Integrated circuit semiconductor processing cooling apparatus and method

Abstract

The application discloses an integrated circuit semiconductor processing cooling device and a method thereof, and relates to the technical field of semiconductor cooling devices.The device comprises a body, a bearing plate, a rotating disc and a blowing mechanism, the inner wall of the body is fixedly provided with a partition plate, the partition plate is provided with an elastic mechanism, the inside of the bearing plate is provided with a pop-up mechanism, the rotating disc is rotationally arranged in the inside of the body, the top end of the rotating disc is fixedly provided with a lifting plate, the bottom end of the inner wall of the body is provided with a driving mechanism, and the blowing mechanism is arranged on the body.The setting mode of the partition plate, the bearing plate, the sealing mechanism, the elastic mechanism, the rotating disc, the lifting plate and the driving mechanism is matched, the lifting plate is driven to rotate by the driving mechanism, one of the two bearing plates is lifted and the other is lowered, the through slot at the lowered position is sealed in advance by the sealing mechanism, the cooling gas leakage is reduced, the cooling system is prevented from being frequently started and stopped, the waiting time is shortened, and the continuity and production efficiency of batch processing are improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor cooling equipment technology, and in particular to a cooling device and method for integrated circuit semiconductor processing. Background Technology

[0002] Integrated circuit semiconductors are micro-electronic components manufactured and interconnected on wafers through processes such as photolithography, etching, and deposition to achieve functions such as signal processing and storage. Their core includes wafer manufacturing, packaging, and testing, and they are the key foundation of electronic devices.

[0003] In integrated circuit semiconductor processing, cooling is used to control process temperature and prevent materials from overheating or thermal damage. When cooling integrated circuit semiconductors, wafers or chips are usually placed in a cooling box in batches and cooled by cooling gas. However, when removing and replacing them, it is not only time-consuming but also prone to leakage of cooling gas, thereby increasing operating costs, affecting cooling efficiency, and is quite inconvenient. Summary of the Invention

[0004] The purpose of this invention is to provide a cooling apparatus and method for integrated circuit semiconductor processing to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a cooling device for integrated circuit semiconductor processing, comprising: The body, wherein a partition is fixedly installed on the inner wall of the body; The carrier plate has symmetrical through slots for placing the carrier plate, a closing mechanism for adjusting the opening and closing of the through slots, an elastic mechanism for connecting the carrier plate, and an ejection mechanism for ejecting a tray containing integrated circuit semiconductors inside the carrier plate. A turntable is rotatably disposed inside the machine body. A lifting plate for adjusting the height of the support plate is fixedly installed at the top of the turntable. A drive mechanism for driving the turntable to rotate is provided at the bottom of the inner wall of the machine body. A blower mechanism, which is mounted on the machine body, is used to circulate and generate cooling gas.

[0006] Preferably, the closure mechanism includes: The first motor is fixedly installed at the bottom end of the partition. A drive rod is connected to the output end of the first motor, and the drive rod is rotatably interlocked with the partition. A sealing plate is fixedly inserted and connected to a drive rod, and an exposure groove is provided on the sealing plate for exposing the bearing plate.

[0007] Preferably, the elastic mechanism includes: Sleeves, which are symmetrically and fixedly installed on the top of the partition; An extrusion rod is slidably inserted into the inner cavity of the sleeve, and the cross-section of the extrusion rod is T-shaped. A connecting plate is fixedly connected to the outer wall of the extrusion rod, and a bearing plate is fixedly connected to the top of the connecting plate; The roller has a groove at the bottom end of the connecting plate, and the roller is rotatably disposed inside the groove. The roller cooperates with the lifting plate. A first compression spring, one end of which is fixedly connected to the extrusion rod, and the other end of which abuts against the top end of the inner wall of the sleeve.

[0008] Preferably, the pop-out mechanism includes: Top plate, which is slidably disposed inside the support plate; An extrusion plate, which is symmetrically arranged below the support plate; A connecting rod, one end of which is fixedly connected to the top plate and the other end of which is fixedly connected to the extrusion plate; A fixing plate is fixedly connected to the bottom end of the inner wall of the machine body, and the fixing plate cooperates with the extrusion plate. The second compression spring is sleeved on the outside of the connecting rod.

