foil having a first surface and a second surface opposite to the first surface, wherein the second surface is configured to be attached to the electronic device, wherein the plate and the foil are attached to each other such that their respective first surfaces face each other, such that the first structure is arranged between the plate and the foil, such that a channel is formed between the plate and the foil, the channel being defined by the first structure; and two liquid connectors attached to the plate and in liquid communication with the channel for connecting the channel to a cooling circuit.

[0008] According to a third aspect, a method for manufacturing a cooling element for a cooling electrical device is provided. The method includes the steps of: providing a plate having a first surface and a second surface opposite to the first surface and including a first structure extending from the first surface, the first structure including a periodic arrangement of basic unit structures, each basic unit structure including at least one cavity surrounded by a wall, such that a plurality of cavities separated by an intermediate wall are formed at the first surface; selectively removing at least one intermediate wall such that adjacent cavities are connected and form a flow path; providing a cover element having a first surface and a second surface opposite to the first surface; attaching the cover element to the plate such that their respective first surfaces face each other, and the first structure is arranged between the plate and the cover element, and such that the flow path forms a channel configured for flow of coolant; and attaching at least two connectors to the plate and / or the cover element and in liquid communication with the channel for connecting the channel to a cooling circuit.

[0009] According to a fourth aspect, a cooling element for cooling at least two power semiconductor devices is provided. The cooling element includes a first plate configured to be attached to a first power semiconductor device; a second plate configured to be attached to a second power semiconductor device; an intermediate element including a frame and a liquid guiding structure; and a liquid inlet and a liquid outlet disposed in the frame, wherein the first plate is attached to a first side of the intermediate element and the second plate is attached to a second side of the intermediate element, such that a cavity is formed between the first plate, the second plate, and the frame, wherein the liquid guiding structure is disposed in the cavity and forms channels in liquid communication with the liquid inlet and the liquid outlet, allowing coolant to flow through the channels.

[0010] According to a fifth aspect, a method for manufacturing a cooling element for cooling a power semiconductor device is provided. The method includes the steps of: providing a first plate having a first surface; providing a second plate having the first surface and a second surface opposite to the first surface, wherein the second surface is configured to be attached to a power semiconductor device; providing a first structure configured to define a flow path; joining the first plate and the second plate such that their respective first surfaces face each other, wherein the first structure is disposed between the first plate and the second plate such that a channel is formed between the first plate and the second plate; and attaching at least two connectors to the first plate and / or the second plate and in liquid communication with the channel for connecting the channel to a cooling circuit.

[0011] Those skilled in the art will recognize the additional features and advantages upon reading the following detailed description and viewing the accompanying drawings. Attached Figure Description

[0012] This disclosure is illustrated by way of example, not limitation, in the accompanying drawings, in which similar reference numerals denote similar or identical elements. The elements in the drawings need not be proportional to each other. Features of the various illustrated examples can be combined unless they are mutually exclusive.

[0013] Figure 1 A vertical cross-section of a first example of a cooling element is shown.

[0014] Figure 2A and Figure 2B Each shows a horizontal cross-section of a corresponding second example of a cooling element.

[0015] Figure 3 An isometric view of a third example of a cooling element is shown.

[0016] Figure 4 Another isometric view of a third example of a cooling element is shown.

[0017] Figure 5 A vertical cross-section of a fourth example of a cooling element is shown.

[0018] Figure 6 A vertical cross-section of a fifth example of a cooling element is shown.

[0019] Figure 7 A top view of a sixth example of a cooling element is shown.

[0020] Figure 8 A top view of a first example plate of a cooling element is shown before it is processed to provide a flow path.

[0021] Figure 9 A top view of a first example plate of a cooling element after processing to provide a flow path is shown.

[0022] Figure 10 A schematic cross-section of a multi-layered structure is shown.

[0023] Figure 11 A schematic block diagram of a first example method for manufacturing a cooling element is shown.

[0024] Figure 12 A schematic block diagram of a second example method for manufacturing a cooling element is shown.

[0025] Figure 13 A schematic block diagram of a system including a cooling circuit and cooling elements is shown. Detailed Implementation

[0026] The examples described herein provide a cooling element configured to cool attached electronic devices, such as transformer coils, resistors, capacitors, semiconductor devices, etc., via liquid cooling. To this end, the cooling element provides a structure integrating channels for coolant and has a liquid connector communicating with the channels, allowing the channels to be connected to a cooling circuit. By pumping coolant through the channels, heat generated by the electronic devices attached to the cooling element can be removed more effectively from the electronic devices compared to air cooling, allowing the devices to operate under conditions with higher power dissipation without the risk of thermal damage.

[0027] The described example cooling element can be integrated into the cooling circuit of a larger electrical system, such as a power converter or inverter, and is used to cool certain electronic devices within the electrical system. Here, for example, integration into a cooling circuit can mean connecting or attaching the cooling element to the cooling circuit using suitable tubing inserted into a liquid connector provided with the cooling element. Coolant will flow through the cooling channel when a pressure difference exists between the liquid connectors. The cooling rate can depend on, for example, the flow rate of the coolant, the temperature difference between the coolant and the electronic device, and the thermal resistance of the heat conduction path between the electronic device and the channel. Other factors can also affect the cooling rate.

