Sole and shoe

Abstract

Provided is a shoe sole and a shoe capable of suppressing generation of uneven compression rate. The shoe sole includes an elastic deformationable cushioning layer, a bottom plate provided below the cushioning layer, a top plate provided above the cushioning layer, and at least one pin holding member that holds a spike pin. The bottom plate includes a plate main body and a base portion that holds the pin holding member. The base portion includes an upper surface formed at a position that protrudes from an upper surface of the plate main body. The cushioning layer includes a first region on the base portion and a second region on the plate main body. The second region includes a receiving space that can accommodate a portion of the first region when a compression load in a vertical direction acts on the cushioning layer.

Description

Technical Field

[0001] This disclosure relates to shoe soles and shoes. Background Technology

[0002] Shoes with pins are known in the past. For example, Japanese Patent Application Publication No. 2024-21287 discloses a shoe having a midsole, a sole plate, a top plate, and a pin retaining member. The sole plate has a plate body and a base portion for retaining the pin retaining member. The base portion protrudes upward from the upper surface of the plate body. In this shoe, the forward propulsion force during walking is improved by utilizing the rebound energy generated when the midsole recovers.

[0003] In the shoe described in Japanese Patent Application Publication No. 2024-21287, the compression of the portion of the midsole on the plate body is smaller during walking, compared to the compression of the portion located on the base of the midsole. In other words, in this shoe, the compression rate of the midsole may be uneven during walking. That is, there is room for improvement in terms of increasing rebound energy. Summary of the Invention

[0004] The purpose of this disclosure is to provide a sole and shoe that can suppress the generation of uneven compression ratio.

[0005] According to one aspect of this disclosure, a sole constitutes part of a shoe, comprising: a cushioning layer capable of elastic deformation; a sole plate disposed below the cushioning layer; a top plate disposed above the cushioning layer; and at least one pin retaining member for retaining a pin. The sole plate has: a plate body; and at least one base portion for retaining at least one of the pin retaining members, the at least one base portion having an upper surface located above the upper surface of the plate body. The cushioning layer has: a first region located on at least one of the base portions; and a second region located on the plate body, the second region including a receiving space capable of accommodating a portion of the first region when a compressive load is applied to the cushioning layer in the vertical direction.

[0006] Additionally, a shoe according to one aspect of this disclosure has: the sole; and an upper disposed above the sole.

[0007] The above and other objects, features, aspects and advantages of the invention will become apparent from the following detailed description of the invention taken in conjunction with the accompanying drawings. Attached Figure Description

[0008] Figure 1 This is a schematic cross-sectional view of a shoe according to one embodiment of the present disclosure.

[0009] Figure 2 It is an exploded 3D diagram of the shoe sole.

[0010] Figure 3 This is a bottom view of the shoe sole.

[0011] Figure 4 yes Figure 3 A cross-sectional view at line IV-IV.

[0012] Figure 5 yes Figure 3 A cross-sectional view at the VV line.

[0013] Figure 6 It is a schematic diagram showing the cross-section of the base plate, buffer layer, and top plate.

[0014] Figure 7 It is a schematic representation Figure 6 The diagram shows the state of the buffer layer being compressed.

[0015] Figure 8 It has the same Figure 1 The diagram shows a three-dimensional representation of a cushioning layer with a structure essentially the same as that of the cushioning layer in the shoe sole.

[0016] Figure 9 yes Figure 8 A three-dimensional view of the unit structure of the buffer layer shown.

[0017] Figure 10 It has the same Figure 1 The diagram shows a three-dimensional representation of the cushioning layer, which has an approximate structure to the cushioning layer of the shoe sole.

[0018] Figure 11 yes Figure 10 A three-dimensional view of the unit structure of the buffer layer shown.

[0019] Figure 12 This is a three-dimensional diagram showing a modified example of the buffer layer. Detailed Implementation

[0020] Embodiments of the present invention will be described with reference to the accompanying drawings. Furthermore, in the drawings referred to below, the same or equivalent components are labeled with the same reference numerals.

