Circuit board assembly, manufacturing method and electronic device

Abstract

The application relates to the technical field of electronic equipment, in particular to a circuit board assembly, a manufacturing method and electronic equipment. The circuit board assembly comprises a first circuit board and a second circuit board which are arranged in a first direction and are spaced apart; wherein the first circuit board has a first surface facing away from the second circuit board and a second surface facing the second circuit board, one of the first surface and the second surface is provided with a heat generating device; the second circuit board has a third surface facing the first circuit board; the circuit board assembly further comprises a first frame plate arranged between the first circuit board and the second circuit board, the first frame plate has a first end and a second end which are opposite to each other in the first direction, the first end is connected with the second surface, and the second end is in heat conduction connection with the third surface; the first frame plate is provided with a first through hole penetrating through the first frame plate in the first direction, and the first through hole is filled with a heat conductive material. In the above manner, the temperature around the heat generating device can be reduced, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and in particular to a circuit board assembly, manufacturing method, and electronic equipment. Background Technology

[0002] With the development of electronic device technology, mobile phones, tablets, smartwatches, and other electronic devices have become indispensable items in people's daily work and life. Taking a mobile phone as an example, a mobile phone includes a battery, motherboard, display assembly, and casing. The battery, motherboard, and display assembly are housed in the casing. The motherboard includes a circuit board and electronic components mounted on the circuit board. Electronic components include, but are not limited to, a processor, antenna module, Bluetooth module, power supply, charging module, and display / operation module. For example, the display assembly needs to be electrically connected to the display and operation module on the motherboard so that the display assembly can perform display or operation functions.

[0003] As mobile phones need to perform more and more functions, the number of electronic components on the circuit board is also increasing, which in turn places higher demands on the motherboard's heat dissipation performance. Improving the motherboard's heat dissipation efficiency has become crucial for enhancing the performance of electronic devices. Summary of the Invention

[0004] This application provides a circuit board assembly, a manufacturing method, and an electronic device. The following describes this application from multiple aspects, and the implementation methods and beneficial effects of these aspects can be referred to each other.

[0005] In a first aspect, embodiments of this application provide a circuit board assembly, including a first circuit board and a second circuit board stacked and spaced apart along a first direction; wherein, the first circuit board has a first surface facing away from the second circuit board and a second surface facing the second circuit board, and a heating device is disposed on one of the first surface and the second surface; the second circuit board has a third surface facing the first circuit board; the circuit board assembly further includes a first frame plate disposed between the first circuit board and the second circuit board, the first frame plate having a first end and a second end facing away from each other along the first direction, the first end being connected to the second surface, and the second end being thermally connected to the third surface; a first through hole is disposed in the first frame plate along the first direction, and the first through hole is filled with a thermally conductive material.

[0006] The circuit board assembly provided in this application embodiment includes a first frame plate disposed between a first circuit board and a second circuit board. A first end of the first frame plate is connected to a second surface, and a second end is thermally connected to a third surface. Because the first frame plate has a first through-hole extending along a first direction and filled with a thermally conductive material, it can transfer heat generated by the heat-generating device to the second circuit board while providing support for the first circuit board. This heat transfer to the second circuit board helps to disperse the heat generated by the heat-generating device to a certain extent. Furthermore, the second circuit board can transfer heat to the middle frame, increasing the heat dissipation channels for the heat-generating device, thereby improving its heat dissipation efficiency and preventing heat accumulation inside or around the device. This improves the reliability of the heat-generating device and reduces its power consumption. Simultaneously, the above heat dissipation method is based on the frame plate and does not require additional heat dissipation components. Therefore, it does not occupy additional circuit board area, thus improving space utilization in the circuit board assembly and reducing the space occupied by the assembly, meeting the requirements for thinner and lighter electronic devices. Moreover, since no additional heat dissipation components are added, there is no significant increase in cost.

[0007] In some alternative embodiments, the heating element is disposed on the first surface, and the orthographic projection of the first frame plate on the first plane at least partially coincides with the orthographic projection of the heating element on the first plane; wherein the first plane is perpendicular to the first direction.

[0008] In some alternative embodiments, a first pad is provided at the first end, and a second pad is provided on the second surface, and the first pad and the second pad are welded together; or, a third pad is provided at the second end, and a fourth pad is provided on the third surface, and the third pad and the fourth pad are welded together.

[0009] In some alternative embodiments, a first electronic device is disposed on the third surface, and thermally conductive adhesive is disposed on the first electronic device, with the second end bonded to the thermally conductive adhesive.

[0010] In some alternative embodiments, the circuit board assembly further includes a first shielding cover disposed on a first surface, and the first shielding cover and the first surface together form a first receiving cavity, in which the heating device is located.

[0011] In some alternative embodiments, the first receiving cavity is filled with thermally conductive adhesive.

[0012] In some optional embodiments, a dam is also provided on the first surface; the dam and the first surface together form a second receiving cavity, the heating device is located in the second receiving cavity, and the second receiving cavity is filled with thermally conductive adhesive.

[0013] In some alternative embodiments, the distance between the dam and the heating device is 0.5mm-3mm.

[0014] In some optional embodiments, the circuit board assembly further includes: a second frame plate, one end of which is connected to a second surface along a first direction, and the other end of which is connected to a third surface along the first direction; the second frame plate, the first circuit board, and the second circuit board together form a third receiving cavity, and the first frame plate is disposed within the third receiving cavity.

[0015] In some alternative embodiments, the third receiving cavity is filled with a peelable thermally conductive gel.

[0016] In some alternative embodiments, the second circuit board has a fourth surface facing away from the first circuit board; the circuit board assembly also includes a second shield disposed on the fourth surface, and the second shield and the fourth surface together form a fourth receiving cavity, which is filled with thermally conductive gel.

[0017] In some optional embodiments, the peel strength of the thermally conductive gel is less than 10 PSI / mm. 2 .

[0018] In some optional embodiments, the first frame plate has a fifth surface located at one end of the second direction, and a metal heat-conducting layer is disposed on the fifth surface; the second direction is perpendicular to the first direction; the second frame plate has a sixth surface located at one end of the second direction, and a metal heat-conducting layer is disposed on the sixth surface.

[0019] In some optional embodiments, a metal thermally conductive layer is provided on the second surface, and the metal thermally conductive layer on the second surface is connected to the metal thermally conductive layer on the fifth surface; and / or, a metal thermally conductive layer is provided on the third surface, and the metal thermally conductive layer on the third surface is connected to the metal thermally conductive layer on the fifth surface.

[0020] In some optional embodiments, the first frame plate includes a first sub-frame plate and a second sub-frame plate stacked along a first direction, the second sub-frame plate being located between the first sub-frame plate and the second circuit board; the first sub-frame plate is provided with a plurality of first sub-through holes along the first direction, and the second sub-frame plate is provided with a plurality of second sub-through holes along the first direction, the plurality of first sub-through holes and the plurality of second sub-through holes corresponding one to one; a heat dissipation perforation plate is provided between the first sub-frame plate and the second sub-frame plate, the heat dissipation perforation plate is provided with a plurality of through holes, and the corresponding first sub-through holes and second sub-through holes are connected through a through hole, the heat dissipation perforation plate being connected to a metal thermally conductive layer on the fifth surface.

[0021] In some optional embodiments, the second frame plate is provided with a plurality of second through holes along the first direction, and the second circuit board is provided with a plurality of third through holes along the first direction; the circuit board assembly further includes: a third circuit board, which is stacked and spaced apart from the second circuit board along the first direction, and the second circuit board is located between the first circuit board and the third circuit board; a third frame plate, one end of which is connected to the second circuit board along the first direction, and the other end of which is connected to the third circuit board along the first direction; the third frame plate is provided with a plurality of fourth through holes along the first direction; wherein, some of the second through holes, the third through holes, and the fourth through holes are interconnected to form a fifth through hole, and the fifth through hole is filled with a thermally conductive material.

[0022] In some optional embodiments, the third frame plate, the second circuit board, and the third circuit board together form a fifth receiving cavity; the third circuit board is provided with a first guide port that penetrates the third circuit board, and the second circuit board is provided with a second guide port that connects the third receiving cavity and the fifth receiving cavity.

[0023] In some optional embodiments, the third frame plate, the second circuit board, and the third circuit board together form a fifth receiving cavity; the second frame plate is provided with a first adhesive guiding channel along a first direction and a second adhesive guiding channel along a second direction, the second adhesive guiding channel connecting the first adhesive guiding channel and the third receiving cavity, the second direction being perpendicular to the first direction; the third frame plate is provided with a third adhesive guiding channel along the first direction and a fourth adhesive guiding channel along the second direction, the fourth adhesive guiding channel connecting the third adhesive guiding channel and the fifth receiving cavity; the second circuit board is provided with a fifth adhesive guiding channel along the first direction, the fifth adhesive guiding channel connecting a portion of the first adhesive guiding channel and a portion of the third adhesive guiding channel.

[0024] In some alternative embodiments, the circuit board assembly further includes a fourth circuit board disposed in the third receiving cavity, the fourth circuit board being stacked and spaced apart from the first and second circuit boards along a first direction; one side of the fourth circuit board along a second direction is connected to the surface of the first frame plate along the second direction.

[0025] In some alternative embodiments, the thermally conductive material is electrically conductive.

[0026] Secondly, embodiments of this application provide a method for manufacturing a frame plate, comprising: obtaining a first plate and a second plate; connecting the first plate and the second plate along a first direction through a heat dissipation perforation plate to obtain a first plate connection structure; forming a first through hole in the first plate connection structure; the first through hole penetrating the first plate, the heat dissipation perforation plate and the second plate along the first direction; and filling the first through hole with a thermally conductive material.

[0027] In this embodiment, a first plate and a second plate are connected by a heat dissipation perforated plate to form a first plate connection structure. A first through hole is formed in the first plate connection structure, and a thermally conductive material is filled into the first through hole to obtain a frame plate with high thermal conductivity. This frame plate with high thermal conductivity can quickly transfer heat, thereby accelerating heat dissipation and improving heat dissipation efficiency.

[0028] In some optional embodiments, the heat dissipation pad includes a fifth pad and a sixth pad; connecting the first plate and the second plate along a first direction via the heat dissipation pad includes: providing a fifth pad on the surface of the first plate at one end along the first direction, and providing a sixth pad on the surface of the second plate at one end along the first direction; soldering the fifth pad and the sixth pad to connect the first plate and the second plate along the first direction via the heat dissipation pad.

[0029] In some optional embodiments, the manufacturing method further includes: forming a first pad and a third pad on two opposite surfaces of the first plate connection structure along a first direction; forming a metal thermally conductive layer on a fifth surface of the first plate connection structure located at one end in a second direction, wherein the first pad and the third pad are both connected to the metal thermally conductive layer on the fifth surface; wherein the second direction is perpendicular to the first direction.

[0030] Thirdly, embodiments of this application provide a method for manufacturing a frame plate, comprising: obtaining a first plate and a second plate; forming a first sub-through hole in the first plate along a first direction to obtain a first sub-frame plate; forming a second sub-through hole in the second plate along the first direction to obtain a second sub-frame plate; filling the first sub-through hole and the second sub-through hole with thermally conductive material respectively; connecting the first sub-frame plate and the second sub-frame plate along the first direction through a heat dissipation perforated plate; wherein the heat dissipation perforated plate is provided with a through hole, and the first sub-through hole, the through hole and the second sub-through hole are aligned along the first direction to form a first through hole.

[0031] In this embodiment, a frame plate with high thermal conductivity is obtained by forming a first sub-through hole in a first plate along a first direction and a second sub-through hole in a second plate along the first direction, respectively, and filling the first and second sub-frame plates with thermally conductive material. Then, the first and second sub-frame plates are connected along the first direction using a heat dissipation perforated plate. This method, by separately fabricating the first and second sub-frame plates, facilitates the filling of thermally conductive material in both plates and improves the aperture ratio of the final frame plate. The high thermal conductivity frame plate obtained through this method can quickly transfer heat, thereby accelerating heat dissipation and improving heat dissipation efficiency.

[0032] Fourthly, embodiments of this application provide a method for manufacturing a circuit board assembly, comprising: obtaining a first frame board, the first frame board being manufactured by a method for manufacturing a frame board provided in the second or third aspect, the first frame board having a first end and a second end opposite to each other along a first direction; obtaining a first circuit board, the first circuit board having a first surface and a second surface opposite to each other along the first direction, a heating device being disposed on the first surface; obtaining a second circuit board, the second circuit board including a third surface located at one end in the first direction; connecting the first end of the first frame board to the second surface, and thermally connecting the second end of the first frame board to the third surface.

[0033] In this embodiment, a first frame plate is provided between the first circuit board and the second circuit board. Since the first frame plate has a first through-hole extending along a first direction and filled with a thermally conductive material, it provides support for the first circuit board while simultaneously transferring heat generated by the heat-generating device to the second circuit board. This heat transfer to the second circuit board disperses the heat generated by the heat-generating device to some extent, and the second circuit board can also transfer heat to the middle frame, increasing the heat dissipation channels for the heat-generating device. This improves the heat dissipation efficiency of the heat-generating device, prevents heat accumulation inside or around it, and enhances its reliability and reduces its power consumption. Furthermore, this heat dissipation method is based on the frame plate and does not require additional heat dissipation components, thus avoiding additional space occupation on the circuit board. This improves the space utilization of the circuit board assembly, reduces the space occupied by the assembly, and meets the requirements for thinner and lighter electronic devices. Moreover, since no additional heat dissipation components are added, there is no significant increase in cost.

[0034] Fifthly, embodiments of this application provide a method for manufacturing a circuit board assembly, comprising: obtaining a third board, a fourth board, and a fifth board; wherein the fifth board has a third surface and a fourth surface opposite to each other along a first direction; disposing the third board on the third surface and disposing the fourth board on the fourth surface; forming a plurality of fifth through holes in the third board that sequentially penetrate the third board, the fifth board, and the fourth board along the first direction; and filling the fifth through holes with a thermally conductive material.

[0035] In this embodiment, by placing a third substrate on a third surface and a fourth substrate on a fourth surface, and then forming a plurality of fifth through holes that sequentially penetrate the third, fifth, and fourth substrates along a first direction in the third substrate, and filling the fifth through holes with thermally conductive material, an integrated heat dissipation circuit board assembly can be obtained. In this circuit board assembly, the thermally conductive material filled in the fifth through holes can quickly transfer heat from one end of the fifth through hole to the other end, thereby accelerating heat transfer and improving the heat dissipation efficiency of the circuit board assembly.

[0036] In some optional embodiments, the manufacturing method further includes: forming a first groove in a third plate, the opening direction of the first groove facing away from the fifth plate and exposing a first region of the third surface; and forming a second groove in a fourth plate, the opening direction of the second groove facing away from the fifth plate and exposing a second region of the fourth surface.

[0037] In some optional embodiments, the manufacturing method further includes: forming a second adhesive guide opening through the fifth plate on the fifth plate, the second adhesive guide opening communicating with the first groove and the second groove; stacking a sixth plate on the fourth plate, the sixth plate covering the opening of the second groove; forming a first adhesive guide opening through the sixth plate on the sixth plate, the first adhesive guide opening communicating with the second groove.

