An automatic retry and intelligent replenishment control method, device and electronic equipment for die bonding failure

Abstract

This application relates to the technical field of semiconductor packaging, and discloses an automatic retry and intelligent replenishment control method, apparatus, and electronic device for die bonding failures. The method includes: acquiring the chip picking status information of the nozzle during the die bonding operation cycle, identifying abnormal chip picking signals of unpicked wafers, determining the corresponding wafer position, and controlling the nozzle to perform a repetitive chip picking operation; collecting the status information after the repetitive chip picking, generating a discard mark if the chip picking is unsuccessful, controlling the die bonding platform to skip the marked position and continue the operation; synchronously counting the cumulative number of discard marks, triggering a replenishment prompt signal when the number reaches a preset threshold, clearing the marks and cumulative number after replenishment, and resuming the operation; clearing the abnormal signal if the repetitive chip picking is successful, controlling the nozzle to complete the chip placement action, and maintaining continuous execution of the die bonding operation. This application can realize intelligent management and control of chip picking abnormality handling, discard management, and replenishment control to improve production efficiency.

Description

Technical Field

[0001] This application relates to the field of semiconductor packaging technology, and in particular to an automatic retry and intelligent replenishment control method, apparatus and electronic equipment for die bonding failure. Background Technology

[0002] Die bonding is a core process in semiconductor packaging, and its quality and efficiency directly determine the yield and production capacity of semiconductor products. Die bonding machines use nozzles to pick up wafers at preset pick-up positions and then precisely place them onto a carrier to complete the bonding process. The entire operation needs to maintain continuous, stable, and automated operation. In actual production scenarios, due to various factors such as wafer placement deviations, fluctuations in blue film viscosity, and nozzle wear, the nozzle often fails to pick up a wafer after completing the pick-up action at the pick-up position. Improper handling of such anomalies can directly affect the continuity of the die bonding operation.

[0003] Existing die bonders often handle abnormal die picking using a simple manual intervention mode. When a wafer is not picked up, the operator must pause the operation, manually control the nozzle to retry picking, and if the retry fails, manually mark the discard location and control the work platform to jump, while manually counting the number of discarded wafers. Once the discarded wafers accumulate to a certain level, a manual replenishment operation is triggered. This method not only incurs significant labor costs, but manual operation also suffers from response delays and judgment errors, easily leading to interruptions in the die bonding operation, making it difficult to ensure the continuity of the workflow, and thus affecting production efficiency.

[0004] In current die bonding operations, the integration of die-taking anomaly handling, waste management, and replenishment control lacks automation and intelligent control, leading to frequent interruptions and low production efficiency. Therefore, achieving intelligent control of the integration of die-taking anomaly handling, waste management, and replenishment control to improve production efficiency remains a challenge. Summary of the Invention

[0005] In order to improve production efficiency by achieving intelligent management and control that integrates die bonding failure handling, waste management and replenishment control, this application provides an automatic retry and intelligent replenishment control method, device and electronic equipment for die bonding failure.

[0006] In a first aspect, this application provides an automatic retry and intelligent replenishment control method for die bonding failures, employing the following technical solution:

[0007] An automatic retry and intelligent feed control method for die bonding failures includes:

[0008] The system acquires the chip picking status information of the nozzle during the die bonding cycle, identifies abnormal chip picking signals when the nozzle fails to pick up a wafer after completing the chip picking action at the chip picking position, determines the position of the wafer for which chip picking was not completed based on the abnormal chip picking signal, and controls the nozzle to return to the position of the wafer for which chip picking was not completed to perform a repeat chip picking operation.

[0009] After collecting the chip picking status information of the nozzle after the repeated chip picking operation, it is determined whether the nozzle has successfully picked up the chip. If the chip is not successfully picked up, a discard mark information corresponding to the chip position is generated. The die bonding platform is controlled to skip the chip position with the discard mark information and move along the preset operation path to the next chip position to continue the die bonding operation.

[0010] The cumulative number of discarded material marking information during the current die bonding cycle is counted simultaneously. When the cumulative number reaches a preset threshold, a replenishment prompt signal is triggered on the die bonding machine. After the replenishment operation is completed, all discarded material marking information and cumulative number during the current die bonding cycle are cleared, and the die bonding machine is controlled to resume continuous die bonding operation.

[0011] When the nozzle successfully picks up the wafer after a repeated wafer picking operation, the corresponding abnormal wafer picking signal is cleared, and the nozzle is controlled to move to the preset die bonding position to complete the die placement action, ensuring continuous execution of the entire die bonding operation process.

[0012] Optionally, the step of identifying an abnormal wafer picking signal where the pick-up nozzle fails to pick up the wafer after completing the wafer picking action at the picking position includes:

[0013] After the nozzle completes the crystal-taking action and is raised to a preset safe height, the crystal-taking status information of the nozzle during the crystal bonding operation cycle is collected simultaneously. The crystal-taking status information includes the pressure detection data of the nozzle and the surface image data of the crystal-taking position.

[0014] The collected pressure detection data is compared with the preset standard pressure range, and the surface image data of the crystal picking position is compared with the pre-stored standard features of the wafer. When both sets of comparison results indicate that the nozzle has not picked up the wafer, a corresponding abnormal crystal picking signal is generated.

[0015] Optionally, the step of determining the location of the wafer for which un-treaty was not completed based on the abnormal treasury signal includes:

[0016] Based on the abnormal crystal removal signal, the pre-stored crystal bonding operation path data within the current crystal bonding operation cycle is retrieved, the crystal removal action timing corresponding to the abnormal crystal removal signal is matched, and the planar coordinate information of the corresponding unfinished crystal removal wafer on the blue film is locked.

[0017] Based on the locked wafer plane coordinate information, combined with the coordinate system calibration data of the die bonding platform, the target wafer position returned by the nozzle is determined.

