Chip site rework on multi-chip laminate packages

Abstract

A method and apparatus extract solder from multiple die repair sites on a laminate structure. The method includes depositing conductive pads on a flexible dielectric film at the same pitch as the solder bumps on the laminate structure to be extracted. The flexible film is mounted on a holding surface and the conductive pads are heated at a temperature above the solder melting temperature. The holding surface is lowered toward the laminate structure having solder thereon until the heated conductive pads contact at least one solder bump. The holding surface is retracted from the contact and includes a substantial portion of the at least one contacted solder bump that was on the laminate structure. The operation is repeated until the solder remaining on the die pads on the laminate structure is similar to the amount of pre-disposed solder originally arranged.

Description

Technical Field

[0001] This disclosure generally relates to structures having multiple chips, and more specifically, to restoring solder in such structures. Background Technology

[0002] As electronic components become increasingly miniaturized, laminated multilayer structures are commonly used to package multiple chips in a device. These laminates are used to interconnect multiple semiconductors using various technologies, including but not limited to plastic ball grid arrays (PBGA), plastic pin grid arrays (PPGA), plastic pad grid arrays (PLGA), or chip-scale packages (CSP). However, when a faulty / failed chip is removed from the laminate, the solder used to attach the chip to the laminate needs to be repaired. Sometimes, challenges arise in removing the faulty / failed chip, repairing the chip sites including the solder, and reattaching the new chip to the laminate to ensure reliable electrical connections. Summary of the Invention

[0003] According to an embodiment, a method and apparatus extract solder from rework sites of multiple chips on a laminated package. The method includes depositing conductive pads on a flexible film having the same pitch as solder bumps on the laminated structure to be extracted. The flexible film is held by the surface of a die bonding stage, and the conductive pads are heated at a temperature above the solder melting temperature. The flexible film is moved toward the laminated structure on which solder is present until the heated conductive pads contact at least one solder bump on the laminated structure. The flexible film retracts from the contact and includes a large portion of the solder bump that was previously contacted on the laminated structure. This operation is repeated until the amount of solder remaining on the laminated structure is similar to the amount of pre-placed solder initially arranged on the pads of the laminated structure. Attached Figure Description

[0004] The accompanying drawings are exemplary embodiments. They do not show all embodiments. Other embodiments may be used alternatively or in lieu of them. Details that may be obvious or unnecessary may be omitted to save space or for more efficient illustration. Some embodiments may be practiced with additional components or steps and / or without all the components or steps shown. When the same number appears in different drawings, it refers to the same or similar components or steps.

[0005] Figure 1 It is a plan view of a laminated structure on which multiple chips are arranged, consistent with the exemplary embodiment.

[0006] Figure 2 The laminated structure undergoing renovation is shown, consistent with the exemplary embodiment.

[0007] Figure 3A Laminated die pads and conductive pads with residual solder are shown, consistent with exemplary embodiments.

[0008] Figure 3B The laminated die pads with residual solder and the ratio are shown. Figure 3A The conductive pads shown are large conductive pads, consistent with the exemplary embodiment.

[0009] Figure 4A , Figure 4B and Figure 4C A processing flow for remodeling laminated structures, consistent with an exemplary embodiment, is shown, wherein Figure 4A The image shows the film and conductive pads aligned above the laminate structure that needs to be reworked. Figure 4B This illustrates that after the stage is lowered to make the conductive pads conduct to at least one solder bump on the laminate, the stage retains the film, and Figure 4C The stage is shown after the solder bumps have been removed following contact with the heated conductive pads, consistent with the exemplary embodiment.

[0010] Figure 5 This is a flowchart illustrating a process for reworking chip sites in a multi-chip laminated package, consistent with the illustrated embodiment.

[0011] Figure 6 A block diagram is shown of a computational environment configured, consistent with an exemplary embodiment, for a die bonding tool that reworks die sites in a multi-chip laminated package. Detailed Implementation

[0012] In the detailed description below, numerous specific details are given by way of example to provide a thorough understanding of the relevant teachings. However, it should be understood that the present teachings can be practiced without these details. In other instances, well-known methods, processes, components, and / or circuits are described at a relatively high level without detailed description to avoid unnecessarily obscuring aspects of the present teachings. It should also be understood that this disclosure is not limited to the depictions in the accompanying drawings, as there may be fewer or more elements shown and described.

[0013] Although the terms first, second, etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element, without departing from the scope of the exemplary embodiments. As used herein, the term "and / or" includes all combinations of one or more of the associated listed items.

[0014] As used herein, the term "chiplet" refers to a type of integration where multiple dies are integrated into a package or system. While there are various variations in the use of chiplets, a common approach is to have multiple modular chips or chiplets in a library. Chipslets are assembled in a package and connected using a die-to-die interconnect scheme.

[0015] As used herein, a die bonder is a tool used to attach a die to another die or substrate. Bonders typically hold the die and bond it to a substrate or laminate. Die bonders, also known as "stages," typically use compressive force to attach the die to the substrate. It should be understood that the appended claims are not limited to a specific type of stage for the die. In some exemplary embodiments, the retaining surface on which the insulating film is mounted is a thermally conductive adhesive (TCB) tool tip for repairing solder. However, it should be understood that the appended claims are not limited to using a TCB tool tip for removal / attachment operations.