[0028] Figure 1A cross-section of a first implementation of a cooling element 100 for cooling an electronic device according to the present disclosure is shown. The cooling element 100 includes a first plate 110 having a first surface 110A and a second plate 120 having a first surface 120A and a second surface 120B opposite to the first surface 120A, wherein the second surface 120B is configured to be attached to the electronic device. The second plate 120 may include at least one cooling region (not shown) at the second surface 120B, wherein the cooling region is configured to transfer heat from the electronic device in thermal contact with the cooling region to the second surface 120B, such that during operation of the cooling element 100, a coolant flowing at the second surface 120B can absorb heat from and thus remove heat from the electronic device. The first plate 110 and the second plate 120 are attached to each other such that their respective first surfaces 110A and 120A face each other. A first structure 112 is disposed between the first plate 110 and the second plate 120 such that a channel 130 is formed between the first plate 110 and the second plate 120. For example, channel 130 is formed to be leak-proof. Here, leak-proof means that liquid cannot leak from channel 130 to areas outside the cooling element 100. However, some coolant may seep from a first portion of channel 130 into a second, more distant portion of channel 130 without flowing along channel 130. In other words, a small portion of coolant may pass outside channel 130 between the first plate 110, the first structure 112, and the second plate 120, but will not leak out of the cooling element 100. For example, this portion of coolant may be less than 1% or 10% of the liquid flowing through the corresponding channel 130. At the lateral ends of the cooling element 100, the first structure 112 should be configured to seal the cooling element 100 and prevent any liquid from flowing outside the specially designed connecting elements. All coolant is supplied to and discharged from the cooling element 100 via liquid connectors 140. For example, channel 130 may be defined by the first structure 112. Two liquid connectors 140 (e.g., see reference 112) Figure 2A , Figure 2B The channel 130 is configured to be in liquid communication with the channel 130, allowing the channel 130 to be connected to the cooling circuit 510 (see reference 510). Figure 13 "Liquid connectivity" can refer to the ability of liquid to be supplied to or discharged from a channel via a liquid connector.

[0029] Figure 13 A schematic block diagram of a system 500 including a cooling circuit 510 and a cooling element 100 is shown. The cooling element 100 is, for example, a... Figures 1 to 7The cooling circuit 510 may include at least one of a pump, radiator, fan, compressor, thermoelectric element, etc. The cooling circuit 510 is configured to circulate coolant through, for example, a channel 130 connected to the cooling element 100. Additionally, the cooling circuit 510 is configured to cool the coolant whose temperature has increased from the cooling element 100. For example, the cooling circuit 510 and the cooling element are connected via a pipe or conduit connection. Here, pipe 502 is used to supply coolant to the cooling element, and pipe 504 is used to recover the coolant after it has passed through the cooling element 100. In other configurations, more than one cooling element 100 may be present. In this case, the cooling elements may be connected in series (e.g., daisy-chain) and / or in parallel with respect to the cooling circuit 510.

[0030] Figure 2A A top view of a second example of the cooling element 100 is shown, in which a second plate 120 is on top of the cooling element 100. Figure 2A The cooling element 100 may have the same characteristics as the reference. Figure 1 The cooling element described has the same characteristics. Figure 2A In the diagram, the dashed line indicates the first structure 112 disposed below the second plate 120. A channel 130 is formed based on the geometry of the first structure 112. In this example, the channel 130 has a tortuous shape. Two connectors 140 are attached to the cooling element 100 to provide passage from an external cooling circuit (not shown) to the channel 130. Each of the connectors 140 may be provided in the form of a plug or a socket. The connectors may be specifically designed to insert into a corresponding socket or receive a corresponding plug to provide a tight and sealed connection from the channel 130 to the external cooling circuit. In this example, the connectors 140 are disposed in the sidewall of the cooling element 100 (e.g., perpendicular to the extended plane of the first plate 110 and the second plate 120), but other arrangements are also possible. Furthermore, more than two connectors 140 may be provided to provide passage to the channel 130. Additionally, different connectors 140 may have different shapes and / or different sizes.

[0031] In one or more implementations, the first structure 112 may have a geometry (not shown) that forms more than one channel 130, such as two channels. The two or more channels may be separate from each other. In this case, for each of the multiple channels, a corresponding set of at least two connectors 140 (e.g., at least one inlet and one outlet) may be provided. Alternatively or additionally, the multiple channels may have a common portion. Furthermore, the two connectors 140 may be in fluid communication with at least two of the multiple channels 130. Figure 2BThis example is illustrated. Here, two connectors 140 are connected to corresponding common channel portions 131, which provide access to two separate channels 130. Thus, the two separate channels 130 are arranged in parallel to accommodate liquid flow. Optional flow-limiting elements 132 may be provided within one or more channels 130, configured to control the flow rate in each channel 130. For example, the flow-limiting elements 132 may be formed at one or both transition points from the common channel portion 131 to the respective channels 130, or they may be formed within the channels 130.

