An adjustable directional multi-channel plasma discharge device and its discharge method

Abstract

The application discloses a kind of adjustable orientation multi-channel plasma discharge device, it is related to multi-channel plasma discharge equipment technical field, including substrate frame, the substrate frame is equipped with discharge channel, the discharge channel is equipped with discharge device, the discharge channel one side is equipped with gas supply device, the gas supply device transports the gas to be ionized to the discharge device, the discharge device is used to ionize the gas provided by the gas supply device into plasma, the discharge channel is rotationally connected with plasma guide plate at the end away from the gas supply device, the plasma guide plate is used to guide the plasma that flows out from the discharge channel.The application can adjust the delivery angle of the plasma that flows out from discharge channel, so as to meet the diversified angle requirement of plasma.

Description

Technical Field

[0001] This invention relates to the field of multi-channel plasma discharge equipment technology, and in particular to an adjustable multi-channel plasma discharge device and its discharge method. Background Technology

[0002] Plasma discharge technology is widely used in material surface modification (to improve adhesion and wear resistance) and waste gas purification (to degrade VOCs and NO) due to its advantages such as high activity, no secondary pollution, and high reaction efficiency. X This technology is used in fields such as plasma deposition (thin film preparation). Multi-channel plasma discharge devices can achieve parallel action of multiple plasma streams, improving processing efficiency.

[0003] However, traditional multi-channel devices have fixed channel structures and discharge electrode positions, and the plasma jet direction is singular, making it impossible to adjust according to the processing target and difficult to meet diverse needs such as specific area coverage and directional processing.

[0004] Therefore, there is an urgent need in this field for a novel tunable multi-channel plasma discharge device and its discharge method to solve the above problems. Summary of the Invention

[0005] The purpose of this invention is to provide an adjustable multi-channel plasma discharge device and its discharge method to solve the problems existing in the prior art. It can adjust the flow direction of the plasma flowing out of the discharge channel as needed to meet different working requirements.

[0006] To achieve the above objectives, the present invention provides the following solution: This invention discloses an adjustable multi-channel plasma discharge device, including a substrate frame, a discharge channel within the substrate frame, a discharge device within the discharge channel, a gas supply device on one side of the discharge channel, the gas supply device supplying gas to be ionized to the discharge device, the discharge device being used to ionize the gas supplied by the gas supply device into plasma, and a plasma guide plate rotatably connected to the end of the discharge channel away from the gas supply device, the plasma guide plate being used to guide the plasma flowing out of the discharge channel.

[0007] Preferably, a plurality of partitioning devices are fixed inside the substrate frame, the partitioning devices dividing the interior of the substrate frame into a plurality of discharge channels, and each discharge channel is provided with a discharge device.

[0008] Preferably, the inner surface of the substrate frame and the outer surface of the separating device are both provided with a plasma corrosion resistant coating.

[0009] Preferably, the plasma guide plate is made of a magnetic material; Alternatively, the surface of the plasma guide plate may be provided with a magnetic coating.

[0010] Preferably, the discharge device includes a positive discharge electrode, a negative discharge electrode, and a discharge power supply, wherein the positive discharge electrode is electrically connected to the positive electrode of the discharge power supply, and the negative discharge electrode is electrically connected to the negative electrode of the discharge power supply.

[0011] Preferably, the discharge device further includes a discharge bracket, and both the positive discharge electrode and the negative discharge electrode are fixed on the discharge bracket. The substrate frame and the discharge bracket are both made of insulating material.

[0012] Preferably, the discharge support is provided with a plasma guiding groove.

[0013] Preferably, the gas supply device includes a gas source and a plurality of gas delivery pipes, the number of gas delivery pipes being the same as the number of discharge channels, one end of each gas delivery pipe being connected to the gas source, and the other end of each gas delivery pipe being connected to the discharge channel. Each of the gas delivery pipes is equipped with a flow valve.

[0014] Preferably, the plasma guide plate is connected to a rotary drive device, which is used to drive the plasma guide plate to rotate.

