Electronic device comprising a coil

Abstract

An electronic device according to various embodiments of the present application includes a circuit board, and a first coil and a second coil formed on the circuit board. The first coil includes a plurality of first windings, and the second coil includes a plurality of second windings substantially surrounded by an innermost winding among the plurality of first windings of the first coil and configured to provide power to an external electronic device, wherein an inductance of the second coil can be configured to be greater than an inductance of the first coil.

Description

Technical Field

[0001] Various embodiments of this disclosure provide electronic devices including at least one coil. Background Technology

[0002] The use of electronic devices such as mobile terminals (e.g., smartphones) and wearable devices (e.g., watches) is steadily increasing, and a wide variety of functions are offered on these devices.

[0003] Electronic devices may include batteries to supply the power required to perform various functions. Electronic devices can charge their batteries using wired or wireless charging methods.

[0004] For example, in the case of a wireless charging method, when an electronic device is placed on a wireless charging device, the battery of the electronic device can be charged by supplying power from a power transmitting coil located inside the wireless charging device to a power receiving coil located inside the electronic device.

[0005] In the case of wireless charging, when an external electronic device (e.g., a wearable device) is placed on the electronic device, power can be supplied to a power receiving coil located inside the external electronic device via a power transmitting coil located inside the electronic device.

[0006] The above information is provided as relevant technical information to aid in understanding this disclosure. No representation or determination is made regarding the applicability of any of the foregoing content as prior art to this disclosure. Summary of the Invention

[0007] Technical issues

[0008] Methods for wirelessly charging electronic devices or external electronic devices may include electromagnetic induction using coils, resonant methods using resonance, or radio wave radiation methods that convert electrical energy into microwaves and transmit the microwaves.

[0009] For example, in electromagnetic induction methods, the magnetic field induced by a coil can be used to wirelessly transmit power from a wireless charging device (e.g., a wireless charging transmitter) to an electronic device (e.g., a wireless charging receiver), thereby charging a battery included in the electronic device.

[0010] The electronic device may include at least one coil and may provide wireless charging power to an external electronic device (e.g., a wearable device such as a watch or wireless headphones) by means of electromagnetic induction.

[0011] For example, in an electronic device that includes a coil in which two or more wires (e.g., conductive wires) are wound in a spiral shape to provide wireless charging power to an external electronic device, the lengths of the inner and outer wires may differ. For instance, when current flows through a coil with inner and outer wires of different lengths, an impedance difference is generated between the inner and outer wires, which may result in high current density or uneven distribution of current density in the coil.

[0012] For example, when a high current density or uneven current density distribution is formed in the coil used by an electronic device to provide wireless charging power to an external electronic device, the coil may generate excessive heat, and the wireless charging efficiency may be reduced.

[0013] Various embodiments of this disclosure may provide an electronic device that allows for a uniform current density to be distributed in a coil to provide wireless charging power to an external electronic device.

[0014] The technical problems solved by this disclosure are not limited to those described above, and those skilled in the art will understand other technical problems more clearly from the following description.

[0015] Solution to the problem

[0016] An electronic device according to embodiments of the present disclosure may include a circuit board and a first coil and a second coil disposed on the circuit board. According to an embodiment, the first coil may include a plurality of first windings. According to an embodiment, the second coil may include a plurality of second windings substantially surrounding the innermost of the plurality of first windings of the first coil, and is configured to provide power to an external electronic device. According to an embodiment, the second coil may be configured to have an inductance greater than that of the first coil.

[0017] An electronic device according to embodiments of the present disclosure may include: a circuit board; a first coil including a plurality of windings disposed on the circuit board; and a second coil substantially surrounded by the innermost winding of the first coil, and including a 2-1 winding disposed in a first layer of the circuit board and a 2-2 winding disposed in a second layer of the circuit board overlapping the first layer. According to an embodiment, the 2-1 winding may include a first sub-wire and a second sub-wire, and the first sub-wire of the 2-1 winding may be disposed outside the second sub-wire. According to an embodiment, the 2-2 winding may include a first sub-wire and a second sub-wire, and the first sub-wire of the 2-2 winding may be disposed inside the second sub-wire. According to an embodiment, at least one crossing region may be located in the innermost winding of the 2-1 winding and the 2-2 winding. According to an embodiment, in the crossing region, the first sub-wire of the 2-1 winding and the first sub-wire of the 2-2 winding may be connected, and the second sub-wire of the 2-1 winding and the second sub-wire of the 2-2 winding may be connected.

[0018] Beneficial effects of the invention

[0019] According to various embodiments of this disclosure, by ensuring a uniform current density distribution in the coil of an electronic device used to provide wireless charging power to an external electronic device, heat generation in the coil can be reduced and wireless charging efficiency can be improved.

[0020] In addition, various effects that can be directly or indirectly identified through this disclosure may be provided. Attached Figure Description

[0021] In conjunction with the description of the accompanying drawings, the same or similar reference numerals may be used for the same or similar elements.

[0022] Figure 1 This is a block diagram illustrating an electronic device in a network environment according to various embodiments of the present disclosure.

[0023] Figure 2 This is a block diagram of a power circuit and a battery in an electronic device according to embodiments of the present disclosure for receiving power from and / or transmitting power to the outside of the electronic device.

[0024] Figure 3A This is a perspective view of the front surface of an electronic device according to various embodiments of the present disclosure.

[0025] Figure 3B This is a perspective view of the rear surface of an electronic device according to various embodiments of the present disclosure.

[0026] Figure 4 This is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.

[0027] Figure 5 This is a schematic diagram illustrating a first coil, a second coil, and a circuit board included in an electronic device according to an embodiment of the present disclosure.

[0028] Figure 6 This illustrates an embodiment according to the present disclosure. Figure 5 A schematic diagram of the first coil shown.

[0029] Figure 7 This is a schematic diagram illustrating a first coil in which a single conductor is wound in a spiral shape according to an embodiment of the present disclosure.

[0030] Figure 8 This is a schematic diagram showing a first coil in which three of the conductors are wound in a spiral shape according to an embodiment of the present disclosure.

[0031] Figure 9 This is a schematic diagram illustrating the configuration of a second coil according to an embodiment of the present disclosure.

[0032] Figure 10 This is a schematic diagram showing a second 2-1 winding of a second coil disposed in a first layer of a circuit board according to an embodiment of the present disclosure.

[0033] Figure 11 This is a schematic diagram showing a second 2-2 winding of a second coil disposed in a second layer of a circuit board according to an embodiment of the present disclosure.

[0034] Figure 12 This is a schematic diagram showing the configuration in which the 2-1 winding and the 2-2 winding of the second coil are interconnected in the cross region according to an embodiment of the present disclosure.

[0035] Figure 13 This is a schematic diagram illustrating a configuration in which the 2-1 winding and the 2-2 winding of a second coil according to an embodiment of the present disclosure are connected by at least one via.

[0036] Figure 14 This is a schematic diagram illustrating the current distribution of a second coil according to an embodiment of the present disclosure.

[0037] Figure 15 This is a schematic diagram illustrating the configuration of a second coil according to various embodiments of the present disclosure.

[0038] Figure 16 This is a schematic diagram showing the 2-1 winding of the second coil disposed in the first layer of the circuit board and the 2-2 winding of the second coil disposed in the second layer of the circuit board according to various embodiments of the present disclosure.

[0039] Figure 17 This is a schematic diagram illustrating the current distribution of a second coil according to various embodiments of the present disclosure. Detailed Implementation

[0040] Figure 1 This is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments.

[0041] Reference Figure 1A. Electronic device 101 in network environment 100 can communicate with electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or with at least one of electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 101 can communicate with electronic device 104 via server 108. According to an embodiment, electronic device 101 may include a processor 120, memory 130, input module 150, sound output module 155, display module 160, audio module 170, sensor module 176, interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, user identification module (SIM) 196, or antenna module 197. In some embodiments, at least one of the above components (e.g., connection terminal 178) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some embodiments, some of the components described above (e.g., sensor module 176, camera module 180, or antenna module 197) may be implemented as a single integrated component (e.g., display module 160).

[0042] Processor 120 may run software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of electronic device 101 connected to processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, processor 120 may store commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the commands or data stored in volatile memory 132, and store the resulting data in non-volatile memory 134. According to embodiments, processor 120 may include a main processor 121 (e.g., central processing unit (CPU) or application processor (AP)) or an auxiliary processor 123 (e.g., graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 121. For example, when electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or may be implemented as part of the main processor 121.

[0043] When the main processor 121 is inactive (e.g., in sleep) state, the auxiliary processor 123 (rather than the main processor 121) can control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190), or when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 can work with the main processor 121 to control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190). According to embodiments, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) functionally associated with the auxiliary processor 123. According to embodiments, the auxiliary processor 123 (e.g., a neural processing unit) may include hardware architecture dedicated to artificial intelligence model processing. Artificial intelligence models can be generated through machine learning. For example, such learning can be performed via electronic device 101 where artificial intelligence is performed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple layers of artificial neural networks. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q-network, or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include software structures in addition to hardware structures.

[0044] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The various data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0045] The program 140 may be stored as software in the memory 130, and the program 140 may include, for example, an operating system (OS) 142, middleware 144, or application 146.

[0046] The input module 150 can receive commands or data from outside the electronic device 101 (e.g., a user) that will be used by other components of the electronic device 101 (e.g., processor 120). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., stylus).

[0047] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to an embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0048] Display module 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display device 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display module 160 may include a touch sensor adapted to detect touch or a pressure sensor adapted to measure the intensity of the force caused by touch.