[0009] Preferably, one end of the second compression spring is fixedly connected to the extrusion plate, and the other end of the second compression spring abuts against the partition.

[0010] Preferably, the drive mechanism includes: The base is fixedly installed on the bottom end of the inner wall of the machine body, and the turntable is rotatably mounted on the base through bearings; A gear ring, which is fixedly fitted onto the outside of the turntable; The second motor is fixedly installed inside the base; The gear is connected to the output end of the second motor via a gear drive, and the gear meshes with a gear ring.

[0011] Preferably, the blower mechanism includes: The refrigeration unit is fixedly installed on the top of the machine body; A fan, which is fixedly installed on the top of the inner wall of the machine body; A circulation pipe, one end of which is fixedly connected to the machine body, and the other end of which is fixedly connected to the output end of the cooler.

[0012] Preferably, a sealing ring is fixedly sleeved on the outer wall of the bearing plate, and a sealing groove communicating with the through groove is opened at the bottom end of the partition plate, and the sealing ring and the sealing groove cooperate with each other.

[0013] Preferably, the outer wall of the body is provided with an observation window, which is made of transparent material.

[0014] The present invention also provides a method of using an integrated circuit semiconductor processing cooling device, comprising the following specific steps: Step 1: Place the integrated circuit semiconductor tray to be cooled inside one of the carrier plates. At this time, the carrier plate is in a raised state under the influence of the lifting plate and is located inside the machine body. The sealing is achieved by the sealing ring and the sealing groove. Start the blower mechanism, the cooler generates cooling gas, and the fan blows the cooling gas downward. The airflow is formed through the circulation pipe to cool the tray on the carrier plate in the raised state. Step 2: After the internal material tray has cooled down, the first motor is started by the controller on the outside of the machine. The first motor drives the drive rod to rotate, so that the sealing plate rotates to the position where the exposed groove is deviated from the through groove. The sealing plate body blocks the through groove on the partition plate where the supporting plate is located, isolating the cooling area from the external environment and preventing the cooling gas from leaking out during the descent process. Step 3: Then start the second motor through the controller. The second motor drives the gear to rotate. The gear drives the turntable to rotate through the gear ring. The turntable drives the lifting plate to rotate. The gradual slope of the lifting plate pushes the roller, so that the elastic mechanism drives the support plate to move vertically. The support plate that has been cooled gradually descends from the raised state to the bottom of the machine body. At the same time, another support plate gradually rises and enters the top cooling position of the machine body. Step 4: When the cooled carrier plate is lowered to the lowest point, the extrusion plate of the ejection mechanism contacts the fixed plate and the turntable and is lifted. The extrusion plate overcomes the elastic force of the second compression spring and pushes the top plate upward through the connecting rod to lift the cooled integrated circuit semiconductor tray. After the operator removes the ejected cooled tray, a new integrated circuit semiconductor tray to be cooled is placed in the carrier plate. Step 5: Restart the first motor via the controller to drive the closed plate to rotate so that the exposed slot is aligned with the slot of the other support plate that has been raised into the machine body, thus exposing the support plate to receive cooling airflow. Start the blower mechanism to cool the material tray on the newly raised support plate. Repeat this cycle to achieve continuous batch processing.

[0015] The technical effects and advantages of this invention are as follows: This invention utilizes a combination of partitions, support plates, a sealing mechanism, an elastic mechanism, a turntable, a lifting plate, and a drive mechanism. The drive mechanism rotates the lifting plate to adjust the two support plates, one rising and the other falling. The sealing mechanism pre-closes the through slot at the fallen position, allowing one support plate to undergo gas cooling inside the machine while the other is used for loading and unloading outside. This isolates the cooling area from the external environment, thereby reducing cooling gas leakage, avoiding frequent start-ups and shutdowns of the cooling system, shortening waiting time, and improving the continuity and production efficiency of batch processing.