[0015] This invention discloses a discharge method for an adjustable multi-channel plasma discharge device, comprising the following steps: First working mode: directional jet and area coverage discharge. Each of the plasma guide plates is adjusted to the target angle and locked. According to the requirements, the plasma guide plate with the corresponding magnetic strength is selected or the distance between the plasma guide plate and the discharge channel is adjusted. The power supply of the discharge device is controlled synchronously so that the plasma jet direction of each discharge channel is distributed according to the preset angle. Second working mode: cross-mixed discharge, adjust the rotation angle of the plasma guide plate of the adjacent discharge channel, select the plasma guide plate with the corresponding magnetic strength according to the requirements or adjust the distance between the plasma guide plate and the discharge channel, thereby controlling the magnetic field strength at the plasma guide plate, so that the plasma jets of the adjacent discharge channels cross and collide at the outlet and match the speed, and match the discharge power of each discharge device. The third working mode is differentiated discharge in terms of intensity and speed. By independently adjusting the power supply of each discharge device, combined with the angle adjustment of the plasma guide plate and the control of the magnetic field strength, the plasma intensity and speed of each discharge channel are differentiated.

[0016] The present invention achieves the following technical effects compared to the prior art: The discharge direction of this invention is flexibly adjustable: by adjusting the angle of the plasma guide plate, the direction of the plasma jet can be precisely controlled. Combined with the discharge channel distribution design, it can flexibly realize various modes such as directional jet and cross-impact, adapting to diverse application scenarios.

[0017] Furthermore, the present invention has high mixing and reaction efficiency: in the cross-mixing discharge mode, the plasma jet directly collides and mixes, and combined with speed control, the contact efficiency and reaction rate with the reactants are significantly improved, which is especially suitable for scenarios such as exhaust gas purification and plasma chemical reaction.

[0018] Furthermore, this invention offers precise intensity and velocity control: each discharge channel is equipped with an independent discharge device, enabling differentiated control of plasma intensity. The plasma guide plate uses magnetic material, and the plasma velocity can be flexibly accelerated or decelerated by adjusting the magnetic field strength. Combined with the influence of the plasma guide plate angle on jet diffusion, the local intensity and velocity distribution are further optimized to meet differentiated processing requirements.

[0019] Furthermore, the present invention features a stable and reliable structure: the separating device is firmly connected to the substrate frame, eliminating the need for a rotating mechanism and preventing structural failure caused by high plasma temperature and corrosion. The positive and negative discharge electrodes are fixed by a discharge bracket, ensuring stable discharge. The inner wall of the discharge channel is coated with a plasma corrosion-resistant coating to enhance corrosion resistance. The plasma guide plate is made of high-temperature and corrosion-resistant magnetic material, resulting in a long service life.

[0020] Furthermore, the present invention has a wide range of applications: it can be adapted to a variety of working gases (argon, nitrogen, oxygen, etc.), and its application scenarios cover material surface modification, waste gas purification, plasma deposition, etching, etc. Moreover, the number of discharge channels, substrate frame size, discharge parameters, and magnetic field strength can be adjusted according to processing requirements, making it highly practical. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a front view of the adjustable multi-channel plasma discharge device of Embodiment 1; Figure 2 This is a top view of the adjustable multi-channel plasma discharge device of Embodiment 1; Figure 3 This is a schematic diagram of the ionized plasma in the adjustable multi-channel plasma discharge device of Embodiment 1; Figure 4 This is a schematic diagram of the structure of the discharge device in the adjustable multi-channel plasma discharge device of Embodiment 1; In the figure: 1-substrate frame; 2-discharge channel; 3-discharge device; 4-gas supply device; 5-plasma guide plate; 6-separation device. Detailed Implementation

[0023] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0024] The purpose of this invention is to provide an adjustable multi-channel plasma discharge device and its discharge method to solve the problems existing in the prior art. It can adjust the flow direction of the plasma flowing out of the discharge channel as needed to meet different working requirements.