[0032] In one or more implementations of the cooling element 100, the first structure 112 is integral with the first plate 110 and extends from the first surface 110A of the first plate 110, such as Figure 1 As shown. Here, "integral" means that the first plate 110 and the first structure 112 are a single unit. For example, the first plate 110, which includes the first structure 112, can be formed by injection molding and / or by additive manufacturing methods (e.g., 3D printing) and / or by machining (e.g., milling, drilling, turning, cutting, slicing, etc.). Therefore, connecting the second plate 120 to the first structure 112 can also be understood as connecting the second plate 120 to the first plate 110.

[0033] In one or more implementations of the cooling element 100, the first plate 110 and the second plate 120 extend over the first structure 112 and directly engage at the edges of the cooling element 100 without the intervention of the first structure 112. For example, the first structure 112 is slightly smaller than both the first plate 110 and the second plate 120 (e.g., within a few millimeters to a few centimeters at each lateral edge). At least one of the first plate 110 and the second plate 120 may be bent toward the other plate to provide a direct contact line at the periphery of the cooling element 100. This can have the advantage that only the periphery of the cooling element must be implemented in a leak-proof manner, while connections in other attachment areas (e.g., where the first structure 112A is provided for forming the channel 130) can be implemented in a simpler manner and are therefore less expensive.

[0034] In one or more implementations, the first plate 110 and the first structure 112 may be provided as separate elements and joined by, for example, welding, gluing, or molding. For example, Figure 1 The dashed line 111 in the figure represents the joint between the first plate 110 and the first structure 112.

[0035] In one or more implementations of the cooling element 100, the first plate 110 and the second plate 120 are attached to each other, for example, by welding, gluing or molding.

[0036] In one or more implementations of the cooling element 100, the weld between the first plate 110 and the second plate 120 is formed solely by the materials of the first plate 110 and / or the second plate 120. In these implementations, welding is performed without providing additional materials, such as welding materials or filler materials. In other words, the material of at least one of the first plate 110 and the second plate 120 undergoes the welding process. It should be noted that this does not preclude the use of welding aids, such as shielding gases, that are not part of the weld during the welding process. Here, for example, at least one of the first plate 110 and the second plate 120 comprises a weldable material. The weldable material may include plastic materials, particularly thermoplastic materials, and / or metallic materials.

[0037] The welding process may include heating an arrangement of a first plate 110 and a second plate 120, the arrangement including a first structure 112 between them, and applying pressure to press the plates together. Heating may be performed globally (e.g., including the entire arrangement) and / or locally (e.g., only at selected contact areas between the plates).

[0038] In one or more implementations of the cooling element 100, the first plate 110 and / or the second plate 120 include a functionalized surface region 115, which is specifically functionalized to provide an attachment area for attaching a corresponding other of the first plate 110 or the second plate 120. The functionalized surface region 115 can be functionalized by chemical, physical, and / or mechanical processes. Chemical functionalization can include surface treatment using chemical agents that induce changes in surface structure, and / or can include coating the surface region with functional agents such as polymers. Physical functionalization can include surface treatment using plasma and / or irradiating the surface with electromagnetic radiation (e.g., a laser beam) or particles (e.g., electrons or atomic / molecular sputtering). Mechanical functionalization can include sandblasting, grinding, polishing, etc. Different functionalization processes can, of course, be combined. Functionalization can be selectively applied to the respective surface to provide the functionalized surface region 115. For example, the functionalized surface region 115 can be limited to the contact area between the first plate 110 and the second plate 120. Functionality may be provided only on the first board 110, only on the second board 120, or on both the first board 110 and the second board 120. Alternatively, functionality may be provided in a first region on the first board 110 and in a second region on the second board 120. The functionality of the first board 110 may differ from the functionality of the second board 120.

[0039] In one or more implementations of the cooling element 100, at least one of the first plate 110 and the second plate 120 is made substantially of a plastic or composite material and / or formed in an injection molding process. Here, "substantially made of" means that the body of the corresponding plate is formed of that material, but the corresponding plate may include other elements, such as functionalized surface areas 115, and / or elements that can be used to secure the corresponding plate or cooling element to other elements, and / or elements that can provide mechanical support, etc. For example, a socket or pin may be provided that is made of a different material than the rest of the corresponding plate.

[0040] In one or more implementations of the cooling element 100, the second plate 120 is formed of a multilayer substrate, particularly an insulating metal substrate (IMS), a direct copper bonding (DCB) substrate, an active metal brazing (AMB) substrate, or a printed circuit board (PCB).

[0041] Here, a multilayer substrate means that the substrate comprises multiple layers. The different layers can be made of the same material or different materials. For example, a multilayer substrate can be a stack of multiple layers.

[0042] In one or more implementations of the cooling element 100, the second plate 120 includes a metal layer 122 configured to conduct electrical signals at its second surface 120B (see reference). Figure 5 Electrical signals may include at least one of control signals, measurement signals, or load current.