[0016] Made of polyimide (such as Kapton) ® Flexible films made of poly(4,4'-oxydiphenyl-pyromellitictetracarboximide) can be used with substrate pads to remove solder bumps from sites being repaired. Kapton ® It exhibits wide-range thermal stability (-269 to +400°C) and electrical insulation properties. However, products such as Nomex... ® Poly(m-phenylene isophthalamide) and Teflon ® Substances such as polytetrafluoroethylene (PTFE) can be used as possible alternatives.

[0017] It should be understood that other embodiments may be used and structural or logical changes may be made without departing from the scope defined by the claims. The description of the embodiments is not restrictive. In particular, elements of the embodiments described below may be combined with elements of different embodiments.

[0018] Technical advantages and support

[0019] It should be understood that some advantages of this disclosure are provided below. However, those skilled in the art will understand that other advantages may exist in addition to those described herein.

[0020] In one embodiment, a method for repairing a multi-chip laminate includes depositing conductive pads on a flexible insulating film and mounting the flexible insulating film on a holding surface. The holding surface is heated to a temperature above the solder melting temperature. The holding surface is lowered toward the laminate until at least one of the conductive pads mounted on the flexible insulating film contacts one or more solder bumps on the laminated solder. The holding surface is retracted from the laminate when one or more of the solder bumps have melted and at least partially transferred to the conductive pads on the holding surface. This method provides efficient solder bump removal for multiple chips on a laminate, allowing the laminate to be reused (rather than discarded) after the chips are repaired or replaced.

[0021] In embodiments that can be combined with the foregoing embodiments, the method further includes aligning the flexible insulating film with the same pitch as the one or more solder bumps to be extracted. Alignment provides more precise desoldering of the solder bumps, allowing more solder to be transferred away from the laminate being reworked.

[0022] In one embodiment, this embodiment can be combined with one or more of the foregoing embodiments, where the retaining surface during the descent and retraction operations is a thermocompressed bonding (TCB) tool tip. The TCB tool tip can be used to attach / remove chips on laminated structures and is effective for solder bumps.

[0023] In one embodiment, this embodiment can be combined with one or more of the foregoing embodiments, the method comprising repeatedly lowering and retracting the surface until a residual amount of solder remains on a plurality of bare die pads on the laminate, on which one or more solder bumps were previously attached. The iterative process effectively removes solder bumps from all areas of the laminate on which a chip is being repaired or replaced, leaving residual solder as receiving pads for new solder when another chip is mounted.

[0024] In one embodiment, this embodiment can be combined with one or more of the foregoing embodiments, the method comprising spatially varying the pitch of conductive pads on a flexible insulating film to align with the pitch of one or more solder bumps. The spatial variation in pitch provides for more efficient transfer of solder bumps to be removed from the laminate structure.

[0025] In one embodiment, it can be combined with one or more of the foregoing embodiments, and the method includes controlling the volume of solder bumps transferred onto the conductive pads based on the size of the conductive pads used. Conductive pads of different sizes mounted on the flexible insulating film can control the amount of solder removed from the laminate being reworked.

[0026] In one embodiment, it can be combined with one or more of the foregoing embodiments, and the method includes detecting whether conductive pads on the flexible insulating film are in contact with one or more solder bumps by maintaining force feedback on the surface. By using a sensor, contact can be ensured, but excessive force is prevented from being applied to the laminate being reworked.

[0027] In one embodiment, it can be combined with one or more of the foregoing embodiments, the method comprising: mounting a flexible insulating film onto a retaining surface including applying a vacuum. A vacuum can help retain the flexible insulating film and remove debris from the laminate being reworked.

[0028] In one embodiment, it can be combined with one or more of the foregoing embodiments, the method comprising cleaning one or more bare die pads on a laminate with residual solder after the one or more solder bumps have been partially transferred to conductive pads. Cleaning can occur after each round or periodically, such as after every other round. This operation keeps the laminate free from debris.

[0029] In one embodiment, it can be combined with one or more of the foregoing embodiments, the method comprising mechanically separating at least one chip from the laminate structure before repairing the laminate structure. Initially, in a laminate structure having multiple chips, a failed or degraded chip must be removed before repair. Mechanical separation is preferred to remove the chip from the laminate structure, after which the laminate structure can be repaired.

[0030] In one embodiment, an apparatus for repairing a multi-chip laminate includes a computer-controlled device comprising a processor and a storage device coupled to the processor. The storage device stores instructions to cause the processor to perform actions including: depositing conductive pads on a flexible insulating film; mounting the flexible insulating film onto a holding surface; heating the holding surface to a temperature above the solder melting temperature; lowering the holding surface toward the lamination sites until at least one of the conductive pads mounted on the flexible insulating film contacts one or more solder bumps on the laminated solder; and retracting the holding surface when one or more of the solder bumps have melted and at least partially transferred to the conductive pads on the flexible insulating film. This apparatus provides efficient removal of solder bumps for heterogeneous chip integration from the laminated structure, allowing the laminated structure to be reused (rather than discarded) after chip repair or replacement.