[0025] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0026] Example 1 like Figures 1-4 As shown, this invention provides an adjustable multi-channel plasma discharge device, including a substrate frame 1. A discharge channel 2 is provided within the substrate frame 1, and the discharge channel 2 can be one, two, or more. A discharge device 3 is provided within the discharge channel 2, and a gas supply device 4 is provided on one side of the discharge channel 2. The gas supply device 4 supplies gas to be ionized to the discharge device 3, and the discharge device 3 is used to ionize the gas supplied by the gas supply device 4 into plasma. A plasma guide plate 5 is rotatably connected to the end of the discharge channel 2 away from the gas supply device 4. Specifically, a plasma guide plate 5 is provided on each side of the outlet end of the discharge channel 2. The plasma guide plate 5 is used to guide the plasma flowing out of the discharge channel 2, so that the plasma can flow in the direction of the plasma guide plate 5. To facilitate remote monitoring by personnel, a control device can also be provided. The control device can be a back-end host, and both the discharge device 3 and the gas supply device 4 can be electrically connected to the control device, thereby enabling personnel to remotely control the opening or closing of the discharge device 3 and the gas supply device 4.

[0027] In actual use, the gas supply device 4 releases the working gas that needs to be ionized into the discharge channel 2. When the working gas is delivered to the discharge device 3, the discharge device 3 discharges and ionizes the working gas into plasma. The generated plasma flows out of the outlet of the discharge channel 2, and the plasma flowing out of the outlet of the discharge channel 2 flows towards the expected working area under the guidance of the plasma guide plate 5.

[0028] In this embodiment, as Figure 1 As shown, the substrate frame 1 is a through rectangular cylindrical structure, comprising an upper substrate, a lower substrate, a left substrate, and a right substrate. The upper substrate, lower substrate, left substrate, and right substrate can be integrally formed; alternatively, they can be manufactured separately and then connected together later using bolts. Several partitioning devices 6 are fixed inside the substrate frame 1, dividing the interior of the substrate frame 1 into multiple discharge channels 2. The number of discharge channels 2 is always one more than the number of partitioning devices 6. Specifically... Figures 1-2 It is not difficult to see that there are a total of three dividing devices 6 in this embodiment. All three dividing devices 6 are rectangular block structures with the same volume. The three dividing devices 6 divide the interior of the substrate frame 1 into four discharge channels 2. The cross-sectional shape of each discharge channel 2 is rectangular.

[0029] The lengths of the upper and lower substrates can be designed according to the specific number of discharge channels 2 and the application scenario, generally 500mm-2000mm is sufficient. The widths of the upper and lower substrates are adapted to the processing area, generally 200mm-800mm is sufficient.

[0030] The thickness of the separating device 6 is 0.5mm-5mm, and the separating devices 6 are distributed at intervals, with the distance between two adjacent separating devices 6 being 20mm-50mm.

[0031] It should be noted that each discharge channel 2 is equipped with an independent discharge device 3. In actual use, the staff can adjust the power supply parameters of each discharge device 3 as needed to achieve differentiated control of each discharge channel 2.

[0032] In this embodiment, the inner surface of the substrate frame 1 and the outer surface of the partition device 6 (i.e. the interior of the discharge channel 2) are both provided with a plasma corrosion resistant coating. The plasma corrosion coating is made of yttrium oxide or silicon nitride to prevent plasma corrosion of the inner wall of the discharge channel 2.

[0033] In this embodiment, the plasma guide plate 5 is made of a magnetic material, including but not limited to existing neodymium iron boron, samarium cobalt, or alnico magnetic materials. The thickness of the plasma guide plate 5 is 0.5mm-3mm, and the area of ​​the plasma guide plate 5 matches the cross-sectional area of ​​the adjacent discharge channel 2. Since each discharge channel 2 has a plasma guide plate 5 on both sides of its outlet (i.e., the end with the plasma guide plate 5), and both plasma guide plates 5 are made of magnetic material, there are two plasma guide plates 5. The magnetic field strength generated between two adjacent plasma guide plates 5 can be controlled by replacing plasma guide plates 5 with plasma guide plates 5 of different magnetic strengths; or by adjusting the relative distance between the plasma guide plate 5 and the outlet of the discharge channel 2 (i.e., adjusting the spacing between two adjacent plasma guide plates 5). The magnetic field strength control range is 10mT-500mT. When the plasma passes through the magnetic field, the magnetic field will apply a certain magnetic force to the plasma, thereby achieving an acceleration of 1.5-5 times or a deceleration of 0.2-0.8 times in plasma velocity.