[0049] The audio module 170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or headphones of an external electronic device (e.g., electronic device 102) that is directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0050] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or the environmental state outside electronic device 101 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 176 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0051] Interface 177 may support one or more specific protocols used to enable electronic device 101 to connect directly (e.g., wired) or wirelessly to external electronic devices (e.g., electronic device 102). According to embodiments, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0052] Connection 178 may include a connector, through which electronic device 101 may be physically connected to an external electronic device (e.g., electronic device 102). According to embodiments, connection 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0053] The haptic module 179 can convert electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that can be recognized by a user through his touch or kinesthesia. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0054] Camera module 180 can capture still or moving images. According to an embodiment, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0055] The power management module 188 manages the power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0056] Battery 189 can power at least one component of electronic device 101. According to an embodiment, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0057] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors capable of operating independently of processor 120 (e.g., application processor (AP)) and support direct (e.g., wired) or wireless communication. According to embodiments, communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). One of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, 5G network, next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components separate from each other (e.g., multiple chips). The wireless communication module 192 can identify and verify the electronic device 101 in the communication network (such as the first network 198 or the second network 199) using user information (e.g., the International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0058] Wireless communication module 192 can support 5G networks following 4G networks and next-generation communication technologies (such as new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communication (mMTC), or ultra-reliable low-latency communication (URLLC). Wireless communication module 192 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 192 can support various technologies used to ensure performance in high-frequency bands, such as, for example, beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 192 can support various requirements specified in electronic device 101, external electronic devices (e.g., electronic device 104), or network systems (e.g., second network 199). According to an embodiment, the wireless communication module 192 may support peak data rates (e.g., 20 Gbps or greater) for implementing eMBB, lost coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip) for implementing URLLC.

[0059] Antenna module 197 can transmit or receive signals or power to or from the exterior of electronic device 101 (e.g., external electronic device). According to an embodiment, antenna module 197 may include an antenna comprising a radiating element formed of a conductive material or conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, antenna module 197 may include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199) can be selected from the multiple antennas by, for example, communication module 190 (e.g., wireless communication module 192). Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, additional components besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally incorporated into antenna module 197.

[0060] According to various embodiments, antenna module 197 may form a millimeter-wave antenna module. According to embodiments, the millimeter-wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and multiple antennas (e.g., an array antenna), wherein the RFIC is disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and is capable of supporting a specified high-frequency band (e.g., a millimeter-wave band), and the multiple antennas are disposed on or adjacent to a second surface (e.g., a top surface or a side surface) of the printed circuit board and are capable of transmitting or receiving signals in the specified high-frequency band.

[0061] At least some of the aforementioned components can be interconnected and communicate signals (e.g., commands or data) between them via an inter-peripheral communication scheme (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0062] According to an embodiment, commands or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 connected to a second network 199. Each of electronic device 102 or electronic device 104 can be a device of the same type as electronic device 101, or a device of a different type. According to an embodiment, all or some operations that would be performed on electronic device 101 can be performed on one or more of external electronic devices 102, external electronic devices 104, or server 108. For example, if electronic device 101 is required to automatically perform a function or service, or is required to perform a function or service in response to a request from a user or another device, electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service, instead of running the function or service, or electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, one or more external electronic devices may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 101. Electronic device 101 may provide the result as at least a partial response to the request, with or without further processing of the result. For this purpose, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing may be used. Electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and / or neural networks. According to embodiments, external electronic device 104 or server 108 may be included in a second network 199. Electronic device 101 may be applied to intelligent services based on 5G communication technology or IoT-related technologies (e.g., smart homes, smart cities, smart cars, or healthcare).

[0063] Figure 2 This is a block diagram 200 of an electronic device 101 according to an embodiment of the present disclosure, comprising a power circuit 210 and a battery 189 for receiving and / or transmitting power from the outside of the electronic device 101 to the outside of the electronic device 101.

[0064] refer to Figure 2 The electronic device 101 according to the embodiment may include at least one of a battery 189, a power circuit 210, a communication circuit 220, a control circuit 230, and / or a wired interface 240.

[0065] According to an embodiment, battery 189 may include a battery protection circuit (protection circuit module). The battery protection circuit may perform various functions (e.g., preventative functions) to prevent performance degradation of battery 189 or damage due to fire. The battery protection circuit may be implemented as at least part of a battery management system (BMS) to additionally or alternatively perform battery balancing, measure the remaining charge of battery 189, measure the number of charge / discharge cycles, measure temperature, or measure voltage. According to an embodiment, at least a portion of the battery 189's usage status information or charging status information may be identified by using a fuel gauge integrated circuit (IC), power circuit 210, or a sensor module (e.g., a temperature sensor).

[0066] According to an embodiment, the power circuit 210 may include at least one circuit configured to support wired charging for charging the battery 189 using power input from an external electronic device (e.g., a travel adapter (TA)) via a wired interface 240, and / or at least one circuit configured to support wireless charging for charging the battery 189 using power input from an external electronic device (e.g., a wireless charging pad) via a conductive pattern (e.g., a coil) 219.

[0067] According to an embodiment, at least one circuit supporting wired charging may include circuitry configured to charge battery 189 using power input from an external electronic device (e.g., TA) and / or circuitry configured to generate a specified voltage using the voltage of battery 189 and transmit power based on the specified voltage to an external electronic device via a wired interface 240 (e.g., a USB interface).

[0068] According to an embodiment, at least one circuit supporting wireless charging may include a circuit configured to receive power from an external electronic device via conductive pattern 219 and charge battery 189 using the received power (or rectified, converted, and / or regulated power) and / or a circuit configured to convert the voltage of power received from battery 189 or external electronic device (e.g., TA) to a specified voltage value, convert the current characteristics of power with the specified voltage value from direct current (DC) to alternating current (AC), and wirelessly transmit power via conductive pattern 219.

[0069] According to an embodiment, the power circuit 210 can simultaneously perform the operation of charging the battery 189 and the operation of transmitting power to an external electronic device. For example, the charging circuit 218 may include multiple charging circuits. At least one of the multiple charging circuits can receive power from an external electronic device (e.g., TA) via a wired interface 240 and use the received power to charge the battery 189. At least one of the multiple charging circuits can transfer the energy charged in the battery 189 to the transmitting / receiving circuit 213. The transmitting / receiving circuit 213 can transmit the power received from the battery 189 by the charging circuit 218 to an external electronic device (e.g., a smartphone or wireless headset charging case) via a conductive pattern 219. According to an embodiment, wireless power transmission methods such as magnetic field inductive coupling, resonant coupling, or combinations thereof can be used for wireless charging.

[0070] According to an embodiment, the power circuit 210 may include a conductive pattern 219, a matching circuit 211, a transmitting / receiving circuit 213, an adjustment circuit 215, a switching circuit 217, and a charging circuit 218.

[0071] According to an embodiment, the matching circuit 211 may be configured to minimize power return loss when transmitting or receiving power from an external electronic device via the conductive pattern 219. For example, the matching circuit 211 may be inserted into the line between the conductive pattern 219 and the transmitting / receiving circuit 213 for impedance matching.

[0072] According to an embodiment, the transmitting / receiving circuit 213 can be configured to convert the current of the power signal from alternating current (AC) to direct current (DC) when receiving power through the conductive pattern 219. For example, the transmitting / receiving circuit 213 may include a rectifier circuit. The transmitting / receiving circuit 213 can also be configured to convert the current of the power signal from DC to AC when transmitting power through the conductive pattern 219. For example, the transmitting / receiving circuit 213 may include an inverter circuit. The regulating circuit 215 can be configured to regulate the charging voltage and may include, for example, a linear regulator (e.g., a low dropout (LDO)).

[0073] According to an embodiment, the switching circuit 217 may include at least one switch (e.g., at least one switching circuit) for controlling power output to a device (e.g., an on-the-go (OTG) device) or a wired power receiving device connected via the wired interface 240, and power input from a wired charging device. According to an embodiment, the switching circuit 217 may also include at least one switch (e.g., at least one switching circuit) for controlling a receiving function for wirelessly receiving power from an external electronic device via the conductive pattern 219 and / or a transmitting function for wirelessly transmitting power via the conductive pattern 219, based on the voltage of the battery 189 or power input from an external electronic device (e.g., a TA). According to an embodiment, the transmitting / receiving circuit 213 may be implemented as a full-bridge inverter or a half-bridge inverter, but this disclosure is not limited thereto and can be modified in various forms.

[0074] According to an embodiment, charging circuit 218 may be electrically connected to switching circuit 217 and may adjust the voltage and / or current of power input via wired or wireless charging. For example, charging circuit 218 may adjust the voltage and / or current of power input via switching circuit 217 to charge battery 189. According to an embodiment, charging circuit 218 may include a switching charger (e.g., a DC / DC converter) comprising a buck-boost converter (not shown) and a charging controller (not shown). According to an embodiment, charging circuit 218 may include a direct charger that supports direct charging (e.g., "DC charging") using a switched capacitor divider method. The direct charger may include an N:1 divider that reduces the input voltage to 1 / N (where N is a positive integer) and increases the input current by a factor of N.

[0075] According to an embodiment, the communication circuit 220 may be a circuit for communication between a transmitter and a receiver during wireless charging, and may include at least one of a first communication circuit 221 or a second communication circuit 223. The first communication circuit 221 may perform communication (in-band communication) by carrying information about the power transmitted via, for example, the conductive pattern 219. The first communication circuit 221 may communicate with external electronic devices using at least one modulation technique of Frequency Shift Keying (FSK) and Amplitude Shift Keying (ASK), wherein FSK carries information at a power frequency during wireless power transmission, and ASK carries information at a power amplitude during wireless power reception. The first communication circuit 221 may be disposed between and electrically connected to the conductive pattern 219 and the transmitting / receiving circuit 213 to perform FSK or ASK communication. The second communication circuit 223 may communicate with external electronic devices via the conductive pattern 219 using a frequency in a frequency band different from the frequency of wireless power (out-of-band communication). For example, the second communication circuit 223 can communicate with an external electronic device using one of various short-range communication methods such as Bluetooth, Bluetooth Low Energy (BLE), Wi-Fi, and / or Near Field Communication (NFC). Data transmitted to and received from the external electronic device via the communication circuit 220 may include charging-related information (e.g., rectified voltage, information about the current flowing in the conductive pattern 219 or the transmitting / receiving circuit 213 (e.g., the current value of a power signal transmitted to the outside via coil 219 or the current value of a power signal received from the outside via coil 219)), various packets, and / or configuration messages. For example, according to the Wireless Power Union (WPC) standard, wireless charging operations may include ping operations, identification and configuration operations, and power delivery operations. A ping operation may include an operation by which the electronic device 101 identifies whether an object near the power supply device (e.g., an object placed on a wireless charging pad) is an electronic device capable of communication for power delivery (PD). As an example of a ping operation, electronic device 101 (e.g., control circuit 230) can receive data signals (e.g., digital ping signals or wake-up signals) from a power supply via communication circuit 220 (e.g., first communication circuit 221). In response to the reception of the data signals, control circuit 230 can send a response signal (e.g., signal strength packet (SSP)) to the power supply via communication circuit 220. The power supply can identify that the approaching object is electronic device 101 based on the reception of the response signal. Identification and configuration operations may include electronic device 101 configuring the power value of a power signal to be sent by the power supply by using communication circuit 220 to communicate with the power supply. Power transmission operations may include the power supply sending a power signal with the power value configured in the identification and configuration operations to electronic device 101.Wireless charging operations may also include determining the source for sending power and the destination for receiving power through data communication between two electronic devices.