[0021] Figure 1 This is a schematic cross-sectional view of a shoe according to one embodiment of the present disclosure. Figure 2 It is an exploded 3D diagram of the shoe sole. Figure 3 This is a bottom view of the shoe sole. Figure 4 yes Figure 3 A cross-sectional view at line IV-IV. Figure 5 yes Figure 3 A cross-sectional view at the VV line. Furthermore, in Figures 1-3The image shows a sole 10 for the left foot, but this sole 10 can also be applied to the right foot. In this case, the sole for the right foot is formed in a shape that is symmetrical to, or approximately based on, the sole for the left foot. The shoe 1 of this embodiment is suitable as a spiked shoe, particularly a spiked shoe for land sports. However, the application of the shoe 1 is not limited to this; it can also be applied to spiked shoes for ball sports such as baseball and soccer.

[0022] In the following description, terms such as foot length direction, foot width direction, front, and back are used. These directional terms indicate the direction of view from the perspective of the wearer wearing the shoes 1 placed on a flat surface such as the ground. For example, front refers to the toe side, and back refers to the heel side.

[0023] Foot length direction and shoe center SC (reference) Figure 3 The extension direction is consistent with that of the sole 10. The shoe center SC is the straight line obtained by projecting the straight line connecting the part between the wearer's first and second toes and the central part of the calcaneus (the so-called heel center HC) in the vertical direction onto the sole 10 when a standard wearer with a foot that fits shoe size 1 wears the shoe.

[0024] like Figure 1 As shown, shoe 1 has a sole 10 and an upper 20.

[0025] The upper 20 is attached to the sole 10 by bonding or other means. The upper 20 and the sole 10 together form a space for accommodating the wearer's foot. The upper 20 covers the upper surface of the wearer's foot.

[0026] The sole 10 forms part of the shoe 1. The sole 10 is attached to the lower part of the upper 20. (Example) Figure 1 and Figure 2 As shown, the sole 10 has a cushioning member 100, a sole plate 200, a top plate 300, a connecting member 400, and at least one pin retaining member 500 (see reference). Figure 4 and Figure 5 ).

[0027] The cushioning member 100 has a cushioning function upon contact with the ground and a rebound function upon being stepped on. The cushioning member 100 is preferably formed of a foamed resin, foamed rubber, resin material, or rubber material with moderate strength and excellent cushioning properties. For example... Figure 1 and Figure 2 As shown, the cushioning member 100 has a cushioning layer 101, a front insole 102, and a rear insole 103.

[0028] The cushioning layer 101 is elastically deformable. The cushioning layer 101 is positioned at the metacarpophalangeal joint (MP joint) of the wearer's foot to support it. Figure 3 The location of the double-dotted line (MP) in the diagram. Details about buffer layer 101 will be described later.

[0029] The forefoot midsole 102 is positioned in front of the cushioning layer 101. The forefoot midsole 102 supports the wearer's toes and surrounding areas. Figure 5 As shown, a gap is formed between the front insole 102 and the buffer layer 101.

[0030] The rear midsole 103 is positioned behind the cushioning layer 101. The rear midsole 103 supports the heel of the wearer's foot and surrounding areas. Figure 5 As shown, a gap is formed between the back insole 103 and the buffer layer 101.

[0031] The base plate 200 is disposed below the buffer layer 101. In this embodiment, the base plate 200 is connected to the lower surface of the buffer member 100. The base plate 200 is made of thermoplastic resin or the like. The hardness of the base plate 200 is greater than the hardness of the buffer member 100. The base plate 200 has a plate body 210 and at least one base portion 220.

[0032] The plate body 210 is joined to the lower surface of the buffer member 100. For example... Figure 2 and Figure 3 As shown, the plate body 210 has a first body 211 and a second body 212.

[0033] The first body 211 has a shape that extends rearward from the front end of the cushioning member 100. The first body 211 extends from the front end of the sole 10 to a position corresponding to the wearer's arch. The first body 211 has a shape that curves downward in a convex manner.

[0034] The second body 212 is positioned behind the first body 211. The second body 212 is positioned to overlap with the wearer's heel. Figure 3 As shown, the second body 212 has a shape that includes the central portion of the wearer's calcaneus (the so-called heel center HC). Furthermore, the first body 211 and the second body 212 can also be integrally connected.