[0034] Alternatively, the plasma guide plate 5 can also be made of common composite materials (such as quartz-based composite materials), and a magnetic coating (including but not limited to samarium cobalt coating) can be provided on the surface of the plasma guide plate 5 to generate a magnetic field between two adjacent plasma guide plates 5.

[0035] In this embodiment, the discharge device 3 includes a positive discharge electrode, a negative discharge electrode, and a discharge power supply. The discharge power supply is an existing AC power supply. The positive discharge electrode is electrically connected to the positive terminal of the discharge power supply, and the negative discharge electrode is electrically connected to the negative terminal of the discharge power supply. When the discharge power supply is activated, a discharge occurs between the positive and negative discharge electrodes, thereby ionizing the working gas passing through them and converting it into plasma.

[0036] Both the positive and negative discharge electrodes are common plate-shaped electrodes. Of course, those skilled in the art can replace them with other electrode structures as needed, as long as they can ionize the working gas into plasma. The materials of the positive and negative discharge electrodes are tungsten, molybdenum, stainless steel, or titanium alloy, and the discharge gap is 5mm-50mm.

[0037] The output parameters of the discharge power supply are: frequency of 1kHz-100kHz, voltage of 5kV-50kV, and the power supply power of each discharge channel 2 can be independently adjusted (10W-500W) to achieve differentiated adjustment of plasma intensity of each discharge channel 2 and adapt to different processing requirements.

[0038] In this embodiment, the discharge device 3 further includes a discharge bracket, on which both the positive and negative discharge electrodes are fixed. The reason for fixing the positive and negative discharge electrodes to the discharge bracket is to prevent them from contacting the substrate frame 1 or the separator 6 and causing a short circuit. The substrate frame 1, the separator 6, and the discharge bracket are all made of insulating materials, specifically including, but not limited to, existing quartz, ceramic, or high-temperature resistant insulating alloys (such as nickel-chromium alloys).

[0039] In this embodiment, the discharge support is provided with a plasma guide groove, which can guide the ionized plasma so that the ionized plasma can flow along the plasma guide groove to the outlet of the discharge channel 2 as quickly as possible, avoiding the accumulation of plasma inside the discharge channel.

[0040] In this embodiment, the gas supply device 4 includes a gas source and several gas delivery pipes, the number of which corresponds to the number of discharge channels 2. One end of each gas delivery pipe is connected to the gas source, and the other end is connected to the discharge channel 2. In actual operation, the operator can supply the required working gas to each discharge channel 2 according to actual needs. The working gas includes, but is not limited to, argon, nitrogen, oxygen, methane, or mixtures thereof. Plasma applications include material surface modification, VOCs waste gas purification, plasma chemical vapor deposition, and plasma etching.

[0041] In addition, each gas delivery pipe is equipped with a flow valve. The flow valve adopts the existing electronically controlled flow valve, which is electrically connected to the control device, so as to facilitate the remote control and adjustment of the gas flow in each gas delivery pipe by the staff. The flow control range is 1L / min-50L / min.

[0042] In this embodiment, to achieve a rotatable connection between the plasma guide plate 5 and the outlet of the discharge channel 2, both the separator 6 and the substrate frame 1 are provided with a fixed rotating cylinder on one side of the outlet end of the discharge channel 2. A rotating shaft is rotatably connected inside the fixed rotating cylinder, and a swing connecting part is provided on the side wall of the rotating shaft. A swing groove is provided on the side wall of the fixed rotating cylinder. The swing connecting part can swing back and forth in the swing groove, and the swing connecting part can pass through the swing groove and be fixedly connected to the plasma guide plate 5. When the rotating shaft is rotated, the swing connecting part will drive the plasma guide plate 5 to swing back and forth, thereby adjusting the angle of the plasma guide plate 5. The swing groove will limit the angle adjustment of the plasma guide plate 5. Generally, the angle adjustment range of the plasma guide plate 5 is 0°-90°.

