Wafer box temporary storage assembly and transfer method
By designing a wafer cassette temporary storage component that integrates a housing, storage compartments, robotic arm, and sealed door, a high-cleanliness transport interface is constructed, which solves the contamination risk in the traditional wafer cassette transport process and improves the continuity and efficiency of the production process.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- BEIJING HEQI PRECISION TECH LTD
- Filing Date
- 2026-03-19
- Publication Date
- 2026-07-24
AI Technical Summary
Traditional wafer storage components pose a risk of wafer contamination during transport in processes requiring high cleanliness, and also suffer from low production process continuity and efficiency.
A wafer cassette temporary storage component was designed, which integrates a housing, storage compartments, a vertical multi-segment robotic arm, and a sealed door. Through the composite motion of the sealed door and the environmental control unit, a high-cleanliness transfer interface is constructed, realizing integrated control of the clean environment between the wafer cassette and the process equipment.
It effectively solves the contamination risk of wafer cells during transportation, improves the continuity and efficiency of the production process, adapts to the cleanliness requirements of different process equipment, and improves product yield.
Smart Images
Figure CN122458736A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor manufacturing equipment technology, and more specifically, to a wafer cassette temporary storage component and a transmission method. Background Technology
[0002] In highly automated semiconductor chip manufacturing plants, wafers need to flow sequentially between various independent process equipment (such as lithography machines, ion implanters, chemical vapor deposition equipment, annealing furnaces, etc.). To protect wafers from environmental contamination and physical damage, they are typically stored, transported, and transferred in standard front-opening wafer cassettes. Automated material handling systems, such as overhead cranes or automated guided vehicles (AGVs), are responsible for moving these wafer cassettes throughout the entire workshop.
[0003] To match the different processing cycles between AMHS and specific process equipment and to cope with possible temporary equipment downtime, temporary storage buffer components are usually set up at the inlet of critical process equipment. The main functions of traditional temporary storage components are physical storage and sequential queue management. The typical workflow is as follows: AMHS sends wafer cassettes to the loading port of the temporary storage component, and the robotic arm inside the component stores them in the internal storage rack; when the process equipment is ready, the robotic arm then takes the designated wafer cassette from the storage position and moves it to a transition position or places it directly on the standard loading port of the process equipment. However, this traditional mode has significant technical drawbacks, especially in advanced processes with extremely stringent requirements for cleanliness, oxygen and moisture content.
[0004] Therefore, there is an urgent need in this field for an innovative wafer cassette temporary storage solution that can not only achieve efficient storage and handling, but also proactively build a controlled and highly clean transfer interface between the temporary storage stage and the process equipment, fundamentally solving the risk of contamination of wafers in the "last stage" of transfer and improving the continuity and efficiency of the production process. Summary of the Invention
[0005] In view of this, in order to solve the above-mentioned problems in the prior art, this application provides a wafer cassette temporary storage component and a transmission method.
[0006] The embodiments of this application are implemented as follows: In a first aspect, this application provides a wafer cassette temporary storage assembly, including a housing, multiple storage bays, a vertical multi-segment robotic arm, and a sealed door; The housing is provided with a loading port and an unloading port. The loading port is used to receive wafer cassettes, and the unloading port is used to send wafer cassettes to downstream process equipment. Multiple storage positions are provided inside the housing for storing wafer cassettes. A vertical multi-segment robotic arm is provided inside the housing for transferring wafer cassettes between the storage positions, the loading port, and the unloading port. A sealing door is provided outside the unloading port. The sealing door includes an outer panel, an inner panel, a sealing strip, and a pin; The outer panel is movably disposed on the housing and is used to open or close the unloading port channel; The inner plate is connected to the outer plate and can move synchronously with the outer plate. The inner plate can also move relative to the outer plate to move closer to or further away from the wafer cassette located at the unloading port. The sealing strip is disposed on the edge of the inner plate facing the wafer box, and is used to form a seal by abutting against the cover of the wafer box when the inner plate is close to the wafer box; The pin is disposed on the outer plate and is rotatable, used to open the cover of the wafer cassette after the sealing strip abuts and seals against the cover of the wafer cassette.
[0007] In one possible implementation, the outer panel is movably disposed on the housing along a first horizontal direction, and the inner panel is movably connected to the outer panel along a second horizontal direction, wherein the first horizontal direction and the second horizontal direction are perpendicular to each other.