[0018] Optionally, the step of controlling the suction nozzle to return to the position where the wafer removal operation was not completed and performing a repeat wafer removal operation includes:

[0019] Control the nozzle to move along an interference-free return path to the determined target wafer position, and perform a repeat die pick-up operation. The pin height and nozzle pressing depth of the repeat die pick-up operation are consistent with the parameters of the first die pick-up operation in this die bonding cycle.

[0020] After completing the repeated crystal removal operation, the nozzle is raised to a preset safe height, and the crystal removal status information of the nozzle is collected simultaneously to complete the status verification of the repeated crystal removal action.

[0021] Optionally, the step of determining whether the nozzle has successfully picked up the wafer after collecting the wafer picking status information of the nozzle after the repeated wafer picking operation includes:

[0022] After the suction nozzle completes the repeated crystal taking action and is raised to the preset safe height, the suction nozzle crystal taking status information corresponding to the repeated crystal taking operation is collected simultaneously. The crystal taking status information includes the vacuum pressure detection data of the suction nozzle and the image acquisition data of the suction nozzle holding surface.

[0023] The collected vacuum pressure detection data is compared with the preset qualified crystal adsorption pressure range, and the image data of the nozzle holding surface is compared with the pre-stored standard wafer contour features. When both sets of comparison results determine that the nozzle has successfully adsorbed the wafer, the nozzle is confirmed to have successfully picked up the wafer.

[0024] If any set of comparison results indicates that no chip has been adsorbed, it confirms that the nozzle has not successfully picked up the chip.

[0025] Optionally, the step of generating discard marker information corresponding to the wafer location when the wafer is not successfully picked up includes:

[0026] Based on the determination that the suction nozzle failed to pick up the wafer, the blue film wafer coordinate mapping table stored in the current die bonding cycle is retrieved, and the unique code and planar coordinate information of the wafer corresponding to this repeated wafer picking operation are matched to generate a discard mark information that is bound one-to-one with the location of the wafer that was not successfully picked up.

[0027] The generated waste material marking information is written in real time to the job execution log and blue film wafer coordinate mapping table of this die bonding operation cycle, and the wafer picking operation permission for the unsuccessful wafer picking position is locked simultaneously to prevent the triggering of subsequent wafer picking actions.

[0028] Optionally, the step of controlling the die bonding platform to skip the wafer position with discard mark information and move along the preset working path to the next wafer position to continue the die bonding operation includes:

[0029] Before the die bonding platform moves along the preset working path, it first reads the blue film wafer coordinate mapping table data of the current wafer position to be worked. When it recognizes that the current wafer position to be worked has a discard mark information, it controls the die bonding platform not to perform the ejector pin lifting and nozzle picking actions at the current wafer position, and directly jumps to the next valid wafer position in the preset working path along the shortest collision-free path.

[0030] After the location jump is completed, the coordinate information and operation permissions of the target wafer position after the jump are verified. After confirming that there is no waste material marking information and the operation permissions are available, the normal die picking and bonding operation process at the corresponding position is triggered to maintain the continuous execution of the die bonding operation.

[0031] Optionally, the step of simultaneously counting the cumulative number of discarded material marking information during the current die bonding cycle, and triggering a replenishment prompt signal for the die bonding machine when the cumulative number reaches a preset threshold, includes:

[0032] After completing the die picking operation at each wafer location, and completing the real-time writing and data update of the discard mark information, the core discard statistics data for this die bonding operation cycle are retrieved synchronously. The core discard statistics data includes the cumulative number of valid discard marks and the percentage of the number of discarded wafers to the total number of valid blue film wafers in this die bonding operation cycle.

[0033] The cumulative number of valid discarded material markers is compared with the preset replenishment quantity threshold, and the percentage of discarded material is compared with the preset replenishment percentage threshold. When any set of comparison results reaches or exceeds the corresponding preset threshold, the die-taking operation permission of the die-bonding platform is immediately locked, the current die-bonding operation process is suspended, and a replenishment prompt signal is generated and pushed to the machine human-machine interface and production line control system.

[0034] Secondly, this application provides an automatic retry and intelligent replenishment control device for die bonding failures, which adopts the following technical solution:

[0035] An automatic retry and intelligent replenishment control device for die bonding failures includes:

[0036] The abnormal wafer picking retry module acquires the wafer picking status information of the nozzle during the die bonding cycle, identifies the abnormal wafer picking signal when the nozzle fails to pick up the wafer after completing the wafer picking action at the wafer picking position, determines the position of the wafer for which wafer picking was not completed based on the abnormal wafer picking signal, and controls the nozzle to return to the position of the wafer for which wafer picking was not completed to perform a repeat wafer picking operation.

[0037] The waste skipping control module collects the chip picking status information of the nozzle after the repeated chip picking operation, determines whether the nozzle has successfully picked up the chip, and generates waste marking information corresponding to the chip picking position when the chip is not successfully picked up. It then controls the die bonding platform to skip the chip position with the waste marking information and move along the preset operation path to the next chip position to continue the die bonding operation.

[0038] The waste material statistics and replenishment module synchronously counts the cumulative number of waste material marking information within the current die bonding cycle. When the cumulative number reaches a preset threshold, it triggers a replenishment prompt signal for the die bonding machine. After the replenishment operation is completed, it clears all waste material marking information and cumulative number within the current die bonding cycle and controls the die bonding machine to resume continuous die bonding operation.

[0039] In the normal die bonding continuation module, when the nozzle successfully picks up the wafer after a repeated die pick-up operation, the corresponding abnormal die pick-up signal is cleared, and the nozzle is controlled to move to the preset die bonding position to complete the die placement action, so as to maintain the continuous execution of the entire die bonding operation.

[0040] Thirdly, this application provides an electronic device that adopts the following technical solution:

[0041] An electronic device includes a processor, wherein the processor runs a program of the automatic retry and intelligent replenishment control method for die bonding failures as described in any one of the above-mentioned methods.

