A wiener filter and a method of manufacturing the same

Abstract

The present application relates to the technical field of semiconductor detection, in particular to a Wien filter and a manufacturing method thereof. The Wien filter comprises a base which is a tubular member made of insulating material, a plurality of electrode areas formed on the inner side of the base, and a plurality of excitation areas formed on the outer side of the base, and each excitation area is provided with a spiral conductive path, so that a deflection magnetic field is generated by energizing the conductive path. The Wien filter of the present application forms an integrated structure of the Wien filter by directly forming a plurality of electrode areas on the inner side of a single base and directly forming a plurality of excitation areas on the outer side, completely eliminates the cumulative tolerance caused by assembly of the traditional split structure, improves the processing precision of the Wien filter, and thus improves the matching degree of the electric field and the magnetic field in the Wien filter.

Description

Technical Field

[0001] This invention relates to the field of semiconductor testing technology, and in particular to a Wien filter and its manufacturing method. Background Technology

[0002] A Wien filter is a key electro-optical device that uses orthogonal electric and magnetic fields to select the velocity of charged particle beams or correct aberrations. In high-resolution instruments such as scanning electron microscopes (SEM), transmission electron microscopes (TEM), and focused ion beam (FIB), the performance of the Wien filter directly affects the final imaging resolution.

[0003] Existing Wien filters typically employ a modular assembly structure, manufacturing multiple independent metal electrodes and external independent magnetic coils, and then assembling the electrodes and coils together using a precision mechanical support.

[0004] However, this modular assembly method involves the processing and assembly of multiple independent parts, resulting in large cumulative tolerances and difficulty in ensuring coaxiality. Furthermore, the poor consistency in the gap width between the individual metal electrodes leads to uneven field distribution. Relying on mechanical assembly to maintain the relative positions of the electric and magnetic fields makes them highly susceptible to mechanical stress and thermal drift, causing the electromagnetic field centers to misalign and introducing aberrations that are difficult to eliminate. In addition, existing Wien filters, composed of complex structures such as coils and wire frames, have a high outgassing rate and are difficult to integrate with ultra-high vacuum environments. Summary of the Invention

[0005] In view of the above problems, the present invention proposes a Wien filter and a method for manufacturing the same to overcome or at least partially solve the above problems.

[0006] One objective of this invention is to provide an integrated Wien filter to improve the manufacturing precision of the Wien filter, thereby enhancing the matching degree between the electric and magnetic fields in the Wien filter.

[0007] A further objective of this invention is to improve the vacuum cleanliness of the Wien filter, thereby improving the stability of the Wien filter.

[0008] Another further objective of this invention is to improve the magnetic field excitation effect of the Wien filter.

[0009] Specifically, the present invention provides a Wien filter, comprising: The substrate is a tubular component made of insulating material; Multiple electrode regions are formed on the inner surface of the substrate; and Multiple excitation zones are formed on the outer surface of the substrate, and each excitation zone has a spiral conductive path, thereby generating a deflection magnetic field by energizing the conductive path.

[0010] Optionally, a metallization layer is plated on a portion of the outer surface of the substrate to form an excitation region.

[0011] Optionally, the outer surface of the substrate is coated with a metallization layer, and the excitation region is formed by removing material from the metallization layer formed on the outer surface of the substrate.

[0012] Optionally, a first contact is formed at the center of each excitation zone to form a conductive path, and a conductive path is formed spirally outward from the first contact, and a second contact is formed at the end of the extended conductive path, wherein each contact is used to connect an external excitation current.

[0013] Optionally, the number of multiple excitation zones is even, and the multiple excitation zones are evenly spaced in the circumferential direction of the substrate.

[0014] Optionally, the inner surface of the substrate is coated with a metallization layer, and the electrode region is formed by dividing the metallization layer formed on the inner surface of the substrate.

[0015] Optionally, each electrode region has a gold plating layer, which is deposited on the surface of the metallization layer.

[0016] Optionally, an electrode dividing groove is formed between every two adjacent electrode regions. The electrode dividing groove extends through the substrate along the axial direction to insulate and isolate the electrode regions on both sides.

[0017] Optionally, the Wien filter also includes: At least one positioning groove, each positioning groove being formed by cutting a portion of the tube wall of the substrate axially inward from the circumferential edge of the axial end face of the substrate.

