A buffer cleaning sheet for a probe card and a method of manufacturing the same
By combining a three-dimensional through-hole waterborne polyurethane buffer layer with a micron-sized abrasive cleaning and polishing layer, the problems of tip damage and environmental pollution during probe cleaning are solved, achieving a highly efficient and environmentally friendly probe cleaning effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- MOZART SEMICON (SUZHOU) CO LTD
- Filing Date
- 2026-05-25
- Publication Date
- 2026-07-17
AI Technical Summary
Existing cleaning methods are insufficient to effectively remove solder residue and oxide layers without damaging the probe tip, and traditional cleaning materials pose an environmental pollution risk.
The combination of a water-based polyurethane buffer layer with a three-dimensional through-hole structure and a micron-sized abrasive cleaning and polishing layer, along with a gradient solidification process and selectable abrasive types, forms a uniform and stable buffer cleaning sheet that combines protection and cleaning capabilities.
It reduces the risk of probe tip wear and deformation, improves cleaning stability and debris holding capacity, and achieves environmentally friendly and efficient cleaning results.
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