[0042] In summary, this application includes at least one of the following beneficial technical effects:

[0043] When the nozzle fails to pick up a wafer, the system can automatically acquire wafer picking status information, identify the abnormal signal, and lock the corresponding wafer position. It then controls the nozzle to automatically perform a repeat wafer picking operation without requiring manual interruption of the operation. If the repeat wafer picking fails, the system automatically generates a discard mark and writes it into the operation log and coordinate mapping table. Simultaneously, it locks the wafer picking permission for the discard position and controls the operation platform to automatically skip the discard position and jump to the next valid position to continue the operation. This avoids operation interruptions caused by delays in manual judgment and operational errors, reduces labor costs, and ensures a smooth and efficient connection between wafer picking anomaly handling and discard management.

[0044] While generating waste material markers, the system simultaneously and automatically calculates the cumulative quantity and percentage of waste materials. Through dual threshold comparison, it automatically triggers a replenishment prompt signal and pushes it to the machine, human-machine interface, and production line control system. After replenishment is completed, the system automatically clears the waste material markers and cumulative data and resumes operation. There is no need for manual calculation of waste material quantity or manual triggering of replenishment, which avoids operation stoppage caused by manual calculation errors and untimely replenishment. It achieves seamless connection and intelligent control of all aspects of crystal picking anomaly handling, waste material management, and replenishment control, effectively solving the problem of operation interruption caused by poor connection in existing technologies, and greatly improving the production efficiency and operation stability of semiconductor packaging. Attached Figure Description

[0045] Figure 1 This is a flowchart illustrating an automatic retry and intelligent replenishment control method for die bonding failures according to an exemplary embodiment.

[0046] Figure 2 This is a structural block diagram of an automatic retry and intelligent replenishment control device for die bonding failures, according to an exemplary embodiment. Detailed Implementation

[0047] The embodiments of this application are described in detail below, and examples of the embodiments are shown in the accompanying drawings.

[0048] In the description of this specification, the references to "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples" refer to specific features, structures, materials, or characteristics described in connection with the described embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0049] This application discloses an automatic retry and intelligent replenishment control method for die bonding failures. This method is applied to die bonding machines in semiconductor packaging processes. The die bonding machine is equipped with at least a pick-up nozzle with a vacuum adsorption channel, a die bonding platform with precise displacement, a ejector pin mechanism for lifting the wafer, a coaxial vision inspection unit, a side vision inspection unit, a vacuum pressure detection module, a human-machine interface, and a communication module that interfaces with the production line management system.

[0050] Before initiating the die bonding operation, basic parameter configuration and operational benchmark construction are completed in advance: Blue film wafer layout data, die bonding platform coordinate system calibration data, and wafer standard features and standard contour feature parameters corresponding to the target die bonding operation are acquired in advance. The blue film wafer layout data includes the row and column arrangement, planar coordinates, and unique coding information of all valid wafers on the blue film. The coordinate system calibration data includes the transformation matrix between the blue film local coordinate system and the die bonding machine's global motion coordinate system. Based on the above basic data, a preset operational path covering the entire die bonding operation process is generated. The preset operational path includes the wafer picking order on the blue film, wafer picking action timing parameters, standard wafer picking operation parameters, and preset safety height parameters. Simultaneously, a blue film wafer coordinate mapping table and various preset threshold ranges corresponding to this die bonding operation cycle are pre-stored, including preset standard pressure ranges, preset acceptable wafer suction pressure ranges, preset replenishment quantity thresholds, and preset replenishment ratio thresholds. This provides a unified execution benchmark and judgment basis for the entire die bonding operation process. Figure 1 Specifically, it includes:

[0051] S100: Obtain the chip picking status information of the nozzle during the die bonding cycle, identify the abnormal chip picking signal that the nozzle has not picked up the wafer after completing the chip picking action at the chip picking position, determine the position of the corresponding wafer that has not been picked up according to the abnormal chip picking signal, and control the nozzle to return to the position of the wafer that has not been picked up to perform a repeat chip picking operation.

[0052] This step is the automatic identification and retry execution stage for crystal retrieval anomalies. It is the trigger entry point for the entire anomaly handling process. By collecting and verifying the crystal retrieval status in real time, it enables rapid response and automatic handling of anomalies without the need for manual intervention to interrupt the operation.

[0053] In this embodiment of the invention, the specific execution process of S100 is as follows:

[0054] S101: After the nozzle completes the crystal-taking action and is raised to a preset safe height, the nozzle's crystal-taking status information during the die-bonding cycle is simultaneously collected. The crystal-taking status information includes pressure detection data of the nozzle and surface image data of the crystal-taking position. The preset safe height is a fixed height of 8-15mm above the top surface of the blue film wafer, which can avoid collisions between the nozzle and the blue film and the ejector pin mechanism during horizontal movement, and also ensure the focusing accuracy of the visual inspection. The pressure detection data comes from a high-precision pressure sensor in the vacuum channel at the rear of the nozzle. The sensor sampling frequency is not less than 10kHz, which can collect the vacuum change data inside the nozzle in real time. The surface image data of the crystal-taking position comes from the coaxial vision inspection unit of the die-bonding machine. After the nozzle is raised to the safe height, the coaxial vision inspection unit takes a high-definition image of the blue film crystal-taking position after the crystal-taking action is completed, and obtains the surface morphology data of that position.

[0055] The collected pressure detection data is compared with a preset standard pressure range, which is the vacuum range corresponding to when the nozzle successfully picks up the wafer. If the detected vacuum is in the normal pressure range or exceeds the preset standard pressure range, it is initially determined that the nozzle has not picked up the wafer. The surface image data of the wafer picking position is compared with the pre-stored wafer standard features. The wafer standard features include the wafer's outline size, grayscale features, and edge features. If the image still shows complete wafer features at that position, it is determined that the wafer has not been picked up by the nozzle. When both comparison results indicate that the nozzle has not picked up the wafer, a corresponding abnormal wafer picking signal is generated. The abnormal wafer picking signal carries the unique timing number and wafer picking position coordinate information corresponding to this wafer picking action.