[0018] According to another aspect of the present invention, the present invention also provides a method for manufacturing a Wien filter, for manufacturing any of the Wien filters described above, comprising: The tubular matrix is ​​made of insulating material; Metallization layers are prepared on the inner and outer surfaces of the substrate, respectively; At least one positioning groove is formed by cutting a portion of the pipe wall axially inward along the circumferential edge of the axial end face of the substrate. Using the positioning groove as the processing reference, the metallization layer formed on the inner side of the substrate is divided to form multiple electrode areas; Using the positioning groove as the processing reference, the metallization layer formed on the outer surface of the substrate is processed by material removal to form multiple excitation zones; A gold plating layer is prepared on the surface of each electrode region.

[0019] The Wien filter of the present invention generates a deflection electric field in the central region of the tubular substrate by forming multiple electrode regions on the inner surface of the tubular substrate made of insulating material. Furthermore, the Wien filter of the present invention generates a deflection magnetic field orthogonal to the deflection electric field in the central region of the tubular substrate by forming multiple excitation regions on the outer surface of the substrate, each excitation region having a spiral conductive path. Thus, by energizing the conductive path, a deflection magnetic field orthogonal to the deflection electric field is generated in the central region of the tubular substrate. Therefore, the Wien filter of the present invention, by directly forming multiple electrode regions on the inner surface of a single substrate and multiple excitation regions on the outer surface, forms an integrated structure of the Wien filter, completely eliminating the accumulated tolerances caused by assembly in traditional split structures, improving the geometric accuracy of the Wien filter, and thereby improving the matching degree of the electric and magnetic fields in the Wien filter.

[0020] Furthermore, the Wien filter of the present invention forms an excitation region directly on the ceramic substrate by coating a metallization layer on a portion of the outer surface of the substrate. This eliminates the need for additional magnetic cores, wire frames, and coil structures to generate the required magnetic field. The structure is compact and avoids outgassing contamination of organic materials in a vacuum, thereby improving the vacuum cleanliness of the Wien filter and thus enhancing its stability.

[0021] Furthermore, the Wien filter of the present invention completes the conductive path planning within each excitation zone by forming a first contact at the center of each excitation zone, extending a conductive path outward in a spiral shape from the first contact, and forming a second contact at the end of the extended conductive path. Each contact is used to connect to an external excitation current, thus completing the conductive path planning within each excitation zone. Therefore, the Wien filter of the present invention, by setting a central contact and an end contact, forms a complete current loop, and the spirally extended conductive path can form a sufficiently long current loop within a limited outer surface area, thereby improving the magnetic field excitation effect of the Wien filter.

[0022] The above and other objects, advantages and features of the present invention will become more apparent to those skilled in the art from the following detailed description of specific embodiments of the invention in conjunction with the accompanying drawings. Attached Figure Description

[0023] The following sections will describe some specific embodiments of the invention in detail by way of example and not limitation, with reference to the accompanying drawings. The same reference numerals in the drawings denote the same or similar parts or portions. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings: Figure 1 This is a schematic structural diagram of a Wien filter according to an embodiment of the present invention; Figure 2This is a top view of a Wien filter according to an embodiment of the present invention; Figure 3 This is a schematic cross-sectional view of a portion of the structure of a Wien filter according to an embodiment of the present invention; Figure 4 This is a side view of a Wien filter according to an embodiment of the present invention; Figure 5 This is a schematic flowchart of a method for manufacturing a Wien filter according to an embodiment of the present invention. Detailed Implementation

[0024] Exemplary embodiments of the invention will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the invention are shown in the drawings, it should be understood that the invention may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0025] To address the above problems, this invention proposes a Wien filter. Figure 1 This is a schematic structural diagram of a Wien filter according to an embodiment of the present invention. Figure 2 This is a top view of a Wien filter according to an embodiment of the present invention. Figure 3 This is a schematic cross-sectional view of a portion of the structure of a Wien filter according to an embodiment of the present invention. Figure 4 This is a side view of a Wien filter according to an embodiment of the present invention. Figures 1-4 As shown, the Wien filter 10 of this embodiment generally includes a substrate 100, a plurality of electrode regions 200 and a plurality of excitation regions 300.

[0026] like Figure 1 As shown, the substrate 100 is a tubular component made of an insulating material. Specifically, the insulating material can be alumina ceramic, aluminum nitride (AlN) ceramic, or glass-ceramic. Furthermore, a vacuum cavity 103 is formed in the central region of the substrate 100 to serve as a channel for the passage of charged particle beams. When the Wien filter 10 is operating, the vacuum cavity 103 maintains an ultra-high vacuum state.