[0031] In one embodiment, it can be combined with the foregoing embodiments, wherein the flexible insulating film is a polyimide structure. The polyimide structure provides a wide range of temperature and electrical insulation.

[0032] In one embodiment, it can be combined with one or more of the foregoing embodiments, and the polyimide structure is Kapton. ®Membrane. This specific membrane is used to mount conductive pads onto the TCB head.

[0033] In one embodiment, it can be combined with one or more of the foregoing embodiments, wherein the conductive pads are copper pads. Copper is particularly effective in the conductive pads to desolder solder bumps during laminate reconstruction.

[0034] In one embodiment, it can be combined with one or more of the foregoing embodiments, wherein the instructions cause the processor to perform additional actions to align the flexible insulating film with the same pitch as the one or more solder bumps to be extracted. Alignment provides more precise solder bump desoldering, allowing more solder to be transferred from the laminate being reworked.

[0035] In one embodiment, it can be combined with one or more of the foregoing embodiments, wherein the instructions cause the processor to perform additional actions, including repeatedly lowering the holding surface until at least one of the conductive pads makes contact with the one or more solder bumps, and retracting the holding surface when one or more of the solder bumps have melted. The iterative operation effectively removes solder bumps from all areas of the laminated structure where the chip is being repaired or replaced, leaving residual solder as a receiving pad for new solder when another chip is mounted.

[0036] In one embodiment, it can be combined with one or more of the foregoing embodiments, wherein the instructions cause the processor to perform additional actions, including repeatedly maintaining the descent and retraction of the surface until a residual amount of solder remains on multiple die pads on the laminate to which the one or more solder bumps were previously attached. The iterative process effectively removes solder bumps from all areas of the laminate to which the chip is being repaired or replaced, leaving residual solder as receiving pads for new solder when another chip is mounted.

[0037] In one embodiment, it can be combined with one or more of the foregoing embodiments, wherein the instructions cause the processor to perform an additional action, namely, to vary the pitch space of the conductive pads on the flexible insulating film to align with the pitch of the one or more solder bumps. This variation in pitch space provides more efficient desoldering of solder bumps on the alignment structure being reworked.

[0038] In one embodiment, it can be combined with one or more of the foregoing embodiments, wherein the volume of solder extracted from the one or more solder bumps is based on the size of the conductive pads. The amount of solder to be removed can be controlled according to the size of the conductive pads arranged on the flexible insulating film.

[0039] Overview

[0040] This disclosure generally relates to an apparatus and method for reconfiguring chip sites in a multi-chip laminated package. Current technology is moving towards arranging multiple chips (which may be identical or different) on a laminated structure. For example, multiple chips are assembled on a single laminated structure. Industry indicates that this configuration could be the future of microelectronic packaging. Laminated structures used to arrange multiple chips are not simple organic laminates because the chips need to communicate over very large bandwidths. Therefore, manufacturing laminated structures is expensive.

[0041] One drawback of attaching multiple chips to a laminated structure is that discarding the entire package is too expensive if one of the chips attached to the laminate fails. Therefore, the failed chip must be pulled out and the chip repair site must be re-attached before a new, functional chip can be attached. The apparatus and methods described in this disclosure provide improvements for repairing chip sites.

[0042] In laminated packaging, chips are connected to each other via solder bumps. Between the chips, there are pitch and line spacing. The laminated structure consists of multiple thin metal lines, which are connected to the bumps via laminated pads.

[0043] Figure 1 This is a plan view 100 of a laminated package having multiple chips arranged thereon, consistent with the illustrative embodiment. Three chips 101, 103, and 105 are shown, which are typically bonded to the laminated structure 110 by solder bumps. Chip 105 typically needs to be removed and either repaired or replaced because, as Figure 1 The heterogeneous integrated structure shown is too expensive to be discarded due to the failure of a single chip. Chip 105 can be physically separated from the laminate using tools such as a die bonding stage tool. Once chip 105 is removed from the laminate, a method for repairing the laminate begins, allowing a repaired or new chip to be attached to the laminate in place of the removed chip 105.

[0044] The method involves depositing conductive pads on a flexible thermally insulating film. The flexible thermally insulating film (with conductive pads) is mounted on a holding surface, and the conductive pads are heated above the solder melting temperature. The holding surface is retracted, and the process is repeated until the remaining solder on the laminated pads is an amount similar to the amount of pre-placed solder on the laminated pads before bonding. A wiper (e.g., a scraper) can be used to clean the residual solder on the laminated pads each time the tool head assembly is lifted or at regular intervals.

[0045] Example Implementation

[0046] Figure 2 This is a front view 200 of a laminated structure undergoing renovation, consistent with the illustrative embodiment. Figure 2 Chip 105 is shown. Figure 1The tool head assembly 210 includes a surface retaining clamp 212, an insulating flexible membrane 215, and conductive pads 217. The conductive pads can be a metal such as copper, but are not limited to this material, and can also be an alloy. As mentioned above, the flexible membrane can be Kapton. ® Or other insulating films with high heat resistance and electrical insulation.