[0076] According to an embodiment, the control circuit 230 can perform overall control of the power circuit 210 and can generate various messages required for wireless charging and send these messages to the communication circuit 220. The control circuit 230 can manage the power supplied to the electronic device 101 and the power sent from the electronic device 101 via wireless charging. The control circuit 230 can be implemented, for example, as at least a part of a power management integrated circuit (PMIC) or an application processor.

[0077] According to an embodiment, control circuit 230 can identify charging state information related to the charging of battery 189 (e.g., charging / discharging voltage / current, battery life, overvoltage, undervoltage, overcurrent, overcharge, overdischarge, overheating, short circuit, or swelling). For example, control circuit 230 can identify signals (voltage or current) at the input or output terminals of the conductive pattern 219 of power circuit 210, matching circuit 211, or transmitting / receiving circuit 213. Control circuit 230 can determine the state of battery 189 based at least in part on the identified charging state information. If it is determined that battery 189 is in an abnormal state, control circuit 230 can adjust (e.g., adjust charging current, adjust charging voltage, or stop charging) the charging of battery 189. According to an embodiment, electronic device 101 may include at least one sensor (e.g., a temperature sensor) for identifying the charging state of battery 189. Control circuit 230 can identify the charging state of battery 189 based on data received from at least one sensor. For example, if the temperature of the battery 189 being charged is equal to or higher than a predetermined temperature, the control circuit 230 can determine that the battery 189 is in an overheated state and can adjust the charging of the battery 189 (e.g., adjust the charging current, adjust the charging voltage, or stop charging).

[0078] According to an embodiment, wired interface 240 can connect external electronic devices (e.g., TA) and electronic device 101 via a connector. Wired interface 240 may include connection to control circuitry 230 or processor (e.g., ...) via a specified system interface (e.g., Internal Integrated Circuit (I2C) or Mobile Industrial Processor Interface (MIPI)). Figure 1The processor 120 in the device 101 has a USB communication module. For example, the TA can communicate with the USB communication module of the electronic device 101 via a USB port. According to an embodiment, the USB communication module may include a communication module for USB power delivery (PD) communication. According to an embodiment, the external electronic device connected to the electronic device 101 via the wired interface 240 may be a device that supports programmable power supply (PPS) or a device that does not support PPS. For example, a device that supports PPS can adjust the voltage of the power output from the external electronic device to the electronic device 101 based on the control circuit 230 of the electronic device 101. A device that does not support PPS can fix the voltage of the power signal output from the external electronic device to the electronic device 101.

[0079] Figure 3A This is a front perspective view of an electronic device according to various embodiments of the present disclosure. Figure 3B Various embodiments according to this disclosure Figure 3A Rear perspective view of the electronic device in the image.

[0080] Reference Figure 3A and Figure 3B The electronic device 300 according to an embodiment may include a housing 310, the housing 310 including a first surface (or front surface) 310A, a second surface (or rear surface) 310B, and a side surface 310C surrounding the space between the first surface 310A and the second surface 310B. In another embodiment (not shown), the housing 310 may represent a structure forming... Figure 3A and Figure 3B The diagram illustrates a portion of the structure of the first surface 310A, the second surface 310B, and the side surface 310C. According to an embodiment, the first surface 310A may be formed from a front panel 302, at least a portion of which is substantially transparent (e.g., a glass or polymer panel comprising various coatings). The second surface 310B may be formed from a substantially opaque rear panel 311. The rear panel 311 may be made of coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the aforementioned materials. The side surface 310C may be formed from a side frame structure (or “side member”) 318 coupled to the front panel 302 and the rear panel 311, and comprising metal and / or polymer. In some embodiments, the rear panel 311 and the side frame structure 318 may be integrally formed and may comprise the same material (e.g., a metallic material such as aluminum).

[0081] In the illustrated embodiment, the front panel 302 may include two first regions 310D at both ends of the long side of the front panel 202, such that the two first regions 310D curve from the first surface 310A toward the rear panel 311 and extend seamlessly. In the illustrated embodiment (see...) Figure 3BThe rear panel 311 may include two second regions 310E at both ends of its long side, such that the two second regions 310E curve from the second surface 310B toward the front panel 302 and extend seamlessly. In some embodiments, the front panel 302 (or the rear panel 311) may include only one of the first region 310D (or the second region 310E). In another embodiment, a portion of the first region 310D or the second region 310E may not be included. In the above embodiments, when viewed from the side surface of the electronic device 300, the side frame structure 318 may have a first thickness (or width) on the portion of the side surface that does not include the first region 310D or the second region 310E as described above, and may have a second thickness less than the first thickness on the portion of the side surface that includes the first region 310D or the second region 310E.

[0082] According to an embodiment, the electronic device 300 may include at least one of a display 301, an input module 303, sound output modules 307 and 314, sensor modules 304 and 319, camera modules 305, 312 and 313, a key input device 317, an indicator, and a connector 308. In some embodiments, at least one of the components of the electronic device 300 (e.g., the key input device 317 or the indicator) may be omitted, or the electronic device 300 may additionally include another component.

[0083] For example, the display 301 may be exposed through a corresponding portion of the front panel 302. In some embodiments, at least a portion of the display 301 may be exposed through the front panel 302 forming a first region 310D of the side surface 310C and the first surface 310A. In some embodiments, the display 301 may have corners formed with a shape substantially the same as the shape of the adjacent outer periphery of the front panel 302. In another embodiment (not shown), to increase the exposed area of ​​the display 301, the spacing between the outer periphery of the display 301 and the outer periphery of the front panel 302 may be formed to be substantially the same.

[0084] Input module 303 may include a microphone. A microphone for acquiring external sound may be arranged in microphone 303, and in some embodiments, multiple microphones may be arranged therein to allow for sensing of the direction of sound. Sound output modules 307 and 314 may include speakers 307 and 314. Speakers 307 and 314 may include an external speaker 307 and a voice receiver 314.

[0085] Sensor modules 304 and 319 can generate electrical signals or data values ​​corresponding to the internal operating conditions of the electronic device 300 or its external environmental conditions. Sensor modules 304 and 319 may include, for example, a first sensor module 304 (e.g., a proximity sensor) disposed on a first surface 310A of the housing 310 and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a second surface 310B of the housing 310 and / or a third sensor module 319 (e.g., an HRM sensor). The electronic device 300 may also include at least one of the following sensor modules not shown: a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an accelerometer, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or a brightness sensor 304.

[0086] Camera modules 305, 312, and 313 may include a first camera device 305 disposed on a first surface 310A of the electronic device 300, a second camera device 312 disposed on a second surface 310B of the electronic device 300, and / or a flash 313. Camera devices 305 and 312 may include a single lens or multiple lenses, an image sensor, and / or an image signal processor. The flash 313 may include, for example, a light-emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared camera, wide-angle lens, and telephoto lens) and an image sensor may be disposed on a single surface of the electronic device 300.

[0087] The key input device 317 may be disposed on the side surface 310C of the housing 310. In another embodiment, the electronic device 300 may not include a portion or the entire key input device 317 described above, and the key input device 317 (not included) may be implemented on the display 301 in another type, such as soft keys. In some embodiments, the key input device may include a sensor module disposed on the second surface 310B of the housing 310.

[0088] For example, an indicator may be disposed on a first surface 310A of the housing 310. For example, the indicator may provide information about the status of the electronic device 300 in the form of light. In another embodiment, for example, the indicator may provide a light source that interacts with the operation of the camera module 305. The indicator may include, for example, LEDs, IR LEDs, and xenon lamps.

[0089] The connector may include a first connector hole 308 and / or a second connector hole (e.g., a headphone jack), the first connector hole 308 being capable of accommodating a connector for sending power and / or data to / receiving power and / or data from an external electronic device (e.g., a USB connector), and the second connector hole 308 being capable of accommodating a connector for sending audio signals to / receiving audio signals from an external electronic device.

[0090] Figure 4 This is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.

[0091] Reference Figure 4 Electronic device 400 may include a side bezel structure 410, a first support member 411 (e.g., a bracket), a front panel 420, a display 430, a printed circuit board 440, a battery 450, a second support member 460 (e.g., a rear cover), an antenna 470, and a rear panel 480. In some embodiments, at least one of the components of electronic device 400 (e.g., the first support member 411 or the second support member 460) may be omitted, or electronic device 400 may also include another component. At least one of the components of electronic device 400 may be combined with... Figures 1 to 3B At least one of the constituent elements of the electronic device is the same or similar, and repeated descriptions thereof will be omitted herein.

[0092] The first support member 411 may be disposed inside the electronic device 400 and connected to the side bezel structure 410, or may be integrally formed with the side bezel structure 410. For example, the first support member 411 may be made of a metallic material and / or a non-metallic (e.g., polymer) material. The display 430 may be coupled to one surface of the first support member 411, and the printed circuit board 440 may be coupled to the other surface of the first support member 411.