[0027] like Figures 1-3 As shown, multiple electrode regions 200 are formed on the inner surface 101 of the substrate 100. When an external voltage is applied, the multiple electrode regions 200 can work together as internal electrodes to generate a deflection electric field within the vacuum cavity 103.

[0028] like Figure 1 and Figure 4As shown, multiple excitation zones 300 are formed on the outer surface 102 of the substrate 100, and each excitation zone 300 has a spiral conductive path 310, thereby generating a deflection magnetic field by energizing the conductive path 310. Specifically, the spiral conductive path 310 refers to a conductive trajectory that extends outward in a spiral or saddle shape around a central axis perpendicular to the outer surface 102, forming at least one rotation. In other words, when an excitation current is applied to each conductive path 310, the multiple excitation zones 300 can work together as external magnetic coils to generate a deflection magnetic field within the vacuum cavity 103.

[0029] In other words, the inner surface 101 and the outer surface 102 of the substrate 100 serve as the common physical carriers of the inner electrode and the outer magnetic coil, respectively.

[0030] In addition, the deflection electric field generated by multiple electrode regions 200 in the vacuum cavity 103 and the magnetic field generated by multiple excitation regions 300 in the vacuum cavity 103 are orthogonal, so that particles with a specific velocity pass through in a straight line and other particles are deflected, thereby achieving velocity selection and deflection correction of the charged particle beam.

[0031] Therefore, the Wien filter 10 of this embodiment integrates multiple electrode regions 200 and multiple excitation regions 300 on a single substrate 100, thereby achieving the integration of electric and magnetic field carriers and forming an integrated structure of the Wien filter 10. This completely eliminates the accumulated tolerances of traditional split assembly structures, improves the geometric accuracy of the Wien filter, and ensures micron-level coincidence of the electromagnetic field center, thereby improving the matching degree of electric and magnetic fields in the Wien filter and significantly reducing aberrations.

[0032] In some embodiments, such as Figure 3 As shown, the inner surface 101 of the substrate 100 is coated with a metallization layer 110, and the electrode region 200 is formed by dividing the metallization layer 110 formed on the inner surface 101 of the substrate 100.

[0033] Specifically, the inner surface 101 of the substrate 100 is first coated with a metallization layer 110 using a ceramic metallization process or a sintered silver paste process. The metallization layer 110 can be a conductive layer made of metal. In addition, the metallization layer 110 can continuously cover the entire inner surface 101 and be divided along the axial direction, dividing the originally continuous metallization layer 110 into multiple independent, mutually insulated electrode regions 200. Each electrode region 200 is an independent inner electrode.

[0034] Since the multiple electrode regions 200 are divided by a metallization layer that continuously covers the entire inner surface 101, the inner hole formed by the multiple electrode regions 200 has extremely high roundness and coaxiality, and each electrode region 200 can also have accurate electrode angles.

[0035] Therefore, the Wien filter 10 of this embodiment of the invention utilizes the metallization layer 110 to directly form the electrode region 200 on the ceramic substrate 100, so that all electrode regions 200 are formed by the same metallization layer 110 in the same process, and their relative positional accuracy depends only on the accuracy of the machining tool, eliminating the cumulative error of manual assembly and ensuring the roundness and coaxiality of the electrode region 200.

[0036] In some embodiments, such as Figure 3 As shown, each electrode region 200 also has a gold plating layer 120, which is plated on the surface of the metallization layer 110.

[0037] Specifically, after the metallization layer 110 is divided to form the electrode region 200, the surface of the electrode region 200 is chemically plated or electroplated with gold to form a dense gold plating layer 120.

[0038] Therefore, the Wien filter 10 of this embodiment of the invention, by covering the metallization layer 110 with a gold-plated layer 120, can prevent the metallization layer 110 from oxidizing in air, avoiding the deterioration of the electric field distribution caused by oxidation and extending the service life of the filter. On the other hand, gold has excellent conductivity and chemical inertness, which can reduce contact resistance and improve the corrosion resistance of the electrode region 200 in the ultra-high vacuum environment, thereby ensuring the long-term stable conductivity of the electrode region 200 and thus improving the stability of the Wien filter 10.

[0039] In some embodiments, such as Figure 1 and Figure 2 As shown, an electrode dividing groove 210 is formed between every two adjacent electrode regions 200. The electrode dividing groove 210 extends through the substrate 100 along the axial direction to insulate and isolate the electrode regions 200 on both sides.