[0047] Figure 2 The laminated structure is also shown to have pads 219, which may be referred to as die pads. Solder bumps 225 are compressed between conductive pads 217 and laminated pads 219.

[0048] Figure 3A The diagram 300A shows residual solder on laminated pad 310 and conductive pads, consistent with the illustrative embodiment. Figure 3B It is the residual solder on the laminated pad 310 and the ratio Figure 3A The illustration 300B, showing a larger top conductive pad, is consistent with the illustrative embodiment. Figure 3A The conductor pad 305 has a diameter similar to that of the solder bump 315. Figure 3B In the middle, conductor pad 307 is larger than Figure 3A The conductive pad 305 is larger than the smaller conductive pad 307. During heating, the larger conductive pad 307 will remove more solder than the smaller conductive pad 305. This can be observed after one or more contacts of the conductive pads 305, 307 (when heated) with the solder bumps 315, 325. Figure 3B The solder bumps in the 325 are compared to Figure 3A The solder bumps 315 remove more solder. It should be understood that the cleaning operation can occur between each contact between the conductive pads and the solder bumps, or at predetermined time intervals. The cleaning operation may include an automatic scraper, part of the die bonding stage assembly, for cleaning residual solder after lifting the conductive pads 305, 307.

[0049] Figure 4A , Figure 4B and Figure 4C A processing flow for remodeling laminated structures, consistent with an exemplary embodiment, is shown, wherein Figure 4A The image shows the film and conductive pads aligned over the laminate structure that needs to be reworked. Figure 4B This illustrates maintaining a surface retention film after the surface is lowered to allow the conductive pads to conduct to at least one solder bump on the laminated structure, and Figure 4C This illustrates maintaining the surface retraction after the solder bumps are removed following contact with the heated conductive pads, consistent with the exemplary embodiment.

[0050] refer to Figure 4AThe image shows a front view 400A of a laminate 220 that needs repair. For example, there is a chip 105 disposed on the laminate 220 that needs repair or replacement (see [reference]). Figure 1 The conductive pads used in this exemplary embodiment are copper pads 2170 and 2190. However, other types of solderability materials may also be used. For the remodeling of the laminate structure 220, the copper pads 2170 are arranged on a membrane 215 having dimensions and pitch similar to those of the solder bumps 225. The membrane 215 in this exemplary embodiment is a flexible conformal Kapton. ® Membrane. Membrane 215 is mounted on platform 435 to form tool head assembly 210 (see...) Figure 2 The tool head assembly 210 is aligned above the laminate structure 220, and the copper pads 2170 are heated to a temperature above the melting temperature of the solder bumps 225. Mounting may include using a vacuum to hold the membrane 215 by the platform 435. It should be noted that the heating of the copper pads 2170 may also be performed after contact with the solder bumps, or it may be preheated to a first temperature and then heated to a second temperature above the first temperature after contact with at least one solder bump 225.

[0051] refer to Figure 4B The diagram shows a front view 400B of platform 435 being lowered until copper pads 2170 contact at least one solder bump 225. Vacuum can be pulled out (e.g., reduced or stopped), and temperature is increased to ensure the solder bumps 225 melt. Although only one solder bump 225 is shown in contact with one of the copper pads 2170, multiple solder bumps 225 may be in contact with their respective copper pads 2170. As the process of lowering and retracting platform 435 is repeated, higher bumps are removed, and copper pads 2170 are then brought into contact with and heated by other solder bumps 225 that may not have been in contact with copper pads 2170 during previous lowering of platform 435.

[0052] refer to Figure 4C This shows that platform 435 is being used by tool head component 210 ( Figure 2 Front view 400C after the laminate structure 220 is retracted. Figure 4CThe solder bumps 225 have been largely transferred to the heated copper pads 2170, leaving a residual solder amount 427 on the copper pads 2190 attached to the laminate 220. It should also be noted that the reduced or stopped vacuum can be returned to the previous level used before the platform 435 was lowered to ensure that the membrane 215 is firmly held when the platform 435 with the membrane 215 is raised. The residual solder 227 on the platform 435 and the laminate can be cleaned with a scraper / wipe surface to remove any debris. It should be noted that not all solder is removed from the copper pads 2190 on the laminate 220. The remaining solder serves as a receiving pad for subsequent soldering of new or repaired chips.

[0053] Example process

[0054] Given the overview of the example architecture above, it may now be helpful to consider a higher-level discussion of the example process. To this end, Figure 5 This is a flowchart illustrating a method for reshaping chip sites in a multi-chip laminated package, consistent with an exemplary embodiment.

[0055] The method begins with depositing conductive pads (502) on a flexible insulating film. It is to be understood that one or more chips have previously been mechanically separated from the laminate structure, and the laminate structure is now being reconstructed so that a repair or replacement chip can be arranged on the laminate structure. As previously disclosed herein, the flexible insulating film can be, for example, Kapton... ® The conductive pads in this exemplary embodiment are made of copper; however, any solderability material can be used.

