A manufacturing method for improving the dimensional accuracy of large panels
Through systematic factor identification and process optimization, including panel saw clamp calibration, infrared detection and secondary finishing, and edge banding feeding device optimization, the problem of high defect rate of large board size deviation was solved, the whole process control of large board size accuracy was realized, the overall defect rate and deviation were reduced, and the production efficiency and board utilization rate were improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- DEHUA TB NEW DECORATION MATERIAL CO LTD
- Filing Date
- 2026-04-24
- Publication Date
- 2026-07-17
AI Technical Summary
Even after the dimensional accuracy standard was raised to ±0.5mm, the defect rate of large board dimensional deviation remained high, especially for boards with a length/width ≥250mm, which became the hardest hit area for dimensional deviation. Existing technology failed to effectively solve the core influencing factors, resulting in an overall defect rate of over 50%.
Through systematic factor identification, a standardized process combining panel saw clamp calibration, infrared detection, and secondary finishing is adopted. Combined with the optimization of the edge banding feeding device, a full-process precision detection system is established to achieve precise control of the dimensional accuracy of large panels.
It has achieved closed-loop management of the entire process for large board size accuracy, reduced the overall defect rate to ≤10%, and reduced the proportion of large board size deviation defects to ≤22.03%, balancing production efficiency and board utilization, and improving product quality and production efficiency.
Smart Images
Figure CN122401563A_ABST