A low-temperature-adaptive packaging adhesive film composition, a low-temperature-adaptive packaging adhesive film, a preparation method thereof, a photovoltaic module, and a photovoltaic system

Abstract

The application provides a low-temperature adaptive packaging adhesive film composition, a low-temperature adaptive packaging adhesive film and a preparation method thereof, a photovoltaic module and a photovoltaic system, and relates to the photovoltaic field. The raw materials of the low-temperature adaptive packaging adhesive film composition include, according to the total mass of 100%, 40%-60% of a copolymer resin, 15%-30% of a modified thermoplastic elastomer, 5%-15% of an additive and 10%-20% of a filler; the copolymer resin includes an ethylene-acrylate-norbornene terpolymer; and the raw materials of the modified thermoplastic elastomer include maleic anhydride and a styrene thermoplastic elastomer. The low-temperature adaptive packaging adhesive film composition can still maintain good flexibility in a low-temperature environment, and will not become hard and brittle due to low temperature, thereby effectively avoiding problems such as rupture and delamination caused by the brittleness of the adhesive film.

Description

Technical Field

[0001] This application relates to the photovoltaic field, and more particularly to a low-temperature adaptable encapsulating film composition, a low-temperature adaptable encapsulating film and its preparation method, a photovoltaic module and a photovoltaic system. Background Technology

[0002] Currently, at low temperatures, the molecular chain segment mobility of existing encapsulation materials decreases, causing the materials to harden and become brittle, resulting in a sharp decline in flexibility and mechanical properties. This makes flexible photovoltaic modules extremely prone to breakage and delamination in low-temperature environments, severely affecting the module's lifespan and power generation efficiency.

[0003] When using encapsulating films in low-temperature environments, there are also issues with material compatibility. New low-temperature resistant components may not bond well with existing system materials, leading to phase separation and affecting performance. Costs increase significantly because low-temperature resistant materials are usually expensive. Processing technology faces challenges, as material properties change at low temperatures, requiring adjustments to processing conditions. Long-term stability is also an issue, as the performance of some materials deteriorates after long-term exposure to low temperatures.

[0004] Therefore, there is an urgent need to provide a low-temperature adaptable flexible photovoltaic module encapsulation film to solve the above problems. Summary of the Invention

[0005] The purpose of this application is to provide a low-temperature adaptable encapsulating film composition, a low-temperature adaptable encapsulating film and its preparation method, a photovoltaic module and a photovoltaic system, in order to solve the above-mentioned problems.

[0006] To achieve the above objectives, the first aspect of this application provides a low-temperature adaptable encapsulating film composition, the raw materials of which, based on a total mass of 100%, comprise:

[0007] The copolymer consists of 40%-60% copolymer resin, 15%-30% modified thermoplastic elastomer, 5%-15% additives, and 10%-20% filler.

[0008] The copolymer resin includes an ethylene-acrylate-norbornene terpolymer;

[0009] The raw materials for the modified thermoplastic elastomer include maleic anhydride and styrene-based thermoplastic elastomers.

[0010] Optionally, the low-temperature adaptable encapsulating film composition satisfies at least one of the following conditions:

[0011] A. The ethylene-acrylate-norbornene terpolymer contains 40%-60% ethylene monomer, 20%-35% acrylate monomer, and 5%-10% norbornene monomer.

[0012] B. The molar mass of the ethylene-acrylate-norbornene terpolymer is 100,000 g / mol to 250,000 g / mol.

[0013] Optionally, the low-temperature adaptable encapsulating film composition satisfies at least one of the following conditions:

[0014] A. The styrene-based thermoplastic elastomer includes a hydrogenated styrene-butadiene-styrene block copolymer, wherein the hydrogenated styrene monomer content in the hydrogenated styrene-butadiene-styrene block copolymer is 20%-40%, the butadiene monomer content is 20%-40%, and the styrene monomer content is 30%-70%.

[0015] B. The molar mass of the styrene-based thermoplastic elastomer is 50,000 g / mol to 150,000 g / mol.