[0016] This invention utilizes a combination of a turntable, a lifting plate, an elastic mechanism, a support plate, and a pop-out mechanism. When the lifting plate rotates, its gradually changing slope guides the support plate on the elastic mechanism to adjust its horizontal height. Simultaneously, as the support plate descends with the slope change, the pop-out mechanism, under the height limit of the turntable and the fixed plate, lifts the cooled integrated circuit semiconductor tray, thus facilitating subsequent retrieval and use. Attached Figure Description

[0017] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used together with the embodiments of the invention to explain the invention, but do not constitute a limitation thereof. In the drawings: Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the overall front internal structure of the present invention; Figure 3 For the present invention Figure 2 Enlarged structural diagram at point A in the middle; Figure 4 This is a schematic diagram of the closed plate structure of the present invention; Figure 5 For the present invention Figure 2 Enlarged structural diagram at point B; Figure 6 This is a schematic diagram of the internal structure of the elastic mechanism of the present invention from the front. Figure 7 This is a schematic diagram of the structure of the lifting plate of the present invention; Figure 8 This is a schematic diagram of the internal structure of the drive mechanism of the present invention from the front.

[0018] In the attached diagram: 1. Body; 2. Partition; 3. Sealing mechanism; 31. First motor; 32. Drive rod; 33. Sealing plate; 4. Bearing plate; 5. Elastic mechanism; 51. Sleeve; 52. Extrusion rod; 53. Connecting plate; 54. Roller; 55. First compression spring; 6. Pop-out mechanism; 61. Top plate; 62. Extrusion plate; 63. Connecting rod; 64. Fixing plate; 65. Second compression spring; 7. Turntable; 8. Drive mechanism; 81. Base; 82. Gear ring; 83. Second motor; 84. Gear; 9. Blowering mechanism; 91. Cooler; 92. Fan; 93. Circulation pipe; 10. Lifting plate; 11. Sealing ring; 12. Observation window. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] This invention provides, for example Figure 1-8 The integrated circuit semiconductor processing cooling device shown includes a body 1, a partition 2, a sealing mechanism 3, a support plate 4, an elastic mechanism 5, an ejection mechanism 6, a turntable 7, and a lifting plate 10. The partition 2 is fixedly installed on the inner wall of the body 1. Symmetrical slots for placing the support plate 4 are provided on the partition 2. A sealing mechanism 3 is provided on the partition 2 to adjust the opening and closing of the slots. An elastic mechanism 5 is provided on the partition 2 to connect the support plate 4. An ejection mechanism 6 for ejecting trays containing integrated circuit semiconductor materials is provided inside the support plate 4. The turntable 7 is rotatably disposed inside the body 1. A lifting plate 10 for adjusting the height of the support plate 4 is fixedly installed at the top of the turntable 7. A drive mechanism 8 for driving the turntable 7 to rotate is provided at the bottom of the inner wall of the body 1. A blower mechanism 9 is disposed on the body 1 and is used to circulate cooling gas. Mechanism 8 drives the lifting plate 10 to rotate, which can adjust the two support plates 4 to rise and fall. The closing mechanism 3 seals the through slot at the lowered position in advance. This allows one support plate 4 to be gas-cooled inside the machine body 1 while the other support plate 4 is loaded and unloaded outside. It also isolates the cooling area from the external environment, thereby reducing cooling gas leakage, avoiding frequent start-up and shutdown of the cooling system, shortening waiting time, and improving the continuity and production efficiency of batch processing. When the lifting plate 10 rotates, its gradual slope guides the support plate 4 on the elastic mechanism 5 to adjust its horizontal height. At the same time, when the support plate 4 descends with the slope, the pop-out mechanism 6 will lift the cooled integrated circuit semiconductor tray under the height limit of the turntable 7 and the fixed plate 64, so as to facilitate subsequent handling and use.

[0021] Specifically, the sealing mechanism 3 includes a first motor 31, a drive rod 32, and a sealing plate 33. The first motor 31 is fixedly installed at the bottom end of the partition 2, and its output end is connected to the drive rod 32. The drive rod 32 is rotatably inserted into the partition 2. The sealing plate 33 is fixedly inserted into the drive rod 32. The sealing plate 33 has an exposure groove for exposing the bearing plate 4. The size of the exposure groove is slightly larger than that of the through groove, so as to fully expose the bearing plate 4 inside the through groove. This facilitates the subsequent cooling treatment of the integrated circuit semiconductor tray inside the bearing plate 4 by the blower mechanism 9. The first motor 31 is installed through the outer wall of the machine body 1. The controller is electrically connected to an external power source. The first motor 31 drives the closed plate 33 on the drive rod 32 to rotate. When the closed plate 33 rotates a certain angle, such as 90°, the exposed slot deviates from the through slot position. The closed plate 33 body blocks both through slots, realizing the isolation of the cooling area from the external environment. After the cooled carrier plate 4 and the new carrier plate 4 to be cooled are adjusted to their positions, the exposed slot can be connected to the through slot of the position to be cooled by rotation, and the cooling operation can continue. It effectively prevents the leakage of cooling gas. The structure is compact, the response is fast, and no additional manual operation is required during adjustment, which improves the degree of automation.