[0035] The base portion 220 retains the pin retaining member 500. The pin retaining member 500 is capable of retaining a pin (not shown). Examples of pin retaining members 500 include nuts. In this embodiment, at least one base portion 220 includes a plurality of base portions 220. Each base portion 220 has a shape that surrounds the pin retaining member 500. Each base portion 220 is integrally formed with the plate body 210. Each base portion 220 protrudes from the plate body 210. Figure 2 , Figure 4 and Figure 5As shown, the base portion 220 has an upper surface 220S formed at a position that protrudes from the upper surface 210S of the plate body 210. In other words, the base portion 220 protrudes upwards further than the upper surface 210S of the plate body 210 surrounding the base portion 220.

[0036] Furthermore, since the first body 211 of the main body 210 is bent in a downward convex manner, when the sole 10 is placed on a flat surface such as the ground, as Figure 5 As shown, the upper surface 210S of the plate body 210 includes a portion that is higher than the upper surface 220S of the base portion 220.

[0037] The lower surface of the base portion 220 may be formed on a surface that is substantially the same as the curved surface including the lower surface of the plate body 210, or it may protrude downward from the curved surface including the lower surface of the plate body 210.

[0038] like Figure 4 and Figure 5 As shown, the plurality of base portions 220 include a support base portion 222. The support base portion 222 supports at least a portion of the lower wall portion 110 of the buffer layer 101, which will be described later.

[0039] A top plate 300 is disposed above the cushioning layer 101. In this embodiment, the top plate 300 is connected to the upper surface of the cushioning member 100. Specifically, the top plate 300 is connected to the upper surfaces of each upper wall portion 120 of the cushioning layer 101 (described later), the upper surface of the front midsole 102, and the upper surface of the rear midsole 103. The top plate 300 extends from the front portion of the front midsole 102 to the rear portion of the rear midsole 103.

[0040] A connecting member 400 is disposed between the top plate 300 and the upper 20, and has the function of connecting the upper 20 to the top plate 300. The connecting member 400 has a shape that substantially corresponds to the top plate 300.

[0041] Here, the buffer layer 101 will be described. The material of the buffer layer 101 can be virtually any material, provided it possesses sufficient elasticity; resin or rubber materials are preferred. More specifically, when the buffer layer 101 is made of resin, the material can be, for example, polyolefin resin, ethylene-vinyl acetate copolymer (EVA), polyamide thermoplastic elastomer (TPA, TPAE), thermoplastic polyurethane (TPU), or polyester thermoplastic elastomer (TPEE). On the other hand, when the buffer layer 101 is made of rubber, the material can be, for example, butadiene rubber.

[0042] There are no particular limitations on the manufacturing method of the buffer layer 101. The buffer layer 101 can be manufactured, for example, by injection molding, casting molding, or sheet molding using a mold, or by shaping using a three-dimensional stacking molding device. In particular, since the shape of the buffer layer 101 is relatively simple, the buffer layer can be easily manufactured by molding using a mold, without the need for shaping using a three-dimensional stacking molding device or molding using complex molds, which can significantly reduce manufacturing costs.

[0043] like Figure 2 As shown, the two ends of the cushioning layer 101 in the foot width direction reach the inner and outer sides of the sole 10. The cushioning layer 101 has a shape that opens a receiving space S in the foot width direction of the sole 10.

[0044] like Figure 4 and Figure 5 As shown, the buffer layer 101 has a first region R1 located on the base portion 220 and a second region R2 located on the plate body 210. The second region R2 includes a receiving space S that can accommodate a portion of the first region R1 when a compressive load in the vertical direction is applied to the buffer layer 101 (e.g., when grounded). Furthermore, the buffer layer 101 is integrally formed of the same material, but to easily distinguish the first region R1 from the second region R2, [details omitted]. Figure 4 and Figure 6 In the diagram, the first region R1 is represented by a dot pattern.

[0045] like Figure 4 and Figure 5 As shown, the buffer layer 101 has a plurality of lower wall portions 110, a plurality of upper wall portions 120 and a plurality of vertical wall portions 130.