[0038] In some optional embodiments, the manufacturing method further includes: forming a first adhesive channel extending in a first direction in a third plate, forming a third adhesive channel extending in the first direction in a fourth plate, and forming a fifth adhesive channel extending in the first direction on a fifth plate, wherein the first adhesive channel, the fifth adhesive channel, and the third adhesive channel are sequentially connected; forming a second adhesive channel extending in a second direction in the third plate, and forming a fourth adhesive channel extending in the second direction in the fourth plate; wherein the second adhesive channel connects the first adhesive channel and the first groove, and the fourth adhesive channel connects the third adhesive channel and the second groove; the second direction is perpendicular to the first direction.

[0039] In a sixth aspect, embodiments of this application provide an electronic device, including: a housing; and a circuit board assembly, wherein the circuit board assembly is the same as the circuit board assembly provided in the first aspect, and the circuit board assembly is disposed within the housing.

[0040] The beneficial effects achievable in the sixth aspect can be referred to the beneficial effects of the circuit board assembly provided in any embodiment of the first aspect, and will not be repeated here. Attached Figure Description

[0041] Figure 1A This is a schematic diagram of an application scenario provided by an embodiment of this application;

[0042] Figure 1B This is a schematic diagram illustrating another application scenario provided by an embodiment of this application;

[0043] Figure 2A This is a schematic diagram of the structure of a circuit board assembly in a candybar mobile phone, provided in an embodiment of this application.

[0044] Figure 2B This is a schematic diagram of the structure of a circuit board assembly in a double-folding mobile phone, provided in an embodiment of this application.

[0045] Figure 2C This is a schematic diagram of the structure of a circuit board assembly in a tri-fold mobile phone, provided in an embodiment of this application.

[0046] Figure 2D This is a schematic diagram of the circuit board assembly in another tri-fold mobile phone provided in an embodiment of this application;

[0047] Figure 2E This is a schematic diagram of the circuit board assembly in a four-fold mobile phone provided in an embodiment of this application;

[0048] Figure 3A This is a schematic diagram of the structure of a circuit board assembly;

[0049] Figure 3B This application provides a schematic diagram of the structure of a frame board on a circuit board.

[0050] Figure 3C A schematic diagram of the structural area of ​​another frame board on a circuit board provided in an embodiment of this application;

[0051] Figure 3D This is a structural schematic diagram of a frame plate;

[0052] Figure 3E A schematic diagram of the structure of a first circuit board, a second circuit board, and a third circuit board provided in an embodiment of this application;

[0053] Figure 4A This is a schematic diagram of the structure of a circuit board assembly provided in an embodiment of this application;

[0054] Figure 4B A schematic diagram of the structure connecting a first frame plate, a first circuit board, and a second circuit board is provided in an embodiment of this application.

[0055] Figure 4C This is a schematic diagram of the structure of a first frame plate provided in an embodiment of this application;

[0056] Figure 4D This is a schematic diagram of the structure of a first frame plate model provided in an embodiment of this application;

[0057] Figure 4E This is a schematic diagram of a first frame plate cross-section structure provided in an embodiment of this application;

[0058] Figure 4F This is a schematic diagram of another circuit board assembly provided in an embodiment of this application;

[0059] Figure 4G This is a schematic diagram of the structure of a SOC chip provided in an embodiment of this application;

[0060] Figure 5A This is a schematic diagram of another circuit board assembly provided in an embodiment of this application;

[0061] Figure 5B A schematic diagram of the filling position of a thermally conductive adhesive provided in an embodiment of this application;

[0062] Figure 6A This is a schematic diagram of another circuit board assembly provided in an embodiment of this application;

[0063] Figure 6B This is a schematic diagram illustrating another structural connection between the first frame plate, the first circuit board, and the second circuit board provided in an embodiment of this application.

[0064] Figure 6C This is a schematic diagram of another circuit board assembly provided in an embodiment of this application;

[0065] Figure 7A This is a schematic diagram of another circuit board assembly provided in an embodiment of this application;

[0066] Figure 7B This is a schematic diagram of another circuit board assembly provided in an embodiment of this application;

[0067] Figure 7C This is a schematic diagram of the structure of a first surface provided in an embodiment of this application;

[0068] Figure 7D This is a schematic diagram of the structure of a junction on a second surface provided in an embodiment of this application;

[0069] Figure 7E This is a schematic diagram of the structure of a third surface provided in an embodiment of this application;

[0070] Figure 7F A schematic diagram illustrating another structural connection between the first frame plate, the first circuit board, and the second circuit board provided in an embodiment of this application;

[0071] Figure 7G This is a schematic diagram of the structure of a first frame plate provided in an embodiment of this application;

[0072] Figure 7H This is a schematic diagram of another frame plate provided in an embodiment of this application;

[0073] Figure 8 This is a schematic diagram of another circuit board assembly provided in an embodiment of this application;

[0074] Figure 9A This is a schematic diagram of another circuit board assembly provided in an embodiment of this application;

[0075] Figure 9B A schematic diagram of a combined structure of a second frame, a second circuit board, and a third frame board provided in an embodiment of this application;

[0076] Figure 10A This is a schematic diagram of another circuit board assembly provided in an embodiment of this application;

[0077] Figure 10B A schematic diagram of another combined structure of a second frame board, a second circuit board, and a third frame board provided in an embodiment of this application;

[0078] Figure 10C A schematic diagram of another combined structure of a second frame board, a second circuit board, and a third frame board provided in an embodiment of this application;

[0079] Figure 10D A physical diagram of a circuit board assembly provided for an embodiment of this application;

[0080] Figure 10E This is a photograph of a disassembled cavity provided in an embodiment of this application.

[0081] Figure 10F A schematic diagram of the guide port location is provided for an embodiment of this application;

[0082] Figure 11A This is a schematic diagram of another circuit board assembly provided in an embodiment of this application;

[0083] Figure 11B This is a schematic diagram showing the location of another adhesive guide opening provided in an embodiment of this application;

[0084] Figure 12A A flowchart illustrating a method for manufacturing a frame plate according to an embodiment of this application;

[0085] Figure 12B A schematic diagram of the structure of a first substrate with a fifth pad and a second substrate with a sixth pad provided in an embodiment of this application;

[0086] Figure 12C This is a schematic diagram of a structure for connecting a first plate and a second plate, provided in an embodiment of this application.

[0087] Figure 12D This application provides a schematic diagram of the connection between a first plate and a second plate after the formation of a first through hole, according to an embodiment of the present application.

[0088] Figure 12E This application provides a schematic diagram of the connection between a first plate and a second plate after the first through hole is filled with thermally conductive material.

[0089] Figure 12FThis is a schematic diagram of a high thermal conductivity frame plate provided in an embodiment of this application;

[0090] Figure 13A A schematic flowchart illustrating another method for manufacturing a frame plate provided in an embodiment of this application;

[0091] Figure 13B This is a schematic diagram of another structure of the first and second plates provided in an embodiment of this application;

[0092] Figure 13C A schematic diagram of the structure of a first sub-frame plate and a second sub-frame plate provided in an embodiment of this application;

[0093] Figure 13D A schematic diagram of the structure of a first subframe plate and a second subframe plate filled with thermally conductive material, provided in an embodiment of this application;

[0094] Figure 13E A schematic diagram of the structure after the first sub-frame plate and the second sub-frame plate are connected, provided for an embodiment of this application;

[0095] Figure 13F This is a schematic diagram of a high thermal conductivity frame plate provided in an embodiment of this application;

[0096] Figure 14 A schematic flowchart illustrating a method for manufacturing a circuit board assembly according to an embodiment of this application;

[0097] Figure 15A A schematic diagram of another method for manufacturing a circuit board assembly provided in an embodiment of this application;

[0098] Figure 15B A schematic diagram of the structure of a fifth substrate after printing layerable inks on the third and fourth surfaces, as provided in an embodiment of this application;

[0099] Figure 15C This application provides a schematic diagram of a structure after pressing a third and a fourth plate onto a fifth plate, as an embodiment of the present application.

[0100] Figure 15D This is a schematic diagram of a structure after drilling holes in a sheet metal structure, provided as an embodiment of this application.

[0101] Figure 15E This application provides a schematic diagram of a structure after a removal groove is created in a sheet metal structure, as shown in the embodiments of the present application.

[0102] Figure 15F This is a schematic diagram of the structure after removing excess sheet material, provided in an embodiment of this application.

[0103] Figure 15GThis is a schematic diagram of the structure after filling with thermally conductive material, provided in an embodiment of this application;

[0104] Figure 15H This is a schematic diagram of the structure after removing residual plate material from a through hole, as provided in an embodiment of this application.

[0105] Figure 15I This is a schematic diagram of the structure after filling with thermally conductive material, provided in an embodiment of this application;

[0106] Figure 15J This application provides a schematic diagram of a structure after a removal groove is created in a sheet metal structure, as shown in the embodiments of the present application.

[0107] Figure 15K A schematic diagram of a structure after opening an adhesive guiding channel in a first direction in a plate structure, provided for an embodiment of this application;

[0108] Figure 15L A schematic diagram of a structure after opening a second-direction adhesive guiding channel in a sheet material structure, provided for an embodiment of this application;

[0109] Figure 15M This is a schematic diagram of the structure after a conductive coating is formed in the adhesive channel, as provided in an embodiment of this application.

[0110] Figure 15N This is a schematic diagram of the structure of the second and fourth adhesive guiding channels in the sealing portion, provided in an embodiment of this application.

[0111] Figure 15O This is a schematic diagram of a structure after opening adhesive guiding channels in the first and second directions in a plate structure, as provided in an embodiment of this application.

[0112] Figure 15P This is a schematic diagram of another structure after forming a conductive plating layer in the adhesive channel, provided by an embodiment of this application;

[0113] Figure 15Q This application provides a schematic diagram of a structure after a removal groove is created in a sheet metal structure, as shown in the embodiments of the present application.

[0114] Figure 15R This is a schematic diagram of a combined structure of a second frame board, a second circuit board, and a third circuit board provided in an embodiment of this application. Detailed Implementation

[0115] The specific embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0116] The embodiments of this application can be applied to electronic device 100. Electronic device 100 can be a mobile phone (including candybar phones and foldable phones), tablet computer, laptop computer, ultra-mobile personal computer (UMPC), handheld computer, touch screen TV, large-screen device, speaker, walkie-talkie, netbook, POS machine, personal digital assistant (PDA), wearable device, virtual reality device, intelligent vehicle, intelligent robot, industrial equipment, etc., and is not limited thereto. In the following, a mobile phone will be used as an example of electronic device 100 to describe the technical solution of this application.

[0117] For ease of description, in the illustrations provided in this application, the X direction (as an example of the second direction) can be the width direction of the electronic device 100, the Y direction (as an example of the third direction) can be the length direction of the electronic device 100, and the Z direction (as an example of the first direction) can be the thickness direction of the electronic device 100. The X, Y, and Z directions can be perpendicular to each other. In addition, in this document, "above" refers to the direction in which the electronic device display screen 101 faces (the positive direction of the Z direction), and "below" refers to the direction away from the electronic device display screen 101 (the negative direction of the Z direction).

[0118] refer to Figure 1A As shown, the electronic device 100 may include a display screen 101, a mid-frame 102, and a battery cover 103. The display screen 101 and the battery cover 103 are located on opposite sides of the mid-frame 102, and the display screen 101, mid-frame 102, and battery cover 103 can together form the housing 110 of the electronic device 100. The mid-frame 102 and battery cover 103 can be independent structures or an integral structure.

[0119] In other embodiments, the housing 110 may also be formed in other ways. For example, see reference... Figure 1B The electronic device 100 can be a foldable phone. The display screen 101, the mid-frame 102, and the display screen 104 together form the housing 110 of the electronic device 100. Among them, the display screen 101 can be the inner screen of the foldable phone, and the display screen 104 can be the outer screen of the foldable phone.

[0120] The housing 110 can form a receiving cavity 111, in which internal components of the electronic device, such as the battery 105, camera (CAM) 106, and circuit board assembly 120, can be housed. The circuit board assembly is the core component of the electronic device, responsible for coordinating and controlling its various functions and operations.

[0121] Figure 2AThe circuit board assembly structure in a candybar mobile phone is shown. (Reference) Figure 2A As shown, the circuit board assembly 120 typically includes multiple printed circuit boards (PCBs), such as a motherboard 121 and a tailboard 122. The motherboard 121 can house multiple electronic components, such as a system-on-a-chip (SOC) 601 and a universal flash storage (UFS) chip 124. The tailboard 122 can house a subscriber identity module (SIM) 125 and a data transmission port 126. The motherboard 121 and the tailboard 122 can be connected via a flexible printed circuit (FPC). Specifically, the motherboard 121 and the tailboard 122 can each have one or more board-to-board connectors 127 (BTBs) 127. The first flexible printed circuit board 131 is used to connect the board-to-board connectors 127 on the motherboard 121 and the tailboard 122, respectively, thus enabling the connection between the motherboard 121 and the tailboard 122. Furthermore, the motherboard 121 can also be connected to other components (such as the battery 105 and the camera 106) using an FPC. For example, the motherboard 121 can be connected to the battery 105 via a second flexible printed circuit board 132.

[0122] Figure 2B The circuit board assembly structure in a dual-folding phone is shown. (Reference) Figure 2B As shown, for a dual-folding phone, the housing 110 may include a first housing 110a and a second housing 110b, which can be connected via a first hinge 141. Figure 2AUnlike the mobile phone shown, the circuit board assembly 120 may include a motherboard 121 and a first sub-motherboard 121a. The motherboard 121 can be housed in the first housing 110a, and the first sub-motherboard 121a can be housed in the second housing 110b. The motherboard 121 and the first sub-motherboard 121a can be connected via a third flexible printed circuit board 133. The third flexible printed circuit board 133 can cross the first hinge 141, either by passing through the inside of the first hinge 141 or by bypassing its outer surface. Furthermore, the dual-folding mobile phone may also include two batteries 105, namely a first battery 105a and a second battery 105b. The first battery 105a can be housed within the first housing 110a, and the second battery 105b can be housed within the second housing 110b. The motherboard 121 can be connected to the first battery 105a via the first flexible printed circuit board 131, and the first sub-motherboard 121a can be connected to the second battery 105b via a fourth flexible printed circuit board 134.

[0123] Figure 2C A circuit board assembly structure in a tri-fold mobile phone is shown. (Reference) Figure 2C As shown, with Figure 2B Unlike the mobile phone shown, for a tri-fold phone, the casing 110 may further include a third casing 110c, with the second casing 110b and the third casing 110c respectively disposed on both sides of the first casing 110a along the X direction. The first casing 110a and the third casing 110c can be connected via a second hinge 142. The circuit board assembly 120 may further include a second sub-mainboard 121b. The second sub-mainboard 121b and the tailboard 122 are both disposed within the third casing 110c. The second sub-mainboard 121b and the tailboard 122 can be connected via a fifth flexible printed circuit board 135. The mainboard 121 and the second sub-mainboard 121b can be connected via a sixth flexible printed circuit board 136. The sixth flexible printed circuit board 136 can span the second hinge 142. The manner in which the sixth flexible printed circuit board 136 spans the second hinge 142 can be referenced to the manner in which the third flexible printed circuit board 133 spans the first hinge 141, and will not be described further here. Furthermore, unlike bi-fold phones, tri-fold phones may also include a third battery 105c, which can be housed within a third casing 110c. A second sub-motherboard 121b can be connected to the third battery 105c via a seventh flexible printed circuit board 137.