[0040] Specifically, the electrode dividing groove 210 is a narrow slit, the width of which is the gap between adjacent electrode regions 200. Each electrode dividing groove 210 extends along the entire axial length of the substrate 100 to completely cut off the metallization layer 110 on the inner side surface 101 of the substrate 100, thereby ensuring that adjacent electrode regions 200 are electrically insulated from each other.

[0041] Furthermore, the position, width, and shape accuracy of the electrode dividing groove 210 directly determine the uniformity of the electric field distribution among the electrode regions 200. In this embodiment, the electrode dividing groove 210 can be processed using a slow wire cutting process, which can control the gap width at the micrometer level and ensure that the width and height are consistent throughout.

[0042] Thus, the Wien filter 10 of this embodiment of the invention achieves precise insulation isolation between electrode regions 200 through electrode dividing groove 210, while ensuring the high uniformity of the inter-electrode gap, thereby obtaining a highly uniform deflection electric field distribution and effectively suppressing higher-order aberrations.

[0043] In some embodiments, such as Figure 1 As shown, a metallization layer 110 is plated on a portion of the outer surface 102 of the substrate 100, thereby forming the excitation region 300. That is, the outer surface 102 of the substrate 100 can be plated with a metallization layer 110, and the excitation region 300 can be formed by removing material from the metallization layer 110 plated on the outer surface 102 of the substrate 100.

[0044] Specifically, the metallization layer 110 has a very strong bond with the ceramic substrate 100, which can withstand the thermal stress during subsequent processing and use. In addition, the material removal process can use laser etching or precision engraving to accurately process multiple excitation zones 300.

[0045] Therefore, the Wien filter 10 of this embodiment of the invention utilizes the metallization layer 110 to directly form the excitation region 300 on the ceramic substrate 100, generating the required magnetic field without the need for additional magnetic cores, wire frames and coil structures. It has a compact structure and avoids the outgassing pollution of organic materials in the vacuum, improving the vacuum cleanliness of the Wien filter and thus improving the stability of the Wien filter.

[0046] In some embodiments, such as Figure 1 and Figure 4 As shown, a first contact 311 of a conductive path 310 is formed at the center of each excitation zone 300. The conductive path 310 extends outward in a spiral shape from the first contact 311, and a second contact 312 is formed at the end of the extended conductive path 310, thus completing the conductive path planning within each excitation zone 300. In addition, each contact is used to connect to an external excitation current.

[0047] Specifically, the first contact 311 is located in the central region of the excitation region 300, and the conductive path 310 extends outward from the first contact 311 to the second contact 312 in a spiral trajectory. In addition, both the first contact 311 and the second contact 312 may be provided with pads or wiring holes to facilitate connection to an external power source via leads.

[0048] In addition, the conductive path 310 can also extend outward from the first contact 311 to the second contact 312 in a saddle-shaped trajectory.

[0049] When the excitation current flows into the first contact 311, through the spiral conductive path 310 and out of the second contact 312, a magnetic field uniformly distributed along the axial direction will be generated inside the substrate 100 according to Ampere's law.

[0050] Thus, the Wien filter 10 of the present invention forms a complete current loop by planning the conductive path 310 in each excitation zone 300, and the spirally extended conductive path 310 can form a sufficiently long current loop on the limited area of ​​the outer surface 102, thereby improving the magnetic field excitation effect of the Wien filter 10.

[0051] In some embodiments, such as Figure 1 As shown, the number of multiple excitation zones 300 can be even, and the multiple excitation zones 300 are evenly spaced in the circumferential direction of the substrate 100.

[0052] Specifically, the number of excitation regions 300 can be determined according to the required number of magnetic field poles. For example, the number of excitation regions 300 can be set to 2, 4, 8 or 12, and symmetrically distributed along the central axis of the substrate 100. In addition, in other embodiments, multiple excitation regions 300 can also be unevenly distributed on the radial inner side of the substrate 100 according to the requirements of higher-order aberration correction.

[0053] Therefore, the Wien filter 10 of this embodiment of the invention ensures the axial symmetry and uniformity of the magnetic field by using an even number of uniformly spaced excitation regions 300, thus avoiding parasitic aberrations introduced by uneven magnetic field distribution.

[0054] In some embodiments, the substrate 100 has a groove along the extension direction of the conductive path 310, and the conductive path 310 is formed by injecting conductive material into the groove. That is, the excitation region 300 can be formed by injecting conductive material into the groove of the substrate 100.