[0016] Optionally, the mass of the maleic anhydride is 1%-5% of the mass of the styrene-based thermoplastic elastomer.

[0017] Optionally, the additives include antioxidants, ultraviolet absorbers, and light stabilizers;

[0018] The mass ratio of the antioxidant, the ultraviolet absorber and the light stabilizer is 1.5-2.5:1.5-2.5:0.8-1.2.

[0019] Optionally, the filler comprises nano-montmorillonite modified with a silane coupling agent.

[0020] A second aspect of this application provides a low-temperature adaptable encapsulating film, prepared from any of the low-temperature adaptable encapsulating film compositions described in any one of the claims.

[0021] A third aspect of this application provides a method for preparing a low-temperature adaptable encapsulating film, comprising:

[0022] The low-temperature adaptable encapsulating film composition is prepared by melt-blowing, blow molding, and / or casting.

[0023] A fourth aspect of this application provides a photovoltaic module, including the aforementioned low-temperature adaptable encapsulating film.

[0024] The fifth aspect of this application provides a photovoltaic system, including the aforementioned photovoltaic module.

[0025] Compared with the prior art, the beneficial effects of this application include:

[0026] The low-temperature adaptable encapsulating film composition provided in this application utilizes a copolymer resin whose unique molecular structure allows for segmental activity at low temperatures, imparting flexibility to the encapsulating film and preventing embrittlement and cracking due to low temperatures. A modified thermoplastic elastomer enhances compatibility with other components, providing low-temperature toughness and preventing material embrittlement and delamination. Composite additives improve the aging resistance of the encapsulating film, indirectly preventing embrittlement, cracking, and delamination due to aging. Fillers uniformly disperse and enhance the mechanical strength of the material, resisting embrittlement at low temperatures and preventing cracking and delamination. Furthermore, the copolymer resin and modified thermoplastic elastomer form a low-temperature physical cross-linking network through hydrogen bonds. When subjected to external force, the elastomeric domains of the modified thermoplastic elastomer absorb energy, while the rigid segments of the terpolymer disperse stress. This low-temperature adaptable encapsulating film composition maintains good flexibility even at low temperatures, preventing hardening and embrittlement, thus effectively avoiding cracking and delamination problems caused by film embrittlement.

[0027] The low-temperature adaptable encapsulating film provided in this application possesses excellent flexibility, high strength, and good weather resistance in low-temperature environments, significantly reducing irreversible damage to flexible photovoltaic modules caused by bending under low-temperature conditions and extending the service life of flexible photovoltaic modules. Furthermore, it maximizes the transmission of sunlight, enabling photovoltaic modules to efficiently absorb light energy and convert it into electrical energy under various lighting conditions, especially in low-temperature environments with weak light, thereby improving the power generation efficiency of photovoltaic modules. It also exhibits good transmittance for different wavelengths of sunlight, particularly in the wavelength range sensitive to photovoltaic cells, reducing light reflection and absorption losses and improving light energy utilization.

[0028] The method for preparing the low-temperature adaptable encapsulating film provided in this application involves the following steps during film formation: under the action of processing external force, the molecular chains of the copolymer resin ethylene-acrylate-norbornene terpolymer and the modified thermoplastic elastomer begin to entangle and align. Due to its inherent flexibility and thermal stability, the molecular chains of the copolymer resin exhibit enhanced mobility in the molten state, enabling them to interpenetrate and entangle with the molecular chains of the modified thermoplastic elastomer. This entanglement structure provides a basic framework for forming a continuous and uniform film, resulting in a film with certain strength and flexibility after molding.

[0029] The photovoltaic modules and photovoltaic systems provided in this application are less prone to damage or delamination in low-temperature environments and have a long service life. Attached Figure Description

[0030] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation on the scope of this application.