[0093] The processor, memory, and / or interface may be mounted on the printed circuit board 440. The processor may include one or more of, for example, a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0094] According to an embodiment, the printed circuit board 440 may include a first PCB 440a and / or a second PCB 440b. For example, the first PCB 440a and the second PCB 440b may be arranged spaced apart from each other and may be electrically connected to each other using a connecting member 445 (e.g., a coaxial cable and / or a FPCB). In an embodiment, the printed circuit board 440 may include a structure in which multiple printed circuit boards (PCBs) are stacked on top of each other. For example, the printed circuit board 440 may include an interposer structure. In an embodiment, the printed circuit board 440 may be implemented in the form of a flexible printed circuit board (FPCB) and / or a rigid printed circuit board (PCB).

[0095] The memory may include, for example, volatile memory or non-volatile memory.

[0096] The interface may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect, for example, electronic device 300 and external electronic devices, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0097] Battery 450 may be a means for supplying power to at least one component of electronic device 400, and may include a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of battery 450 may be disposed on, for example, a plane substantially the same as printed circuit board 440. Battery 450 may be integrally disposed within electronic device 400. In another embodiment, battery 450 may be configured to be attachable to / removable from electronic device 400.

[0098] Antenna 470 may be located between rear panel 480 and battery 450. Antenna 470 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetically secure transmission (MST) antenna. For example, antenna 470 may wirelessly transmit and receive power required for charging or perform near field communication with external devices. In another embodiment, the antenna structure may be formed by a portion or combination of side frame structure 310 and / or first support member 411.

[0099] Figure 5 This is a schematic diagram illustrating a first coil, a second coil, and a circuit board included in an electronic device according to an embodiment of the present disclosure. Figure 6 This illustrates an embodiment according to the present disclosure. Figure 5 A schematic diagram of the first coil shown. Figure 7 This is a schematic diagram illustrating a first coil in which a single conductor is wound in a spiral shape according to an embodiment of the present disclosure. Figure 8This is a schematic diagram showing a first coil in which three of the conductors are wound in a spiral shape according to an embodiment of the present disclosure. Figure 9 This is a schematic diagram illustrating the configuration of a second coil according to an embodiment of the present disclosure. Figure 10 This is a schematic diagram showing a second 2-1 winding of a second coil disposed in a first layer of a circuit board according to an embodiment of the present disclosure. Figure 11 This is a schematic diagram showing a second 2-2 winding of a second coil disposed in a second layer of a circuit board according to an embodiment of the present disclosure.

[0100] According to various embodiments, Figure 5 The electronic device 500 may include Figure 1 and Figure 2 The electronic device 101 described in the document Figure 3A and Figure 3B The electronic device 300 and / or described herein Figure 4 The electronic device 400 described herein. Figure 5 The electronic device 500 in the middle can include in substantially the same way Figure 1 and Figure 2 Components of electronic device 101 in Figure 3A and Figure 3B Components and / or components of electronic device 300 in Figure 4 Components of electronic device 400 in the middle.

[0101] According to various embodiments, the battery described below may include Figure 1 and Figure 2 The battery 189 and / or described in Figure 4 The battery 450 described herein. The first coil 510 and the second coil 520 described below may include Figure 2 The conductive pattern 219 is described in the diagram. The first coil 510 and the second coil 520, described below, can perform the same operation as... Figure 2 The conductive pattern 219 described herein has essentially the same function and operation.

[0102] According to various embodiments, even if the descriptions differ, the wires or sub-wires described below are essentially the same elements and can be conductive wires (e.g., copper or aluminum) that configure the first coil 510 and the second coil 520.

[0103] Reference Figure 5 An electronic device 500 according to an embodiment of the present disclosure may include a circuit board 530, a first coil 510, and a second coil 520.

[0104] According to an embodiment, the circuit board 530 may include a first coil 510 and a second coil 520. For example, the circuit board 530 may be disposed in... Figure 4The antenna 470 described herein. For example, circuit board 530 can be set on... Figure 4 In the first surface (e.g., the z-axis direction or the upper surface) or the second surface (e.g., the -z-axis direction or the lower surface) of the antenna 470 shown.

[0105] According to various embodiments, circuit board 530 may include a printed circuit board (PCB), a flexible printed circuit board (FPCB), or a rigid-flexible printed circuit board (RFPCB). Circuit board 530 may include a structure in which multiple circuit boards are stacked. For example, circuit board 530 may include multiple layers.

[0106] According to an embodiment, a first coil 510 and a second coil 520 can be formed on a circuit board 530. The first coil 510 and the second coil 520 can be disposed on the circuit board 530. For example, the first coil 510 and the second coil 520 can be disposed on the same layer of the circuit board 530. For example, the first coil 510 and the second coil 520 can be disposed on different layers of the circuit board 530. For example, the first coil 510 can be disposed at a designated location on the circuit board 530 (e.g., the outer side), and the second coil 520 can be disposed inside the first coil 510.

[0107] According to various embodiments, the first coil 510 and / or the second coil 510 can supply power to a battery included in the electronic device 500 (e.g., Figure 1 and Figure 2 Battery 189 and / or Figure 4 The first coil 510 and / or the second coil 520 can provide power to external electronic devices (e.g., watches or wireless headphones) according to various embodiments.

[0108] According to an embodiment, the first coil 510 may include a plurality of first windings. The first coil 510 may be configured with at least one conductor (e.g., a conductive wire or a sub-wire) wound in a helical shape. For example, the first coil 510 may include at least one conductor wound multiple turns (e.g., multiple times) in a first direction (e.g., counterclockwise) based on the starting point 511 (e.g., a first end) of the outermost winding 515 among the plurality of first windings. For example, the ending point 512 (e.g., a second end) of the first coil 510 may be located at the end of the innermost winding 516 of the plurality of first windings of the first coil 510.

[0109] Reference Figure 5 and Figure 6 The starting point 511 of the first coil 510 (for example, Figure 6 The first ends of the two wires 510-1 and 510-2 described herein can be electrically connected to the first feed terminal 501. The end point 512 of the first coil 510 (e.g., Figure 6 The second ends of the two wires 510-1 and 510-2 described herein can be electrically connected to the second feed terminal 502. For example, the first coil 510 may include a first wire 510-1 (e.g., a first sub-wire 510-1) and a second wire 510-2 (e.g., a second sub-wire 510-2) wound in a spiral shape. For example, the first wire 510-1 may be disposed outside the second wire 510-2, and the second wire 510-2 may be disposed inside the first wire 510-1.

[0110] Reference Figure 7 The first coil 510 may include a single conductor 510-1 (e.g., a sub-wire) wound in a spiral shape. For example, the first coil 510 may include a single conductor 510-1 wound multiple turns (e.g., multiple times) in a first direction (e.g., counterclockwise) based on the starting point 511 (e.g., the first end) of the outermost winding 515. For example, the ending point 512 (e.g., the second end) of the first coil 510 may be located at the end of the innermost winding 516 of the first coil 510. The starting point 511 (e.g., the first end) of the single conductor 510-1 (e.g., the sub-wire) wound in a spiral shape of the first coil 510 may be electrically connected to... Figure 5 The first feed terminal 501 is described in the diagram. The end point 512 of the first coil 510 (e.g., the second end) can be electrically connected to... Figure 5 The second feed terminal 502 is described in the text. For example... Figure 7 The first coil 510 is schematically shown, wherein a single wire 510-1 is wound in a spiral shape, and may be omitted. Figure 5 The diagram shows the first feed terminal 501 and the second feed terminal 502 as described in the figure.

[0111] Reference Figure 8The first coil 510 may have a first conductor 510-1 (e.g., a first sub-wire 510-1), a second conductor 510-2 (e.g., a second sub-wire 510-2), and a third conductor 510-3 (e.g., a third sub-wire) wound in a spiral shape. For example, the first conductor 510-1 may be located outside the second conductor 510-2, and the third conductor 510-3 may be located inside the second conductor 510-2. The second conductor 510-2 may be located between the first conductor 510-1 and the third conductor 510-3. For example, the first coil 510 may include a form in which the three conductors 510-1, 510-2, and 510-3 are wound multiple turns (e.g., multiple times) in a first direction (e.g., counterclockwise) based on the starting point 511 of the outermost winding 515 (e.g., the first end of the three conductors 510-1, 510-2, and 510-3). For example, the end point 512 of the first coil 510 (e.g., the second end of the three wires 510-1, 510-2, and 510-3) may be located at the end of the innermost winding 516 of the first coil 510. The starting point 511 (e.g., the first end) of the first coil 510, in which the three wires 510-1, 510-2, and 510-3 are wound in a spiral shape, may be electrically connected to the first feed terminal 501. The end point 512 (e.g., the second end) of the first coil 510 may be electrically connected to... Figure 5 The second feed terminal 502 is described in the text. For example... Figure 8 It could be a schematic diagram of the first coil 510 in which three wires 510-1, 510-2 and 510-3 are wound in a spiral shape.

[0112] According to various embodiments, the first coil 510 is not limited to Figure 7 The single conductor 510-1 described in the document Figure 6 The two conductors 510-1 and 510-2 described in the document, as well as Figure 8 The three conductors 510-1, 510-2 and 510-3 described herein may include at least one conductor (e.g., the first conductor 510-1 to the Nth conductor 510-N) wound in a spiral shape.

[0113] According to various embodiments, the first coil 510 is not limited to the above-described helical winding shape, and may include various shapes such as elliptical or polygonal (e.g., square or hexagonal). For example, Figure 7 The single conductor 510-1 shown (e.g., a sub-wire) can be divided as follows: Figure 6The first conductor 510-1 and the second conductor 510-2 are shown. For example, when a single conductor 510-1 is formed into a first conductor 510-1 and a second conductor 510-2, the width of the single conductor 510-1 can be formed to be substantially the same as the combined width of the two separate conductors including the first conductor 510-1 and the second conductor 510-2. For example, Figure 7 The single conductor 510-1 shown can be divided into a first conductor 510-1, a second conductor 510-2, and a third conductor 510-3, as follows: Figure 8 As shown in the figure. For example, when a single conductor 510-1 is formed into a first conductor 510-1, a second conductor 510-2 and a third conductor 510-3, the width of the single conductor 510-1 can be formed to be substantially the same as the combined width of the three separate conductors including the first conductor 510-1, the second conductor 510-2 and the third conductor 510-3.