[0008] In one possible implementation, the sealing door further includes a first driving mechanism and a second driving mechanism. The first driving mechanism is connected to the outer panel and is used to drive the outer panel to move along the first horizontal direction. The second driving mechanism is connected to the inner panel and is used to drive the inner panel to move along the second horizontal direction.
[0009] In one possible implementation, a precision positioning platform is provided at the unloading port, which is used to precisely position the wafer cassette placed by the vertical multi-segment robotic arm.
[0010] One possible implementation also includes a controller; The controller is electrically connected to the vertical multi-segment robotic arm and is used to control the vertical multi-segment robotic arm to transfer wafer boxes. The controller is electrically connected to the sealing door and is used to control the movement of the inner plate, the movement of the outer plate, and the rotation of the pin.
[0011] In one possible implementation, the sealing door further includes a first position sensor and a second position sensor; The first position sensor is used to detect the position of the outer plate as it moves into place; The second position sensor is used to detect the position of the inner plate or the contact force between the sealing strip and the wafer box cover; Both the first position sensor and the second position sensor are electrically connected to the controller.
[0012] In one possible implementation, an environmental control unit is also included; The environmental control unit includes an air inlet and a gas pressure sensor; The air inlet is used to deliver clean gas into the sealed space formed by the sealing strip and the wafer cassette cover. The gas pressure sensor is used to monitor the gas pressure within the sealed space; The environmental control unit is electrically connected to the controller, and the controller controls the gas delivery at the air inlet based on feedback from the gas pressure sensor.
[0013] In one possible implementation, the sealing door is a modular structure and is detachably installed at the unloading port of the housing.
[0014] Secondly, this application provides a method for transferring wafer cassette temporary storage components, including: Transfer the target wafer cassette to the unloading port; The outer panel of the movable sealing door is used to close the unloading port passage; The inner panel of the movable sealing door is close to the target wafer box, so that the sealing strip on the inner panel abuts against the cover of the target wafer box to form a sealed space; Rotate the pin on the outer panel to open the cover of the target wafer cassette.
[0015] In one possible implementation, prior to the step of rotating the pin disposed on the outer plate, the method further includes: The environmental control unit delivers clean gas into the sealed space and monitors and maintains the gas pressure in the sealed space at a preset positive pressure.
[0016] The technical solution provided in this application can achieve at least the following beneficial effects: This application provides a wafer cassette storage component and transfer method that deeply integrates active sealing and opening functions into the wafer cassette storage process. By constructing a sealing door mechanism with composite motion and active execution capabilities, it achieves high reliability assurance of the internal clean environment of the wafer cassette during transfer between the storage location and downstream process equipment. This solves the problem in traditional processes where the wafer cassette may be exposed to a lower cleanliness environment, leading to contamination or oxidation, when it moves between the storage area and the equipment load port. It changes the previous separate construction approach where "the storage is only responsible for storage, and the process equipment is responsible for the interface sealing" and establishes a unified transfer interface standard of "pre-establishing a local clean microenvironment at the unloading port". This achieves integrated and continuous control of the internal clean environment of the wafer cassette from the storage location to the process equipment.
[0017] The wafer cassette temporary storage component is designed to closely meet the stringent process requirements for cleanliness of the transfer interface in semiconductor manufacturing. Its modular sealing and opening assembly, programmable controller coordination logic, and optional environmental control unit can flexibly adapt to the docking requirements of different process equipment (such as annealing, etching, and deposition equipment) and gas environment (such as nitrogen and dry air) specifications, providing an effective physical guarantee for wafer transfer in highly sensitive processes. This component has high configurability and scalability, and can quickly adjust mechanical parameters and control processes according to changes in production line layout, equipment type, and cleanliness level requirements. This helps to solve the problem of incomplete data (i.e., wafer status) contamination coverage that may be caused by "cleanliness blind spots" in the transfer process in the traditional mode, as well as the problem of equipment waiting time loading delays caused by process fragmentation, thereby significantly improving the timeliness of production cycle and the availability of final product yield. Attached Figure Description
[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0019] Figure 1 This is a schematic diagram of the structure of a wafer cassette temporary storage component shown in an exemplary embodiment of this application; Figure 2 This is a schematic diagram of the structure of an open portion of a wafer cassette storage component housing, as shown in an exemplary embodiment of this application. Figure 3 This is a schematic flowchart illustrating a wafer cassette temporary storage component transfer method according to an exemplary embodiment of this application.