[0046] Each lower wall portion 110 is in contact with the upper surface 210S of the main plate body 210 and even the upper surface 220S of the base portion 220. For example... Figure 4 and Figure 5 As shown, the plurality of lower wall portions 110 include at least one intermediate lower wall portion 112. In this embodiment, the at least one intermediate lower wall portion 112 includes a plurality of intermediate lower wall portions 112. Each intermediate lower wall portion 112 is disposed between a pair of adjacent base portions 220. Each intermediate lower wall portion 112 is in contact with the upper surface 210S of the plate body 210.

[0047] Each upper wall portion 120 is formed at a position higher than the plurality of lower wall portions 110. The upper surface of the upper wall portion 120 is in contact with the lower surface of the top plate 300.

[0048] Each vertical wall portion 130 connects the lower wall portion 110 to the upper wall portion 120. Each vertical wall portion 130 connected to the shared upper wall portion 120 is formed such that it approaches each other from the lower wall portion 110 toward the upper wall portion 120. For example... Figure 6 As shown, the length D between a pair of opposing vertical wall portions 130 can be 0.5 mm or more, 0.6 mm or more, or 0.7 mm or more. Furthermore, the length D between a pair of vertical wall portions 130 refers to the length between the midpoints of the two sides formed by the intersection of the pair of opposing vertical wall portions 130 and the lower wall portion 110.

[0049] In this embodiment, the second region R2 includes a pair of adjacent vertical wall portions 130, and an accommodating space S is formed between the pair of vertical wall portions 130.

[0050] Figure 6 It is a schematic diagram showing the cross-section of the base plate, buffer layer, and top plate. Figure 7 It is a schematic representation Figure 6 A diagram showing the state of the buffer layer being compressed. (See diagram below.) Figure 6 and Figure 7 As shown, when a compressive load is applied to the buffer layer 101 in the vertical direction, a portion of the first region R1 (e.g., a portion of the vertical wall portion 130) enters the receiving space S of the second region R2, thus the buffer layer 101 as a whole is easily compressed uniformly. Without the receiving space S, when a compressive load is applied to the buffer layer 101 in the vertical direction, the compressive force is biased towards the first region R1, making it difficult for the buffer layer 101 as a whole to be compressed uniformly, and thus making it difficult for the buffer layer 101 as a whole to obtain a rebound force.

[0051] like Figure 2 As shown, the buffer layer 101 differs from the front midsole 102 and the rear midsole 103 in that it is composed of a three-dimensional structure having a plurality of recesses and protrusions. This three-dimensional structure will be described here.

[0052] Figure 8 It has the same Figure 1 A perspective view of a cushioning layer 101A with a structure substantially the same as that of the cushioning layer 101 in the shoe sole shown. Figure 9 yes Figure 8 A perspective view of the unit structure 101U of the buffer layer 101A shown.

[0053] like Figure 8 As shown, the buffer layer 101A includes a three-dimensional structure 101S having a plurality of unit structures 101U arranged adjacent to each other. Each of the plurality of unit structures 101U has a three-dimensional shape formed by a wall 101W, the outer contour of which is defined by a pair of parallel planes (see...). Figure 9 Thus, the three-dimensional structure 101S also has a three-dimensional shape formed by the wall 101W, the outer contour of which is defined by a pair of parallel planes.

[0054] The unit structure 101U has a structure based on a geometrically planar structural unit and to which thickness is given. More specifically, the unit structure 101U is constructed by dividing a structural unit consisting of a plurality of intersecting planes with internal voids into two in any one of its orthogonal triaxial directions, and further giving it thickness.

[0055] Here, in Figure 9 In the unit structure 101U shown, the aforementioned surface structure is a Kelvin structure. The unit structure 101U is constructed by dividing the structural unit of the Kelvin structure in two along the height direction (Z-axis direction shown in the figure) in the orthogonal triaxial direction and further imparting thickness.

[0056] More specifically, the unit structure 101U includes an upper wall portion 120, four lower wall portions 110 divided into four sections, and four vertical wall portions 130 connecting the upper wall portions 120 and the lower wall portions 110 respectively. The vertical wall portions 130 extend in a manner intersecting with the upper wall portions 120 and the lower wall portions 110, and connect to adjacent vertical wall portions 130 at their side ends. Thus, the four vertical wall portions 130 form a ring shape. Furthermore, the upper wall portions 120, the lower wall portions 110, and the vertical wall portions 130 each have a flat plate shape. That is, the lower wall portions 110, the upper wall portions 120, and the vertical wall portions 130 form a three-dimensional shape defining a defined accommodating space S.