[0043] In one example, metal layer 122 is configured to conduct electricity from electronic device 200 (see reference). Figure 4 or Figure 7 The load current is controlled by the controller. In this example, the electronic device 200 can be implemented as a power semiconductor transistor, which is controlled by a control signal provided by the controller to provide load current to the electrical load. The metal layer 122 can be electrically connected to a positive or negative power supply node, such as a DC+ or DC- bus.

[0044] In one or more implementations, metal layer 122 is a structured layer having multiple portions. The different portions can be separated from each other. For example, the different portions can be electrically isolated relative to each other. In this case, the different portions can be used to conduct different electrical signals. In one example, a first portion can be used to conduct load current, and a second portion can be used to conduct control signals, etc. In another example, a first portion can be used to conduct a first load current, and a second portion can be used to conduct a second load current. In yet another example, the structured metal layer may include one or more conductive traces that can be used to route one or more electrical signals. In yet another implementation, the different portions can be electrically coupled to each other, the coupling being implemented such that a specific impedance is provided between the different portions. For example, the coupling can provide a specific resistance value, a specific capacitive coupling, or a specific magnetic coupling.

[0045] Figure 3 An isometric view of a third example of the cooling element 100 is shown. In this example, the second surface 120B of the second plate 120 includes a metal layer 122 configured as four separate portions. Each portion of the metal layer 122 can be configured to conduct load current or different electrical signals. Here, the four portions of the metal layer 122 are configured such that they can serve as attachment areas for attaching a corresponding electronic device 200 to be cooled. In particular, as... Figure 4 As shown, the electronic device 200 is implemented as a power semiconductor switch in a package, such as a TO-247 package. This is just one example, and semiconductor devices packaged in other packages, particularly those commonly used in industry, can be used. The back side of the power semiconductor device 200 can be soldered or sintered to a corresponding portion of the metal layer 122 disposed on the second surface 120B of the second plate 120. It should be noted that other methods of attaching the power semiconductor device 200 can also be used, such as screw connections, clamp connections, etc.

[0046] Figure 5 A cross-section of a fourth example of the cooling element 100 is shown. Figure 5 The cooling element 100 may have the same characteristics as the reference. Figure 1The same features are described. Additionally, the first structure 112 includes an additional element 114 that extends from the first surface 110A at the location where the channel 130 is formed when the second plate 120 is attached. The additional element 114 can be selectively disposed in selected locations and can act as a turbulence generator to induce turbulence in the coolant flowing through the channel 130. This can enhance heat transfer to the coolant. Furthermore, the second plate 120 includes a metal layer 122 at its second surface 120B. In this example, the metal layer 122 comprises three portions, each configured for attaching an electronic device 200 (e.g., a power semiconductor or other electronic device requiring cooling). It should be noted that in this example, the portions of the structured metal layer 122 correspond to the arrangement of the turbulence generator 114 in the channel 130. The structured metal layer 122 may also have a relatively high thermal conductivity (e.g., higher than that of the material of the second plate 120), thereby improving heat transfer from the electronic device 200 to the coolant flowing in the channel 130.

[0047] In one or more implementations of the cooling element 100, the second plate 120 includes an insulating material arranged to provide electrical isolation between a first surface 120A and a second surface 120B of the second plate 120.

[0048] This has the advantage that the voltage that can be applied to the metal layer 122 on the second surface 120B of the second plate 120 is isolated from the coolant and therefore also from the cooling circuit. For example, the insulating material can be a polymer, plastic, fiber, ceramic, or glass material. In one or more implementations, the insulating material is formed as a layer of the second plate 120.

[0049] In one or more implementations, the electrical device may be disposed on and / or integrated into one of the first surface 120A and / or the second surface 120B of the second plate 120. For example, the electrical device may be, for instance, a resistor, capacitor, inductor, diode, transistor, transformer, integrated electronic circuit, or any type of sensing element. In one example, the electrical device may be a temperature sensor disposed on the first surface 120A of the second plate 120 and configured to provide a temperature signal indicating the temperature of the cooling liquid in the channel 130. For this purpose, the temperature sensor may be disposed on the second surface 120A to contact the channel 130. The temperature sensor may be connected to a connection terminal disposed on the second surface 120B via a conductive trace (e.g., a through-hole) extending through the body of the second plate 120. In one example, the electrical device is integrated into the second plate 120, meaning it is disposed between the first surface 120A and the second surface 120B. The electrical device may be connected to a terminal on the second surface 120B via a conductive trace extending through the body of the second plate 120.

[0050] Figure 6 A cross-section of a fifth example of the cooling element 100 is shown. In this implementation, a third plate 125 is provided, having a first surface 125A and a second surface 125B opposite to the first surface 125A, wherein the second surface 125B is configured to be attached to the electronic device 200. The third plate 125 is attached to the first plate 110 opposite to the second plate 120, wherein a second structure 112B is arranged between the first plate 110 and the third plate 125, such that another channel 132 is provided between the first plate 110 and the third plate 125.