[0022] Specifically, the elastic mechanism 5 includes a sleeve 51, a pressing rod 52, a connecting plate 53, a roller 54, and a first compression spring 55. The sleeve 51 is symmetrically fixedly installed on the top of the partition plate 2. The pressing rod 52 is slidably inserted into the inner cavity of the sleeve 51, and the cross-section of the pressing rod 52 is T-shaped. The connecting plate 53 is fixedly connected to the outer wall of the pressing rod 52, and the bearing plate 4 is fixedly connected to the top of the connecting plate 53. A groove is provided at the bottom of the connecting plate 53, and the roller 54 is rotatably disposed inside the groove, cooperating with the lifting plate 10. One end of the first compression spring 55 is fixedly connected to the pressing rod 52, and the other end of the first compression spring 55 is fixedly connected to the top of the inner wall of the sleeve 51. With the ends abutting each other, the first compression spring 55 always provides a stable elastic force to the bearing plate 4 on the connecting plate 53 through the extrusion rod 52, so that the roller 54 can be closely attached to the turntable 7. When the lifting plate 10 rotates to the position of the roller 54 as shown in the figure, the roller 54 can drive the bearing plate 4 to move back and forth in the vertical direction according to the change of slope, which facilitates the switching of the positions of the two bearing plates 4. Thus, while one bearing plate 4 is gas-cooled inside the machine body 1, the other bearing plate 4 is loaded and unloaded outside, avoiding frequent start and stop of the cooling system, shortening the waiting time, improving the continuity of batch processing and production efficiency, and making it easy to use.

[0023] Specifically, the ejection mechanism 6 includes a top plate 61, a pressing plate 62, a connecting rod 63, a fixing plate 64, and a second compression spring 65. The top plate 61 is slidably disposed inside the bearing plate 4; the pressing plate 62 is symmetrically disposed below the bearing plate 4; one end of the connecting rod 63 is fixedly connected to the top plate 61, and the other end of the connecting rod 63 is fixedly connected to the pressing plate 62; the fixing plate 64 is fixedly connected to the bottom end of the inner wall of the machine body 1, and the fixing plate 64 cooperates with the pressing plate 62. The height of the fixing plate 64 is the same as the horizontal height of the turntable 7, so that when the bearing plate 4 descends, the pressing plate 62 can simultaneously contact the turntable 7 and the fixing plate 64, thereby extruding and lifting the cooled material tray; the second compression spring 65 is sleeved on the connecting rod. Externally, one end of the second compression spring 65 is fixedly connected to the extrusion plate 62, and the other end of the second compression spring 65 abuts against the partition plate 2. When the lifting plate 10 rotates with the turntable 7, the height of the bearing plate 4 can be adjusted by its own slope change. When the bearing plate 4 descends to the lowest point, that is, when the roller 54 is in contact with the top of the turntable 7, the extrusion plate 62 will overcome the elastic force of the second compression spring 65 under the limit of the turntable 7 and the fixed plate 64, thereby pushing out the top plate 61 located at the bottom of the bearing plate 4 and lifting the integrated circuit semiconductor tray placed inside the bearing plate 4, thereby taking out the cooled integrated circuit semiconductor tray and replacing it with a new integrated circuit semiconductor tray to be cooled for the next switch.