[0056] A flexible insulating film, including conductive pads, is mounted onto the holding surface of a device such as a die bonding device (504).

[0057] The holding surface is heated to a temperature above the melting temperature of the solder bumps (506). The conductive pads of the holding surface may be heated to a desired melting temperature before contact with the solder bumps. Alternatively, the temperature may be increased to an initial level and then increased upon detection of contact with the solder bumps. Heating may also begin after contact with the solder bumps is detected as the holding surface descends toward the laminate structure.

[0058] The retaining surface descends toward the laminated structure until one of the conductive pads on the flexible insulating film contacts one or more solder bumps (508). Contact can be determined by force feedback detected by a sensor attached to the retaining surface.

[0059] After the solder bumps melt, the retaining surface retracts (510). Due to heat and the vacuum that can be applied, most of the solder bumps transfer to the conductive pads on the retaining surface. The retaining surface can be lowered and retracted until all the solder bumps are removed, leaving only a residual amount of solder that approximates the amount of pre-placed solder on the die pads on the laminate, to serve as receiving pads for attaching solder to replacement or repair chips.

[0060] Regarding any flowchart, depending on the technology involved, operations may be performed in a different order than those shown in a given flowchart. For example, also depending on the technology involved, two operations shown in consecutive flowchart blocks may be performed in reverse order, as a single integrated step, simultaneously, or in a manner that at least partially overlaps in time.

[0061] Computing environment

[0062] Figure 6 A block diagram of a computational environment configured, consistent with an exemplary embodiment, for reworking die bonding tools at chip sites in a multi-chip laminated package is shown.

[0063] Computer Program Product Embodiment (“CPP Embodiment” or “CPP”) is a term used herein to describe any group of one or more storage media (also referred to as “media”) included in a collection of one or more storage devices that collectively comprise machine-readable code corresponding to instructions and / or data for performing the computer operations specified in a given CPP claim. A “storage device” is any tangible device capable of holding and storing instructions for use by a computer processor. Without limitation, a computer-readable storage medium can be an electronic storage medium, a magnetic storage medium, an optical storage medium, an electromagnetic storage medium, a semiconductor storage medium, a mechanical storage medium, or any suitable combination of the foregoing. Some known types of storage devices that include these media include: floppy disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), static random access memory (SRAM), optical disc read-only memory (CD-ROM), digital versatile optical disc (DVD), memory sticks, floppy disks, mechanical encoding devices (such as punched cards or pits / bumps formed on the main surface of a disc), or any suitable combination of the foregoing. As used herein, the term "computer-readable storage medium" is not intended to be interpreted as storage in the form of transient signals themselves (such as radio waves or other freely propagating electromagnetic waves, electromagnetic waves propagating through waveguides, optical pulses transmitted through fiber optic cables, electrical signals communicated through wires, etc.). As those skilled in the art will understand, data may be moved at some point during normal operation of the storage device, such as during access, defrauding, or garbage collection, but this does not make the storage device transient, because the data is not transient when it is stored.

[0064] refer to Figure 6 The computing environment 600 includes examples of an environment for executing at least some computer code related to the execution of the inventive method. In one embodiment, computer-executable instructions in the die bonding control module 650 monitor and control various components of the die bonding apparatus. For example, the die carrier head control 652 picks up and / or releases semiconductor dies during a rework operation. In one embodiment, a vacuum may be applied to hold the die to the die head. The heating element model 654 controls the heating of solder to be removed during the rework operation. The soldering / desoldering module 656 controls the removal of solder from the pads, similar to the pre-set amount of solder present before the die held by the die head is assembled onto the laminated pads. The cleaning control 658 controls a scraper or squeegee to clean the laminated pads where residual solder debris may remain after the desoldering operation.

[0065] Furthermore, the computing environment 600 includes, for example, a computer 601, a wide area network (WAN) 602, an end-user equipment (EUD) 603, a remote server 604, a public cloud 605, and a private cloud 606. In this embodiment, the computer 601 includes a processor set 610 (including processing circuitry 620 and a cache 621), a communication architecture 611, volatile memory 612, persistent storage device 613 (including an operating system 622 and a die bonding control module 650 as described above), a peripheral device set 614 (including a user interface (UI) device set 623, a storage device 624, and an Internet of Things (IoT) sensor set 625), and a network module 665. The remote server 604 includes a remote database 630. The public cloud 605 includes a gateway 640, a cloud coordination module 641, a host physical machine set 642, a virtual machine set 643, and a container set 644.

[0066] Computer 601 can take the form of a desktop computer, laptop computer, tablet computer, smartphone, smartwatch or other wearable computer, mainframe computer, quantum computer, or any other form of computer or mobile device now known or developed in the future capable of running programs, accessing networks, or querying databases (e.g., remote database 630). As is well known to those skilled in the art of computer technology, and depending on the technology, the performance of a computer-implemented method can be distributed across multiple computers / multiple locations. On the other hand, in presenting the computing environment 600, the discussion focuses on a single computer, specifically computer 601, to keep the presentation as simple as possible. Although in Figure 6 Although not shown, computer 601 may be located in the cloud. On the other hand, except to a degree that can be definitively indicated, computer 601 does not need to be located in the cloud.