[0055] Specifically, the groove can be formed by laser or mechanical engraving along a predetermined spiral or saddle-shaped trajectory on the outer surface 102 of the substrate 100. Additionally, the conductive material can be conductive silver paste, copper paste, or other molten metal, and is sintered or cured to form a continuous conductive path 310.

[0056] Therefore, the Wien filter 10 of this embodiment of the invention achieves the integration of the external magnetic coil and the substrate 100 by opening grooves and forming the conductive path 310 using additive manufacturing process. The grooves can protect and position the conductive material, improving the reliability of the conductive path 310 and thus improving the structural stability of the Wien filter 10.

[0057] In some embodiments, such as Figure 1 , Figure 2 and Figure 4 As shown, the Wien filter 10 may also include at least one positioning groove 130, each positioning groove 130 being formed by cutting a portion of the tube wall of the substrate 100 axially inward from the circumferential edge of the axial end face 104 of the substrate 100.

[0058] Specifically, such as Figure 2 As shown, each positioning groove 130 can be a notch formed by cutting axially inward from the circumferential edge of the axial end face 104 of the substrate 100. The positioning groove 130 can serve as a unified physical reference during the manufacturing process for positioning all machining steps on the inner surface 101 and the outer surface 102. For example, when forming the electrode region 200 by dividing the metallization layer 110 on the inner surface 101, and when removing material from the metallization layer 110 on the outer surface 102 to form the excitation region 300, the same positioning groove 130 is used as the machining reference for clamping and tool setting.

[0059] Additionally, the Wien filter 10 may include an even number of positioning slots 130, which are evenly spaced in the circumferential direction of the substrate 100. For example, the Wien filter 10 may include four positioning slots 130, located on two axial end faces 104 on both sides of the substrate 100. Each axial end face 104 has two radially facing positioning slots 130.

[0060] Therefore, the Wien filter 10 of this embodiment of the invention achieves a manufacturing process with a unified reference by setting the positioning groove 130, which forcibly ensures the strict alignment between the center of the external magnetic field and the center of the internal electric field, eliminating alignment errors from the structural principle, thereby improving the stability of the Wien filter 10.

[0061] Based on the same inventive concept, this invention also proposes a method for manufacturing a Wien filter. Figure 5 This is a schematic flowchart illustrating a method for manufacturing a Wien filter according to an embodiment of the present invention. Figure 5 As shown, the method for manufacturing the Wien filter in this embodiment generally includes: Step S502: A tubular substrate 100 is made using an insulating material. It should be noted that the tubular substrate 100 can be made using a ceramic material in this step. The substrate 100 is machined to a predetermined size, and the coaxiality of the inner side surface 101 and the outer side surface 102 of the substrate 100 and the perpendicularity of the axial end face 104 are ensured.

[0062] Step S504: Prepare metallization layers 110 on the inner surface 101 and outer surface 102 of the substrate 100. It should be noted that this step can use ceramic metallization or sintered silver paste process to prepare metallization layers 110 with strong adhesion on the inner surface 101 and outer surface 102 of the substrate 100 made of ceramic material.

[0063] In step S506, at least one positioning groove 130 is formed by cutting a portion of the pipe wall axially inward along the circumferential edge of the axial end face 104 of the base 100. In this step, the number of positioning grooves 130 can be four, with the four positioning grooves 130 located on two axial end faces 104 on both sides of the base 100, and the two positioning grooves 130 on each axial end face 104 facing each other radially.

[0064] In step S508, using the positioning groove 130 as a processing reference, the metallization layer 110 formed on the inner surface 101 of the substrate 100 is divided to form multiple electrode regions 200. It should be noted that in this step, the same positioning groove 130 can be used as a reference to divide the metallization layer 110 prepared on the inner surface 101 in the same clamping to form multiple electrode dividing grooves 210. An electrode region 200 can be formed between every two adjacent electrode dividing grooves 210.

[0065] In step S510, using the positioning groove 130 as the processing reference, the metallization layer 110 formed on the outer surface 102 of the substrate 100 is processed to remove material, forming multiple excitation regions 300. It should be noted that this step can use the same positioning groove 130 as the reference, and in the same clamping, process the metallization layer 110 prepared on the outer surface 102 to form multiple conductive paths 310. Each conductive path 310 can form an excitation region 300.

[0066] Step S512: A gold plating layer 120 is prepared on the surface of each electrode region 200. It should be noted that this step can be performed by chemical gold plating or electroplating gold plating on the surface of the conductive area of ​​the inner hole to form the gold plating layer 120.