[0031] Figure 1A cross-sectional scanning electron microscope image of the low-temperature adaptable flexible photovoltaic module encapsulation film provided in Example 1. Detailed Implementation

[0032] As used in this article:

[0033] "Prepared from" is synonymous with "comprising". The terms "comprising", "including", "having", "containing", or any other variations thereof as used herein are intended to cover non-exclusive inclusion. For example, a composition, step, method, article, or apparatus that includes the listed elements is not necessarily limited to those elements, but may include other elements not expressly listed or elements inherent to such composition, step, method, article, or apparatus.

[0034] The conjunction "composed of..." excludes any unspecified elements, steps, or components. If used in a claim, this phrase makes the claim closed, excluding materials other than those described, except for associated conventional impurities. When the phrase "composed of..." appears in a clause of the body of a claim rather than immediately following it, it limits only the elements described in that clause; other elements are not excluded from the claim as a whole.

[0035] When a quantity, concentration, or other value or parameter is expressed as a range, a preferred range, or a range defined by a series of upper and lower preferred values, this should be understood as specifically disclosing all ranges formed by any pair of any upper or preferred value with any lower or preferred value, regardless of whether the range is disclosed individually. For example, when the range “1–5” is disclosed, the described range should be interpreted as including ranges “1–4”, “1–3”, “1–2”, “1–2 and 4–5”, “1–3 and 5”, etc. When numerical ranges are described herein, unless otherwise stated, the range is intended to include its endpoints and all integers and fractions within that range.

[0036] In these embodiments, unless otherwise specified, the portions and percentages are all by weight.

[0037] "Parts by mass" refers to the basic unit of measurement that expresses the mass ratio of multiple components. One part can represent any unit mass, such as 1g or 2.689g. If we say that component A has "a" parts by mass and component B has "b" parts by mass, it means the ratio of the mass of component A to the mass of component B is a:b. Alternatively, it can mean that the mass of component A is aK and the mass of component B is bK (K is any number representing a multiplier). It is important to understand that, unlike the number of parts by mass, the sum of the mass parts of all components is not limited to 100 parts.

[0038] "And / or" is used to indicate that one or both of the described situations may occur, for example, A and / or B includes (A and B) and (A or B).

[0039] There are many problems with film compositions in low-temperature environments, such as: 1. Material compatibility issues: new low-temperature resistant components may not bond well with existing system materials, leading to phase separation and affecting performance; 2. Low-temperature resistant materials are usually expensive, significantly increasing costs; 3. Processing technology faces challenges: material properties change at low temperatures, requiring adjustments to processing conditions; 4. Long-term stability is also a problem: the performance of some materials deteriorates after long-term exposure to low temperatures.

[0040] Based on this, the first aspect of this application provides a low-temperature adaptable encapsulating film composition, the raw materials of which, based on a total mass of 100%, include:

[0041] The copolymer consists of 40%-60% copolymer resin, 15%-30% modified thermoplastic elastomer, 5%-15% additives, and 10%-20% filler.

[0042] Optionally, the copolymer resin can be any value between 40%, 50%, 60%, or 40%-60%, the modified thermoplastic elastomer can be any value between 15%, 20%, 25%, 30%, or 15%-30%, the additives can be any value between 5%, 10%, 15%, or 5%-15%, and the filler can be any value between 10%, 15%, 20%, or 10%-20%.

[0043] The copolymer resin includes an ethylene-acrylate-norbornene terpolymer;

[0044] It should be noted that the ethylene-acrylate-norbornene terpolymer has both good flexibility and thermal stability. Its unique molecular structure can maintain a certain chain segment mobility at low temperatures, giving the material flexibility and preventing it from becoming brittle and cracking due to low temperatures.

[0045] The raw materials for the modified thermoplastic elastomer include maleic anhydride and styrene-based thermoplastic elastomers.

[0046] It is important to note that the modified thermoplastic elastomer is prepared by grafting maleic anhydride onto hydrogenated styrene-butadiene-styrene block copolymer (SEBS), which enhances compatibility with other components, provides low-temperature toughness, and prevents material embrittlement and delamination. Maleic anhydride grafting can enhance the interfacial compatibility of the hydrogenated styrene-butadiene-styrene block copolymer. The improved compatibility makes stress transmission more uniform and improves the material's impact resistance and fatigue resistance.