[0057] The four lower wall portions 110 are integrated by being continuous with the lower wall portions 110 included in other unit structures 101U that are arranged adjacent to the unit structure 101U containing itself. Thus, in the three-dimensional structure 101S, by making the lower wall portions 110 included in each of these four adjacent unit structures 101U continuous with each other, a lower wall portion 110 having a shape substantially the same as the upper wall portion 120 described above is formed.

[0058] The buffer layer 101A is designed to provide buffering in the aforementioned height direction. Therefore, as... Figure 8 As shown, a plurality of unit structures 101U are arranged regularly and continuously along the width direction (X direction shown in the figure) and depth direction (Y direction shown in the figure) of the aforementioned orthogonal three axes. Thus, the three-dimensional structure 101S, when viewed from above, has a structure with alternating upward and downward convex portions. It should be noted that in... Figure 8 In the figure, three adjacent unit structures 101U in the width and depth directions are extracted and illustrated.

[0059] In the buffer layer 101A constructed in this way, when a load is applied along its height direction (the Z-axis direction shown in the figure), compressive deformation occurs. At this time, in the buffer layer 101A, buckling occurs in the vertical wall portion 130 due to its structure. In addition, when the above-mentioned load is removed, the buckling in the vertical wall portion 130 is also eliminated, and the buffer layer 101A returns to its original shape.

[0060] like Figures 1-5 As shown, the cushioning layer 101 of the sole 10 in this embodiment is provided on the sole 10. While maintaining the basic structure of the cushioning layer 101A, the shape and thickness of the unit structure 101U are slightly deformed for each part. Other than that, it has the same structure as the cushioning layer 101A.

[0061] Therefore, the unit structure of the cushioning layer 101 of the sole 10 in this embodiment is also formed by dividing the structural unit of the Kelvin structure in the height direction (Z-axis direction shown in the figure) in the orthogonal triaxial direction and further imparting thickness. Thus, the cushioning layer 101 is a three-dimensional structure formed by repeatedly arranging a plurality of such unit structures in an adjacent manner.

[0062] Here, the aforementioned buffer layer 101 is constructed by dividing a Kelvin structure unit in half along the height direction and further imparting thickness. However, other surface structure units can be used instead of Kelvin structure units. For example, similar to the aforementioned buffer layer 101, when the buffer material is a three-dimensional material with a wall defined by a pair of parallel planes along its outer contour, structural units such as octahedral, cubic, and cubic octahedral structures can be used in addition to Kelvin structures.

[0063] These surface structures are all composed of a plurality of intersecting planes with internal cavities. Each of these planes is divided in two along any one of the orthogonal triaxial directions and then thickened to form a buffer layer. This allows for the creation of a buffer layer that not only achieves high buffering performance but also high resilience.

[0064] in addition, Figure 10 This is a perspective view of a cushioning layer 101B having a structure similar to the cushioning layer 101 of the sole in this embodiment. Figure 11 This is a perspective view of the unit structure 101U of the cushioning layer 101B. Here, in the sole 10 of this embodiment, the aforementioned cushioning layer 101 may be substituted, and a sole as described above may be used. Figure 10 The buffer layer 101B shown is used as buffer layer 101. Hereinafter, reference will be made to the... Figure 10 and Figure 11 The cushioning layer 101B, which has a structure similar to the cushioning layer 101 of the sole 10 in this embodiment, will be described.

[0065] for Figure 10 The buffer layer 101 shown, as its unit construct 101U, has a structure based on a geometrically surface-structured structural unit and endowed with thickness. More specifically, the unit construct 101U is constructed by dividing a mathematically defined triple-periodic minimal surface structural unit in half along any of its orthogonal triaxial directions and further endowing it with thickness. Furthermore, a minimal surface is defined as the surface with the smallest area among surfaces bounded by a given closed curve.