[0067] In addition, prior to step S512, the manufacturing method of the Wien filter of the present invention may further include the following steps: performing ultra-precision honing or polishing on multiple electrode regions 200 to remove processing burrs and correct minor deformations, so that the roundness of the inner hole formed by the multiple electrode regions 200 reaches the micrometer level.

[0068] Therefore, the manufacturing method of the Wien filter of the present invention, by simultaneously processing multiple electrode regions 200 and multiple excitation regions 300 on a single substrate 100, realizes the integration of electric field and magnetic field carriers, forming an integrated structure of Wien filter 10, completely eliminating the accumulated tolerance of traditional split assembly structures, improving the geometric accuracy of Wien filter, ensuring micron-level coincidence of electromagnetic field centers, thereby improving the matching degree of electric field and magnetic field in Wien filter, and thus significantly reducing aberrations.

[0069] Furthermore, the manufacturing method of the Wien filter of the present invention utilizes the metallization layer 110 to directly form the electrode region 200 on the ceramic substrate 100, eliminating the cumulative error of manual assembly, and performs ultra-precision honing or polishing on the inner hole through honing or polishing process, thereby improving the roundness of the inner hole of multiple electrode regions 200, thus ensuring the roundness and coaxiality of the electrode region 200, thereby improving the stability of the Wien filter.

[0070] Furthermore, the manufacturing method of the Wien filter of the present invention utilizes the metallization layer 110 to directly form the excitation region 300 on the ceramic substrate 100, generating the required magnetic field without the need for additional magnetic cores, wire frames, and coil structures. The structure is compact and avoids the outgassing contamination of organic materials in the vacuum, improving the vacuum cleanliness of the Wien filter, thereby further improving the stability of the Wien filter.

[0071] Therefore, those skilled in the art should recognize that although numerous exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications conforming to the principles of the present invention can be directly determined or derived from the disclosure of the present invention without departing from the spirit and scope of the invention. Thus, the scope of the present invention should be understood and construed as covering all such other variations or modifications.

Claims

1. A Wien filter, comprising: The substrate is a tubular component made of insulating material; Multiple electrode regions are formed on the inner surface of the substrate; as well as Multiple excitation zones are formed on the outer surface of the substrate, and each excitation zone has a spiral conductive path, thereby generating a deflection magnetic field by energizing the conductive path.

2. The Wien filter according to claim 1, wherein, A metallization layer is plated on a portion of the outer surface of the substrate, thereby forming the excitation region.

3. The Wien filter according to claim 2, wherein, The outer surface of the substrate is coated with a metallization layer, and the excitation region is formed by removing material from the metallization layer coated on the outer surface of the substrate.

4. The Wien filter according to claim 1, wherein, A first contact of the conductive path is formed at the center of each of the excitation zones, the conductive path extends outward in a spiral shape from the first contact, and a second contact is formed at the end of the extended conductive path, wherein each of the contacts is used to connect an external excitation current.

5. The Wien filter according to claim 1, wherein, The number of the plurality of excitation zones is even, and the plurality of excitation zones are evenly spaced apart in the circumferential direction of the substrate.

6. The Wien filter according to claim 1, wherein, The inner surface of the substrate is coated with a metallization layer, and the electrode region is formed by dividing the metallization layer formed on the inner surface of the substrate.

7. The Wien filter according to claim 6, wherein, Each of the electrode regions has a gold plating layer, which is deposited on the surface of the metallization layer.

8. The Wien filter according to claim 6, wherein, An electrode dividing groove is formed between every two adjacent electrode regions. The electrode dividing groove extends through the substrate along the axial direction to insulate and isolate the electrode regions on both sides.

9. The Wien filter according to claim 1, wherein, The Wien filter also includes: At least one positioning groove, each positioning groove being formed by cutting a portion of the tube wall of the substrate axially inward from the circumferential edge of the axial end face of the substrate.

10. A method for manufacturing a Wien filter, for manufacturing a Wien filter as described in any one of claims 1 to 9, comprising: The tubular matrix is ​​made of insulating material; Metallization layers are prepared on the inner and outer surfaces of the substrate, respectively; At least one positioning groove is formed by cutting a portion of the pipe wall axially inward along the circumferential edge of the axial end face of the substrate. Using the positioning groove as a processing reference, the metallization layer formed on the inner side of the substrate is divided to form multiple electrode regions; Using the positioning groove as the processing reference, the metallization layer formed on the outer surface of the substrate is processed by material removal to form the plurality of excitation zones; A gold plating layer is prepared on the surface of each of the electrode regions.

Images