[0124] Figure 2D This illustrates another circuit board assembly structure in a tri-fold phone. (Compared to...) Figure 2CUnlike the illustrated phone, the third housing 110c is located on the side of the second housing 110b opposite to the first housing 110a; that is, the second housing 110b is positioned between the first housing 110a and the third housing 110c. The second housing 110b and the third housing 110c are connected by a second hinge 142. The mainboard 121 and the tailboard 122 are both located within the first housing 110a. The mainboard 121 can be connected to the first sub-mainboard 121a and the second sub-mainboard 121b via a flexible printed circuit board. (Reference) Figure 2D As shown, the main board 121, the first sub-main board 121a, and the second sub-main board 121b can be connected via a third flexible printed circuit board 133. That is, the third flexible printed circuit board 133 can span the first pivot 141 and the second pivot 142.

[0125] Figure 2E A circuit board assembly 120 structure in a four-fold mobile phone is shown. (Reference) Figure 2E As shown, with Figure 2D Unlike the phone shown, for a four-fold phone, the housing 110 may further include a fourth housing 110d, and the third housing 110c and the fourth housing 110d can be connected via a third hinge 143. The circuit board assembly 120 may further include a third sub-motherboard 121c. The third sub-motherboard 121c can be disposed in the fourth housing 110d, and the second sub-motherboard 121b and the third sub-motherboard 121c can be connected via an eighth flexible printed circuit board 138. The eighth flexible printed circuit board 138 can span the third hinge 143. The way the eighth flexible printed circuit board 138 spans the third hinge 143 can be referred to the way the third flexible printed circuit board 133 spans the first hinge 141, and will not be repeated here. In addition, unlike the three-fold phone, the four-fold phone may further include a fourth battery 105d, which can be disposed in the fourth housing 110d. The third sub-motherboard 121c can be connected to the fourth battery 105d via a ninth flexible printed circuit board 139.

[0126] It should be understood that the structure of the mobile phone is not limited to the above description. In some embodiments, the mobile phone may also be a five-fold phone, a six-fold phone, or a phone that includes more foldable shells 110. The arrangement of the circuit board assembly 120 in these phones can be referred to the above description, and will not be described exhaustively here.

[0127] For the motherboard 121 (or the secondary motherboard), multiple circuit boards can be stacked, which allows for the placement of more electronic components to meet the diverse functional needs of mobile phones. At the same time, it can also reduce the space occupied by the motherboard 121 to meet the trend of mobile phones becoming thinner and lighter.

[0128] Figure 3AA circuit board stack structure is shown. (Reference) Figure 3A As shown, the circuit board stack structure may include a first circuit board 210, a second circuit board 220, and a third circuit board 230. The first circuit board 210 may be a processor board, and the second and third circuit boards 220 may be radio frequency boards.

[0129] refer to Figure 3A As shown, the first circuit board 210, the second circuit board 220, and the third circuit board 230 are all plate-shaped. The thickness directions of the first circuit board 210, the second circuit board 220, and the third circuit board 230 can all be parallel to the Z-direction. The first circuit board 210, the second circuit board 220, and the third circuit board 230 are stacked and spaced apart along the Z-direction. The first circuit board 210, the second circuit board 220, and the third circuit board 230 can be separated by a frame board (FB).

[0130] For example, a frame board is typically positioned along the edge of the circuit board, and its shape is usually designed to match the edge shape of the circuit board. As an example, Figure 3B A frame board is shown in the mounting area of ​​a circuit board, for reference. Figure 3B The frame panel can be a rectangle with a "notched corner". As another example, Figure 3C Another example is shown in the mounting area of ​​a frame board on a circuit board, see reference. Figure 3C The frame plate can be a closed shape formed by multiple sides, and the closed area enclosed by the frame plate can include multiple closed or connected sub-regions.

[0131] Continue to refer to Figure 3A As shown, the frame board may include a second frame board 320 and a third frame board 330. The second frame board 320 is disposed between the first circuit board 210 and the second circuit board 220. The second frame board 320 provides structural support for the first circuit board 210 and the second circuit board 220. The first circuit board 210, the second frame board 320, and the second circuit board 220 form a sandwich structure A. The third frame board 330 is disposed between the second circuit board 220 and the third circuit board 230. The third frame board 330 provides structural support for the second circuit board 220 and the third circuit board 230. The first circuit board 210, the second frame board 320, the second circuit board 220, the third frame board 330, and the third circuit board 230 form a sandwich structure B.

[0132] It should be noted that the height of the circuit board assembly in the Z direction is usually set based on the height of the decoration (DECO) protrusion 107. That is, the height of the multi-layer circuit board and frame board after stacking is less than the distance between DECO 107 and housing 110 (e.g., middle frame 102). The distance between DECO 107 and housing 110 is usually set based on the camera.

[0133] In some embodiments, the second frame plate 320 is also used to realize the electrical connection between the first circuit board 210 and the second circuit board 220, and the third frame plate 330 is also used to realize the electrical connection between the second circuit board 220 and the third circuit board 230. Figure 3D A frame plate structure is shown. (Reference) Figure 3D As shown, the frame plate has vias 301, and the inner wall of the vias 301 has a metal plating layer 302. Pads are provided at both ends of the frame plate along the Z direction, and the metal plating layer 302 within the vias 301 is electrically connected to the pads at both ends. The pads at both ends of the frame plate can be connected to pads 303 on the circuit board, thereby achieving electrical connection between the circuit boards. Optionally, the second frame plate 320 can be... Figure 3D The frame plate shown enables electrical connection between the first circuit board 210 and the second circuit board 220. Similarly, the third frame plate 330 can be... Figure 3D The frame plate shown enables electrical connection between the second circuit board 220 and the third circuit board 230.

[0134] The shapes of the first circuit board 210, the second circuit board 220, and the third circuit board 230 may be the same or different. Figure 3E The structure of a first circuit board 210, a second circuit board 220, and a third circuit board 230 is shown. (Reference) Figure 3E The first circuit board 210, the second circuit board 220, and the third circuit board 230 have different shapes. All three circuit boards can be used to arrange electronic components, such as a WIFI chip, a UFS chip 608, a SOC chip 601, a Low Power Double Data Rate (LPDDR) chip 602, a Power Management Unit (PMU), a Radio Frequency Integrated Circuit (RFIC) chip 604, a Charger IC chip 605, a satellite mobile communication terminal baseband chip 606, a Near Field Communication (NFC) control chip 607, an audio amplifier, and an audio analog-to-digital converter 609.

[0135] refer to Figure 3A As shown, the first circuit board 210 has a first surface and a second surface opposite in the Z-direction, and multiple electronic devices can be disposed on both the first and second surfaces. Similarly, the second circuit board 220 also has two surfaces opposite in the Z-direction, and multiple electronic devices can be disposed on both surfaces. The third circuit board 230 also has two surfaces opposite in the Z-direction, and multiple electronic devices can be disposed on both surfaces. It can be understood that in this way, the number of electronic devices disposed on the circuit board can be greatly increased, thereby meeting the needs of diverse functions of electronic devices.

[0136] refer to Figure 3A As shown, to ensure that electronic devices are not subject to electromagnetic interference during operation, shielding covers can be used to protect the electronic devices. Specifically, the shielding covers may include a first shielding cover 410, a second shielding cover 420, and a third shielding cover 430. The first shielding cover 410 can be disposed on the first surface of the first circuit board 210, thereby protecting the circuit board assembly of electronic devices on the first surface. The second shielding cover 420 can be disposed on the surface of the second circuit board 220 opposite to the first circuit board 210, thereby protecting the electronic devices disposed on the surface of the third circuit board 230 opposite to the first circuit board 210. The third shielding cover 430 can be disposed on the surface of the third circuit board 230 opposite to the first circuit board 210, thereby protecting the electronic devices disposed on the surface of the third circuit board 230 opposite to the first circuit board 210. Optionally, the first shielding cover 410, the second shielding cover 420, and the third shielding cover 430 can all be made of metal. Optionally, the materials of the first shield 410, the second shield 420 and the third shield 430 include, but are not limited to, copper, copper-zinc alloy, copper-tin alloy, aluminum, stainless steel, etc.

[0137] refer to Figure 3A As shown, the first shielding cover 410 and the first surface form a first receiving cavity 801. The electronic devices disposed within the first receiving cavity 801 include heat-generating devices. Heat-generating devices refer to electronic devices that generate significant heat or are highly sensitive to temperature changes during operation. Examples include SOC chips, central processing units (CPUs), and graphics processing units (GPUs). Because heat-generating devices generate considerable heat during operation, when the heat generated is significant, it may accumulate inside or around the device, leading to decreased reliability and increased power consumption. Furthermore, heat accumulation can increase the perceived temperature of the electronic device, shorten its battery life, and negatively impact user experience.

[0138] In order to avoid heat accumulation inside or around the heating device, and to reduce the temperature of the heating device and prevent it from becoming too hot, the heat generated by the heating device needs to be dissipated to the outside of the electronic device through a certain heat dissipation channel, or the heat around it can be quickly diffused during the heating process through a heat equalization method, so that the heat can be dissipated to the outside of the electronic device.

[0139] To facilitate the dissipation of heat generated by the heat-generating components, the circuit board assembly includes a vapor chamber (VC) 108a and a first thermally conductive adhesive 501. (Reference) Figure 3A As shown, the outer side of the first receiving cavity 801 is a middle frame 102, and a heat spreader 108a is disposed on the side of the middle frame 102 opposite to the first circuit board 210 along the Z direction (i.e., below the middle frame 102). An opening is provided on the middle frame 102, and a first thermally conductive adhesive 501 is disposed within the opening. The first thermally conductive adhesive 501 is positioned on opposite sides along the Z direction, namely the first shielding cover 410 and the heat spreader 108a, respectively; that is, the first thermally conductive adhesive 501 is disposed between the first shielding cover 410 and the heat spreader 108a. The heat generated by the heat-generating device can be transferred to the first shielding cover 410 through thermal radiation, and then transferred to the heat spreader 108a through the first thermally conductive adhesive 501. The heat spreader 108a then transfers the heat to the middle frame 102, which can dissipate the heat to the outside of the electronic device.

[0140] However, with the widespread adoption of edge artificial intelligence (AI) models in electronic devices, the heat generated by heat-generating components is increasing, and the aforementioned heat dissipation methods cannot meet the heat dissipation requirements of these components, thus limiting the development of electronic devices. Meanwhile, the frame 102 of the circuit board assembly occupies a significant portion of the circuit board area, yet its function is merely to provide support and electrical connections between circuit boards, which to some extent results in wasted space.

[0141] In view of this, this application provides a circuit board assembly 120, which includes a first circuit board 210 and a second circuit board 220 stacked and spaced apart along a first direction (e.g., the Z direction). The first circuit board 210 has a first surface facing away from the second circuit board 220 and a second surface facing the second circuit board 220. A heat-generating device is disposed on the first surface or the second surface. The second circuit board 220 has a third surface facing the first circuit board 210. The circuit board assembly 120 also includes a first frame plate 310 disposed between the first circuit board 210 and the second circuit board 220. The first frame plate 310 has a first end and a second end facing away from each other along the first direction. The first end is connected to the second surface, and the second end is thermally connected to the third surface. A first through hole 313a is provided in the first frame plate 310, which penetrates the first frame plate 310 along the first direction. The first through hole 313a is filled with a thermally conductive material 313, so that the first frame plate 310 can transfer the heat generated by the heat-generating device from the first circuit board 210 to the second circuit board 220, thereby reducing the temperature around the heat-generating device and improving heat dissipation efficiency.

[0142] It is understandable that, since the first frame plate 310 has a first through hole 313a filled with thermally conductive material 313, the first frame plate 310 can transfer the heat generated by the heat-generating device to the second circuit board 220 while providing support for the first circuit board 210 (or the second circuit board 220). Transferring heat to the second circuit board 220 can, on the one hand, disperse the heat generated by the heat-generating device to a certain extent; on the other hand, the second circuit board 220 can transfer heat to the middle frame 102, increasing the heat dissipation channels for the heat-generating device, thereby improving the heat dissipation efficiency of the heat-generating device, preventing heat accumulation inside or around the heat-generating device, which is beneficial to improving the reliability of the heat-generating device and reducing its power consumption. At the same time, the above heat dissipation method is based on the frame plate and does not add any additional heat dissipation components, therefore it does not occupy additional circuit board area, thereby improving the space utilization rate of the circuit board assembly, reducing the space occupied by the circuit board assembly, and meeting the requirements for thinner and lighter electronic devices. Moreover, since no additional heat dissipation components are added, there is no significant increase in cost.

[0143] The following describes the circuit board assembly provided in this application embodiment, taking the SOC chip 601 in a mobile phone (an example of an electronic device) as an example of a heat-generating device.

[0144] In the following description, "embodiment" or "implementation" means that a particular feature, structure, or characteristic described in connection with an implementation may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0145] Figure 4A A circuit board assembly 120 structure according to one embodiment is shown. (Reference) Figure 4A As shown, the circuit board assembly 120 may include a first circuit board 210 and a second circuit board 220 that are stacked and spaced apart along the Z direction.

[0146] The first circuit board 210 may have a first surface and a second surface that are opposite to each other along the Z direction, and the second circuit board 220 may have a third surface and a fourth surface that are opposite to each other along the Z direction. The first surface is away from the second circuit board 220, the second surface is towards the second circuit board 220, the third surface is towards the first circuit board 210, and the fourth surface is away from the first circuit board 210.

[0147] The first circuit board 210 and the second circuit board 220 can be connected via the second frame board 320. Specifically, refer to... Figure 4A As shown, the second frame plate 320 has two opposite ends along the Z direction, one end of which is connected to the second surface and the other end of which is connected to the third surface. The second frame plate 320, the first circuit board 210, and the second circuit board 220 together form the third receiving cavity 803.

[0148] Electronic devices can be disposed on the first, second, third, and fourth surfaces. (Reference) Figure 4A As shown, a SOC chip 601 is disposed on the first surface. In some embodiments, the SOC chip 601 may also be disposed on the second surface. To improve the heat dissipation efficiency of the SOC chip 601, a first frame plate 310 with thermal conductivity can be disposed in the third receiving cavity 803 to transfer the heat generated by the operation of the SOC chip 601 from the first circuit board 210 to the second circuit board 220.

[0149] Specifically, the first frame plate 310 has a first end and a second end opposite to each other along a first direction, wherein the first end is connected to the second surface, and the second end is thermally connected to the third surface. The thermal connection between the second end of the first frame plate 310 and the third surface means that heat can be transferred to the second circuit board 220 through the second end of the first frame plate 310. For example, the second end of the first frame plate 310 can be directly attached to the third surface, or the connection can be achieved through a thermally conductive medium.