[0114] According to various embodiments, the first coil 510 may be disposed on multiple layers (e.g., a first layer and a second layer) of the circuit board 530. For example, multiple first windings of the first coil 510 may be disposed in a first layer and a second layer that overlap each other.

[0115] According to an embodiment, the circuit board 530 may have a structure in which multiple layers are stacked. A first coil 510 may be disposed on at least one layer (not shown) of the circuit board 530. The circuit board 530 may include a substrate (not shown). For example, a portion of the first coil 510 may be disposed in a first layer (not shown) of the substrate in a first direction (e.g., the bottom of the substrate). For example, another portion of the first coil 510 may be disposed in a second layer (not shown) of the substrate in a second direction (e.g., the top of the substrate). For example, the first and / or second layers may include a helical winding shape.

[0116] According to an embodiment, the first coil 510 may include at least one conductive wire. The conductive wire may include at least one conductor wound multiple turns (e.g., multiple times) in a first direction (e.g., counterclockwise). For example, at least a portion of the first feed terminal 501 or the second feed terminal 502 may be configured to overlap with the area wound around the first coil 510. For example, the ends of the first feed terminal 501 or the second feed terminal 502 may be configured to face outwards or inwards towards the first coil 510.

[0117] According to an embodiment, the second coil 520 may be disposed inside the first coil 510. For example, the second coil 520 may be substantially surrounded by the innermost winding 516 of a plurality of first windings of the first coil 510. The second coil 520 may include components configured to extend to external electronic devices (e.g., Figure 1Multiple second windings that provide power to external electronic devices 102 and 104. For example, external electronic devices 102 and 104 may include wearable electronic devices (e.g., watches and / or wireless headphones). The second coil 520 may be configured with at least two or more conductors (e.g., conductive wires or sub-wires) wound in a spiral shape.

[0118] According to an embodiment, the second number of the plurality of second windings (e.g., wires) of the second coil 520 may be greater than the first number of the plurality of first windings (e.g., wires) of the first coil 510. For example, the number of turns (e.g., number of windings) of the plurality of second windings of the second coil 520 may be greater than the number of turns (e.g., number of windings) of the plurality of first windings of the first coil 510. For example, the number of turns (e.g., number of windings) of the wires (e.g., windings) of the second coil 520 may be greater than the number of turns (e.g., number of windings) of the wires (e.g., windings) of the first coil 510.

[0119] According to an embodiment, the inductance of the second coil 520 can be greater than the inductance of the first coil 510. For example, the inductance of the second coil 520 can be formed to be about 1.5 to 2 times the inductance of the first coil 510. For example, the inductance of the first coil 510 can be about 10 μF to 12 μF, and the inductance of the second coil 520 can be about 15 μF to 24 μF.

[0120] Reference Figure 5 and Figures 9 to 11 The second coil 520 may include a second-1 winding 521 and a second-2 winding 522. For example, the second-1 winding 521 of the second coil 520 may be disposed in the first layer 531 of the circuit board 530. For example, the second-2 winding 522 of the second coil 520 may be disposed in the second layer 532 of the circuit board 530. According to an embodiment, the first layer 531 on which the second-1 winding 521 is disposed and the second layer 532 on which the second-2 winding 522 is disposed may overlap each other. For example, in Figure 9 In the embodiment shown, the first layer 531 on which the second-1 winding 521 is disposed and the second layer 532 on which the second-2 winding 522 is disposed are aligned and overlap each other, but are not limited thereto, the first layer 531 on which the second-1 winding 521 is disposed and the second layer 532 on which the second-2 winding 522 is disposed may at least partially overlap.

[0121] According to an embodiment, the second coil 520 may include a second-first winding 521 and a second-second winding 522. For example, the second-first winding 521 may include a first conductor 521-1 (e.g., a first sub-wire 521-1) and a second conductor 521-2 (e.g., a second sub-wire 521-2) wound in a spiral shape. For example, the second-first winding 521 of the second coil 520 may be disposed in the first layer 531. For example, the second-second winding 522 of the second coil 520 may be disposed in the second layer 532. The first conductor 521-1 and the second conductor 521-2 of the second-first winding 521 disposed in the first layer 531, and the first conductor 522-1 and the second conductor 522-2 of the second-second winding 522 disposed in the second layer 532, may be connected to each other in a crossing region 525 (e.g., a crossing point).

[0122] According to an embodiment, the circuit board 530 may have a structure in which multiple layers are stacked. The second coil 520 may be disposed in at least one layer of the circuit board 530 (e.g., Figure 9 The circuit board 530 may include a substrate (not shown). For example, the second-first winding 521 of the second coil 520 may be disposed in the first layer 531 in a first direction of the substrate. For example, the second-second winding 522 of the second coil 520 may be disposed in the second layer 532 in a second direction of the substrate. For example, the first layer 531 and / or the second layer 532 may include a helical winding shape.

[0123] According to an embodiment, among the plurality of second windings of the second coil 520, the second-1 winding 521 disposed in the first layer 531 of the circuit board 530 may include a first conductor 521-1 (e.g., a first sub-wire 521-1) and a second conductor 521-2 (e.g., a second sub-wire 521-2). For example, the first conductor 521-1 (e.g., a first sub-wire or an outer conductor) of the second-1 winding 521 may be disposed outside the second conductor 521-2 (e.g., a second sub-wire or an inner conductor) on the first layer 531.

[0124] According to an embodiment, among the plurality of second windings of the second coil 520, the second-2 winding 522 disposed in the second layer 532 of the circuit board 530 may include a first conductor 522-1 (e.g., a first sub-wire 522-1) and a second conductor 522-2 (e.g., a second sub-wire 522-2). For example, the first conductor 522-2 (e.g., a first sub-wire or an inner conductor) of the second-2 winding 522 may be disposed inside the second conductor 522-2 (e.g., a second sub-wire or an outer conductor) on the second layer 532.

[0125] According to an embodiment, the innermost winding 520b of a plurality of second windings of the second coil 520 (e.g., the second-1st winding 521 and the second-2nd winding 522) may have at least one crossover region 525 (e.g., a crossover point) thereon. For example, in the crossover region 525, the first conductor 521-1 (e.g., the first sub-wire 521-1) of the second-1st winding 521 in the first layer 531 and the first conductor 522-1 (e.g., the first sub-wire 522-1) of the second-2nd winding 522 in the second layer 532 may be connected. For example, in the crossover region 525, the second conductor 521-2 (e.g., the second sub-wire 521-2) of the second-1st winding 521 in the first layer 531 and the second conductor 522-2 (e.g., the second sub-wire 522-2) of the second-2nd winding 522 in the second layer 532 may be connected. For example, in the cross region 525, when the first conductor 521-1 (e.g., the first sub-wire) of the second-1 winding 521 in the first layer 531 and the first conductor 522-1 (e.g., the first sub-wire) of the second-2 winding 522 in the second layer 532 are connected, and the second conductor 521-2 (e.g., the second sub-wire) of the second-1 winding 521 in the first layer 531 and the second conductor 522-2 (e.g., the second sub-wire) of the second-2 winding 522 in the second layer 532 are connected, the lengths of the inner and outer conductors of the second coil 520 can be formed to be substantially the same. For example, when the inner and outer conductors of the second coil 520 are formed to have substantially the same length and current flows through the second coil 520, no impedance difference will appear between the inner and outer conductors, and a uniform current density can be formed and distributed in the second coil 520.

[0126] According to an embodiment, the starting point 526 (e.g., the first end) of the second coil 520 may be located at the outermost winding 520a of the second-1st winding 521 disposed in the first layer 531 among a plurality of second windings. For example, the starting point 526 (e.g., the first end) of the second coil 520 may be located at the outermost winding 520a among a plurality of second windings on the first layer 531.

[0127] According to an embodiment, the end point 527 (e.g., the second end) of the second coil 520 may be located at the outermost winding 520c of the second-2nd winding 522 disposed in the second layer 532 among a plurality of second windings. For example, the end point 527 (e.g., the second end) of the second coil 520 may be located at the outermost winding 520c among a plurality of second windings on the second layer 532.

[0128] According to an embodiment, the starting point 526 (e.g., the first end) of the second coil 520 can be electrically connected to the third feed terminal 503. The ending point 527 (e.g., the second end) of the second coil 520 can be electrically connected to the fourth feed terminal 504. For example, the third feed terminal 503 can be electrically connected to... Figure 5 The first power supply terminal 501 is shown. For example, the fourth power supply terminal 504 can be electrically connected to... Figure 5 The second power supply terminal 502 shown.

[0129] According to various embodiments, the third feed terminal 503 connected to the start point 526 of the second coil 520 and the fourth feed terminal 504 connected to the end point 527 can be omitted. For example, when the third feed terminal 503 and the fourth feed terminal 504 of the second coil 520 are omitted, they can be used together. Figure 5 The first feed terminal 501 and the second feed terminal 502 are shown. For example, if the third feed terminal 503 and the fourth feed terminal 504 of the second coil 520 are omitted, the starting point 526 of the second coil 520 can be electrically connected to... Figure 5 The first feed terminal 501 of the first coil 510 is shown. For example, the end point 527 of the second coil 520 can be electrically connected to... Figure 5 The second feed terminal 502 of the first coil 510 is shown. For example, the first feed terminal 501 and the second feed terminal 502 can be disposed on the same layer and / or different layers of the circuit board 530. For example, the first feed terminal 501, the second feed terminal 502, the third feed terminal 503 and the fourth feed terminal 504 can be disposed on the same layer and / or different layers of the circuit board 530.

[0130] According to embodiments, the second-1 winding 521 disposed in the first layer 531 and the second-2 winding 522 disposed in the second layer 522 may overlap each other. When the first layer 531 and the second layer 532 overlap each other, the second-1 winding 521 disposed in the first layer 531 and the second-2 winding 522 disposed in the second layer 532 may have symmetrical shapes. For example, the second-1 winding 521 and the second-2 winding 522 may have shapes symmetrical with respect to the virtual center line between the first layer 531 and the second layer 532. According to various embodiments, when the first layer 531 and the second layer 532 overlap each other, the second-1 winding 521 disposed in the first layer 531 and the second-2 winding 522 disposed in the second layer 532 may have shapes asymmetrical with respect to each other. For example, the second-1 winding 521 and the second-2 winding 522 may have shapes asymmetrical with respect to the virtual center line between the first layer 531 and the second layer 532.

