Deposition masks, methods of making the same, and electronic devices manufactured using the same
By using a deposition mask designed with a multilayer film structure and precise etching process, the problems of material loss and uneven thickness caused by pixel aperture design in high-resolution display panels are solved, achieving higher pixel position accuracy and material utilization efficiency, and supporting high-quality manufacturing of microdisplays.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SAMSUNG DISPLAY CO LTD
- Filing Date
- 2025-11-10
- Publication Date
- 2026-07-17
AI Technical Summary
In the manufacturing of high-resolution display panels, the pixel aperture design of the deposition mask in existing technologies leads to increased loss of deposited material, affecting the thickness and uniformity of the light-emitting layer, making it difficult to achieve a resolution of 3000 pixels per inch or higher.
A deposition mask with a multilayer film structure of different widths, including a first pixel opening and a second pixel opening, is formed by plasma-enhanced chemical vapor deposition and low-pressure chemical vapor deposition, combined with anisotropic and isotropic etching processes to form pixel openings of different widths that are separated from the mask substrate.
It improves the deposition uniformity of the light-emitting layer and the pixel position accuracy, reduces material loss, lowers manufacturing costs, and supports precise patterning of submicron features, thereby enhancing display quality.
Smart Images
Figure CN122406153A_ABST