[0024] Specifically, the drive mechanism 8 includes a base 81, a gear ring 82, a second motor 83, and a gear 84. The base 81 is fixedly installed on the bottom of the inner wall of the machine body 1, and the turntable 7 is rotatably mounted on the base 81 via bearings. The gear ring 82 is fixedly sleeved on the outside of the turntable 7. The second motor 83 is fixedly installed inside the base 81. The output end of the second motor 83 is connected to the gear 84, and the gear 84 meshes with the gear ring 82. The second motor 83 is electrically connected to an external power supply via a controller outside the machine body 1, and the second motor 83 can drive the gear 84 to rotate. The turntable 7 can be rotated by the gear ring 82, thus achieving stable and controllable rotation of the turntable 7. This facilitates the periodic switching of the bearing plate 4 in coordination with the gradual slope of the lifting plate 10. The gear 84 meshes with the gear ring 82 for transmission. Compared with belt or chain transmission, it has higher transmission accuracy and positioning repeatability, ensuring that the turntable 7 rotates at the same angle each time. This allows the slope of the lifting plate 10 to accurately match the roller 54. At the same time, the gear 84 transmission has strong impact resistance and is suitable for periodic working modes with frequent start-stop and forward / reverse rotation. It is stable and reliable in long-term operation and reduces maintenance costs.

[0025] Specifically, the blower mechanism 9 includes a cooler 91, a fan 92, and a circulation pipe 93. The cooler 91 is fixedly installed at the top of the body 1; the fan 92 is fixedly installed at the top of the inner wall of the body 1; one end of the circulation pipe 93 is fixedly connected to the body 1, and the other end of the circulation pipe 93 is fixedly connected to the output end of the cooler 91. The cooler 91, fixed at the top of the body 1, generates cooling gas. The fan 92, installed at the top of the inner wall of the body 1, has a built-in filter screen to facilitate the filtration of the cooling gas and blow it downwards into the cooling chamber. One end of the circulation pipe 93 is connected to the body 1, and the other end is connected to the output end of the cooler 91, forming a gas circulation loop. This allows the cooling gas to continuously circulate within the chamber. The active air-cooling circulation can quickly remove heat from the surface of the wafer or chip, resulting in uniform and efficient cooling. Gas recycling reduces the consumption of cooling media and lowers operating costs. The cooler 91 and fan 92 work together to achieve precise temperature control, meeting the cooling temperature requirements of different processes.

[0026] Furthermore, a sealing ring 11 is fixedly sleeved on the outer wall of the support plate 4, and a sealing groove communicating with the through groove is opened at the bottom end of the partition plate 2. The sealing ring 11 and the sealing groove cooperate with each other. When the support plate 4 rises to the cooling position, the sealing ring 11 is embedded in the sealing groove to form a combination seal of radial and axial forces. This effectively prevents cooling gas from leaking out from the gap of the through groove, ensuring the stability of the cooling environment of the material tray of the support plate 4, avoiding the loss of cold air and the failure of temperature control. At the same time, the annular sealing structure can reduce the excessive wear of the sealing ring 11 due to unilateral force, extend its service life, and reduce the requirements for the lifting accuracy of the support plate 4. It is only necessary to ensure that the seal is achieved, thereby improving the long-term operational reliability of the equipment.

[0027] Furthermore, an observation window 12 is embedded in the outer wall of the machine body 1. The observation window 12 is made of transparent material, allowing operators to directly observe the position of the bearing plate 4, the material tray, and whether the closing mechanism 3 is in place without opening the machine body 1. This enables timely detection of abnormalities such as jamming or offset, facilitating operation. The bottom of the machine body 1 is sealed by a cabinet door that can be opened and closed, facilitating regular maintenance of internal components by operators, such as cleaning debris from the turntable 7 and the lifting plate 10, and replacing worn parts, thereby improving the maintainability of the equipment.