[0056] By employing a dual verification mechanism combining pressure detection and visual inspection, accurate identification of abnormal crystal extraction signals is achieved, avoiding the problem of misjudgment caused by environmental interference in a single detection dimension.

[0057] S102: Based on the abnormal wafer picking signal, retrieve the pre-stored wafer bonding operation path data within the current wafer bonding operation cycle, and match the wafer picking action timing corresponding to the abnormal wafer picking signal. The wafer bonding operation path data pre-stores a one-to-one mapping relationship between the timing number of each wafer picking action and the corresponding wafer position. Through precise matching of timing numbers, the planar coordinate information of the corresponding wafer that has not completed wafer picking in the local coordinate system of the blue film can be directly locked. Based on the locked wafer planar coordinate information, combined with the coordinate system calibration data of the wafer bonding operation platform, the wafer coordinates in the local coordinate system of the blue film are converted into motion coordinates in the global motion coordinate system of the wafer bonding machine through the pre-calibrated coordinate transformation matrix. Finally, the target wafer position returned by the nozzle is determined. The target wafer position is directly above the wafer and completely coincides with the target position of the first wafer picking action.

[0058] By using timing matching and coordinate system transformation, the precise location of the wafer corresponding to abnormal wafer picking is achieved, ensuring that the nozzle can accurately return to the position directly above the target wafer, avoiding the problem of repeated wafer picking failure caused by position deviation, and ensuring the accuracy of repeated wafer picking operations.

[0059] S103: Control the nozzle to move along an interference-free return path to the determined target wafer position. The interference-free return path is as follows: the nozzle moves horizontally at the current preset safety height until it reaches directly above the target wafer position, maintaining a constant vertical height throughout to avoid collisions with surrounding mechanisms or products that have already been bonded. After reaching the target position, perform a repeat wafer removal operation. The ejector pin height, nozzle pressing depth, adsorption vacuum, and ejector pin lifting sequence of the repeat wafer removal operation are consistent with the parameters of the first wafer removal operation in this wafer bonding cycle. This set of parameters is the optimal wafer removal parameters determined in the previous process debugging. Maintaining parameter consistency can eliminate the interference of process parameter fluctuations on the wafer removal results. After completing the repeat wafer removal operation, control the nozzle to rise again to the preset safety height, and simultaneously collect the wafer removal status information of the nozzle to complete the status verification of the repeat wafer removal action.

[0060] By performing a single, repeated die-taking operation with fixed parameters, the consistency of the optimal die-taking process is preserved, the success rate of repeated die-taking is maximized, and the problems of extended operation cycle, blue film damage, and wafer edge breakage caused by multiple repeated die-taking are avoided. At the same time, the preliminary confirmation of the repeated die-taking results is completed through state verification after lifting.

[0061] S200 collects the chip picking status information of the nozzle after the repeated chip picking operation is completed, determines whether the nozzle has successfully picked up the chip, and generates a discard mark information corresponding to the chip picking position if the chip is not successfully picked up. It controls the die bonding platform to skip the chip position with the discard mark information and move along the preset operation path to the next chip position to continue the die bonding operation.

[0062] This step involves determining the results of repeated crystal taking and controlling waste materials. It is a core link between anomaly handling and continuous operation. By accurately determining the retry results, either waste material control or normal crystal bonding process is executed to ensure that the operation process is not interrupted.

[0063] In this embodiment of the invention, the specific execution process of S200 is as follows:

[0064] S201: After the nozzle completes the repeated crystal picking action and is raised to the preset safe height, the nozzle picking status information corresponding to the repeated crystal picking operation is collected simultaneously. The picking status information includes the vacuum pressure detection data of the nozzle and the image acquisition data of the nozzle holding surface. The vacuum pressure detection data comes from a high-precision vacuum sensor inside the nozzle, which can provide real-time feedback on the vacuum degree change of the nozzle adsorption end face. The image acquisition data of the nozzle holding surface comes from the side-view vision detection unit of the die bonder. The side-view vision detection unit takes high-definition images of the adsorption end face of the nozzle, which can clearly capture whether there is a wafer on the nozzle end face and whether the wafer is completely adsorbed.

[0065] The collected vacuum pressure detection data is compared with the preset qualified crystal adsorption pressure range, which is the vacuum range corresponding to the stable adsorption of the wafer by the nozzle. If the detection data falls within this range, it is preliminarily determined that the nozzle has successfully adsorbed the wafer. The image data of the nozzle holding surface is compared with the pre-stored standard wafer contour features, which are the complete shape contour and size parameters of the wafer of the corresponding specification. If there is a wafer image in the image that perfectly matches the standard contour features on the nozzle end face, it is further determined that the wafer has been successfully adsorbed. When both sets of comparison results determine that the nozzle has successfully adsorbed the wafer, it is confirmed that the nozzle has successfully picked up the wafer. When either set of comparison results determines that the wafer has not been adsorbed, it is confirmed that the nozzle has not successfully picked up the wafer.

[0066] By combining vacuum pressure detection and visual inspection of the holding surface, the system achieves accurate determination of repeated crystal picking results. It can effectively identify abnormal situations such as semi-adsorption, offset adsorption, and crystal breakage, and avoid missing abnormal adsorption states.

[0067] S202, based on the determination that the nozzle failed to pick up the wafer, retrieve the blue film wafer coordinate mapping table stored in the current die bonding cycle. The blue film wafer coordinate mapping table stores all data such as the unique code, plane coordinates, operation status, and marking information of all wafers in this operation. Match the unique code and plane coordinate information of the wafer corresponding to this repeated wafer picking operation, and generate discard mark information that is bound one-to-one with the location of the wafer that was not successfully picked up. The discard mark information includes the unique code, plane coordinates, discard judgment time, and judgment basis data of the corresponding wafer, ensuring that the mark information uniquely corresponds to the wafer location and that there will be no mismarking or omission.