[0150] Figure 4B A connection structure between a first frame plate 310, a first circuit board 210, and a second circuit board 220 is shown. (Reference) Figure 4B As shown, a first pad 311 is provided at the first end, and a second pad 211 is provided on the second surface. The first pad 311 and the second pad 211 are soldered together. A third pad 312 is provided at the second end, and a fourth pad 221 is provided on the third surface. The third pad 312 and the fourth pad 221 are soldered together. When soldering the first pad 311 and the second pad 211, solder 304 can be placed between the first pad 311 and the second pad 211. Similarly, when soldering the third pad 312 and the fourth pad 221, solder 304 can be placed between the third pad 312 and the fourth pad 221. Optionally, the solder 304 includes, but is not limited to, solder paste, pre-formed solder, etc. Optionally, the methods for implementing the soldering of the first pad 311 and the second pad 211, and the soldering of the third pad 312 and the fourth pad 221 include, but are not limited to, reflow soldering, laser soldering, milling soldering, diffusion soldering, and other soldering processes.

[0151] In this embodiment of the application, a first through hole 313a is provided in the first frame plate 310, which penetrates the first frame plate 310 along the Z direction, and the first through hole 313a is filled with thermally conductive material 313. Figure 4C A first frame plate 310 structure according to one embodiment is shown. (Reference) Figure 4C As shown, the number of first through holes 313a in the first frame plate 310 can be multiple (two or more). To ensure heat transfer efficiency, each first through hole 313a can correspond to one solder joint of the first pad 311 and the third pad 312. The thermally conductive material 313 filling the first through hole 313a can be a material with good thermal conductivity that can fill the hole. Optionally, the thermally conductive material 313 can be a resin material with thermal conductivity. Figure 4D A first frame plate 310 model structure according to one embodiment is shown. Figure 4E A cross-sectional structure of a first frame plate 310 according to one embodiment is shown. (Reference) Figure 4D and Figure 4E The first through hole 313a is filled with thermally conductive material 313.

[0152] In some embodiments, the thermally conductive material 313 may also be electrically conductive, thereby enabling the first frame plate 310 to achieve an electrical connection between the first circuit board 210 and the second circuit board 220. Optionally, the thermally conductive material 313 may be a metal-mixed resin material. As an example, the metal-mixed resin material may include components such as a conductive agent, a glass oxide binder, an organic solvent, a surfactant, and a stabilizer. Table 1 shows the properties of a thermally conductive material 313.

[0153] Table 1 Properties of Thermally Conductive Material 313

[0154] index characteristic Viscosity 1000cps-300000cps Thixotropic index 1-28 thermal conductivity ≥10W / mK Volume resistivity <![CDATA[Less than or equal to 5×10 -5 Ω.cm]]> Curing conditions Curing time is 10-30 minutes at 100℃-225℃.

[0155] As an example, the viscosity of thermally conductive material 313 can be 1000cps-300000cps, the thixotropic index can be 3-8, the thermal conductivity can be greater than or equal to 30W / mK, and the volume resistivity can be less than or equal to 2×10⁻⁶. -5 Ω.cm, curing conditions can be 125℃, curing for 30 min.

[0156] The resistivity of the thermally conductive material 313 typically depends on the conductive elements it contains, and different conductive elements have different thermal conductivity coefficients. Table 2 shows the thermal conductivity coefficient of a common conductive element.

[0157] Table 2 Thermal conductivity of common conductive elements

[0158]

[0159] As shown in Table 2, the conductive elements contained in the thermally conductive material 313 can be silver, copper, or other elements. This achieves good electrical conductivity and ensures the thermal conductivity efficiency of the thermally conductive material 313. Furthermore, since the thermally conductive material 313 is conductive, there is no need to install a metal plating layer 302 in the first through-hole 313a, thereby reducing the processing difficulty and cost of the first frame plate 310.

[0160] It is understandable that the SOC chip 601 is mounted on the first circuit board 210, and the heat generated by the SOC chip 601 during operation will cause the temperature of the first circuit board 210 to rise. Since the first end of the first frame board 310 is connected to the first circuit board 210, and the second end of the first frame board 310 is thermally connected to the second circuit board 220, and the first frame board 310 has a first through-hole 313a filled with thermally conductive material 313, heat can be transferred from the first circuit board 210 to the second circuit board 220 through the thermally conductive material 313 in the first frame board 310. This allows the heat generated by the SOC chip 601 to be quickly dissipated, preventing heat accumulation around the SOC chip 601. This not only reduces the temperature of the SOC chip 601, ensuring its performance and reliability, but also reduces the power consumption of the electronic device, extends its battery life, and improves the user experience.

[0161] In some embodiments, the first frame plate 310 enables the first circuit board 210 and the second circuit board 220 to be electrically connected. Alternatively, a conductive layer, such as a metal conductive layer, can be provided on the sidewall of the first through hole 313a. The thermally conductive material 313 can be filled in the first through hole 313a with the metal conductive layer.

[0162] To further accelerate the dissipation of heat generated by the SOC chip 601 during operation, the orthographic projection of the first frame plate 310 on the first plane (XY plane) at least partially coincides with the orthographic projection of the heat-generating device on the first plane. The first plane is perpendicular to the Z-direction. In other words, the first frame plate 310 is positioned directly below or around the SOC chip 601 within the third receiving cavity 803, ensuring that at least a portion of the first frame plate 310 is directly opposite the SOC chip 601. This shortens the heat transfer path between the SOC chip 601 and the thermally conductive material 313, improving heat conduction efficiency and thus effectively enhancing the heat dissipation efficiency of the circuit board assembly.

[0163] Furthermore, the first frame board 310 is positioned directly below or around the SOC chip 601, which not only improves the heat dissipation efficiency of the SOC chip 601 but also provides structural support for the first circuit board 210 and the second circuit board 220. This effectively reduces the deformation of the first circuit board 210 and the second circuit board 220 during a drop, thereby effectively preventing cracking and failure of the solder joints between the first circuit board 210 and the frame board, as well as between the second circuit board 220 and the frame board. This improves the reliability of the electrical and mechanical connections between the first circuit board 210 and the second circuit board 220, enhances the structural stability and reliability of the circuit board assembly, and ultimately improves the drop resistance of the circuit board assembly and the electronic device, thus contributing to the improved reliability of the electronic device.

[0164] In some embodiments, for structural strength of the circuit board assembly, a fourth circuit board 240 may also be provided in the third receiving cavity 803. Figure 4F Another circuit board assembly structure is shown. (Reference) Figure 4F A fourth circuit board 240 is disposed in the third receiving cavity 803. The fourth circuit board 240 is stacked and spaced apart from the first circuit board 210 and the second circuit board 220 along the Z-direction. The side of the fourth circuit board 240 along the Z-direction is connected to the surface of the first frame plate 310 along the Z-direction. That is, the fourth circuit board 240 is disposed between the first circuit board 210 and the second circuit board 220, and the side of the fourth circuit board 240 is connected to the first frame plate 310. In some embodiments, the side of the fourth circuit board 240 along the Z-direction may also be connected to the second frame plate 320. By disposing of the fourth circuit board 240 in the third receiving cavity 803, the circuit board assembly can be supported in the XY plane, increasing the overall rigidity of the circuit board assembly, making it less prone to deformation, and improving the overall strength of the circuit board assembly.

[0165] refer to Figure 4AAs shown, the circuit board assembly also includes a first shield 410, which is disposed on the first surface and together with the first surface forms a first receiving cavity 801, in which the SOC chip 601 is located.

[0166] Figure 4G The diagram illustrates the structure of a System-on-a-Chip (SOC) chip 601. The F-side is the front side of the SOC chip 601, and the B-side is the back side. The back side of the SOC chip 601 can be connected to a first surface, and the front side of the SOC chip 601 can house a second electronic device, such as an LPDDR chip 602.

[0167] Since the first receiving cavity 801 is the chamber where the SOC chip 601 is directly located, the way heat is dissipated in the first receiving cavity 801 is crucial. To improve the heat dissipation efficiency of the SOC chip 601, thermally conductive adhesive 503 can be filled into the first receiving cavity 801 to quickly transfer the heat generated by the SOC chip 601 to the first shield 410 and the first circuit board 210, thereby improving the heat dissipation performance of the first receiving cavity 801, reducing the temperature of the SOC chip 601, and improving the operational reliability of the SOC chip 601.

[0168] In this embodiment, the thermally conductive adhesive 503 can be a thermal interface material (TIM) 313, such as thermal grease, thermal imaging adhesive, or thermal gap filler (e.g., gel, paste). TIM materials have high thermal conductivity, enabling rapid heat transfer from the second cavity 802 to the first shield 410 and the first circuit board 210, thereby reducing the temperature of the SOC chip 601 and improving its heat dissipation efficiency. Furthermore, TIM has good adhesion, allowing it to bond tightly to the surfaces of the SOC chip 601 and the LPDDR chip 602, preventing air gaps and increasing the contact area with the SOC chip 601 and LPDDR chip 602, thus achieving better thermal conductivity and effectively dissipating the heat generated by the SOC chip 601 during operation.

[0169] Figure 5A Another embodiment of the circuit board assembly 120 structure is shown. (Reference) Figure 5A As shown, the circuit board assembly 120 and Figure 4A The circuit board assembly shown is different, Figure 5A In the circuit board assembly shown, a dam 502 is provided on the first surface of the first circuit board 210. The dam 502, together with the first surface and the first shield 410, encloses a second receiving cavity 802, into which thermally conductive adhesive 503 can be filled. Compared to Figure 4AThe circuit board assembly shown reduces the amount of thermally conductive adhesive 503 used, which not only lowers the cost of the circuit board assembly but also reduces the difficulty of cleaning up residual adhesive.

[0170] Specifically, refer to Figure 5A As shown, a dam 502 is disposed on the first surface, and the top of the dam 502 is attached to the first shield 410. The dam 502 can be arranged circumferentially around the SOC chip 601, and optionally, the distance between the dam 502 and the SOC chip 601 is 0.5mm-3mm. The dam 502, together with the first surface and the first shield 410, can form a second receiving cavity 802, in which the SOC chip 601 is disposed. To improve heat dissipation efficiency, thermally conductive adhesive 503 can be filled into the second receiving cavity 802 to allow heat to be quickly transferred to the first shield 410 and the first circuit board 210.

[0171] Figure 5B The location 504 filled by thermally conductive adhesive 503 is shown. (Reference) Figure 5B As shown, thermally conductive adhesive 503 can be filled on the side of SOC chip 601, as well as the side and top of LPDDR chip 602.

[0172] In this embodiment, the thermally conductive adhesive 503 can be a TIM material. The TIM material is an ice cream-like fluid, and the dam 502 provides structural support for the TIM material to prevent it from flowing out of the second receiving cavity 802. The dam 502 can be formed by curing the dam adhesive. Table 3 shows the characteristics of one type of dam adhesive.

[0173] Table 3. Properties of the damming adhesive

[0174] parameter average value Min value Max value Curing conditions At 150℃, for 15 minutes 50% of the average value 200% of the average value Shear strength (MPa) ≥2..5 50% of the average value 500% of the average value Elongation at break (%) ≥80 50% of the average value 500% of the average value Tensile strength (MPa) ≥4.0 50% of the average value 500% of the average value Shore hardness (HA) 50±5 50% of the average value 500% of the average value Volume resistivity (Ω·cm) 0.5×10 50% of the average value 500% of the average value Relative permittivity (MHz) 3.2 50% of the average value 200% of the average value

[0175] By placing a first frame plate 310 with high thermal conductivity below the SOC chip 601 and filling the second receiving cavity 802 containing the SOC chip 601 with TIM material, the heat generated by the operation of the SOC chip 601 can be quickly dissipated, thereby reducing the temperature of the SOC chip 601. Tests have shown that compared to circuit board assemblies without the first frame plate 310 (e.g., [missing information]), [missing information] Figure 3A For example, after setting the first frame plate 310 with heat conduction function, the operating temperature of the SOC is reduced by about 3°C, which greatly improves the heat dissipation efficiency of the SOC chip 601, ensures the stability of the SOC chip 601 operation, and thus improves the performance of electronic devices.

[0176] Figure 6A Another embodiment of the circuit board assembly 120 structure is shown. (Reference) Figure 6A As shown, the circuit board assembly 120 and Figure 5AThe circuit board assembly shown is different, Figure 6A In the circuit board assembly shown, the second end of the first frame plate 310 is not directly connected to the third surface, but is bonded to the thermally conductive adhesive 503 disposed on the third surface. In this way, electronic components can also be disposed on the third surface below the first frame plate 310, thereby improving the space utilization of the circuit board assembly.

[0177] Specifically, refer to Figure 6A As shown, a first electronic device 603 is disposed on the third surface in the area corresponding to the first frame plate 310. Optionally, the first electronic device 603 may be a ball grid array (BGA) packaged chip. Thermally conductive adhesive 503 is disposed on the first electronic device 603, and the second end of the first frame plate 310 is attached to the thermally conductive adhesive 503.

[0178] Figure 6B Another connection structure between the first frame plate 310 and the first circuit board 210 and the second circuit board 220 is shown. (Reference) Figure 6B As shown, the first electronic device 603 is disposed on the third surface and covered with thermally conductive adhesive 503. The first pad 311 on the first end is soldered to the third pad 312 on the second surface, and the second pad 211 on the second end is bonded to the thermally conductive adhesive 503.

[0179] In some embodiments, for structural strength of the circuit board assembly, a fourth circuit board 240 may also be provided in the third receiving cavity 803. Figure 6C Another circuit board assembly structure is shown. (Reference) Figure 6C A fourth circuit board 240 is disposed in the third receiving cavity 803. The fourth circuit board 240 is stacked and spaced apart from the first circuit board 210 and the second circuit board 220 along the Z-direction. The upper surface of the fourth circuit board 240 along the Z-direction (the surface near the first circuit board) can be connected to the second end. Optionally, the connection between the second end and the fourth circuit board 240 can be a thermally conductive connection or a thermally conductive and electrically conductive connection. When the second end and the fourth circuit board 240 are thermally conductive and electrically conductively connected, electronic components can be arranged on the upper and lower surfaces of the fourth circuit board 240 to improve space utilization. The lower surface of the fourth circuit board 240 along the Z-direction (the surface facing away from the first circuit board 210) can be thermally conductively connected to the second circuit board 220. For example, thermally conductive adhesive is filled between the second circuit board 220 and the fourth circuit board 240, so that heat can be transferred from the fourth circuit board 240 to the second circuit board 220.

[0180] In other embodiments, the side of the fourth circuit board 240 along the Z direction may be connected to the surface of the second frame board 320 along the Z direction. Optionally, see reference... Figure 6CAs shown, the Z-direction side of the fourth circuit board 240 can be connected to the Z-direction surface of the second frame plate holder 320 on the left side (negative X-direction side) of the first frame plate 310, or the Z-direction side of the fourth circuit board 240 can be connected to the Z-direction surface of the second frame plate holder 320 on the right side (positive X-direction side) of the first frame plate 310, or the Z-direction side of the fourth circuit board 240 can be connected to the Z-direction surfaces of the second frame plate holders 320 on both the left and right sides of the first frame plate 310. By providing the fourth circuit board 240 in the third receiving cavity 803, the third receiving cavity 803 can be divided into two chambers (arranged along the Z-direction), each of which can house electronic devices, thereby improving space utilization. Moreover, the fourth circuit board 240 can support the circuit board assembly in the X-direction, increasing the overall rigidity of the circuit board assembly, making it less prone to deformation, and improving the overall strength of the circuit board assembly.