[0067] Processor set 610 includes one or more types of computer processors, either currently known or to be developed in the future. Processing circuitry 620 may be distributed across multiple packages, such as multiple coordinated integrated circuit chips. Processing circuitry 620 may implement multiple processor threads and / or multiple processor cores. Cache 621 is memory located within the processor chip package, typically used for data or code that the threads or cores running on processor set 610 should access quickly. Cache memory is typically organized into multiple levels based on its relative proximity to the processing circuitry. Alternatively, some or all of the processor set's cache may be located "off-chip". In some computing environments, processor set 610 may be designed to work with qubits and perform quantum computing.

[0068] Computer-readable program instructions are typically loaded onto computer 601 to cause the processor set 610 of computer 601 to perform a series of operational steps to implement a computer-implemented method, such that the instructions executed thereby instantiate the method specified in the flowcharts and / or descriptive passages of the computer-implemented method contained herein (collectively, the “inventive method”). These computer-readable program instructions are stored in various types of computer-readable storage media, such as cache 621 and other storage media discussed below. The processor set 610 accesses the program instructions and associated data to control and direct the execution of the inventive method. In computing environment 600, at least some of the instructions for performing the inventive method may be stored in persistent storage device 613.

[0069] Communication structure 611 is a signal transmission path that allows various components of computer 601 to communicate with each other. Typically, this structure is made of switches and conductive paths (such as switches and conductive paths that form buses, bridges, physical input / output ports, etc.). Other types of signal communication paths, such as fiber optic communication paths and / or wireless communication paths, can be used.

[0070] Volatile memory 612 is any type of volatile memory known now or in the future. Examples include dynamic random access memory (RAM) or static RAM. Typically, volatile memory 612 is characterized by random access, but this is not required unless explicitly stated. In computer 601, volatile memory 612 is located in a single package and inside computer 601, but alternatively or additionally, volatile memory may be distributed across multiple packages and / or located relative to the outside of computer 601.

[0071] The persistent storage device 613 is any form of non-volatile storage for a computer that is now known or will be developed in the future. The non-volatility of this storage means that the stored data is retained regardless of whether power is supplied to the computer 601 and / or directly to the persistent storage device 613. The persistent storage device 613 may be a read-only memory (ROM), but typically at least a portion of the persistent storage allows data to be written, deleted, and rewritten. Some familiar forms of persistent storage include hard disks and solid-state storage devices. The operating system 622 may take many forms, such as various known proprietary operating systems or open-source portable operating system interface types with a kernel. The code included in the persistent storage device 613 typically includes a portion of the computer code involved in performing the inventive methods.

[0072] Peripheral device set 614 includes the peripheral device set of computer 601. Data communication connections between the peripheral devices of computer 601 and other components can be implemented in various ways, such as Bluetooth connectivity, near field communication (NFC) connectivity, cable connections (such as Universal Serial Bus (USB) type cables), plug-in connections (e.g., Secure Digital (SD) cards), connections via local area networks, and even connections via wide area networks (such as the Internet). In various embodiments, UI device set 623 may include components such as displays, speakers, microphones, wearable devices (such as goggles and smartwatches), keyboards, mice, printers, touchpads, game controllers, and haptic devices. Storage device 624 is external storage, such as an external hard drive, or pluggable storage, such as an SD card. Storage device 624 may be persistent and / or volatile. In some embodiments, storage device 624 may take the form of a quantum computing storage device for storing data in the form of qubits. In embodiments requiring computer 601 to have substantial storage (e.g., where computer 601 locally stores and manages a large database), this storage can be provided by peripheral storage devices designed for storing very large amounts of data, such as a storage area network (SAN) shared by multiple geographically distributed computers. The IoT sensor set 625 consists of sensors that can be used in IoT applications. For example, one sensor could be a thermometer, and another could be a motion detector.

[0073] Network module 615 is a collection of computer software, hardware, and firmware that allows computer 601 to communicate with other computers via WAN 602. Network module 615 may include hardware such as a modem or Wi-Fi transceiver, software for packetizing and / or depacketizing data for communication network transmission, and / or web browser software for transmitting data over the Internet. In some embodiments, the network control and network forwarding functions of network module 615 are performed on the same physical hardware device. In other embodiments (e.g., embodiments utilizing software-defined networking (SDN), the control and forwarding functions of network module 615 are performed on physically separate devices, such that the control functions manage multiple different network hardware devices. Computer-readable program instructions for performing the methods of the invention can typically be downloaded to computer 601 from an external computer or external storage device via a network adapter card or network interface included in network module 615.

[0074] A WAN 602 is any wide area network (e.g., the Internet) capable of communicating computer data over non-local distances using currently known or future technologies for communicating computer data. In some embodiments, a WAN 602 can be replaced and / or supplemented by a local area network (LAN) designed to communicate data between devices in a local area, such as a Wi-Fi network. WANs and / or LANs typically include computer hardware such as copper transmission cables, optical fiber transmissions, wireless transmissions, routers, firewalls, switches, gateway computers, and edge servers.