[0068] The generated waste material marking information is written in real time to the operation execution log and the blue film wafer coordinate mapping table of this die bonding operation cycle. The writing to the operation execution log is used for subsequent process traceability and problem review, and the writing to the blue film wafer coordinate mapping table is used for real-time verification of subsequent operation paths. At the same time, the wafer picking operation permission for the unsuccessful wafer picking position is locked. After the permission is locked, the system will not issue any wafer picking related instructions to that position in the subsequent operation process, and the triggering of subsequent wafer picking actions is prohibited.

[0069] By binding the waste material marker to the wafer location and locking the work permissions simultaneously, precise control of invalid wafer locations is achieved, which can avoid repeated wafer removal operations at invalid locations in subsequent operations, thereby reducing invalid work steps.

[0070] S203, before the die bonding platform moves along the preset working path, it first reads the blue film wafer coordinate mapping table data of the current wafer position to be processed, and completes the validity pre-verification of the position to be processed; when it is detected that the current wafer position to be processed has discard mark information, it controls the die bonding platform not to perform the ejector pin lifting and nozzle picking action of the current wafer position to be processed, directly rejects the invalid working node, and directly jumps to the next valid wafer position in the preset working path along the shortest collision-free path. The shortest collision-free path is that the die bonding platform moves horizontally directly from the current position to directly above the next valid wafer position, maintaining a safe height throughout the process, without passing through the path node corresponding to the discard position, and minimizing the movement distance.

[0071] After the position jump is completed, the coordinate information and operation permissions of the target wafer position after the jump are verified. After confirming that there is no waste material marking information at the target position and that the operation permission is available, the normal die picking and bonding operation process at the corresponding position is triggered to maintain the continuous execution of the die bonding operation.

[0072] By pre-identifying the waste material location, skipping without action, and jumping to the shortest path, invalid operation steps are completely eliminated, effectively shortening the single cycle operation time. At the same time, by verifying the coordinates and permissions after jumping, problems such as misoperation and jumping deviation are avoided, ensuring the continuous and stable execution of the die bonding operation and achieving seamless connection of the operation process without manual intervention.

[0073] S300 synchronously counts the cumulative number of discarded material marking information within the current die bonding cycle. When the cumulative number reaches a preset threshold, it triggers a replenishment prompt signal for the die bonding machine. After the replenishment operation is completed, it clears all discarded material marking information and cumulative number within the current die bonding cycle and controls the die bonding machine to resume continuous die bonding operation.

[0074] This step involves waste material statistics and intelligent replenishment management, which is the core of achieving closed-loop management throughout the entire process. By statistically analyzing waste material data in real time and intelligently triggering replenishment prompts, it enables precise control over the timing of replenishment, avoiding a continuous decline in operational efficiency caused by excessive invalid wafers.

[0075] In this embodiment of the invention, the specific execution process of S300 is as follows:

[0076] S301, after completing the die picking operation judgment for each wafer position, completing the real-time writing and data update of the discard mark information, synchronously retrieves the core discard statistics data for this die bonding operation cycle. The core discard statistics data includes the cumulative number of valid discard marks and the percentage of discarded items to the total number of valid wafers on the blue film in this die bonding operation cycle. The cumulative number of valid discard marks is the total number of discard marks that have been locked with permissions in this operation cycle. The percentage of discarded items is the ratio of the cumulative number of valid discard marks to the initial total number of valid wafers on the blue film, which can intuitively reflect the remaining proportion of valid wafers on the current blue film.

[0077] The system compares the cumulative number of valid discarded material markers with the preset replenishment quantity threshold, and the percentage of discarded material with the preset replenishment percentage threshold. The preset replenishment quantity threshold is a pre-set absolute quantity threshold, and the preset replenishment percentage threshold is a pre-set relative proportion threshold. Both thresholds can be flexibly adjusted according to wafer specifications and mass production process requirements. When any set of comparison results reaches or exceeds the corresponding preset threshold, the die-grabbing operation permission of the die-bonding platform is immediately locked, the current die-bonding operation process is suspended, and a replenishment prompt signal is generated and pushed to the machine's human-machine interface and the production line control system. The replenishment prompt signal includes the current cumulative number of discarded materials, percentage data, and blue film number information, ensuring that on-site operators and production line managers can obtain replenishment requirements simultaneously.

[0078] By implementing real-time synchronous statistics of discarded material data and a dual-threshold replenishment trigger mechanism, precise control over the timing of replenishment is achieved, avoiding a continuous decline in operational efficiency caused by excessive invalid wafers. At the same time, the timely response of replenishment operations can be ensured through multi-terminal synchronized prompt signals.

[0079] S302, after receiving the confirmation signal that the replenishment operation is completed, clear all waste material marking information and the cumulative number of valid waste material markings in the current die bonding operation cycle. The confirmation signal for the completion of the replenishment operation is either a replenishment completion confirmation command issued by the operator on the human-machine interface terminal, or an automatic confirmation signal that the machine's vision detection unit has identified that the new blue film has been replaced and the coordinate calibration is qualified. After the data is cleared, the operation status of all wafers in the blue film wafer coordinate mapping table is updated synchronously, the die picking operation permission lock of the die bonding operation platform is released, and the die bonding machine is controlled to resume continuous die bonding operation. The die bonding process continues from the last valid operation node before the current operation was suspended.

[0080] By automatically resetting the status after material replenishment, the operation can be quickly resumed after replenishment without the need for manual reset of machine parameters, operation status and operation path, which further improves the level of automation and shortens the production line downtime caused by material replenishment operation.

[0081] S400: After a repeated die pick-up operation, when the nozzle successfully picks up the wafer, it clears the corresponding abnormal die pick-up signal, controls the nozzle to move to the preset die bonding position to complete the die placement action, and maintains continuous execution of the entire die bonding operation process.