[0181] In this embodiment, a first frame plate 310 with high thermal conductivity is connected to the area where the SOC chip 601 is located, and the lower part of the first frame plate 310 is thermally connected to the third surface. This conducts the heat generated by the SOC chip 601 to the second circuit board 220 without affecting the normal arrangement of electronic components on the surface of the third circuit board 230. Actual testing shows that compared to not having the first frame plate 310, the SOC operating temperature is reduced by approximately 2.5°C after its installation. This significantly improves the heat dissipation efficiency of the SOC chip 601, ensures the stability of the SOC chip's operation, and ultimately improves the performance of the electronic device.

[0182] Further details about circuit board assembly 120 can be found in [reference]. Figures 4A to 5B The description of the illustrated embodiments will not be repeated.

[0183] Figure 7A and Figure 7B Another embodiment of the circuit board assembly 120 structure is shown. In this embodiment, Figure 7A The image shown is an XZ section of the circuit board assembly. Figure 7B The YZ section of the circuit board assembly is shown.

[0184] refer to Figure 7A and Figure 7B As shown, the second circuit board 220 is connected to the middle frame 102 (an example of housing 110) by fasteners 109 (e.g., screws). A second shield 420 is disposed on the fourth surface, and the second shield 420 and the fourth surface together form a fourth receiving cavity 804. Figure 4AThe circuit board assembly shown differs in that, in this assembly, the third receiving cavity 803 and the fourth receiving cavity 804 are filled with thermally conductive gel 505. Furthermore, the second frame plate 320 is replaced with a high thermal conductivity frame plate (such as...). Figure 4B (As shown). Furthermore, each high thermal conductivity frame plate (including the first frame plate 310 and the second frame plate 320) has a heat-conducting element 108 provided on its side. In this way, the heat dissipation path can be shortened, and while ensuring heat dissipation effect, the maintainability of the circuit board assembly is achieved.

[0185] Specifically, refer to Figure 7B As shown, the first circuit board 210, the second frame plate 320, and the second circuit board 220 can all be connected to the middle frame 102 by screws. That is, the screws can pass through the first circuit board 210, the second frame plate 320, and the second circuit board 220, and are connected to the middle frame 102. The upper and lower (along the Z direction) sides of the middle frame 102 are the display screen 101 and the battery cover 103, respectively, and a multi-layer heat-conducting component 108 is provided below the screen. Optionally, these heat-conducting components 108 can be one or more of the following: a metal layer (such as a copper layer), a graphite layer, thermally conductive adhesive 503, and a heat sink (such as a VC). These heat-conducting components 108 are stacked between the heat spreader 108a and the display screen 101. In some embodiments, a support cover is also provided between the heat spreader 108a and the first thermally conductive adhesive 501 to support the heat-conducting components 108 and the display screen 101. Optionally, the material of the support cover can be a material with thermal conductivity, such as copper. In addition, the battery cover 103 is attached to the second shield 420 by thermally conductive adhesive.

[0186] refer to Figure 7B As shown, the heat generated by the SOC chip 601 can be transferred outward through the following heat dissipation paths a and b. Heat dissipation path a is: solder joint between the SOC chip 601 and the first circuit board 210 → first circuit board 210 → solder joint in the first pad 311 → first frame board 310 → solder joint in the third pad 312 → second circuit board 220 → middle frame 102 → air. Heat dissipation path b is: solder joint between the SOC chip 601 and the first circuit board 210 → first circuit board 210 → first frame board 310 → solder joint in the third pad 312 → second circuit board 220 → middle frame 102 → air. This enables heat dissipation and heat conduction across multiple circuit boards, improving the heat dissipation efficiency of the SOC chip 601 and enhancing the heat dissipation performance of circuit board assemblies and electronic devices.

[0187] In this embodiment of the application, in order to achieve a good heat conduction effect, the height (dimension in the Z direction) of each cavity needs to be minimized while ensuring heat dissipation, so as to avoid the circuit board assembly occupying a large space and affecting the thinness of the electronic device.

[0188] Specifically, refer to Figure 7B As shown, the distance between the second electronic device and the first shield 410 is 0.02mm-0.15mm, the distance between the inner surface of the first shield 410 (the surface in the first receiving cavity 801) and the first surface along the Z direction is 0.6mm-0.8mm, the distance between the second end of the first frame plate 310 and the third surface is 0.05mm-0.35mm, and the distance between the surface of the electronic device in the fourth receiving cavity 804 and the inner surface of the second shield 420 (the surface in the fourth receiving cavity 804) and the fourth surface along the Z direction is 0.05mm-0.2mm.

[0189] In this embodiment, the thermally conductive adhesive 503 filling the first receiving cavity 801 can be a TIM material, and the second receiving cavity 802 and the third receiving cavity 803 can be filled with thermally conductive gel 505. The difference between the thermally conductive gel 505 and the TIM material is that the TIM material has a higher viscosity, while the thermally conductive gel 505 has a lower viscosity, making it easier to peel off from the circuit board and reduce the difficulty of cleaning residual adhesive, thus facilitating repair when the circuit board assembly fails.

[0190] In this embodiment, the peel strength of the TIM material can be greater than or equal to 30 PSI / mm. 2 The peel strength of thermal conductive gel 505 is less than 10 PSI / mm. 2 The thermal conductivity of the TIM material can be greater than or equal to 9 W / mK, and the thermal conductivity of the thermally conductive gel 505 can be greater than or equal to 3 W / mK. In some embodiments, the thermal conductivity of the thermally conductive gel 505 can also be 50% to 500% of that of the TIM material.

[0191] Continue to refer to Figure 7A As shown, the second frame plate 320 has a sixth surface (i.e., the side surface of the second frame plate 320) located at one end in the X direction, on which a thermally conductive layer 321 is disposed. Optionally, the thermally conductive layer 321 can be a metallic thermally conductive layer, such as a thermally conductive layer formed of metals or alloys such as copper, silver, aluminum, zinc, and tin; the thermally conductive layer 321 can also be a non-metallic thermally conductive layer, such as a thermally conductive ceramic coating or a thermally conductive resin coating. By providing a thermally conductive layer 321 on the side surface of the second frame plate 320, the heat exchange efficiency between the thermally conductive gel 505 and the second frame plate 320 can be improved, thereby accelerating heat dissipation.

[0192] Figure 7C The structure of a first surface is shown. Figure 7C The diagram shows some of the electronic components disposed on the first surface and the camera arrangement area 106a corresponding to the camera.

[0193] Figure 7D The structure of a second surface is shown. Figure 7DA portion of the electronic components disposed on the second surface is shown. Furthermore, Figure 7D The positions of the first frame plate 310 and the second frame plate 320 on the second surface are also shown. Figure 7D As shown, the second frame plate 320 encloses a closed annular region on the second surface, which corresponds to the third receiving cavity 803. The first frame plate 310 is disposed within the annular region enclosed by the second frame plate 320.

[0194] Figure 7E The structure of a third surface is shown. Figure 7E A portion of the electronic components disposed on the third surface is shown. Furthermore, Figure 7E The arrangement positions of the first frame plate 310 and the second frame plate 320 on the third surface are also shown. Figure 7E As shown, the second frame plate 320 encloses a closed annular region on the third surface, which corresponds to the third receiving cavity 803. The first frame plate 310 is disposed within the annular region enclosed by the second frame plate 320.

[0195] In some embodiments, reference Figure 7D and Figure 7E As shown, the annular region formed by the second frame plate 320 on the second (or third) surface is divided into a first region and a second region by the first frame plate 310. That is, the third receiving cavity 803 is divided by the first frame plate 310 into a first sub-receiving cavity corresponding to the first region and a second sub-receiving cavity corresponding to the second region. The first sub-receiving cavity corresponds to the position of the SOC chip 601, therefore it can be filled with thermally conductive gel 505 to accelerate heat dissipation. The second sub-receiving cavity is relatively far from the SOC chip 601, therefore it can be left unfilled with thermally conductive gel 505, thereby reducing the amount of thermally conductive gel 505 and lowering costs.

[0196] To further improve heat dissipation efficiency, a heat-conducting layer may be provided on the sides of the first frame plate 310 and / or the second frame plate 320. Optionally, the heat-conducting layer may be a metallic heat-conducting layer, such as a heat-conducting layer formed of metals or alloys such as copper, silver, aluminum, zinc, and tin; the heat-conducting layer may also be a non-metallic heat-conducting layer, such as a thermally conductive ceramic coating or a thermally conductive resin coating.

[0197] refer to Figure 7A As shown, the first frame plate 310 has a fifth surface (i.e., the side surface of the first frame plate 310) located at one end in the X direction, and a metal heat-conducting layer is disposed on the fifth surface. The second frame plate 320 has a sixth surface (i.e., the side surface of the second frame plate 320) located at one end in the second direction, and a metal heat-conducting layer is disposed on the sixth surface.

[0198] Figure 7F Another connection structure between the first frame plate 310 and the first circuit board 210 and the second circuit board 220 is shown. (Reference) Figure 7F As shown, with Figure 6B The structures shown are different, Figure 7F In the structure shown, a thermally conductive layer is provided on the side of the first frame plate 310, and the second end and a portion of the thermally conductive layer near the second end are covered by thermally conductive gel 505. It can be understood that in this way, the first frame plate 310 can quickly transfer heat to the thermally conductive gel 505, thereby accelerating heat dissipation.

[0199] In some embodiments, the first frame plate 310 may also be composed of two or more layers of sub-frame plates, and the sub-frame plates may be connected to each other through a heat dissipation plate 314.

[0200] As an example, Figure 7G Another structure of the first frame plate 310 is shown. (Reference) Figure 7G As shown, the first frame plate 310 includes a first sub-frame plate and a second sub-frame plate stacked along a first direction, with the second sub-frame plate located between the first sub-frame plate and the second circuit board 220. The first sub-frame plate has a plurality of first sub-through holes 313b along the first direction, and the second sub-frame plate has a plurality of second sub-through holes 313c along the first direction, with each of the first sub-through holes 313b and second sub-through holes 313c corresponding one-to-one. A heat dissipation perforation plate 314 is provided between the first and second sub-frame plates, and the heat dissipation perforation plate 314 can be obtained by soldering two layers of pads. The heat dissipation perforation plate 314 has a plurality of through holes, and the corresponding first sub-through holes 313b and second sub-through holes 313c are connected through a through hole. In some embodiments, reinforcing ribs may also be provided between the first and second sub-frame plates to increase the structural strength of the first frame plate 310.

[0201] The first sub-frame plate and the second sub-frame plate are connected to form the first frame plate 310. The dimensional parameters of the first sub-frame plate and the second sub-frame plate are shown in Table 4.

[0202] Table 4 Subframe Plate Parameter Table

[0203]

[0204] It should be noted that the aspect ratio refers to the ratio between the thickness of the sub-frame board and the diameter of the sub-via. The aspect ratio affects the reliability of the first frame board 310. When the aspect ratio of the sub-frame board is too large, it can lead to drill eccentricity and poor hole wall quality, thus affecting the connectivity and conductivity between sub-frame boards. Conversely, when the aspect ratio of the sub-frame board is too small, it increases the difficulty and cost of drilling, and also increases the fragility and breakage of the sub-frame board. In addition, the aspect ratio of the sub-frame board also affects the performance of the first frame board 310. A larger aspect ratio can improve the thermal conductivity of the sub-frame board, which is beneficial for heat dissipation and maintaining the stability of the circuit board. A smaller aspect ratio can improve the electromagnetic compatibility of the sub-frame board, reducing electromagnetic interference and signal crosstalk.

[0205] In some embodiments, the heat dissipation perforated plate 314 can be connected to the metal thermally conductive layer 315 on the fifth surface, thereby transferring heat from the inside of the first frame plate 310 to the outer surface, and then to the thermally conductive gel 505 via the outer surface. This enables rapid heat exchange between the inside and outside of the first frame plate 310, improving heat dissipation efficiency.

[0206] Figure 7H Another frame plate structure is shown. (Reference) Figure 7H As shown, with Figure 7G The difference between the first frame plate 310 shown is that the heat dissipation plate 314 can be made of thermally conductive adhesive 503, which simplifies the connection process between the first sub-frame plate and the second sub-frame plate, reduces costs, and improves the heat conduction effect.

[0207] In this embodiment, a first frame plate 310 with high thermal conductivity is connected to the corresponding area of ​​the SOC chip 601. Thermally conductive adhesive 503 is filled in the first receiving cavity 801, the third receiving cavity 803, and the fourth receiving cavity 804 around the SOC chip 601 for regional heat dissipation, which accelerates heat dissipation. Testing shows that compared to not using the first frame plate 310, the operating temperature of the SOC is reduced by approximately 2°C after adopting this method, thereby significantly improving the heat dissipation efficiency of the SOC chip 601, ensuring the stability of the SOC chip 601's operation, and thus improving the performance of the electronic device. Furthermore, the third receiving cavity 803 and the fourth receiving cavity 804 are filled with peelable thermally conductive gel 505. In the event of a circuit board assembly failure, the thermally conductive gel 505 can be peeled off, facilitating the repair of the circuit board assembly.

[0208] Figure 8 A circuit board assembly provided in another embodiment is shown. (Reference) Figure 8 As shown, with Figure 7A The circuit board assembly shown is different, Figure 8In the circuit board assembly shown, a thermally conductive layer is provided on the second and / or third surface to improve heat transfer efficiency.

[0209] Optionally, the thermally conductive layer disposed on the second and / or third surface can be a metallic thermally conductive layer, such as a thermally conductive layer formed of metals or alloys such as copper, silver, aluminum, zinc, and tin; the thermally conductive layer can also be a non-metallic thermally conductive layer, such as a thermally conductive ceramic coating or a thermally conductive resin coating.

[0210] In some embodiments, the thermally conductive layer 212 disposed on the second surface can be connected to the thermally conductive layers on the side surface of the first frame plate 310 (i.e., the fifth surface) and / or the side surface of the second frame plate 320 (i.e., the sixth surface) to form an integrated heat dissipation structure, thereby further improving heat transfer efficiency. Similarly, the thermally conductive layer 222 disposed on the third surface can be connected to the thermally conductive layers on the side surface of the first frame plate 310 (i.e., the fifth surface) and / or the side surface of the second frame plate 320 (i.e., the sixth surface) to form an integrated heat dissipation structure.

[0211] In other embodiments, the first circuit board 210, the second circuit board 220, and the first frame board 310 (or the second frame board 320) can be made of materials with high thermal conductivity. Specifically, the first circuit board 210 can be made of thermally conductive PP, and the thermal conductivity of the first circuit board 210 can be increased to 1 W / mK. Furthermore, pads are provided as a thermally conductive layer in the area where the second surface connects to the first frame board 310 (or the second frame board 320), which can improve the thermal conductivity of the first circuit board 210. Meanwhile, the thermally conductive material 313 used in the first frame board 310 (or the second frame board 320) can be thermally conductive silver paste, and the thermal conductivity of the first frame board 310 can be around 30 W / mK. Additionally, the first frame board 310 can be composed of two or more sub-frame boards (e.g.,...). Figure 7G and Figure 7H Thick copper connecting sidewalls can be used between adjacent sub-frame boards to improve the thermal conductivity of the upper and lower boards of the first frame board 310 and enhance the thermal conductivity of the sides of the first frame board 310. Furthermore, the second circuit board 220 can be an RF board. The second circuit board 220 can use high thermal conductivity RCC, be made of fiberglass-free material, and has a thermal conductivity of 2W / mk. Plating pads are provided as a thermal conductive layer in the area where the third surface connects to the first frame board 310 (or the second frame board 320), and a large area of ​​copper foil is provided on the third surface to improve the thermal conductivity of the second circuit board 220 and increase the contact area with the thermally conductive adhesive 503.