[0020] Figure label: 1. Box body; 2. Storage compartment; 3. Vertical multi-segment robotic arm; 4. Sealed door. Detailed Implementation
[0021] To make the objectives, implementation methods and advantages of this application clearer, the exemplary implementation methods of this application will be clearly and completely described below with reference to the accompanying drawings of the exemplary embodiments of this application. Obviously, the exemplary embodiments described are only some embodiments of this application, and not all embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.
[0022] It should be noted that the brief descriptions of terms in this application are only for the convenience of understanding the embodiments described below, and are not intended to limit the embodiments of this application. Unless otherwise stated, these terms should be understood in their ordinary and common meaning.
[0023] The terms "first," "second," "third," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar or related objects or entities, and do not necessarily imply a specific order or sequence, unless otherwise specified. It should be understood that such terms are interchangeable where appropriate.
[0024] The terms “comprising” and “having”, and any variations thereof, are intended to cover but not exclude inclusion, for example, a product or device that includes a range of components is not necessarily limited to all of the components that are clearly listed, but may include other components that are not clearly listed or that are inherent to such product or device.
[0025] In highly automated semiconductor chip manufacturing plants, wafers need to flow sequentially between various independent process equipment (such as lithography machines, ion implanters, chemical vapor deposition equipment, annealing furnaces, etc.). To protect wafers from environmental contamination and physical damage, they are typically stored, transported, and transferred in standard front-opening wafer cassettes. Automated material handling systems, such as overhead cranes or automated guided vehicles (AGVs), are responsible for moving these wafer cassettes throughout the entire workshop.
[0026] To match the different processing cycles between AMHS and specific process equipment and to cope with possible temporary equipment downtime, temporary storage buffer components are usually set up at the inlet of critical process equipment. The main functions of traditional temporary storage components are physical storage and sequential queue management. The typical workflow is as follows: AMHS sends wafer cassettes to the loading port of the temporary storage component, and the robotic arm inside the component stores them in the internal storage rack; when the process equipment is ready, the robotic arm then takes the designated wafer cassette from the storage position and moves it to a transition position or places it directly on the standard loading port of the process equipment. However, this traditional mode has significant technical drawbacks, especially in advanced processes with extremely stringent requirements for cleanliness, oxygen and moisture content.
[0027] Therefore, there is an urgent need in this field for an innovative wafer cassette temporary storage solution that can not only achieve efficient storage and handling, but also proactively build a controlled and highly clean transfer interface between the temporary storage stage and the process equipment, fundamentally solving the risk of contamination of wafers in the "last stage" of transfer and improving the continuity and efficiency of the production process.
[0028] Next, the technical solutions of this application and how they solve the aforementioned technical problems will be described in detail through embodiments and in conjunction with the accompanying drawings. The embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. Obviously, the described embodiments are only some, not all, of the embodiments of this application.
[0029] In one exemplary embodiment, such as Figure 1 and Figure 2 As shown, a wafer cassette storage component is provided. In this embodiment, the wafer cassette storage component may include: It includes a cabinet 1, multiple storage compartments 2, a vertical multi-segment robotic arm 3, and a sealed door 4; The housing 1 is provided with a loading port and an unloading port. The loading port is used to receive wafer cassettes, and the unloading port is used to send wafer cassettes to downstream process equipment. Multiple storage slots 2 are provided inside the housing 1 for storing wafer cassettes. The vertical multi-segment robotic arm 3 is provided inside the housing 1 for transferring wafer cassettes between the storage slots 2, the loading port and the unloading port. The sealing door 4 is provided outside the unloading port. The sealing door 4 includes an outer panel, an inner panel, a sealing strip, and a pin; The outer panel is movably disposed on the housing 1 and is used to open or close the unloading port channel; The inner plate is connected to the outer plate and can move synchronously with the outer plate. The inner plate can also move relative to the outer plate to move closer to or further away from the wafer cassette located at the unloading port. The sealing strip is disposed on the edge of the inner plate facing the wafer box, and is used to form a seal by abutting against the cover of the wafer box when the inner plate is close to the wafer box; The pin is disposed on the outer plate and is rotatable, used to open the cover of the wafer cassette after the sealing strip abuts and seals against the cover of the wafer cassette.
[0030] In one embodiment, the wafer cassette temporary storage assembly mainly includes a housing 1, a storage compartment 2, a vertical multi-segment robotic arm 3, and a core sealed door 4.