[0051] In this example, the first plate 110 may have a first structure 112A on its first surface 110A and a second structure 112B on its second surface 110B. The first structure 112A and / or the second structure 112B may be integral with the first plate 110. Another channel 132 is defined by the second structure 112B. Although the channel 130 and the other channel 132 have the same shape in this illustration, this is not necessary. Alternatively, the channel 130 and the other channel 132 may have different shapes and / or geometries and may be specifically adapted based on the electronic device 200 to be cooled at the respective sides of the cooling element 100. The first plate 110 and / or the first structure 112A and / or the second structure 112B may be implemented in the same and / or a single manufacturing process. For example, the first plate 110 including the first structure 110A and the second structure 112B may be formed in a single molding process. Alternatively, the first structure 112A and / or the second structure 112B may be formed as separate elements and then connected to the first plate 110.

[0052] Figure 7 A top view of a sixth example of a cooling element 100 is shown. In this example, the cooling element 100 may have a similar design to... Figure 6 The structure shown depicts a sandwich structure formed by a first plate 110, a second plate 120, and a third plate 125, which has a channel 130 and another channel 132 for cooling the attached electronic device 200. In this example, the electronic device 200 is a power semiconductor transistor, but other implementations are possible. In this example, the respective second surface 120B of the second plate 120 and the respective second surface 125B of the third plate 125 include a metal layer 122. As schematically shown, during operation of the power semiconductor transistor 200, the metal layer 122 can be connected to a bus voltage (in [the specified voltage range]). Figure 7(The symbol is "V"). For example, a power semiconductor transistor 200 may be attached to a cooling element 100, with the drain contacts of the power semiconductor transistor 200 electrically connected to a metal layer 122. In this case, the second plate 120 and the third plate 125 may preferably include an electrical isolation layer for isolating the metal layer 122 from the coolant. Thus, the metal layer 122 forms a load node for each of the power semiconductor transistors 200 and is configured to conduct load current. This simplifies the electrical layout of systems using the power semiconductor transistors 200. As mentioned above, the metal layer 122 may also be structured and may be used to conduct additional and / or other electrical signals.

[0053] It should be noted that the number of devices 200 is variable, meaning that there may be more than eight or fewer devices attached to the cooling element 100, and the number of devices 200 attached to the second plate 120 may differ from the number of devices 200 attached to the third plate 125. Furthermore, different types or categories of electronic devices 200 may be attached to corresponding sides of the cooling element 100. As an example, different power semiconductor devices (e.g., transistors and / or diodes with different voltage levels and / or different technologies) and / or different categories of electronic devices (e.g., inductors, capacitors, resistors, etc.) may be attached to either side of the cooling element 100.

[0054] In one or more implementations of the cooling element 100, two additional liquid connectors (not shown) are configured to be in liquid communication with another channel 132 for connecting the other channel 132 to the cooling circuit. Therefore, coolant can be supplied to the other channel 132 independently of the coolant supplied to channel 130.

[0055] In one or more implementations of the cooling element 100, two liquid connectors 140 are in liquid communication with another channel 132. Therefore, coolant can be supplied to both channel 130 and the other channel 132 using only the two liquid connectors 140.

[0056] In one or more implementations of the cooling element 100, channel 130 and another channel 132 are in liquid communication with each other. In another embodiment, channel 130 and another channel 132 form a common channel in at least a portion of their respective portions.

[0057] This means, for example, that channel 130 and another channel 132 may have a common liquid distribution section (for distributing coolant supplied via connector 140 to the cooling areas of the respective channels 130, 132) and / or a common liquid discharge section (for collecting coolant after it has passed through the cooling areas of the respective channels 130, 132 and discharging it via another connector 140).

[0058] In one or more implementations of the cooling element 100, the second plate 120 and / or the third plate 125 (if present) include a second structure extending from their first surfaces 120A and 125A into channels 130 and 132 (not shown). For example, the second structure may include elements that increase the surface area in contact with the coolant and / or turbulence-generating structure to enhance heat transfer from the second plate 120 or the third plate 125 to the coolant flowing through the channel 130 or another channel 132.

[0059] In one or more implementations of the cooling element 100, the first plate 110 includes additional elements extending from the first surface 110A and / or from the second surface 110B, which serve as turbulence generators to enhance heat transfer from the second plate 120 or the third plate 125 to the coolant flowing through the channel 130 or another channel 132.

[0060] In one or more implementations of the cooling element 100, the first structure 112 includes a plurality of basic unit structures 113 arranged in a grid on the first surface 110A of the first plate 110.

[0061] An example of this first board 110 is... Figure 8 As shown in the diagram. In this example, the first structure 112 comprises a mesh of 5 by 10 basic unit structures 113. Figure 8 The first plate shown can be used as a starting point to define the channel 130, for example by selectively removing the walls between adjacent basic unit structures 113. It should be noted that other geometries of the basic unit structures are possible, such as triangles, rectangles, circles, hexagons, or any other suitable basic geometry that can be used to fill the first surface of the first plate 110.