[0043] Regarding the driving methods of rotating shafts, they generally include electric drive and manual drive.

[0044] Electric drive: The plasma guide plate 5 is connected to a rotary drive device, which drives the plasma guide plate 5 to rotate. Specifically, the rotary drive device is an existing rotary motor, and the output shaft of the rotary motor is connected to one end of the rotating shaft. When the rotary motor is started, the rotary motor drives the rotating shaft to rotate. The electric drive can achieve 0.1° precision angle control and has a self-locking capability to prevent the plasma guide plate 5 from rotating automatically.

[0045] Manual drive: The angle of the plasma guide plate 5 can be adjusted by manually rotating the rotating shaft. However, manual drive requires an additional angle fixing device. For example, a fastening nut can be threaded to both ends of the rotating shaft. When the fastening nuts are tightened, the two fastening nuts can press against the two ends of the rotating drum, thereby fixing the angle of the rotating shaft.

[0046] Example 2 This embodiment provides a discharge method for an adjustable multi-channel plasma discharge device, based on the adjustable multi-channel plasma discharge device 3 disclosed in Embodiment 1, including the following steps: The first working mode is directional jet and area coverage discharge. When directional treatment of a specific area is required and the plasma velocity is critical, each plasma guide plate 5 is adjusted to the target angle and locked (e.g., when all are 0°, the jet direction is consistent with the discharge channel 2, forming a parallel jet; when adjusted in a fan-shaped distribution, the jet diffuses). The plasma guide plate 5 with the corresponding magnetic strength is selected according to the requirements, or the distance between the plasma guide plate 5 and the discharge channel 2 is adjusted to achieve the preset magnetic field strength, realizing preset acceleration or deceleration adjustment of the plasma velocity. The power supply of each discharge device 3 is synchronously controlled (e.g., the power of the edge channel is higher than that of the center channel to compensate for jet diffusion losses), ensuring that the plasma jet direction of each discharge channel 2 is distributed at a preset angle and the velocity meets the preset requirements, achieving uniform coverage discharge of the target area. This is suitable for scenarios such as large-area rapid modification of material surfaces and efficient plasma treatment of sheet materials.

[0047] The second working mode: cross-mixing discharge. For scenarios requiring enhanced plasma-reactant mixing and reaction rates (such as VOCs exhaust gas purification and plasma chemical reactions), the rotation angle of the plasma guide plates 5 in adjacent discharge channels 2 is adjusted (e.g., the two plasma guide plates 5 in the left discharge channel 2 rotate 25° clockwise, and the two plasma guide plates 5 in the right adjacent discharge channel 2 rotate 25° counterclockwise), causing the plasma jets of adjacent discharge channels 2 to cross-collise at the outlet. Plasma guide plates 5 with corresponding magnetic strength are selected according to requirements, or the distance between the plasma guide plates 5 and the discharge channels 2 is adjusted, thereby controlling the magnetic field strength at the plasma guide plates 5. This ensures that the plasma jets of adjacent discharge channels 2 cross-collise at the outlet with matched velocities, enhancing the collision mixing effect. Simultaneously, the discharge power and gas flow rate of each discharge device 3 are matched, utilizing the momentum collision and velocity control of the plasma jets to enhance the mixing effect, prolonging the residence time of reactants in the plasma working area and increasing the reaction rate. The reaction efficiency is more than 40% higher than traditional parallel discharge, eliminating the need for an additional mixing mechanism.

