A cold and hot integrated device applied to a vacuum environment
By integrating a heating and cooling structure and thermal isolation design, the integrated heating and cooling device solves the problems of low temperature control efficiency and interference in vacuum environments, enabling stable and continuous in-situ observation of samples under high vacuum, thus broadening the application scenarios of microscopic analysis.
CN122408387APending Publication Date: 2026-07-17HANGZHOU YUANWEI TECH CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- HANGZHOU YUANWEI TECH CO LTD
- Filing Date
- 2026-05-06
- Publication Date
- 2026-07-17
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Figure CN122408387A_ABST
Abstract
本发明提供了一种应用于真空环境的冷热一体装置，属于材料科学显微分析技术领域，该装置集成制冷与制热功能，兼容高真空环境，实现对样品的从深低温到高温的原位显微分析。其核心结构包括：由制冷片与水冷头组成的制冷组件、由加热核心与电热丝组成的制热组件、用于热量传导与样品承载的导热组件，以及包覆整体的隔热组件。通过将加热核心集成于导热块内部，并将导热块底部与制冷片贴合，同时利用隔热罩与底座实现整体封装与热隔离，有效抑制了热量向真空腔体的扩散。该装置支持同一微区样品在冷热循环过程中的连续原位观测，避免了样品转移带来的干扰，显著提高了高真空环境下原位显微分析的可靠性与实验效率。
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