[0212] In this embodiment, a first frame plate 310 with high thermal conductivity is connected to the corresponding area of ​​the SOC chip 601. Thermally conductive adhesive 503 is filled in the first receiving cavity 801, the third receiving cavity 803, and the fourth receiving cavity 804 around the SOC chip 601 for regional heat dissipation. Furthermore, a large-area thermally conductive layer (copper foil) is provided on the second and third surfaces to accelerate heat dissipation. Testing showed that compared to not using the first frame plate 310, the operating temperature of the SOC is reduced by approximately 2°C after adopting this method, thereby significantly improving the heat dissipation efficiency of the SOC chip 601, ensuring the stability of the SOC chip 601's operation, and ultimately improving the performance of the electronic device.

[0213] refer to Figure 3A As shown, for the five-panel structure, the heat transfer path of the SOC chip 601 is as follows: first circuit board 210 → solder joint → solder pads of the second frame board 320 → vias in the second frame board 320 → solder pads of the second frame board 320 → solder joint → second circuit board 220 → solder joint → solder pads of the third frame board 330 → vias in the third frame board 330 → solder pads of the third frame board 330 → solder joint → third circuit board 230. It is evident that this heat dissipation path is relatively long, making it difficult to achieve rapid heat dissipation. Therefore, to accelerate heat dissipation, it is necessary to adjust this heat dissipation path.

[0214] Figure 9A A circuit board assembly provided in another embodiment is shown. (Reference) Figure 9A As shown, the circuit board assembly further includes: a third circuit board 230, which is stacked and spaced apart from the second circuit board 220 along a first direction, with the second circuit board 220 located between the first circuit board 210 and the third circuit board 230; a third frame plate 330, one end of which is connected to the second circuit board 220 along the first direction, and the other end of which is connected to the third circuit board 230; the third frame plate 330, the second circuit board 220, and the third circuit board 230 together form a fifth receiving cavity 805, which is connected to... Figure 3A The circuit board assembly shown is different in that the first receiving cavity 801, the third receiving cavity 803, and the fifth receiving cavity 805 are filled with thermally conductive gel 505, so that heat can be quickly transferred from the first circuit board 210 side to the third circuit board 230.

[0215] To shorten the heat dissipation path, the second frame plate 320, the second circuit board 220, and the third frame plate 330 can adopt an integrated heat dissipation method for heat transfer.

[0216] Specifically, Figure 9B A combined structure of a second frame board 320, a second circuit board 220, and a third frame board 330 is shown. (Reference) Figure 9BAs shown, the second frame board 320 and the second circuit board 220 can be connected by pressing, and the second circuit board 220 and the third frame board 330 can also be connected by pressing, thereby realizing high density interconnect (HDI).

[0217] The second frame plate 320 is provided with a plurality of second through holes along the first direction, and the second circuit board 220 is provided with a plurality of third through holes along the first direction; the third frame plate 330 is provided with a plurality of fourth through holes along the first direction; wherein, some of the second through holes, the third through holes and the fourth through holes are connected to form a fifth through hole, and the fifth through hole is filled with thermally conductive material 313.

[0218] refer to Figure 9B As shown, with the above design, the heat transfer path of the SOC chip 601 is as follows: first circuit board 210 → solder joint → pad of second frame board 320 → fifth through hole → pad of third frame board 330 → third circuit board 230. This significantly shortens the heat dissipation path, improving the heat dissipation efficiency of the SOC chip 601 and enhancing the heat dissipation performance of circuit board assemblies and electronic devices. Furthermore, filling the fifth through hole with a conductive thermally conductive material 313 shortens the impedance link between different circuit boards, achieving impedance continuity. It also reduces the number of connection ports (pads) between the frame board and the circuit board, thereby reducing insertion loss and improving over-the-air (OTA) testing performance (increasing by xDb, where x is a positive number less than 1).

[0219] In the above embodiment, a highly efficient heat conduction path design is adopted. Fifth through holes are provided in the second frame plate 320, the second circuit board 220, and the third frame plate 330, and thermally conductive material 313 is filled in the fifth through holes. This allows heat to be quickly transferred from the first circuit board 210 to the third circuit board 230, accelerating heat dissipation. Testing shows that compared to not having the first frame plate 310, the operating temperature of the SOC is reduced by approximately 2°C after adopting this method. This significantly improves the heat dissipation efficiency of the SOC chip 601, ensuring the stability of the SOC chip 601's operation and thus improving the performance of the electronic device.

[0220] To simplify the potting process and reduce the processing cost of the circuit board assembly by filling the third receiving cavity 803 and the fifth receiving cavity 805 with thermally conductive gel 505, a guide port can be provided in the circuit board assembly.

[0221] Specifically, Figure 10A A circuit board assembly provided in another embodiment is shown. (Reference) Figure 10AAs shown, the third circuit board 230 is provided with a first adhesive guide port 231 that passes through the third circuit board 230, and the second circuit board 220 is provided with a second adhesive guide port 223, which connects the third receiving cavity 803 and the fifth receiving cavity 805.

[0222] Figure 10B and Figure 10C An alternative embodiment of the combined structure of a second frame plate 320, a second circuit board 220, and a third frame plate 330 is shown. Figure 10B The image shown is the XZ cross-section of the composite structure. Figure 10C The image shows the YZ cross-section of the composite structure. (Reference) Figure 10B and Figure 10C As shown, with Figure 9B The difference in the combined structure shown is that the first frame plate 310, the second frame plate 320, the second circuit board 220, and the third frame plate 330 can be fabricated as a whole, and the first frame plate 310 can be regarded as a part of the second frame plate 320. Furthermore, the second frame plate 320 (first frame plate 310) is provided with adhesive guiding holes 322 arranged along the X direction, and the second circuit board 220 is provided with second adhesive guiding openings 223.

[0223] Figure 10D A physical diagram of a circuit board assembly is shown, for reference. Figure 10D As shown, the cavity is filled with thermally conductive gel 505, which can be poured into the cavity through the aforementioned gel channel.

[0224] Figure 10E A photograph of the disassembled cavity is shown for reference. Figure 10E As shown, the circuit board has three adhesive guide ports: adhesive guide port 1, adhesive guide port 2, and adhesive guide port 3. Thermal conductive gel 505 is poured into the receiving cavity through the aforementioned adhesive guide ports 1, 2, and 3, and the thermal conductive gel 505 can cover the electronic device.

[0225] In some embodiments, the first adhesive guide opening 231 can be disposed not only on the third circuit board 230, but also partially on the third frame plate 330. That is, a portion of the first adhesive guide opening 231 can be blocked by the third frame plate 330. Similarly, the second adhesive guide opening 223 can be disposed not only on the second circuit board 220, but also partially on the second frame plate 320. That is, a portion of the second adhesive guide opening 223 can be blocked by the second frame plate 320. Figure 10F A guide port location is shown for reference. Figure 10FAs shown, the adhesive guide opening can be partially located on the circuit board and partially located on the frame board. After the circuit board and the frame board are connected, the frame board covers part of the adhesive guide opening. In other embodiments, the adhesive guide opening can be located at the corner or bevel of the circuit board, thereby preventing the adhesive guide opening from affecting the arrangement of electronic components on the circuit board.

[0226] This embodiment allows for the infusion of thermally conductive gel 505 into multiple cavities. Furthermore, the integrated design of the second frame plate 320, the second circuit board 220, and the third frame plate 330 ensures impedance continuity, thereby preventing heat generation in the circuit board assembly due to impedance discontinuity during fast battery charging (high current). Simultaneously, the first frame plate 310, the second frame plate 320, the second circuit board 220, and the third frame plate 330 are integrally processed, allowing the third cavity 803 to be directly formed in the second frame plate 320, and the fifth cavity 805 to be directly formed in the third frame plate 330. Adhesive guide holes can be provided in the frame plates to connect different cavities. These guide holes can penetrate the second frame plate 320 and be located on either side or inside it. Thermally conductive gel 503 or urea-formaldehyde resin adhesive can be introduced into multiple cavities through the guide channels, thereby reducing the need for drilling in the circuit board assembly. Additionally, the guide ports can be located on the circuit board or partially overlap with the frame plate.

[0227] Figure 11A A circuit board assembly provided in another embodiment is shown. (Reference) Figure 11A As shown, with Figure 10A Unlike the circuit board assembly shown, the second circuit board 220 and the third circuit board 230 do not have glue guide ports. Instead, glue guide channels are set in the frame board. This avoids the glue guide ports occupying the circuit board area, increases the area on the circuit board where electronic devices can be placed, and improves the circuit board area utilization rate.

[0228] Specifically, refer to Figure 11A As shown, the second frame plate 320 has a first adhesive guiding channel 323 along the Z direction and a second adhesive guiding channel 324 along the X direction. The second adhesive guiding channel 324 connects the first adhesive guiding channel 323 with the third receiving cavity 803. The third frame plate 330 has a third adhesive guiding channel 331 along the Z direction and a fourth adhesive guiding channel 332 along the X direction. The fourth adhesive guiding channel 332 connects the third adhesive guiding channel 331 with the fifth receiving cavity 805. The second circuit board 220 has a fifth adhesive guiding channel 224 along the Z direction. The fifth adhesive guiding channel 224 connects a portion of the first adhesive guiding channel 323 and a portion of the third adhesive guiding channel 331.

[0229] In this embodiment, the dimensions of the first adhesive guiding channel 323, the second adhesive guiding channel 324, the third adhesive guiding channel 331, the fourth adhesive guiding channel 332, and the fifth adhesive guiding channel 224 can be the same or different. The diameter of the first adhesive guiding channel 323 can be 0.5mm-5mm, and its length can be 20%-100% of the dimension of the second frame plate 320 in the Z direction. The diameter of the second adhesive guiding channel 324 can be 0.5mm-5mm, and its length can be 20%-100% of the dimension of the second frame plate 320 in the X direction. The diameter of the third adhesive guiding channel 331 can be 0.5mm-5mm, and its length can be 20%-100% of the dimension of the third frame plate 330 in the Z direction. The diameter of the fourth adhesive guiding channel 332 can be 0.5mm-5mm, and its length can be 20%-100% of the dimension of the third frame plate 330 in the X direction. The diameter of the fifth adhesive guiding channel 224 can be 0.5mm-5mm.

[0230] Figure 11B This shows the location of another guide port. (Compared to...) Figure 10E The difference between the guide ports shown is that... Figure 11B The adhesive guide port shown is located in the area where the frame plate is located.

[0231] In this embodiment, the adhesive guiding channel is set in the frame plate, which can avoid the adhesive guiding port occupying the circuit board area and increase the area on the circuit board where electronic devices can be placed.

[0232] This application embodiment also provides a method for manufacturing a frame plate, which is used to manufacture the first frame plate 310 with high thermal conductivity mentioned above.

[0233] Figure 12A The flowchart of a method for manufacturing a frame plate according to one embodiment is shown, with reference to... Figure 12A As shown, the method may include:

[0234] S1201: Obtain the first plate 316 and the second plate 317.

[0235] The first plate 316 and the second plate 317 are used to fabricate a frame plate with high thermal conductivity (an example of the first frame plate 310). Optionally, the material of the first plate 316 can be glass fiber reinforced epoxy resin, polypropylene, polyimide, polytetrafluoroethylene, phenolic resin, polyethylene terephthalate, ceramics, etc. Optionally, the material of the second plate 317 can be glass fiber reinforced epoxy resin, polypropylene, polyimide, polytetrafluoroethylene, phenolic resin, polyethylene terephthalate, ceramics, etc. The materials of the first plate 316 and the second plate 317 can be the same or different.

[0236] The thickness of the first sheet material 316 can be 0.2mm-5mm. The thickness of the second sheet material 317 can be 0.2mm-5mm. The thicknesses of the first sheet material 316 and the second sheet material 317 can be the same or different.

[0237] S1202: The first plate 316 and the second plate 317 are connected along the first direction through the heat dissipation plate 314 to obtain the connection structure of the first plate 316.

[0238] The heat dissipation pad 314 can be formed by connecting pads. Specifically, before connecting the first plate 316 and the second plate 317 through the heat dissipation pad 314, a fifth pad 318 can be provided on the surface of the first plate 316 at one end along the first direction, and a sixth pad can be provided on the surface of the second plate 317 at one end along the first direction. Figure 12B A first substrate 316 with a fifth pad 318 and a second substrate 317 with a sixth pad are shown. The fifth pad 318 and the sixth pad are then soldered to connect the first substrate 316 and the second substrate 317 along a first direction via a heat dissipation pad 314. Figure 12C A first plate 316 connection structure is shown. (Reference) Figure 12C As shown, the fifth pad 318 and the sixth pad 319 are soldered together to form a heat dissipation plate 314. The thickness of the heat dissipation plate 314 is 9μm-100μm.

[0239] S1203: A first through hole 313a is formed in the first plate 316 connection structure.

[0240] After obtaining the first plate 316 connection structure, holes can be drilled in the first plate 316 connection structure to form a first through hole 313a that penetrates the first plate 316 connection structure. Figure 12D A connection structure for the first plate 316 after forming the first through hole 313a is shown. (Reference) Figure 12D As shown, the first through hole 313a penetrates the first plate 316, the heat dissipation plate 314, and the second plate 317 along the first direction. The diameter of the first through hole 313a is 0.1mm-3mm.

[0241] S1204: The first through hole 313a is filled with thermally conductive material 313.

[0242] After forming the first through hole 313a in the first plate 316 connection structure, thermally conductive material 313 can be filled into the first through hole 313a. Figure 12E A first plate 316 connection structure is shown after the first through hole 313a is filled with thermally conductive material 313.

[0243] In some embodiments, before filling the first through-hole 313a with thermally conductive material 313, electroless copper plating can be performed in the first through-hole 313a, followed by pulse electroplating of copper to form a conductive layer in the first through-hole 313a. Then, the thermally conductive material 313 is filled into the first through-hole 313a.

[0244] In some embodiments, after filling the first through hole 313a with thermally conductive material 313, a first pad 311 and a third pad 312 can be formed on two opposite surfaces of the first plate 316 connection structure along the first direction, and a metal thermally conductive layer can be formed on the fifth surface of the first plate 316 connection structure located at one end of the second direction. The first pad 311 and the third pad 312 are both connected to the metal thermally conductive layer 315 on the fifth surface, thereby obtaining the desired high thermal conductivity frame plate. Figure 12F The structure of a high thermal conductivity frame plate is shown.