[0031] The housing 1 constitutes the main frame and sealed chamber of the equipment. Its interior is maintained at a cleanliness level higher than that of the external environment through a fan filtration unit. The housing 1 adopts a metal frame and smooth panel structure, and the inner corners are transitioned with large arcs to minimize dust accumulation. The housing 1 is provided with a loading port and an unloading port. The loading port is used to receive wafer cassettes from AMHS or the loading station, and is usually equipped with a centering guide mechanism and a first airtight door. The unloading port is used to send the wafer cassettes to the downstream process equipment, and its opening size matches the standard loading port of the downstream equipment.
[0032] Multiple storage positions 2 are located inside the housing 1 for storing wafer cassettes. These storage positions 2 can be multi-layer fixed shelves or compact, liftable, and rotatable storage towers. Each storage position 2 is equipped with a wafer cassette in-situ sensor (such as a photoelectric beam sensor) and an identification barcode reader. The vertical multi-segment robotic arm 3 is located inside the housing 1 for transferring wafer cassettes between the storage positions 2, the loading port, and the unloading port. The robotic arm is preferably a SCARA-type or similar structure robotic arm with rotational, lifting, and horizontal extension degrees of freedom. Its end effector is an adaptive gripper with force sensing function, which can safely grip wafer cassettes of different sizes.
[0033] The sealing door 4 is located on the outside of the unloading port and is connected to the housing 1 as an independent functional module. The sealing door 4 includes an outer panel, an inner panel, a sealing strip, and a pin.
[0034] The outer plate is movably mounted on the housing 1 for opening or closing the unloading port. Specifically, the outer plate is mounted on the frame of the sealing door 4 via a high-precision linear guide pair and can slide along a first horizontal direction (e.g., left-right direction). Its operation is driven by a first drive mechanism (such as a linear module consisting of a servo motor and a ball screw) and equipped with a first position sensor (such as a limit switch or photoelectric sensor) to detect the "fully open" and "fully closed" positions.
[0035] The inner plate is connected to the outer plate and can move synchronously with the outer plate. The inner plate can also move relative to the outer plate to move closer to or further away from the wafer cassette located at the unloading port.
[0036] Specifically, the inner plate is mounted on the inner side of the outer plate via another set of linear guide rails. The guiding direction of this set of guide rails is a second horizontal direction (e.g., front-back direction), perpendicular to the first horizontal direction. The inner plate is independently driven by a second drive mechanism (such as an electric cylinder or another set of servo linear modules) to achieve precise advance and retraction relative to the outer plate. The sealing strip is set on the edge of the inner plate facing the wafer cassette and is used to form a seal with the cover of the wafer cassette when the inner plate approaches the wafer cassette. The sealing strip is annular and made of a low-release, high-elasticity material (such as fluororubber). Its cross-section can be designed as a lip structure with a hollow cavity to enhance sealing and reduce the required clamping force. The sealing strip is fixed to the inner plate by a detachable pressure plate for easy replacement.
[0037] The pins are mounted on the outer plate and are rotatable. They are used to open the wafer cassette cover after the sealing strip abuts and seals against the cover. There are typically two pins, corresponding to the latch positions on the wafer cassette cover. Each pin is driven by an independent rotary drive device (such as a micro servo motor with a reducer), allowing for precise angular rotation (e.g., 0-90 degrees). The end shape of the pin precisely matches the slot of the wafer cassette cover latch.
[0038] In one embodiment, a precision positioning platform is provided at the unloading port. This platform is used to precisely position the wafer cassette placed by the vertical multi-segment robotic arm 3 to ensure that the center of the wafer cassette cover and the sealing door 4 are strictly aligned. The precision positioning platform may include a support platform that can be slightly raised and lowered by a cylinder or electric cylinder, and at least three conical positioning pins that can extend from the side. After the robotic arm roughly places the wafer cassette on the support platform, the support platform lowers to make the wafer cassette sit stably. Then the conical positioning pins extend and are inserted into the standard positioning holes at the bottom of the wafer cassette to complete the precision correction of the X, Y directions and the θ angle. The positioning accuracy can reach ±0.1mm.
[0039] In one embodiment, the temporary storage component further includes a controller.
[0040] The controller is electrically connected to the vertical multi-segment robotic arm 3 and is used to control the path and action sequence of the vertical multi-segment robotic arm 3 in transferring the wafer box.
[0041] The controller is electrically connected to the sealing door 4 and controls the start, stop, speed and position of the first and second drive mechanisms, as well as the movement of the rotating motor of the pin, through digital / analog I / O modules or motion control buses.