[0082] This step is a normal operation continuation step after a successful retry. After the abnormal crystal picking problem is resolved, the normal crystal bonding process is quickly resumed to ensure the continuity of the entire process and avoid operation interruption caused by abnormal situations.

[0083] In this embodiment of the invention, the specific execution process of S400 is as follows:

[0084] S401: Upon receiving confirmation that the nozzle has successfully picked up the wafer, immediately clear the abnormal wafer picking signal corresponding to this wafer picking action, simultaneously update the job execution log for this die bonding cycle, and update the job status of the wafer to "Wafer Picked Successfully," completing the closed-loop processing of abnormal states. This step, through the timely clearing of abnormal wafer picking signals, achieves accurate updates of the job status, avoids the problem of subsequent jobs being falsely triggered due to residual abnormal signals, and ensures the consistency of the job process status.

[0085] S402, after clearing the abnormal signal, control the nozzle to move along the preset working path to the preset die bonding position. The preset die bonding position is the pad position on the lead frame or substrate corresponding to the wafer. After the nozzle reaches the die bonding position, the wafer placement action is completed according to the preset process parameters. After the die placement action is completed, control the nozzle to rise to the preset safety height, and the die bonding platform moves along the preset working path to the next wafer position, triggering the next die pick-up and die bonding operation process, keeping the entire die bonding operation process continuously executed.

[0086] By retrying successfully and then continuing the normal die placement process, the entire die bonding process can be executed continuously, while avoiding interruptions caused by abnormal die picking, thus ensuring the efficiency and stability of the overall die bonding operation.

[0087] Based on the solutions in the embodiments of this application, and combined with the semiconductor packaging mass production scenario, the die bonding process is the core process in semiconductor packaging. Its continuity and degree of automation directly determine the packaging yield and production capacity of semiconductor products. As semiconductor devices rapidly develop towards miniaturization and high integration, the wafer size continues to shrink. The number of wafers on a single blue film can reach tens of thousands or even hundreds of thousands. This places extremely stringent requirements on the die bonding operation's pick-up accuracy, anomaly response speed, and continuous operation stability. In particular, in large-scale mass production lines, a single die bonding machine needs to run continuously for 24 hours, making the requirements for the automation and intelligence level of anomaly handling even more prominent.

[0088] Traditional die bonding solutions generally employ a fixed-path die picking and bonding mode. When an anomaly occurs where the nozzle fails to pick up the wafer, the operator must pause the machine operation and manually control the nozzle to retry the die picking. If the retry fails, the discard location must be manually marked, the machine operation must be switched, and the quantity of discarded wafers must be manually counted and a replenishment operation must be manually triggered. This not only consumes a lot of labor costs, but manual operation also suffers from response delays and judgment errors, which can easily lead to frequent interruptions in die bonding operations, making it difficult to guarantee the continuity of operations and production efficiency in mass production scenarios. Some solutions use simple automatic retry logic, but lack a dual verification mechanism for anomaly identification, which can easily lead to misjudgments and missed judgments. Furthermore, they do not achieve full-process linkage of discard marking, switching operations, and replenishment control, and cannot form a closed-loop control for anomaly handling, making it difficult to meet the stability requirements of large-scale mass production.

[0089] After using the solution in this embodiment of the invention, a pre-configuration step is first performed to obtain the blue film wafer layout data and the coordinate system calibration data of the die bonding platform corresponding to the target die bonding operation. A preset operation path covering the entire die bonding operation process is generated, and a blue film wafer coordinate mapping table, various preset threshold ranges, and standard process parameters are pre-stored to provide a unified execution benchmark for the entire die bonding operation process. After the pre-configuration is completed, the process automatically enters step S100 to obtain the chip picking status information of the nozzle during the die bonding operation cycle. An abnormal chip picking signal is identified through a dual verification mechanism if the nozzle fails to pick up the wafer after completing the chip picking action. Based on the abnormal chip picking signal, the position of the corresponding wafer that has not been picked up is accurately located, and the nozzle is controlled to return to the target position to perform a repeat chip picking operation, thus completing the automatic retry processing of abnormal chip picking.

[0090] After completing the repeated wafer picking operation and status verification in step S100, the system automatically proceeds to step S200. It collects the wafer picking status information of the nozzle after the repeated wafer picking operation is completed and determines whether the nozzle has successfully picked up the wafer through dual verification. If it is determined that the wafer was not picked up successfully, it generates the discard mark information of the corresponding wafer position, locks the wafer picking operation permission of that position, and controls the die bonding operation platform to skip the discard position and jump to the next valid wafer position to continue the die bonding operation. If it is determined that the wafer was picked up successfully, the system automatically proceeds to step S400.

[0091] After entering step S400, the corresponding abnormal die-picking signal is cleared, and the nozzle is controlled to move to the preset die-bonding position to complete the die placement action. After die placement, the die-bonding platform is controlled to move along the preset operation path to the next wafer position to continue the die-bonding operation, maintaining continuous execution of the entire process. After the die-picking operation at each wafer position is completed and the waste material marking information is updated, the process automatically enters step S300. The cumulative number and percentage of waste material marking information within the current die-bonding operation cycle are simultaneously counted. When the cumulative number or percentage reaches a preset threshold, the die-picking operation permission of the machine is locked, the operation is paused, and a replenishment prompt signal is pushed. After the replenishment operation is completed, all waste material marking information and cumulative quantity are cleared, the permission lock is released, and the machine is controlled to resume continuous die-bonding operation.