[0028] How to use this invention: The integrated circuit semiconductor tray to be cooled is placed inside one of the carrier plates 4. At this time, the carrier plate 4 is in a raised state under the influence of the lifting plate 10 and is located inside the machine body 1. The sealing is achieved by the sealing ring 11 cooperating with the sealing groove. The blower mechanism 9 is started, the cooler 91 generates cooling gas, and the fan 92 blows the cooling gas downward. A circulating airflow is formed through the circulation pipe 93 to cool the tray on the carrier plate 4 in the raised state. After the internal tray has cooled down, the first motor 31 is started by the controller outside the machine body 1. The first motor 31 drives the drive rod 32 to rotate, so that the sealing plate 33 rotates to the position where the exposed groove is deviated from the through groove. The sealing plate 33 blocks the through groove where the bearing plate 4 is located on the partition plate 2, isolating the cooling area from the external environment and preventing the cooling gas from leaking out during the descent process. Then, the second motor 83 is started by the controller. The second motor 83 drives the gear 84 to rotate. The gear 84 drives the turntable 7 to rotate through the gear ring 82. The turntable 7 drives the lifting plate 10 to rotate. The gradual slope of the lifting plate 10 pushes the roller 54, so that the elastic mechanism 5 drives the bearing plate 4 to move vertically. The bearing plate 4, which has been cooled, gradually descends from the raised state to the bottom of the machine body 1. At the same time, another bearing plate 4 gradually rises and enters the top cooling position of the machine body 1. When the cooled carrier plate 4 is lowered to the lowest point, the extrusion plate 62 of the ejection mechanism 6 contacts the fixed plate 64 and the turntable 7 and is lifted. The extrusion plate 62 overcomes the elastic force of the second compression spring 65 and pushes the top plate 61 upward through the connecting rod 63 to lift the cooled integrated circuit semiconductor tray. After the operator removes the cooled tray, a new integrated circuit semiconductor tray to be cooled is placed in the carrier plate 4. The controller restarts the first motor 31, driving the closed plate 33 to rotate so that the exposed slot is aligned with the slot of the other support plate 4 that has been raised into the machine body 1, exposing the support plate 4 to receive the cooling airflow. The blower mechanism 9 is then activated to cool the tray on the newly raised support plate 4. This cycle is repeated to achieve continuous batch processing.

[0029] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A cooling device for integrated circuit semiconductor processing, characterized in that, include: The body (1) has a partition (2) fixedly installed on its inner wall; The support plate (4) has symmetrical through slots for placing the support plate (4) on the partition plate (2), the partition plate (2) is provided with a closing mechanism (3) for adjusting the opening and closing of the through slots, the partition plate (2) is provided with an elastic mechanism (5) for connecting the support plate (4), and the support plate (4) is provided with an ejection mechanism (6) for ejecting the integrated circuit semiconductor tray inside the support plate (4). Turntable (7), the turntable (7) is rotatably disposed inside the body (1), the top of the turntable (7) is fixedly installed with a lifting plate (10) for adjusting the height of the bearing plate (4), and the bottom of the inner wall of the body (1) is provided with a driving mechanism (8) for driving the turntable (7) to rotate. A blower mechanism (9) is disposed on the body (1) and is used to circulate cooling gas.

2. The integrated circuit semiconductor processing cooling apparatus according to claim 1, characterized in that, The closing mechanism (3) includes: The first motor (31) is fixedly installed at the bottom end of the partition (2); The drive rod (32) is connected to the output end of the first motor (31) in a transmission connection, and the drive rod (32) is rotatably interlocked with the partition (2); The sealing plate (33) is fixedly inserted and connected to the drive rod (32), and the sealing plate (33) has an exposure groove for exposing the bearing plate (4).

3. The integrated circuit semiconductor processing cooling apparatus according to claim 2, characterized in that, The elastic mechanism (5) includes: Sleeve (51), the sleeve (51) is symmetrically fixedly installed on the top of the partition (2); The extrusion rod (52) is slidably inserted into the inner cavity of the sleeve (51), and the cross section of the extrusion rod (52) is T-shaped. A connecting plate (53) is fixedly connected to the outer wall of the extrusion rod (52), and a bearing plate (4) is fixedly connected to the top of the connecting plate (53); The roller (54) has a groove at the bottom end of the connecting plate (53), and the roller (54) is rotatably disposed inside the groove. The roller (54) cooperates with the lifting plate (10). The first compression spring (55) has one end fixedly connected to the extrusion rod (52) and the other end abuts against the top of the inner wall of the sleeve (51).

4. The integrated circuit semiconductor processing cooling apparatus according to claim 3, characterized in that, The pop-out mechanism (6) includes: Top plate (61), which is slidably disposed inside the support plate (4); An extrusion plate (62) is symmetrically arranged below the support plate (4); A connecting rod (63) is fixedly connected at one end to the top plate (61) and at the other end to the extrusion plate (62); A fixing plate (64) is fixedly connected to the bottom end of the inner wall of the machine body (1), and the fixing plate (64) cooperates with the extrusion plate (62); The second compression spring (65) is sleeved on the outside of the connecting rod (63).