[0075] End User Equipment (EUD) 603 is any computer system used and controlled by an end user (e.g., an enterprise customer operating computer 601) and can take any of the forms discussed above regarding computer 601. EUD 603 typically receives helpful and useful data from the operation of computer 601. For example, in a hypothetical scenario where computer 601 is designed to provide recommendations to the end user, such recommendations would typically be sent from network module 615 of computer 601 via WAN 602 to EUD 603. Thus, EUD 603 can display or otherwise present the recommendations to the end user. In some embodiments, EUD 603 can be a client device, such as a thin client, a thick client, a mainframe computer, a desktop computer, etc.

[0076] Remote server 604 is any computer system that provides at least some data and / or functionality to computer 601. Remote server 604 can be controlled and used by the same entity operating computer 601. Remote server 604 represents a machine that collects and stores helpful and useful data for use by other computers, such as computer 601. For example, in a hypothetical scenario where computer 601 is designed and programmed to provide recommendations based on historical data, that historical data can be provided to computer 601 from a remote database 630 of remote server 604.

[0077] Public cloud 605 is any computer system that can be used by multiple entities to provide on-demand computer system resources and / or other computer functions (particularly data storage (cloud storage) and computing power) without direct active management by the user. Cloud computing typically leverages resource sharing to achieve consistency and economies of scale. Direct and active management of the computing resources of public cloud 605 is performed by the computer hardware and / or software of cloud orchestration module 641. The computing resources provided by public cloud 605 are typically implemented by virtual computing environments running on various computers constituting host physical machine set 642, which is a universe of physical computers in and / or usable by public cloud 605. Virtual computing environments (VCEs) typically take the form of virtual machines from virtual machine set 643 and / or containers from container set 644. It should be understood that these VCEs can be stored as images and can be transferred between various physical machine hosts as images or after VCE instantiation. Cloud orchestration module 641 manages the transfer and storage of images, deploys new VCE instantiations, and manages the instantiation of active VCE deployments. Gateway 640 is a collection of computer software, hardware, and firmware that allows public cloud 605 to communicate via WAN 602.

[0078] Now, we will provide some further explanation about Virtualized Computing Environments (VCEs). A VCE can be stored as an "image." A new active instance of a VCE can be instantiated from an image. Two familiar types of VCEs are virtual machines and containers. A container is a VCE that uses operating system-level virtualization. This refers to an operating system feature where the kernel allows the existence of multiple isolated user-space instances (called containers). From the perspective of a program running within it, these isolated user-space instances typically behave like a real computer. A computer program running on a regular operating system can utilize all the resources of that computer, such as connected devices, files and folders, network shares, CPU power, and quantifiable hardware capabilities. However, a program running inside a container can only use the contents of the container and the devices allocated to the container; this characteristic is called containerization.

[0079] Aside from the fact that computing resources are only available for use by a single enterprise, private cloud 606 is similar to public cloud 605. Although private cloud 606 is depicted as communicating with WAN 602, in other embodiments, private cloud may be completely disconnected from the internet and accessible only via a local / private network. Hybrid clouds consist of multiple clouds of different types (e.g., private, community, or public cloud types), typically implemented by different vendors. Each of the multiple clouds remains a separate and discrete entity, but the larger hybrid cloud architecture is combined through standardized or proprietary technologies that enable coordination, management, and / or data / application portability between the multiple component clouds. In this embodiment, both public cloud 605 and private cloud 606 are part of a larger hybrid cloud.

[0080] in conclusion

[0081] Various embodiments of this teaching have been described for illustrative purposes, but are not intended to be exhaustive or limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope of the described embodiments. The terminology used herein has been chosen to better explain the principles of the embodiments, their practical application or improvement of technology found in the market, or to enable those skilled in the art to understand the embodiments disclosed herein.

[0082] While what is considered the best state and / or other examples has been described above, it should be understood that various modifications can be made, and the subject matter disclosed herein can be implemented in various forms and examples, and many applications can be applied herein, only some of which have been described herein. It is intended that any and all applications, modifications, and variations falling within the true scope of this teaching be claimed by the following claims.

[0083] The components, operations, steps, features, objects, benefits, and advantages discussed herein are merely illustrative. None of them, and the discussion relating to them, is intended to limit the scope of protection. Unless otherwise stated, all measurements, values, grades, locations, sizes, and other specifications set forth herein, including in the following claims, are approximate, not precise. They are intended to have a reasonable range consistent with their associated function and with the conventions of the art to which they pertain.

[0084] Many other embodiments are also considered. These include embodiments with fewer, additional, and / or different components, steps, features, objects, benefits, and advantages. These also include embodiments in which the components and / or steps are arranged and / or ordered in different ways.

[0085] Although described above in conjunction with exemplary embodiments, it should be understood that the word "exemplary" is merely indicative of an example and not of the best or optimal. Nothing stated or illustrated herein should be construed as waiving any component, step, feature, object, benefit, advantage, or equivalent, whether or not it is mentioned in the claims, unless immediately stated above.

