An electronic nail art and a method of making the same
By using a structural design that combines a laminated substrate, an electronic paper layer, a UV adhesive layer, and a high-transparency protective layer, along with mold shaping and UV curing technology, the problem of matching curved and flat materials in mass production of nail art has been solved, achieving efficient production and high-quality curved nail art.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHENZHEN REFOND OPTOELECTRONICS CO LTD
- Filing Date
- 2026-06-04
- Publication Date
- 2026-07-17
AI Technical Summary
In the mass production of existing nail products, it is difficult to match curved and flat materials without stress, which leads to problems such as bubbles, wrinkles or local delamination, affecting the appearance quality and structural consistency of the finished product, and making it difficult to control the yield rate.
The structure employs a bottom-up, sequentially stacked structure consisting of a substrate, an electronic paper layer, a UV adhesive layer, and a high-transparency protective layer. The substrate has a conductive pattern layer on the front and conductive contacts on the back. The electronic paper layer is electrically connected to the conductive pattern layer. The UV adhesive layer allows deformation before curing and locks in its shape after curing. The high-transparency protective layer provides physical protection. After cutting, the material is shaped under pressure in a mold and cured by UV light to form a curved armor plate.
This technology enables stress-free and precise bonding of electronic nail art in a flat state, significantly improving production efficiency and yield rate, ensuring display uniformity and structural integration, while reducing non-display borders and improving the accuracy and brightness of pattern display.
Smart Images
Figure CN122398039A_ABST