[0047] In some embodiments, the low-temperature adaptable encapsulating film composition satisfies at least one of the following conditions:

[0048] A. The ethylene-acrylate-norbornene terpolymer contains 40%-60% ethylene monomer, 20%-35% acrylate monomer, and 5%-10% norbornene monomer.

[0049] Optionally, the ethylene monomer content in the ethylene-acrylate-norbornene terpolymer can be any value between 40%, 50%, 60%, or 40%-60%, the acrylate monomer content can be any value between 20%, 25%, 30%, 35%, or 20%-35%, and the norbornene monomer content can be any value between 5%, 6%, 7%, 8%, 9%, 10%, or 5%-10%.

[0050] B. The molar mass of the ethylene-acrylate-norbornene terpolymer is 100,000 g / mol to 250,000 g / mol.

[0051] Optionally, the molar mass of the ethylene-acrylate-norbornene terpolymer can be any value between 100,000 g / mol, 150,000 g / mol, 200,000 g / mol, 250,000 g / mol, or 100,000 g / mol to 250,000 g / mol.

[0052] In some embodiments, the low-temperature adaptable encapsulating film composition satisfies at least one of the following conditions:

[0053] A. The styrene-based thermoplastic elastomer includes a hydrogenated styrene-butadiene-styrene block copolymer, wherein the hydrogenated styrene monomer content in the hydrogenated styrene-butadiene-styrene block copolymer is 20%-40%, the butadiene monomer content is 20%-40%, and the styrene monomer content is 30%-70%.

[0054] Optionally, the hydrogenated styrene monomer content in the hydrogenated styrene-butadiene-styrene block copolymer can be any value between 20%, 30%, 40%, or 20%-40%, the butadiene monomer content can be any value between 20%, 30%, 40%, or 20%-40%, and the styrene monomer content can be any value between 30%, 40%, 50%, 60%, 70%, or 30%-70%.

[0055] B. The molar mass of the styrene-based thermoplastic elastomer is 50,000 g / mol to 150,000 g / mol.

[0056] Optionally, the molar mass of the styrene-based thermoplastic elastomer can be any value between 50,000 g / mol, 100,000 g / mol, 150,000 g / mol, or 50,000 g / mol to 150,000 g / mol.

[0057] In some embodiments, the mass of the maleic anhydride is 1%-5% of the mass of the styrene-based thermoplastic elastomer.

[0058] Optionally, the mass of maleic anhydride can be any value between 1%, 2%, 3%, 4%, 5%, or 1%-5% of the mass of the styrene-based thermoplastic elastomer.

[0059] In some embodiments, the adjuvants include antioxidants, ultraviolet absorbers, and light stabilizers;

[0060] The mass ratio of the antioxidant, the ultraviolet absorber and the light stabilizer is 1.5-2.5:1.5-2.5:0.8-1.2.

[0061] Optionally, the mass ratio of antioxidant, ultraviolet absorber and light stabilizer can be any value between 1.5:1.5:0.8, 2:1.5:0.8, 2.5:1.5:0.8, 1.5:2:0.8, 1.5:2.5:0.8, 1.5:1.5:1, 1.5:1.5:1.2 or 1.5-2.5:1.5-2.5:0.8-1.2.

[0062] It is important to note that the additives are a compound of antioxidants, UV absorbers, and light stabilizers, which synergistically enhance the material's aging resistance and indirectly prevent film embrittlement, cracking, and delamination caused by aging. In addition, the UV absorbers absorb UV-B band energy, and the light stabilizers capture free radicals, forming a "outer layer absorption + inner layer blocking" protection. The outer layer material directly absorbs the UV energy input, while the inner layer blocks and inhibits the generation and diffusion of free radicals. The antioxidants and modified montmorillonite strengthen the protection from the perspectives of chemical decomposition and physical barrier, respectively. The antioxidants decompose peroxides, and the modified montmorillonite hinders oxygen diffusion, thus effectively improving the tensile strength retention rate.

[0063] In some embodiments, the filler comprises nano-montmorillonite modified with a silane coupling agent.