[0062] In one or more implementations of the cooling element 100, the first surface 110A of the first plate 110 is covered by a periodic arrangement of basic unit structures 113, such that the first surface 110A is filled with cavities separated by intermediate walls, wherein channels 130 are formed by adjacent cavities and intermediate walls are removed between adjacent cavities.

[0063] An example of this first board 110 is... Figure 9 As shown in the diagram, a flow path 116 is formed by connecting the cavities of the various basic unit structures (e.g., by selectively removing multiple intermediate walls between adjacent cavities, thus connecting the respective cavities together). Additionally, a liquid connector 140 is attached to the first plate 110 at both ends of the flow path 116. When the flow path 116 is formed by removing intermediate wall structures, certain portions of the respective intermediate wall structures may be intentionally left unremoved to provide flow regulation and / or turbulence-generating structures. When a second plate or foil is attached to the top of the first plate 110, the flow path 116 forms a channel 130.

[0064] In some embodiments, two or more flow paths 116 may be formed in the first plate 110 (not shown). The two or more flow paths 116 may be connected to separate pairs of liquid connectors 140. For example, the two or more flow paths may be in liquid communication with the same pair of liquid connectors 140 through a common portion of the flow paths. Certain portions of the corresponding intermediate wall structures may be intentionally left intact to provide flow-limiting elements, while in other portions, such as in the common portion, more of the wall structure may be removed to provide a larger cross-section for the coolant.

[0065] like Figure 8 The first plate 110 shown can be considered a template that can be used to define channels for coolant in a simple manner. In particular, if the number of individual cooling elements 100 required to establish a cooling system for a particular electrical system is small, the first plate 110 can be an economical approach that allows for free customization of channel geometry and does not require much material. Since the basic unit structure 113 can have a material fill rate between 10% and 50% (e.g., a portion of the volume of the basic unit structure filled with material), for example, much less material is required to manufacture the first plate 110 compared to a solid plate.

[0066] In one or more implementations of the cooling element 100, at least one cavity does not communicate with the channel 130 and is configured to receive a fixing element for attaching the cooling element 100 to the electronic device 200. Alternatively or additionally, at least one cavity may be configured to receive a fixing element for attaching the cooling element 100 to an external fixing structure, such as a frame or housing. This is in Figure 9 As shown, a total of six cavities are not part of flow path 116, and therefore the six cavities are not part of channel 130.

[0067] For example, Figure 10 A schematic cross-section of a multilayer structure that can be used as a second plate 120 or a third plate 125 in a cooling element as described above is shown. In this example, the multilayer structure 120 includes a core element 121, a structured metal layer 122 on one side, and an insulating material layer 123 on the other side. The core element 121 can be particularly used to provide mechanical integrity and stability to the structure. Preferably, the core element 121 has good thermal conductivity characteristics. For example, the core element 121 has a thermal conductivity greater than 10 W / ( The structured metal layer 122 has a thermal conductivity of [missing information]. As described above, the structured metal layer 122 can be used to attach and cool electronic devices and conduct electrical signals. For example, the multilayer structure 120 can be a laminate.

[0068] According to a second aspect of this disclosure, a cooling element 100 for cooling an electronic device 200 includes a plate 110 having a first surface 110A and a first structure 112 formed on the first surface 110A; a foil 120 having a first surface and a second surface opposite to the first surface, the second surface being configured to be attached to the electronic device 200, wherein the plate 110 and the foil 120 are attached to each other such that their respective first surfaces face each other, such that the first structure 112 is arranged between the plate 110 and the foil 120, such that a channel 130 is formed between the plate 110 and the foil 120, wherein the channel 130 is defined by the first structure 112, and two liquid connectors 140 are attached to the plate 110 and in liquid communication with the channel 130 for connecting the cooling element 100 to a cooling circuit.

[0069] For example, Figure 9 The cooling element shown can be implemented as described by using foil instead of the second plate 120. This can have the advantages of ease of manufacture and further cost reduction.

[0070] According to a third aspect, a method 300 for manufacturing a cooling element 100 for a cooling electronic device 200 is proposed. Method 300 in... Figure 11 The following steps are illustrated below. In the first step S11, a plate 110 is provided, having a first surface and a second surface opposite to the first surface, and including a first structure 112 extending from the first surface. The first structure 112 includes a periodic arrangement of basic unit structures 113, each basic unit structure including at least one cavity surrounded by a wall, such that a plurality of cavities separated by intermediate walls are formed at the first surface 112. For example, the plate 110 may be as follows: Figure 8 The form shown is described. For example, plate 110 can be formed by injection molding from a suitable material. In the second step S12, at least one intermediate wall is selectively removed, such that adjacent cavities are connected and a flow path 116 is formed. Removal can be accomplished by any suitable method, such as milling, cutting, drilling, turning, fusion, etc. In the third step S13, a cover element having a first surface and a second surface opposite to the first surface is provided. For example, the cover element can be a foil or a solid plate. In the fourth step S14, the cover element is attached to plate 110 such that their respective first surfaces face each other, and a first structure 112 is arranged between plate 110 and cover element, such that flow path 116 forms a channel 130 configured for coolant flow. Attachment can be accomplished by heat treatment, such as lamination. In the fifth step S15, at least two connectors 140 are provided such that they are in liquid communication with channel 130 for connecting channel 130 to a cooling circuit. It should be noted that in the simplified form, connector 140 can be simply provided by drilling a hole through the sidewall of cooling element 100.