[0042] To achieve closed-loop control and process safety, the sealing door 4 may also include a first position sensor and a second position sensor. The first position sensor is used to detect the position of the outer panel, and the second position sensor may be a high-precision linear encoder (such as a magnetic ruler) to detect the absolute position of the inner panel. A pressure sensor may also be integrated to detect the contact force between the sealing strip and the wafer cover and to feed the force signal back to the controller to determine whether the seal is reliably established. Both the first position sensor and the second position sensor are electrically connected to the controller.
[0043] In one embodiment, to achieve a higher level of cleanliness, the environmental control unit is optionally integrated, which includes an air inlet and a gas pressure sensor.
[0044] The air inlet is used to deliver clean gas (such as high-purity nitrogen or dry air) into the sealed space formed by the sealing strip and the wafer cover.
[0045] The air inlet is connected to the factory's air source via a pipeline, which is equipped with a precision filter, a pressure regulating valve, and an electromagnetic proportional valve controlled by a controller.
[0046] The gas pressure sensor is used to monitor the gas pressure in the sealed space. The environmental control unit is electrically connected to the controller. Based on the real-time feedback from the gas pressure sensor, the controller dynamically adjusts the opening of the electromagnetic proportional valve through a PID control algorithm, thereby filling and maintaining a stable micro-positive pressure (e.g., +5 to +20 Pa) into the sealed space before the opening operation, effectively removing external contaminants.
[0047] The sealing door 4 assembly is designed as an independent module. Its door frame is connected to the housing 1 frame through a mechanical interface with a tapered positioning pin and a quick-locking handle. All electrical connections (power, control signals, sensor signals) are quickly connected through a waterproof aviation plug. When maintenance, cleaning or upgrades are required, technicians can remove the entire sealing door 4 module from the housing 1 within minutes and replace it with a spare module, greatly reducing equipment downtime.
[0048] Corresponding to the aforementioned embodiments of the wafer cassette temporary storage component, and employing the same technical concept, this application also provides embodiments of the wafer cassette temporary storage component transfer method.
[0049] In one exemplary embodiment, such as Figure 3 As shown, the wafer cassette temporary storage component transfer method may include the following steps: Step 100: Transfer the target wafer cassette to the unloading port.
[0050] Step 200: Move the outer panel of the sealing door 4 to close the unloading port passage.
[0051] Step 300: Move the inner plate of the sealing door 4 closer to the target wafer box, so that the sealing strip on the inner plate abuts against the cover of the target wafer box to form a sealed space.
[0052] Step 400: Rotate the pin on the outer plate to open the cover of the target wafer cassette.
[0053] In one embodiment, the wafer cassette temporary storage component transfer method is implemented as follows: Outbound and coarse positioning: The controller instructs the vertical multi-segment robotic arm 3 to retrieve the target wafer cassette from the designated storage location 2, transport it, and place it on the bearing platform of the fine positioning platform at the unloading port.
[0054] Precise positioning: The controller starts the precision positioning platform, executes the descent and lateral positioning pin extension actions, and completes the final precise positioning of the wafer cell.
[0055] Closing the transmission channel: The controller instructs the first drive mechanism to move the outer panel to the "fully closed" position. The first position sensor confirms the position is in place.
[0056] Establishing a sealed environment: The controller instructs the second drive mechanism to move, driving the inner plate forward. The process is divided into two stages: first, rapid approach; when the magnetic scale feedback position approaches the theoretical contact point, it switches to a low-speed, high-force mode to advance until the clamping force feedback from the pressure sensor reaches the preset value. At this point, a reliable seal is formed between the annular sealing strip and the wafer cover.
[0057] Localized environmental purification: The controller activates the environmental control unit, opens the intake valve, and fills the sealed space with high-purity nitrogen. A gas pressure sensor monitors the space pressure, and the controller uses PID control to maintain the pressure stably at a preset positive value.
[0058] Perform the opening operation: After confirming that the seal is established, the controller instructs the motor of the opening actuator to drive the two pins to rotate synchronously at a preset angle. The rotation of the pins, through cooperation with the wafer box cover slot, unlocks and opens the box cover.
[0059] Readiness and Docking: At this point, the interior of the wafer cassette is connected to the loading port of the downstream process equipment via a clean, sealed channel filled with protective gas. The controller sends a "ready" signal to both upstream and downstream, allowing the robotic arm of the process equipment to transfer the wafer.
[0060] Process Reset: After the process equipment completes wafer storage and retrieval and issues a "close cover" command, the controller controls the pin to rotate in the opposite direction to close the cover. Then, it commands the inner board to retract to release the seal. Finally, it commands the outer board to open the channel, and the robotic arm can take away the processed wafer box, thus ending the process.