[0064] It is important to note that the silane coupling agent-modified nano-montmorillonite, when uniformly dispersed in the composition system, enhances the mechanical strength of the composition and the material, resisting embrittlement at low temperatures and preventing cracking and delamination. It also enhances compatibility by chemically bonding (Si-O-Si) between inorganic montmorillonite and organic resin, reducing agglomeration, improving dispersion uniformity, and providing barrier protection. The nanosheets hinder oxygen / moisture penetration, delaying aging. Furthermore, the silane coupling agent-modified nano-montmorillonite chemically bonds with the ethylene-acrylate-norbornene terpolymer, resulting in layered dispersion and the exfoliation of the layered silicate structure of the modified montmorillonite. The montmorillonite is dispersed in nanoscale flakes uniformly within the polymer matrix. This dispersion method significantly increases the specific surface area of ​​the montmorillonite, forming a "brick-mud" structure. The "brick" refers to the exfoliated nano-montmorillonite flakes, which provide mechanical support as a rigid framework. The "mud" refers to the ethylene-acrylate-norbornene terpolymer matrix. This structure greatly improves the tensile modulus and elongation at break. At low temperatures, the nano-flakes hinder the propagation of microcracks, forming a "hard-soft synergy" with the modified thermoplastic elastomer. The "hard" refers to the nano-montmorillonite flakes, and the "soft" refers to the modified thermoplastic elastomer. This synergistic effect results in a flexural fatigue life that is far superior to that of traditional adhesive film compositions.

[0065] It should also be noted that the silane coupling agent-modified nano-montmorillonite is uniformly dispersed in the system, and its layered structure plays a reinforcing and stabilizing role in the film formation process. The nano-montmorillonite layers are tightly bonded to the molecular chains of the novel copolymer resin and modified thermoplastic elastomer, filling the gaps between the molecular chains. On the one hand, the high modulus of the nano-montmorillonite layers enhances the mechanical strength of the film; on the other hand, it restricts the excessive movement of the molecular chains, making the molecular chains more ordered during the orientation process, thereby improving the stability of the film and preventing the film performance from deteriorating due to the relaxation of the molecular chains after film formation.

[0066] A second aspect of this application provides a low-temperature adaptable encapsulating film, prepared from any of the low-temperature adaptable encapsulating film compositions described in any one of the claims.

[0067] A third aspect of this application provides a method for preparing a low-temperature adaptable encapsulating film, comprising:

[0068] The low-temperature adaptable encapsulating film composition is prepared by melt-blowing, blow molding, and / or casting.

[0069] A fourth aspect of this application provides a photovoltaic module, including the aforementioned low-temperature adaptable encapsulating film.

[0070] The fifth aspect of this application provides a photovoltaic system, including the aforementioned photovoltaic module.

[0071] The implementation schemes of this application will be described in detail below with reference to specific embodiments. However, those skilled in the art will understand that the following embodiments are only for illustrating this application and should not be regarded as limiting the scope of this application. Unless otherwise specified in the embodiments, conventional conditions or conditions recommended by the manufacturer shall apply. Reagents or instruments used without specified manufacturers are all conventional products that can be purchased commercially.

[0072] Example 1

[0073] The first aspect of this embodiment provides a low-temperature adaptable flexible photovoltaic module encapsulation film composition, the raw materials of which, based on a total mass of 100%, include:

[0074] The composition consists of 50% copolymer resin, 30% modified thermoplastic elastomer, 10% additives, and 10% filler.

[0075] The copolymer resin is an ethylene-acrylate-norbornene terpolymer with a molar mass of 200,000 g / mol, wherein the ethylene monomer content is 55%, the acrylate monomer content is 35%, and the norbornene monomer content is 10%.

[0076] The modified thermoplastic elastomer is a styrene-based thermoplastic elastomer grafted with maleic anhydride, wherein the mass of maleic anhydride is 3% of the mass of the styrene-based thermoplastic elastomer, and the styrene-based thermoplastic elastomer is a hydrogenated styrene-butadiene-styrene block copolymer with a molar mass of 100,000 g / mol, wherein the hydrogenated styrene-butadiene-styrene block copolymer contains 30% hydrogenated styrene monomer, 20% butadiene monomer, and 50% styrene monomer.