5. The integrated circuit semiconductor processing cooling apparatus according to claim 4, characterized in that, One end of the second compression spring (65) is fixedly connected to the extrusion plate (62), and the other end of the second compression spring (65) abuts against the partition plate (2).

6. The integrated circuit semiconductor processing cooling apparatus according to claim 5, characterized in that, The drive mechanism (8) includes: The base (81) is fixedly installed on the bottom end of the inner wall of the machine body (1), and the turntable (7) is rotatably mounted on the base (81) through a bearing; Gear ring (82), gear ring (82) is fixedly sleeved on the outside of turntable (7); The second motor (83) is fixedly installed inside the base (81); The gear (84) is connected to the output end of the second motor (83) via a transmission, and the gear (84) meshes with the gear ring (82).

7. The integrated circuit semiconductor processing cooling apparatus according to claim 6, characterized in that, The blower mechanism (9) includes: A cooler (91) is fixedly installed on the top of the body (1); Fan (92), the fan (92) is fixedly installed on the top of the inner wall of the body (1); A circulation pipe (93) is fixedly inserted and connected at one end to the body (1), and at the other end to the output end of the cooler (91).

8. The integrated circuit semiconductor processing cooling apparatus according to claim 7, characterized in that, The outer wall of the bearing plate (4) is fixedly fitted with a sealing ring (11), and the bottom end of the partition plate (2) is provided with a sealing groove that communicates with the through groove. The sealing ring (11) and the sealing groove cooperate with each other.

9. The integrated circuit semiconductor processing cooling apparatus according to claim 8, characterized in that, The outer wall of the body (1) is provided with an observation window (12), which is made of transparent material.

10. A method of using a cooling device for integrated circuit semiconductor processing, characterized in that, The method of using the integrated circuit semiconductor processing cooling device includes the integrated circuit semiconductor processing cooling device as described in any one of claims 1-9, specifically comprising the following steps: Step 1: Place the integrated circuit semiconductor tray to be cooled inside one of the carrier plates (4). At this time, the carrier plate (4) is in a raised state under the influence of the lifting plate (10) and is located inside the machine body (1). The sealing is achieved by the sealing ring (11) cooperating with the sealing groove. Start the blower mechanism (9), the cooler (91) generates cooling gas, and the fan (92) blows the cooling gas downward. The circulating airflow is formed through the circulation pipe (93) to cool the tray on the carrier plate (4) in the raised state. Step 2: After the internal material tray has cooled down, the first motor (31) is started by the controller outside the machine body (1). The first motor (31) drives the drive rod (32) to rotate, so that the sealing plate (33) rotates to the position of the exposed groove deviating from the through groove. The sealing plate (33) blocks the through groove where the bearing plate (4) is located on the partition plate (2), isolating the cooling area from the external environment and preventing the cooling gas from leaking out during the descent process. Step 3: Then start the second motor (83) through the controller. The second motor (83) drives the gear (84) to rotate. The gear (84) drives the turntable (7) to rotate through the gear ring (82). The turntable (7) drives the lifting plate (10) to rotate. The gradual slope of the lifting plate (10) pushes the roller (54) so ​​that the elastic mechanism (5) drives the bearing plate (4) to move vertically. The bearing plate (4) that has been cooled gradually descends from the raised state to the bottom of the machine body (1). At the same time, another bearing plate (4) gradually rises and enters the top cooling position of the machine body (1). Step 4: When the cooled carrier plate (4) is lowered to the lowest point, the extrusion plate (62) of the ejection mechanism (6) contacts the fixed plate (64) and the turntable (7) and is lifted. The extrusion plate (62) overcomes the elastic force of the second compression spring (65) and pushes the top plate (61) upward through the connecting rod (63) to lift the cooled integrated circuit semiconductor tray. After the operator takes away the cooled tray, the new integrated circuit semiconductor tray to be cooled is placed in the carrier plate (4). Step 5: Restart the first motor (31) through the controller to drive the closed plate (33) to rotate so that the exposed slot is aligned with the slot of the other support plate (4) that has been raised into the machine body (1), so that the support plate (4) is exposed to receive the cooling airflow. Start the blower mechanism (9) to cool the tray on the newly raised support plate (4). Repeat this cycle to achieve continuous batch processing.

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