[0131] Reference Figure 10Among the multiple second windings of the second coil 520, the second-1 winding 521 disposed in the first layer 531 of the circuit board 530 can be configured such that the first conductor 521-1 (e.g., the first sub-wire or outer conductor) and the second conductor 521-2 (e.g., the second sub-wire or inner conductor) are wound in a spiral shape. For example, the second-1 winding 521 of the second coil 520 may include the first conductor 521-1 (e.g., the first sub-wire or outer conductor) and the second conductor 521-2 (e.g., the second sub-wire or inner conductor) wound multiple turns (e.g., multiple times) in a first direction (e.g., counterclockwise) relative to the starting point 526 of the outermost winding 520a of the second-1 winding 521. For example, the first conductor 521-1 (e.g., the first sub-wire or outer conductor) may be disposed outside the second conductor 521-2 (e.g., the second sub-wire or inner conductor) on the first layer 531 of the circuit board 530.

[0132] Reference Figure 11 Among the multiple second windings of the second coil 520, the second-2 winding 522 disposed in the second layer 532 of the circuit board 530 can be configured in a spiral shape with the first conductor 522-1 (e.g., the first sub-wire or inner conductor) and the second conductor 522-2 (e.g., the second sub-wire or outer conductor) wound together. For example, the second-2 winding 522 of the second coil 520 may include the first conductor 522-1 (e.g., the first sub-wire or inner conductor) and the second conductor 522-2 (e.g., the second sub-wire or outer conductor) wound multiple turns (e.g., multiple times) in a second direction (e.g., clockwise) relative to the end point 527 of the outermost winding 520c of the second-2 winding 521. For example, the first conductor 522-1 (e.g., the first sub-wire or inner conductor) may be disposed inside the second conductor 522-2 (e.g., the second sub-wire or outer conductor) on the second layer 531 of the circuit board 530.

[0133] Figure 12 This is a schematic diagram showing the configuration in which the 2-1 winding and the 2-2 winding of the second coil are interconnected in the cross region according to an embodiment of the present disclosure.

[0134] According to an embodiment, in Figure 5 and Figure 9In the disclosed cross region 525 (e.g., cross point), the second coil 520 may have a first conductor 521-1 (e.g., first sub-wire 521-1) of the second-1 winding 521 disposed in the first layer 531 of the circuit board 530 and a first conductor 522-1 (e.g., first sub-wire 522-1) of the second-2 winding 522 disposed in the second layer 532 of the circuit board 530, which are connected to each other. For example, in the cross region 525, the second coil 520 may have a second conductor 521-2 (e.g., second sub-wire 521-2) of the second-1 winding 521 disposed in the first layer 531 of the circuit board 530 and a second conductor 522-2 (e.g., second sub-wire 522-2) of the second-2 winding 522 disposed in the second layer 532 of the circuit board 530, which are connected to each other.

[0135] Figure 13 This is a schematic diagram showing a configuration in which the 2-1 winding and the 2-2 winding of a second coil according to an embodiment of the present disclosure are connected by at least one through hole.

[0136] For example, Figure 13 It can include and Figure 5 , Figure 9 and Figure 14 The embodiment related to the intersection region 525 shown.

[0137] According to an embodiment, in the crossover region 525, the second coil 520 can connect the first conductor 521-1 (e.g., the first sub-wire 521-1) of the second-1 winding 521 to the first conductor 522-1 (e.g., the first sub-wire 522-1) of the second-2 winding 522 through the first through-hole V1. For example, in the crossover region 525, the second coil 520 can connect the second conductor 521-1 (e.g., the second sub-wire 521-2) of the second-1 winding 521 to the second conductor 522-2 (e.g., the second sub-wire 522-2) of the second-2 winding 522 through the second through-hole V2. For example, the first through-hole V1 and the second through-hole V2 can be configured in the circuit board 530.

[0138] Figure 14 This is a schematic diagram illustrating the current distribution of a second coil according to an embodiment of the present disclosure.

[0139] According to the embodiment, refer to the above. Figure 12 or Figure 13In the described cross region 525, the first conductor 521-1 (e.g., first sub-wire 521-1) of the second-1 winding 521 in the first layer 531 is connected to the first conductor 522-1 (e.g., first sub-wire 522-1) of the second-2 winding 522 in the second layer 532, and the second conductor 521-2 (e.g., second sub-wire 521-2) of the second-1 winding 521 in the first layer 531 is connected to the second conductor 522 of the second-2 winding 522 in the second layer 532. In the case of the connection of -2 (e.g., the second sub-wire 522-2), since the length of the wire connecting the first conductor 521-1 (e.g., the first sub-wire) in the first layer 531 and the first conductor 522-1 (e.g., the first sub-wire) in the second layer 532 is substantially the same as the length of the wire connecting the second conductor 521-2 (e.g., the second sub-wire) in the first layer 531 and the second conductor 522-2 (e.g., the second sub-wire) in the second layer 532, a uniform current density can be identified in the second coil 520.

[0140] Figure 15 This is a schematic diagram illustrating the configuration of a second coil according to various embodiments of the present disclosure. Figure 16 This is a schematic diagram showing the 2-1 winding of the second coil disposed in the first layer of the circuit board and the 2-2 winding of the second coil disposed in the second layer of the circuit board according to various embodiments of the present disclosure.

[0141] In the following description, as mentioned above Figures 5 to 11 Components that are substantially the same as those described in the embodiments are assigned the same reference numerals, and redundant descriptions may be omitted.

[0142] Reference Figure 5 , Figure 15 and Figure 16 The second coil 520 may include a second-1 winding 521 and a second-2 winding 522. For example, the second-1 winding 521 of the second coil 520 may be disposed in the first layer 531 of the circuit board 530. For example, the second-2 winding 522 of the second coil 520 may be disposed in the second layer 532 of the circuit board 530. For example, the first layer 531 on which the second-1 winding 521 is disposed and the second layer 532 on which the second-2 winding 522 is disposed may overlap each other.

[0143] According to various embodiments, when the first layer 531 and the second layer 532 overlap each other, the second-1 winding 521 disposed in the first layer 531 and the second-2 winding 522 disposed in the second layer 532 may have asymmetrical shapes relative to each other. For example, the second-1 winding 521 and the second-2 winding 522 may have asymmetrical shapes relative to the virtual center line between the first layer 531 and the second layer 532.

[0144] According to an embodiment, among the plurality of second windings of the second coil 520, the second-1 winding 521 disposed in the first layer 531 of the circuit board 530 may include a first conductor 521-1 (e.g., a first sub-wire 521-1) and a second conductor 521-2 (e.g., a second sub-wire 521-2). For example, the first conductor 521-1 (e.g., a first sub-wire) may be disposed outside the second conductor 521-2 (e.g., a second sub-wire) in the first layer 531.

[0145] According to an embodiment, the number of turns of the first conductor 521-1 (e.g., the first sub-wire or outer conductor) and the second conductor 521-2 (e.g., the second sub-wire or inner conductor) of the second-first winding 521 can be different. For example, in the second-first winding 521, the number of turns of the first conductor 521-1 (e.g., the first sub-wire or outer conductor) can be 13 turns, and the number of turns of the second conductor 521-2 (e.g., the second sub-wire or inner conductor) can be 14 turns. For example, in the second-first winding 521, the number of turns of the first conductor 521-1 (e.g., the first sub-wire or outer conductor) can be 14 turns, and the number of turns of the second conductor 521-2 (e.g., the second sub-wire or inner conductor) can be 13 turns.

[0146] According to an embodiment, among the plurality of second windings of the second coil 520, the second-2 winding 522 disposed in the second layer 532 of the circuit board 530 may include a first conductor 522-1 (e.g., a first sub-wire) and a second conductor 522-2 (e.g., a second sub-wire). For example, the first conductor 522-1 (e.g., the first sub-wire) may be arranged inside the second conductor 522-2 (e.g., the second sub-wire) in the second layer 532.

[0147] According to an embodiment, the number of turns of the first conductor 522-1 (e.g., the first sub-wire or inner conductor) and the second conductor 522-2 (e.g., the second sub-wire or inner conductor) of the second-2 winding 522 can be substantially the same. For example, in the second-2 winding 522, the number of turns of the first conductor 522-1 (e.g., the first sub-wire or inner conductor) can be 13 turns, and the number of turns of the second conductor 522-2 (e.g., the second sub-wire or outer conductor) can be 13 turns. For example, in the second-2 winding 522, the number of turns of the first conductor 522-1 (e.g., the first sub-wire or inner conductor) can be 14 turns, and the number of turns of the second conductor 522-2 (e.g., the second sub-wire or outer conductor) can be 14 turns. For example, when the number of turns of the first conductor 522-1 (e.g., the first sub-wire or inner conductor) and the second conductor 522-2 (e.g., the second sub-wire or outer conductor) of the second-2 winding 522 is the same (e.g., 13 or 14 turns), the second conductor 522-2 (e.g., the second sub-wire or outer conductor) can be formed to have a greater length than the first conductor 522-1 (e.g., the first sub-wire or inner conductor). According to various embodiments, the above-described number of turns (e.g., number of turns) of the second-1 winding 521 and the second-2 winding 522 are examples, and various other numbers of turns (e.g., number of turns) can be applied.