[0077] The mass ratios of antioxidant di-tert-butyl-p-cresol, UV absorber 2-hydroxy-4-methoxybenzophenone, and light stabilizer bis(2,2,6,6-tetramethylpiperidinyl) sebacate were 2, 1, and 1, respectively.

[0078] The filler is nano-montmorillonite modified with a silane coupling agent.

[0079] The second aspect of this embodiment provides a low-temperature adaptable flexible photovoltaic module encapsulation film and its preparation method, the specific steps of which are as follows:

[0080] The modified nano-montmorillonite was purchased from Zhejiang Fenghong New Material Co., Ltd., nano-montmorillonite, model DK1.

[0081] The modified thermoplastic elastomer was purchased from Kraton, USA, model FG1901;

[0082] The copolymer resin was purchased from Mitsui Chemicals, Japan, APEL series;

[0083] First, the copolymer resin and modified thermoplastic elastomer are added to a high-speed mixer and premixed at 90°C for 18 minutes. Then, composite additives and modified nano-montmorillonite are added and mixed for another 12 minutes. Subsequently, the mixture is transferred to a twin-screw extruder, and the extruder temperature is set to gradually increase from 160°C in the feeding section to 180°C in the die head. The melt-blended extrusion granulation yields the encapsulation material masterbatch, which is then processed into a low-temperature adaptable flexible photovoltaic module encapsulation film with a thickness of 0.2 mm through a blow molding process for use in flexible photovoltaic module encapsulation.

[0084] Cross-sectional scanning electron microscope image of the low-temperature adaptive flexible photovoltaic module encapsulation film, as shown in the image. Figure 1 As shown, the dispersion state of nano-montmorillonite modified with silane coupling agent in the film system can be clearly seen. After modification with silane coupling agent, the nano-montmorillonite is uniformly dispersed in the entire material system and tightly bonded with other components, effectively enhancing the mechanical strength of the material. It can be observed from the figure that the nano-montmorillonite sheets form a good interfacial bond with the surrounding copolymer resin, modified thermoplastic elastomer, etc., without obvious agglomeration, which provides a strong guarantee for the improvement of material performance.

[0085] Example 2

[0086] The difference from Example 1 is that the raw materials, calculated at 100% by mass, include:

[0087] The composition consists of 60% copolymer resin, 20% modified thermoplastic elastomer, 10% additives, and 10% filler.

[0088] Example 3

[0089] The difference from Example 1 is that the raw materials, calculated at 100% by mass, include:

[0090] The composition consists of 60% copolymer resin, 10% modified thermoplastic elastomer, 10% additives, and 20% filler.

[0091] Comparative Example 1

[0092] The difference from Example 1 is that no modified thermoplastic elastomer is added.

[0093] Comparative Example 2

[0094] The difference from Example 1 is that the modified thermoplastic elastomer is replaced with a styrene-based thermoplastic elastomer.

[0095] Comparative Example 3

[0096] The difference from Example 1 is that the raw materials, calculated at 100% by mass, include:

[0097] The composition consists of 70% copolymer resin, 10% modified thermoplastic elastomer, 5% additives, and 15% filler.

[0098] Comparative Example 4

[0099] The difference from Example 1 is that the copolymer resin is replaced with an ethylene-acrylate copolymer.

[0100] Comparative Example 5

[0101] The difference from Example 1 is that the copolymer resin is replaced with ethylene-vinyl acetate copolymer.

[0102] Comparative Example 6

[0103] The difference from Example 1 is that the filler is replaced with nano-montmorillonite, and no silane coupling agent modification is performed.

[0104] The encapsulation films prepared in the above-mentioned examples and comparative examples were subjected to performance tests at -30°C, as detailed in Table 1.