[0048] The third working mode: differentiated discharge of intensity and velocity. When different regions require different plasma intensities and velocities (e.g., high-intensity, high-velocity plasma for material edge modification, and low-intensity, medium-velocity plasma for the central region; high-concentration regions in waste gas treatment require high-intensity, high-velocity plasma, and low-concentration regions require low-intensity, low-velocity plasma), the plasma intensity and velocity of each discharge channel 2 are differentiated by independently adjusting the power supply of each discharge device 3, combined with the angle adjustment of the plasma guide plate 5 (changing the jet diffusion range) and the control of the magnetic field strength. For example, for the channel corresponding to the edge of the material, a higher power supply (300W-500W) is set, the baffle angle is adjusted to 0° (jet concentration), and a high-magnetic plasma guide plate 5 (magnetic field strength 300mT-500mT) is selected to achieve a high-speed plasma jet; for the channel corresponding to the central region, a lower power supply (100W-200W) is set, the angle of the plasma guide plate 5 is adjusted to 10° (jet moderate diffusion), and a plasma guide plate 5 with medium magnetic strength (magnetic field strength 100mT-200mT) is selected to achieve a medium-speed plasma jet, meeting the needs of differentiated processing.

[0049] Example 3 This embodiment provides an application of an adjustable multi-channel plasma discharge device for rapid modification of large-area material surfaces.

[0050] In this embodiment, there are 5 separating devices 6, which separate to form 6 independent discharge channels 2. The device is used for rapid hydrophilic modification of the surface of polypropylene sheet (1000mm×500mm), and the processing efficiency is required to be 30% higher than that of traditional devices.

[0051] Device parameters: The substrate frame 1 is made of quartz, with the upper and lower substrates measuring 1200mm × 600mm and spaced 20mm apart. The separator 6 is made of ceramic, 2mm thick, with a spacing of 200mm between adjacent separators 6. The discharge gap between the positive and negative electrodes is 10mm. The output frequency of the discharge power supply is 13.56kHz, the voltage is 20kV, and the power control range of discharge channel 2 is 50W-300W. The plasma guide plate 5 is made of neodymium iron boron magnetic material, manually adjustable, with a magnetic field strength control range of 50mT-300mT. The working gas is argon + oxygen (volume ratio 9:1), and the flow rate of discharge channel 2 is 10L / min.

[0052] Usage: Adjust all six plasma guide plates 5 to 5° to form a slightly diffused fan-shaped jet. Select a plasma guide plate 5 with a magnetic field strength of 200mT to achieve a 2x acceleration of the plasma velocity. Adjust the power of the two discharge channels 2 at the edge to 300W and the power of the four discharge channels 2 in the middle to 200W to compensate for the edge strength loss caused by jet diffusion. Place the polypropylene sheet 50mm from the device outlet and start the device to discharge continuously for 20s (10s shorter than the traditional device). After treatment, the water contact angle of the sheet surface decreased from 95° to below 35°, the surface hydrophilicity was uniformly improved, there was no local insufficient modification, and the treatment efficiency was improved by 33%, meeting the requirements of subsequent bonding processes.

[0053] Example 4 This embodiment provides an application of an adjustable multi-channel plasma discharge device for the efficient purification of VOCs waste gas.

[0054] In this embodiment, there are three separating devices 6, which form four independent discharge channels 2. The device is used to process a concentration of 500 mg / m³. 3 Toluene exhaust gas (air volume 100m³) 3 ( / h), requiring a toluene removal rate of ≥90% and a treatment rate increase of 40%.

[0055] Device parameters: The substrate frame 1 is made of corrosion-resistant ceramic material, with upper and lower substrate dimensions of 800mm × 400mm and a spacing of 30mm. The separator 6 is made of ceramic material with a thickness of 3mm, and the spacing between two adjacent separators 6 is 200mm. The discharge gap between the positive and negative discharge electrodes is 15mm. The discharge power supply output frequency is 20kHz, the voltage is 30kV, and the power adjustment range of discharge channel 2 is 100W-500W. The plasma guide plate 5 is made of samarium cobalt magnetic material, driven by a rotary motor (accuracy 0.1°), and the magnetic field strength adjustment range is 100mT-400mT. The working gas is nitrogen + oxygen (volume ratio 8:2), with a single-channel flow rate of 20L / min.