[0245] Generally speaking, in the production Figure 3D When manufacturing the frame plate shown, since the inner walls of the vias are coated with a metal layer, in order to form a metal coating on the inner walls of the vias, after drilling the holes in the plate, it is usually necessary to remove adhesive residue, chemically treat the vias, form a metal coating using pulse electroplating, plug the holes with resin, grind smooth, and thin the metal coating. However, Figure 12A In the manufacturing method shown, since the thermally conductive material 313 is conductive, there is no need to use complex hole-filling electroplating technology during the manufacturing process of the frame plate. Only a horizontal vacuum hole-filling device is used to fill the holes with thermally conductive material 313, which simplifies the manufacturing process of the frame plate, improves processing efficiency, and reduces the manufacturing cost of the frame plate.

[0246] Figure 13A The flowchart illustrates a method for manufacturing a frame plate according to another embodiment. (Compared to...) Figure 12A The manufacturing method shown differs from the one described above. This method involves first drilling holes in the first plate 316 and the second plate 317 and filling them with thermally conductive material 313, then connecting the first plate 316 and the second plate 317 via a heat dissipation plate 314. Specifically, refer to... Figure 13A As shown, the method may include:

[0247] S1301: Obtain the first plate 316 and the second plate 317.

[0248] Figure 13B The structure of a first plate 316 and a second plate 317 is shown. Specific embodiments for obtaining the first plate 316 and the second plate 317 can be found in S1201, and will not be repeated here.

[0249] S1302: A first sub-through hole 313b is formed in the first plate 316 along the first direction to obtain a first sub-frame plate.

[0250] After obtaining the first plate 316, holes can be drilled in the first plate 316 to form a first sub-through hole 313b in the first plate 316. Figure 13C The structure of a first subframe plate and a second subframe plate is shown.

[0251] S1303: A second sub-through hole 313c is formed in the second plate 317 along the first direction to obtain the second sub-frame plate.

[0252] After obtaining the first plate 316, holes can be drilled in the first plate 316 to form a first sub-through hole 313b in the first plate 316.

[0253] S1304: Thermally conductive material 313 is filled into the first sub-through hole 313b and the second sub-through hole 313c respectively.

[0254] After obtaining the first sub-frame plate and the second sub-frame plate, thermally conductive material 313 is filled into the first sub-through hole 313b and the second sub-through hole 313c, respectively. Figure 13D The structure of a first subframe plate and a second subframe plate after being filled with thermally conductive material 313 is shown.

[0255] Thermally conductive material 313 is filled into the first sub-through hole 313b and the second sub-through hole 313c respectively. Since the first sub-through hole 313b and the second sub-through hole 313c are relatively short (relative to the first through hole 313a), the difficulty of plugging the holes can be reduced and the efficiency of filling the thermally conductive material 313 can be improved.

[0256] In some embodiments, before filling the first sub-via 313b and the second sub-via 313c with thermally conductive material 313, electroless copper plating can be performed on the first sub-via 313b and the second sub-via 313c respectively, followed by pulse electroplating of copper to form a conductive layer in the first sub-via 313b and the second sub-via 313c. Then, the thermally conductive material 313 is filled into the first sub-via 313b and the second sub-via 313c.

[0257] S1305: The first sub-frame plate and the second sub-frame plate are connected along the first direction through the heat dissipation plate 314.

[0258] The material of the upper heat dissipation plate 314 can be a conductive and thermally conductive material (e.g., conductive paste). The heat dissipation plate 314 is provided with through holes, and the first sub-through hole 313b, the through hole and the second sub-through hole 313c are aligned along the first direction to form the first through hole 313a. Figure 13EThe diagram illustrates a structure formed by connecting a first sub-frame plate and a second sub-frame plate. By fabricating the first and second sub-frame plates first, and then connecting them, the aspect ratio of the fabricated frame plate can be improved.

[0259] In some embodiments, after the first subframe plate and the second subframe plate are connected, a first pad 311 and a third pad 312 can be formed on two opposite surfaces of the first plate 316 connection structure along the first direction, and a metal thermally conductive layer can be formed on the fifth surface of the first plate 316 connection structure located at one end of the second direction. The first pad 311 and the third pad 312 are both connected to the metal thermally conductive layer 315 on the fifth surface, thereby obtaining the high thermal conductivity frame plate to be prepared. Figure 13F The structure of a high thermal conductivity frame plate is shown.

[0260] This application also provides a method for manufacturing a circuit board assembly, which is used to manufacture the circuit board assembly described above.

[0261] Figure 14 A flowchart of a method for manufacturing a circuit board assembly according to one embodiment is shown, with reference to... Figure 14 As shown, the method may include:

[0262] S1401: Obtain the first frame plate 310, the first frame plate 310 having a first end and a second end opposite to each other along a first direction.

[0263] The first frame plate 310 can be configured as described above. Figure 12A It can be manufactured using the same method as shown in 13A. The first frame plate 310 has a first through hole 313a, which is filled with a thermally conductive material 313.

[0264] S1402: Obtain a first circuit board 210, the first circuit board 210 having a first surface and a second surface disposed opposite to each other along a first direction.

[0265] The first circuit board 210 can be a motherboard, and the material of the first circuit board 210 can be thermally conductive polyethylene, thus having good thermal conductivity.

[0266] Multiple electronic devices are disposed on the first surface and the second surface. Among them, a heating device is disposed on the first surface.

[0267] S1403: Obtain a second circuit board 220, the second circuit board 220 including a third surface located at one end in a first direction.

[0268] The second circuit board 220 can be an RF board, and the material of the second circuit board 220 can be resin-coated copper (RCC).

[0269] Multiple electronic devices are mounted on the third surface.

[0270] S1404: Connect the first end of the first frame plate 310 to the second surface, and thermally connect the second end of the first frame plate 310 to the third surface.

[0271] After obtaining the first circuit board 210, the second circuit board 220, and the first frame board 310, the first end of the first frame board 310 can be connected to the second surface, and the second end of the first frame board 310 can be thermally connected to the third surface. The connection method between the first frame board 310 and the first circuit board 210 and the second circuit board 220 can be referred to the above. Figures 4A to 4G As shown, it will not be elaborated further here.

[0272] Figure 15A The flowchart of another embodiment of the circuit board assembly manufacturing method is shown. In this embodiment, by processing the third, fourth, and fifth substrates 220a, an integrated heat dissipation second frame plate 320, second circuit board 220, and third circuit board 230 can be obtained.

[0273] Specifically, refer to Figure 15A As shown, the method may include:

[0274] S1501: Obtain the third plate, the fourth plate, and the fifth plate 220a, wherein the fifth plate 220a has a third surface and a fourth surface that are opposite to each other along a first direction.

[0275] The third plate is used to form the second frame plate 320, the fourth plate is used to form the third frame plate 330, and the fifth plate 220a is used to form the second circuit board 220. By processing the third plate, the fourth plate, and the fifth plate 220a, a combined structure of the integrated heat dissipation second frame plate 320, the second circuit board 220, and the third circuit board 230 can be obtained.

[0276] S1502: The third plate is disposed on the third surface, and the fourth plate is disposed on the fourth surface.

[0277] To facilitate subsequent removal of a portion of the third sheet material, a first groove 703a is formed in the third sheet material. Before pressing the third sheet material onto the third surface, a layerable medium (e.g., ink 702) can be applied to the area on the third surface used to form the first groove 703a. Similarly, to facilitate subsequent removal of a portion of the fourth sheet material, a second groove 704a is formed in the fourth sheet material. Before pressing the fourth sheet material onto the fourth surface, a layerable medium (e.g., ink 702) can be applied to the area on the fourth surface used to form the second groove 704a. Figure 15BA structure of a fifth substrate 220a with a third and fourth surface printed with a layerable ink 702 is shown. (Reference) Figure 15B As shown, a first mask (e.g., copper foil) is disposed on the third surface. The first mask 701 is used to define a first region corresponding to the first groove 703a on the third surface, and to print layerable ink 702 in the first region. Similarly, a second mask (e.g., copper foil) is disposed on the fourth surface. The second mask 701 is used to define a second region corresponding to the second groove 704a on the fourth surface, and to print layerable ink 702 in the second region.

[0278] The third and fourth plates can be made of polyethylene. The third plate can be laminated onto the third surface, and the fourth plate can be laminated onto the fourth surface. Using lamination to achieve the connection reduces welding reflow and sealant failure. Figure 15C A structure is shown after the third and fourth plates are laminated onto the fifth plate 220a.

[0279] S1503: A plurality of fifth through holes are formed in the third plate, which sequentially penetrate the third plate, the fifth plate 220a and the fourth plate along the first direction.

[0280] After the third and fourth plates are pressed onto the fifth plate 220a, holes can be drilled in the resulting plate structure to form multiple fifth through holes that sequentially penetrate the third plate, the fifth plate 220a, and the fourth plate along the first direction.

[0281] Specifically, Figure 15D This illustrates a structure for drilling holes in a sheet metal structure obtained after lamination. (Reference) Figure 15D As shown, holes can be drilled in the sheet structure obtained after pressing to form a second through hole in the third sheet, a third through hole in the fifth sheet 220a, and a fourth through hole in the fourth sheet.

[0282] Next, a first groove 703a can be formed in the third plate, with the opening direction of the first groove 703a facing away from the fifth plate 220a and exposing a first region of the third surface. A second groove 704a is formed in the fourth plate, with the opening direction of the second groove 704a facing away from the fifth plate 220a and exposing a second region of the fourth surface.

[0283] The first groove 703a is used to form the chamber structure of the third receiving cavity 803, and the first region is used to house electronic devices. The second groove 704a is used to form the chamber structure of the fifth receiving cavity 805, and the second region is used to house electronic devices.

[0284] When forming the first groove 703a and the second groove 704a, a circumferential first removal groove 703 and a circumferential second removal groove 704 can be formed in the third plate. Figure 15E This illustrates a structure after creating a removal groove in a sheet metal structure. (Reference) Figure 15E As shown, the bottom of the first removal groove 703 (near the third surface) exposes pre-coated layerable ink 702, and the bottom of the second removal groove 704 (near the fourth surface) exposes pre-coated layerable ink 702.

[0285] Next, remove the board material from the first area and the board material from the second area, and clean the board material remaining in the through holes after drilling. Figure 15F The structure after removing excess sheet material is shown. (Reference) Figure 15F As shown, a first groove 703a is formed in the third plate, and a second groove 704a is formed in the fourth plate. Furthermore, a second through hole is formed in the third plate, a third through hole is formed in the fifth plate 220a, and a fourth through hole is formed in the fourth plate. Among the third through holes, some are only connected to the second through hole, some are only connected to the fourth through hole, and some are connected to both the second and fourth through holes to form a fifth through hole.

[0286] S1504: Fill the fifth through hole with thermally conductive material 313.

[0287] The fifth through hole is formed by connecting the second, third, and fourth through holes. After obtaining the second, third, and fourth through holes, thermally conductive material 313 can be filled into the second, third, and fourth through holes to obtain a combined structure of the integrated heat dissipation second frame plate 320, the second circuit board 220, and the third circuit board 230. Figure 15G A structure after filling with thermally conductive material 313 is shown. (Reference) Figure 15G As shown, the second, third, and fourth through holes are filled with thermally conductive material 313.

[0288] In some embodiments, thermally conductive material 313 may be filled into the second, third, and fourth through holes first, and then the plate material on the first region and the plate material on the second region may be removed. That is, after obtaining Figure 15D After the structure shown, the residual board material in the through holes can be removed first.

[0289] Specifically, Figure 15H The structure after removing residual plate from a through-hole is shown. (Reference) Figure 15HAs shown, a second through hole is formed in the third plate, a third through hole is formed in the fifth plate 220a, and a fourth through hole is formed in the fourth plate. Among the third through holes, some third through holes only communicate with the second through hole, some third through holes only communicate with the fourth through hole, and some third through holes communicate with both the second and fourth through holes to form a fifth through hole.

[0290] Next, thermally conductive material 313 is filled into the second, third, and fourth through holes. Figure 15I The structure after filling with thermally conductive material 313 is shown.

[0291] Next, a first circumferential removal groove 703 is formed in the third plate, and a second circumferential removal groove 704 is formed in the third plate. Figure 15J This illustrates a structure after creating a removal groove in a sheet metal structure. (Reference) Figure 15J As shown, the bottom of the first removal groove 703 (near the third surface) exposes pre-coated layerable ink 702, and the bottom of the second removal groove 704 (near the fourth surface) exposes pre-coated layerable ink 702.

[0292] Finally, by removing the boards from the first region and the second region, we can obtain... Figure 15G The diagram shows a combined structure of an integrated heat dissipation second frame plate 320, a second circuit board 220, and a third circuit board 230.

[0293] In other embodiments, after obtaining Figure 15G After the integrated heat dissipation second frame plate 320, second circuit board 220 and third circuit board 230 shown, a second adhesive guide port 223 can be provided on the fifth plate 220a, and a sixth plate can be stacked on the fourth plate.

[0294] Specifically, a second adhesive guide opening 223 is formed on the fifth plate 220a, penetrating the fifth plate 220a. The second adhesive guide opening 223 connects the first groove 703a and the second groove 704a. A sixth plate is stacked on the fourth plate, and the sixth plate covers the opening of the second groove 704a. A first adhesive guide opening 231 is formed on the sixth plate, penetrating the sixth plate, and the first adhesive guide opening 231 connects to the second groove 704a.

[0295] Please refer to [link / reference] for the specific location and function of the guide port. Figure 11A and Figure 11B As shown, it will not be elaborated further here.

[0296] In other embodiments, after obtaining Figure 15GAfter the combination structure of the integrated heat dissipation second frame plate 320, second circuit board 220 and third circuit board 230 shown, adhesive guiding channels can also be formed in the third plate, fourth plate and fifth plate 220a.

[0297] Specifically, a first adhesive channel 323 extending in the first direction can be formed in the third plate, a third adhesive channel 331 extending in the first direction can be formed in the fourth plate, and a fifth adhesive channel 224 extending in the first direction can be formed on the fifth plate 220a. The first adhesive channel 323, the fifth adhesive channel 224, and the third adhesive channel 331 are connected in sequence. Figure 15K This illustrates a structure after creating an adhesive channel in a first direction within a sheet material structure. (Reference) Figure 15K As shown, in the fifth adhesive channel 224, some fifth adhesive channels 224 are only connected to the first adhesive channel 323, some fifth adhesive channels 224 are only connected to the third adhesive channel 331, and some fifth adhesive channels 224 are connected to both the first adhesive channel 323 and the third adhesive channel 331.

[0298] Next, a second adhesive channel 324 along the second direction is formed in the third board, and a fourth adhesive channel 332 along the second direction is formed in the fourth board. Figure 15L This illustrates a structure with a second-direction adhesive channel created within the sheet material. (Reference) Figure 15L As shown, the second adhesive channel 324 connects the first adhesive channel 323 and the first groove 703a, and the fourth adhesive channel 332 connects the third adhesive channel 331 and the second groove 704a.

[0299] In some embodiments, a conductive plating layer may also be formed in the adhesive channel. Figure 15M This illustrates a structure after a conductive plating layer has been formed in the adhesive channel. (Reference) Figure 15M As shown, the conductive coating can be formed by electroplating metal, such as copper. The conductive coating is formed on the sidewalls of the adhesive channel.