[0061] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0062] The embodiments described above are merely examples of several implementation methods of this application. They are described in a relatively specific and detailed manner, but they should not be construed as limiting the scope of the invention. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application.
Claims
1. A wafer cassette temporary storage component, characterized in that, Includes a cabinet, multiple storage compartments, a vertical multi-segment robotic arm, and a sealed door; The housing is provided with a loading port and an unloading port. The loading port is used to receive wafer cassettes, and the unloading port is used to send wafer cassettes to downstream process equipment. Multiple storage positions are provided inside the housing for storing wafer cassettes. A vertical multi-segment robotic arm is provided inside the housing for transferring wafer cassettes between the storage positions, the loading port, and the unloading port. A sealing door is provided outside the unloading port. The sealing door includes an outer panel, an inner panel, a sealing strip, and a pin; The outer panel is movably disposed on the housing and is used to open or close the unloading port channel; The inner plate is connected to the outer plate and can move synchronously with the outer plate. The inner plate can also move relative to the outer plate to move closer to or further away from the wafer cassette located at the unloading port. The sealing strip is disposed on the edge of the inner plate facing the wafer box, and is used to form a seal by abutting against the cover of the wafer box when the inner plate is close to the wafer box; The pin is disposed on the outer plate and is rotatable, used to open the cover of the wafer cassette after the sealing strip abuts and seals against the cover of the wafer cassette.
2. The wafer cassette temporary storage assembly as described in claim 1, characterized in that, The outer panel is movably disposed on the housing along a first horizontal direction, and the inner panel is movably connected to the outer panel along a second horizontal direction, wherein the first horizontal direction and the second horizontal direction are perpendicular to each other.
3. The wafer cassette temporary storage component as described in claim 2, characterized in that, The sealing door further includes a first driving mechanism and a second driving mechanism. The first driving mechanism is connected to the outer plate and is used to drive the outer plate to move along the first horizontal direction. The second driving mechanism is connected to the inner plate and is used to drive the inner plate to move along the second horizontal direction.
4. The wafer cassette temporary storage assembly as described in claim 1, characterized in that, A precision positioning platform is provided at the unloading port, which is used to precisely position the wafer cassette placed by the vertical multi-segment robotic arm.
5. The wafer cassette temporary storage assembly as described in claim 1, characterized in that, It also includes the controller; The controller is electrically connected to the vertical multi-segment robotic arm and is used to control the vertical multi-segment robotic arm to transfer wafer boxes. The controller is electrically connected to the sealing door and is used to control the movement of the inner plate, the movement of the outer plate, and the rotation of the pin.
6. The wafer cassette temporary storage assembly as described in claim 5, characterized in that, The sealing door also includes a first position sensor and a second position sensor; The first position sensor is used to detect the position of the outer plate as it moves into place; The second position sensor is used to detect the position of the inner plate or the contact force between the sealing strip and the wafer box cover; Both the first position sensor and the second position sensor are electrically connected to the controller.
7. The wafer cassette temporary storage assembly as described in claim 5, characterized in that, It also includes an environmental control unit; The environmental control unit includes an air inlet and a gas pressure sensor; The air inlet is used to deliver clean gas into the sealed space formed by the sealing strip and the wafer cassette cover. The gas pressure sensor is used to monitor the gas pressure within the sealed space; The environmental control unit is electrically connected to the controller, and the controller controls the gas delivery at the air inlet based on feedback from the gas pressure sensor.
8. The wafer cassette temporary storage assembly as described in claim 1, characterized in that, The sealing door has a modular structure and is detachably installed at the unloading port of the box.
9. A method for transferring a wafer cell temporary storage component, applied to the wafer cell temporary storage component according to any one of claims 1-8, characterized in that, include: Transfer the target wafer cassette to the unloading port; The outer panel of the movable sealing door is used to close the unloading port passage; The inner panel of the movable sealing door is close to the target wafer box, so that the sealing strip on the inner panel abuts against the cover of the target wafer box to form a sealed space; Rotate the pin on the outer panel to open the cover of the target wafer cassette.
10. The wafer cassette temporary storage component transfer method as described in claim 9, characterized in that, Prior to the step of rotating the pin disposed on the outer plate, the method further includes: The environmental control unit delivers clean gas into the sealed space and monitors and maintains the gas pressure in the sealed space at a preset positive pressure.