[0066] Here, in Figure 10 In the unit structure 101U shown, the aforementioned surface structure is a Schwarz P structure. The unit structure 101U is formed by dividing the structural unit of the Schwarz P structure in two along the height direction (Z-axis direction shown in the figure) in the orthogonal triaxial direction and further imparting thickness.

[0067] In the buffer layer 101B constructed in this way, similarly to the buffer layer 101A described above, compressive deformation occurs when a load is applied along its height direction (the Z-axis direction shown in the figure). At this time, buckling occurs in the vertical wall portion 130 of the buffer layer 101B. Furthermore, when the applied load is removed, the buckling of the vertical wall portion 130 is eliminated, and the buffer layer 101B returns to its original shape.

[0068] Therefore, when the cushioning layer 101 of the sole 10 in this embodiment is replaced by a cushioning layer with a structure that is basically the same as that of the cushioning layer 101B, the cushioning layer 101 will also be compressed when the foot is hit. As a result, the cushioning layer 101 that supports the metacarpophalangeal joint of the wearer's foot not only has high cushioning performance, but also high rebound performance.

[0069] Furthermore, other structural units of triple-period minimal surfaces can be used to replace the Schwarz P structure described above. Other structures that can be used as triple-period minimal surface structural units include gyroid structures and Schwarz D structures. By dividing these structural units in half along any of the orthogonal triaxial directions and further imparting thickness to them to form a cushioning material, it is possible to produce a cushioning material that not only achieves high cushioning performance but also high resilience.

[0070] As explained above, in the sole 10 of this embodiment, since the second region R2 includes the accommodating space S, when a compressive load is applied to the cushioning layer 101 in the vertical direction, a portion of the first region R1 (e.g., a portion of the vertical wall portion 130) enters the second region R2, thereby substantially uniformly compressing the cushioning layer 101 as a whole. Therefore, uneven compression ratios within the cushioning layer 101 are suppressed. Consequently, the rebound energy generated when the cushioning layer 101 recovers (e.g., during push-off while walking) is effectively increased.

[0071] Alternatively, the buffer layer 101 described above can be replaced, such as... Figure 12 As shown, a buffer layer 101 with a lattice structure is used. The lattice structure has a structure containing a plurality of straight line elements (edges) and intersection points (nodes) where the straight line elements intersect. There are spaces between the straight line elements that correspond to the accommodating space S in the buffer layer 101 described above. Therefore, when a compressive load in the vertical direction is applied to the buffer layer 101 with the lattice structure, the straight line elements can enter the accommodating space S, and the buffer layer 101 as a whole can be easily and uniformly compressed.

[0072] In the above description, the method of making the accommodating space S a cavity (filling the interior of the accommodating space S with gas) was described. However, it is also possible for the accommodating space S to contain substances other than gas, within a range that can accommodate a portion of the first region when a compressive load is applied to the buffer layer 101 in the vertical direction. Specifically, the accommodating space S may also be filled with a material that is more deformable than the material constituting the unit structure 101U and the lattice structure.

[0073] Those skilled in the art will understand that the exemplary embodiments described above are specific examples of the solutions described below.

[0074] [Method 1]

[0075] A shoe sole, forming part of a shoe, wherein it has: The buffer layer is capable of elastic deformation; The base plate is located below the buffer layer; Top plate, disposed above the buffer layer; and At least one pin retaining member, retaining pin, The base plate has: The main body of the board; and At least one base portion holds at least one of the said pin retaining members. At least one of the base portions has an upper surface formed at a position that protrudes from the upper surface of the plate body. The buffer layer has: A first region, located on at least one of the base portions; and The second region is located on the main body of the plate. The second region includes a containment space that can accommodate a portion of the first region when a compressive load is applied to the buffer layer in the vertical direction.

[0076] In the sole, because the second region includes a receiving space, when a compressive load is applied to the cushioning layer in the vertical direction, a portion of the first region enters the second region, thereby compressing the cushioning layer substantially uniformly as a whole. This suppresses uneven compression ratios within the cushioning layer. Consequently, the rebound energy generated during the cushioning layer's recovery (e.g., during push-off while walking) is effectively increased.