[0071] According to another aspect of this disclosure, a cooling element 100 for cooling at least two power semiconductor devices 200 includes: a first plate 120 configured to be attached to a first power semiconductor device 200; a second plate 125 configured to be attached to a second power semiconductor device 200; an intermediate element 110 including at least one frame and at least one liquid guiding structure; and a liquid inlet 140 and a liquid outlet 140 disposed in the frame, wherein the first plate 120 is attached to a first side of the intermediate element 110 and the second plate 125 is attached to a second side of the intermediate element 110, such that a cavity is formed between the first plate 120, the second plate 125 and the frame, wherein the liquid guiding structure is disposed in the cavity and forms a channel 130 in liquid communication with the liquid inlet 140 and the liquid outlet 140, such that coolant can flow through the channel 130.

[0072] According to another aspect of this disclosure, a method 400 for manufacturing a cooling element 100 for cooling an electronic device 200 includes the following steps. In a first step S21, a first plate 110 having a first surface 110A is provided. In a second step S22, a second plate 120 having a first surface 120A and a second surface 120B opposite to the first surface 120A is provided. The second surface 120B is configured to be attached to the electronic device 200. In a third step S23, a first structure 112 configured to define a flow path 116 is provided. The first structure 112 may be a separate element or may be disposed on the first surface 110A of the first plate 110 by, for example, removing or depositing material. In a fourth step S24, the first plate 110 and the second plate 120 are joined such that their respective first surfaces 110A and 120A face each other, wherein the first structure 112 is disposed between the first plate 110 and the second plate 120 such that a channel 130 defined by the flow path 116 is formed between the first plate 110 and the second plate 120. In the fifth step, at least two connectors 140 are provided in liquid communication with channel 130 for connecting channel 130 to a cooling circuit.

[0073] While specific examples have been shown and described herein, it will be understood by those skilled in the art that various alternatives and / or equivalent implementations may be used instead of the specific examples shown and described without departing from the scope of the invention. This application is intended to cover any changes or modifications to the specific examples discussed herein. Therefore, the invention is intended to be limited only by the claims and their equivalents.

[0074] It should be noted that the methods and apparatuses, including their preferred embodiments as outlined herein, can be used alone or in combination with other methods and apparatuses disclosed herein. Furthermore, features outlined in the context of the apparatus also apply to the corresponding methods, and vice versa. Moreover, all aspects of the methods and apparatuses outlined herein can be combined arbitrarily. In particular, the features of the claims can be combined with each other in any manner.

[0075] It should be noted that the description and accompanying drawings only illustrate the principles of the proposed methods and systems. Those skilled in the art will be able to implement various arrangements, which, although not explicitly described or shown herein, embody the principles of the invention and are included within its spirit and scope. Furthermore, all examples and embodiments outlined herein are primarily and explicitly intended for illustrative purposes only to aid the reader in understanding the principles of the proposed methods and systems. Moreover, all statements herein providing the principles, aspects, and embodiments of the invention, as well as specific examples thereof, are intended to cover their equivalents.

Claims

1. A cooling element for cooling an electronic device, comprising: The first plate having the first surface, A second plate, the second plate having a first surface and a second surface opposite to the first surface of the second plate, wherein the second surface is configured to be attached to the electronic device. The first plate and the second plate are attached to each other such that their respective first surfaces face each other, wherein a first structure is arranged between the first plate and the second plate to form a channel between the first plate and the second plate, and Two liquid connectors are in liquid communication with the channel for connecting the channel to a cooling circuit.

2. The cooling element according to claim 1, wherein, The first structure is integral with the first plate and extends from the first surface of the first plate.

3. The cooling element according to claim 1 or 2, wherein, The first plate and the second plate are attached to each other by welding.

4. The cooling element according to claim 3, wherein, The weld seam of the welding is formed only by the material of the first plate and / or the second plate.

5. The cooling element according to any one of the preceding claims, wherein, The first plate and / or the second plate includes a functionalized surface region that is specifically functionalized to provide an attachment area for attaching a corresponding other of the first plate or the second plate.

6. The cooling element according to any one of the preceding claims, wherein, At least one of the first plate and the second plate is made substantially of plastic or composite material and / or formed in an injection molding process.

7. The cooling element according to any one of the preceding claims, wherein, The second board is formed from an insulating metal substrate or a direct copper-bonded substrate, an active metal brazing substrate, or a printed circuit board material.

8. The cooling element according to claim 7, wherein, The second plate includes a metal layer configured to conduct electrical signals on its second surface.

9. The cooling element according to claim 8, wherein, The metal layer is configured to conduct load current controlled by the electronic device.