[0092] When the nozzle fails to pick up a wafer, the system can automatically acquire wafer picking status information, identify the abnormal signal, and lock the corresponding wafer position. It then controls the nozzle to automatically perform a repeat wafer picking operation without requiring manual interruption of the operation. If the repeat wafer picking fails, the system automatically generates a discard mark and writes it into the operation log and coordinate mapping table. Simultaneously, it locks the wafer picking permission for the discard position and controls the operation platform to automatically skip the discard position and jump to the next valid position to continue the operation. This avoids operation interruptions caused by delays in manual judgment and operational errors, reduces labor costs, and ensures a smooth and efficient connection between wafer picking anomaly handling and discard management.

[0093] This method further realizes the intelligent linkage between waste management and replenishment control, forming a closed-loop control of the entire process from anomaly handling to waste statistics, replenishment prompts, and finally reset and continuation, which further improves the automation level and production efficiency of the die bonding operation.

[0094] While generating waste material markers, the system simultaneously and automatically calculates the cumulative quantity and percentage of waste materials. Through dual threshold comparison, it automatically triggers a replenishment prompt signal and pushes it to the machine, human-machine interface, and production line control system. After replenishment is completed, the system automatically clears the waste material markers and cumulative data and resumes operation. There is no need for manual calculation of waste material quantity or manual triggering of replenishment, avoiding operation stoppages caused by manual calculation errors and untimely replenishment. It achieves seamless connection and intelligent control of all aspects of crystal picking anomaly handling, waste material management, and replenishment control, effectively solving the problem of operation interruption caused by poor connection in existing technologies, and significantly improving the production efficiency and operation stability of semiconductor packaging.

[0095] This application discloses an automatic retry and intelligent feed control device for die bonding failures, referring to... Figure 2 ,include:

[0096] The abnormal die picking retry module 001 acquires the die picking status information of the nozzle during the die bonding operation cycle, identifies the abnormal die picking signal when the nozzle fails to pick up the wafer after completing the die picking action at the die picking position, determines the position of the wafer that has not been picked up according to the abnormal die picking signal, and controls the nozzle to return to the position of the wafer that has not been picked up to perform a repeat die picking operation.

[0097] The discarding skip control module 002 collects the chip picking status information of the nozzle after the repeated chip picking operation, determines whether the nozzle has successfully picked up the chip, and generates the discarding mark information corresponding to the chip picking position when the chip is not successfully picked up. It controls the die bonding platform to skip the chip position with the discarding mark information and move along the preset operation path to the next chip position to continue the die bonding operation.

[0098] The waste material statistics and replenishment module 003 synchronously counts the cumulative number of waste material marking information within the current die bonding operation cycle. When the cumulative number reaches a preset threshold, it triggers a replenishment prompt signal for the die bonding machine. After the replenishment operation is completed, it clears all waste material marking information and cumulative number within the current die bonding operation cycle and controls the die bonding machine to resume continuous die bonding operation.

[0099] Normal die bonding continuation module 004: After a repeated die picking operation, when the nozzle successfully picks up the wafer, it clears the corresponding abnormal die picking signal, controls the nozzle to move to the preset die bonding position to complete the die placement action, and keeps the entire die bonding operation process running continuously.

[0100] This application also discloses an electronic device, including a processor, wherein the processor runs a program of the automatic retry and intelligent replenishment control method for die bonding failure as described in any one of the above-mentioned embodiments.

[0101] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. An automatic retry and intelligent feed control method for die bonding failures, characterized in that, include: The system acquires the chip picking status information of the nozzle during the die bonding cycle, identifies abnormal chip picking signals when the nozzle fails to pick up a wafer after completing the chip picking action at the chip picking position, determines the position of the wafer for which chip picking was not completed based on the abnormal chip picking signal, and controls the nozzle to return to the position of the wafer for which chip picking was not completed to perform a repeat chip picking operation. After collecting the chip picking status information of the nozzle after the repeated chip picking operation, it is determined whether the nozzle has successfully picked up the chip. If the chip is not successfully picked up, a discard mark information corresponding to the chip position is generated. The die bonding platform is controlled to skip the chip position with the discard mark information and move along the preset operation path to the next chip position to continue the die bonding operation. The cumulative number of discarded material marking information during the current die bonding cycle is counted simultaneously. When the cumulative number reaches a preset threshold, a replenishment prompt signal is triggered on the die bonding machine. After the replenishment operation is completed, all discarded material marking information and cumulative number during the current die bonding cycle are cleared, and the die bonding machine is controlled to resume continuous die bonding operation. When the nozzle successfully picks up the wafer after a repeated wafer picking operation, the corresponding abnormal wafer picking signal is cleared, and the nozzle is controlled to move to the preset die bonding position to complete the die placement action, ensuring continuous execution of the entire die bonding operation process.

2. The automatic retry and intelligent replenishment control method for die bonding failures according to claim 1, characterized in that, The step of identifying an abnormal wafer pickup signal where the pick-up nozzle fails to pick up the wafer after completing the wafer pickup operation at the pickup position includes: After the nozzle completes the crystal-taking action and is raised to a preset safe height, the crystal-taking status information of the nozzle during the crystal bonding operation cycle is collected simultaneously. The crystal-taking status information includes the pressure detection data of the nozzle and the surface image data of the crystal-taking position. The collected pressure detection data is compared with the preset standard pressure range, and the surface image data of the crystal picking position is compared with the pre-stored standard features of the wafer. When both sets of comparison results indicate that the nozzle has not picked up the wafer, a corresponding abnormal crystal picking signal is generated.

3. The automatic retry and intelligent replenishment control method for die bonding failures according to claim 2, characterized in that, The step of determining the location of the wafer for which wafer picking was not completed based on the abnormal picking signal includes: Based on the abnormal crystal removal signal, the pre-stored crystal bonding operation path data within the current crystal bonding operation cycle is retrieved, the crystal removal action timing corresponding to the abnormal crystal removal signal is matched, and the planar coordinate information of the corresponding unfinished crystal removal wafer on the blue film is locked. Based on the locked wafer plane coordinate information, combined with the coordinate system calibration data of the die bonding platform, the target wafer position returned by the nozzle is determined.