[0056] Usage: Adjust the plasma guide plates 5 of two adjacent discharge channels 2 to rotate in opposite directions. Rotate the two plasma guide plates 5 corresponding to one discharge channel 2 clockwise by 25°, and the two plasma guide plates 5 corresponding to the other discharge channel 2 counterclockwise by 25°, forming a cross-flow jet. Select a plasma guide plate 5 with a magnetic field strength of 300mT to achieve a 1.8-fold acceleration of the plasma velocity. Adjust the power of the four discharge channels 2 to 400W. Introduce toluene waste gas from the side of the device, allowing it to cross-contact with the plasma jet. After treatment, the toluene removal rate reaches 94%, which is 48% higher than that of the traditional parallel discharge device 3, the treatment rate is increased by 42%, and the ozone byproduct concentration is below 0.1mg / m³. 3 It complies with GB3095-2012 "Ambient Air Quality Standard".

[0057] Example 5 This embodiment provides an application of an adjustable multi-channel plasma discharge device for plasma etching with varying intensity and velocity.

[0058] In this embodiment, there are two separators 6, which separate to form three independent discharge channels 2. The devices are used for edge etching enhancement of the silicon wafer (8 inches) (the edge etching depth needs to be 1.5 times that of the center, and the edge etching speed needs to be 1.2 times that of the center).

[0059] Device parameters: The substrate frame 1 is made of quartz, with upper and lower substrates measuring 600mm × 600mm and spaced 15mm apart. The separator 6 is also made of quartz, 1.5mm thick, with a 200mm spacing between adjacent separators. The positive and negative discharge electrodes are parallel plate electrodes (titanium alloy), with an 8mm discharge gap. The discharge power supply output frequency is 40kHz, voltage is 15kV, and the power control range for discharge channel 2 is 50W-200W. The plasma guide plate 5 is made of AlNiCo magnetic material, with a magnetic field strength control range of 50mT-250mT. The working gas is argon + methane (volume ratio 95:5), and the flow rate of discharge channel 2 is 5L / min.

[0060] Usage: Adjust the plasma guide plate 5 of the middle discharge channel 2 to 10°, set the power of the discharge power supply to 100W, and select the plasma guide plate 5 with a magnetic field strength of 100mT (plasma velocity 1 times, i.e., normal velocity), corresponding to the center area of ​​the silicon wafer. Adjust the plasma guide plates 5 of the two side discharge channels 2 to 0°, set the power of the discharge power supply to 150W, and select the plasma guide plate 5 with a magnetic field strength of 200mT (plasma velocity 1.2 times), corresponding to the edge area of ​​the silicon wafer. After starting the device for 50s of etching (10s shorter than the traditional device), the etching depth at the edge of the silicon wafer is 1.2μm, the etching depth at the center is 0.8μm, the etching speed at the edge is 0.024μm / s, and the etching speed at the center is 0.016μm / s, meeting the strength and speed requirements for edge-enhanced etching, with an etching uniformity error ≤5%.

[0061] In the description of this invention, it should be understood that the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this invention, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention. Furthermore, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Thus, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0062] In the description of this invention, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0063] If this invention discloses or relates to components or structural parts that are fixedly connected to each other, then, unless otherwise stated, a fixed connection can be understood as: a detachable fixed connection (e.g., using bolts or screws) or a non-detachable fixed connection (e.g., riveting, welding). Of course, a fixed connection can also be replaced by an integral structure (e.g., manufactured in one piece using a casting process) (except where it is obviously impossible to use an integral molding process).

[0064] In addition, unless otherwise stated, the terms used in any of the technical solutions disclosed in this invention to indicate positional relationships or shapes include states or shapes that are similar to, close to, or approximate with those states or shapes.

[0065] Any component provided by this invention can be assembled from multiple individual components or can be a single component manufactured by a one-piece molding process.

[0066] It should be noted that the structures, proportions, sizes, etc., depicted in the accompanying drawings of this specification are only used to complement the content disclosed in the specification, so as to enable those skilled in the art to understand and read them, and are not intended to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and objectives that the present invention can produce, should still fall within the scope of the technical content disclosed in the present invention.

[0067] It should also be noted that in the embodiments of this application, the same reference numerals are used to denote the same component or the same part.

[0068] Any adaptive changes made according to actual needs are within the scope of protection of this invention.