[0300] It should be noted that the main function of the adhesive guiding channels is to inject thermally conductive gel 505 into the first groove 703a (for forming the third receiving cavity 803) and the second groove 704a (for forming the fifth receiving cavity 805). Therefore, the second adhesive guiding channel 324 and the fourth adhesive guiding channel 332 should not penetrate the sidewalls of the grooves. However, during the formation of the second adhesive guiding channel 324 and the fourth adhesive guiding channel 332, for ease of processing, the formed second adhesive guiding channel 324 and the fourth adhesive guiding channel 332 often penetrate the sidewalls of the grooves. Therefore, in some embodiments, after forming a conductive plating layer in the adhesive guiding channels, the sidewalls of the grooves penetrated by the second adhesive guiding channel 324 and the fourth adhesive guiding channel 332 can be sealed. Figure 15NThis diagram illustrates a structure that seals the second adhesive channel 324 and the fourth adhesive channel 332. (Reference) Figure 15N As shown, the sidewall of the groove through which the second adhesive channel 324 and the fourth adhesive channel 332 pass can be sealed with a plugging glue plug 705 to prevent leakage of the thermal conductive gel 505 during the subsequent glue pouring process.

[0301] In some embodiments, after obtaining Figure 15I After the structure shown, adhesive channels can be formed in the board structure first, and then the board in the first area and the board in the second area can be removed.

[0302] Specifically, Figure 15O This illustrates a structure with adhesive guiding channels in a first and second direction created within the sheet material. (Reference) Figure 15O As shown, a first adhesive guiding channel 323 extending in a first direction is formed in the third plate, a third adhesive guiding channel 331 extending in the first direction is formed in the fourth plate, and a fifth adhesive guiding channel 224 extending in the first direction is formed on the fifth plate 220a. The first adhesive guiding channel 323, the fifth adhesive guiding channel 224, and the third adhesive guiding channel 331 are sequentially connected. A second adhesive guiding channel 324 extending in a second direction is formed in the third plate, and a fourth adhesive guiding channel 332 extending in a second direction is formed in the fourth plate. The second adhesive guiding channel 324 connects the first adhesive guiding channel 323 and the first groove 703a, and the fourth adhesive guiding channel 332 connects the third adhesive guiding channel 331 and the second groove 704a.

[0303] Figure 15P Another structure is shown after forming a conductive plating layer in the adhesive channel. (Reference) Figure 15P As shown, the conductive coating can be formed by electroplating metal, such as copper. The conductive coating is formed on the sidewalls of the adhesive channel.

[0304] Next, a first circumferential removal groove 703 is formed in the third plate, and a second circumferential removal groove 704 is formed in the third plate. Figure 15Q This illustrates a structure after creating a removal groove in a sheet metal structure. (Reference) Figure 15Q As shown, the bottom of the first removal groove 703 (near the third surface) exposes pre-coated layerable ink 702, and the bottom of the second removal groove 704 (near the fourth surface) exposes pre-coated layerable ink 702.

[0305] Finally, the board material in the first region and the board material in the second region are removed, and the sidewall of the groove through which the second adhesive channel 324 and the fourth adhesive channel 332 are connected is sealed with a plugging adhesive 705, thus obtaining... Figure 15R The diagram shows a combined structure of an integrated heat dissipation second frame plate 320, a second circuit board 220, and a third circuit board 230.

[0306] This application also provides an electronic device, which includes a housing 110 and a circuit board assembly. The circuit board assembly is the one described above, and it is disposed within the housing 110.

[0307] In the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0308] In the embodiments of this application, it should be understood that the directional terms mentioned, such as "up", "down", "left", "right", "inner", "outer", etc., are only for reference to the direction of the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0309] In the embodiments of this application, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," "third," and "fourth" may explicitly or implicitly include one or more of that feature.

[0310] In embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0311] In the embodiments of this application, "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0312] In the embodiments of this application, it should be noted that the descriptions of "vertical" and "parallel" respectively indicate approximately vertical and approximately parallel within a certain error range. This error range can be a range with a deviation angle of less than or equal to 5°, 8° or 10° relative to absolute verticality and absolute parallelism, respectively, and is not specifically limited here.

[0313] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A circuit board assembly, characterized in that, It includes a first circuit board and a second circuit board stacked and spaced apart along a first direction; wherein, The first circuit board has a first surface facing away from the second circuit board and a second surface facing the second circuit board, and a heating device is disposed on one of the first surface and the second surface; The second circuit board has a third surface facing the first circuit board; The circuit board assembly further includes a first frame plate disposed between the first circuit board and the second circuit board. The first frame plate has a first end and a second end opposite to each other along the first direction. The first end is connected to the second surface, and the second end is thermally connected to the third surface. A first through hole is provided in the first frame plate along the first direction, and the first through hole is filled with a thermally conductive material.

2. The circuit board assembly according to claim 1, characterized in that, The heating element is disposed on the first surface, and the orthographic projection of the first frame plate on the first plane at least partially coincides with the orthographic projection of the heating element on the first plane; wherein, the first plane is perpendicular to the first direction.

3. The circuit board assembly according to claim 1, characterized in that, The first end is provided with a first pad, and the second surface is provided with a second pad, wherein the first pad and the second pad are soldered together; or; The second end is provided with a third pad, and the third surface is provided with a fourth pad, and the third pad is soldered to the fourth pad.

4. The circuit board assembly according to claim 1, characterized in that, A first electronic device is disposed on the third surface, and thermally conductive adhesive is disposed on the first electronic device, with the second end attached to the thermally conductive adhesive.

5. The circuit board assembly according to any one of claims 1 to 4, characterized in that, The circuit board assembly further includes a first shielding cover, which is disposed on the first surface and together with the first surface forms a first receiving cavity, and the heating device is located in the first receiving cavity.

6. The circuit board assembly according to claim 5, characterized in that, The first cavity is filled with thermally conductive adhesive.

7. The circuit board assembly according to claim 5, characterized in that, A dam is also provided on the first surface; The dam and the first surface together form a second receiving cavity, the heating device is located in the second receiving cavity, and the second receiving cavity is filled with thermally conductive adhesive.

8. The circuit board assembly according to claim 7, characterized in that, The distance between the dam and the heating device is 0.5mm-3mm.

9. The circuit board assembly according to claim 1, characterized in that, The circuit board assembly also includes: The second frame plate has one end connected to the second surface along the first direction and the other end connected to the third surface along the first direction; the second frame plate, the first circuit board and the second circuit board together form a third receiving cavity, and the first frame plate is disposed in the third receiving cavity.

10. The circuit board assembly according to claim 9, characterized in that, The third cavity is filled with a peelable thermally conductive gel.

11. The circuit board assembly according to claim 10, characterized in that, The second circuit board has a fourth surface facing away from the first circuit board; The circuit board assembly further includes a second shield, which is disposed on the fourth surface and together with the fourth surface forms a fourth receiving cavity, which is filled with the thermally conductive gel.

12. The circuit board assembly according to claim 10 or 11, characterized in that, The peel strength of the thermally conductive gel is less than 10 PSI / mm. 2 .

13. The circuit board assembly according to claim 9, characterized in that, The first frame plate has a fifth surface located at one end in the second direction, and a metal thermally conductive layer is disposed on the fifth surface; the second direction is perpendicular to the first direction; The second frame plate has a sixth surface located at one end in the second direction, and a metal thermally conductive layer is disposed on the sixth surface.

14. The circuit board assembly according to claim 13, characterized in that, A metal thermally conductive layer is disposed on the second surface, and the metal thermally conductive layer on the second surface is connected to the metal thermally conductive layer on the fifth surface; and / or, A metal thermally conductive layer is disposed on the third surface, and the metal thermally conductive layer on the third surface is connected to the metal thermally conductive layer on the fifth surface.

15. The circuit board assembly according to claim 13, characterized in that, The first frame plate includes a first sub-frame plate and a second sub-frame plate stacked along a first direction, wherein the second sub-frame plate is located between the first sub-frame plate and the second circuit board; The first sub-frame plate is provided with a plurality of first sub-through holes along the first direction, and the second sub-frame plate is provided with a plurality of second sub-through holes along the first direction, wherein the plurality of first sub-through holes and the plurality of second sub-through holes correspond one-to-one; A heat dissipation perforation plate is provided between the first sub-frame plate and the second sub-frame plate. The heat dissipation perforation plate is provided with multiple through holes, and the corresponding first sub-through hole and second sub-through hole are connected through one of the through holes. The heat dissipation perforation plate is connected to the metal thermally conductive layer on the fifth surface.

16. The circuit board assembly according to claim 9, characterized in that, The second frame plate is provided with a plurality of second through holes along the first direction, and the second circuit board is provided with a plurality of third through holes along the first direction; The circuit board assembly also includes: The third circuit board is stacked and spaced apart from the second circuit board along the first direction, and the second circuit board is located between the first circuit board and the third circuit board; A third frame plate, one end of which is connected to the second circuit board along the first direction, and the other end of which is connected to the third circuit board along the first direction; the third frame plate is provided with a plurality of fourth through holes along the first direction; In this configuration, a portion of the second through hole connects with the third and fourth through holes to form a fifth through hole, which is filled with a thermally conductive material.

17. The circuit board assembly according to claim 16, characterized in that, The third frame plate, the second circuit board, and the third circuit board together form a fifth receiving cavity; The third circuit board is provided with a first adhesive guide opening that passes through the third circuit board, and the second circuit board is provided with a second adhesive guide opening that connects the third receiving cavity and the fifth receiving cavity.

18. The circuit board assembly according to claim 16, characterized in that, The third frame plate, the second circuit board, and the third circuit board together form a fifth receiving cavity; The second frame plate is provided with a first adhesive guiding channel along the first direction and a second adhesive guiding channel along the second direction. The second adhesive guiding channel connects the first adhesive guiding channel with the third receiving cavity. The second direction is perpendicular to the first direction. The third frame plate is provided with a third adhesive guiding channel along the first direction and a fourth adhesive guiding channel along the second direction, and the fourth adhesive guiding channel connects the third adhesive guiding channel with the fifth receiving cavity; The second circuit board is provided with a fifth adhesive guiding channel along the first direction, and the fifth adhesive guiding channel connects part of the first adhesive guiding channel and part of the third adhesive guiding channel.

19. The circuit board assembly according to claim 9, characterized in that, The circuit board assembly further includes a fourth circuit board, which is disposed in the third receiving cavity. The fourth circuit board is stacked and spaced apart from the first circuit board and the second circuit board along the first direction. The fourth circuit board is connected to the surface of the first frame plate along the second direction on one side along the second direction.

20. The circuit board assembly according to claim 1, characterized in that, The thermally conductive material is electrically conductive.

21. A method for manufacturing a frame panel, characterized in that, include: Obtain the first and second boards; The first plate and the second plate are connected along the first direction by a heat dissipation plate to obtain the first plate connection structure; A first through hole is formed in the first plate connection structure; the first through hole penetrates the first plate, the heat dissipation plate and the second plate along the first direction; The first through hole is filled with thermally conductive material.

22. The manufacturing method according to claim 21, characterized in that, The heat dissipation pad includes a fifth pad and a sixth pad; The method of connecting the first plate and the second plate along the first direction via a heat dissipation perforated plate includes: A fifth pad is provided on the surface of the first plate at one end along the first direction, and a sixth pad is provided on the surface of the second plate at one end along the first direction. The fifth and sixth pads are soldered to connect the first and second plates along a first direction via a heat dissipation perforated plate.

23. The manufacturing method according to claim 21, characterized in that, The method further includes: A first pad and a third pad are formed on two surfaces opposite to each other along the first direction of the first plate connection structure; A metal thermally conductive layer is formed on the fifth surface of the first plate connection structure located at one end in the second direction, and the first pad and the third pad are both connected to the metal thermally conductive layer on the fifth surface; wherein, the second direction is perpendicular to the first direction.

24. A method for manufacturing a frame panel, characterized in that, include: Obtain the first and second boards; A first sub-through hole is formed in the first plate material along a first direction to obtain a first sub-frame plate; A second sub-through hole is formed in the second plate material along the first direction to penetrate the second plate material, thereby obtaining a second sub-frame plate; Thermally conductive material is filled into the first sub-through hole and the second sub-through hole, respectively; The first sub-frame plate and the second sub-frame plate are connected along the first direction by a heat dissipation perforation plate; wherein, the heat dissipation perforation plate is provided with through holes, and the first sub-through hole, the through hole and the second sub-through hole are aligned along the first direction to form a first through hole.

25. A method for manufacturing a circuit board assembly, characterized in that, include: A first frame plate is obtained, wherein the first frame plate is manufactured by the frame plate manufacturing method according to any one of claims 21 to 24, and the first frame plate has a first end and a second end opposite to each other along the first direction. A first circuit board is obtained, the first circuit board having a first surface and a second surface disposed opposite to each other along the first direction, and a heating device is disposed on the first surface. Obtain a second circuit board, the second circuit board including a third surface located at one end in the first direction; The first end of the first frame plate is connected to the second surface, and the second end of the first frame plate is thermally connected to the third surface.

26. A method for manufacturing a circuit board assembly, characterized in that, include: Obtain a third plate, a fourth plate, and a fifth plate; wherein the fifth plate has a third surface and a fourth surface that are opposite to each other along a first direction; The third plate is disposed on the third surface, and the fourth plate is disposed on the fourth surface; Multiple fifth through holes are formed in the third plate material, which sequentially penetrate the third plate material, the fifth plate material, and the fourth plate material along the first direction; The fifth through hole is filled with thermally conductive material.

27. The manufacturing method according to claim 26, characterized in that, The method further includes: A first groove is formed in the third plate, the opening direction of the first groove is towards the direction of the third plate away from the fifth plate, and the first groove exposes a first area of ​​the third surface; A second groove is formed in the fourth plate, the opening direction of the second groove is towards the fourth plate and away from the fifth plate, and the second groove exposes a second area of ​​the fourth surface.

28. The manufacturing method according to claim 27, characterized in that, The method further includes: A second adhesive guide opening is formed on the fifth plate, which penetrates the fifth plate and connects the first groove and the second groove. A sixth plate is stacked on the fourth plate, and the sixth plate covers the opening of the second groove; A first adhesive guide opening is formed on the sixth plate, and the first adhesive guide opening communicates with the second groove.

29. The manufacturing method according to claim 27, characterized in that, The method further includes: A first adhesive guiding channel extending along the first direction is formed in the third plate, a third adhesive guiding channel extending along the first direction is formed in the fourth plate, and a fifth adhesive guiding channel extending along the first direction is formed on the fifth plate, wherein the first adhesive guiding channel, the fifth adhesive guiding channel, and the third adhesive guiding channel are sequentially connected. A second adhesive guiding channel along the second direction is formed in the third plate, and a fourth adhesive guiding channel along the second direction is formed in the fourth plate; wherein, the second adhesive guiding channel connects the first adhesive guiding channel and the first groove, and the fourth adhesive guiding channel connects the third adhesive guiding channel and the second groove; the second direction is perpendicular to the first direction.

30. An electronic device, characterized in that, include: case; A circuit board assembly, wherein the circuit board assembly is any one of claims 1-20, and the circuit board assembly is disposed within the housing.

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