[0086] It will be understood that the terms and expressions used herein have the general meanings usually assigned to such terms and expressions, unless otherwise specified herein, and are relevant to their respective research and fields of study. Relative terms such as "first" and "second" may be used merely to distinguish one entity or action from another, without requiring or implying any actual relationship or order between such entities or actions. The terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed or inherently belonging to such a process, method, article, or apparatus. An element beginning with "a" or "a" does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes that element.

[0087] To enable readers to quickly understand the nature of the technical disclosure, a summary of the disclosure is provided. When submitting the summary, it should be understood that it is not intended to interpret or limit the scope or meaning of the claims. Furthermore, in the foregoing detailed description, various features are combined to simplify the disclosure. This method of disclosure should not be construed as reflecting an intention to include more features in the claimed embodiment than are expressly recited in each claim. Rather, as reflected in the following claims, the inventive subject matter lies in fewer than all features of a single disclosed embodiment. Therefore, the following claims are incorporated into the detailed description, each claim being an independent, separately claimed subject matter.

Claims

1. A method for reconstructing a multi-chip laminate structure, the method comprising: Deposit conductive pads on a flexible insulating film; Install a flexible insulating film on the retaining surface; The surface will be kept heated to a temperature higher than the solder melting temperature; The retaining surface with the flexible insulating film is lowered toward the laminated structure until at least one of the conductive pads mounted on the flexible insulating film contacts one or more solder bumps on the laminated structure; and When one or more of the solder bumps have melted and at least partially transferred to the conductive pads of the retaining surface, the retaining surface with the flexible insulating film is retracted.

2. The method of claim 1, further comprising aligning the flexible insulating film with the same pitch as the one or more solder bumps to be extracted.

3. The method according to claim 1 or claim 2, wherein the retaining surface during the descent and retraction operations is a thermo-pressed bonded (TCB) tool head.

4. The method according to any one of the preceding claims further comprises repeatedly lowering and retracting the retaining surface with the flexible insulating film until a residual amount of solder remains on a plurality of bare die pads on the laminate to which the one or more solder bumps were previously attached.

5. The method of claim 4, further comprising controlling the volume of solder bumps transferred onto the conductive pads based on the size of the conductive pads used, and wetting the conductive pads before removing the solder bumps.

6. The method according to any one of the preceding claims further comprises varying the pitch space of the conductive pads on the flexible insulating film to align with the pitch of one or more solder bumps.

7. The method according to any one of the preceding claims, wherein contact between conductive pads on the flexible insulating film and one or more solder bumps is detected by force feedback of the retaining surface with the flexible insulating film.

8. The method according to any one of the preceding claims, wherein mounting the flexible insulating film on the retaining surface includes applying a vacuum.

9. The method according to any one of the preceding claims further includes solder transferred from the conductive pad cleaning portion after the retaining surface with the flexible insulating film is retracted from the laminate structure.

10. The method according to any one of the preceding claims further comprises cleaning one or more bare die pads with residual solder on the laminate structure after transferring one or more solder bump portions to conductive pads.

11. The method according to any one of the preceding claims further comprises mechanically separating at least one chip from the laminate structure before reconstructing the laminate structure.

12. An apparatus for reconstructing a multi-chip stacked structure, the apparatus comprising: processor; A storage device coupled to the processor; The storage device stores instructions to cause the processor to perform actions, including: Deposit conductive pads on a flexible insulating film; Install a flexible insulating film on the retaining surface; The surface will be kept heated to a temperature higher than the solder melting temperature; Lower the retaining surface toward the laminated structure until at least one of the conductive pads mounted on the flexible insulating film contacts one or more solder bumps on the laminated structure; and When one or more of the solder bumps have melted and at least partially transferred to the conductive pads on the flexible insulating film, the retaining surface retracts.

13. The device of claim 12, wherein the flexible insulating film comprises a polyimide structure.

14. The device of claim 13, wherein the polyimide structure comprises Kapton. ® membrane.

15. The device according to any one of claims 12 to 14, wherein the conductive pads comprise copper pads.

16. The device according to any one of claims 12 to 15, wherein the instructions cause the processor to perform an additional action, the additional action comprising aligning the flexible insulating film at the same pitch as one or more solder bumps to be extracted.

17. The device according to any one of claims 12 to 16, wherein the instructions cause the processor to perform additional actions, the additional actions comprising repeatedly lowering the holding surface until contact is formed between at least one of the conductive pads and one or more solder bumps, and retracting the holding surface when one or more of the solder bumps have melted.

18. The device according to any one of claims 12 to 17, wherein the retaining surface includes a thermo-pressed bonding (TCB) tool head, and wherein the instruction causes the processor to perform an additional action, the additional action including repeatedly lowering and retracting the TCB tool head until a residual amount of solder remains on a plurality of bare die pads on a laminate to which the one or more solder bumps were previously attached.

19. The device according to any one of claims 12 to 18, wherein the instructions cause the processor to perform an additional action, the additional action comprising changing the pitch space of conductive pads on the flexible insulating film to align with the pitch of one or more solder bumps.

20. The apparatus according to any one of claims 12 to 19, wherein the volume of solder extracted from one or more solder bumps is based on the size of the conductive pads.

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