[0069] Specific examples have been used to illustrate the principles and implementation methods of this invention. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of this invention. Furthermore, those skilled in the art will recognize that, based on the ideas of this invention, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this invention.

Claims

1. An adjustable multi-channel plasma discharge device, characterized in that: The system includes a substrate frame (1), a discharge channel (2) is provided inside the substrate frame (1), a discharge device (3) is provided inside the discharge channel (2), a gas supply device (4) is provided on one side of the discharge channel (2), the gas supply device (4) supplies gas to be ionized to the discharge device (3), the discharge device (3) is used to ionize the gas supplied by the gas supply device (4) into plasma, and a plasma guide plate (5) is rotatably connected to one end of the discharge channel (2) away from the gas supply device (4), the plasma guide plate (5) is used to guide the plasma flowing out from the discharge channel (2).

2. The adjustable multi-channel plasma discharge device according to claim 1, characterized in that: The substrate frame (1) is fixed with a number of partition devices (6), which divide the interior of the substrate frame (1) into multiple discharge channels (2), and each discharge channel (2) is provided with a discharge device (3).

3. The adjustable multi-channel plasma discharge device according to claim 2, characterized in that: The inner surface of the substrate frame (1) and the outer surface of the partition device (6) are both provided with plasma corrosion resistant coatings.

4. The adjustable multi-channel plasma discharge device according to claim 1, characterized in that: The plasma guide plate (5) is made of magnetic material; Alternatively, the surface of the plasma guide plate (5) may be provided with a magnetic coating.

5. The adjustable multi-channel plasma discharge device according to claim 1, characterized in that: The discharge device (3) includes a discharge positive electrode, a discharge negative electrode and a discharge power supply. The discharge positive electrode and the positive electrode of the discharge power supply are electrically connected, and the discharge negative electrode and the negative electrode of the discharge power supply are electrically connected.

6. The adjustable multi-channel plasma discharge device according to claim 5, characterized in that: The discharge device (3) also includes a discharge bracket, and the discharge positive electrode and the discharge negative electrode are both fixed on the discharge bracket. The substrate frame (1) and the discharge bracket are both made of insulating material.

7. The adjustable multi-channel plasma discharge device according to claim 6, characterized in that: The discharge support is equipped with a plasma guide channel.

8. The adjustable multi-channel plasma discharge device according to claim 1, characterized in that: The gas supply device (4) includes a gas source and several gas delivery pipes. The number of gas delivery pipes is the same as the number of discharge channels (2). One end of the gas delivery pipe is connected to the gas source, and the other end of the gas delivery pipe is connected to the discharge channel (2). Each of the gas delivery pipes is equipped with a flow valve.

9. The adjustable multi-channel plasma discharge device according to claim 1, characterized in that: The plasma guide plate (5) is connected to a rotary drive device, which is used to drive the plasma guide plate (5) to rotate.

10. A discharge method for an adjustable multi-channel plasma discharge device, characterized in that, The adjustable multi-channel plasma discharge device according to any one of claims 1-9 includes the following steps: First working mode: Directional jet and regional coverage discharge. Adjust each of the plasma guide plates (5) to the target angle and lock them. Select the plasma guide plate (5) with the corresponding magnetic strength according to the requirements or adjust the distance between the plasma guide plate (5) and the discharge channel (2). Synchronously control the power supply of the discharge device (3) so that the plasma jet direction of each discharge channel (2) is distributed according to the preset angle. Second working mode: cross-mixed discharge, adjust the rotation angle of the plasma guide plate (5) of the adjacent discharge channel (2), select the plasma guide plate (5) with the corresponding magnetic strength according to the requirements or adjust the distance between the plasma guide plate (5) and the discharge channel (2), thereby controlling the magnetic field strength at the plasma guide plate (5), so that the plasma jets of the adjacent discharge channels (2) cross and collide at the outlet and match the speed, and match the discharge power of each discharge device (3); The third working mode is intensity and speed differential discharge. By independently adjusting the power supply of each discharge device (3), combined with the angle adjustment of the plasma guide plate (5) and the magnetic field strength control, the plasma intensity and speed of each discharge channel (2) are differentiated.

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