[0148] According to an embodiment, the innermost winding 520b of a plurality of second windings of the second coil 520 (e.g., the second-1st winding 521 and the second-2nd winding 522) may have at least one connection region 625 (e.g., a connection point) thereon. For example, in the connection region 625, the first conductor 521-1 (e.g., the first sub-wire or outer conductor) of the second-1st winding 521 in the first layer 531 and the second conductor 522-2 (e.g., the second sub-wire or outer conductor) of the second-2nd winding 522 in the second layer 532 may be connected. For example, in the connection region 625, the second conductor 521-2 (e.g., the second sub-wire or inner conductor) of the second-1st winding 521 in the first layer 531 and the first conductor 522-1 (e.g., the second sub-wire or inner conductor) of the second-2nd winding 522 in the second layer 532 may be connected. For example, in connection region 625, the first conductor 521-1 (e.g., first sub-wire or outer conductor) of the second-1 winding 521 in the first layer 531 and the second conductor 522-2 (e.g., second sub-wire or outer conductor) of the second-2 winding 522 in the second layer 532 are connected, and the second conductor 521-2 (e.g., second sub-wire or inner conductor) of the second-1 winding 521 in the first layer 531 and the first conductor 522-1 (e.g., first sub-wire or inner conductor) of the second-2 winding 522 in the second layer 532 are connected, the lengths of the inner and outer conductors of the second coil 520 can be formed to be substantially the same. For example, when the inner and outer conductors of the second coil 520 are formed to have substantially the same length and current flows through the second coil 520, no impedance difference will appear between the inner and outer conductors, and a uniform current density can be formed and distributed in the second coil 520.

[0149] According to an embodiment, the starting point 526 (e.g., the first end) of the second coil 520 may be located at the outermost winding 520a of the second-1st winding 521 disposed in the first layer 531 among a plurality of second windings. For example, the starting point 526 (e.g., the first end) of the second coil 520 may be located at the outermost winding 520a among a plurality of second windings on the first layer 531.

[0150] According to an embodiment, the end point 527 (e.g., the second end) of the second coil 520 may be located at the outermost winding 520c of the second-2nd winding 522 disposed in the second layer 532 among a plurality of second windings. For example, the end point 527 (e.g., the second end) of the second coil 520 may be located at the outermost winding 520c among a plurality of second windings on the second layer 532.

[0151] According to an embodiment, the starting point 526 (e.g., the first end) of the second coil 520 can be electrically connected to the third feed terminal 503. The ending point 527 (e.g., the second end) of the second coil 520 can be electrically connected to the fourth feed terminal 504. For example, the third feed terminal 503 can be electrically connected to... Figure 5 The first power supply terminal 501 is shown. For example, the fourth power supply terminal 504 can be electrically connected to... Figure 5 The second power supply terminal 502 shown.

[0152] According to various embodiments, the third feed terminal 503 connected to the start point 526 of the second coil 520 and the fourth feed terminal 504 connected to the end point 527 can be omitted. For example, when the third feed terminal 503 and the fourth feed terminal 504 of the second coil 520 are omitted, they can be used together. Figure 5 The first feed terminal 501 and the second feed terminal 502 are shown. For example, if the third feed terminal 503 and the fourth feed terminal 504 of the second coil 520 are omitted, the starting point 526 of the second coil 520 can be electrically connected to... Figure 5 The first feed terminal 501 of the first coil 510 is shown. For example, the end point 527 of the second coil 520 can be electrically connected to... Figure 5 The second feed terminal 502 of the first coil 510 is shown. For example, the first feed terminal 501 and the second feed terminal 502 can be disposed on the same layer and / or different layers of the circuit board 530. For example, the first feed terminal 501, the second feed terminal 502, the third feed terminal 503 and the fourth feed terminal 504 can be disposed on the same layer and / or different layers of the circuit board 530.

[0153] According to an embodiment, among the plurality of second windings of the second coil 520, the second-1 winding 521 disposed in the first layer 531 of the circuit board 530 can be configured such that the first conductor 521-1 (e.g., the first sub-wire or outer conductor) and the second conductor 521-2 (e.g., the second sub-wire or inner conductor) are wound in a spiral shape. For example, the second-1 winding 521 of the second coil 520 may include the first conductor 521-1 (e.g., the first sub-wire or outer conductor) and the second conductor 521-2 (e.g., the second sub-wire or inner conductor) being wound multiple turns (e.g., multiple times) in a first direction (e.g., counterclockwise) relative to the starting point 526 of the outermost winding 520a of the second-1 winding 521.

[0154] According to an embodiment, the number of turns of the first conductor 521-1 (e.g., the first sub-wire or outer conductor) and the second conductor 521-2 (e.g., the second sub-wire or inner conductor) of the second-first winding 521 can be different. For example, in the second-first winding 521, the number of turns of the first conductor 521-1 (e.g., the first sub-wire or outer conductor) can be 13 turns, and the number of turns of the second conductor 521-2 (e.g., the second sub-wire or inner conductor) can be 14 turns. For example, in the second-first winding 521, the number of turns of the first conductor 521-1 (e.g., the first sub-wire or outer conductor) can be 14 turns, and the number of turns of the second conductor 521-2 (e.g., the second sub-wire or inner conductor) can be 13 turns.

[0155] According to an embodiment, among the plurality of second windings of the second coil 520, the second-2nd winding 522 disposed in the second layer 532 of the circuit board 530 can be configured such that the first conductor 522-1 (e.g., the first sub-wire or inner conductor) and the second conductor 522-2 (e.g., the second sub-wire or outer conductor) are wound in a spiral shape. For example, the second-2nd winding 522 of the second coil 520 may include the first conductor 522-1 (e.g., the first sub-wire or inner conductor) and the second conductor 522-2 (e.g., the second sub-wire or outer conductor) being wound multiple turns (e.g., multiple times) in a second direction (e.g., clockwise) relative to the end point 527 of the outermost winding 520c of the second-2nd winding 521.

[0156] According to an embodiment, the number of turns of the first conductor 522-1 (e.g., the first sub-wire or inner conductor) and the second conductor 522-2 (e.g., the second sub-wire or outer conductor) of the second-2 winding 522 can be substantially the same. For example, in the second-2 winding 522, the number of turns of the first conductor 522-1 (e.g., the first sub-wire or inner conductor) can be 13 turns, and the number of turns of the second conductor 522-2 (e.g., the second sub-wire or outer conductor) can be 13 turns. For example, in the second-2 winding 522, the number of turns of the first conductor 522-1 (e.g., the first sub-wire or inner conductor) can be 14 turns, and the number of turns of the second conductor 522-2 (e.g., the second sub-wire or outer conductor) can be 14 turns.

[0157] According to various embodiments, the above-described number of turns (e.g., number of turns) of the second-1 winding 521 and the second-2 winding 522 are examples, and various other numbers of turns (e.g., number of turns) can be applied.

[0158] Figure 17 This is a schematic diagram illustrating the current distribution of a second coil according to various embodiments of the present disclosure.

[0159] According to various embodiments, in the connection region 625 (e.g., connection point) described above, the first conductor 521-1 (e.g., first sub-wire or outer conductor) of the second-1 winding 521 in the first layer 531 is connected to the second conductor 522-2 (e.g., second sub-wire or outer conductor) of the second-2 winding 522 in the second layer 532, and the second conductor 521-2 (e.g., second sub-wire or inner conductor) of the second-1 winding 521 in the first layer 531 is connected to the first conductor 522-2 of the second-2 winding 522 in the second layer 532. In the case of 2-1 (e.g., the first sub-wire or inner wire) connection, since the length of the wire connecting the first wire 521-1 (e.g., the first sub-wire or outer wire) in the first layer 531 and the second wire 522-2 (e.g., the second sub-wire or outer wire) in the second layer 532 is substantially the same as the length of the wire connecting the second wire 521-2 (e.g., the second sub-wire or inner wire) in the first layer 531 and the first wire 522-1 (e.g., the first sub-wire or inner wire) in the second layer 532, a uniform current density can be identified in the second coil 520.

[0160] Electronic devices 101, 300, 400, or 500 according to embodiments of the present disclosure may include a circuit board 530 and a first coil 510 and a second coil 520 disposed on the circuit board 530. According to an embodiment, the first coil 510 may include a plurality of first windings. According to an embodiment, the second coil 520 may include a plurality of second windings substantially surrounding the innermost winding 516 of the plurality of first windings of the first coil 510, and is configured to provide power to an external electronic device 102 or 104. According to an embodiment, the inductance of the second coil 520 may be greater than the inductance of the first coil 510.

[0161] According to an embodiment, a plurality of second windings of the second coil 520 may be disposed in the overlapping first layer 531 and second layer 532 of the circuit board 530. Each of the plurality of second windings may include a first sub-wire 521-1 or 522-1 and a second sub-wire 521-2 or 522-2, and the first sub-wire 521-1 in the first layer 531 may be disposed outside the second sub-wire 521-2.

[0162] According to an embodiment, the second number of the plurality of windings of the second coil 520 can be configured to be greater than the first number of the plurality of first windings of the first coil 510.

[0163] According to an embodiment, the inductance of the second coil 520 can be 1.5 to 2 times the inductance of the first coil 510.

[0164] According to the embodiment, the starting point 511 of the first coil 510 may be located at the outermost winding 515 among the plurality of first windings, the ending point 512 of the first coil 510 may be located at the innermost winding 516 among the plurality of first windings, the starting point 511 of the first coil 510 may be connected to the first feed terminal 501, and the ending point 512 of the first coil 510 may be connected to the second feed terminal 502.

[0165] According to an embodiment, in the second layer 532, the first sub-line 522-1 can be disposed inside the second sub-line 522-2.

[0166] According to an embodiment, at least one cross region 525 may be located at the innermost winding 520b of a plurality of second windings of the second coil 520, and in the cross region 525, the first sub-line 521-1 in the first layer 531 and the first sub-line 522-1 in the second layer 532 may be connected, and the second sub-line 521-2 in the first layer 531 and the second sub-line 522-2 in the second layer 532 may be connected.

[0167] According to the embodiment, the starting point 526 of the second coil 520 may be located at the outermost winding 520a of the plurality of second windings in the first layer 531, and the ending point 527 of the second coil 520 may be located at the outermost winding 520c of the plurality of second windings in the second layer 532.

[0168] According to an embodiment, the plurality of second windings of the second coil 520 may include a second-1 winding 521 disposed in the first layer 531 and a second-2 winding 522 disposed in the second layer 532.

[0169] According to an embodiment, the second-1 winding 521 disposed in the first layer 531 and the second-2 winding 522 disposed in the second layer 532 can be configured to have a shape that is symmetrical to each other when the first layer 531 and the second layer 532 overlap.