[0105] Crease test method: Fold the material repeatedly in the same position (e.g., 100 times) and record the number of times a visible crease or break appears.

[0106] Aging test methods: damp heat aging (high temperature and high humidity environment); damp heat aging (85℃ / 85% RH, 1000 hours) after.

[0107] Table 1 Performance Tests

[0108]

[0109]

[0110] analyze:

[0111] As shown in Table 1, the modified thermoplastic elastomers in Examples 1-3 exhibit excellent thermal stability and retain elasticity even after high-temperature aging. In Comparative Example 3, excessive resin can affect the DH aging test. In Comparative Example 4, the carboxylic acid groups are easily hydrolyzed, resulting in a sharp drop in modulus after humid heat aging. In Comparative Example 5, plastic deformation accumulates rapidly, and the crease depth increases after long-term bending. In Comparative Example 6, the interface defects of montmorillonite catalyze the thermal oxidation reaction, accelerating the performance degradation.

[0112] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

[0113] Furthermore, those skilled in the art will understand that although some embodiments herein include certain features included in other embodiments but not others, combinations of features from different embodiments are intended to be within the scope of this application and form different embodiments. For example, in the foregoing claims, any of the claimed embodiments can be used in any combination. The information disclosed in this background section is intended only to enhance the understanding of the general background of this application and should not be construed as an admission or in any way implying that such information constitutes prior art known to those skilled in the art.

Claims

1. A low-temperature adaptable encapsulating film composition, characterized in that, Its raw materials, calculated on a total mass basis of 100%, include: The copolymer consists of 40%-60% copolymer resin, 15%-30% modified thermoplastic elastomer, 5%-15% additives, and 10%-20% filler. The copolymer resin includes an ethylene-acrylate-norbornene terpolymer; The raw materials for the modified thermoplastic elastomer include maleic anhydride and styrene-based thermoplastic elastomers.

2. The low-temperature adaptable encapsulating film composition according to claim 1, characterized in that, At least one of the following conditions must be met: A. The ethylene-acrylate-norbornene terpolymer contains 40%-60% ethylene monomer, 20%-35% acrylate monomer, and 5%-10% norbornene monomer. B. The molar mass of the ethylene-acrylate-norbornene terpolymer is 100,000 g / mol to 250,000 g / mol.

3. The low-temperature adaptable encapsulating film composition according to claim 1, characterized in that, At least one of the following conditions must be met: A. The styrene-based thermoplastic elastomer includes a hydrogenated styrene-butadiene-styrene block copolymer, wherein the hydrogenated styrene monomer content in the hydrogenated styrene-butadiene-styrene block copolymer is 20%-40%, the butadiene monomer content is 20%-40%, and the styrene monomer content is 30%-70%. B. The molar mass of the styrene-based thermoplastic elastomer is 50,000 g / mol to 150,000 g / mol.

4. The low-temperature adaptable encapsulating film composition according to claim 1, characterized in that, The mass of the maleic anhydride is 1%-5% of the mass of the styrene-based thermoplastic elastomer.

5. The low-temperature adaptable encapsulating film composition according to claim 1, characterized in that, The additives include antioxidants, ultraviolet absorbers, and light stabilizers; The mass ratio of the antioxidant, the ultraviolet absorber and the light stabilizer is 1.5-2.5:1.5-2.5:0.8-1.

2.

6. The low-temperature adaptable encapsulating film composition according to any one of claims 1-5, characterized in that, The filler comprises nano-montmorillonite modified with a silane coupling agent.

7. A low-temperature adaptable encapsulating film, characterized in that, It is prepared from the low-temperature adaptable encapsulating film composition according to any one of claims 1-6.

8. A method for preparing a low-temperature adaptable encapsulating film, characterized in that, include: The low-temperature adaptable encapsulating film composition according to any one of claims 1-6 is prepared by melt melting, blow molding and / or casting to form a film.

9. A photovoltaic module, characterized in that, Includes the low-temperature adaptable encapsulating film as described in claim 8.

10. A photovoltaic system, characterized in that, Includes the photovoltaic module as described in claim 9.

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