4. The automatic retry and intelligent replenishment control method for die bonding failures according to claim 3, characterized in that, The step of controlling the suction nozzle to return to the position of the unfinished wafer and performing a repeat wafer-retrieving operation includes: Control the nozzle to move along an interference-free return path to the determined target wafer position, and perform a repeat die pick-up operation. The pin height and nozzle pressing depth of the repeat die pick-up operation are consistent with the parameters of the first die pick-up operation in this die bonding cycle. After completing the repeated crystal removal operation, the nozzle is raised to a preset safe height, and the crystal removal status information of the nozzle is collected simultaneously to complete the status verification of the repeated crystal removal action.

5. The automatic retry and intelligent replenishment control method for die bonding failures according to claim 1, characterized in that, The step of collecting the chip-picking status information of the nozzle after a repeated chip-picking operation and determining whether the nozzle has successfully picked up the wafer includes: After the suction nozzle completes the repeated crystal taking action and is raised to the preset safe height, the suction nozzle crystal taking status information corresponding to the repeated crystal taking operation is collected simultaneously. The crystal taking status information includes the vacuum pressure detection data of the suction nozzle and the image acquisition data of the suction nozzle holding surface. The collected vacuum pressure detection data is compared with the preset qualified crystal adsorption pressure range, and the image data of the nozzle holding surface is compared with the pre-stored standard wafer contour features. When both sets of comparison results determine that the nozzle has successfully adsorbed the wafer, the nozzle is confirmed to have successfully picked up the wafer. If any set of comparison results indicates that no chip has been adsorbed, it confirms that the nozzle has not successfully picked up the chip.

6. The automatic retry and intelligent replenishment control method for die bonding failures according to claim 5, characterized in that, The step of generating a discard marker for a wafer location when the wafer is not successfully picked up includes: Based on the determination that the suction nozzle failed to pick up the wafer, the blue film wafer coordinate mapping table stored in the current die bonding cycle is retrieved, and the unique code and planar coordinate information of the wafer corresponding to this repeated wafer picking operation are matched to generate a discard mark information that is bound one-to-one with the location of the wafer that was not successfully picked up. The generated waste material marking information is written in real time to the job execution log and blue film wafer coordinate mapping table of this die bonding operation cycle, and the wafer picking operation permission for the unsuccessful wafer picking position is locked simultaneously to prevent the triggering of subsequent wafer picking actions.

7. The automatic retry and intelligent replenishment control method for die bonding failures according to claim 6, characterized in that, The step of controlling the die bonding platform to skip wafer positions with discard marker information and move along a preset working path to the next wafer position to continue the die bonding operation includes: Before the die bonding platform moves along the preset working path, it first reads the blue film wafer coordinate mapping table data of the current wafer position to be worked. When it recognizes that the current wafer position to be worked has a discard mark information, it controls the die bonding platform not to perform the ejector pin lifting and nozzle picking actions at the current wafer position, and directly jumps to the next valid wafer position in the preset working path along the shortest collision-free path. After the location jump is completed, the coordinate information and operation permissions of the target wafer position after the jump are verified. After confirming that there is no waste material marking information and the operation permissions are available, the normal die picking and bonding operation process at the corresponding position is triggered to maintain the continuous execution of the die bonding operation.

8. The automatic retry and intelligent replenishment control method for die bonding failures according to claim 1, characterized in that, The step of simultaneously counting the cumulative number of discarded material markers during the current die bonding cycle, and triggering a replenishment prompt signal from the die bonding machine when the cumulative number reaches a preset threshold, includes: After completing the die picking operation at each wafer location, and completing the real-time writing and data update of the discard mark information, the core discard statistics data for this die bonding operation cycle are retrieved synchronously. The core discard statistics data includes the cumulative number of valid discard marks and the percentage of the number of discarded wafers to the total number of valid blue film wafers in this die bonding operation cycle. The cumulative number of valid discarded material markers is compared with the preset replenishment quantity threshold, and the percentage of discarded material is compared with the preset replenishment percentage threshold. When any set of comparison results reaches or exceeds the corresponding preset threshold, the die-taking operation permission of the die-bonding platform is immediately locked, the current die-bonding operation process is suspended, and a replenishment prompt signal is generated and pushed to the machine human-machine interface and production line control system.

9. An automatic retry and intelligent feed control device for die bonding failures, characterized in that, include: The abnormal wafer picking retry module acquires the wafer picking status information of the nozzle during the die bonding cycle, identifies the abnormal wafer picking signal when the nozzle fails to pick up the wafer after completing the wafer picking action at the wafer picking position, determines the position of the wafer for which wafer picking was not completed based on the abnormal wafer picking signal, and controls the nozzle to return to the position of the wafer for which wafer picking was not completed to perform a repeat wafer picking operation. The waste skipping control module collects the chip picking status information of the nozzle after the repeated chip picking operation, determines whether the nozzle has successfully picked up the chip, and generates waste marking information corresponding to the chip picking position when the chip is not successfully picked up. It then controls the die bonding platform to skip the chip position with the waste marking information and move along the preset operation path to the next chip position to continue the die bonding operation. The waste material statistics and replenishment module synchronously counts the cumulative number of waste material marking information within the current die bonding cycle. When the cumulative number reaches a preset threshold, it triggers a replenishment prompt signal for the die bonding machine. After the replenishment operation is completed, it clears all waste material marking information and cumulative number within the current die bonding cycle and controls the die bonding machine to resume continuous die bonding operation. In the normal die bonding continuation module, when the nozzle successfully picks up the wafer after a repeated die pick-up operation, the corresponding abnormal die pick-up signal is cleared, and the nozzle is controlled to move to the preset die bonding position to complete the die placement action, so as to maintain the continuous execution of the entire die bonding operation.

10. An electronic device, characterized in that, Includes a processor, wherein the processor runs a program for an automatic retry and intelligent replenishment control method for die bonding failures as described in any one of claims 1-8.

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