[0170] According to an embodiment, when the first layer 531 and the second layer 532 overlap, the second 2-1 winding 521 disposed in the first layer 531 and the second 2-2 winding 522 disposed in the second layer 532 can be configured to have an asymmetrical shape.

[0171] According to the embodiment, the length of the conductor connecting the first sub-line 521-1 in the first layer 531 and the first sub-line 522-1 in the second layer 532 can be substantially the same as the length of the conductor connecting the second sub-line 521-2 in the first layer 531 and the second sub-line 522-2 in the second layer 532.

[0172] According to the embodiment, when current flows through the second coil 520, the current density of the wire connecting the first sub-wire 521-1 in the first layer 531 and the first sub-wire 522-1 in the second layer 532 can be configured to be substantially the same as the current density of the wire connecting the second sub-wire 521-2 in the first layer 531 and the second sub-wire 522-2 in the second layer 532.

[0173] According to an embodiment, the first sub-line 521-1 in the first layer 531 and the first sub-line 522-1 in the second layer 532 can be connected through a first through hole configured in the circuit board 530, and the second sub-line 521-2 in the first layer 531 and the second sub-line 522-2 in the second layer 532 can be connected through a second through hole configured in the circuit board 530.

[0174] According to an embodiment, at least one connection region 625 may be located at the innermost winding 520b of a plurality of second windings of the second coil 520, and in the connection region 625, the first sub-wire 521-1 in the first layer 531 and the second sub-wire 522-2 in the second layer 532 may be connected, and the second sub-wire 521-2 in the first layer 531 and the first sub-wire 522-1 in the second layer 532 may be connected.

[0175] Electronic devices 101, 300, 400, or 500 according to embodiments of the present disclosure may include a circuit board 530, a first coil 510 including a plurality of windings disposed on the circuit board 530, and a second coil 520, the second coil 520 being substantially surrounded by the innermost winding 516 of the first coil 510 disposed on the circuit board 530, and including a second-1 winding 521 disposed in a first layer 531 of the circuit board 530 and a second-2 winding 522 disposed in a second layer 532 of the circuit board 530, the second layer 532 overlapping the first layer 531. According to an embodiment, the second-1 winding 521 may include a first sub-wire 521-1 and a second sub-wire 521-2, wherein the first sub-wire 521-1 of the second-1 winding 521 may be disposed outside the second sub-wire 521-2. According to an embodiment, the second-2 winding 522 may include a first sub-wire 522-1 and a second sub-wire 522-2, wherein the first sub-wire 522-1 of the second-2 winding 522 may be disposed inside the second sub-wire 522-2. According to an embodiment, at least one crossover region 525 may be located at the innermost coil 520b of the second-1 coil 521 and the second-2 coil 522. According to an embodiment, in the crossover region 525, the first sub-wire 521-1 of the second-1 winding 521 and the first sub-wire 522-1 of the second-2 winding 522 may be connected, and the second sub-wire 521-2 of the second-1 winding 521 and the second sub-wire 522-2 of the second-2 winding 522 may be connected.

[0176] According to an embodiment, the inductance of the second coil 520 can be greater than the inductance of the first coil 510.

[0177] According to the embodiment, the starting point 526 of the second coil 520 may be located at the outermost winding 520a of the second-1 winding 521 in the first layer 531, and the ending point 527 of the second coil 520 may be located at the outermost winding 520c of the second-2 winding 522 in the second layer 532.

[0178] According to an embodiment, the second-1 winding 521 disposed in the first layer 531 and the second-2 winding 522 disposed in the second layer 532 can be configured to have a shape that is symmetrical to each other when the first layer 531 and the second layer 532 overlap.

[0179] According to an embodiment, the length of the conductor connecting the first sub-wire 521-1 of the second-1 winding 521 and the first sub-wire 522-1 of the second-2 winding 522 can be configured to be substantially the same as the length of the conductor connecting the second sub-wire 521-2 of the second-1 winding 521 and the second sub-wire 522-2 of the second-2 winding 522.

[0180] The electronic device according to various embodiments can be one of a variety of types of electronic devices. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. According to embodiments of this disclosure, the electronic device is not limited to those described above.

[0181] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various changes, equivalents, or substitutions to the respective embodiments. In the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that nouns in the singular form corresponding to terms may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include any one or all possible combinations of the items enumerated together with the corresponding phrase among the plurality of phrases. As used herein, terms such as “first” and “second” or “first” and “second” may be used to simply distinguish the respective component from another component and do not limit the component in other respects (e.g., importance or order). It will be understood that, whether the terms “operably” or “communically” are used or not, if an element (e.g., a first element) is referred to as “combined with another element (e.g., a second element),” “combined to another element (e.g., a second element),” “connected to another element (e.g., a second element),” or “connected to another element (e.g., a second element)”, it means that the element can be directly (e.g., wiredly) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0182] As used in connection with various embodiments of this disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms such as "logic," "logic block," "part," or "circuit." A module may be a single integrated component adapted to perform one or more functions, or the smallest unit or part of such a single integrated component. For example, according to embodiments, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0183] The various embodiments set forth herein can be implemented as software (e.g., program 140) containing one or more instructions readable by a machine (e.g., electronic device 101) stored in a storage medium (e.g., internal memory 136 or external memory 138). For example, under the control of a processor, the processor (e.g., processor 120) of the machine (e.g., electronic device 101) can invoke and execute at least one of the one or more instructions stored in the storage medium, with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. Machine-readable storage media may be provided in the form of non-transitory storage media. The term "non-transitory" simply means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but this term does not distinguish between data being stored semi-permanently in the storage medium and data being temporarily stored in the storage medium.

[0184] Although this disclosure has been described with reference to various embodiments thereof, it will be apparent to those skilled in the art to which this disclosure pertains that various changes and modifications may be made without departing from the technical spirit of this disclosure, and such changes and modifications should be construed as falling within the scope of this disclosure.

Claims

1. An electronic device (101, 300, 400, 500), comprising: Circuit board (530); as well as The first coil (510) and the second coil (520) are disposed on the circuit board (530). The first coil (510) includes multiple first windings. The second coil (520) includes a plurality of second windings that are substantially surrounded by the innermost winding (516) of the plurality of first windings of the first coil (510), and is configured to provide power to external electronic devices (102, 104). The inductance of the second coil (520) is greater than that of the first coil (510).

2. The electronic device according to claim 1, wherein, The plurality of second windings of the second coil (520) are disposed in the first layer (531) and the second layer (532) of the circuit board (530), the first layer and the second layer overlapping each other. Each of the plurality of second windings includes a first sub-wire (521-1, 522-1) and a second sub-wire (521-2, 522-2), and In the first layer 531, the first sub-line (521-1) is located outside the second sub-line (521-2).

3. The electronic device according to claim 1, wherein, The second number of the plurality of second windings of the second coil (520) is greater than the first number of the plurality of first windings of the first coil (510).

4. The electronic device according to claim 1, wherein, The inductance of the second coil (520) is 1.5 to 2 times that of the first coil (510).

5. The electronic device according to claim 1, wherein, The starting point (511) of the first coil (510) is located at the outermost winding (515) among the plurality of first windings. The end point (512) of the first coil (510) is located at the innermost winding (516) among the plurality of first windings, and The starting point (511) of the first coil (510) is connected to the first feed terminal (501), and the ending point (512) of the first coil (510) is connected to the second feed terminal (502).

6. The electronic device according to claim 2, wherein, In the second layer (532), the first sub-line (522-1) is disposed inside the second sub-line (522-2).

7. The electronic device according to claim 6, wherein, At least one crossover region (525) is located at the innermost winding (520b) of the plurality of second windings of the second coil (520), and In the intersection area (525), the first sub-line (521-1) in the first layer (531) is connected to the first sub-line (522-1) in the second layer (532), and the second sub-line (521-2) in the first layer (531) is connected to the second sub-line (522-2) in the second layer (532).

8. The electronic device according to claim 7, wherein, The starting point (526) of the second coil (520) is located at the outermost winding (520a) of the plurality of second windings in the first layer (531), and The end point (527) of the second coil (520) is located at the outermost winding (520c) among the plurality of second windings in the second layer (532).

9. The electronic device according to claim 6, wherein, The plurality of second windings of the second coil (520) include a second-1 winding (521) disposed in the first layer (531) and a second-2 winding (522) disposed in the second layer (532).

10. The electronic device according to claim 9, wherein, When the first layer (531) and the second layer (532) overlap, the second-1 winding (521) disposed in the first layer (531) and the second-2 winding (522) disposed in the second layer (532) are configured to have shapes that are symmetrical with respect to each other.

11. The electronic device according to claim 9, wherein, When the first layer (531) and the second layer (532) overlap, the second-1 winding (521) disposed in the first layer (531) and the second-2 winding (522) disposed in the second layer (532) are configured to have asymmetrical shapes relative to each other.

12. The electronic device according to claim 7, wherein, The length of the conductor connecting the first sub-line (521-1) in the first layer (531) and the first sub-line (522-1) in the second layer (532) is substantially the same as the length of the conductor connecting the second sub-line (521-2) in the first layer (531) and the second sub-line (522-2) in the second layer (532).

13. The electronic device according to claim 7 or 12, wherein, When current flows through the second coil (520), the current density of the conductor connecting the first sub-line (521-1) in the first layer (531) and the first sub-line (522-1) in the second layer (532) is configured to be substantially the same as the current density of the conductor connecting the second sub-line (521-2) in the first layer (531) and the second sub-line (522-2) in the second layer (532).

14. The electronic device according to claim 7, wherein, The first sub-line (521-1) in the first layer (531) and the first sub-line (522-1) in the second layer (532) are connected through a first through-hole provided in the circuit board (530). The second sub-line (521-2) in the first layer (531) and the second sub-line (522-2) in the second layer (532) are connected by a second through hole provided in the circuit board (530).

15. The electronic device according to claim 6, wherein, At least one connection region (625) is located at the innermost winding (520b) among the plurality of second windings of the second coil (520), and In the connection area (625), the first sub-line (521-1) in the first layer (531) and the second sub-line (522-2) in the second layer (532) are connected, and the second sub-line (521-2) in the first layer (531) and the first sub-line (522-1) in the second layer (532) are connected.

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