[0077] [Method 2]

[0078] According to the sole described in method 1, wherein, The buffer layer has: Multiple lower wall portions; A plurality of upper wall portions are formed at a position higher than the plurality of said lower wall portions; and A plurality of vertical wall portions connect the lower wall portion to the upper wall portion, respectively. The second region includes a pair of adjacent vertical wall portions, with the receiving space formed between the pair of vertical wall portions.

[0079] [Method 3]

[0080] According to the sole described in method 2, wherein, At least one of the said pin retaining members includes a plurality of pin retaining members. At least one of the base portions includes a plurality of base portions. The plurality of said base portions include a support base portion that supports at least a portion of the lower wall portion.

[0081] In this method, when a compressive load is applied to the sole in the vertical direction, the cushioning layer is compressed by the base and the top plate. Therefore, the rebound energy generated when the cushioning layer recovers is effectively increased.

[0082] [Method 4]

[0083] According to the sole of method 3, the plurality of said lower wall portions include at least one intermediate lower wall portion disposed between a pair of said base portions adjacent to each other.

[0084] [Method 5]

[0085] According to the sole of method 4, at least one of the middle lower wall portions is in contact with the plate body.

[0086] [Method 6]

[0087] According to the sole of method 2, the length between a pair of the vertical wall portions is 0.5 mm or more.

[0088] [Method 7]

[0089] According to the sole described in method 2, wherein, The buffer layer comprises a three-dimensional structure consisting of a plurality of unit structures arranged adjacent to each other. Each of the plurality of said unit structures includes the upper wall portion, the lower wall portion, and the vertical wall portion. The upper wall, the lower wall, and the vertical wall form a three-dimensional shape that defines the accommodating space.

[0090] [Method 8]

[0091] According to the sole of embodiment 7, the three-dimensional structure has a shape that opens the receiving space in the foot width direction of the sole.

[0092] [Method 9]

[0093] A type of shoe, wherein: The sole of any one of methods 1 to 8; and The upper is located above the sole.

[0094] Embodiments of the present invention have been described, but should be considered illustrative rather than limiting in all respects. The scope of the invention is set forth in the claims and is intended to include all modifications equivalent to or within the scope of the claims.

Claims

1. A shoe sole, constituting part of a shoe, wherein, have: The buffer layer is capable of elastic deformation; The base plate is located below the buffer layer; Top plate, located above the buffer layer; as well as At least one pin retaining member, retaining pin, The base plate has: Main body of the board; as well as At least one base portion holds at least one of the said pin retaining members. At least one of the base portions has an upper surface formed at a position that protrudes from the upper surface of the plate body. The buffer layer has: A first region, located on at least one of the base portions; and The second region is located on the main body of the plate. The second region includes a containment space that can accommodate a portion of the first region when a compressive load is applied to the buffer layer in the vertical direction.

2. The sole according to claim 1, wherein, The buffer layer has: Multiple lower wall portions; A plurality of upper wall portions are formed at a position higher than the plurality of said lower wall portions; and A plurality of vertical wall portions connect the lower wall portion to the upper wall portion, respectively. The second region includes a pair of adjacent vertical wall portions, with the receiving space formed between the pair of vertical wall portions.

3. The sole according to claim 2, wherein, At least one of the said pin retaining members includes a plurality of pin retaining members. At least one of the base portions includes a plurality of base portions. The plurality of said base portions include a support base portion that supports at least a portion of the lower wall portion.

4. The sole according to claim 3, wherein, The plurality of said lower wall portions includes at least one intermediate lower wall portion disposed between a pair of said base portions adjacent to each other.

5. The sole according to claim 4, wherein, At least one of the middle lower wall portions is in contact with the plate body.

6. The sole according to claim 2, wherein, The length between a pair of the vertical wall portions is 0.5 mm or more.

7. The sole according to claim 2, wherein, The buffer layer comprises a three-dimensional structure consisting of a plurality of unit structures arranged adjacent to each other. Each of the plurality of said unit structures includes the upper wall portion, the lower wall portion, and the vertical wall portion. The upper wall, the lower wall, and the vertical wall form a three-dimensional shape that defines the accommodating space.

8. The sole according to claim 7, wherein, The three-dimensional structure has a shape that opens the receiving space in the foot width direction of the sole.

9. A type of shoe, wherein, have: The sole according to any one of claims 1 to 8; and The upper is located above the sole.

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