10. The cooling element according to any one of the preceding claims, wherein, The second plate includes an insulating material arranged to provide electrical isolation between a first surface and a second surface of the second plate.

11. The cooling element according to any one of the preceding claims further comprises: A third plate, the third plate having a first surface and a second surface opposite to the first surface of the third plate, wherein the second surface of the third plate is configured to be attached to the electronic device. The third plate is attached to the first plate opposite to the second plate, wherein a second structure is arranged between the first plate and the third plate to form an additional channel between the first plate and the third plate.

12. The cooling element of claim 11, further comprising at least one additional liquid connector in liquid communication with the additional channel for connecting the additional channel to the cooling circuit.

13. The cooling element according to claim 12, wherein, The two liquid connectors are in liquid communication with the additional channel.

14. The cooling element according to claim 13, wherein, The channel and the other channel are in liquid communication with each other and / or form a common channel in at least a portion of each other.

15. The cooling element according to any one of the preceding claims, wherein, The second plate includes a second structure extending from its first surface and into the channel.

16. The cooling element according to any one of the preceding claims, wherein, The first structure includes a plurality of basic unit structures arranged in a grid on the first surface of the first plate.

17. The cooling element according to claim 16, wherein, The first surface of the first plate is covered by the periodically arranged basic unit structure, such that the first surface of the first plate is filled with cavities separated by intermediate walls, wherein the channels are formed by adjacent cavities, and the intermediate walls are removed between the adjacent cavities.

18. The cooling element according to claim 17, wherein, At least one cavity is not connected to the channel and is configured to receive a fixing element for attaching the cooling element to the electronic device and / or an external fixing structure.

19. The cooling element according to any one of the preceding claims further comprises: At least one power semiconductor device is attached to the second surface of the second plate.

20. The cooling element according to any one of claims 12 to 15, further comprising: At least one first power semiconductor device is attached to the second surface of the second plate, and At least one second power semiconductor device is attached to the second surface of the third plate.

21. The cooling element according to any one of claims 19 or 20, wherein, The at least one power semiconductor device, the at least one first power semiconductor device, and / or the at least one second power semiconductor device are attached to the second plate or the third plate by welding and / or sintering.

22. The cooling element according to any one of claims 19 or 20, wherein, The at least one power semiconductor device, the at least one first power semiconductor device, and / or the at least one second power semiconductor device are disposed in a standard semiconductor package.

23. The cooling element according to claim 22, wherein, The standard semiconductor package is TO-247.

24. A cooling element for cooling an electronic device, comprising: A plate having a first surface and a first structure formed on the first surface, A foil having a first surface and a second surface opposite to the first surface, the foil being configured to be attached to the electronic device at the second surface. The plate and the foil are attached to each other such that their respective first surfaces face each other, such that the first structure is arranged between the plate and the foil, such that a channel is formed between the plate and the foil, wherein the channel is defined by the first structure. Two liquid connectors, located on the plate and in liquid communication with the channel, are used to connect the channel to a cooling circuit.

25. A method for manufacturing a cooling element for a cooling electronic device, comprising the following steps: A plate is provided having a first surface and a second surface opposite to the first surface and including a first structure extending from the first surface, the first structure including periodically arranged basic unit structures, each basic unit structure including at least one cavity surrounded by an intermediate wall, such that a plurality of cavities separated by the intermediate wall are formed on the first surface. At least one intermediate wall is selectively removed, thereby connecting adjacent cavities and forming a flow path. A cover element is provided, the cover element having a first surface and a second surface opposite to the first surface of the cover element. The cover elements are attached to the plate such that their respective first surfaces face each other, and the first structure is arranged between the plate and the cover elements, such that the flow path forms a channel configured for coolant flow. Provide at least two connectors in liquid communication with the channel for connecting the channel to a cooling circuit.

26. A cooling element for cooling at least two power semiconductor devices, comprising: A first board, configured to be attached to a first power semiconductor device. The second board is configured to be attached to the second power semiconductor device. An intermediate element, comprising at least one frame and at least one fluid-conducting structure, and Liquid inlets and liquid outlets are arranged in the frame. The first plate is attached to a first side of the intermediate element, and the second plate is attached to a second side of the intermediate element, such that a cavity is formed between the first plate, the second plate, and the frame. The liquid guiding structure is arranged in the cavity and forms a channel in liquid communication with the liquid inlet and the liquid outlet, allowing coolant to flow through the channel.

27. A method for manufacturing a cooling element for a cooling electronic device, comprising the following steps: Provide a first plate having a first surface, A second plate is provided, the second plate having a first surface and a second surface opposite to the first surface of the second plate, wherein the second surface is configured to be attached to the electronic device. The first structure that provides a defined flow path The first plate and the second plate are joined such that their respective first surfaces face each other, wherein the first structure is arranged between the first plate and the second plate such that a channel is formed between the first plate and the second plate and the channel is defined by the flow path, and Provide at least two connectors in liquid communication with the channel for connecting the channel to a cooling circuit.

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