Electroplating assembly for high-density integrated circuit lead frame reels
By designing an electroplating assembly bracket and a modular electroplating production line, an automated production line for lead frame strip electroplating was achieved, solving the problem of low automation and improving production efficiency and electroplating quality. This is suitable for the electroplating production of high-density integrated circuits.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- DONGGUAN ALLMERIT TECH CO LTD
- Filing Date
- 2026-05-29
- Publication Date
- 2026-07-17
AI Technical Summary
The existing electroplating production of lead frames suffers from low automation, disjointed process connections, and frequent material transfers that cause scratches and contamination, affecting electroplating quality and making it difficult to achieve fully automated production line operations.
Design an electroplating assembly for lead frame rolls of high-density integrated circuits, including an assembly bracket and side-by-side electroplating production line modules. The assembly line achieves automated production line operation through continuous feeding, electroplating, pulling and collecting mechanisms. Each tank is modularly assembled through splicing components to ensure process continuity and flexibility.
It realizes the automated production line operation of lead frame strip from feeding to winding, improves production efficiency, reduces the risk of damage during transportation, ensures electroplating quality and production flexibility, and is suitable for high-efficiency electroplating of high-density integrated circuits.
Smart Images
Figure CN122406347A_ABST